JP4248586B2 - IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND PORTABLE INFORMATION TERMINAL AND IMAGING DEVICE WITH THE IMAGING DEVICE - Google Patents

Description

  The present invention relates to an imaging apparatus, a manufacturing method thereof, a portable information terminal and an imaging apparatus equipped with the imaging apparatus, and more specifically, a structure used for aligning an optical system and a solid-state imaging device, The present invention relates to an imaging device in which an optical system is directly formed on the upper surface of a package provided with a solid-state imaging device, a method for manufacturing the imaging device, and a portable information terminal and imaging equipment equipped with the imaging device.

  A solid-state imaging device capable of obtaining imaging information by receiving light from a lens on a light-receiving surface of an imaging element is used in imaging equipment and information equipment such as a digital still camera and a mobile phone having a camera function. In this solid-state imaging device, in order to irradiate light from the lens to a predetermined light receiving area of the imaging device, and to sufficiently draw out the designed optical performance and to obtain a clear and non-blurred image or the like, from the lens It is necessary to form an image of light on a predetermined region of the imaging surface with good positional accuracy and good vertical accuracy. However, if there is a relative position shift or optical axis shift between the lens and the imaging surface, the position of the light flux from the lens may be off the imaging surface, or vignetting or tilting of the captured image may occur. One side blur may occur. In order to prevent such a problem, the relative position between the lens and the image sensor and the perpendicularity between the optical axis and the imaging surface are accurately matched, and the back focus (the most imaged lens group) is selected. It is necessary to accurately match the distance from the surface close to the surface to the imaging surface.

  In a conventional solid-state imaging device, an image sensor is attached to an element fixing material such as a substrate, and a lens holder that holds a lens is assembled to the element fixing material in a posture that allows position adjustment with a position adjusting screw. There is a configuration in which adjustment is performed using a position adjusting screw so that the light beam from the lens is well positioned on the imaging surface of the imaging element and the optical axis of the lens and the imaging surface of the imaging element are perpendicular to each other.

  In Patent Document 1, a position adjusting substrate is interposed between the element fixing material and the lens holder, and the mounting position of the position adjusting substrate with respect to the element fixing material and the lens holder is a screw provided on the position adjusting substrate. By adjusting, the relative position between the lens and the image sensor, and the vertical accuracy between the optical axis of the lens and the imaging surface of the image sensor are matched. However, in the case of the above configuration, after assembling the imaging element, the element fixing material, and the lens holder without restricting the position of the imaging element and the element fixing material and the position regulation of the element fixing material and the lens holder, Adjust the position adjustment screw or adjust the mounting position of the position adjustment board with the screw, and for each image pickup unit, the relative position between the lens and the image sensor, the optical axis of the lens and the image pickup surface The vertical accuracy etc. are adjusted. Therefore, these adjustment operations must be performed, and these adjustment operations require a great deal of labor and time.

Patent Document 2 discloses a configuration including an element fixing material in which a positioning hole for positioning with an imaging element is formed. The positioning hole is configured so that a positioning convex portion formed on the lens holder for positioning the element fixing member and the lens holder can also be engaged. It is fixed to the element fixing material. That is, according to this configuration, the positioning hole of the element fixing material for positioning the relative position between the element fixing material and the imaging element can also be used as a positioning hole for positioning the relative position between the element fixing material and the lens holder. it can. Therefore, the lens held by the lens holder and the image sensor can be positioned relatively easily.
Japanese Patent Laid-Open No. 6-167644 (released on June 14, 1994) JP 2006-154319 A (published on June 15, 2006)

  However, in the case of the configuration of Patent Document 2, the shape of the positioning portion that can be formed on the element fixing material (element package) is limited to a small-diameter hole or a convex shape due to the manufacturing method and the mold structure, and is accurate. It is difficult to form a shape or a complicated shape.

  The solid-state imaging device mounted on a mobile phone or a small information terminal is being reduced in size year by year due to the size limitation of the housing. Further, in recent years, there has been a demand for higher pixels and higher functions of solid-state image sensors, and even in small cameras mounted on mobile phones and the like, cameras equipped with autofocus and zoom functions with 3 to 5 million pixels. Has also appeared. In such a small and highly functional camera module, high-precision assembly between the lenses constituting the optical system and high-precision alignment between the optical system and the image sensor are essential. If the positioning portion is not formed with an accurate shape or cannot sufficiently perform the positioning function, a desired imaging quality cannot be realized.

  Therefore, the present invention has been made in view of the above-described problems, and an object thereof is to easily and accurately position an optical system including a lens and an image sensor using a simple structure. In addition to providing an imaging device that can be used and a method for manufacturing the same, a portable information terminal equipped with the imaging device is provided.

  In order to solve the above-described problems, an imaging device according to the present invention is provided on an imaging device, an imaging package configured to be able to arrange the imaging device on the bottom, and an upper surface of the imaging package. A first optical element that guides light toward the imaging element; a second optical element that guides light toward the first optical element; and an upper surface of the imaging package. And a structure for aligning the element and the second optical element. Specifically, the structure is a structure for determining the relative positions of the first optical element, the second optical element, and the imaging element at a desired position.

  According to the above configuration, it is possible to provide an imaging apparatus in which an optical system including a lens and an imaging element are easily and accurately positioned using a simple structure.

  That is, in the configuration of the imaging device of the present invention, the first optical element and the structure are provided on the upper surface of the imaging package. Therefore, it is possible to form the structure functioning as an alignment unit (positioning unit) for attaching the (second) optical element to the imaging package with the same accuracy as the (first) optical element, A structure having an accurate shape can be realized, and even a structure having a complicated structure generally employed in an optical element can be realized accurately. Therefore, the positioning function can be sufficiently achieved, and a desired imaging quality can be realized.

  In addition, since the first optical element is provided on the upper surface of the imaging package, the imaging apparatus can be reduced in size as compared with the configuration in which the optical element is mounted by interposing a member in which an alignment portion is formed. It is possible to provide an imaging apparatus that can be realized and achieves high-performance imaging quality while being miniaturized.

  In addition, it is possible to assemble the lenses constituting the optical system with high accuracy.

  The imaging apparatus according to the present invention further includes a holding body that holds the second optical element, and the holding body is fixed to the imaging package via the structure. Also good.

  In the imaging apparatus according to the present invention, the structure and the first optical element are integrally formed.

  Thereby, compared with the case where the said structure and said 1st optical element are comprised separately, it can handle easily at the time of the attachment to the upper surface of an imaging package (at the time of fixation). . That is, in the case where the structure and the first optical element are configured as separate bodies, when attaching the image pickup package to the upper surface of the image pickup package (at the time of adhering), to align the individual with the image pickup element. In addition, since the mutual alignment is required, the process becomes complicated. On the other hand, if the structure and the first optical element are integrated, it is not necessary to align each other, and the process can be simplified.

  Moreover, according to said structure, compared with the case where a structure and a 1st optical element are comprised by a different body, a fixed strength can be raised. That is, when the structure and the first optical element are configured separately, each is fixed independently to the top surface of the imaging package when attached to the top surface of the imaging package (at the time of fixing). Therefore, when the structure has a relatively small size, there is a possibility that the structure is detached from the upper surface of the imaging package or misaligned due to some external factor. On the other hand, if the structure and the first optical element are integrated, even if the structure is of a small size, the structure is also formed by the first optical element. The state is fixed to the upper surface of the imaging package. For this reason, it is possible to increase the fixing strength and perform highly reliable positioning.

  In the imaging device according to the present invention, the structure body and the first optical element are formed separately, but may be formed at the same time. According to this configuration, even a separate body can be formed without increasing the number of steps.

  In the imaging apparatus according to the present invention, it is preferable that the imaging package has a lid member made of a translucent material on the imaging element.

  According to said structure, since it has the cover member which consists of a translucent material, an image pick-up element can be protected from moisture or external dust. Therefore, desired image quality can be maintained and deterioration of the image sensor can be prevented.

  In the imaging apparatus according to the present invention, it is preferable that the imaging package has a light-impermeable member for preventing light from entering the imaging element from other than the first optical element.

  According to the above configuration, high imaging accuracy can be realized without unnecessary light entering the imaging device and without impairing imaging quality.

  In the imaging apparatus according to the present invention, as the first optical element, a plano-concave lens or a plano-convex lens whose surface facing the top surface of the imaging package is a plane can be used.

  In the imaging device according to the present invention, the first optical element has a plurality of protruding structures protruding upward from the upper surface of the imaging package, and the protruding structure is a tapered structure. Can be used.

  According to said structure, reflection of the light which injects into said 1st optical element is suppressed by several protrusion structure. Thereby, the loss of light in the first optical element can be suppressed, and a sufficient amount of light incident on the imaging element can be secured.

  In the imaging device according to the present invention, the structure may be a convex structure, and the second optical element may be formed with a concave structure that meshes with the convex structure. Contrary to this configuration, the imaging apparatus according to the present invention may have a configuration in which a concave structure is formed in the structure and the second optical element is engaged with the concave structure.

  Further, the convex structure may be a tapered structure, and the concave structure may be a tapered structure. Thereby, occlusion can be performed smoothly. Further, when the structure and the second optical element are formed by injection molding in the manufacturing process of the imaging device, release from the mold is facilitated by providing a tapered structure.

  In the imaging apparatus according to the present invention, it is preferable that the structure is configured in a ring shape surrounding the outer periphery of the first optical element on the upper surface of the imaging package. Thus, when the structure and the second optical element are formed by injection molding in the manufacturing process of the imaging device, the mold can be easily manufactured with high accuracy. Moreover, when releasing from a metal mold | die, a mold release agent etc. are not required but it can release without making a structure lack. Moreover, the strength of the structure can be improved and deformation can be suppressed by forming a ring-like shape surrounding the outer periphery of the first optical element, that is, a continuous structure. However, the present invention is not limited to this, and in the imaging apparatus according to the present invention, the structure may be intermittently disposed along the outer periphery of the first optical element on the upper surface of the imaging package. .

  In the imaging apparatus according to the present invention, the second optical element may include a plurality of lenses.

  In order to solve the above-described problems, another imaging apparatus according to the present invention includes an imaging element, an imaging package configured to be able to dispose the imaging element on the bottom, and the imaging element. A first optical element that guides light toward the first optical element, and the first optical element has a flat surface disposed on one surface of the imaging package and on the other surface. Is characterized in that, in addition to the optically effective area, a protrusion or a depression used for aligning the member disposed on the other surface side with the first optical element is provided. .

  According to said structure, using the said protrusion or hollow formed in the 1st optical element as an alignment part of the optical system (for example, lens barrel holding the lens) containing a lens, and an image pick-up element. In addition, this projection or depression can be created with the same accuracy as the lens, that is, with high accuracy.

  Furthermore, a portable information terminal including the imaging device having the above-described configuration is also within the scope of the present invention.

  Furthermore, an imaging device including the imaging device having the above-described configuration is also within the scope of the present invention. Examples of the imaging device include a digital still camera and a video camera.

  In addition, in order to solve the above-described problem, the manufacturing method of the imaging device according to the present invention is a mold in which a predetermined space is formed on the upper surface of the imaging package when the imaging package having the imaging element mounted on the bottom is arranged. Are disposed on the upper surface of the imaging package, the filling device filling the space with an uncured liquid material and a curing step for curing the liquid material filled in the filling step. A first optical element that guides light and a structure for attaching the second optical element that guides light toward the first optical element to the imaging package are formed of the liquid material.

  According to said structure, the optical system containing a lens and an image pick-up element can be positioned easily and with high precision using a simple structure.

  That is, in the manufacturing method of the imaging device of the present invention, the first optical element and the structure are provided on the upper surface of the imaging package. Therefore, it is possible to form the structure functioning as an alignment unit (positioning unit) for attaching the (second) optical element to the imaging package with the same accuracy as the (first) optical element, A structure having an accurate shape can be realized, and even a structure having a complicated structure generally employed in an optical element can be realized accurately. Therefore, the positioning function can be sufficiently achieved, and a desired imaging quality can be realized.

  In addition, since the first optical element is provided on the upper surface of the imaging package, the imaging apparatus can be reduced in size as compared with the configuration in which the optical element is mounted by interposing a member in which an alignment portion is formed. It is possible to realize a high-performance imaging quality while being miniaturized.

  As described above, the imaging device according to the present invention is provided on the top surface of the imaging device, the imaging package configured to be able to arrange the imaging device on the bottom, and the imaging device. A first optical element that guides light toward the first optical element, a second optical element that guides light toward the first optical element, and an upper surface of the imaging package. The first optical element and the first optical element And a structure for aligning the two optical elements. In addition, as described above, another imaging apparatus according to the present invention includes an imaging element, an imaging package configured to be able to dispose the imaging element on the bottom, and light toward the imaging element. A first optical element for guiding, the first optical element having a plane disposed on the upper surface of the imaging package on one surface and an optically effective surface on the other surface. Outside the region, there is provided a protrusion or a depression used when aligning the member disposed on the other surface side with the first optical element. In addition, as described above, the manufacturing method of the imaging device according to the present invention is after arranging the mold that forms a predetermined space on the upper surface of the imaging package when the imaging package having the imaging element mounted on the bottom is arranged. A first step of guiding light to the image sensor on the upper surface of the imaging package, the method comprising: a filling step for filling the space with an uncured liquid material; and a curing step for curing the liquid material filled in the filling step. And the structure for attaching the second optical element for guiding light toward the first optical element to the imaging package is formed of the liquid material. Further, a portable information terminal including the imaging device having the above-described configuration is also within the scope of the present invention, and an imaging device including the imaging device having the above-described configuration is also within the scope of the present invention.

  If it is set as the above structure, the optical system containing a lens and an image pick-up element can be positioned easily and with high precision using a simple structure.

[Embodiment 1]
An embodiment of the present invention will be described with reference to FIGS. In the following description, various technically preferable limitations for carrying out the present invention are given, but the scope of the present invention is not limited to the following embodiments and drawings.

  FIG. 1 is a diagram illustrating a configuration of an imaging apparatus according to the present embodiment. The imaging device 1 of the present embodiment can be used, for example, when imaging is performed on a mobile phone or the like (portable information terminal). Therefore, as shown in FIG. 1, the imaging apparatus 1 of the present embodiment includes an imaging system (imaging package) 2, a first optical system (first optical element) 3, and a second optical system (second optical system). The optical element, the holding body, and the member 4). Hereinafter, each component will be described in detail.

  FIG. 2 is a cross-sectional view illustrating a configuration of a solid-state imaging unit configured by the imaging system 2 and the first optical system 3.

  As shown in FIG. 2, the imaging system 2 includes an imaging element unit 8 including a solid-state imaging element 5, an effective pixel region 6, and a translucent lid 7, a substrate 9, an electrode 10, and non-translucent light. The package 11 is provided.

  The solid-state image sensor 5 of the image sensor unit 8 is formed in a rectangular shape in plan view on a semiconductor substrate, and can receive light and convert it into an electrical signal. Specifically, the solid-state imaging device 5 can be configured using a CCD or a CMOS image sensor.

  The effective pixel area 6 of the image sensor unit 8 is an area that is formed in the solid-state image sensor 5 and actually receives light.

  The translucent lid 7 of the image sensor unit 8 is provided at a position facing the effective pixel region 6 in order to protect it from external moisture, dust (dust, chips), etc. Can be configured. The translucent lid 7 may be provided with a functional film on one side or both sides as necessary. Examples of the functional film include an AR coat film and an IR cut film. However, the functional film is not limited thereto, and is a conventionally known film that has some effect on the light incident on the solid-state imaging device 5. Also good.

  The substrate 9 is provided for mounting the image pickup device unit 8 having the above-described configuration, and can be configured using, for example, a ceramic or a glass epoxy substrate.

  The electrode 10 is formed on the surface of the substrate 9 opposite to the image sensor unit 8 mounting side, and draws out an electrical signal from the solid-state image sensor 5 to the outside. An electrical signal generated by the solid-state imaging device 5 is output to the electrode 10 through, for example, wire bonding.

  The substrate 9 ensures the strength of the image sensor unit 8. For this reason, if the image sensor unit 8 itself can obtain a desired strength, the substrate 9 need not be provided. When the substrate 9 is not provided, the electrode 10 can be formed on the surface of the solid-state imaging device 5 opposite to the side facing the translucent lid 7.

  A portion of the upper surface of the substrate 9 other than the region sealed with the translucent lid 7 and the solid-state imaging device 5 is sealed with the light-impermeable package 11. The light-impermeable package 11 prevents light that is not related to the imaging target, that is, unnecessary light from entering the solid-state imaging device 5, and can realize high imaging quality. Further, by providing the light-impermeable package 11, the subsequent assembly process can be performed without considering the entry of dust, so that the image sensor unit 8 can be easily handled and high reliability can be ensured. The light-impermeable package 11 can be made of a conventionally known light-shielding material such as a mold resin for a semiconductor package, and the light-shielding material other than the region sealed by the light-transmissive lid 7 and the solid-state imaging device 5 is made of this light-shielding material. What is necessary is just to seal.

  The surface formed by the translucent lid 7 and the non-translucent package 11 of the imaging system 2 having the above-described configuration (hereinafter, this surface is referred to as the upper surface of the imaging system 2) As shown in FIGS. 1 and 2, the first optical system 3 is formed.

  The first optical system 3 can be made of, for example, translucent glass or resin, and is formed on the upper surface of the imaging system 2 in the vicinity of the solid-state imaging device 5 as described later. The first optical system 3 has a role of mainly relaxing the incident angle of the light to the solid-state imaging device 5 and improving the light amount drop in the peripheral portion. It is good also as a structure which has a lens function. In this embodiment, a plano-convex lens is employed as the first optical system 3 as shown in FIGS. 1 and 2, but the present invention is not limited to this, and a plano-concave lens is employed. May be.

  When the upper surface of the imaging system 2 is viewed, the first optical system 3 has a circular shape as shown in FIG. Then, on the outer periphery of the circular first optical system 3, a structure 12a which is a characteristic configuration of the present invention provided for positioning the second optical system 4 and the imaging system 2 is provided. Is formed.

  The structure 12a is a convex structure protruding from the upper surface of the imaging system 2, and forms a concentric ring with the first optical system 3 on the outer periphery of the circular first optical system 3 shown in FIG. It is formed as follows. By making it concentric, not only can the mold be manufactured easily and with high precision, but also the structure 12a is missing without requiring a mold release agent or the like when releasing from the mold. The mold can be released without any trouble. Moreover, the deformation | transformation of the structure 12a can also be suppressed by setting it as a ring-shaped structure on the outer periphery, ie, a continuous structure. Furthermore, as shown in FIG. 2, the structure 12a has a tapered structure that gradually becomes thinner toward the protruding end. Such a tapered structure not only can further improve the releasability when the structure 12a is manufactured using a mold, but is provided in the second optical system 4 described later. The receiving portion 16 (FIG. 5) can be easily fitted.

  As shown in FIG. 2, the structure 12 a is configured integrally with the first optical system 3. If the structure 12a and the first optical system 3 are integrally configured in this way, handling and fixing to the upper surface of the imaging system 2 are facilitated, and the first structure 12a is deformed and the like. It can suppress that the positioning function with respect to the optical system 3 is impaired. If the structural body 12a and the first optical system 3 are not integrally formed and are formed separately from each other, when the structure 12a and the first optical system 3 are formed separately from each other, each of the structures 12a and the first optical system 3 may In addition to aligning the positions, it is necessary to align each other, and the process becomes complicated. On the other hand, if the structural body 12a and the first optical system 3 are integrally formed, it is not necessary to align each other, and the process can be simplified. However, the present invention is not limited to this, and the structure 12a and the first optical system 3 may be configured separately. In this case, it is preferable to form both on the upper surface of the imaging system 2 at the same time so that the number of forming steps does not increase. In the following description, a mode in which the structural body 12a and the first optical system 3 are integrally configured will be described.

  The material constituting the structural body 12a is the same as the material constituting the first optical system 3, and glass or resin can be used.

  In the case of a resin, a resin that is cured by ultraviolet rays or the like can be used. If resin is used, the structure 12a and the first optical system 3 can be directly formed on the upper surface of the imaging system 2. By forming directly, it is possible to simplify the process of position adjustment, fixing using an adhesive or the like. This forming method will be described later.

  On the other hand, in the case of glass, it is difficult to form directly on the upper surface of the imaging system 2. However, before being disposed on the upper surface of the imaging system 2, the structure 12a and the first optical system 3 are integrally configured (manufactured) in advance, and the position of the product and the effective pixel region 6 is adjusted. Thereafter, it may be fixed to the upper surface of the imaging system 2 using an adhesive or the like.

  Further, when a thermosetting resin is used among the resins, the imaging system 2 may be damaged if the resin is heated and cured on the upper surface of the imaging system 2. Therefore, when a material that may cause damage to the imaging system 2 is employed in this manner, the structure 12a and the first structure are arranged in advance before being disposed on the upper surface of the imaging system 2, as in the case of glass. The optical system 3 may be configured (manufactured) integrally.

  The integrated structure of the structure 12a and the first optical system 3 is not limited to the structure 12a and the structure having a thickness on the lower surface of the first optical system 3, as shown in FIG. A structure (not shown) in which a part of the first optical systems 3 are connected may be used.

  Further, in the present embodiment, the ring-shaped structure 12a has been described. However, the present invention is not limited to this, and as another shape, the ring-shaped structure 12a is not ring-shaped but is located at the same position as the structure 12a and mutually. It may be composed of a plurality of structures lined up at equal intervals. FIG. 4 shows a state of this structure when the upper surface of the imaging system 2 is viewed from an oblique direction. In FIG. 4, the first optical system 3 is provided at at least three locations at equal intervals in a concentric manner. Each structure 12a 'shown in FIG. 4 may be formed in a pin shape or a similar shape. In this case, a plane perpendicular to the central optical axis of the first optical system 3 and the imaging system 2 is formed, and as a result, the tilt of the optical system can be suppressed. In addition, the structure 12a has a hook shape at least at three or more concentric circles on the outer periphery of the first optical system 3, and the second optical system 4 can be mounted on the upper surface of the imaging system 2 without an adhesive. Also good.

  The second optical system 4 is composed of at least one lens 14 (second optical element) and a lens barrel 15 (holding body) that holds the lens 14, as shown in FIG. A plurality of lenses 14 are preferably disposed. The lens barrel 15 is provided with a receiving portion 16 formed so as to be fitted to the structure 12a. That is, the receiving part 16 has a concave structure.

  In the imaging apparatus 1 (FIG. 1) having the above configuration, an image is captured if the optical axes of the second optical system 4 (lens 14), the first optical system 3, and the imaging system 2 do not match. This causes vignetting, tilting, and one-sided blurring. Therefore, hereinafter, based on FIG. 6, when assembling the imaging system 2 and the first optical system 3, and the first optical system 3 in order to make these optical axes coincide or substantially coincide with each other. Position adjustment (positioning) performed at the time of assembly of the first optical system 4 and the second optical system 4 will be described along the manufacturing steps of the first optical system 3 and the second optical system 4.

  First, the imaging system 2 is placed on the XY stage 17 shown in FIG. Next, when the first optical system 3 and the structure 12a are formed using a resin, the first optical system 3 and the structure 12a are arranged on the upper surface of the imaging system 2 placed on the XY stage 17 with each other. An aligned mold 13 is placed. This mold is made of a transparent material. Therefore, it is recognized by the CCD camera 18 through the mold 13, followed by an alignment mark attached to the transparent mold 13, a structure provided on the outer periphery of the first optical system 3 or the outer periphery of the first optical system 3. The body 12a is recognized, and the position is adjusted by the XY stage 17 so that the center of the effective pixel region 6 and the center of the mold are aligned. Thereby, the first optical system 3 and the structure 12a are aligned with high accuracy with respect to the effective pixel region 6 of the imaging system 2.

  In such a state of alignment, for example, a mold is filled with an ultraviolet curable resin. Then, ultraviolet rays are irradiated from the outside of the transparent mold to cure the filled resin. Thereby, the first optical system 3 and the structural body 12a can be directly formed on the upper surface of the imaging system 2.

  Next, the second optical system 4 is mounted. If the effective pixel region 6 of the imaging system 2 is aligned with the first optical system 3 and the structure 12a with high accuracy, the receiving portion 16 of the second optical system 4 is fitted into the structure 12a. By combining, the effective pixel region 6, the first optical system 3, and the second optical system 4 can be assembled with high accuracy. Here, in the lens 14 and the lens barrel 15 constituting the second optical system 4, the optical axis of the lens 14 and the optical axis of the first optical system 3 are matched or substantially matched in advance. The receiving portion 16 of the lens barrel 15 is also formed so that these optical axes coincide with each other or substantially coincide with each other. The receiving part 16 may be formed by molding the lens barrel 15 with a mold and providing the mold with the shape of the receiving part 16. Thereby, the lens barrel 15 and the receiving part 16 can be formed easily and accurately.

  As described above, the imaging apparatus 1 according to the present embodiment includes the imaging system 2 in which the solid-state imaging element 5 is mounted on the bottom surface and the first optical system configured to form an optical image on the solid-state imaging element 5. The first optical system 3 has a flat surface on one surface, and is mounted on the upper surface of the imaging system 2 by fixing the flat surface and the upper surface of the imaging system 2. In the first optical system 3, the second optical system 4 and the first optical system 3 disposed on the other surface side are positioned outside the optically effective area on the other surface. A structure 12a used at the time is provided. Accordingly, it is possible to provide an imaging apparatus in which an optical system including a lens and an imaging element are easily and accurately positioned using a simple structure. That is, in the configuration of the imaging apparatus 1, the first optical system 3 and the structure 12 a are directly fixed to the upper surface of the imaging system 2. Therefore, the structure 12a that functions as a positioning portion when the second optical system 4 is mounted can be formed with the same accuracy as the first optical system 3, and the structure 12a having an accurate shape is realized. Even if the structure has a complicated structure that is generally employed in an optical element, it can be realized accurately. Therefore, the positioning function can be sufficiently achieved, and a desired imaging quality can be realized.

  In addition, since the first optical system 3 is directly fixed to the upper surface of the imaging system 2, the imaging device is smaller than the configuration in which the optical element is mounted by interposing a member on which a positioning portion is formed. Therefore, it is possible to provide an imaging apparatus that realizes high-performance imaging quality while being compact.

  Moreover, according to this embodiment, since the structure 12a and the 1st optical system 3 are comprised integrally, the structure and the 1st optical system are comprised separately. Compared to the above, handling can be easily performed when the imaging system 2 is attached to the upper surface (at the time of fixing). That is, when the structure and the first optical element are formed separately, each is aligned with the image sensor when attached to the upper surface of the image pickup system 2 (at the time of fixing). In addition, since the mutual alignment is required, the process becomes complicated. On the other hand, if the structure and the first optical element are integrated, it is not necessary to align each other, and the process can be simplified.

  Moreover, according to said structure, compared with the case where a structure and a 1st optical system are comprised by the different body, a fixed strength can be raised. That is, when the structure and the first optical system are configured separately, each is independently fixed to the upper surface of the imaging system 2 when attached to the upper surface of the imaging system 2 (at the time of fixing). Therefore, when the structure has a relatively small size, there is a possibility that the structure is separated from the upper surface of the imaging system 2 or is displaced due to some external factor. On the other hand, if the structure 12a and the first optical system 3 are integrated as in the present embodiment, the structure 12a has the first size even if the structure 12a has a small size. This optical element is also fixed to the upper surface of the imaging system 2. For this reason, it is possible to increase the fixing strength and perform highly reliable positioning.

In other words, the imaging apparatus according to the present invention is characterized by the following configuration.
That is, the imaging apparatus according to the present invention is provided with a solid-state imaging device, a package having the solid-state imaging device, an optical element disposed on the upper surface of the package so as to face the solid-state imaging element, and an outer periphery of the optical element. In other words, it is characterized by having a structure. In the above configuration, the structure is preferably formed integrally with the optical element. In the above structure, the optical element and the structure are preferably formed on the upper surface of the package. In the above configuration, the structures are preferably formed concentrically on the outer periphery of the optical element, but the structures may be provided at at least three locations at equal intervals. In the above configuration, the structure body preferably has a convex shape.

  In the present embodiment, a portable information terminal such as a mobile phone has been described as an example. However, the present invention is not limited to this and can be applied to any imaging device.

[Embodiment 2]
Another embodiment according to the present invention will be described below with reference to FIGS. In this embodiment, in order to explain differences from the first embodiment, members having the same functions as the members described in the first embodiment are denoted by the same member numbers for convenience of explanation. The description is omitted.

  FIG. 7 is a cross-sectional view illustrating a configuration of a solid-state imaging unit that is a part of the imaging apparatus of the present embodiment, and corresponds to the configuration illustrated in FIG. 2 of the first embodiment. The solid-state imaging unit illustrated in FIG. 7 includes a structure 12b instead of the solid-state imaging unit structure 12a described with reference to FIG. 2 of the first embodiment.

  The structure 12b has a concave structure as shown in FIG. The structure 12b is concentric with the first optical system 3 at the outer periphery of the circular first optical system 3 shown in FIG. 7 in the same manner as the structure 12a shown in FIG. It is formed so as to constitute a ring. Moreover, as shown in FIG. 7, the structure 12b has a tapered structure in which the concave structure is gradually narrowed from the opening toward the tip. By adopting such a tapered structure, the mold releasability can be further improved when the structure 12b is manufactured using a mold.

  By the way, in above-mentioned Embodiment 1, the receiving part 16 formed so that it might fit with the structure 12a (FIG. 2) is provided in the lens-barrel 15 (FIG. 5). In contrast, in the second optical system 4 ′ of the present embodiment, the end of the lens barrel 15 ′ is fitted with the concave structure 12 b. In other words, the present embodiment is configured such that the end of the lens barrel 15 is not formed with a receiving portion having a convex structure, and the end of the lens barrel 15 is directly fitted to the concave structure 12b. .

  A conventional imaging device (hereinafter referred to as a camera module) is assumed to be a digital camera. However, as described above, a recent camera module is assumed to be mounted on a mobile terminal such as a mobile phone. It is said. When the camera module is mounted on a portable terminal, the camera module is required to be thin and small, and it is necessary to reduce the thickness and size of the optical system and the solid-state imaging device constituting the camera module. . Therefore, the imaging apparatus according to the present invention has a configuration in which an optical system having a lens function is provided on the upper surface of the imaging system so that the optical performance is not deteriorated even if the number of lenses and the lens thickness are reduced. In addition, the translucent lid 7 has a size that is approximately the same size as the effective pixel region and maintains performance.

  As a result, although the optical system and the solid-state imaging device constituting the camera module can be thinned and miniaturized, it is difficult to assemble them. For example, there is no space for providing a mechanism for adjusting the optical system. Therefore, in this embodiment, when the side surface of the lens barrel 15 holding the lens constituting the optical system is thin, and the structure 12 has a convex structure, the concave shape for fitting to the side surface of the lens barrel 15 is used. There are cases where a structure cannot be provided. Therefore, if the structure 12 has a concave structure as shown in FIG. 7, the convex structure for fitting to the side surface of the lens barrel 15 can be directly fitted without being formed. This state is shown in FIG.

  Further, as in the present embodiment, the second optical system 4 ′ can be assembled without adjustment by forming the concave structure 12 b. Therefore, as compared with the first embodiment described above, it is possible to realize cost reduction in the structure and cost reduction by simple assembly.

  However, the present invention is not limited to this, and a convex structure 19 may be formed at the end of the lens barrel 15 of the second optical system 4 'as shown in FIG. And the convex structure 19 can be made into the taper structure gradually narrowed toward the protrusion end so that it may fit in the concave structure 12b of a taper structure.

  Moreover, the structure 12b may be a concentric continuous structure, or may be a structure formed in at least three locations at regular intervals. Other shapes and manufacturing processes can be the same as those in the first embodiment.

[Embodiment 3]
Another embodiment according to the present invention will be described below with reference to FIGS. In this embodiment, in order to explain differences from the first embodiment, members having the same functions as the members described in the first embodiment are denoted by the same member numbers for convenience of explanation. The description is omitted.

  FIG. 10 is a cross-sectional view showing a configuration of an imaging system 2 ′ that is a part of the imaging apparatus of the present embodiment, and corresponds to the configuration shown in FIG. 2 of the first embodiment. An imaging system 2 ′ shown in FIG. 10 includes an imaging element protection member 20 instead of the opaque package 11 described based on FIG. 2 of the first embodiment. Hereinafter, this embodiment will be described in detail.

  As shown in FIG. 10, the imaging system 2 ′ provided in the imaging apparatus according to the present embodiment includes a solid-state imaging device 5, an effective pixel region 6, a translucent lid 7, a substrate 9, an electrode 10, and The element protection member 20 is included. In this imaging system 2 ′, the element protection member 20 is molded of a resin material, holds the light-transmitting lid portion 7, covers the solid-state imaging element 5, and protects it from dust and scratches. Irrelevant light, that is, unnecessary light, is prevented from entering the solid-state imaging device 5.

  The element protection member 20 is fixed to the substrate 9 with an adhesive or the like after the translucent lid 7 is attached. Here, the translucent lid 7 is configured to be fixed to the same side as the solid-state imaging element 5 in order to be fixed to the element protection member 20, but may be configured to be fixed to the opposite side to the solid-state imaging element 5. Absent. For example, if dust or dust falls from a cross section around the translucent lid portion 7, it can be prevented by adopting a configuration that is fixed to the side opposite to the solid-state imaging device 5. In any configuration, the same configuration as that in FIG. 2 can be obtained by forming the first optical element and the structure on the upper surface of the imaging system.

  The structure 12a and the first optical system 3 only need to be provided on the upper surface of the translucent lid 7, as shown in FIG. However, the present invention is not limited to this, and the structure 12a may be partially disposed on the upper surface of the element protection member 20 as shown in FIG. Although not shown, the structural body 12 a may be disposed on the upper surface of the element protection member 20, and only the first optical system 3 may be disposed on the upper surface of the translucent lid portion 7.

[Embodiment 4]
Another embodiment according to the present invention will be described below with reference to FIG. In this embodiment, in order to explain differences from the first embodiment, members having the same functions as the members described in the first embodiment are denoted by the same member numbers for convenience of explanation. The description is omitted.

  FIG. 12 is a cross-sectional view showing the configuration of the imaging system 2 and the first optical system 3 ′ which are a part of the imaging apparatus of the present embodiment, and the configuration shown in FIG. 2 of the first embodiment. It corresponds to. The first optical system 3 ′ shown in FIG. 12 will be described in detail below.

  The first optical system 3 of the first embodiment has a function of relaxing the incident angle to the solid-state imaging device 5 and improving the light amount drop at the peripheral part, or having a lens function. The first optical system 3 ′ employed in the embodiment reduces light reflected from the translucent lid portion 7 provided in the translucent package 11 due to light incident on the solid-state imaging device 5. The surface of the translucent lid 7 is provided with a plurality of sharp structures (protruding structures) for suppressing reflection.

  In general, a configuration in which an AR coat layer is provided on the surface of the translucent lid portion to prevent reflection is employed. However, the present invention is characterized in that the structure 12 for positioning the second optical system 4 (specifically, the lens 14) is formed, and the step of forming the structure on the surface of the opaque package. Need. As a result, the cost increased and became a problem. Therefore, here, the AR coating layer is not formed, and the structure 12 is formed, and at the same time, a plurality of sharp structures that suppress reflection are formed, so that an imaging device can be obtained without increasing the cost.

  The formation of a plurality of sharp structures is the same as the formation of the first optical system 3 shown in the first embodiment, and a structure for forming a plurality of sharp structures on the mold is provided, and a structure using an ultraviolet curable resin is provided. It can be formed simultaneously with the body 12.

  In FIG. 12, a plurality of sharp structures are directly fixed to the translucent lid portion 7, but a configuration in which a plurality of sharp structures are formed thereon with a slight thickness may be employed. By adopting such a configuration, for example, an ultraviolet curable resin can be poured uniformly, and a plurality of sharp structures can be formed without any loss.

  As the size of the plurality of sharp structures, for example, the reflectance is less than 1% in the wavelength range (for example, 300 to 800 nm) required for imaging by setting the pitch to 250 nm and the aspect ratio to 1 or more. Can do.

  The first optical system 3 may have a curved surface shape and a plurality of sharp structures on the surface. In general, the surface of the lens is provided with an AR coating layer to prevent reflection, but the step of forming the AR coating layer is omitted, and a curved surface shape and a sharp structure for suppressing reflection are simultaneously formed on the surface. be able to. The mold at this time can be formed by first forming a mold for forming a curved surface shape, and then additionally providing a mold for forming a plurality of sharp structures.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  The image pickup apparatus of the present invention has a structure in which the first optical element is directly fixed to the upper surface of the image pickup package, and the second optical element that guides light toward the first optical element is attached to the image pickup package. Since the body is directly fixed to the upper surface of the imaging package, an imaging apparatus in which an optical system including a lens and an imaging element are easily and accurately positioned using a simple structure is provided. be able to.

  Therefore, the present invention can be applied to any device equipped with an image pickup device such as a digital camera or a mobile phone having an image pickup function.

It is sectional drawing which showed the structure of one Embodiment of the imaging device which concerns on this invention. It is sectional drawing which showed one structure of the principal part of the imaging device shown in FIG. FIG. 3 is a perspective view illustrating one configuration of a main part of the imaging device illustrated in FIG. 1, and is the same configuration as the configuration illustrated in FIG. 2. FIG. 4 is a perspective view illustrating one configuration of a main part of the imaging apparatus illustrated in FIG. 1, and is a modification example of the configuration illustrated in FIGS. It is sectional drawing which showed one structure of the principal part of the imaging device shown in FIG. It is the figure which showed the step which manufactures one structure of the principal part of the imaging device shown in FIG. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention. It is sectional drawing which showed other embodiment of the principal part of the imaging device which concerns on this invention.

Explanation of symbols

1 Imaging device 2 Imaging system (imaging package)
3 First optical system (first optical element)
4 Second optical system (second optical element, member)
5 Solid-state imaging device (imaging device)
6 Effective pixel area 7 Translucent lid 8 Imaging element unit 9 Substrate 10 Electrode 11 Translucent package 12a Structure (convex structure)
12b Structure (concave structure)
13 Mold 14 Lens 15 Lens barrel 16 Receiving part (concave structure)
17 XY stage 18 CCD camera 19 Convex structure

Claims (21)

An image sensor;
An imaging package configured to be able to arrange the imaging device on the bottom;
A first optical element that is provided on the upper surface of the imaging package and guides light toward the imaging element;
A second optical element that guides light toward the first optical element;
Provided on the upper surface of the imaging package, and includes a structure for aligning the first optical element and the second optical element,
A portion of the top surface of the imaging package is
Formed by a non-transparent member for preventing light from entering the image sensor from other than the first optical element, provided at a position that does not block light transmitted through the first optical element,
The structure and the first optical element are made of the same material,
The structure is located on an outer periphery of the first optical element ;
Surface on the side opposed to the upper surface of the imaging package in said structure, an imaging apparatus to which the entire area is characterized in that it is fixed to the upper surface of the opaque member.   The imaging apparatus according to claim 1, wherein the structure is fixed only on the light-impermeable member. Furthermore, a holding body for holding the second optical element is provided,
The imaging apparatus according to claim 1, wherein the holding body is fixed to the imaging package via the structure.   4. The structure according to claim 1, wherein the structure is a structure for determining a relative position of the first optical element, the second optical element, and the imaging element at a desired position. The imaging device according to any one of the above.   The imaging apparatus according to any one of claims 1 to 4, wherein the structure and the first optical element are integrally formed.   The imaging apparatus according to any one of claims 1 to 4, wherein the structure and the first optical element are separate bodies but are formed at the same time. The imaging package has a lid member made of a translucent material on the imaging element,
The opaque member is provided around the lid member,
The imaging apparatus according to claim 1, wherein the upper surface of the imaging package is formed by the light-impermeable member and the lid member. The first optical element is a plano-concave lens or a plano-convex lens whose surface facing the top surface of the imaging package is a plane,
The imaging apparatus according to claim 1, wherein the plane is fixed to an upper surface of the imaging package. The first optical element has a plurality of protruding structures for reducing light reflected from the lid member by light rays incident on the imaging element, which protrude upward from the upper surface of the imaging package.
The imaging apparatus according to claim 7 , wherein the protruding structure is a tapered structure. The structure is a convex structure,
10. The imaging apparatus according to claim 1, wherein the second optical element has a concave structure that meshes with the convex structure. 11. The structure has a concave structure,
10. The imaging apparatus according to claim 1, wherein the second optical element is engaged with the concave structure. 11.   The imaging apparatus according to claim 10, wherein the convex structure is a tapered structure.   The imaging device according to claim 10, wherein the concave structure is a tapered structure.   The imaging device according to any one of claims 1 to 13, wherein the structure is configured in a ring shape surrounding an outer periphery of the first optical element on an upper surface of the imaging package.   The imaging device according to claim 1, wherein the structure is intermittently disposed along an outer periphery of the first optical element on an upper surface of the imaging package. .   The imaging apparatus according to claim 1, wherein the second optical element has a plurality of lenses. An image sensor;
An imaging package configured to be able to arrange the imaging device on the bottom;
A first optical element that guides light toward the imaging element;
A protrusion provided on the upper surface of the imaging package and used when aligning the first optical element and a member disposed on the opposite side of the upper surface of the first optical element, or And a structure in which a depression is formed,
A portion of the top surface of the imaging package is
Formed by a non-transparent member for preventing light from entering the image sensor from other than the first optical element, provided at a position that does not block light transmitted through the first optical element,
The structure and the first optical element are made of the same material,
The structure is located on an outer periphery of the first optical element ;
Surface on the side opposed to the upper surface of the imaging package in said structure, an imaging apparatus to which the entire area is characterized in that it is fixed to the upper surface of the opaque member.   The imaging device according to claim 17, wherein the structure is fixed only on the light-impermeable member.   A portable information terminal comprising the imaging device according to any one of claims 1 to 18.   An imaging apparatus comprising the imaging apparatus according to claim 1. A manufacturing method for manufacturing an imaging device having a first optical element that guides light to the imaging element on an upper surface of an imaging package having the imaging element mounted on the bottom,
A part of the upper surface of the imaging package is impermeable to prevent light from entering the imaging element from other than the first optical element provided at a position that does not block the light transmitted through the first optical element. It is formed by a light member,
A mold in which a predetermined space is formed on the upper surface when the imaging package is disposed, and the predetermined space has a shape corresponding to the first optical element, a first optical element, A structure used for aligning the first optical element and the second optical element when the second optical element for guiding light toward the first optical element is attached to the upper surface of the imaging package. A filling step of filling the space with an uncured liquid material after placing the corresponding mold in a corresponding shape;
A curing step of curing the liquid material filled in the filling step, and in the filling step, a portion having a shape corresponding to the structure of the mold is the light-impermeable on the upper surface of the imaging package. so as to be located on surface of the member, the imaging device manufacturing method characterized by placing the mold.

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