CN114428431B

CN114428431B - Optical anti-shake camera module and assembly method thereof

Info

Publication number: CN114428431B
Application number: CN202011440026.XA
Authority: CN
Inventors: 魏罕钢; 卞强龙; 刘佳; 李剑虹; 张琼; 黄坚斌; 袁栋立
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2023-12-19
Anticipated expiration: 2040-10-14
Also published as: CN114428430B; CN114428431A; CN114415442B; CN114415444B; CN114428434B; CN114428436B; CN114415444A; CN114415443A; CN114428430A; CN114428432A; CN114428433A; CN114428435B; CN114428434A; CN114428432B; CN114428435A; CN114428436A; CN114428433B; CN114415442A

Abstract

The invention relates to an optical anti-shake camera module, which comprises: a lens; a photosensitive assembly; a first driving part which mounts the lens and drives the lens to translate in x-axis and y-axis directions; a second driving part including a second base part and a second movable part; the photosensitive assembly is positioned below the second movable part and is arranged on the second movable part, the second movable part is suitable for driving the photosensitive assembly to translate in the directions of an x axis and a y axis relative to the second base part, and the x axis and the y axis are mutually perpendicular and are parallel to the photosensitive surface of the photosensitive assembly; and the rear shell is positioned below the second driving part, the rear shell is connected with the second base part and forms a containing cavity, and the second movable part and the photosensitive assembly are both positioned in the containing cavity. The application also provides an assembling method of the corresponding optical anti-shake camera module.

Description

Optical anti-shake camera module and assembly method thereof

RELATED APPLICATIONS

The present application is a divisional application of the parent application of chinese patent application No. CN202011097162.3, entitled "driving structure for optical actuator and corresponding camera module", filed on day 14 and 10 in 2020.

Technical Field

The invention relates to the technical field of camera equipment, in particular to an optical anti-shake camera module and an assembly method thereof.

Background

With the increasing demands of consumers for mobile phones, the functions of mobile phone cameras (i.e. camera modules) are becoming more and more abundant, and the functions of portrait shooting, remote shooting, optical zooming, optical anti-shake and the like are integrated into cameras with limited volumes, and the functions of auto focusing, optical anti-shake, optical zooming and the like are often realized by means of optical actuators (sometimes also called motors).

Fig. 1 shows a typical prior art camera module with a motor. Referring to fig. 1, the image pickup module generally includes a lens 1, a motor mechanism 2 (which may be simply referred to as a motor), and a photosensitive assembly 3. In the photographing state, the light from the photographing object is focused on the photosensitive element 3a of the photosensitive assembly 3 through the lens 1. Structurally, the lens 1 is fixed to a motor carrier (specifically shown in fig. 1) of a motor, which is a movable member that normally moves the lens 1 in the optical axis direction by a driving element of the motor to realize a focusing function. For an image capturing module with an optical anti-shake (OIS) function, the motor often has a more complex structure. This is because the motor is required to drive the lens 1 to move in other degrees of freedom (for example, in a direction perpendicular to the optical axis) in addition to the lens to be driven in the optical axis direction to compensate for shake at the time of photographing. In general, the shake of the camera module includes translation (translation in x-axis and y-axis directions) and rotation (rotation in the xoy plane, whose rotation axis direction may be substantially the same as the optical axis) in a direction perpendicular to the optical axis, and tilt shake (rotation about x-axis and y-axis, which is also referred to as tilt shake in the field of camera modules). When the gyroscope (or other position sensing element) in the module detects shake in one direction, a command can be sent to enable the motor to drive the lens to move a distance in the opposite direction, so that shake of the lens is compensated. Generally speaking, the lens is only translated and/or rotated in a direction perpendicular to the optical axis to compensate for the shake of the camera module, because if the lens is rotated around the x and y axes, that is, if the anti-shake effect is achieved by tilt adjustment of the lens, the imaging quality of the module may be degraded, or even the imaging paste may be generated, which makes it difficult to achieve the basic imaging quality requirement.

However, as the imaging quality requirement of the camera module of the mobile phone is higher, the volume and weight of the lens are larger and larger, and the driving force requirement of the motor is also higher and higher. The volume of the camera module is also greatly limited by the current electronic equipment (such as a mobile phone), and the occupied volume of the motor is correspondingly increased along with the increase of the lens. In other words, in the trend of the lens toward larger volume and weight, the driving force provided by the motor is difficult to increase correspondingly. On the premise of limited driving force, the heavier the lens, the shorter the stroke of the motor capable of driving the lens to move, and the anti-shake capability is affected. On the other hand, the heavier the lens, the slower the motor can drive the lens to move, and the longer the lens reaches a predetermined compensation position, which also affects the anti-shake effect.

Therefore, a solution for improving the anti-shake distance and the anti-shake response speed of the camera module, which can avoid the image sticking, is highly desired.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a solution capable of avoiding image sticking and improving the anti-shake stroke and the anti-shake response speed of an image pickup module.

In order to solve the above technical problems, the present invention provides an optical anti-shake camera module, which includes: a lens; a photosensitive assembly; a first driving part which mounts the lens and drives the lens to translate in x-axis and y-axis directions; a second driving part including a second base part and a second movable part; the photosensitive assembly is positioned below the second movable part and is arranged on the second movable part, the second movable part is suitable for driving the photosensitive assembly to translate in the directions of an x axis and a y axis relative to the second base part, and the x axis and the y axis are mutually perpendicular and are parallel to the photosensitive surface of the photosensitive assembly; and the rear shell is positioned below the second driving part, the rear shell is connected with the second base part and forms a containing cavity, and the second movable part and the photosensitive assembly are both positioned in the containing cavity.

The rear shell is provided with a bottom plate, and a second through hole is formed in the center of the bottom plate.

The bottom of the rear shell is a complete bottom plate, and a gap is reserved between the photosensitive assembly and the bottom plate.

The side wall of the rear shell is provided with a first through hole, the circuit board of the photosensitive assembly comprises an FPC board, and the FPC board penetrates through the first through hole.

Wherein, the bottom surface of the second movable part is supported against the top surface of the photosensitive assembly.

The photosensitive assembly comprises a circuit board, a photosensitive chip and a lens seat, wherein the photosensitive chip is installed on the surface of the circuit board, the lens seat surrounds the periphery of the photosensitive chip, the bottom of the lens seat is installed on the surface of the circuit board, and the top surface of the lens seat is fixed on the second movable part.

Wherein the second base portion and the second movable portion are brought into contact with each other by balls in a z-axis direction so as to restrict movement of the second movable portion with respect to the second base portion within an xoy plane, the z-axis being parallel to a normal direction of the light-sensitive surface.

The second movable part is movably connected with the second base part through a suspension system, the suspension system comprises an elastic element, the second base part is connected with the second movable part through the elastic element, and the elastic element allows the second movable part to translate relative to the second base part in an xoy plane and prevents the second movable part from moving relative to the second base part outside the xoy plane.

The light sensing assembly further comprises a light filter, the circuit board, the light sensing chip, the mirror base and the light filter are packaged into a whole, and the circuit board, the mirror base and the light filter form a closed space.

Wherein the second movable part is provided with an extension arm extending downwards, and the extension arm is bonded with the circuit board; and the extension part is provided with an FPC board which is electrically connected with the circuit board.

Wherein the second base part comprises a base and a cover, and the cover comprises a side wall which is formed by extending downwards from the base and surrounds the second movable part and a bearing platform which is formed by extending inwards from the side wall horizontally.

Wherein the lower surface of the edge area of the second movable part is supported against the upper surface of the supporting table.

Wherein the ball and the second movable portion are clamped between the base and the rest table.

The second movable part is further suitable for driving the photosensitive assembly to rotate on an xoy plane relative to the second base part.

According to another aspect of the present application, there is also provided an assembly method of an optical anti-shake camera module having a rear case bottom plate with a second through hole, including: mounting the lens on the first driving part, and attaching the second driving part to the bottom of the first driving part; and finally, attaching the photosensitive assembly to the second movable part upwards through the second through hole of the rear shell.

Wherein the step of attaching the photosensitive member to the second movable portion further comprises: and placing the photosensitive assembly on an adjusting device, adjusting the photosensitive assembly by the adjusting device through a second through hole at the bottom of the rear shell, determining the position and the posture of the photosensitive assembly based on an active calibration process, and then bonding the photosensitive assembly and the second movable part through glue.

According to still another aspect of the present application, there is provided another method for assembling an optical anti-shake camera module having a rear case with a complete chassis, including: attaching the second driving part and the photosensitive assembly together to form a first combination body, and assembling the first driving part and the lens together to form a second combination body; then determining the relative positions of the first combination body and the second combination body through an active calibration process; and finally, adhering the first driving part and the second driving part according to the relative position determined by active calibration, wherein glue used for adhering the first combination body and the second combination body is arranged between the bottom surface of the first driving part and the top surface of the second driving part.

Compared with the prior art, the application has at least one of the following technical effects:

1. The anti-shake stroke of the camera module can be improved, so that larger shake of the camera module can be compensated.

2. The anti-shake response speed of the camera module can be improved.

3. The driving structure for the optical actuator has the advantage of compact structure, and is particularly suitable for miniaturized camera modules.

4. The anti-shake device has the advantages that when the anti-shake is performed by utilizing the movement of the photosensitive chip, the photosensitive chip does not need to be inclined, and thus the problem of image sticking caused by the anti-shake movement is avoided.

5. In some embodiments of the present application, on the xoy plane, the lens and the photosensitive chip are allowed to move in opposite directions at the same time, so that the problem of image sticking caused by anti-shake movement is avoided, and the anti-shake stroke and the anti-shake response speed of the camera module can be improved.

6. The assembly method can realize position adjustment based on active calibration, so that the imaging quality of the camera module is improved.

Drawings

FIG. 1 illustrates a typical prior art camera module with a motor;

FIG. 2 is a schematic cross-sectional view of an image capturing module with anti-shake features according to an embodiment of the present disclosure;

fig. 3 is a schematic cross-sectional view of an image capturing module with anti-shake function according to another embodiment of the present disclosure;

FIG. 4 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the application;

FIG. 5 illustrates a schematic cross-sectional view of a camera module in one embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of an imaging module according to another embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of a camera module in accordance with another embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of an imaging module according to still another embodiment of the present application;

fig. 9a shows a schematic perspective view of a second drive part in an embodiment of the present application;

fig. 9b shows an exploded perspective view of the second drive part in one embodiment of the present application;

FIG. 10a is a schematic cross-sectional view of a second driving portion and a photosensitive member according to an embodiment of the present disclosure;

fig. 10b shows a schematic cross-sectional view of a second driving part with balls arranged at the lower side of the movable part in a variant embodiment of the present application;

FIG. 10c shows a schematic cross-sectional view of a second drive section with two layers of balls in a variant embodiment of the present application;

FIG. 11a shows a schematic cross-sectional view of a second drive section in one embodiment of the present application;

FIG. 11b illustrates an assembled schematic view of a second drive section in one embodiment of the present application;

FIG. 11c shows a schematic cross-sectional view of a second drive section in another embodiment of the present application;

fig. 12 shows a schematic cross-sectional view of a second drive part in a further embodiment of the present application;

FIG. 13a illustrates a schematic bottom view of a movable portion of a second drive portion in one embodiment of the present application;

fig. 13b shows a schematic bottom view of the movable part of the second driving part in another embodiment of the present application;

FIG. 14 illustrates the mounting position of the drive element of the second drive section in one embodiment of the present application at a bottom angle;

FIG. 15a shows a schematic cross-sectional view of a second drive section including a drive element in one embodiment of the present application;

FIG. 15b shows a schematic cross-sectional view of a second drive section including a drive element in another embodiment of the present application;

fig. 15c shows a schematic cross-sectional view of a driving element of a second driving part in a further embodiment of the present application;

FIG. 16a illustrates a schematic cross-sectional view of a camera module in one embodiment of the present application;

FIG. 16b is a schematic diagram illustrating an assembly of a camera module in one embodiment of the present application;

FIG. 16c illustrates a schematic cross-sectional view of an imaging module in another embodiment of the present application;

FIG. 17 illustrates an arrangement of camera modules and their connection straps in one embodiment of the present application;

FIG. 18 illustrates a perspective view of a second drive section and photosensitive assembly assembled in one embodiment of the present application;

FIG. 19 illustrates an exploded view of a second drive section and photosensitive assembly in one embodiment of the present application;

FIG. 20 is a schematic perspective view of a photosensitive assembly and a suspension circuit board used therein according to one embodiment of the present application;

FIG. 21a illustrates a front schematic view of a suspension circuit board in one embodiment of the present application after deployment;

fig. 21b shows a schematic back view of a suspension board in one embodiment of the present application after deployment.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed description are merely illustrative of exemplary embodiments of the application and are not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

The invention is further described below with reference to the drawings and specific embodiments.

Fig. 2 is a schematic cross-sectional view of an image capturing module with anti-shake function according to an embodiment of the present application. Referring to fig. 2, in the present embodiment, the image capturing module includes a lens 10, a photosensitive assembly 20, a first driving portion 30, and a second driving portion 40. Wherein the photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in both x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in both x and y directions. In this embodiment, the x and y directions are perpendicular to each other and are parallel to the photosensitive surface of the photosensitive element 20. The z direction is parallel to the normal direction of the photosensitive surface. For ease of understanding, a three-dimensional rectangular coordinate system constructed based on the x, y, z directions is also shown in fig. 2. In this embodiment, the control module drives the lens 10 and the photosensitive chip 21 to move in opposite directions at the same time, so as to realize optical anti-shake of the image capturing module. Specifically, the lens 1 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions, for example, the lens 10 is driven to move in the positive x-axis direction, and the photosensitive chip 21 is driven to move in the negative x-axis direction; the lens 10 is driven to move toward the positive y-axis direction, and the photosensitive chip 21 is driven to move toward the negative y-axis direction; or the lens 10 is driven to move in the x-axis and the y-axis while the photosensitive chip 21 is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens 10, in other words, when the movement in the x-axis and the y-axis is required to be simultaneously performed, the direction of the displacement vector of the lens 10 and the direction of the displacement vector of the photosensitive chip 21 are opposite in the xoy plane. The camera module generally includes a position sensor for detecting shake of the camera module or a terminal device (i.e., an electronic device, such as a mobile phone, on which the camera module is mounted). When the shake is detected, the position sensor sends a signal to the image pickup module, and the lens 10 and the photosensitive chip 21 are driven to move correspondingly to compensate the shake, so that the purpose of optical shake prevention is achieved. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, so that a faster response can be achieved, and a better anti-shake effect is achieved. In addition, the anti-shake angle range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in the present embodiment, by driving the lens 10 or the photosensitive chip 21 to move in opposite directions at the same time, a larger relative movement stroke (for convenience of description, the relative movement stroke may be simply referred to as an anti-shake stroke) is provided between the lens 10 and the photosensitive chip 21 than in the case of driving only the lens 10. In particular, due to the increase of the anti-shake stroke, the embodiment also has a better compensation effect on the tilting shake of the camera module. Further, the moving direction of the anti-shake movement of the present embodiment may be defined in the xoy plane, and the optical axis of the lens 10 or the photosensitive chip 21 does not need to be tilted, so that the problem of image sticking caused by the anti-shake movement is avoided.

Further, in another embodiment of the present application, the photosensitive chip 21 may be further driven by the second driving part 40 to rotate in the xoy plane, so as to implement compensation for shake in the rotation direction of the camera module.

Further, still referring to fig. 2, in one embodiment of the present application, the image capturing module includes a first driving section 30, a lens 10, a second driving section 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The first driving part 30 may have a cylindrical first motor carrier, which may be a movable part of the first driving part, and the lens is mounted on an inner side surface of the first motor carrier. The first driving part also has a stationary part, or called base part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base is provided with a light-passing hole. The movable part is movably connected with the base part. The driving element may be a coil magnet combination, which may be mounted between the movable part and the base part. For example, may be mounted between the first motor carrier and the motor housing. In fact, the first driving part in the present embodiment may directly adopt a common structure of the optical anti-shake motor in the prior art. Further, in the present embodiment, the second driving part 40 may be supported and fixed on the bottom surface of the first driving part 30. The second driving part 40 may also include a base part and a movable part. Wherein the base portion is directly connected with the first driving portion. The movable part is arranged below the base part and is movably connected with the base part. The photosensitive assembly 20 comprises a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens base 22 surrounding the photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the movable portion of the second driving portion 40. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22 (the light filter 24 can also be regarded as a component of the photosensitive assembly 20). The photosensitive assembly 20 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the driving of the movable portion of the second driving portion 40. For convenience of description, the base portion of the first driving portion 30 is sometimes referred to herein as a first base portion, the base portion of the second driving portion 40 is referred to as a second base portion, the movable portion of the first driving portion 30 is referred to as a first movable portion, and the movable portion of the second driving portion 40 is referred to as a second movable portion.

Fig. 3 is a schematic cross-sectional view of an image capturing module with anti-shake function according to another embodiment of the present disclosure. In this embodiment, the image capturing module includes a first driving portion 30, a lens 10, a second driving portion 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly of the first driving part 30 and the lens 10 may be identical to those of the previous embodiment shown in fig. 2, and will not be described again. This embodiment differs from the previous embodiment in that: the second driving part 40 is located inside the photosensitive assembly 20. In this embodiment, the photosensitive assembly 20 includes a circuit board 23, a lens base 22, an optical filter 24, and a photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the base portion of the first driving portion 30. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22. The lens base 22, the optical filter 24 and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving portion 40 may also be located in the cavity 25. Specifically, the base portion of the second driving portion 40 may be mounted on the surface of the circuit board 23, and the movable portion of the second driving portion 40 may be movably connected to the base portion. The photosensitive chip 21 is mounted on the surface of the movable portion. In this way, the photosensitive chip 21 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the drive of the movable portion of the second driving portion 40.

The above describes, in connection with two embodiments, different structural implementations of the second driving part of the camera module of the present application. The method for compensating the inclination shake of the camera module is further introduced based on the design thought of the application.

Fig. 4 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the application. In the figure, the position A represents the combination of the moving distance of the lens and the photosensitive chip for compensating the shake angle a of the camera module. As shown in fig. 4, the lens moving distance is b, the moving distance of the photosensitive chip (hereinafter sometimes simply referred to as chip) is c, and the lens or chip moving distance can be equivalent to the angle of the image plane deviating from the optical axis at the time of optical imaging. Specifically, when the translational distance of the lens in the xoy plane is b, an arithmetic relationship is formed between the image plane offset angle α1 and the image distance, the image distance is different at different shooting distances, and the image distance is replaced by the focal length of the image side for the convenience of calculation and expression. Specifically, the relationship between the image plane offset angle α1 and the focal length f of the lens is: tan (α1) =b/f, when the translation distance of the photosensitive chip in the xoy plane is c, the relationship between the image plane offset angle α2 and the focal length f of the lens image space is: tan (α2) =c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation mode of the comprehensive compensation angle a of the camera module is as follows: a=α1+α2=arctan (b/f) +arctan (c/f). In one embodiment, the moving distance of the lens and the photosensitive chip may be set to be the same, i.e., b=c. In another embodiment, the distance the lens moves from the photosensitive chip may be set to be unequal, for example, the distance the lens moves may be greater than the distance the photosensitive chip moves, i.e., b > c. In this embodiment, the second driving portion may select a smaller-sized driver (such as a mems driver, etc., and the movable stroke of such a driver is also relatively small), so as to help the overall miniaturization of the camera module.

Further, in one embodiment of the present application, the ratio of the lens moving distance to the photosensitive chip moving distance is optionally set to keep a fixed ratio, for example, b/c=6:4, b/c=7:3, or b/c=5:5, and the distance between the lens and the photosensitive chip moving is kept at the preset ratio no matter what the compensation value (for example, the integrated compensation angle a) of the shake of the camera module is, which is beneficial to making the compensation effect of the camera module uniform in the compensable range and reducing the design difficulty of the driving logic module of the anti-shake system of the camera module.

Further, in the configuration in which the lens movement distance and the photosensitive chip movement distance are subjected to anti-shake movement based on a fixed ratio, since the movable range of the photosensitive chip is small, sometimes the shake of the image pickup module may exceed the maximum movement stroke of the photosensitive chip. Therefore, in an embodiment of the present application, an anti-shake threshold may be set, for example, for a shake angle a to be compensated, a threshold K may be set, and when the shake angle a actually calculated is less than or equal to the anti-shake threshold K, the lens moving distance b and the photosensitive chip moving distance c are kept at a fixed ratio, where the fixed ratio may be preset, for example, b/c=6:4, b/c=7:3, or b/c=5:5. When the actually calculated shake angle a is greater than the anti-shake threshold K, the moving distance c of the photosensitive chip takes the maximum value of the moving travel, namely the maximum travel c of the photosensitive chip _max And lens shift distance b=tan (a/f) -c _max . In other words, when the shake angle to be compensated by the camera module is above the anti-shake threshold K, the lens is moved to a maximum value corresponding to the moving distance of the photosensitive chip (i.e. the maximum stroke c of the photosensitive chip _max ) After the position of (2), the first driving part can drive the lens to move continuously until the lens moving distance b=tan (a/f) -c _max . At the same time, the photosensitive chip moves synchronously to the opposite direction until the moving distance of the photosensitive chip is the mostLarge value c _max And then remain stationary.

Further, in another embodiment of the present application, in the xoy plane, the maximum travel b of the lens movement _max The corresponding anti-shake angle (the anti-shake angle refers to the angle of inclined shake of the camera module) can be smaller than the maximum stroke c of the photosensitive chip _max The corresponding anti-shake angle. Under the design, the anti-shake system of the camera module can have a faster response speed. In high-end lenses, the lenses often have a large number of lenses, for example, the number of lenses in the rear-end main camera lens in the current smart phone can reach 8 lenses, and in order to further improve imaging quality, glass lenses are used in some lenses, which all result in a large lens weight. When the driving force is not significantly increased, the speed at which the driving device drives the lens to move will decrease. The weight of the photosensitive chip or the photosensitive component is relatively light, and the preset position can be reached by a small driving force. Therefore, in the scheme of the embodiment, the advantage that the photosensitive chip or the photosensitive assembly is relatively close in weight and relatively fast in moving speed can be better utilized, and the response speed of the anti-shake system of the camera module is effectively improved.

Further, in another embodiment of the present application, the fixed ratio of the lens movement distance to the photosensitive chip movement distance may be set according to factors such as the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or the photosensitive assembly), the driving force of the second driving portion, and the like, and the setting of a suitable fixed ratio may enable the time for the lens and the photosensitive chip to move to respective anti-shake target positions to be substantially consistent, so as to obtain a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving part may substantially determine the moving speed of the lens, and the weight of the photosensitive chip (or the photosensitive assembly) and the driving force of the second driving part may substantially determine the moving speed of the photosensitive chip, when the moving speed of the lens is smaller than the moving speed of the photosensitive chip (for example, when the weight of the lens is larger), the moving distance of the photosensitive chip may occupy a larger proportion when the fixed proportion is set, so that the characteristic of the moving speed of the photosensitive chip is higher may be utilized, so that the photosensitive chip moves a longer distance, and the time for the lens and the photosensitive chip to move to respective anti-shake target positions is substantially consistent.

Further, in another embodiment of the present application, the first driving part may employ a driving element having a large driving force, and a suspension system having a large stroke. For example, the first driving portion may be driven by an SMA (shape memory alloy) element. Compared with the traditional coil magnet combination, the SMA element can provide larger driving force with smaller occupied space, so that the first driving part can be designed more compactly, and the miniaturization of the camera module is facilitated.

Further, fig. 5 shows a schematic cross-sectional view of an image capturing module in an embodiment of the present application. Referring to fig. 5, in the present embodiment, a base portion 41 of the second driving portion 40 is fixed with a base portion (not specifically shown in fig. 5) of the first driving portion 30. The lens 10 may be mounted to a movable part (e.g., a first motor carrier, not specifically shown in fig. 5) of the first driving part 30. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21, a lens base 22, an optical filter 24, and the like. The photosensitive assembly 20 may be mounted to the movable portion 42 of the second driving portion 40. Specifically, the bottom surface of the moving portion 42 may bear against the top surface of the lens holder 22 of the photosensitive assembly 20. In the second driving portion 40, the base portion 41 and the movable portion 42 may be elastically connected by a suspension system. In this embodiment, the suspension system allows translation of the movable part 42 in the xoy plane with respect to the base part 41. Alternatively, the suspension system may be a ball system, which has the advantage that: in the z direction, the movable portion 42 and the base portion 41 are brought into contact by balls, the movable portion 42 moves only in the xoy plane, and movement in the optical axis direction can be prevented by the balls between the movable portion 42 and the base portion 41, thereby avoiding an influence on focusing of the image pickup module.

Alternatively, in another embodiment, the suspension system may comprise a resilient element (e.g. a spring) by which the fixed and movable parts are connected, which allows translation of the movable part relative to the base part in the xoy plane but prevents movement of the movable part relative to the base part outside the xoy plane. The advantage of providing an elastic element compared to a ball system is: the elastic element can provide an initial force between the base part and the movable part, and the initial force can control the moving distance of the movable part or keep the position of the movable part by matching with the driving force of the driving element, so that the position of the movable part can be controlled without additionally providing a driving element for providing conjugate driving force. If a ball system is employed, the movable portion is free to move in the xoy direction relative to the base portion in the case where the driving element does not provide driving force, and therefore it is often necessary to provide at least a pair of driving forces in opposition to each other to control the holding of the movable portion in its initial position.

Further, still referring to fig. 5, in one embodiment of the present application, anti-shake may be achieved by driving the entire photosensitive assembly 20 to move. Meanwhile, the circuit board 23, the photosensitive chip 21, the lens seat 22 and the optical filter 24 are packaged into a whole, the circuit board 23, the lens seat 22 and the optical filter 24 form a closed space, the photosensitive chip 21 is accommodated in the closed space, the sealing performance of the photosensitive assembly 20 is improved, and the imaging of the photosensitive chip 21 in the process of making or using the camera module is not influenced by dust.

In this embodiment, still referring to fig. 5, in an embodiment of the present application, the back surface of the circuit board may directly bear against the terminal device (i.e. the electronic device on which the camera module is mounted, such as a mobile phone), and specifically, the back surface of the circuit board 23 may bear against the motherboard or other bearing member 90 of the terminal device. Although the movable portion 42 is connected to the photosensitive assembly 20 and the base portion 41 is connected to the first driving portion 30 in the present embodiment, it is understood that the movement of the movable portion 42 and the base portion 41 is opposite. In anti-shake movement, the movement direction is opposite: the direction of movement of the movable part of the first driving part relative to the base part thereof is opposite to the direction of movement of the movable part of the second driving part relative to the base part thereof.

Further, fig. 6 is a schematic cross-sectional view of an image capturing module according to another embodiment of the present application. Referring to fig. 6, in the present embodiment, a rear case 49 is added below the second driving part 40, and the rear case 49 is connected to the base part 41 of the second driving part 40, and forms a receiving cavity in which the movable part 42 of the second driving part 40 and the photosensitive member 20 are received. Referring to fig. 6, a gap 49a may be provided between the photosensitive member 20 and the bottom of the rear case 49. That is, the photosensitive assembly 20 is suspended, and the photosensitive assembly 20 is connected only to the movable portion 42 of the second driving portion 40. In this embodiment, the rear housing 49 is directly supported against the terminal device. Since the rear case 49 connects the terminal device and the second driving part 40 and the base part of the first driving part 30, the movable parts of the first driving part 30 and the second driving part 40 simultaneously drive the lens 10 and the photosensitive member 20 to move in opposite directions, respectively, with the terminal device as a reference during the anti-shake process. Further, in the present embodiment, the movable portion 42 of the second driving portion 40 is directly adhered to the upper end surface of the photosensitive member 20, so that the optical filter 24 is separated from the external space, and therefore, the chips generated by friction or collision of the movable portion 42 during the movement relative to the base portion 41 are prevented from directly falling onto the surface of the optical filter 24.

Fig. 7 shows a schematic cross-sectional view of an imaging module according to yet another embodiment of the present application. Referring to fig. 7, in the present embodiment, the first driving part 30 is implemented to be adapted to drive the lens 10 to move in the optical axis direction to realize the focusing function, while also being adapted to drive the lens 10 to move in the xoy plane to realize the anti-shake function. Optionally, the first driving portion 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32, the lens 10 is supported by the first carrier 31, a suspension system is disposed between the first carrier 31 and the second carrier 32, and a suspension system is disposed between the second carrier 32 and a housing 33 of the first driving portion 30. The suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) in this embodiment is configured as a ball system, and the suspension system between the second carrier 32 and the housing 33 (i.e., the second suspension system) is a suspension system based on elastic elements (e.g., spring plates). In the present embodiment, the second suspension system is provided outside the first suspension system, the first suspension system allows the lens 10 and the first carrier 31 to translate in the xoy plane to realize the anti-shake function, and the second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to integrally move in the optical axis direction to realize the focusing function. Alternatively, in another embodiment, the second suspension system may also be arranged inside the first suspension system. In another variant embodiment, the second suspension system may also be arranged below the first suspension system. In this embodiment, the suspension system is a system in which two members are movably connected, and the degree of freedom (i.e., the moving direction) of relative movement of the two members is limited. These two articulating components may be referred to as a base portion and a movable portion, respectively. Typically, the suspension system is used in conjunction with a drive element (e.g., an SMA element or coil magnet combination). Wherein a driving force is provided by the driving element, under which driving force the movable part is moved relative to the base part in a movement direction defined by the suspension system.

Further, fig. 8 shows a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application. Referring to fig. 8, the movable portion of the second driving portion 40 of the present embodiment may be provided with a downward extending arm 42a, and the extending arm 42a is adhered to the circuit board 23 of the photosensitive assembly 20. The extension arm 42a may be provided with an FPC board 42b, and the FPC board 42b may be directly soldered to the circuit board 23, thereby electrically conducting the driving element mounted on the movable portion and the circuit board 23. The embodiment can avoid the glue water flowing onto the optical filter when the photosensitive assembly 20 is adhered to the movable part, thereby influencing imaging. In addition, in the present embodiment, the upper end surface (i.e. the top end) of the photosensitive member 20 and the second driving portion 40 have a gap, so that the color filter can be prevented from being scratched or broken.

Further, fig. 9a shows a schematic perspective view of the second driving part in one embodiment of the present application, and fig. 9b shows a schematic exploded perspective view of the second driving part in one embodiment of the present application. Referring to fig. 9a and 9b, in the present embodiment, the movable portion 42 of the second driving portion 40 and the center of the base portion 41 each have a light passing hole through which light passing through the lens is incident on the photosensitive chip and imaged. In the present embodiment, the number of balls 80 is preferably four, and the balls are provided at four corners (i.e., four corner positions in a plan view) of the second driving portion 40.

Further, fig. 10a shows a schematic cross-sectional view of the second driving portion and the photosensitive assembly according to an embodiment of the present application. Referring to fig. 10a, in the present embodiment, the second driving part 40 includes a movable part 42 and a base part 41, wherein the base part 41 includes a base 41a and a cover 41b. The cover 41b includes a side wall 41c extending downward from the base 41a to form a surrounding of the movable portion 42 and a rest 41d extending horizontally inward from the side wall 41 c. The top of the sidewall 41c is connected to the base 41a, and the lower surface of the edge region 42a of the movable portion 42 may be supported against the upper surface of the support table 41d. The balls 80 and the edge region 42a of the movable portion 42 are sandwiched between the base 41a and the rest 41d of the cover 41b, ensuring that the movable portion 42 and the base portion 41 do not move relative to each other in the optical axis direction (i.e., the z-axis direction). In this way, the second driving portion 40 allows only the translation of the movable portion 42 in the xoy plane with respect to the base portion 41. More specifically, at least one accommodation space is provided between the base 41a and the cover 41b, the accommodation space being provided with the balls 80, and the movable portion 42 and the base 41a are respectively abutted against the balls 80, thereby ensuring that the movable portion 42 and the base portion 41 do not relatively move in the optical axis direction. The movable portion 42 may include a body portion 42b and an edge region 42a, and the thickness of the edge region 42a may be smaller than the thickness of the body portion 42 b. The lower surface (may also be referred to as a lower end surface) of the main body 42b may be lower than the lower surface (may also be referred to as a lower end surface) of the cover 41b, so as to ensure that the photosensitive assembly 20 does not contact the cover 41b after being attached to the movable portion 42, and prevent the photosensitive assembly 20 from touching or rubbing against the cover when performing anti-shake movement.

Further, still referring to fig. 10a, in one embodiment of the present application, the upper surface of the base portion 41 may have a stepped structure, and the stepped structure may include a first stepped surface 41e located at an outer side and a second stepped surface 41f located at an inner side, and the height of the second stepped surface 41f is lower than that of the first stepped surface 41e, so as to provide a larger axial (i.e., z-axis) movement space for focusing of the camera module. In this embodiment, the first driving portion may be mounted to the first stepped surface 41e of the base portion 41 of the second driving portion 40. The upper surface of the edge region 42a of the movable portion 42 may form a groove that can receive the ball 80 and restrict the movement of the ball 80 within the groove, while also retaining debris generated by friction of the ball 80 with the movable portion 42 or the base portion 41 within the groove. Also, since the balls 80 can be placed in the grooves, the movable portion 42, the base 41a and the cover 41b of the base portion 41 can be more conveniently assembled. In another embodiment, the boss on the outer side of the groove can be omitted, so that the design can reduce the transverse dimension of the second driving part, and the miniaturization of the camera module is facilitated. Since the outer-lying elevation of the recess is eliminated, the recess is now effectively degraded to a depression step whose outer-side step surface is lower than the inner-side step surface, and which, together with the side wall of the cover and the base, forms a receiving space for receiving the balls.

Further, in an embodiment of the present application, the edge region of the movable portion may be provided with a plurality of grooves, and the number of grooves may be matched with the number of balls. Each ball is respectively accommodated in the corresponding groove. The bottom surface of the groove can be a plane, so that the movable part can be ensured not to incline during translation, and meanwhile, the movable part and the base part can relatively move on three axes in the xoy plane only through a single-layer ball. Alternatively, a base groove may be provided at a position of the base corresponding to the movable portion groove. This design allows to reduce the thickness of the second drive part in case the ball diameter is constant. The bottom surface of the groove or the bottom surface of the recessed step (i.e., the outer step surface of the recessed step) is flat, and the movable portion is allowed to rotate in the xoy plane, i.e., about the z-axis, with respect to the base portion. The direction of rotation about the z-axis may be referred to as the Rz direction, and may also be referred to as Rz-axis rotation. In this embodiment, the photosensitive chip can move in three directions of x, y and Rz to realize anti-shake, so that the anti-shake device has better anti-shake capability. Since the x, y, and Rz directions of movement are all in the xoy plane, the aforementioned relative movement in the xoy plane on three axes, that is, movement in the x, y, and Rz directions is referred to.

Fig. 10b shows a schematic cross-sectional view of a second driving part with balls arranged at the lower side of the movable part in a variant embodiment of the present application. Referring to fig. 10b, in the present embodiment, the balls 80 are located between the rest 41d of the cover 41b and the movable portion 42. At the positions corresponding to the balls 80, the edge regions 42a of the movable portion 42 and/or the rest table 41d may be provided with grooves, and groove bottom surfaces of the grooves may be provided as planes, thereby allowing the movable portion 42 to move only in the xoy plane with respect to the base portion 41 and not to be inclined when moving in the xoy plane.

Fig. 10c shows a schematic cross-sectional view of a second drive part with two layers of balls in a variant embodiment of the present application. In the present embodiment, two layers of balls 81 and 82 are provided. Specifically, a layer of balls 81 is provided between the base 41a and the movable portion 42, and a layer of balls 82 is provided between the movable portion 42 and the rest 41d of the cover 41 b. Compared with the embodiment shown in fig. 10a, since a layer of balls 82 is added between the movable part 42 and the bearing table 41d, the movable part 42 does not directly rub against the bearing table 41d during anti-shake movement, and generation of chips is reduced. And the resistance of the movable portion 42 at the time of movement can be reduced by providing the two layers of balls 81 and 82.

Further, fig. 11a shows a schematic cross-sectional view of the second driving part in one embodiment of the present application. Referring to fig. 11a, in the present embodiment, an inward concave locking groove 42c is provided on the outer side surface of the movable portion 42, and a receiving base 41d of a cover 41b of the base portion 41 is fitted into the locking groove 42c. In this solution, the lower end surface of the second driving portion 40 may have a larger area, and when the lens base 22 is attached to the movable portion 42, the glue may be disposed in an area further outside the lens base 22, so that the glue is kept away from the optical filter as far as possible, and the risk that the glue flows onto the optical filter 24 is reduced, and meanwhile, the risk that the lens base 22 rubs against the base portion 41 during the anti-shake movement process is completely avoided. Further, in this embodiment, the movable portion 42 may be split, for example, the movable portion 42 may include a first movable portion member 43 and a second movable portion member 44, and the second movable portion member 44 and/or the first movable portion member 43 may be recessed laterally inward to form the slot 42c. Further, fig. 11b shows an assembled schematic view of the second driving part in one embodiment of the present application. Referring to fig. 11a and 11b in combination, in the assembly process of the second driving part 42, the movable part first member 43, the base part 41, and the balls 80 may be assembled, and then the movable part second member 44 may be attached to the lower end surface of the movable part first member 43. Under this kind of design, need not to worry when the mirror seat is attached that glue contacts basic portion, glue also can set up in the place that the mirror seat is close to the edge (need not dodge the basic portion in four corners) simultaneously and avoid glue to pollute the colour filter.

Alternatively, fig. 11c shows a schematic cross-sectional view of the second driving part in another embodiment of the present application. Referring to fig. 11c, in the present embodiment, the movable portion 42 may be integrally formed, that is, the locking groove 42c is directly formed when the movable portion 42 is formed. And the cover 41b may be of a separate type. Referring to fig. 11b, the cover 41b may include two separate cover members 41b1 and 41b2, and the two separate cover members 41b1 and 41b2 may be laterally inserted into the locking grooves 42c of the movable portion 42 from both left and right sides, respectively, to fix the axial (i.e., z-axis) positions of the movable portion 42 and the base portion 41, thereby completing the encapsulation of the second driving portion 40.

Further, fig. 12 shows a schematic cross-sectional view of a second driving part in yet another embodiment of the present application. Referring to fig. 12, in the present embodiment, an inward concave locking groove 42c is provided on the outer side surface of the movable portion 42, and both the bearing table 41d of the base portion 41 and the balls 80 are provided in the locking groove.

In one embodiment of the present application, the movable portion is adhered to the upper end surface of the lens base of the photosensitive assembly, so as to connect the movable portion and the photosensitive assembly. In a modified embodiment, the movable portion may also be provided with a downward extending extension arm, and the circuit board of the photosensitive assembly is bonded through the extension arm, so as to realize connection between the movable portion and the photosensitive assembly. Referring to fig. 8 in combination, in the case where the extension arm 42a of the movable portion is bonded to the circuit board 23, alternatively, the lens holder may be selected as a small lens holder 22a with a low height, the small lens holder 22a is used only for mounting the photosensitive chip 24, and the electronic component 25 with a high height such as a capacitor or the like is disposed outside the photosensitive chip 21 and the small lens holder 22 a. The scheme can reduce the height of the lens base, thereby reducing the back focus of the camera module and further reducing the overall height of the module. In the present embodiment, since at least a portion of the electronic component is disposed outside the lens holder, preferably, the outer side surface of the movable portion of the second driving portion 40 has the clamping slot, so that the extension arm is disposed at the edge of the second driving portion, so that the extension arm is far away from the electronic component as far as possible, and the electronic component is prevented from being affected by glue.

Fig. 13a shows a schematic bottom view of the movable part of the second driving part in one embodiment of the present application. In the present embodiment, the glue 50 is disposed between the lower end surface of the movable portion 42 and the upper end surface of the lens base of the photosensitive assembly. The glue 50 may be disposed so as to avoid the four corner regions, so as to avoid the glue 50 leaking into the gaps of the ball receiving structures at the four corners, thereby negatively affecting the anti-shake movement. At the same time, the edge of the movable part 42 is prevented from being too close to the optical filter, so that the risk of glue polluting the optical filter is reduced. Fig. 13b shows a schematic bottom view of the movable part of the second driving part in another embodiment of the present application. In this embodiment, the glue 50 may be arranged in a closed loop along the edge area of the lower end face of the movable part 42. This design can increase the sealing of the photosensitive assembly and prevent dust from falling onto the color filter.

It should be noted that the above embodiments may be combined with each other, for example, the card slot designs shown in fig. 11a, 11b and 12 may be combined with a double-layer ball design. Wherein the groove/recess step may be provided on the rest stand or on the movable portion.

Further, fig. 14 shows the mounting position of the driving element of the second driving part in an embodiment of the present application in a bottom view. Fig. 15a shows a schematic cross-sectional view of a driving element comprising a second driving part in an embodiment of the present application. Referring to fig. 14 and 15a in combination, in one embodiment of the present application, the driving element of the second driving portion 40 is a coil magnet combination. Wherein the magnet 61 may be provided at an edge region of the base portion 41, and the coil 62 may be provided at an edge region 42a of the movable portion 42. The coil 62 may be soldered to and connected to the circuit board 23 of the photosensitive member 20 via an FPC board (flexible board) provided on the movable portion 42. Since the movable portion 42 and the photosensitive member 20 are moved synchronously during the anti-shake process, soldering the coil 62 to the wiring board 23 through the FPC board can ensure that there is no relative movement of the wires or solder during the movement, reducing the risk of electrical connection failure or poor contact at the solder. In this embodiment, a magnet may be provided on the base 41a of the base 41.

Further, fig. 15b shows a schematic cross-sectional view of the driving element of the second driving part in another embodiment of the present application. Referring to fig. 15b, in the present embodiment, the magnet 61 is provided on the support base 41d of the cover 41b of the base 41.

Further, fig. 15c shows a schematic cross-sectional view of the driving element of the second driving part in a further embodiment of the present application. In the present embodiment, the coil 62 and the magnet 61 may be provided on the side walls of the movable portion 42 and the base portion 41. This design is advantageous in reducing the thickness of the second driving portion 40, thereby reducing the height of the camera module.

Still referring to fig. 14, in one embodiment of the present application, preferably, three coil magnet pairs (one coil magnet pair, i.e., one coil magnet combination) are provided, which are referred to as a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65, respectively. The first pair of coil magnets 63 and the second pair of coil magnets 64 are used to drive the translation of the movable portion 42 in the x-axis direction, that is, to provide a driving force in the x-axis direction. The third pair of coil magnets 65 is used to drive the translation of the movable portion 42 in the y-axis direction, i.e., to provide a driving force in the y-axis direction. The first coil magnet pair 63 and the second coil magnet pair 64 may be disposed along two opposite sides of the second driving part, which may be referred to as a first side 45 and a second side 46, respectively, in a top view (or a bottom view), the first side 45 and the second side 46 not intersecting. And the second pair of coil magnets 64 may be arranged along a third side 47 of the second driving part, the third side 47 intersecting both the first side 45 and the second side 46. In this embodiment, the three coil magnet pairs can realize both x-axis translation and y-axis translation, and also can realize rotation on the xoy plane. For example, when the first coil magnet pair 63 and the second coil magnet pair 64 provide driving forces in opposite directions, a combined driving force for rotating the movable portion in the xoy plane can be generated. Note that the manner of providing the driving force for the rotation in the xoy plane is not limited to this, and for example, a combined driving force for rotating the movable portion in the xoy plane may be generated by operating the first coil magnet pair 63 and the third coil magnet pair 65. Optionally, the positions of the first coil magnet pair and the second coil magnet pair may be staggered (i.e., the positions of the first coil magnet pair and the second coil magnet pair may be asymmetric about the central axis of the second driving portion), so as to provide a driving force to implement rotation of the movable portion in the xoy plane (i.e., movement in the Rz direction).

Further, fig. 16a shows a schematic cross-sectional view of an imaging module in an embodiment of the present application. Referring to fig. 16a, in the present embodiment, a sidewall of the rear case 49 may have a first through hole 49b so that a Flexible Printed Circuit (FPC) of the circuit board 23 passes therethrough to make electrical connection with a main board or other parts of the terminal device. The center of the bottom plate 49c of the rear case 49 may have a second through hole 49d to facilitate assembly of the camera module. The process of assembling the camera module may include: the lens 10 is mounted on the first driving part 30, the second driving part 40 is attached to the bottom of the first driving part 30, and finally the photosensitive assembly 20 is attached to the movable part 42 of the second driving part 40 upwards through the second through hole 49d at the bottom of the rear case 49.

Fig. 16b is a schematic diagram illustrating an assembly method of the camera module in an embodiment of the present application. In this embodiment, optionally, the photosensitive assembly 20 may be placed on the adjusting device 29, and the second through hole 49d at the bottom of the rear case 49 allows the adjusting device 29 to determine the preferred position and posture of the photosensitive assembly 20 through an active calibration process, and then adhere to the movable portion 42 of the second driving portion 40 through the glue 28.

Fig. 16c shows a schematic cross-sectional view of an imaging module according to another embodiment of the present application. Referring to fig. 16c, in this embodiment, the bottom of the rear case 49 is a complete bottom plate 49c, i.e. the bottom plate 49c is not provided with a second through hole, when assembling, the second driving part 40 and the photosensitive assembly 20 may be attached together to form a first assembly, the first driving part 30 and the lens 10 may be assembled together to form a second assembly, then the relative positions of the first assembly and the second assembly (the active calibration includes the adjustment of the position and the posture) may be determined through the active calibration process, and finally the first driving part 30 and the second driving part 40 may be attached according to the relative positions determined through the active calibration, wherein the glue 27 for bonding the first assembly and the second assembly may be disposed between the bottom surface of the first driving part 30 and the top surface of the second driving part 40.

Further, fig. 17 shows an arrangement of the camera module and the connection belt thereof in an embodiment of the present application. Referring to fig. 17, in the present embodiment, the camera module may include a first connection belt 26a and a second connection belt 26b, the first connection belt 26a is disposed at a top region of the first driving portion 30 and electrically connected to the first driving portion 30, and the second connection belt 26b is in communication with the circuit board 23 of the photosensitive assembly 20. The second connecting strip 26b may be provided with a plurality of bends to form a bending lamination shape to buffer the stress caused by the movement of the photosensitive assembly 20. The end of the second connecting strap 26b may be provided with a connector which is optionally secured by pressing and electrically connected to the central column, and which in turn conducts the main board (or other component) of the terminal device through the central column 26 c. Likewise, the end of the first connecting strap 26a may also be connected to a connector that is fixed by pressing and electrically connected to the center pillar 26c, and then conducts the main board (or other components) of the terminal device through the center pillar 26 c. In the solution of this embodiment, the conducting circuit of the first driving portion 30 may be separated from the photosensitive assembly 20, and is not affected by the movement of the photosensitive assembly 20. The second connection strap 26b and the center pillar 26c may be accommodated in the second housing 70, the first connection strap 26a is located outside the second housing 70, and the top of the second housing 70 may have a third through hole 70a so that the connector of the first connection strap 26a protrudes into and is electrically conducted with the second connection strap 26b or the center pillar 26 c.

In the above embodiment, the first driving portion and the second driving portion may constitute a driving structure for the optical actuator, in which the first driving portion is adapted to mount the lens, the second driving portion is adapted to mount the photosensitive assembly, and the lens and the photosensitive chip are configured to be driven simultaneously and to move in opposite directions. For example, if the lens is driven to move towards the positive direction of the x axis, the photosensitive chip is driven to move towards the negative direction of the x axis; the lens is driven to move towards the positive direction of the y axis, and the photosensitive chip is driven to move towards the negative direction of the y axis; or the lens is driven to move in the x-axis and the y-axis while the photosensitive chip is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens, in other words, when the movement in the x-axis and the y-axis is required to be simultaneously performed, the directions of the displacement vector of the lens and the displacement vector of the photosensitive chip are opposite in the xoy plane. In this embodiment, the lens and the photosensitive chip are configured to move simultaneously, and the moving directions of the lens and the photosensitive chip are opposite, so that a faster response can be realized, and the anti-shake effect is better. In addition, the anti-shake angle range of the normal camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in this embodiment, by driving the lens or the photosensitive chip to move in opposite directions at the same time, compared with the scheme of driving only the lens to move, a larger relative movement stroke (for convenience of description, the relative movement stroke may be simply referred to as an anti-shake stroke) is provided between the lens and the photosensitive chip, which may have a better compensation effect. In particular, due to the increase of the anti-shake stroke, the embodiment also has a better compensation effect on the tilting shake of the camera module. Further, the moving direction of the anti-shake movement in the embodiment may be limited in the xoy plane, so that the optical axis of the lens or the photosensitive chip does not need to be inclined, thereby avoiding the problem of image sticking caused by the anti-shake movement.

Further, in the camera module, the circuit board of the photosensitive assembly generally includes a rigid circuit board body and a flexible connection strap, one end of which is connected to the circuit board body, and the other end of which is connected to and conducts with a motherboard or other member of the electronic device through a connector. In the prior art, the flexible connecting belt of the photosensitive assembly is usually led out from the side surface of the main body of the circuit board, and the flexible connecting belt is approximately parallel to the surface of the column body of the circuit board. In this arrangement, the flexible connection strip may generate a large resistance to the movement of the circuit board main body, which may increase the force required to drive the circuit board main body to move, resulting in insufficient stroke of anti-shake compensation and a decrease in response speed. Also, the resistance caused by the connection belt is irregular, which makes it difficult for the second driving portion to compensate for the resistance, possibly causing a decrease in the accuracy of the anti-shake compensation. Therefore, the present embodiment provides a suspended circuit board as the circuit board of the photosensitive assembly adapted to the second driving portion, which is designed to help overcome the above-mentioned drawbacks caused by the connection belt.

Fig. 18 is a perspective view showing an assembled second driving part and photosensitive member in one embodiment of the present application. Fig. 19 shows an exploded schematic view of the second driving part and the photosensitive assembly in one embodiment of the present application. Fig. 20 is a schematic perspective view of a photosensitive assembly and a suspension circuit board used in the photosensitive assembly according to an embodiment of the present application. Referring to fig. 18, 19 and 20, in the image capturing module of the embodiment, the photosensitive assembly 20 is connected to the movable portion 42 of the second driving portion 40, so that the circuit board main body 71 can move in the xoy plane under the driving of the movable portion 42. The wiring board 23 of the present embodiment is designed as a suspension structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connection strap 72, and the connection strap 72 may include a third connection strap 72a and a fourth connection strap 72b, and the third connection strap 72a and the fourth connection strap 72b may be respectively led out from two opposite sides (for convenience of description, the two opposite sides may be referred to as a first side 74a and a second side 74 b) of the circuit board body 71 and bent upward. The third and fourth connection bands 72a and 72b after bending may form hanging parts 75, respectively. The suspension 75 may be connected to the base portion of the second driving portion 40 (or the first driving portion 30) to form a suspension structure. The suspension structure allows the base portion to suspend the circuit board main body 71 and its surface-mounted components (i.e., suspend the photosensitive assembly 20) by the bent portion 73 of the flexible connection strap 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75 a), and the base portion 41 of the second driving portion 40 may have a corresponding hook 75b, and the hook 75b hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting belt and the circuit board main body are usually in the same plane, and deflection of the connecting belt on the same plane relative to the circuit board main body can generate larger resistance. In the present embodiment, the connecting strip 72 and the circuit board body 71 are provided with a bending portion 73 formed by bending upwards, and the resistance of the connecting strip 72 on the xoy plane (which can be regarded as a horizontal plane) relative to the circuit board body 71 is relatively small.

Further, in one embodiment of the present application, the third and fourth connection bands 72a and 72b may extend along the circumference of the circuit board main body 71 and the photosensitive assembly 20 such that the connection band 72 surrounds the photosensitive assembly on at least three sides. And, the third connection strap 72a and the fourth connection strap 72b are connected to each other and electrically connected. Wherein the photosensitive member 20 has a first side 74a and a second side 74b which are positioned in conformity with the wiring board main body 71. The first side 74a and the second side 74b are disposed opposite (i.e., do not intersect) and the third side 74c of the photosensitive assembly 20 intersects both the first side 74a and the second side 74b. The connecting band 72 may be looped around the first side 74a, the second side 74b, and the third side 74c of the photosensitive assembly 20. The third connecting band 72a is led out from the first side 74a of the circuit board main body 71 and is bent upward to form the bending portion 73, then extends along the first side 74a of the photosensitive member 20, is bent in the horizontal direction at the corner, and continues to extend along the third side 74c. The fourth connecting strip 72b is led out from the second side 74b of the circuit board main body 71 and is bent upwards to form another bending part 73, then extends along the second side 74b of the photosensitive assembly 20, is bent horizontally at a corner, and continues to extend along the third side 74c. The third 72a and fourth 72b connecting strips may be joined and electrically conductive to each other at the third side 74c, thereby forming a complete connecting strip 72. The three connection strap sections at the first, second and third sides 74a, 74b and 74c may have at least one hanging portion 75, respectively, each of the hanging portions 75 having at least one through hole so as to be connected with the base portion 41 of the second driving portion 40 (or the first driving portion 30). In this embodiment, the suspension portion 75 can suspend the circuit board body 71 by the bending portions 73 located at opposite sides of the circuit board body 71, so that the bending portions 73 and the connecting strap 72 can bend and deform when the circuit board body 71 is driven to move by the second driving portion 40, thereby satisfying the movement stroke of the circuit board body 71.

Further, in one embodiment of the present application, the suspension 73 of the three connecting band sections at the first, second and third sides 74a, 74b, 74c may be reinforced by a rigid substrate. For example, a rigid substrate may be attached to a partial region of the flexible connection tape to form the suspension 73. While other areas of the flexible connecting band remain flexible so as to be capable of bending and deforming and meet the movement stroke of the circuit board main body 71.

Further, in one embodiment of the present application, the connection strap section located on the third side 74c may have a rigid hanging portion 75c, and the hanging portion 75c may lead out a fifth connection strap 76, and the fifth connection strap 76 may be used to connect to a motherboard of an electronic device (e.g., a mobile phone).

Further, in another embodiment of the present application, the suspension part may also be connected to an external bracket (not shown in the drawings) which is directly or indirectly fixed with the base part of the second driving part. In this application, the suspension part may be fixed to the base part of the second driving part through other intermediaries. Wherein the intermediary may be directly or indirectly fixed to the base part of the second driving part. The intermediate has hooks thereon to hook the suspension portion, or the intermediate is adhered to the suspension portion. The intermediate may be an outer bracket, a base portion of the first driving portion, or another intermediate.

Further, in another embodiment of the present application, the suspension may not have the through hole. In this embodiment, the suspension part may be fixed to the base part of the second driving part (or to the base part of the first driving part or the outer bracket) by means of adhesion. Further, in another embodiment of the present application, the third connection strap and the fourth connection strap may be a rigid-flex board, wherein a portion forming the suspension portion may be a rigid board, and both a portion connecting the suspension portion and the bending portion formed by bending upward may be a flexible board. Since the suspension portion is directly formed by the hard plate, the suspension portion in the embodiment can be reinforced without attaching the rigid substrate.

Further, in an embodiment of the present application, the circuit board main body, the third connection strap and the fourth connection strap may be formed of a complete rigid-flex board.

Further, still referring to fig. 18, 19 and 20, in one embodiment of the present application, the circuit board may further have a fixing portion 76a for fixing the fifth connection strap 76, which is designed to prevent the circuit board main body 71, the third connection strap 72a and the fourth connection strap 72b from being affected by external factors.

Further, fig. 21a shows a schematic front view of a suspension circuit board according to an embodiment of the present application after being unfolded; fig. 21b shows a schematic back view of a suspension board in one embodiment of the present application after deployment. Referring to fig. 21a and 21b, in the present embodiment, the circuit board 23 may be formed of a rigid-flex board. Wherein the sections of the third connecting strip 72a and the fourth connecting strip 72b on the third side 74c can be snapped together by means of connectors 78, 79 (see fig. 20 in combination), the third connecting strip 72a and the fourth connecting strip 72b are fixedly connected and further electrically connected. Circuits are provided in the third connecting strip 72a and the fourth connecting strip 72b to lead out the wires in the circuit board main body 71, and then the wires are connected to an external circuit through the fifth connecting strip 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can each draw out a part of the wiring by the corresponding bent portion 73 formed by the upward bending, the wiring required to be drawn out of each bent portion 73 can be reduced, so that the width of each bent portion 73 can be reduced, thereby further reducing the resistance of the flexible connecting band 72 to the movement of the wiring board main body 71, and further reducing the driving force required to be supplied by the second driving portion 40. It should be noted that, in other embodiments of the present application, the circuit of the circuit board main body may be led out through only one of the bending portions (for example, the bending portion of the third connecting band bending upward or the bending portion of the fourth connecting band bending upward).

Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and are not limiting. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the appended claims.

Claims

1. An optical anti-shake camera module, comprising:

a lens;

a photosensitive assembly;

a first driving part which mounts the lens and drives the lens to translate in x-axis and y-axis directions;

a second driving part including a second base part and a second movable part; the photosensitive assembly is positioned below the second movable part and is arranged on the second movable part, the second movable part is suitable for driving the photosensitive assembly to translate in the directions of an x axis and a y axis relative to the second base part, and the x axis and the y axis are mutually perpendicular and are parallel to the photosensitive surface of the photosensitive assembly; and

a rear shell positioned below the second driving part, the rear shell is connected with the second base part and forms a containing cavity, and the second movable part and the photosensitive assembly are positioned in the containing cavity;

The first driving part drives the lens to move a lens moving distance b and the second driving part drives the photosensitive chip to move a photosensitive chip moving distance c, wherein the photosensitive chip and the lens move in opposite directions, and the first driving part drives the lens to move a lens according to the detected inclination shaking angle a of the camera module; the lens moving distance b, the photosensitive chip moving distance c and the image space focal length f of the camera module satisfy the following conditions: a=arctan (b/f) +arctan (c/f).

2. The optical anti-shake camera module according to claim 1, wherein the rear housing has a bottom plate, and the center of the bottom plate has a second through hole.

3. The optical anti-shake camera module according to claim 1, wherein the bottom of the rear housing is a complete bottom plate, and a gap is formed between the photosensitive assembly and the bottom plate.

4. An optical anti-shake camera module according to claim 1, 2 or 3 and wherein the side wall of the rear housing has a first through hole, and the circuit board of the photosensitive assembly comprises an FPC board, and the FPC board passes through the first through hole.

5. The optical anti-shake camera module according to claim 1, wherein a bottom surface of the second movable portion is supported against a top surface of the photosensitive assembly.

6. The optical anti-shake camera module according to claim 5, wherein the photosensitive assembly comprises a circuit board, the photosensitive chip mounted on the surface of the circuit board, and a lens base surrounding the photosensitive chip, the bottom of the lens base is mounted on the surface of the circuit board, and the top surface of the lens base is fixed on the second movable portion.

7. The optical anti-shake imaging module according to claim 1, wherein the second base portion and the second movable portion are in contact with each other via balls in a z-axis direction so as to restrict movement of the second movable portion relative to the second base portion within an xoy plane, the z-axis being parallel to a normal direction of the light-sensitive surface.

8. The optical anti-shake camera module according to claim 1, wherein the second movable portion is movably connected to the second base portion by a suspension system, the suspension system including an elastic element, the second base portion and the second movable portion being connected by the elastic element, the elastic element allowing translation of the second movable portion relative to the second base portion in an xoy plane and preventing movement of the second movable portion relative to the second base portion outside the xoy plane.

9. The optical anti-shake camera module according to claim 6, wherein the photosensitive assembly further comprises an optical filter, the circuit board, the photosensitive chip, the lens holder and the optical filter are packaged as a whole, and the circuit board, the lens holder and the optical filter form a closed space.

10. The optical anti-shake camera module according to claim 1, wherein the second movable portion has a downward extending arm, and the arm is bonded to the circuit board; and the extension part is provided with an FPC board which is electrically connected with the circuit board.

11. The optical anti-shake camera module according to claim 1, wherein the second base portion includes a base and a cover, the cover including a side wall extending downward from the base and surrounding the second movable portion, and a rest stand extending horizontally inward from the side wall.

12. The optical anti-shake imaging module according to claim 11, wherein a lower surface of an edge region of the second movable portion is supported against an upper surface of the support table.

13. The optical anti-shake camera module of claim 11, wherein the ball and the second movable portion are sandwiched between the base and the rest.

14. The optical anti-shake camera module according to claim 1, wherein the second movable portion is further adapted to drive the photosensitive assembly to rotate on an xoy plane relative to the second base portion.

15. A method of assembling an optical anti-shake camera module according to claim 2, comprising: mounting the lens on the first driving part, and attaching the second driving part to the bottom of the first driving part; and

and finally, the photosensitive assembly is attached to the second movable part upwards through the second through hole of the rear shell.

16. The method of assembling of claim 15, wherein the step of attaching the photosensitive assembly to the second movable portion further comprises: and placing the photosensitive assembly on an adjusting device, adjusting the photosensitive assembly by the adjusting device through a second through hole at the bottom of the rear shell, determining the position and the posture of the photosensitive assembly based on an active calibration process, and then bonding the photosensitive assembly and the second movable part through glue.

17. An assembling method of the optical anti-shake camera module according to claim 3, wherein the second driving part and the photosensitive assembly are attached together to form a first assembly, and the first driving part and the lens are assembled together to form a second assembly;

Then determining the relative positions of the first combination body and the second combination body through an active calibration process; and

and finally, pasting the first driving part and the second driving part according to the relative position determined by active calibration, wherein glue used for pasting the first combination body and the second combination body is arranged between the bottom surface of the first driving part and the top surface of the second driving part.