JP4185236B2 - Solid-state imaging device and imaging apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device and an imaging apparatus used for imaging.
[0002]
[Prior art]
Conventionally, for example, solid-state imaging devices such as CCD (Charge Coupled Devices) and MOS (Metal Oxide Semiconductor) are used in cameras such as digital cameras and video cameras.
[0003]
As a conventional solid-state imaging device, for example, a structure described in Japanese Utility Model Laid-Open No. 59-171462 or Japanese Patent Laid-Open No. 10-23340 is known. For example, as shown in FIG. 4, in such a solid-state imaging device 1, a semiconductor chip 4 is mounted on a chip mounting surface 3a in a mold package 3 in which a lead frame 2 is integrally formed by insert molding through an opening 3b. 3 is closed with a cover glass 5.
[0004]
In order to attach the solid-state imaging device 1 to the lens barrel side of the camera, as shown in FIG. 5, the center of the solid-state imaging device 1 and the center of the mounting plate 6 are positioned and the solid-state imaging device 1 and the mounting plate 6 are positioned. The mounting plate 6 is positioned on the lens master frame 7 on the lens barrel side, and the mounting plate 6 is fastened and fixed to the lens master frame 7 with screws 8.
[0005]
Further, as shown in FIG. 6, the solid-state imaging device 1 in which a pair of metal mounting plates 9 are integrally formed on both sides of the mold package 3, or both sides of the ceramic mold package 3 as shown in FIG. There is a solid-state image pickup device 1 in which a pair of attachment portions 3c are integrally formed. These solid-state image pickup devices 1 can be directly attached to the lens master frame 7 by means of attachment plates 9 or attachment portions 3c. In the solid-state imaging device 1 shown in FIG. 6, the semiconductor chip 4 is mounted on the chip mounting surface 3c on the mold package 3 side.
[0006]
Further, for example, as described in JP-A-1-283973, there is a solid-state image pickup device in which a single metal mounting plate is integrally formed in a mold package, but the solid-state image pickup device shown in FIG. Similar to 1, a semiconductor chip is mounted on the mold package side.
[0007]
[Problems to be solved by the invention]
By the way, the chip surface 4a on the surface of the semiconductor chip 4 of the solid-state imaging device 1 is originally required to be positioned perpendicular to the imaging optical axis, and if the chip surface 4a is inclined (hereinafter, this phenomenon). The focal position of the lens cannot be maintained uniformly within the chip surface 4a, and a blurring phenomenon occurs when an image is taken. As for the height (position in the optical axis direction) of the chip surface 4a associated with the tilt of the chip surface 4a, when the solid-state imaging device 1 is incorporated in the lens master frame 7, the height of the chip surface 4a is the lens focus. It is necessary to match the distance position. In this case, the height of the chip surface 4a in the solid-state image pickup device 1 itself varies, and as shown in FIG. Therefore, the reality is that adjustments are made to absorb this error.
[0008]
In recent years, digital cameras equipped with the solid-state imaging device 1 have been increased in the size and density of 2 to 3 million pixels, and zoom lenses have become mainstream in the optical system. The allowable error becomes very severe, and numerically, the solid-state imaging device 1 itself is required to have a level of accuracy of 10 μm or less. In addition, in the movement of miniaturization, the structure conventionally used for the height of the chip surface 4a is complicated, and it becomes impossible to use the time-consuming adjustment method, and the simplification thereof has been demanded. The height accuracy of the chip surface 4a by itself is required to have a level of accuracy equivalent to 10 μm, like the tilt.
[0009]
Considering the tilt of the chip surface 4a when the solid-state imaging device 1 shown in FIG. 4 is attached to the lens master frame 7 and set by the method shown in FIG. 5, the chip mounting surface 3a of the mold package 3 and its chip mounting surface 3a. There is a parallel error between the back surface of the mold package 3 and a flatness error between the back surface of the mold package 3 and the mounting plate 6, and the stacking error is already 40 μm or more before being set on the master frame 7. Further, when considering the height of the chip surface 4a, a height error between the chip mounting surface 3a of the mold package 3 and the back surface of the mold package 3 results in an error of 40 μm or more as with the tilt.
[0010]
In the case of the conventional solid-state imaging device 1 shown in FIG. 6, the pair of mounting plates 9 are different from the mold package 3 on which the chip mounting surface 3a is formed. It is difficult to obtain parallel accuracy and height accuracy with respect to the mounting surface 3a, and the chip surface 4a is raised as in the case of the conventional solid-state imaging device 1 shown in FIG. Furthermore, since the solid-state imaging device described in JP-A-1-283973 is also different from the mold package having the mounting plate and the chip mounting surface, the same error occurs.
[0011]
Further, in the case of the conventional solid-state image pickup device 1 shown in FIG. 7, it has a structure in which a mold package 3 having a mounting portion 3c made of ceramic is integrally formed, and is often used for a large-sized solid-state image pickup device. The height of the chip surface 4a until it is attached to the frame 7 and the height error can be made much smaller than those of the conventional solid-state imaging device 1 shown in FIG. 3 and FIG. In the course of downsizing, it has become difficult to ensure the strength of the mounting portion 3c that can withstand the tightening torque necessary for tightening the screw 8.
[0012]
Apart from the tilt and height of the chip surface 4a, when the solid-state image sensor 1 is incorporated in the lens master frame 7, the center of the chip surface 4a of the solid-state image sensor 1 needs to coincide with the lens optical axis. Since the center position of the chip surface 4a varies with the element 1 itself, adjustment is made to absorb this error. When adjusting the solid-state imaging device 1 having no mounting structure shown in FIG. 4, it is necessary to bond and fix to the mounting plate 6 after alignment with the mounting plate 6, which requires man-hours and remains uneasy about reliability. Therefore, no adjustment is originally desirable. In order to realize the non-adjustment, the center accuracy of the chip surface 4a is required to be about 10 μm at the time when the solid-state imaging device 1 is incorporated into the lens master frame 7, but the material shown in FIG. When the portion 3c is integrally molded, the accuracy of the positioning hole with the lens master frame 7 formed in the mounting portion 3c or the mounting hole to the lens master frame 7 and the center of the chip surface 4a is 50 μm due to the molding process. Since the degree is the limit, it is difficult to keep within the required accuracy without adjustment.
[0013]
The present invention has been made in view of such a point, and an object thereof is to provide a solid-state imaging device and an imaging apparatus capable of ensuring the positional accuracy of a semiconductor chip.
[0014]
[Means for Solving the Problems]
The present invention, in a solid-state imaging device which is attached to the imaging component fixing section of the image pickup apparatus, a mold package is integrated with the molded package, a mounting plate that have a protruding portion protruding from the molded package, the mold package A semiconductor chip disposed inside, and a chip mounting portion which is fixed to the mounting plate and protrudes into the mold package and mounts the semiconductor chip at a protruding tip, and a plate surface of the protruding portion of the mounting plate is It is attached to the said imaging component fixing | fixed part so that the said imaging component fixing | fixed part may be touched.
[0015]
In the solid-state imaging device according to the present invention, the chip mounting portion has a concave-shaped portion on which the semiconductor chip is mounted with a concave surface facing the semiconductor chip, and the semiconductor chip It is preferable to be fixed to the concave surface of the concave portion.
[0016]
In the solid-state imaging device according to the present invention, the mounting plate has a chip mounting portion mounting fitting hole for mounting the chip mounting portion, and the chip mounting portion is fitted with the chip mounting portion mounting fit. It is preferable to be inserted into the joint hole and fixed.
[0017]
In the solid-state imaging device according to the present invention, it is preferable that the mounting plate has a pair of protruding portions protruding from the mold package with a portion integrated with the mold package interposed therebetween.
[0018]
Further, in an imaging apparatus including the solid-state imaging device according to the present invention and the imaging component fixing unit, the imaging component fixing unit is a frame structure member provided in a camera lens barrel, and the solid-state imaging device is It is preferable that the pair of projecting portions of the mounting plate be attached to the frame structure member so that the frame comes into contact with the frame of the frame structure member .
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0025]
1 and 2 show an embodiment, FIG. 1A is a side view of a solid-state image sensor, FIG. 1B is a rear view of the solid-state image sensor, and FIG. 2 is an image pickup apparatus using the solid-state image sensor. FIG.
[0026]
The solid-state imaging device 11 includes a mounting plate 12, a mold package 13 formed integrally with the mounting plate 12, a lead frame 14 formed integrally with the mold package 13, and a semiconductor mounted directly on the mounting plate 12 within the mold package 13. A chip 15 and a cover glass 16 that covers the semiconductor chip 15 and is attached to the mold package 13 are provided.
[0027]
The mounting plate 12 is made of a metal, is formed in a flat plate shape, and includes a substrate portion 21 disposed in the mold package 13 and mounting portions 22 that protrude from both ends of the mold package 13 at both ends of the substrate portion 21. ing. The entire surface on which the semiconductor chip 15 of the mounting plate 12 is mounted is a reference surface 23 processed to a predetermined plane accuracy, and the central area of the reference surface 23 of the substrate portion 21 is the chip mounting surface on which the semiconductor chip 15 is mounted. 24. Each mounting portion 22 has one reference hole 25, 26 and one mounting hole 27, 28, respectively. The reference hole 25 of one attachment portion 22 and the attachment holes 27 and 28 of both attachment portions 22 are formed as circular holes, and the reference hole 26 of the other attachment portion 22 is long toward one reference hole 26 (attachment plate It is formed in a long hole (long in the direction of both ends of 12).
[0028]
The mold package 13 is made of, for example, an insulating synthetic resin, and is integrally formed with the lead frame 14 and insert molding with respect to the substrate portion 21 of the mounting plate 12. The mold package 13 has a frame portion 31 formed in a quadrangular frame shape. The frame portion 31 is formed with an opening 32 through which the chip mounting surface 24 of the mounting plate 12 is exposed. Mounting portions 22 of the mounting plate 12 protrude from both ends of the frame portion 31, and lead frames 14 protrude from both sides of the frame portion 31.
[0029]
The lead frame 14 has a plurality of pins 35. The base ends of the pins 35 are fixed to the mold package 13 by integral molding of the mold package 13, and the tips of the pins 35 protruding from the mold package 13 are the mounting plates. It is derived in the direction opposite to the 12 reference planes 23. The base end of each pin 35 protrudes into the opening 32 of the mold package 13 and is electrically connected to the semiconductor chip 15 by wire bonding or the like.
[0030]
The semiconductor chip 15 is a rectangular semiconductor chip such as a CCD (Charge Coupled Devices) or a MOS (Metal Oxide Semiconductor), and the surface having the element is a chip surface 15a, and the surface opposite to the chip surface 15a is die-bonded. Is mounted and fixed on the chip mounting surface 24 of the mounting plate 12. A plurality of terminal portions (not shown) are formed around the semiconductor chip 15. For example, the terminal portions and the pins 35 of the lead frame 14 are electrically connected by wire bonding or the like.
[0031]
The cover glass 16 is made of transparent glass, and is fixed to the periphery of the opening 32 of the mold package 13 with an adhesive or the like, thereby closing the opening 32.
[0032]
As shown in FIG. 2, the imaging apparatus using the solid-state imaging device 11 has a lens master frame 41 on the lens barrel side as the imaging apparatus body, and the lens master frame 41 is a metal disc shape. Thus, a reference surface 42 processed with a predetermined plane accuracy is formed on one surface to which the solid-state imaging device 11 is attached.
[0033]
A rectangular window hole 43 into which the mold package 13 of the solid-state image sensor 11 is inserted is formed inside the lens master frame 41, and the solid-state image sensor 11 is attached to the reference surfaces 42 on both ends of the window hole 43. A cylindrical boss 44 that engages with the reference holes 25 and 26 of the plate 12 is formed so as to project, and a mounting hole 46 is formed through which the screw 45 is screwed through the mounting holes 27 and 28 of the mounting plate 12. ing.
[0034]
Note that the reference holes 25 and 26 of the mounting plate 12 of the solid-state imaging device 11 and the boss 44 and the mounting hole 46 of the lens master frame 41 are formed within a predetermined dimensional accuracy. In particular, the hole diameter of the reference hole 25 and the boss 44 The tolerance with the diameter is finished to approximately ± 0. The reference holes 25 and 26 of the mounting plate 12 can be finished to an error of 10 μm or less by using metal as the material of the mounting plate 12.
[0035]
In order to assemble the solid-state imaging device 11, first, the mold package 13 is integrally formed on the mounting plate 12 and the lead frame 14 by insert molding. Subsequently, the semiconductor chip 15 is directly mounted on the chip mounting surface 24 of the mounting plate 12 through the opening 32 of the mold package 13, the optical position is adjusted with reference to the reference holes 25 and 26 of the mounting plate 12, and die bonding is performed. Fixed by. Subsequently, for example, each terminal portion of the semiconductor chip 15 and each pin 35 of the lead frame 14 are electrically connected by wire bonding or the like. Subsequently, the cover glass 16 is bonded and fixed to the opening 32 of the mold package 13.
[0036]
The solid-state imaging device 11 assembled in this way is configured such that the mounting plate 12 is formed separately from the mold package 13, and the mounting plate 12 is integrated with the mold package 13 and the chip of the mounting plate 12 in the mold package 13. Since the semiconductor chip 15 is directly mounted on the mounting surface 24 (reference surface 23), the tilt accuracy and height accuracy of the chip surface 15a with respect to the reference surface 23 of the mounting plate 12 can be improved as compared with the conventional one. Position accuracy can be secured.
[0037]
Further, in order to assemble the solid-state imaging device 11 to the lens master frame 41, the reference holes 25 and 26 of the respective mounting portions 22 of the mounting plate 12 are made to be in the lens master while the mold package 13 enters the window hole 43 of the lens master frame 41. Fit to each boss 44 of the frame 41, screw each screw 45 into each mounting hole 46 of the lens master frame 41 through each mounting hole 27, 28 of the mounting plate 12, and tighten the mounting plate 12 to the lens master frame 41 Fix it.
[0038]
In this state where the solid-state imaging device 11 is assembled to the lens master frame 41, the reference surface 23 of the mounting plate 12 is joined to the reference surface 42 of the lens master frame 41, so that the chip surface of the semiconductor chip 15 with respect to the lens master frame 41 The tilt accuracy and height accuracy of 15a can be improved as compared to the conventional case, that is, the chip surface 15a can be aligned perpendicular to the imaging optical axis and the chip surface 15a can be aligned with the lens focal length position. Furthermore, by using a metal with excellent strength and accuracy as the material of the mounting plate 12, the reference holes 25 and 26 of the mounting portions 22 of the mounting plate 12 are fitted to the bosses 44 of the lens master frame 41, and each By simply screwing the screw 45 into the mounting holes 46 of the lens master frame 41 through the mounting holes 27 and 28 of the mounting plate 12, the center of the chip surface 15a can be aligned with the imaging optical axis, and no adjustment can be achieved. .
[0039]
As described above, the mounting plate 12 is configured separately from the mold package 13, the mounting plate 12 is integrated with the mold package 13, and the semiconductor chip 15 is directly mounted on the mounting plate 12 in the mold package 13. Thus, the positional accuracy of the semiconductor chip 15 can be secured via the mounting plate 12, and a material having excellent strength and accuracy can be selected for the mounting plate 12 separate from the mold package 13.
[0040]
Since the material of the mounting plate 12 is metal, in addition to excellent strength and accuracy, the heat dissipation of the semiconductor chip 15 can be improved, the temperature rise of the semiconductor chip 15 is suppressed, the thermal dark current is suppressed, and the captured image Can be obtained.
[0041]
By integrally molding the mold package 13 to the mounting plate 12 and the lead frame 14, the number of parts can be reduced and the number of assembly steps can be reduced.
[0042]
By using the solid-state imaging device 11 in the imaging apparatus, adjustment at the time of assembling the solid-state imaging device 11 to the lens master frame 41 can be stably and easily performed, and high-quality imaging can be performed.
[0043]
Next, FIG. 3 shows another embodiment, FIG. 3 (a) is a cross-sectional view of a solid-state image sensor, and FIG. 3 (b) is a rear view of the solid-state image sensor.
[0044]
The mounting plate 12 has a mounting plate main body 51 and a stud 52. The mounting plate main body 51 is made of metal, and a fitting hole 53 is formed in the central portion of the substrate portion 21. A stud 52 is inserted into the fitting hole 53 from the reference surface (first reference surface) 23 side of the mounting plate main body 51. It is press-fitted and fixed (press-fitting adhesive fixing). The stud 52 is made of metal, has a base portion 54, and a fixing portion 55 that is press-fitted into the fitting hole 53 from the base portion 54 is formed to protrude. The surface of the base 54 from which the fixing portion 55 protrudes is a reference surface 56 processed to a predetermined plane accuracy, and the surface opposite to the reference surface 56 is a chip mounting surface (second reference surface) on which the semiconductor chip 15 is directly mounted. Surface) 57. On the inner side of the chip mounting surface 57, a recess 59 is formed in which an adhesive 58 for bonding and fixing the semiconductor chip 15 directly mounted on the chip mounting surface 57 to the stud 52 is placed. The mounting plate 12 includes a parallelism, a flatness, a height, and the like of the reference surface 23 of the mounting plate body 51 that is the first reference surface and the chip mounting surface 57 of the stud 52 that is the second reference surface. Processing is performed so that the optically related accuracy is within a predetermined tolerance.
[0045]
The mold package 13 is formed separately or integrally with the mounting plate 12. When the mold package 13 is a separate body, a mounting surface portion 60 to be joined to the reference surface 23 of the mounting plate body 51 is formed at the bottom of the opening portion 32 of the frame portion 31, and the mounting surface portion 60 has a base 54 of the stud 52. A through hole 61 is formed, and the outer surface of the frame portion 31 and the mounting plate main body 51 are bonded and fixed by an adhesive 62 in a state of being combined with the mounting plate 12. The thickness of the mounting surface portion 60 is lower than the height of the base portion 54 of the stud 52, and the semiconductor chip 15 mounted on the chip mounting surface 57 is configured not to contact the mounting surface portion 60. On the other hand, when the mold package 13 is integrally formed, it is integrally formed with the mounting plate 12 and the lead frame 14, and the frame portion 31 and the like are formed as in the case of separate bodies.
[0046]
Other configurations, assembly, and the like are the same as those of the embodiment shown in FIGS.
[0047]
Also in the case of this embodiment, the mounting plate 12 is configured separately from the mold package 13, and the mounting plate 12 is integrated with the mold package 13, and the semiconductor chip is mounted on the mounting plate 12 within the mold package 13. By mounting 15 directly, it is possible to secure the positional accuracy of the semiconductor chip 15 via the mounting plate 12, and it is possible to select a material with excellent strength and accuracy for the mounting plate 12 separate from the mold package 13. The same effect as the embodiment shown in FIGS. 1 and 2 can be obtained.
[0048]
Further, the stud 52 protrudes from the mounting plate body 51 of the mounting plate 12 into the mold package 13, and the semiconductor chip 15 is directly mounted on the stud 52, whereby the semiconductor chip 15 is disposed at an arbitrary position in the mold package 13. it can.
[0049]
Although a total of four holes (reference holes 25, 26 and mounting holes 27, 28) are provided in the mounting portion 22 of the mounting plate 12, depending on the required accuracy, for example, positioning holes and mounting holes The number of holes is not limited, such as serving as a hole.
[0050]
Further, the material of the mounting plate 12 may be other than metal as long as strength and accuracy can be secured.
[0051]
【The invention's effect】
According to the solid-state imaging device according to any one of claims 1 to 4, it is possible to ensure the positional accuracy of the semiconductor chip through the Mounting plate excellent in strength and precision to plate Mounting integrated with mold package The material can be selected.
[0052]
According to the solid-state imaging device according to claim 1, further can be arranged semi-conductor chip to an arbitrary position in the mold package.
[0054]
Oite the solid-state imaging device according to any one of claims 1 to 4, the mold package since the integral of the mounting plate, and reduce the number of parts can be reduced number of assembling steps.
[0055]
According to the imaging apparatus according to claim 5, the imaging device adjustment during assembling the solid-state imaging device of the body stably can be easily, it is high-quality imaging.
[Brief description of the drawings]
FIG. 1 shows an embodiment of a solid-state imaging device of the present invention, where (a) is a side view and (b) is a rear view.
FIG. 2 is a perspective view of an imaging apparatus using the same solid-state imaging device.
FIG. 3 shows another embodiment of the solid-state imaging device of the present invention, where (a) is a cross-sectional view and (b) is a rear view.
4A and 4B show a conventional solid-state imaging device, in which FIG. 4A is a side view, and FIG. 4B is a rear view.
FIG. 5 is a perspective view of an imaging apparatus using a conventional solid-state imaging device.
6A and 6B show another conventional solid-state imaging device, in which FIG. 6A is a side view and FIG. 6B is a rear view.
7A and 7B show still another conventional solid-state imaging device, in which FIG. 7A is a side view and FIG. 7B is a rear view.
[Explanation of symbols]
11 Solid-state image sensor
12 Mounting plate
13 Mold package
15 Semiconductor chip
41 Lens master frame as imaging device body
51 Mounting plate body
52 Stud

Claims (5)

In the solid-state image sensor attached to the imaging component fixing part of the imaging device,
Mold package,
A mounting plate integrated with the mold package and having a protruding portion protruding from the mold package;
A semiconductor chip disposed in the mold package;
A chip mounting portion fixed to the mounting plate and protruding into the mold package, and mounting the semiconductor chip on the protruding tip;
Comprising
A solid-state image pickup device attached to the imaging component fixing portion so that a plate surface of a protruding portion of the mounting plate is in contact with the imaging component fixing portion. The solid-state imaging device according to claim 1,
The chip mounting portion is
Having a concave shaped portion for mounting the semiconductor chip with the concave surface facing the semiconductor chip side,
The semiconductor chip is
A solid-state imaging device, which is fixed to a concave surface of the concave portion. The solid-state imaging device according to claim 1 or 2,
The mounting plate is
A chip mounting portion mounting fitting hole for mounting the chip mounting portion;
The chip mounting portion is
A solid-state imaging device, wherein the solid-state imaging device is inserted into and fixed to the chip mounting portion mounting fitting hole. In the solid-state image sensor according to any one of claims 1 to 3,
The mounting plate is
A solid-state imaging device having a pair of projecting portions projecting from the mold package with a portion integrated with the mold package interposed therebetween. An imaging apparatus comprising: the solid-state imaging device according to claim 4; and the imaging component fixing unit.
The imaging component fixing part is
A frame structure member provided in the camera lens barrel;
The solid-state imaging device is
An image pickup apparatus attached to the frame structure member such that a pair of protruding portions of the attachment plate is in contact with a frame of the frame structure member .

Images