CN109688299B - Camera module array and corresponding integrated substrate - Google Patents

Camera module array and corresponding integrated substrate Download PDF

Info

Publication number
CN109688299B
CN109688299B CN201711009864.XA CN201711009864A CN109688299B CN 109688299 B CN109688299 B CN 109688299B CN 201711009864 A CN201711009864 A CN 201711009864A CN 109688299 B CN109688299 B CN 109688299B
Authority
CN
China
Prior art keywords
circuit board
lens
array
integrated substrate
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711009864.XA
Other languages
Chinese (zh)
Other versions
CN109688299A (en
Inventor
田中武彦
陈振宇
梅哲文
方银丽
吴业
苏小娟
郭楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of CN109688299A publication Critical patent/CN109688299A/en
Application granted granted Critical
Publication of CN109688299B publication Critical patent/CN109688299B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006—Filter holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G03B17/14—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets interchangeably
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The invention provides an integrated substrate for an image pickup module array, which comprises a circuit board, a first lens, a second lens, a first optical component and a second optical component, wherein the circuit board is provided with a first area suitable for mounting the first optical component comprising the first lens and a second area suitable for mounting the second lens, and the circuit board is also provided with a first surface close to the first lens and the second lens and a second surface opposite to the first surface; and a molding part integrally formed on the second surface of the circuit board through a molding process, and covering at least a portion of the second surface corresponding to the first region and at least a portion corresponding to the second region; the integrated substrate has a first planar surface and a second planar surface. The invention also provides a corresponding camera module array. The invention can improve the structural strength of the substrate, can better adapt to the double-shot module with two different optical designs, is beneficial to reducing the size of the double-shot module and reduces the cost.

Description

Camera module array and corresponding integrated substrate
Technical Field
The invention relates to the technical field of optics, in particular to a solution of an image pickup module array and a corresponding integrated substrate.
Background
Along with the continuous development of intelligent devices, the requirements on the camera module are higher and higher. For example, in recent two years, the camera of the smart phone is changed from a single camera to a double camera, and the development of a double camera module is also an important trend of the development of the camera module of the mobile phone. In short, the double cameras can acquire images through the cooperation of the two cameras, so that a richer image acquisition function is realized. The existing double cameras can be mainly divided into two types according to functions: the method is characterized in that stereoscopic vision is generated by using two cameras, the depth of field of an image is obtained, background blurring, scanning, auxiliary focusing, action recognition and other applications are performed by using depth of field information, or fusion is performed by using information of two pictures; the other is to fuse the left and right different pictures to obtain better resolution, better color, dynamic range and other better image quality or realize the function of optical zooming.
In any case, the dual cameras need hardware support, and one of the most basic problems is to consider the assembly and fixation between two cameras. How to stably and compactly assemble two cameras together to form an integral module is a basic problem considered by a double-camera module. On the other hand, two cameras constituting a dual camera are typically two different types of cameras, such as one for imaging and one for recording depth of field. The requirement of different functions generally makes the two cameras different in size, such as different in height, and how to combine the two cameras with different heights stably to make the two cameras into a whole is another important problem encountered in the development of the dual-camera module.
In the prior art, a metal bracket is generally manufactured, the bracket is provided with two accommodating holes, and after two cameras are respectively manufactured, the two camera modules are respectively arranged in the two accommodating holes of the metal bracket, so that a stable and reliable double camera module is formed. However, the above solution also has the problems of increased module size and increased cost.
Thus, solutions are currently urgent to overcome the above drawbacks.
Disclosure of Invention
The present invention aims to provide a solution that overcomes at least one of the above-mentioned drawbacks of the prior art.
According to one aspect of the present invention, there is provided an integrated substrate for an array of camera modules, comprising:
a wiring board having a first area adapted to mount a first lens assembly and a second area adapted to mount a second lens assembly, the first lens and the second lens being located on a same side of the wiring board, the wiring board further having a first surface adjacent to the first lens and the second lens and a second surface opposite to the first surface; and
a molding part integrally formed on a second surface of the circuit board by a molding process, and covering at least a portion of the second surface corresponding to the first region and at least a portion of the second surface corresponding to the second region;
wherein the integrated substrate has a first planar surface adapted to mount a first photosensitive element and a second planar surface adapted to mount a second photosensitive element, and the first planar surface and the second planar surface are at different heights.
Wherein, the circuit board is integrated circuit board.
Wherein, the circuit board is provided with a first through hole which is suitable for accommodating the first photosensitive element.
Wherein the molding part covers the first through hole, and the first flat surface is positioned on the molding part.
The integrated substrate further comprises a first metal sheet, the molding part is provided with a second through hole corresponding to the first through hole and suitable for accommodating the first photosensitive element, the first metal sheet covers the first through hole and the second through hole, and the first flat surface is located on the first metal sheet.
The circuit board is provided with a first groove suitable for accommodating the first photosensitive element, and the first flat surface is positioned in the first groove.
Wherein at least one capacitor or resistor element is mounted on the second surface, and the molding part covers the at least one capacitor or resistor element.
The molding part is provided with a contact surface contacted with the second surface and a non-contact surface formed by extending the contact surface and covering the first through hole, and the first flat surface is formed on the non-contact surface.
Wherein the non-contact surface and the contact surface are in the same plane.
Wherein, the non-contact surface forms a boss or a groove, and the first flat surface is positioned on the boss or the groove of the non-contact surface.
The first metal sheet is provided with a boss, and the first flat surface is positioned on the boss of the first metal sheet.
The circuit board is provided with a second groove suitable for accommodating the second photosensitive element, and the second flat surface is positioned in the second groove.
The circuit board is provided with a second groove suitable for accommodating the second photosensitive element, and the second flat surface is positioned in the second groove.
The circuit board is provided with a second boss, and the second flat surface is positioned on the second boss.
The integrated substrate is further provided with a second metal sheet, the second metal sheet is arranged on the first surface of the circuit board at a position corresponding to the second area, and the second flat surface is located on the second metal sheet.
The circuit board comprises a first circuit board with the first area and a second circuit board with the second area, and the first circuit board and the second circuit board are electrically connected through a flexible circuit.
According to another aspect of the present invention, there is also provided an image capturing module array including:
a first lens and a second lens;
the integrated substrate for the camera module array described above; and
a first photosensitive element mounted on the first planar surface and a second photosensitive element mounted on the second planar surface.
Wherein, the camera module array still includes:
the mirror base is provided with a base part and an extension part, the base part is arranged on the first surface of the circuit board and surrounds the periphery of the first photosensitive element, the extension part extends from the base part to the center, and a gap is reserved between the extension part and the circuit board and between the extension part and the first photosensitive element.
Wherein, the camera module array still includes:
a first color filter element;
the first lens is mounted on the base portion, and the first color filter element is mounted on the extension portion.
The lens seat is provided with a third surface close to the circuit board and a fourth surface opposite to the third surface, the first lens is mounted on the third surface, and the first color filter element is mounted on the fourth surface.
Wherein, the camera module array still includes: the first motor, the first camera lens is installed in the first motor, the first motor is installed in the basis portion, the first color filter element is installed in the extension.
The lens seat is provided with a third surface close to the circuit board and a fourth surface opposite to the third surface, the first motor is installed on the third surface, and the first color filter element is installed on the fourth surface.
Wherein the position of the extension is higher than the position of the base.
Wherein the lens holder forms a step such that the position of the extension portion is higher than the position of the base portion.
The camera module array further comprises a second motor, the second lens is mounted on the second motor, and the second motor is mounted on the circuit board.
The camera module array further comprises a second color filter, and the second color filter is installed on the second motor or the second lens.
The first surface of the circuit board is provided with a main body part and a transition section, the transition section is positioned at a position close to the first through hole or the first groove, and the position of the transition section is lower than the main body part of the first surface.
The first photosensitive element is connected with the transition section through a metal wire, so that the metal wire is electrically connected with the circuit board.
Compared with the prior art, the invention has at least one of the following technical effects:
1. the invention can enhance the structural strength of the substrate with the two double-camera modules with different optical designs.
2. The invention can provide the mounting surfaces of two photosensitive elements with different heights, thereby better adapting to the double-camera module with two different optical designs.
3. The invention can cancel the metal bracket with two containing holes in the traditional scheme for the double-camera module with two different optical designs, thereby saving the cost and reducing the production procedures.
4. The invention is beneficial to reducing the radial size of the camera module array.
5. The shoulder height and the total height of the camera module are reduced.
Drawings
Exemplary embodiments are illustrated in referenced figures. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.
FIG. 1 illustrates an array of camera modules in accordance with one embodiment of the present invention;
FIG. 2 illustrates an array of camera modules according to another embodiment of the present invention;
FIG. 3 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;
FIG. 4 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;
FIG. 5 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;
FIG. 6 illustrates an array of camera modules according to yet another embodiment of the present invention;
FIG. 7 shows a bottom view of the embodiment of FIG. 6;
FIG. 8 illustrates an array of camera modules in accordance with yet another embodiment of the present invention;
figures 9-11 show schematic views of several embodiments of a first gasket having a "U" shape;
fig. 12 shows a schematic view of an embodiment of a first gasket in the form of a flat plate.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed description are merely illustrative of exemplary embodiments of the application and are not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Fig. 1 shows an image capturing module array according to an embodiment of the present invention, where the image capturing module array includes at least a first image capturing module 100 and a second image capturing module 200 with different optical designs, and the first image capturing module 100 and the second image capturing module 200 are formed on a unitary substrate 600 (i.e., the first image capturing module 100 and the second image capturing module 200 share the same unitary substrate 600). Wherein the integrated substrate 600 includes an integrated circuit board 400 and a molding part 500 formed at the circuit board 400 through a molding process.
The wiring board 400 has a first area adapted to mount a first optical component including the first lens 101 and a second area adapted to mount a second optical component including the second lens 201, the first lens 101 and the second lens 201 being both located on an upper side of the wiring board 400. The circuit board 400 also has a first surface 410 adjacent to the first lens 101 and the second lens 201 and a second surface 420 opposite to the first surface 410. For ease of description, a first optical assembly containing the first lens 101 will be referred to herein as a first lens assembly, and a second optical assembly containing the second lens 201 will be referred to herein as a second lens assembly.
The molding part 500 is formed on the second surface 420 of the circuit board 400 through a molding process, and the molding part 500 covers regions of the second surface 420 corresponding to the first and second regions. In this way, the molding part 500 is formed substantially in a plate shape and supports the wiring board 500, thereby reinforcing the structural strength of the wiring board.
The wiring board 400 has a first through hole adapted to accommodate the first photosensitive element 104. The molding part 500 covers the first through hole, and an upper surface of the molding part 500 forms a first flat surface suitable for mounting the first photosensitive element 104. Here, the upper surface, i.e., the surface of the portion of the molding part 500 covering the first through hole. Specifically, the molding part 500 has a contact surface 510 contacting the second surface 420 of the circuit board 400, and a non-contact surface 520 extending from the contact surface 510 to cover the first through hole, and the first flat surface is formed on the non-contact surface 520. In this embodiment, the non-contact surface 520 covering the first through hole is in the same plane with the contact surface 510 between the circuit board 400 and the molding part 500. On the other hand, a second flat surface adapted to mount a second photosensitive element is formed at a second region of the wiring board 400. The first planar surface and the second planar surface are at different heights in order to accommodate two camera modules of different optical designs (e.g., different back focus). The height here refers to the dimension in the thickness direction of the integrated substrate 600. In one embodiment, a dielectric sheet 207 may be added to the second area of the circuit board 400, with the second planar surface provided by the dielectric sheet 207. In this way, the difference in height between the first photosensitive element 104 and the second photosensitive element 204 can be more flexibly adjusted.
Still referring to fig. 1, in one embodiment, at least one capacitive or resistive element 108 is mounted on the second surface, and the molding 500 covers the capacitive or resistive element 108. Since the circuit board 400 has the first through hole for accommodating the first photosensitive element 104, the space remaining on the first surface 410 of the circuit board 400 is relatively tight, and a part or all of the capacitor or resistor elements are mounted on the back surface, that is, the second surface 420, so that the radial dimension (the radial dimension refers to the dimension perpendicular to the optical axis direction of the camera module) of the camera module array can be effectively reduced.
Further, referring to fig. 1, in one embodiment, the first image capturing module 100 includes a first lens 101, a first motor 102, a first color filter 106, a lens holder 105, and a first photosensitive element 104. The second camera module 200 includes a first lens 201, a second color filter 206, and a second photosensitive element 204. A spacer 300 may also be provided between the first lens 101 and the second lens 201. The spacer 300 can serve to further strengthen the structural strength of the dual camera module.
Referring to fig. 1, the mirror base 105 has a base portion 105a and an extension portion 105b, the base portion 105a is mounted on the first surface 410 of the circuit board 400 and surrounds the first photosensitive element 104, and the extension portion 105b extends from the base portion 105a toward the center. And there are gaps between the extension 105b and the wiring board 400 and between the extension and the first photosensitive element 104. The first motor 102 is mounted on the upper surface of the base portion 105a, and the first color filter member 106 is mounted on the lower surface of the extension portion 105 b. The first lens 101 is mounted to the first motor 102 (e.g., inside a ring-shaped carrier of the first motor 102). The lens holder forms an inclined transition section, which on the one hand makes the position of the extension 105b higher than the position of the base 105a, and on the other hand makes the lens holder machining difficult to be reduced. In one embodiment, the lens base 105 may be made of a metal material, so as to reduce the thickness of the lens base, thereby reducing the shoulder height and the total height of the camera module (the shoulder height may be the height from the bottom surface of the camera module to the top cover of the camera module motor, and the total height may be the height from the bottom surface of the camera module to the top end of the lens of the camera module).
In one embodiment, the first camera module employs a zoom module and the second camera module employs a fixed focus module, in which case the first camera module includes a first motor 102 and the second camera module need not have a motor. A second color filter 206 is mounted under the second lens 201. That is, in this embodiment, the second color filter 206 may be fixed with the second lens 201, and then the second lens 201 is mounted on the circuit board 400. In this case, the lens mount between the circuit board 400 and the molding part 500 may be eliminated. This can reduce the axial dimension (i.e., the dimension along the optical axis direction) of the second image pickup module. In one embodiment, the annular lens support 202 may be mounted on the circuit board 400, and the lens 201 may be mounted on the lens support 202 by screwing.
Further, in one embodiment, both camera modules may employ a zoom module. In this case, the first camera module includes a first motor 102, and the second camera module includes a second motor. The structure of the first camera module is identical to the embodiment shown in fig. 1. For the second camera module, the second lens 201 is mounted on a second motor, and the second motor is mounted on the circuit board 400. The second color filter 206 is mounted under the second motor or the second lens 201.
In the above embodiment, the molding part 500 is integrally formed on the back surface of the integrated circuit board 400 to support the circuit board 400, thereby reinforcing the structural strength of the circuit board 400. Therefore, for the double-camera module with two different optical designs, the metal bracket with two accommodating holes in the traditional scheme can be omitted, so that the cost is saved, and the production procedures are reduced.
On the other hand, for a dual-camera module having two different optical designs, it is often necessary to provide two photosensitive element mounting surfaces of different heights. However, the current circuit board manufacturing process, especially the manufacturing process of the rigid-flex circuit board, has difficulty in providing two flat surfaces with different heights suitable for the installation of photosensitive elements. In the above embodiment, when the molding portion 500 is formed, the pressing head of the mold is disposed at the position of the first through hole, and the flat molding portion surface can be conveniently manufactured at the position of the first through hole by using the pressing head with a flat surface, and the surface can provide the first flat surface for mounting the first photosensitive element 104. It should be noted that, although the upper surface of the entire molding portion is a plane in the embodiment of fig. 1, the present invention is not limited thereto. For example, the upper surface of the molding part may also have a boss or a groove, that is, the first flat surface may have a height higher or lower than the contact surface of the circuit board 400 and the molding part 500. Fig. 2 shows an image capturing module array according to another embodiment of the present invention, in which the molding part 500 has a contact surface contacting the second surface, and a non-contact surface extending from the contact surface and covering the first through hole, and the first flat surface is formed on the non-contact surface. The non-contact surface forms a groove, and the first flat surface is positioned in the groove of the non-contact surface. Similarly, in another embodiment, the non-contact surface may also form a boss, and the first flat surface is located on the boss of the non-contact surface. Therefore, the height difference between the first plane and the second plane can be conveniently determined according to actual conditions.
It should be noted that although the above embodiments have been described with respect to the case where the first flat surface is formed on the surface of the molding part 500 located in the first through hole, the present invention is not limited thereto. In other embodiments of the invention, there are a variety of alternative embodiments. In general, the integrated substrate 600 has a first flat surface adapted to mount the first photosensitive element 104 and a second flat surface adapted to mount the second photosensitive element 204, and the first flat surface and the second flat surface are at different heights (height refers to a dimension in a direction perpendicular to the first flat surface or the second flat surface, or a dimension in a thickness direction of the integrated substrate 600). Thus, the integrated substrate 600 can be used for dual-camera modules with two different optical designs, and achieves a more ideal comprehensive effect. For example, a metal bracket with two containing holes in the traditional scheme can be omitted, so that the cost is saved and the production procedure is reduced.
Fig. 3 shows an array of camera modules according to a further embodiment of the present invention, where the integrated substrate further includes a first metal sheet 107, the molding 500 has a second through hole corresponding to the first through hole and adapted to accommodate the first photosensitive element, the first metal sheet covers the first through hole and the second through hole, and the first flat surface is located on the first metal sheet 107.
In a variant embodiment, the first through hole of the circuit board can also be replaced by a first recess. The first recess is adapted to receive the first photosensitive element. In this case, the first flat surface is located in the first groove. In this case, in manufacturing the wiring board 400, two mounting surfaces having different heights need to be manufactured on the first surface of the wiring board 400 in order to mount the photosensitive elements corresponding to the two lenses, respectively. However, as described above, under the prior art process, the two mounting surfaces may have a problem of insufficient flatness (for example, the bottom surface of the groove may have insufficient flatness). In the solution of this embodiment, since the molding part 500 is integrally formed on the back surface of the circuit board 400, the process of pressing the circuit board 400 up and down is adopted in the manufacturing process, and the pressing head of the mold contacts the bottom surface of the groove on the first surface of the circuit board 400 and applies pressure to the bottom surface of the groove, at the same time, the molding process needs to be performed at a higher temperature, so that the effect of flattening the bottom surface of the groove (similar to the effect of "ironing") is achieved, so that the obtained integrated substrate can provide the first flat surface and the second flat surface at different heights, and the metal bracket with two accommodating holes in the conventional solution can be omitted, thereby saving the cost and reducing the production process. Furthermore, no additional process is required to obtain the first planar surface and the second planar surface.
Further, in one embodiment, the circuit board 400 further has a second groove adapted to accommodate the second photosensitive element, and the second flat surface is located in the second groove. Fig. 8 shows the camera module array with the second groove of this embodiment. In this embodiment, the second plane may be provided in a similar manner to the previous embodiment. That is, the molding part 500 is formed by a molding process of pressing the circuit board 400 up and down, and the pressing head of the mold contacts and applies pressure to the bottom surface of the second groove of the first surface of the circuit board 400, and at the same time, since the molding process needs to be performed at a higher temperature, the effect of flattening the bottom surface of the second groove is achieved (similar to the "ironing" effect).
Further, in one embodiment, the circuit board 400 may have a second boss, and the second flat surface is located on the second boss. The molding part 500 is manufactured by a molding process of pressing the circuit board 400 up and down, and a pressing head of the mold contacts and planarizes a surface of the second boss of the circuit board 400, thereby forming a second planarized surface.
Further, fig. 4 shows an array of camera modules according to a further embodiment of the present invention. In this embodiment, the integrated substrate further has a second metal sheet mounted on the first surface of the circuit board 400 at a position corresponding to the second area, and the second flat surface is located on the second metal sheet 207. The second photosensitive element is thus raised by the second metal sheet, thereby obtaining a desired difference in height between the first photosensitive element and the second photosensitive element. The difference in height between the first photosensitive element and the second photosensitive element herein refers to the difference in height between the photosensitive surface of the first photosensitive element and the photosensitive surface of the second photosensitive element.
Further still referring to fig. 4, in yet another embodiment of the present invention, the first surface 410 of the circuit board 400 has a main body 411 and a transition section 412 (a stepped transition section is shown in fig. 4), the transition section 412 is located near the first through hole (or near the first groove), and the transition section 412 is located below the main body 411 of the first surface. Generally, it is necessary to electrically connect the photosensitive element with the wiring board 400 with a metal wire (e.g., gold wire). When the first photosensitive element 104 is mounted in the first through hole, a larger height difference may be formed between the first photosensitive element 104 and the first surface 410 of the circuit board 400, and this height difference may cause an increase in difficulty in a process of connecting metal wires (generally referred to as "wire bonding" in industry). In this embodiment, the first surface has a main body portion with a transition section disposed near the first through hole (or the first groove) and a height of the transition section is lower than that of the main body portion of the first surface. Thus, the metal wires can be electrically connected to the circuit board 400 through the electrical connection transition section, thereby reducing the process difficulty of wire bonding.
Fig. 5 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the lens base is mounted on an edge region (the edge region is usually a non-photosensitive surface) of the first photosensitive element. The color filter element is mounted on the lens base. A first motor or a first lens of the first camera module is mounted on the circuit board 400.
Fig. 6 shows an array of camera modules according to yet another embodiment of the present invention. In this embodiment, the bottom surface 530 of the molding part 500 (the bottom surface 530 refers to the surface of the molding part 500 opposite to the contact surface 510) has a third groove 700 in a region corresponding to the second camera module. The third recess 700 may allow room for other components in the terminal device to be avoided. Fig. 7 shows a bottom view of the embodiment of fig. 6, illustrating one example of the planar shape of the third groove 700.
Further, fig. 9 to 12 show an embodiment in which a spacer is added at the first through hole. In these embodiments, the second surface 420 of the circuit board 400 is further provided with a first pad 800, the first through hole is covered by the first pad 800, and the upper surface of the pad is flat, so as to provide a first flat surface adapted to the first photosensitive element. The molding part 500 is integrally formed on the second surface 420 of the circuit board 400 and the lower surface of the first spacer 800. First spacer 800 may be flat or "U" shaped. Fig. 9-11 illustrate several exemplary embodiments of a first spacer 800 having a "U" shape. Wherein the first shim 800 has a first flat surface in the shape of a "U". Fig. 12 shows a schematic view of an embodiment of a first gasket 800 in the form of a flat plate. The first gasket is added at the position of the first through hole, so that the molding process difficulty can be reduced, and the quality of the double shot product can be improved. It should be noted that the first spacer having the "U" shape may be concave downward or convex upward, so that the difference in height between the first flat surface and the second flat surface may be set according to practical situations. The first gasket may also be made in the shape of the metal sheet 107 in the embodiment of fig. 3, i.e. with a raised solid plate-like structure. The upper surface of the convex structure can be used for providing a first flat surface for mounting the first photosensitive element.
In a variant embodiment, the circuit board in the integrated substrate may also be split. For example, the circuit board may include a first circuit board having the first region and a second circuit board having the second region, the first circuit board and the second circuit board being electrically connected by a flexible circuit. The back of the first circuit board and the back of the second circuit board are integrally formed with a molding part, and the molding part supports the two circuit boards, thereby reinforcing the structural strength of the circuit boards, and forming an integrated substrate with sufficient strength. Thus, for a dual-camera module with two different optical designs, the metal bracket with two accommodating holes in the traditional scheme (or the structural strength requirement on the metal bracket is reduced) can be eliminated, so that the cost is saved, the production process is reduced, and the axial and/or radial size of the dual-camera module is reduced.
The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.

Claims (17)

1. An integrated substrate for an array of camera modules, comprising:
a circuit board having a first region adapted to mount a first lens assembly and a second region adapted to mount a second lens assembly, the circuit board further having a first surface proximate to the first lens and the second lens and a second surface opposite to the first surface; and
a molding part integrally formed on a second surface of the circuit board by a molding process, and covering at least a portion of the second surface corresponding to the first region and at least a portion of the second surface corresponding to the second region;
the integrated substrate is provided with a first flat surface suitable for mounting a first photosensitive element and a second flat surface suitable for mounting a second photosensitive element, the first flat surface and the second flat surface are positioned at different heights, the circuit board is provided with a first through hole suitable for accommodating the first photosensitive element, the first through hole is covered by the molding part, and the first flat surface is positioned on the molding part.
2. The integrated substrate for an array of camera modules of claim 1, wherein the circuit board is an integrated circuit board.
3. The integrated substrate for an array of camera modules of any one of claims 1-2, wherein at least one capacitor or resistor element is mounted on the second surface, and the molding covers the at least one capacitor or resistor element.
4. The integrated substrate for an array of camera modules of claim 1, wherein the molding has a contact surface that contacts the second surface, and a non-contact surface that is formed by the contact surface extending to cover the first through hole, the first flat surface being formed on the non-contact surface.
5. The integrated substrate for an array of camera modules of claim 4, wherein the non-contact surface is in the same plane as the contact surface.
6. The integrated substrate for an array of camera modules of claim 4, wherein the non-contact surface forms a boss or recess, and the first planar surface is located at the boss or recess of the non-contact surface.
7. The integrated substrate for an array of camera modules of claim 1, wherein the circuit board has a second recess adapted to receive the second photosensitive element, the second planar surface being located in the second recess.
8. The integrated substrate for an array of camera modules of claim 1, wherein the circuit board has a second boss, the second planar surface being located on the second boss.
9. The integrated substrate for an array of camera modules of claim 1, further comprising a second metal sheet mounted on the first surface of the circuit board at a location corresponding to the second area, the second planar surface being located on the second metal sheet.
10. The integrated substrate for an array of camera modules of claim 1, wherein the circuit board comprises a first circuit board having the first region and a second circuit board having the second region, the first circuit board and the second circuit board being electrically connected by a flexible circuit.
11. A camera module array, comprising:
a first lens and a second lens;
the integrated substrate for an array of camera modules of any one of claims 1 to 10; and
a first photosensitive element mounted on the first planar surface and a second photosensitive element mounted on the second planar surface.
12. The camera module array of claim 11, wherein the camera module array further comprises:
the mirror base is provided with a base part and an extension part, the base part is arranged on the first surface of the circuit board and surrounds the periphery of the first photosensitive element, the extension part extends from the base part to the center, and a gap is reserved between the extension part and the circuit board and between the extension part and the first photosensitive element.
13. The camera module array of claim 12, wherein the camera module array further comprises:
a first color filter element; the first lens is mounted on the base portion, and the first color filter element is mounted on the extension portion.
14. The array of camera modules of claim 13, wherein the lens mount has a third surface proximate the circuit board and a fourth surface opposite the third surface, the first lens being mounted on the third surface, the first color filter element being mounted on the fourth surface.
15. The camera module array of claim 13, wherein the camera module array further comprises: the first motor, the first camera lens is installed in the first motor, the first motor is installed in the basis portion, the first color filter element is installed in the extension.
16. The camera module array of claim 15, wherein the lens mount has a third surface proximate the circuit board and a fourth surface opposite the third surface, the first motor being mounted to the third surface, the first color filter element being mounted to the fourth surface.
17. The camera module array of claim 11, wherein the first surface of the circuit board has a main body portion and a transition section, the transition section is located near the first through hole, the transition section is located lower than the main body portion of the first surface, and the first photosensitive element is connected to the transition section through a metal wire, so that the metal wire is electrically connected to the circuit board.
CN201711009864.XA 2017-10-18 2017-10-25 Camera module array and corresponding integrated substrate Active CN109688299B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2017109733181 2017-10-18
CN201710973318 2017-10-18

Publications (2)

Publication Number Publication Date
CN109688299A CN109688299A (en) 2019-04-26
CN109688299B true CN109688299B (en) 2024-04-09

Family

ID=62937762

Family Applications (12)

Application Number Title Priority Date Filing Date
CN201711009864.XA Active CN109688299B (en) 2017-10-18 2017-10-25 Camera module array and corresponding integrated substrate
CN201711014959.0A Pending CN109688301A (en) 2017-10-18 2017-10-25 Photosensory assembly array and corresponding camera module array
CN201721395664.8U Withdrawn - After Issue CN207978027U (en) 2017-10-18 2017-10-25 Camera module array and corresponding unitary substrate
CN201721385479.0U Active CN207665056U (en) 2017-10-18 2017-10-25 Photosensory assembly array for camera module array and corresponding camera module array
CN201721385762.3U Active CN207766338U (en) 2017-10-18 2017-10-25 Camera module array and unitary substrate for camera module array
CN201711008660.4A Active CN109688298B (en) 2017-10-18 2017-10-25 Camera module array and corresponding integrated substrate
CN201711060630.8A Active CN109683434B (en) 2017-10-18 2017-11-02 Camera module array
CN201721440261.0U Active CN207663195U (en) 2017-10-18 2017-11-02 camera module array
CN201711085379.0A Active CN109688302B (en) 2017-10-18 2017-11-07 Integrated substrate for camera module array, manufacturing method and die thereof
CN201721470922.4U Active CN208369686U (en) 2017-10-18 2017-11-07 Unitary substrate and its production mold, photosensory assembly array and camera module array
CN201711249119.2A Active CN109688303B (en) 2017-10-18 2017-12-01 Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method
CN201721656763.7U Active CN207691907U (en) 2017-10-18 2017-12-01 Photosensory assembly jigsaw, photosensory assembly and camera module

Family Applications After (11)

Application Number Title Priority Date Filing Date
CN201711014959.0A Pending CN109688301A (en) 2017-10-18 2017-10-25 Photosensory assembly array and corresponding camera module array
CN201721395664.8U Withdrawn - After Issue CN207978027U (en) 2017-10-18 2017-10-25 Camera module array and corresponding unitary substrate
CN201721385479.0U Active CN207665056U (en) 2017-10-18 2017-10-25 Photosensory assembly array for camera module array and corresponding camera module array
CN201721385762.3U Active CN207766338U (en) 2017-10-18 2017-10-25 Camera module array and unitary substrate for camera module array
CN201711008660.4A Active CN109688298B (en) 2017-10-18 2017-10-25 Camera module array and corresponding integrated substrate
CN201711060630.8A Active CN109683434B (en) 2017-10-18 2017-11-02 Camera module array
CN201721440261.0U Active CN207663195U (en) 2017-10-18 2017-11-02 camera module array
CN201711085379.0A Active CN109688302B (en) 2017-10-18 2017-11-07 Integrated substrate for camera module array, manufacturing method and die thereof
CN201721470922.4U Active CN208369686U (en) 2017-10-18 2017-11-07 Unitary substrate and its production mold, photosensory assembly array and camera module array
CN201711249119.2A Active CN109688303B (en) 2017-10-18 2017-12-01 Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method
CN201721656763.7U Active CN207691907U (en) 2017-10-18 2017-12-01 Photosensory assembly jigsaw, photosensory assembly and camera module

Country Status (1)

Country Link
CN (12) CN109688299B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109688299B (en) * 2017-10-18 2024-04-09 宁波舜宇光电信息有限公司 Camera module array and corresponding integrated substrate
WO2020043116A1 (en) 2018-08-28 2020-03-05 Zhejiang Dahua Technology Co., Ltd. Systems and methods for adjusting position of photosensitive chip of image acquisition device
CN109286743B (en) * 2018-10-24 2020-04-03 浙江大华技术股份有限公司 Flatness adjusting device and camera
CN109729645B (en) * 2019-01-21 2024-10-15 宁波舜宇光电信息有限公司 Circuit board, circuit board semi-finished product, electronic device and circuit board preparation method
CN111491074B (en) * 2019-01-25 2021-08-06 宁波舜宇光电信息有限公司 Composite support for camera module array and corresponding camera module array
CN109714515A (en) * 2019-02-19 2019-05-03 昆山丘钛微电子科技有限公司 TOF camera module and electronic product
CN110234001B (en) * 2019-06-04 2021-03-05 深圳市华芯技研科技有限公司 Portable binocular three-dimensional camera device
CN110290304B (en) * 2019-07-29 2021-08-20 Oppo广东移动通信有限公司 Depth camera and terminal
CN112333350A (en) * 2019-07-30 2021-02-05 宁波舜宇光电信息有限公司 Camera module, composite substrate, photosensitive assembly and manufacturing method thereof
CN112637447B (en) * 2019-10-08 2022-08-16 宁波舜宇光电信息有限公司 Composite substrate, photosensitive assembly, camera module and corresponding manufacturing method
CN112702475A (en) * 2019-10-17 2021-04-23 广州立景创新科技有限公司 Optical module
CN110794557A (en) * 2019-11-29 2020-02-14 浙江舜宇光学有限公司 Image pickup apparatus
CN111491084B (en) * 2020-04-21 2021-03-26 Oppo广东移动通信有限公司 A electronic equipment that is used for decoration of camera and has it
CN114650347B (en) * 2020-12-21 2024-03-15 宁波舜宇光电信息有限公司 Image sensor assembly, camera module and mobile device
CN112839159A (en) * 2021-03-19 2021-05-25 浙江舜宇智领技术有限公司 Camera module
CN113726995B (en) * 2021-08-12 2022-06-10 荣耀终端有限公司 Camera module structure and electronic equipment
TWI794101B (en) * 2022-04-21 2023-02-21 大根光學工業股份有限公司 Imaging lens module and electronic device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101144890A (en) * 2007-10-31 2008-03-19 无锡凯尔科技有限公司 Automatic microdistance regulation type mobile phone camera module group assembling process
CN104576674A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module and image sensing chip package structure thereof
CN105763780A (en) * 2016-04-07 2016-07-13 宁波舜宇光电信息有限公司 Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof
CN205545567U (en) * 2016-03-03 2016-08-31 南昌欧菲光电技术有限公司 Imaging module and electron device
CN205809504U (en) * 2016-06-23 2016-12-14 宁波舜宇光电信息有限公司 Focus camera module and focussing mechanism thereof
WO2017003140A1 (en) * 2015-06-29 2017-01-05 엘지이노텍 주식회사 Dual camera module and optical device
CN206212112U (en) * 2016-03-15 2017-05-31 宁波舜宇光电信息有限公司 Array camera module and its photosensory assembly
CN206313866U (en) * 2016-08-12 2017-07-07 宁波舜宇光电信息有限公司 Array camera module and its molding photosensory assembly and the electronic equipment with array camera module
CN207766338U (en) * 2017-10-18 2018-08-24 宁波舜宇光电信息有限公司 Camera module array and unitary substrate for camera module array

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011039377A (en) * 2009-08-17 2011-02-24 Minebea Co Ltd Camera module
CN102572320A (en) * 2011-11-28 2012-07-11 北京思比科微电子技术股份有限公司 Method for reducing height of CMOS (Complementary Metal-Oxide-Semiconductor Transistor) image sensor module and CMOS image sensor module
US9973669B2 (en) * 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
KR20170035237A (en) * 2015-09-22 2017-03-30 엘지전자 주식회사 Mobile terminal and method for controlling the same
US9781324B2 (en) * 2016-02-18 2017-10-03 Ningbo Sunny Opotech Co., Ltd. Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
CN105721749B (en) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 Camera module, electric support and circuit board assembly thereof and manufacturing method
CN206212113U (en) * 2016-03-15 2017-05-31 宁波舜宇光电信息有限公司 Array camera module and double camera modules and its circuit board module and electronic equipment
TWI731060B (en) * 2016-04-07 2021-06-21 大陸商寧波舜宇光電信息有限公司 Split type array camera module and its assembling and application method
CN206136071U (en) * 2016-07-03 2017-04-26 宁波舜宇光电信息有限公司 Photosensitive assembly and module of making a video recording
CN106550177A (en) * 2016-09-06 2017-03-29 华为机器有限公司 A kind of photographic head and its manufacture method and terminal

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101144890A (en) * 2007-10-31 2008-03-19 无锡凯尔科技有限公司 Automatic microdistance regulation type mobile phone camera module group assembling process
CN104576674A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module and image sensing chip package structure thereof
WO2017003140A1 (en) * 2015-06-29 2017-01-05 엘지이노텍 주식회사 Dual camera module and optical device
CN205545567U (en) * 2016-03-03 2016-08-31 南昌欧菲光电技术有限公司 Imaging module and electron device
CN206212112U (en) * 2016-03-15 2017-05-31 宁波舜宇光电信息有限公司 Array camera module and its photosensory assembly
CN105763780A (en) * 2016-04-07 2016-07-13 宁波舜宇光电信息有限公司 Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof
CN205809504U (en) * 2016-06-23 2016-12-14 宁波舜宇光电信息有限公司 Focus camera module and focussing mechanism thereof
CN206313866U (en) * 2016-08-12 2017-07-07 宁波舜宇光电信息有限公司 Array camera module and its molding photosensory assembly and the electronic equipment with array camera module
CN207766338U (en) * 2017-10-18 2018-08-24 宁波舜宇光电信息有限公司 Camera module array and unitary substrate for camera module array

Also Published As

Publication number Publication date
CN109683434A (en) 2019-04-26
CN109688298B (en) 2024-03-22
CN207691907U (en) 2018-08-03
CN109688299A (en) 2019-04-26
CN109688302A (en) 2019-04-26
CN207665056U (en) 2018-07-27
CN207663195U (en) 2018-07-27
CN109688303B (en) 2024-02-02
CN207978027U (en) 2018-10-16
CN109688303A (en) 2019-04-26
CN109688302B (en) 2023-11-03
CN208369686U (en) 2019-01-11
CN207766338U (en) 2018-08-24
CN109688298A (en) 2019-04-26
CN109688301A (en) 2019-04-26
CN109683434B (en) 2024-05-28

Similar Documents

Publication Publication Date Title
CN109688299B (en) Camera module array and corresponding integrated substrate
US11601576B2 (en) Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device
CN108401094B (en) Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module
CN110832835B (en) Fixed-focus camera module and electronic equipment
WO2018121793A1 (en) Separable photographic array module and manufacturing method thereof
US12003838B2 (en) Camera module and molded photosensitive assembly and electronic device
CN105472216B (en) Electric support and camera module with buffer structure
CN108270949B (en) Split type array camera module and manufacturing method thereof
JP3495008B2 (en) Solid-state imaging device and manufacturing method thereof
CN209982576U (en) Camera shooting module
EP1758373A2 (en) Solid image pickup unit and camera module
KR20100009410A (en) Camera module for mobile device
CN114982216B (en) Filtering component, camera module and multi-camera module
CN209982574U (en) Camera shooting module
CN109819142B (en) Split double-camera module, photosensitive assembly, manufacturing method and electronic equipment
CN211509146U (en) Double-camera module and electronic equipment
CN114390161B (en) Camera module and electronic equipment
CN209982575U (en) Camera shooting module
CN110855854B (en) Image pickup module, molded photosensitive member, method of manufacturing the same, and electronic apparatus
US11394861B2 (en) Camera module, manufacturing method thereof and corresponding intelligent terminal
CN111988498A (en) Camera module and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant