CN208572247U - Stabilization camera module, stabilization photosensory assembly and electronic equipment - Google Patents
Stabilization camera module, stabilization photosensory assembly and electronic equipment Download PDFInfo
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- CN208572247U CN208572247U CN201821320091.7U CN201821320091U CN208572247U CN 208572247 U CN208572247 U CN 208572247U CN 201821320091 U CN201821320091 U CN 201821320091U CN 208572247 U CN208572247 U CN 208572247U
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- photosensory assembly
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Abstract
The utility model discloses a stabilization camera module, stabilization photosensory assembly and electronic equipments.The stabilization photosensory assembly includes a circuit board module, at least a driver and an at least photosensitive element.The circuit board module provides at least one and attaches face.Often the driver is accordingly attached at often attaching face of the circuit board module.Often the photosensitive element is arranged in correspondence in the often driver, and the driver is located between the photosensitive element and the attaching face of the circuit board module, to pass through the mobile corresponding photosensitive element of the driver, to realize the stabilization function of the stabilization photosensory assembly.
Description
Technical field
The utility model relates to optical image technology fields, more particularly to a stabilization camera module, stabilization photosensory assembly
And electronic equipment.
Background technique
In recent years, electronic product, smart machine etc. develop towards miniaturization and high performance direction more and more, electronics
Product, smart machine this development trend to the camera module of one of standard configuration as electronic product, smart machine
Size and imaging capability are proposed harsher requirement.This also results in electronic product and smart machine industry is being pursued invariably
The compact and function of camera module are integrated, and stabilization function is exactly to be integrated into camera module in this development wave
It goes, to realize the stabilization function of camera module.
In the prior art, usually using traditional anti-vibration motor to camera module offset in x and y direction and
Rotation in X/Y plane is corrected, to realize the stabilization function of camera module.However, on the one hand, traditional anti-vibration motor pair
The calibration result of the offset of camera module in x and y direction and the rotation in X/Y plane is bad；On the other hand, the tradition
Anti-vibration motor structure is complicated, at high cost, yield is low, power consumption is big, volume is big, be not able to satisfy camera module day gradually
The harsh requirement of benefit.
Utility model content
The one of the utility model is designed to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Stabilization function can be realized using driver, to meet the camera module requirement increasingly harsh to anti-shudder performance.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
It can provide a smooth attaching face for the driver, to avoid because of precision and flatness needed for attaching the driver
The not up to standard and problem that causes yield lower.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Its yield, reliability and economic benefit for can be improved the stabilization camera module production.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the driver is implemented as a MEMS (abbreviation MEMS), to pass through
The MEMS is attached at the photosensitive element of the MEMS to move, to realize the stabilization function of the stabilization camera module.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, an attaching substrate of the stabilization photosensory assembly provides the smooth attaching
Face, so that the MEMS is attached at wiring board across the attaching substrate indirectly, to prevent the flatness because of the wiring board
Normal work that is poor and influencing the MEMS.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, attaching substrate intensity with higher attaches substrate to prevent described
Deformation, to guarantee that the attaching face is able to maintain preferable flatness.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the attaching substrate is implemented as the steel plate made of steel, so that the patch
Attached substrate can not only provide non-deformability with higher, to keep the flatness in the attaching face, but also can increase
The heat-sinking capability of the strong stabilization camera module.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the attaching substrate is implemented as by such as ceramics, alloy, metal material, height
With the plate of high flatness made of material of the molecular material etc. with some strength, to guarantee that the attaching substrate can
The attaching face for having high flatness is provided.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the attaching substrate is attached in an accommodation space of the wiring board, with
Reduce a photosensitive element and the distance between the wiring board for the stabilization photosensory assembly, to reduce the stabilization camera shooting mould
The whole height of group.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the attaching substrate is equipped with an at least vacuum tank, and is attaching the MEMS extremely
When the attaching substrate, inhale vacuum by the vacuum tank prevents the MEMS in glue to keep the flatness of the MEMS
It shifts or warps before solidification.
The another object of the utility model is to provide a stabilization camera module, stabilization photosensory assembly and electronic equipment,
Wherein, in an embodiment of the utility model, the stabilization photosensory assembly does not use the attaching substrate, but uses RDL
Technique or grinding technics process circuit plate, so that the wiring board is capable of providing the attaching face with high flatness.Change sentence
It talks about, the MEMS is affixed directly to the wiring board with high flatness, prevents from influencing institute because of the wiring board out-of-flatness
State the normal work of MEMS.
In order to realize above-mentioned at least a purpose or other objects and advantages, the utility model provides photosensitive group of a stabilization
Part, comprising:
One circuit board module, wherein the circuit board module, which provides at least one, attaches face；
An at least driver, wherein being accordingly attached at every attaching of the circuit board module per the driver
Face；And
An at least photosensitive element, wherein being arranged in correspondence with per the photosensitive element in every driver, and described
Driver is between the photosensitive element and the attaching face of the circuit board module, to pass through the mobile phase of the driver
The photosensitive element answered.
In some embodiments of the utility model, the circuit board module includes that a wiring board and one attach substrate,
Described in attaching substrate a lower surface be mounted on the wiring board, using it is described attach substrate a upper surface as described in
The attaching face of circuit board module.
In some embodiments of the utility model, the attaching substrate is a steel plate.
In some embodiments of the utility model, the attaching substrate is by being selected from ceramics, alloy, metal and macromolecule
One of material material is made.
In some embodiments of the utility model, the attaching substrate has an at least vacuum tank, wherein per described true
Empty slot extends to the lower surface for attaching substrate from the upper surface for attaching substrate, in the attaching substrate
Upper formation through-hole.
In some embodiments of the utility model, the attaching substrate has multiple vacuum tanks, wherein described more
A vacuum tank is uniformly distributed in the attaching substrate.
In some embodiments of the utility model, the wiring board has an accommodation space, wherein being mounted on described
The attaching substrate of wiring board is housed inside the accommodation space.
In some embodiments of the utility model, the accommodation space is a groove.
In some embodiments of the utility model, the accommodation space is a through-hole.
In some embodiments of the utility model, the wiring board has the accommodation space of a through-hole type, wherein described
It attaches substrate and is mounted on the bottom side of the wiring board, and be attached at the driver for attaching substrate and be housed inside
The accommodation space.
In some embodiments of the utility model, the circuit board module includes a route handled by grinding technics
Plate, wherein the wiring board includes a pasting area and one is located at fringe region around the pasting area, and by the line
The attaching face of the pasting area of road plate as the circuit board module.
In some embodiments of the utility model, the circuit board module includes one rerouting made of layer process
Wiring board, wherein the wiring board includes a pasting area and one is located at fringe region around the pasting area, and by institute
State the attaching face of the pasting area as the circuit board module of wiring board.
In some embodiments of the utility model, the circuit board module further includes a reinforcing element, wherein described add
Strong element is arranged at the bottom side of the wiring board, to reinforce the intensity of the wiring board.
In some embodiments of the utility model, the reinforcing element is a steel plate.
In some embodiments of the utility model, the flatness in the attaching face of the circuit board module 15um with
It is interior.
In some embodiments of the utility model, the photosensitive element is attached at described in a manner of particle glue sticking
Driver, and the driver is attached at the attaching face of the circuit board module in a manner of particle glue sticking.
In some embodiments of the utility model, the attaching substrate is mounted on described in a manner of particle glue sticking
Wiring board.
In some embodiments of the utility model, the driver is a MEMS.
In some embodiments of the utility model, the driver includes a movable part and an immovable portion, wherein institute
The immovable portion for stating driver is fixedly attached at the attaching face of the circuit board module, the photosensitive element quilt
Accordingly it is attached at the movable part of the driver.
In some embodiments of the utility model, the driver further includes at least one set of first connector, at least one
The second connector of group and at least one set of elastica, wherein the first connector described in every group is arranged at the described of the driver
Movable part, the second connector described in every group are arranged at the immovable portion of the driver, wherein the first company described in every group
It can conductively be connected between second connector described in fitting and every group by elastica described in every group, wherein the wiring board and institute
It states the second connector described in every group of driver conductively to connect, first described in every group of the photosensitive element and the driver
Connector conductively connects.
In some embodiments of the utility model, the stabilization photosensory assembly further includes an at least filter element,
In top surface per the photosensitive element is directly mounted on per the filter element.
Another aspect according to the present utility model, the utility model additionally provide a stabilization camera module, comprising:
An at least optical lens；With
Above-mentioned stabilization photosensory assembly, wherein being arranged in correspondence with per the optical lens in the every of the stabilization photosensory assembly
The photosensitive path of the photosensitive element, to be assembled into the stabilization camera module.
Another aspect according to the present utility model, the utility model additionally provide an electronic equipment, comprising:
One electronic equipment ontology；With
Above-mentioned stabilization camera module, wherein the stabilization camera module is assemblied in the electronic equipment ontology, with assembling
At the electronic equipment.
By the understanding to subsequent description and attached drawing, the further purpose of the utility model and advantage will be able to abundant body
It is existing.
The these and other objects of the utility model, feature and advantage, by following detailed descriptions, attached drawing and right are wanted
It acquires to fully demonstrate.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of a stabilization camera module of one first preferred embodiment according to the present utility model.
Fig. 2 is the section view signal of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model
Figure.
Fig. 3 is that a stabilization of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model is photosensitive
The perspective cross-sectional schematic diagram of component.
Fig. 4 be the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model manufacturing step it
One schematic diagram.
Fig. 5 be the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model manufacturing step it
Two schematic diagram.
Fig. 6 be the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model manufacturing step it
Three schematic diagram.
Fig. 7 be the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model manufacturing step it
Four schematic diagram.
Fig. 8 A shows the one of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model
One variant embodiment.
Fig. 8 B shows the one of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model
Two variant embodiments.
Fig. 8 C shows the one of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model
Three variant embodiments.
Fig. 8 D shows the one of the stabilization camera module of above-mentioned first preferred embodiment according to the present utility model
Four variant embodiments.
Fig. 9 is the schematic cross-sectional view of a stabilization camera module of one second preferred embodiment according to the present utility model.
Figure 10 shows a change of the stabilization camera module of above-mentioned second preferred embodiment according to the present utility model
Shape embodiment.
Figure 11 is the stabilization camera module with above-mentioned first or second preferred embodiment according to the present utility model
An electronic equipment schematic diagram.
Figure 12 is the manufacturing method of the stabilization photosensory assembly of above-mentioned first preferred embodiment according to the present utility model
Flow diagram.
Figure 13 is a stabilization sense of the stabilization camera module of above-mentioned second preferred embodiment according to the present utility model
The flow diagram of the manufacturing method of optical assembly.
Specific embodiment
It is described below for disclosing the utility model so that those skilled in the art can be realized the utility model.It retouches below
Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following
The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs
The other technologies scheme of case and the spirit and scope without departing from the utility model.
It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", "upper",
The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed
System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, without
It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore on
Stating term should not be understood as limiting the present invention.
In the present invention, term " one " is interpreted as " one or more " in claim and specification, i.e., one
A embodiment, the quantity of an element can be one, and in a further embodiment, the quantity of the element can be multiple.
Unless clearly illustrate in the exposure of the utility model the element quantity only one, otherwise term " one " can not be interpreted as
Unique or single, term " one " should not be understood as the limitation to quantity.
It is used for description purposes only in the description of the present invention, it should be understood that belonging to " first ", " second " etc.,
And it should not be understood as indicating or implying relative importance.In the description of the utility model, it should be noted that unless otherwise bright
True regulation and restriction, belongs to " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, is also possible to removable
It unloads connection or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be and be directly connected to, be also possible to lead to
Medium is crossed to link indirectly.For the ordinary skill in the art, above-mentioned term can be understood at this as the case may be
Concrete meaning in utility model.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
With the development of science and technology, people to the miniaturization of electronic equipment, intelligent terminal and high performance requirements also therewith
It improves.And camera module is as one of electronic product, the standard configuration of smart machine, the requirement of size and performance is also increasingly tight
It is severe, more harsh requirement is especially proposed to the stabilization function of camera module.Traditional anti-vibration motor is not only because can not be right
The offset of camera module in x and y direction and the rotation in X/Y plane preferably corrected and cause anti-shudder performance compared with
Difference, and because structure is complicated, at high cost, yield is low, power consumption is big, volume is big for its own, it is not able to satisfy camera module day gradually yet
The harsh requirement of benefit.
However, preventing with the appearance of MEMS (Micro-Electro-Mechanic System, abbreviation MEMS)
The realization for trembling function has technical strategies again, i.e., MEMS is being attached directly to wiring board and then is pasting sensitive chip
It is attached on MEMS, to move sensitive chip by MEMS, for compensating the offset that sensitive chip occurs by shake, Jin Ershi
The stabilization function of existing camera module.But due to the flatness of wiring board be difficult to control, and attach flatness required by MEMS and
Precision is very high, so that contradiction between the two is difficult to reconcile, therefore would generally be not up to standard because of the precision needed for attaching and flatness
And the problem for causing yield lower, seriously affect the volume production and economic benefit of camera module.
With reference to Fig. 1 to Fig. 7 of the Figure of description of the utility model, to solve the above-mentioned problems, the one of the utility model
First preferred embodiment provides a stabilization camera module 1, wherein the stabilization camera module 1 includes an at least optical lens 10
With a stabilization photosensory assembly 20, wherein the stabilization photosensory assembly 20 further comprise a circuit board module 21, at least one driving
Device 22 and at least a photosensitive element 23, wherein the circuit board module 21 provides an at least smooth attaching face 210, wherein often
The driver 22 is attached at every attaching face 210 of the circuit board module 21 respectively, wherein each photosensitive member
Part 23 is arranged in correspondence with respectively in the driver 22, and the driver 22 is located at the photosensitive element 23 and the line
Between the attaching face 210 of road board group part 21, to pass through the mobile corresponding photosensitive element 23 of each driver 22,
Wherein each optical lens 10 is arranged in correspondence with respectively in the photosensitive path of the photosensitive element 23, described anti-to be formed
Tremble camera module 1.
Preferably, the driver 22 is implemented as a MEMS (i.e. MEMS, also known as micro machine), by described
MEMS moves the photosensitive element 23, is deviated because of caused by shake for compensating the photosensitive element 23 or rotation, thus
Realize the stabilization function of the stabilization camera module 1.It should be appreciated that the normal work in order to guarantee the driver 22, described
The flatness per the attaching face 210 of circuit board module 21 is preferably controlled within 15um.
It is noted that although only being wrapped in attached drawing 1 to Fig. 7 and following description with the stabilization camera module 1
For including the optical lens 10 and a driver 22, the stabilization camera module 1 of the utility model is illustrated
Feature and advantage, it will be appreciated by those skilled in the art that, disclosed in attached drawing 1 to Fig. 7 and following description
The stabilization camera module 1 is only for example, and does not constitute the limitation to the content and range of the utility model, for example, in institute
It states in other examples of stabilization camera module 1, the quantity of the optical lens 10 can also be more than one, to form the anti-of array
Tremble camera module.
Specifically, as shown in Fig. 2, the circuit board module 21 includes that a wiring board 211 and one is arranged at the route
The attaching substrate 212 of plate 211, wherein the attaching substrate 212 is made of the material with some strength and flatness, to pass through
The substrate 212 that attaches provides the attaching face 210 with high flatness, so that the driver 22 is affixed directly to institute
It states and attaches substrate 212, to prevent influencing the normal work of the driver 22 because of wiring board out-of-flatness.
Preferably, as shown in Figures 2 and 3, the attaching substrate 212 has slab construction, and the attaching substrate 212
With a smooth upper surface 2121 and a lower surface 2122 parallel with the upper surface 2121, wherein when the attaching substrate
When 212 lower surface 2122 is mounted on the wiring board 211, the upper surface 2121 for attaching substrate 212 is made
For the attaching face 210 of the circuit board module 21.It should be appreciated that in some other embodiments of the utility model, institute
Stating and attaching the upper surface 2121 of substrate 212 is a smooth plane, and the lower surface 2122 for attaching substrate 212
For the curved surface of an out-of-flatness；Or multiple supporting legs can also be arranged in the lower surface 2122 for attaching substrate 212, to pass through
The attaching substrate 212 is fixably attached to the wiring board 211 by the supporting leg.
It is highly preferred that the attaching substrate 212 is fixedly arranged at the wiring board 211 in such a way that glue is bonded
Top side.It should be appreciated that the glue can be, but not limited to be implemented as a particle glue, due to maximum gauge in the particle glue
Uniform particle distribution, therefore its thickness is consistent after capable of ensuring the particle adhesive curing.Certainly, the one of the utility model
In a little other embodiments, the glue can also be heat-curable glue perhaps other kinds of glue or the attaching substrate 212
The wiring board 211 can also be fixedly arranged in a manner of inlaying, weld etc..
It is noted that the attaching substrate 212 is made of steel, so that the attaching substrate 212 is implemented as one
With higher-strength and the steel plate of flatness 212, wherein the lower surface 2122 and the wiring board when the steel plate 212
211 when being mounted on together, and the upper surface 2121 of the steel plate 212 is by as the attaching face 210, to be the drive
Dynamic device 22 provides the attaching face 210 of high flatness.In other words, the steel plate 212 is after special processing and processing, institute
The upper surface 2121 for stating steel plate 212 can have very high flatness using the attaching as the circuit board module 21
Face 210, and the steel plate 212 has very high intensity and is unlikely to deform, and enables the steel plate 212 for a long time and stablizes
Ground provides the attaching face 210 of high flatness, to prevent influencing the patch because of factors such as external force, temperature change, long-time services
The flatness in attached face 210.Further, since steel have biggish thermal coefficient, so that the steel plate 212 is with good thermally conductive
And heat-sinking capability, therefore the steel plate 212 also contributes to the heat dissipation performance of the stabilization camera module 1.
It should be appreciated that the attaching substrate 212 can also be by such as high in some other embodiments of the utility model
There is the material of some strength and flatness to be made for molecular material, alloy, metal, ceramics etc., to pass through the attaching substrate
212 provide the attaching face 210 of stable and high flatness, to avoid the wiring board 211 to the driver 22
It influences.
In first preferred embodiment of the utility model, as shown in Fig. 2, the wiring board 211 includes an attachment
Region 2111, a fringe region 2112 and at least one set of wiring board connector 2113, wherein the pasting area 2111 and institute
It is integrally formed to state fringe region 2112, and the fringe region 2112 is located at around the pasting area 2111, also
It is to say, the pasting area 2111 is located at the middle part of the wiring board 211, and the fringe region 2112 is located at the wiring board
211 outside.Wiring board connector 2113 described in every group is arranged at the fringe region of the wiring board 211 respectively
2112。
The pasting area 2111 for attaching substrate 212 and being mounted on the wiring board 211, and the attaching base
The attaching face 210 of plate 212 corresponds to the pasting area 2111 of the wiring board 211, so as to be attached at the patch
The driver 22 in attached face 210 is corresponding with the pasting area 2111 of the wiring board 211, so that route described in every group
Plate connector 2113 is respectively positioned on around the driver 22, to help conductively to connect the driver 22 and the line
Road plate 211.
Illustratively, as shown in Figures 2 and 3, the driver 22 generally includes a movable part 221 and an immovable portion
222, wherein the immovable portion 222 of the driver 22 is fixedly attached at the attaching for attaching substrate 212
Face 210, the photosensitive element 23 are accordingly attached at the movable part 221 of the driver 22, to pass through the driving
The movable part 221 of device 22 moves the photosensitive element 23 to realize the stabilization function of the stabilization camera module 1.It should manage
Solution, when establishing plane coordinate system XY with the attaching face 210, is attached at the driver 22 in the attaching face 210
The movable part 221 can move in X-direction and Y direction, and rotate in X/Y plane, to pass through the driving
Device 22 realizes the stabilization function for moving in X-direction and Y direction and rotating in X/Y plane.
Specifically, as shown in figure 3, the driver 22 further includes at least one set of first connector 223, at least one set second
Connector 224 and at least one set of elastica 225, wherein the first connector 223 described in every group is arranged at the driver 22
The movable part 221, the second connector 224 described in every group is arranged at the immovable portion 221 of the driver 22,
In can be connected by elastica 225 described in every group between the second connector 224 described in the first connector 223 described in every group and every group
Ground connection.It should be appreciated that the elastica 225 of the driver 22 can have leading for certain elasticity by such as aluminum steel etc.
Electric material is made, and avoids the immovable portion 222 of the driver 22 right with the elastic deformation using the elastica 225
The movement of the movable part 221 of the driver 22 has an impact.
It is worth noting that, first and second connector 223,224 of the driver 22 can be connection respectively
First and second connector 223,224 of disk, i.e., the described driver 22 can be disc-shaped respectively, for making the elasticity
The both ends of line 225 can be conductively connected to first and second connector 223,224 of the driver 22 respectively.It should
Understand, in the other embodiments of the utility model, first and second connector 223,224 of the driver 22 can also
With respectively be in spherical or other shapes, the utility model to this with no restriction.
In addition, as shown in figure 3, the second connector 224 described in every group of the driver 22 is by one group of lead with routing
Mode can conductively be connect with the wiring board connector 2113 of the wiring board 211；Correspondingly, the driver 22
First connector 223 described in every group also can another group of lead in a manner of routing with the photosensitive element 23 can be conductively
Connection, will pass through first connector 223, second connector 224 and the elastica of the driver 22
225 can conductively connect the photosensitive element 23 with the wiring board 211.It should be appreciated that the utility model is to the lead
Type do not do further limitation, such as the lead may be implemented as gold thread, silver wire, copper wire etc., need to only guarantee described
Lead can conductively connect the wiring board 211 and the driver 22, or conductively connect the driver 22 and institute
State photosensitive element 23.
First preferred embodiment according to the present utility model, as shown in Figures 2 and 3, the stabilization photosensory assembly 20
Further include one first supporting member 24, wherein first supporting member 24 be arranged at it is described attach substrate 212 it is described on
Between surface 2121 and the immovable portion 222 of the driver 22, with by first supporting member 24 by the drive
Dynamic device 22 is securely attached at the upper surface 2121 for attaching substrate 212.Since first supporting member 24 has
Certain thickness, therefore the stabilization photosensory assembly 20 can also be by first supporting member 24 in the attaching substrate
One first safety clearance 25 is formed between 212 upper surface 2121 and the movable part 221 of the driver 22, to prevent
The substrate 212 that attaches influences the normal work of the driver 22, and then the product for improving the stabilization camera module 1 is good
Rate.
Preferably, first supporting member 24 is formed by one first glue curing, can not only utilize first glue
The viscosity of water securely bonds together the driver 22 and the attaching substrate 212, additionally it is possible to utilize first glue
Water forms first supporting member 24 with some strength after hardening, so that the driver 22 and the attaching substrate
First safety clearance 25 between 212 is able to maintain stabilization, influences the driver 22 to prevent the attaching substrate 212
It works normally.
It is noted that the first glue for being used to form first supporting member 24 can be particle glue, heat cure
Glue or other kinds of glue.
Correspondingly, in first preferred embodiment of the utility model, as shown in Figures 2 and 3, the stabilization is photosensitive
Component 20 further includes one second supporting member 26, wherein second supporting member 26 is arranged at the photosensitive element 23
Between one bottom surface 232 and the movable part 221 of the driver 22, with by second supporting member 26 by the sense
Optical element 23 is securely attached at the movable part 221 of the driver 22.Since second supporting member 26 has one
Fixed thickness, therefore the stabilization photosensory assembly 20 is also by second supporting member 26 described in the photosensitive element 23
One second safety clearance 27 is formed between bottom surface 232 and the movable part 221 of the driver 22, to prevent the photosensitive member
Part 23 influences the normal work of the driver 22, and then improves the product yield of the stabilization camera module 1.
It should be appreciated that when the photosensitive element 23 the bottom surface 232 be attached at the described of driver 22 can
When dynamic portion 221, a top surface 231 of the photosensitive element 23 is towards the optical lens 10, that is to say, that the photosensitive element
23 top surface 231 is implemented as the photosurface of the photosensitive element 23.
Preferably, second supporting member 26 is formed by one second glue curing, can not only utilize second glue
The viscosity of water securely bonds together the photosensitive element 23 and the driver 22, additionally it is possible to utilize second glue
Second supporting member 26 with some strength is formed after hardening, so that the driver 22 and the photosensitive element 23
Between second safety clearance 27 be able to maintain stabilization, influence the normal of the driver 22 to prevent the photosensitive element 23
Work.
It is noted that the second glue for being used to form second supporting member 26 can be particle glue, heat cure
Glue or other kinds of glue.
With reference to shown in attached drawing 1 and Fig. 2, the stabilization camera module 1 further includes a pedestal 30, wherein the pedestal 30 is set
It is placed in the fringe region 2112 of the wiring board 211 of the circuit board module 21 of the stabilization photosensory assembly 20, institute
The top surface that optical lens 10 is installed in the pedestal 30 is stated, so as to be maintained at the stabilization photosensitive for the optical lens 10
The photosensitive path of the photosensitive element 23 of component 20.
In addition, in first preferred embodiment of the utility model, as shown in Fig. 2, the stabilization photosensory assembly 20
It further comprise a filter element 28, wherein the filter element 28 is assembled in the pedestal 30, so that the filter element
28 are maintained at the photosensitive path of the photosensitive element 23, wherein the filter element 28 is located at the optical lens 10 and described
Between photosensitive element 23, so as to pass through institute from the light that the optical lens 10 enters the inside of the stabilization camera module 1
After the filtering for stating filter element 28, photoelectric conversion can be received and carried out by the photosurface of the photosensitive element 23, from
And improve the image quality of the stabilization camera module 1, such as the filter element 28 can be filtered from the optical lens 10
Infrared part into the light of the inside of the stabilization camera module 1.It should be appreciated that in the stabilization camera module 1
Different examples in, the filter element 28 can be implemented as different types, such as the filter element 28 can be by reality
It applies as cutoff filter, full impregnated spectral filter and other optical filter or the combination of multiple optical filters etc.,
In the utility model with no restriction to this.
With reference to attached drawing 4 to the manufacturing process and institute for shown in Fig. 7, being the stabilization photosensory assembly 20 according to the present utility model
The schematic diagram of the manufacturing process of stabilization camera module 1 is stated, it will be understood by those of skill in the art that showing in attached drawing 4 into Fig. 7
The manufacturing process of the stabilization photosensory assembly 20 and the manufacturing process of the stabilization camera module 1 merely illustrative illustrate this reality
With novel feature and advantage, the limitation to the content and range of the utility model is not constituted.
Specifically, attached drawing 4, which is shown, is attached at the instantiation procedure for attaching substrate 212 for the driver 22,
Middle elder generation applies the first glue in the upper surface 2121 for attaching substrate 212, then the driver 22 is arranged in correspondence with
In the upper surface 2121 for attaching substrate 212, wherein being applied over the upper surface 2121 for attaching substrate 212
First glue correspond to the driver 22 the immovable portion 222, to be formed after first glue curing
Described between the upper surface 2121 for attaching substrate 212 and the immovable portion 222 of the driver 22
First supporting member 24, and in the described movable of the upper surface 2121 for attaching substrate 212 and the driver 22
First safety clearance 25 is formed between portion 221, and the normal work of the driver 22 is influenced to prevent the attaching substrate 212
Make.
It is worth noting that, in some other embodiments of the utility model, it can also be first in the driver 22
The immovable portion 222 applies the first glue, then the driver 22 is arranged in correspondence with described in the attaching substrate 212
Upper surface 2121 is located at the upper surface 2121 for attaching substrate 212 and institute to be formed after first glue curing
First supporting member 24 between the immovable portion 222 of driver 22 is stated, and in the institute for attaching substrate 212
It states and forms first safety clearance 25 between upper surface 2121 and the movable part 221 of the driver 22.
It is noted that because first glue has certain mobility before curing, so that the driving
Device 22 is easy to happen offset or inclination on the upper surface 2121 for attaching substrate 212, causes between first safety
Gap 25 is unstable, so needing to apply external force stably keeping the driver 22 in the attaching substrate 212.
Therefore, in first preferred embodiment of the utility model, as shown in figure 4, the attaching substrate 212 is also set
There is an at least vacuum tank 2123, wherein extending per the vacuum tank 2123 from the upper surface 2121 for attaching substrate 212
The extremely described lower surface 2122 for attaching substrate 212, to form about one perforative through-hole on the attaching substrate 212,
Convenient for passing through the vacuum tank during attaching the driver 22 to the attaching face 210 for attaching substrate 212
2123 inhale vacuum from the lower surface 2122 for attaching substrate 212, in the attaching substrate 212 and the driver 22
Between form a vacuum area, to the driver 22 and the attaching substrate 212 are held securely together, to prevent institute
It states driver 22 to shift or fall off, to guarantee the flatness of the driver 22.It should be appreciated that in the present invention,
Since the vacuum tank being opened on wiring board originally is arranged at the attaching substrate 212, this avoids later period encapsulation
The process for filling vacuum tank on wiring board again in the process, while avoiding and dirty mould group being polluted by wiring board vacuum tank
Risk.
Illustratively, as shown in figure 4, the attaching substrate 212 is set there are five the vacuum tank 2123, described in one of them
Vacuum tank 2123 is located at the center for attaching substrate 212, remaining four vacuum tanks 2123 are evenly distributed in described
Attach substrate 212 circumferential edges, so as to by the vacuum tank 2123 vacuumize when, to each position of the driver 22
Apply uniform suction, to guarantee the driver 22 flatness with higher.It should be appreciated that in some of the utility model
In other embodiments, the vacuum tank 2123 for attaching substrate 212 and being also provided with other quantity, and the vacuum tank
2123 can also be according to any arrangement mode of the arrangement of such as matrix, annular arrangement, random arrangement etc. in the attaching substrate 212
On be arranged, the utility model is not further limited this.
Attached drawing 5 shows the instantiation procedure that the photosensitive element 23 is attached to the driver 22, wherein first described
A part of the movable part 221 of driver 22 applies the second glue, then the photosensitive element 23 is arranged in correspondence in institute
The movable part 221 of driver 22 is stated, is located at described in the photosensitive element 23 with being formed after second glue curing
Second supporting member 26 between a part of the movable part 221 of bottom surface 232 and the driver 22, and
It is formed between another part of the movable part 221 of the bottom surface 232 and driver 22 of the photosensitive element 23
Second safety clearance 27 influences the normal work of the driver 22 to prevent the photosensitive element 23.
It certainly, can also be first at the bottom of the photosensitive element 23 in some other embodiments of the utility model
Surface 232 applies the second glue, then the photosensitive element 23 is arranged in correspondence in the movable part of the driver 22
221, to form the bottom surface 232 and the driver 22 that are located at the photosensitive element 23 after second glue curing
The movable part 221 a part between second supporting member 26, and at the bottom of the photosensitive element 23
Second safety clearance 27 is formed between another part of the movable part 221 of surface 232 and the driver 22, to prevent
The photosensitive element 23 influences the normal work of the driver 22.
In figure 6, the attaching substrate 212 is first mounted on the wiring board 211, then is connected by way of routing
Ground connects the wiring board connector 2113 of the wiring board 211 and second connector 224 of the driver 22, and
And first connector 223 and the photosensitive element 23 of the driver 22 are conductively connected by way of routing, with
The photosensitive element 23 and the wiring board 211 are conductively connected by the elastica 225 of the driver 22, to be made
The stabilization photosensory assembly 20.In other words, after the attaching substrate 212 is mounted on the wiring board 211, lead to respectively
The mode for crossing routing conductively connects the driver 22 and the wiring board 211 and the driver 22 and the photosensitive member
Part 23.
It, can also be by the attaching substrate 212 it is worth noting that, in some other embodiments of the utility model
It is mounted on before the wiring board 211, the mode for first passing through routing conductively connects first connection of the driver 22
Part 223 and the photosensitive element 23；Then, the attaching substrate 212 is being mounted on the wiring board 211 and then is being passed through
The mode of routing conductively connects the driver 22 and the wiring board 211.Certainly, in other implementations of the utility model
It, can also be direct by flexible lead after the attaching substrate 212 is mounted on the wiring board 211 in example
Conductively connect the photosensitive element 23 and the wiring board 211.
It is noted that photosensitive although manufacturing the stabilization in attached drawing 4 to attached drawing 6 and first preferred embodiment
The step order of component 20 is: the driver 22 being first attached at the attaching substrate 212, then the photosensitive element 23 is pasted
The driver 22 is invested, the attaching substrate 212 is finally mounted on the wiring board 211, and conductively connect the sense
Optical element 23 and the driver 22 and conductively connect the driver 22 and the wiring board 211.But this field
Technical staff is it is understood that attached drawing 4 manufactures the stabilization photosensory assembly 20 into attached drawing 6 and first preferred embodiment
Step order it is merely illustrative, to illustrate the feature and advantage of the stabilization photosensory assembly 20 of the utility model, not structure
The limitation of the content and range of pairs of the utility model, for example, in other examples for manufacturing the stabilization photosensory assembly 20,
The attaching substrate 212 first can be mounted on the wiring board 211, then the driver 22 is attached at the attaching substrate
212, the photosensitive element 23 is finally attached at the driver 22, the stabilization photosensory assembly 20 is made；Or may be used also
The photosensitive element 23 is first attached at the driver 22, then the driver 22 is attached at the attaching substrate 212,
The attaching substrate 212 is finally mounted on the wiring board 211, the stabilization photosensory assembly 20 is made.
In fig. 7, the pedestal 30 is assembled in the fringe region 2112 of the wiring board 211, and respectively will
The filter element 28 and the optical lens 10 are assembled in the pedestal 30, so that the filter element 28 and the optical frames
First 10 are held in the photosensitive path of the photosensitive element 23, so that the stabilization camera module 1 be made.It should be appreciated that described
Pedestal 30 can be, but not limited to be made into such as injection molding, die cast, molding etc. manufacturing process.
It is worth noting that, being mounted in some other embodiments of the utility model by the attaching substrate 212
Before the pasting area 2111 of the wiring board 211, the pedestal 30 can be made by moulding technology, to form packet
Cover the molded base (not shown) of the fringe region 2112 of the wiring board 211；Then, by the attaching substrate
212 are mounted on after the pasting area 2111 of the wiring board 211, respectively by the filter element 28 and the optical frames
First 10 are assembled in the pedestal 30.That is, the pedestal 30 can be assembled to before attaching the attaching substrate 212
The wiring board 211 can also be assembled to the wiring board 211, the utility model after attaching the attaching substrate 212
This is not further limited.
Attached drawing 8A shows first variant embodiment of the stabilization camera module 1, wherein the stabilization images mould
The filter element 28 of the stabilization photosensory assembly 20 of group 1 is directly mounted on the top surface of the photosensitive element 23
231, to reduce the distance between the filter element 28 and described photosensitive element 23, and then reduce the height of the pedestal 30,
To reduce the whole height of the stabilization camera module 1.
Attached drawing 8B shows second variant embodiment of the stabilization camera module 1, wherein the stabilization images mould
The wiring board 211 of the circuit board module 21 of the stabilization photosensory assembly 20 of group 1 has an at least accommodation space
2114, wherein the pasting area 2111 of the wiring board 211 is formed in every accommodation space of the wiring board 211
2114, wherein the attaching substrate 212 for being mounted on the pasting area 2111 is housed inside the described of the wiring board 211
Accommodation space 2114, to reduce the height of the stabilization photosensory assembly 20, to avoid the stabilization camera module 1 because adding
It states and attaches substrate 212 and its height is caused to become larger, to meet electronic equipment, intellectual product to the small form factor requirements of camera module.
It is worth noting that, in this example of the stabilization camera module 1 shown in attached drawing 8B, the accommodation space
2114 can be a groove, and in the third variant embodiment of the stabilization camera module 1 shown in attached drawing 8C, institute
It states accommodation space 2114 and is also possible to a through-hole, that is to say, that the type of the accommodation space 2114 can be unrestricted,
The attaching substrate 212 can be accommodated.
It is noted that the size of the accommodation space 2114 can be greater than the outer peripheral of the attaching substrate 212
Size can also be equal to the outer peripheral size for attaching substrate 212, and the utility model in this respect can be unrestricted
System.
Attached drawing 8D shows the 4th variant embodiment of the stabilization camera module 1, wherein the accommodation space
2114 are implemented as a through-hole, and the attaching substrate 212 is mounted on the bottom side of the wiring board 211, and is attached at institute
The driver 22 for stating the upper surface 2121 of attaching substrate 212 is housed inside the receiving sky of the wiring board 211
Between 2114.It should be appreciated that in this example of the stabilization camera module 1 shown in attached drawing 8D, the accommodation space 2114
Size be less than the outer peripheral size for attaching substrate 212, and the outer peripheral size of the driver 22 is then not more than
The size of the accommodation space 2114.
With reference to Fig. 9 of attached drawing, a stabilization camera module 1A of the second preferred embodiment according to the present utility model is elucidated with.
Compared to above-mentioned first preferred embodiment according to the present utility model, second preferred embodiment according to the present utility model
The stabilization camera module 1A the difference is that: a line of a stabilization photosensory assembly 20A of the stabilization camera module 1A
Road board group part 21A includes a wiring board 211A, without including the attaching substrate 212, wherein the wiring board 211A has one
Smooth pasting area 2111A and the fringe region 2112, to pass through the pasting area 2111A of the wiring board 211A
There is provided the smooth attaching face 210, that is to say, that the driver 22 is directly attached at the institute of the wiring board 211A
Pasting area 2111A is stated, rather than the driver 22 is attached at the route by the attaching substrate 212 indirectly
Plate 211A, to further decrease the height of the stabilization photosensory assembly 20A, to reduce the entirety of the stabilization camera module 1A
Highly.
Preferably, the wiring board 211A is handled by grinding technics, to provide the attaching 210 of high flatness.It lifts
Example ground, the wiring board 211A are implemented as a ceramic substrate handled by grinding technics, so that the wiring board 211A
The pasting area 2111A can flatness with higher, to meet the driver 22 to the plane in the attaching face 210
The rigors of degree are effectively prevented from the wiring board 211A and have an impact to the normal work of the driver 22.It should manage
Solution, the ceramic substrate 211A can form the patch with high flatness by grinding technics on the wiring board 211A
Region 2111A is filled, so that the pasting area 2111A of the wiring board 211A is as described in the circuit board module 21A
Attaching face 210.In addition, the ceramic substrate 211A can also prevent from influencing the patch due to wiring board 211A deforms
The flatness in attached face 210 influences the normal work of the driver 22 to prevent the attaching face 210.
Attached drawing 10 shows the stabilization camera module 1A's of second preferred embodiment according to the present utility model
One variant embodiment, wherein the wiring board 211A is made by rerouting layer process, to provide the patch of high flatness
Attached face 210.In other words, the wiring board 211A is implemented as a rewiring sandwich circuit board (i.e. RDL wiring board), so that described
The pasting area 2111A of wiring board 211A can flatness with higher, to meet the driver 22 to the patch
The rigors of the flatness in attached face 210 are effectively prevented from the wiring board 211A and produce to the normal work of the driver 22
It is raw to influence.
Further, as shown in Figure 10, the circuit board module 21A further includes a reinforcing element 213A, wherein described add
The bottom side that strong element 213 is arranged at the wiring board 211A prevents the route to reinforce the intensity of the wiring board 211A
Plate 211A deforms, so that the wiring board 211A is avoided to destroy the flatness in the attaching face 210 because deforming, with
Ensure the normal work of the driver 22.
Preferably, the reinforcing element 213 is implemented as a steel plate, wherein the steel plate is mounted on the wiring board
The bottom side of 211A, while reinforcing the wiring board 211A, additionally it is possible to increase the heat dissipation of the wiring board 211A, with
Enhance the heat dissipation performance of the stabilization camera module 1A.
It is worth noting that, in second preferred embodiment of the utility model, other than above structure is different,
The other structures of the stabilization camera module 1A and the stabilization of first preferred embodiment according to the present utility model are taken the photograph
As the structure of mould group 1 is identical, and the stabilization camera module 1A also has the stabilization with first preferred embodiment
The similar or identical variant embodiment of the various modifications embodiment of camera module 1, details are not described herein.
With reference to attached drawing 11, according to the other side of the utility model, the utility model further provides for an electronic equipment,
Described in electronic equipment include an electronic equipment ontology 500 and at least a stabilization camera module 1,1A, wherein each stabilization
Camera module 1,1A are arranged at the electronic equipment ontology 500 respectively, for obtaining image.It is noted that described
The type of electronic equipment ontology 500 is unrestricted, for example, the electronic equipment ontology 500 can be smart phone, tablet computer,
Any electronics that can be configured the stabilization camera module such as laptop, e-book, personal digital assistant, camera is set
It is standby.It will be appreciated by those skilled in the art that although being implemented as intelligence in attached drawing 11 with the electronic equipment ontology 500
For mobile phone, but it does not constitute the limitation to the content and range of the utility model.
Another aspect according to the present utility model, the utility model further provide the manufacture stabilization photosensory assembly 20
Method.Specifically, as shown in figure 12, the stabilization photosensory assembly 20 manufacturing method comprising steps of
S1: the upper surface 2121 that a driver 22 attaches substrate 212 in one is accordingly attached；
S2: a photosensitive element 23 is accordingly attached in the driver 22；
S3: the attaching substrate 212 is mounted on a wiring board 211；And
S4: the driver 22 and the photosensitive element 23 are conductively connect with the wiring board 211 respectively, to be made
The stabilization photosensory assembly 20.
Specifically, the step S4 comprising steps of
S41: at least one set of the of the photosensitive element 23 and the driver 22 is conductively connected by way of routing
A connection piece 223；With
S42: the second connector of at least one set 224 of the driver 22 and described is conductively connected by way of routing
At least one set of wiring board connector 2113 of wiring board 211, wherein the first connector 223 described in every group connects with described in every group second
Fitting 224 is conductively connected by one group of elastica 225.
It is worth noting that, in the manufacturing method of the stabilization photosensory assembly 20, the step S1, the step S2 with
And the order of the step S3 is merely illustrative, in some other embodiments of the utility model, also can be executed sequentially described
Step S2, the described step S1, the step S3；Or it can also successively execute the step S3, the step S1, the step
S2；The utility model does not do further limitation to the order of the step S1, the step S2 and the step S3.
Another aspect according to the present utility model, the utility model further provide the manufacture stabilization photosensory assembly
The method of 20A.Specifically, as shown in figure 13, the stabilization photosensory assembly 20A manufacturing method comprising steps of
S1 ': a driver 22 is accordingly attached in a pasting area 2111A of a wiring board 211A, wherein the route
Plate 211A is made by rerouting layer process；
S2 ': a photosensitive element 23 is accordingly attached in the driver 22；And
The driver 22 and the photosensitive element 23: conductively connecting by S3 ' with the wiring board 211A respectively, with system
At the stabilization photosensory assembly 20A.
Further, the manufacturing method of the stabilization photosensory assembly 20A further comprises the steps of:
S4 ': one reinforcing element 213A is in the bottom side of the wiring board 211A for setting, to increase the strong of the wiring board 211A
Degree.
It is worth noting that, as shown in figure 13, in the manufacturing method of the stabilization photosensory assembly 20A, the step S1 '
With the step S2 ' respectively in the manufacturing method of the stabilization photosensory assembly 20 the step S1 and the step S2 class
Seemingly, first glue is respectively adopted and second glue is bonded to complete corresponding attaching step.
Another aspect according to the present utility model, the utility model further provide the system of a stabilization camera module 1,1A
Method is made, comprising steps of
The stabilization photosensory assembly 20,20A are manufactured according to the manufacturing method of stabilization photosensory assembly 20 described above, 20A；With
Be arranged in correspondence with an optical lens 10 in the stabilization photosensory assembly 20,20A the photosensitive element 23 it is photosensitive
Path, the stabilization camera module 1,1A is made.
It should be understood by those skilled in the art that foregoing description and the embodiments of the present invention shown in the drawings are only used as
It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The function of the utility model
Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiments of the present invention
Can there are any deformation or modification.
Claims (23)
1. a stabilization photosensory assembly characterized by comprising
One circuit board module, wherein the circuit board module, which provides at least one, attaches face；
An at least driver, wherein being accordingly attached at every attaching face of the circuit board module per the driver；
And
An at least photosensitive element, wherein being arranged in correspondence with per the photosensitive element in every driver, and the driving
Device is between the photosensitive element and the attaching face of the circuit board module, with mobile corresponding by the driver
The photosensitive element.
2. stabilization photosensory assembly as described in claim 1, wherein the circuit board module includes that a wiring board and one attach base
Plate makees the upper surface for attaching substrate wherein described a lower surface for attaching substrate is mounted on the wiring board
For the attaching face of the circuit board module.
3. stabilization photosensory assembly as claimed in claim 2, wherein the attaching substrate is a steel plate.
4. stabilization photosensory assembly as claimed in claim 2, wherein the attaching substrate by selected from ceramics, alloy, metal and
One of high molecular material material is made.
5. stabilization photosensory assembly as claimed in claim 2, wherein the attaching substrate has an at least vacuum tank, wherein often
The vacuum tank extends to the lower surface for attaching substrate from the upper surface for attaching substrate, in the patch
Through-hole is formed on attached substrate.
6. stabilization photosensory assembly as claimed in claim 5, wherein the attaching substrate has multiple vacuum tanks, wherein
The multiple vacuum tank is uniformly distributed in the attaching substrate.
7. stabilization photosensory assembly as claimed in claim 2, wherein the wiring board has an accommodation space, wherein by mounting
The accommodation space is housed inside in the attaching substrate of the wiring board.
8. stabilization photosensory assembly as claimed in claim 7, wherein the accommodation space is a groove.
9. stabilization photosensory assembly as claimed in claim 7, wherein the accommodation space is a through-hole.
10. stabilization photosensory assembly as claimed in claim 2, wherein the wiring board has the accommodation space of a through-hole type,
Described in attaching substrate be mounted on the bottom side of the wiring board, and be attached at it is described attach substrate the driver quilt
It is contained in the accommodation space.
11. stabilization photosensory assembly as described in claim 1, wherein the circuit board module includes one by grinding technics
The wiring board of reason, wherein the wiring board include a pasting area and one be located at the pasting area around fringe region, and
Using the pasting area of the wiring board as the attaching face of the circuit board module.
12. stabilization photosensory assembly as described in claim 1, wherein the circuit board module includes one by rerouting layer work
Wiring board made of skill, wherein the wiring board includes a pasting area and a marginal zone around the pasting area
Domain, and using the pasting area of the wiring board as the attaching face of the circuit board module.
13. stabilization photosensory assembly as claimed in claim 11, wherein the circuit board module further includes a reinforcing element,
Described in reinforcing element be arranged at the bottom side of the wiring board, to reinforce the intensity of the wiring board.
14. stabilization photosensory assembly as claimed in claim 13, wherein the reinforcing element is a steel plate.
15. the stabilization photosensory assembly as described in any in claim 1 to 14, wherein the attaching of the circuit board module
The flatness in face is within 15um.
16. the stabilization photosensory assembly as described in any in claim 1 to 14, wherein the photosensitive element is with particle glue sticking
Mode be attached at the driver, and the driver is attached at the route board group in a manner of particle glue sticking
The attaching face of part.
17. the stabilization photosensory assembly as described in any in claim 2 to 10, wherein the attaching substrate is with particle glue sticking
Mode be mounted on the wiring board.
18. the stabilization photosensory assembly as described in any in claim 2 to 14, wherein the driver is a MEMS.
19. stabilization photosensory assembly as claimed in claim 18, wherein the driver includes that a movable part and one are immovable
Portion, wherein the immovable portion of the driver is fixedly attached at the attaching face of the circuit board module, it is described
Photosensitive element is accordingly attached at the movable part of the driver.
20. stabilization photosensory assembly as claimed in claim 19, wherein the driver further includes that at least one set first connects
Part, at least one set of second connector and at least one set of elastica, wherein the first connector described in every group is arranged at the drive
The movable part of dynamic device, the second connector described in every group is arranged at the immovable portion of the driver, wherein every group
It can conductively be connected between second connector described in first connector and every group by elastica described in every group, wherein described
Wiring board is conductively connect with the second connector described in every group of the driver, and the photosensitive element is every with the driver
Group first connector conductively connects.
21. the stabilization photosensory assembly as described in any in claim 1 to 14 further includes an at least filter element, wherein every institute
State the top surface that filter element is directly mounted on every photosensitive element.
22. a stabilization camera module characterized by comprising
An at least optical lens；With
Stabilization photosensory assembly as described in any in claim 1 to 21, wherein per the optical lens be arranged in correspondence in
The photosensitive path per the photosensitive element of the stabilization photosensory assembly, to be assembled into the stabilization camera module.
23. an electronic equipment characterized by comprising
One electronic equipment ontology；With
Stabilization camera module as claimed in claim 22, wherein the stabilization camera module is assemblied in the electronic equipment sheet
Body, to be assembled into the electronic equipment.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821320091.7U CN208572247U (en) | 2018-08-15 | 2018-08-15 | Stabilization camera module, stabilization photosensory assembly and electronic equipment |
| EP19849128.4A EP3829156B1 (en) | 2018-08-15 | 2019-07-29 | Anti-shake light-sensing assembly, fabrication method therefor and electronic device |
| US17/268,335 US11899222B2 (en) | 2018-08-15 | 2019-07-29 | Anti-shake camera module, anti-shake photosensitive assembly, and manufacturing method thereof and electronic device |
| PCT/CN2019/098077 WO2020034826A1 (en) | 2018-08-15 | 2019-07-29 | Anti-shake camera module, anti-shake light-sensing assembly, fabrication method therefor and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821320091.7U CN208572247U (en) | 2018-08-15 | 2018-08-15 | Stabilization camera module, stabilization photosensory assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208572247U true CN208572247U (en) | 2019-03-01 |
Family
ID=65450711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821320091.7U Active CN208572247U (en) | 2018-08-15 | 2018-08-15 | Stabilization camera module, stabilization photosensory assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208572247U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034826A1 (en) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake light-sensing assembly, fabrication method therefor and electronic device |
| CN110839120A (en) * | 2018-08-15 | 2020-02-25 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake camera module and anti-shake photosensitive assembly, and electronic equipment |
| WO2021008169A1 (en) * | 2019-07-15 | 2021-01-21 | 华为技术有限公司 | Photographing apparatus and method, and adjustment element |
| WO2021092855A1 (en) * | 2019-11-14 | 2021-05-20 | 南昌欧菲光电技术有限公司 | Camera module and mobile terminal |
| WO2021108972A1 (en) * | 2019-12-03 | 2021-06-10 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
| WO2021249191A1 (en) * | 2020-06-08 | 2021-12-16 | 宁波舜宇光电信息有限公司 | Photosensitive assembly having anti-shake function, camera module, and assembly methods therefor |
| CN116600202A (en) * | 2022-02-11 | 2023-08-15 | 华为技术有限公司 | Image sensor driving module, optical assembly, camera module and electronic equipment |
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2018
- 2018-08-15 CN CN201821320091.7U patent/CN208572247U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034826A1 (en) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake light-sensing assembly, fabrication method therefor and electronic device |
| CN110839120A (en) * | 2018-08-15 | 2020-02-25 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake camera module and anti-shake photosensitive assembly, and electronic equipment |
| US11899222B2 (en) | 2018-08-15 | 2024-02-13 | Ningbo Sunny Opotech Co., Ltd. | Anti-shake camera module, anti-shake photosensitive assembly, and manufacturing method thereof and electronic device |
| CN110839120B (en) * | 2018-08-15 | 2024-07-12 | 宁波舜宇光电信息有限公司 | Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake photosensitive assembly and electronic equipment |
| WO2021008169A1 (en) * | 2019-07-15 | 2021-01-21 | 华为技术有限公司 | Photographing apparatus and method, and adjustment element |
| WO2021092855A1 (en) * | 2019-11-14 | 2021-05-20 | 南昌欧菲光电技术有限公司 | Camera module and mobile terminal |
| WO2021108972A1 (en) * | 2019-12-03 | 2021-06-10 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
| WO2021249191A1 (en) * | 2020-06-08 | 2021-12-16 | 宁波舜宇光电信息有限公司 | Photosensitive assembly having anti-shake function, camera module, and assembly methods therefor |
| CN116600202A (en) * | 2022-02-11 | 2023-08-15 | 华为技术有限公司 | Image sensor driving module, optical assembly, camera module and electronic equipment |
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