JP2008289096A - Solid-state imaging module, imaging apparatus, imaging equipment, and method of manufacturing solid-state imaging module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging module capable of highly accurately and easily constituting an imaging apparatus, to provide the imaging apparatus to which such a solid-state imaging module is applied, and to provide a method of manufacturing such a solid-state imaging module. <P>SOLUTION: The solid-state imaging module 1 includes a solid-state imaging element 11 including a photo-detection unit 11r wherein a pixel for photoelectric-converting incident light into an electric signal is disposed, and a translucent protection unit 13 protecting the photo-detection section 11r. The translucent protection unit 13 includes a light guide section 13t guiding the incident light to the photo-detection unit 11r, a frame-like abutting section 13b which is disposed around the light guide section 13t and abutted to a surface of the solid-state imaging element 11 around the photo-detection unit 11r, and a light guide supporting section 13w which is coupled with the frame-like abutting section 13b and supports the light guide section 13t. The frame-like abutting section 13b (translucent protection unit 13) is positioned with respect to the photo-detection unit 11r by a positioning mark 11m provided around the photo-detection unit 11r. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solid-state imaging module having a light-transmitting protection unit that protects a light-receiving unit of a solid-state imaging device, an imaging device including such a solid-state imaging module, and a method for manufacturing such a solid-state imaging module.

  In recent years, portable electronic devices such as mobile phones have been actively reduced in size and thickness from the viewpoint of improving portability. In addition, the demand for performance is very high. For example, camera modules built into mobile phones, etc. have limited space to be mounted, so the demand for miniaturization and thinning is extremely high, and the same performance as a digital still camera is required at the same time. Yes.

  In order to meet such demands, it is possible to increase the number of pixels by reducing the arrangement pitch of the sensor pixels constituting the light receiving unit of the solid-state image sensor, and to obtain a solid from the incident light incident surface by using a high refractive index lens group. The optical path length to the light receiving part of the image sensor is shortened.

  However, in order to realize higher pixels and shorter optical path length, etc., extremely high accuracy is required for the coupling (attachment) of the imaging lens optical system and the solid-state imaging device. This is a major factor in the decline and cost increase.

In order to cope with such a problem, as a conventional example, for example, a leg portion is provided on a lens constituting an imaging lens optical system, and the leg portion is brought into direct contact with the surface of the solid-state imaging device so that the lens in the optical axis direction of the lens. A method and an imaging apparatus that simplify the adjustment have been proposed (see, for example, Patent Document 1 and Patent Document 2).
JP 2002-320149 A JP 2003-46825 A

  However, the imaging device according to the conventional example described above has the following problems in attaching the solid-state imaging device and the lens.

  That is, in attaching a lens to a solid-state image sensor arranged in a direction perpendicular to the optical axis of the lens, positioning of the lens frame (lens lens frame) to which the lens is attached and the wiring board on which the solid-state image sensor is mounted is For example, an optical sensor provided in an automatic assembly machine is used.

  Therefore, the assembly error between the lens and the solid-state image sensor is greatly affected by the assembly error between the lens and the lens barrel and the assembly error between the solid-state image sensor and the wiring board.

  Further, a combination of a light shielding plate, a diaphragm, and a lens barrel prevents unwanted light from entering and condenses only desired incident light on the light receiving surface of the solid-state imaging device. However, when the assembly error of the light shielding plate, the stop, and the lens barrel is large, there is a high possibility that unexpected unnecessary light is incident. Even if the light shielding plate, diaphragm, lens, and lens barrel are designed so that unnecessary light does not enter using an analysis tool, etc., if the shape becomes complicated, unexpected unwanted light, such as the lens barrel In some cases, incident light is reflected on the inner surface and becomes unnecessary light. Therefore, in order to solve such unexpected unnecessary light problems, additional steps such as correction and re-trialing are required, which may cause a delay in development time and an increase in development man-hours. is there.

  The present invention has been made in view of such circumstances, and a light guide unit that guides incident light to the light receiving unit and a surface of the solid-state imaging device that is disposed around the light guide unit and around the light receiving unit. An imaging lens optical system by positioning a translucent protective portion that protects the light receiving portion of the solid-state imaging device on the solid-state imaging device with a positioning mark provided around the light-receiving portion. A solid-state imaging module capable of easily and accurately constructing an imaging apparatus by positioning a translucent protective portion having a simple structure with a small assembly error with respect to a light receiving portion of a solid-state imaging device with high accuracy. For the purpose.

  Further, the present invention holds a lens group including a solid-state imaging module having a light-receiving unit, a translucent protection unit that protects the light-receiving unit, and a plurality of lenses, and is translucent. An imaging apparatus including a lens holding unit in contact with a protection unit, wherein the solid-state imaging module is configured by the solid-state imaging module according to the present invention, and the lens group is attached to the solid-state imaging module with high accuracy and easily. For other purposes.

  In addition, another object of the present invention is to provide an imaging device that can be miniaturized with high accuracy and high productivity by using an imaging device equipped with the imaging device according to the present invention.

  The present invention also relates to a method for manufacturing a solid-state imaging module, comprising: a solid-state imaging device having a light receiving portion; and a translucent protecting portion that has a light guiding portion that guides incident light to the light receiving portion and protects the light receiving portion. A step of positioning the optical axis of the light guide unit at the center of the light receiving unit based on the positioning mark formed on the solid state image sensor, and attaching the translucent protection unit to the solid image sensor; And a step of forming a light-shielding portion by applying a light-shielding film, so that the translucent protection portion (light guide portion) can be positioned with high accuracy and easily with respect to the light-receiving portion. Another object of the present invention is to provide a method for manufacturing a solid-state imaging module that can easily manufacture a solid-state imaging module that can easily form an imaging apparatus that does not generate unnecessary light.

  A solid-state imaging module according to the present invention is a solid-state imaging module including a solid-state imaging device having a light receiving unit that photoelectrically converts incident light into an electrical signal, and a translucent protection unit that protects the light receiving unit. The optical protection unit includes a light guide unit that guides incident light to the light receiving unit, and a frame-shaped contact that is disposed around the light guide unit and is in contact with the surface of the solid-state imaging device around the light receiving unit. And the translucent protection part is positioned by positioning marks provided around the light receiving part.

  With this configuration, it is possible to easily and accurately position the translucent protective portion having a simple structure with little assembling error with the imaging lens optical system to the light receiving portion of the solid-state imaging device. It can be set as the solid-state imaging module which can comprise.

  Further, in the solid-state imaging module according to the present invention, the positioning mark is arranged at a position where the optical axis of the light guide unit is aligned with the center of the light receiving unit.

  With this configuration, since the translucent protection part can be positioned with high accuracy on the light receiving part, it is possible to receive incident light from the imaging target with high precision and efficiency.

  In the solid-state imaging module according to the present invention, the positioning mark is located at a position corresponding to the frame-shaped contact portion or a light guide support portion that is coupled to the frame-shaped contact portion and supports the light guide portion. It is arranged.

  With this configuration, the frame-shaped contact portion can be easily positioned, and the position corresponding to the light guide support portion that is closer to the light guide portion than the outer periphery of the translucent protection portion (light guide). When the positioning mark is arranged at a position close to the optical axis of the optical part, the optical axis of the light guide part and the center of the light receiving part can be positioned with higher accuracy.

  In the solid-state imaging module according to the present invention, an outward surface constituting a side on which incident light of the light guide support portion is incident is a plane intersecting with the optical axis of the light guide portion.

  With this configuration, since the outward surface can be used as a reference surface in the assembly process, a solid-state imaging module with high assembly accuracy can be obtained.

  In the solid-state imaging module according to the present invention, the outward surface includes a light shielding portion that shields incident light.

  With this configuration, it is possible to shield unnecessary incident light to a region other than the light guide portion with high accuracy.

  In the solid-state imaging module according to the present invention, the surface of the light guide unit that faces the light receiving unit is a plane that intersects the optical axis of the light guide unit.

  With this configuration, incident light can be accurately imaged on the light receiving unit.

  In the solid-state imaging module according to the present invention, an optical filter is provided on the plane.

  With this configuration, the optical filter can be easily attached with high accuracy.

  In the solid-state imaging module according to the present invention, the light guide section is configured such that a side on which incident light is incident is convex, and the incident light is condensed on the light receiving section.

  With this configuration, it is possible to reliably prevent unnecessary light from entering with a simple structure, and to reduce the optical path length by condensing incident light to the light receiving section with high accuracy, thereby reducing the size of the solid-state imaging module. It becomes possible to plan.

  In the solid-state imaging module according to the present invention, the contact surface of the frame-shaped contact portion that contacts the solid-state imaging element is configured to be perpendicular to the optical axis of the light guide portion. To do.

  With this configuration, it is possible to attach the translucent protection unit to the individual image sensor without adjusting the optical axis tilt.

  In the solid-state imaging module according to the present invention, the solid-state imaging element is mounted on a wiring board, and includes a resin sealing portion formed from the translucent protection portion to the wiring substrate. .

  With this configuration, the translucent protection part can be fixed with the resin sealing part, and the mounting strength of the translucent protection part with respect to the solid-state imaging device can be secured and the reliability can be improved.

  In addition, an imaging apparatus according to the present invention includes a solid-state imaging module including a solid-state imaging device having a light-receiving unit that photoelectrically converts incident light into an electrical signal, a translucent protection unit that protects the light-receiving unit, and a plurality of An imaging apparatus comprising a lens holding unit that holds a lens group composed of lenses and is in contact with the translucent protection unit, wherein the solid-state imaging module is any one of claims 1 to 9. It is a solid-state imaging module as described in above.

  With this configuration, it is possible to provide an imaging apparatus that can easily and accurately attach the lens group constituting the imaging lens optical system to the solid-state imaging module.

  In the image pickup apparatus according to the present invention, the positioning mark is arranged at a position where the optical axis of the lens group and the optical axis of the light guide unit coincide with the center of the light receiving unit.

  With this configuration, the optical axis of the lens group can be easily and accurately aligned with the optical axis of the light guide unit.

  In the imaging device according to the present invention, the lens holding portion is in contact with the light shielding portion.

  With this configuration, it is possible to provide an imaging apparatus that can reliably prevent unnecessary light from entering the light receiving unit.

  In the imaging device according to the present invention, the lens holding unit may be configured so that incident light incident on the light receiving unit through the lens group and the light guide unit forms an image on the light receiving unit. A distance from the light guide is defined.

  With this configuration, it is not necessary to adjust the position of the lens group and the solid-state imaging module in the optical axis direction, so that an imaging apparatus that can be manufactured with high accuracy and easily can be obtained.

  An imaging device according to the present invention is an imaging device including an imaging device including a solid-state imaging module having a solid-state imaging device and a lens holding unit that holds a lens group, and the imaging device is included in the invention. It is the imaging device which concerns.

  With this configuration, it is possible to provide an imaging device that includes a high-precision imaging optical system and can be downsized with high productivity.

  The solid-state imaging module manufacturing method according to the present invention includes a solid-state imaging device having a light receiving unit that photoelectrically converts incident light into an electrical signal, and a light guide unit that guides incident light to the light receiving unit. A solid-state imaging module manufacturing method comprising a translucent protection part for protecting a part, wherein the optical axis of the light guide part is positioned at the center of the light receiving part based on a positioning mark formed on the solid-state imaging element. A protective part attaching step for attaching the translucent protective part to the solid-state image sensor, a light-shielding part forming step for forming a light-shielding part by attaching a light-shielding film around the light guide part, and the solid-state image sensor. And a resin sealing step of forming a resin sealing portion that protects the solid-state imaging element from the translucent protection portion to the wiring substrate.

  With this configuration, the translucent protection portion (light guide portion) can be positioned with high accuracy and easily with respect to the light receiving portion, and the light shielding portion can be easily formed. It becomes possible to easily manufacture a solid-state imaging module that can constitute the apparatus.

  The solid-state imaging module according to the present invention includes a solid-state imaging device having a light-receiving unit that photoelectrically converts incident light into an electrical signal, and a translucent protection unit that protects the light-receiving unit. Since the frame-shaped contact portion that is in contact with the surface of the solid-state imaging device is provided around the portion, and the frame-shaped contact portion is positioned by the positioning marks provided around the light receiving portion, the imaging lens optical system It is possible to position the translucent protective part with a simple structure with a small assembly error to the light receiving part of the solid-state image sensor with high accuracy and easily, and it is possible to construct an imaging device with high precision and easily The effect is that it can be a module.

  In addition, according to the imaging apparatus of the present invention, the solid-state imaging module includes a solid-state imaging module and a lens holding unit that holds a lens group including a plurality of lenses and is in contact with the translucent protection unit. Is constituted by the solid-state imaging module according to the present invention, so that it is possible to provide an imaging apparatus capable of easily attaching the lens group (imaging lens optical system) to the solid-state imaging module with high accuracy.

  Moreover, according to the imaging device according to the present invention, since the imaging device according to the present invention is mounted, the imaging device can be provided with high productivity by providing a high-precision imaging optical system.

  According to the method for manufacturing a solid-state imaging module according to the present invention, a solid-state imaging device having a light receiving unit that photoelectrically converts incident light into an electrical signal, and a light receiving unit that has a light guide unit that guides incident light to the light receiving unit. When manufacturing a solid-state imaging module having a light-transmitting protective part to protect, the optical axis of the light guide part is positioned at the center of the light-receiving part based on the positioning mark on the surface of the solid-state imaging element, and the light-transmitting protective part is solid-state imaged. The light-shielding film is attached to the element and a light-shielding film is pasted around the light-guiding unit to form the light-shielding unit, so that the translucent protective part (light-guiding unit) can be easily and accurately positioned with respect to the light-receiving unit. Since the light-shielding portion can be easily formed, it is possible to easily manufacture a solid-state imaging module that can constitute an imaging device that does not generate unnecessary light with high accuracy.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
A solid-state imaging module according to Embodiment 1 of the present invention will be described with reference to FIGS.

  FIG. 1 is a perspective view showing the entire solid-state imaging module according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view showing the translucent protective part disassembled except for the resin sealing part of the solid-state imaging module shown in FIG. FIG. 3 is a cross-sectional view showing a cross section of the main part of the solid-state imaging module shown in FIG.

  The solid-state imaging module 1 according to the present embodiment includes a solid-state imaging element 11 having a light-receiving unit 11r in which pixels (not shown) that photoelectrically convert incident light into electrical signals and a light-transmitting property that protects the light-receiving unit 11r. And a protection unit 13.

  The solid-state imaging device 11 is constituted by, for example, a CMOS (Complementary Metal Oxide Semiconductor) type image sensor, a CCD (Charge Coupled Device) image sensor, or the like. Further, a circuit unit (not shown) is arranged around the light receiving unit 11r, and an element pad 11p as a connection terminal to the outside is arranged at the periphery.

  The translucent protection unit 13 is disposed around the light guide unit 13t and guides incident light to the light receiving unit 11r, and is in contact with the surface of the solid-state imaging device 11 around the light receiving unit 11r. And a frame-like contact portion 13b.

  Between the light guide part 13t and the frame-like contact part 13b, a light guide support part 13w that is coupled to the frame-like contact part 13b and supports the light guide part 13t is disposed. That is, the frame-like contact portion 13b is formed in a leg shape with respect to the light guide support portion 13w. Therefore, it is possible to eliminate the mechanical influence from the light guide portion 13t on the surface of the light receiving portion 11r.

  The frame-like contact portion 13b (translucent protection portion 13) is positioned relative to the light receiving portion 11r by positioning marks 11m provided around the light receiving portion 11r.

  That is, the positioning mark 11 m acts as a reference when the translucent protection part 13 is attached to the surface of the solid-state imaging element 11. The positioning mark 11m can be formed on the surface of the solid-state imaging device 11 by appropriately patterning with, for example, a metal, an oxide film, or a nitride film.

  The positioning of the translucent protection part 13 with respect to the light receiving part 11r is, for example, any of the diagonal lines formed by the ends of the translucent protection part 13 (frame-shaped contact part 13b) (for example, the four corners of the translucent protection part 13). When two positioning marks 11m are formed corresponding to one, two corners on the diagonal line of the translucent protection part 13.

  Alternatively, when four positioning marks 11 m are formed corresponding to both diagonal lines formed by the four corners of the translucent protection part 13, four corners on the diagonal line of the translucent protection part 13. ) Is aligned with the positioning mark 11m, and is aligned at the positioning position AP. By positioning the translucent protection part 13 and the light receiving part 11r, the optical axis Lax1 of the light guide part 13t is made to coincide with the center of the light receiving part 11r (light receiving surface).

  That is, the positioning mark 11m is disposed at a position where the optical axis Lax1 of the light guide portion 13t is aligned with the center of the light receiving portion 11r. Therefore, the translucent protection unit 13 is placed on the light receiving unit 11r with high accuracy in the direction perpendicular to the optical axis Lax1 based on the outer shape of the translucent protection unit 13 (that is, based on the outer shape of the translucent protection unit 13). Since it can be positioned easily, it is possible to obtain a solid-state imaging module 1 that receives (images) incident light from an imaging target with high accuracy and efficiency by the light receiving unit 11r.

  The contact surface 13bs of the frame-like contact portion 13b that contacts the surface of the solid-state imaging device 11 is configured to be perpendicular to the optical axis Lax1 of the light guide portion 13t. Therefore, it is possible to attach the translucent protection part 13 to the individual image sensor 11 without adjusting the optical axis tilt. The contact surface 13bs (translucent protection portion 13) is attached and fixed to the surface of the solid-state imaging device 11 by applying an appropriate adhesive (for example, an epoxy-based adhesive) to the contact surface 13bs in advance. After positioning the translucent protection part 13 to AP, it adheres by pressing with an appropriate pressure.

  Further, when the adhesive adheres to the light receiving portion 11r by pressing, for example, an adhesive reservoir portion 13c is provided on a part or the entire periphery of the frame-like contact portion 13b, and the translucent protective portion 13 and the solid are provided. After temporarily fixing the imaging element 11 with UV curable resin or the like, the resin sealing portion 15 may be formed and fixed.

  The solid-state imaging module 1 according to the present embodiment includes a light-transmitting protection unit 13 having a simple structure with little assembly error with the imaging lens optical system 2im (lens group 21, lens holding unit 22, see Embodiment 2). It is possible to position the light receiving unit 11r of the individual image pickup device 11 with high accuracy and easily. Therefore, according to the solid-state imaging module 1 according to the present embodiment, the imaging device 2 (see Embodiment 2) can be configured with high accuracy and ease.

  The translucent protection unit 13 is located between the imaging lens optical system 2im (lens group 21, lens holding unit 22) and the light receiving unit 11r, and fixes the lens group 21 to the translucent protection unit 13. In addition, it has a role of preventing dust from entering the light receiving unit 11r from the outside.

  Therefore, the surface on the side where the incident light enters the frame-like contact portion 13b (the outward surface that forms the surface opposite to the contact surface 13bs and the side on which the incident light enters the light guide support portion 13w) 13ws) is a plane that intersects the optical axis Lax1 in the vertical direction in order to align the optical position with the lens group 21. That is, since the outward surface 13ws is a plane that intersects with the optical axis Lax1, the outward surface 13ws can be used as a reference surface in the subsequent assembly process, so that the solid-state imaging module 1 with high assembly accuracy can be obtained.

  The translucent protection part 13 includes a light shielding part 13s that shields incident light around the light guide part 13t around the light guide part 13t. That is, the outward surface 13ws includes a light shielding portion 13s that shields incident light. With this configuration, it is possible to shield unnecessary incident light to a region other than the light guide portion 13s with high accuracy.

  It is possible to adopt a configuration in which the incident light incident side of the light guide portion 13t is convex and the incident light is condensed on the light receiving portion 11r. That is, by making the incident light incident side (lens group 21 side) of the light guide part 13t convex, the entire optical path length is compared with the case where the light guide part 13t is a plate having flat surfaces. Can be shortened.

  With this configuration, it is possible to reliably prevent unnecessary light from entering with a simple structure, and to collect the incident light to the light receiving unit 11r with high accuracy and to shorten the optical path length. It is possible to reduce the size and thickness of the apparatus 2).

  The surface of the light guide portion 13t facing the light receiving portion 11r is a plane that intersects the optical axis Lax1 of the light guide portion 13t in the vertical direction. Therefore, it becomes possible to form an incident light on the light receiving portion 11r with high accuracy.

  An optical filter 13f (for example, an IR (infrared light) cut filter) is provided on a surface (plane) facing the light receiving unit 11r of the light guide unit 13t. Since the surface of the light guide portion 13t facing the light receiving portion 11r is a flat surface, the optical filter 13f can be easily attached with high accuracy. The optical filter 13f can be bonded by applying an appropriate adhesive.

  The translucent protection unit 13 blocks unnecessary light from the incident light from the imaging lens optical system 2im (lens group 21) by the light shielding unit 13s, and guides incident light as imaging light to the light receiving unit 11r. Therefore, it is transparent (translucent).

  Note that the translucent protective portion 13 is desirably formed of a transparent synthetic resin material that can be precisely integrated as a whole.

  The solid-state imaging device 11 is mounted on the wiring board 12 and includes a resin sealing part 15 formed from the translucent protection part 13 to the wiring board 12. With this configuration, the translucent protection part 13 can be fixed by the resin sealing part 15, and the mounting strength of the translucent protection part 13 to the solid-state imaging device 11 can be secured and the reliability can be improved.

  A wiring pad 12p connected to the element pad 11p via the wire 12w is disposed on the periphery of the wiring substrate 12. Therefore, the resin sealing portion 15 has a role of protecting the wire 12 w in addition to fixing the translucent protection portion 13.

  Further, since the side surface of the translucent protection portion 13 is resin-sealed by the resin sealing portion 15 in a direction crossing the optical axis direction Lax1, unnecessary light from the incident light incident side (image surface side) is shielded. Since it is possible to shield light by 13s and the resin sealing portion 15, it is not necessary to provide an additional light shielding portion on the side surface of the translucent protection portion 13.

  The light shielding portion 13s is arranged on a plane on the side where the incident light of the frame-like contact portion 13b enters (a plane opposite to the contact surface 13bs), and the incident light incident side and the solid-state imaging device 11 side. Both have a planar shape (that is, a flat plate shape) that intersects the optical axis Lax1 of the light guide portion 13t in the vertical direction. With this configuration, unnecessary incident light (unnecessary light) to a region other than the light guide portion 13t can be shielded with high accuracy.

  The light shielding unit 13s has a flat plate shape and serves to prevent unnecessary light from entering the light receiving unit 11r. The light shielding unit 13s includes a light guide unit 13t that guides incident light to the light receiving unit 11r. ) Other than the above, it is only necessary to shield light, for example, a colored film such as PET (polyethylene terephthalate) (for example, a light-shielding film colored black), direct coloring with a pigment-based black ink, or a light guide part 13t and the light shielding part 13s can be formed by two-color molding or the like.

  When the light shielding part 13s is formed by sticking a colored film or the like, the light shielding part 13s can be formed after positioning and fixing the translucent protection part 13 with respect to the light receiving part 11r. Therefore, when forming the light-shielding part 13s after positioning and fixing the translucent protection part 13, the region corresponding to the light-shielding part 13s before application of the colored film (the outward surface 13ws as the outer surface of the light guide support part 13w). Since the region corresponding to) is made of the same material as the light guide portion 13t, the positioning mark 11m can be disposed at a position corresponding to the light shielding portion 13s (light guide support portion 13w).

  That is, a corresponding positioning mark (not shown) corresponding to the positioning mark 11m is arranged at a position corresponding to the light guide support portion 13w, and the positioning mark 11m and the corresponding positioning mark are aligned to thereby align the positioning mark 11m with the corresponding positioning mark. Positioning can be performed.

  With this configuration, the positioning mark 11m is arranged at a position (position near the optical axis Lax1 of the light guide section 13t) corresponding to the light guide support section 13w that is closer to the light guide section 13t than the outer periphery of the translucent protection section 13. Therefore, the optical axis Lax1 of the light guide portion 13t and the center of the light receiving portion 11r can be positioned with higher accuracy. Further, since the degree of freedom of arrangement of the positioning mark 11m is improved, the positioning mark 11m is provided on the surface of the solid-state image sensor 11 with high accuracy even when a circuit component is mounted on the surface of the solid-state image sensor 11. It becomes possible.

  As described above, the alignment of the translucent protection part 13 is not limited to the case where the outer shape of the translucent protection part 13 is used as a reference, but the position corresponding to the light guide support part 13w (the inner region of the translucent protection part 13). ) Can also be performed. That is, it is natural that the light shielding portion 13s is not formed. However, even when the light shielding portion 13s is formed, the positioning mark 11m is formed at a position corresponding to the light guide support portion 13w (outward surface 13ws). Can be performed. Therefore, the translucent protection part 13 can be positioned by the positioning marks 11m provided around the light receiving part 11r.

  Further, the frame-shaped contact portion 13b of the translucent protection portion 13 can be provided with a vent hole (not shown) that allows ventilation to the outside. When the vent hole is formed, solid-state imaging is possible. Condensation on the light receiving surface of the element 11 can be prevented.

<Embodiment 2>
Next, a manufacturing method for manufacturing the solid-state imaging module 1 according to the first embodiment will be described as a second embodiment. In addition, about the solid-state imaging module 1, the code | symbol in Embodiment 1 (FIG. 1 thru | or FIG. 3) is used suitably.

  The present embodiment includes a solid-state imaging device 11 having a light receiving unit 11r that photoelectrically converts incident light into an electrical signal, and a light guide unit 13t that guides incident light to the light receiving unit 11r, and protects the light receiving unit 11r. The present invention relates to a method for manufacturing the solid-state imaging module 1 including the optical protection unit 13.

  Based on the positioning mark 11m formed on the solid-state image sensor 11, the optical axis Lax1 of the light guide portion 13t is positioned at the center of the light-receiving portion 11r (the center position of the light-receiving surface), and the translucent protection portion 13 is positioned. (Protection part attachment process). In the protective part attaching step, the solid-state imaging device 11 can attach the translucent protective part 13 in either a wafer state or a chip state.

  When the translucent protection part 13 is attached in a wafer state, positioning becomes easy, but the manufacturing apparatus becomes large. Further, it becomes possible to prevent the surface of the light receiving portion 11r from being stained when cut into chips.

  When the translucent protection part 13 is attached in a chip state, it is necessary to position the chip, but the manufacturing apparatus can be simplified.

  A light shielding portion 13s is formed around the light guide portion 13t on the incident light incident side surface of the translucent protection portion 13 (light shielding portion forming step). If the two-color molding is used as described in the first embodiment, the light-shielding portion 13s can be performed simultaneously with the formation of the translucent protection portion 13. In this case, the light-shielding portion forming step is omitted. Can do. In the present embodiment, the light shielding part 13s is formed in the light shielding part forming step. For example, it can be formed by sticking a colored film (light-shielding film) as described in Embodiment 1. Further, as described in the first embodiment, it can be formed by direct coloring with a pigment-based black ink.

  In the present embodiment, the light shielding part 13 can be formed either before or after the translucent protection part 13 is attached to the solid-state imaging device 11. When the light shielding part 13 is formed after the translucent protection part 13 is attached to the solid-state imaging device 11, as described in the first embodiment, the positioning mark 11m is arranged in the region of the corresponding light shielding part 13s. It becomes possible to arrange. That is, the positioning mark 11m can be arranged at a position closer to the optical axis Lax1 than the outer periphery of the translucent protection portion 13 (inside the outer periphery of the translucent protection portion 13), and the degree of freedom of arrangement of the positioning mark 11m is increased. It is possible to improve the positioning accuracy.

  The solid-state image sensor 11 with the translucent protection part 13 attached is mounted on the wiring board 12 (element mounting process). After the solid-state imaging element 11 is die-bonded to the wiring board 12, the element pad 11p and the wiring pad 12p are connected using the wire 12w.

  After the element mounting step, a resin sealing portion 15 that protects the solid-state imaging device 11 from the translucent protection portion 13 to the wiring board 12 is formed (resin sealing step). The resin sealing portion 15 can be formed by applying an appropriate resin sealing technique (for example, casting or transfer molding).

  In the present embodiment, the translucent protection portion 13 (light guide portion 13t) can be positioned with high accuracy and easily with respect to the light receiving portion 11r, and the light shielding portion 13s can be easily formed. It is possible to easily manufacture the solid-state imaging module 1 that can constitute the imaging device 2 that does not generate unnecessary light.

<Embodiment 3>
An imaging apparatus according to Embodiment 3 will be described based on FIGS. 4 and 5. The solid-state imaging module 1 according to the first embodiment is applied to the imaging apparatus according to the present embodiment. Therefore, the reference numerals in the first embodiment are appropriately used, and different items will be mainly described.

  FIG. 4 is an exploded perspective view showing the translucent protection part and the lens holding part that are disassembled except for the resin sealing part of the imaging apparatus according to Embodiment 3 of the present invention. FIG. 5 is a cross-sectional view showing a cross-section of the main part on a plane passing through the optical axis and wires of the imaging apparatus shown in FIG.

  The imaging apparatus 2 according to the present embodiment includes a solid-state imaging module 1 including a solid-state imaging element 11 having a light receiving unit 11r that photoelectrically converts incident light into an electrical signal, and a translucent protection unit 13 that protects the light receiving unit 11r. And a lens holding portion 22 that holds the lens group 21 composed of a plurality of lenses and is in contact with the translucent protection portion 13. The lens group 21 and the lens holding unit 22 constitute an imaging lens optical system 2im of the imaging device 2.

  The lens group 21 includes a plurality of lenses arranged at appropriate intervals so as to collect incident light from the image plane onto the light guide portion 13t. Each lens is made of, for example, optical resin or glass. The lens holding unit 22 fixes and holds the lens group 21 and fixes the imaging lens optical system 2 im for the solid-state imaging module 1 to the translucent protection unit 13.

  The optical coupling unit 24 is a sealing resin that abuts and fixes the lens holding unit 22 to the frame-shaped contact unit 13 b (light shielding unit 13 s) of the solid-state imaging module 1. The lens holding part 22 is in contact with the light shielding part 13s. Therefore, it is possible to obtain the imaging device 2 that can reliably prevent the unnecessary light from entering the light receiving unit 11r.

  The optical coupling unit 24 is appropriately engaged with the lens holding unit 22 to fix the lens holding unit 22. For example, a concavo-convex portion that is fitted to the contact surface between the lens holding portion 22 and the optical coupling portion 24 is formed.

  The optical coupling portion 24 is also appropriately fixed to the resin sealing portion 15. Therefore, the solid-state imaging module 1 and the imaging device 2 can be reliably coupled by the linkage of the resin sealing unit 15, the light shielding unit 13s, the lens holding unit 22, and the optical coupling unit 24.

  Since the lens holding portion 22 (holding end surface 22s) is brought into contact with the translucent protection portion 13 of the solid-state imaging module 1 according to Embodiment 1, the lens group 21 can be easily attached to the solid-state imaging module 1 with high accuracy. It is possible to obtain an imaging apparatus 2 that can be used. The holding end surface 22s is a surface that makes the lens holding portion 22 contact (adhere) to the translucent protection portion 13, and is configured to intersect the optical axis Lax2 of the lens group 21 in the vertical direction.

  Therefore, by aligning the optical axis Lax2 of the lens group 21 (lens holding unit 22) with the optical axis Lax1 of the translucent protection unit 13, the imaging device 2 can be configured with high accuracy and easily.

  The contact surface 13bs, the light shielding portion 13s (the light guide support portion 13w, the outward surface 13ws), and the holding end surface 22s are configured to intersect the optical axes Lax1 and Lax2 in the vertical direction. Therefore, positioning of the translucent protection part 13 with respect to the light receiving part 11r can be easily performed with high accuracy by aligning and contacting the optical axis Lax1 with respect to the center of the light receiving part 11r. Further, the positioning of the lens holding portion 22 with respect to the translucent protection portion 13 can be easily performed with high accuracy by aligning and contacting the optical axis Lax2 with respect to the optical axis Lax1. That is, the image pickup apparatus 2 can be assembled by combining the solid-state image pickup module 1 and the lens holding unit 22 (lens group 21) without adjusting the optical axis tilt.

  The lens holding unit 22 is configured so that the incident light incident on the light receiving unit 11r via the lens group 21 and the light guide unit 13t forms an image on the light receiving unit 11r (not shown). For example, it can be defined by the center of the lens in the optical axis direction))). Therefore, it is not necessary to adjust the position of the lens group 21 and the solid-state imaging module 1 in the optical axis direction, and the imaging apparatus 2 that can be manufactured with high accuracy and easily can be obtained.

  Further, for example, since there is no need for unnecessary light countermeasures for the translucent protective member 13, the positioning mark 11m can be confirmed via the translucent protective member 13 when the light shielding portion 13s is unnecessary. Therefore, by providing the positioning mark 11m so that the optical axes Lax1 and Lax2 coincide with each other, the translucent protection member 13 and the lens group 21 can be positioned with high accuracy.

  That is, the positioning mark 11m is disposed at a position where the optical axis Lax2 of the lens group 21 and the optical axis Lax1 of the light guide portion 13t are aligned with the center of the light receiving portion 11r. Therefore, the optical axis Lax2 of the lens group 21 can be easily and accurately aligned with the optical axis Lax1 (the center of the light receiving unit 11r) of the light guide unit 13t.

  Note that the shapes of the translucent protection portion 13, the light guide portion 13t, and the light guide support portion 13w (outward surface 13ws) are formed in advance in consideration of optical characteristics such as the focal length of the lens group 21. That is, the overall optical accuracy of the imaging device 2 (imaging lens optical system 2im) can be defined by the molding accuracy of the translucent protection portion 13 and the assembly accuracy of the lens holding portion 22.

  According to the imaging device 2 according to the present embodiment, the solid-state imaging module 1 that can be easily assembled with high accuracy and can be reduced in size and thickness is applied. Can be realized.

<Embodiment 4>
An imaging device (not shown) according to the present embodiment includes an imaging unit having an imaging function, and includes the imaging device 2 according to Embodiment 3 in the imaging unit. Therefore, the reference numerals in Embodiment 1 and Embodiment 3 are used as appropriate, and different items will be mainly described.

  That is, the imaging device according to the present embodiment is an imaging device equipped with the imaging device 2 including the solid-state imaging module 1 having the solid-state imaging device 11 and the lens holding unit 22 that holds the lens group 21. The apparatus 2 is an imaging apparatus according to Embodiment 3 of the present invention.

  Therefore, it is possible to provide an imaging device equipped with the imaging device 2 including the solid-state imaging module 1 and the lens group 21 that are positioned easily and with high accuracy, and can be downsized with a high-precision imaging optical system. The imaging device can be provided with high productivity.

  The imaging device according to the present embodiment can be put into practical use, for example, as a mobile phone. Note that the configuration of the imaging device can be freely set as appropriate according to the application, and thus the details are omitted.

1 is a perspective view showing an entire solid-state imaging module according to Embodiment 1 of the present invention. It is a disassembled perspective view which shows the translucent protection part decomposed | disassembled except the resin sealing part of the solid-state imaging module shown in FIG. It is sectional drawing which shows the principal part cross section in the surface which passes along the optical axis and wire of the solid-state imaging module shown in FIG. It is a disassembled perspective view which shows the translucent protection part and lens holding part which were decomposed | disassembled except the resin sealing part of the imaging device which concerns on Embodiment 3 of this invention. FIG. 5 is a cross-sectional view showing a cross-section of a main part on a plane passing through an optical axis and a wire of the imaging apparatus shown in FIG. 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solid-state imaging module 11 Solid-state imaging device 11r Light-receiving part 11p Element pad 11m Positioning mark 12 Wiring board 12p Wiring pad 12w Wire 13 Translucent protection part 13b Frame-shaped contact part 13bs Contact surface 13c Adhesive storage part 13f Optical filter 13s Light shielding part 13t Light guide part 13w Light guide support part 13ws Outward surface 15 Resin sealing part 2 Imaging device 2im Imaging lens optical system 21 Lens group 22 Lens holding part 22s Holding end face 24 Optical coupling part AP Positioning position Lax1 Optical axis Lax2 Optical axis

Claims (16)

A solid-state imaging module comprising a solid-state imaging device having a light-receiving unit that photoelectrically converts incident light into an electrical signal, and a translucent protection unit that protects the light-receiving unit,
The translucent protection unit includes a light guide unit that guides incident light to the light receiving unit, and a frame that is disposed around the light guide unit and is in contact with the surface of the solid-state imaging device around the light receiving unit. A solid-state imaging module, wherein the translucent protection part is positioned by positioning marks provided around the light receiving part.   2. The solid-state imaging module according to claim 1, wherein the positioning mark is disposed at a position where an optical axis of the light guide unit is aligned with a center of the light receiving unit.   The said positioning mark is arrange | positioned in the position corresponding to the light guide support part which couple | bonds with the said frame shape contact part or the said frame shape contact part, and supports the said light guide part. The solid-state imaging module according to claim 1 or 2.   4. The solid-state imaging module according to claim 3, wherein an outward surface that constitutes a side on which incident light of the light guide support portion is incident is a flat surface that intersects an optical axis of the light guide portion.   The solid-state imaging module according to claim 4, wherein the outward surface includes a light shielding unit that shields incident light.   6. The solid-state imaging module according to claim 1, wherein a surface of the light guide unit that faces the light receiving unit is a plane that intersects an optical axis of the light guide unit. .   The solid-state imaging module according to claim 6, wherein an optical filter is provided on the plane.   8. The light guide unit according to claim 1, wherein a side on which incident light is incident is convex and condenses incident light on the light receiving unit. 9. Solid-state imaging module.   9. The contact surface of the frame-shaped contact portion that contacts the solid-state image sensor is configured to be perpendicular to the optical axis of the light guide portion. The solid-state imaging module as described in one.   10. The solid-state imaging device is mounted on a wiring board, and includes a resin sealing portion formed from the translucent protection portion to the wiring substrate. The solid-state imaging module described in 1. A solid-state imaging module having a light-receiving unit that photoelectrically converts incident light into an electrical signal, a light-transmitting protection unit that protects the light-receiving unit, and a lens group that includes a plurality of lenses An imaging device comprising a lens holding part in contact with the translucent protection part,
11. The imaging device according to claim 1, wherein the solid-state imaging module is the solid-state imaging module according to any one of claims 1 to 10.   The imaging device according to claim 11, wherein the positioning mark is disposed at a position where an optical axis of the lens group and an optical axis of the light guide unit are aligned with a center of the light receiving unit.   The image pickup apparatus according to claim 11, wherein the lens holding portion is in contact with the light shielding portion.   The lens holding unit defines an interval between the lens group and the light guide unit so that incident light incident on the light receiving unit through the lens group and the light guide unit forms an image on the light receiving unit. The imaging apparatus according to claim 11, wherein the imaging apparatus is provided. An imaging device equipped with an imaging device including a solid-state imaging module having a solid-state imaging device and a lens holding unit that holds a lens group,
The imaging apparatus according to claim 11, wherein the imaging apparatus is the imaging apparatus according to claim 11. Solid-state imaging device comprising a solid-state imaging device having a light-receiving unit that photoelectrically converts incident light into an electrical signal, and a translucent protection unit that has a light guide unit that guides incident light to the light-receiving unit and protects the light-receiving unit A method of manufacturing a module,
A protective part attaching step of positioning the optical axis of the light guide part at the center of the light receiving part based on a positioning mark formed on the solid state image sensor, and attaching the translucent protection part to the solid state image sensor;
A light shielding part forming step of forming a light shielding part by pasting a light shielding film around the light guiding part;
An element mounting step of mounting the solid-state imaging element on a wiring board;
And a resin sealing step for forming a resin sealing portion that protects the solid-state imaging element from the translucent protection portion to the wiring board.

Images