CN207663195U - camera module array - Google Patents
camera module array Download PDFInfo
- Publication number
- CN207663195U CN207663195U CN201721440261.0U CN201721440261U CN207663195U CN 207663195 U CN207663195 U CN 207663195U CN 201721440261 U CN201721440261 U CN 201721440261U CN 207663195 U CN207663195 U CN 207663195U
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- China
- Prior art keywords
- supporter
- wiring board
- camera module
- photosensitive element
- camera
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
- G03B17/14—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets interchangeably
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The utility model provides a kind of camera module array, including：First, second lens assembly；First, second photosensitive element；First colour filter；And unitary substrate.Unitary substrate includes：Wiring board and molded section.Wiring board has the first, second region for being suitable for installing the first, second lens assembly.Molded section is integrally formed the second surface in the wiring board, and covers first area and second area；There is unitary substrate the first, second burnishing surface in different height, the first, second photosensitive element to be respectively arranged in the first, second burnishing surface.First camera lens supporter bottom bears against first surface, and the first colour filter supporter is detached with the first camera lens supporter.The utility model can enhance pair board structure intensity for taking the photograph module, be capable of providing two different photosensitive element mounting surfaces of height, the radial dimension of reduction camera module array and its shoulder height and total height, and camera lens rear end is avoided to be interfered with colour filter supporter.
Description
Technical field
The utility model is related to optical technical fields, specifically, the utility model is related to the solutions of camera module array
Scheme.
Background technology
With the continuous development of smart machine, the requirement to camera module is higher and higher.For example, over the past two years, intelligent hand
The camera of machine is by individually becoming dual camera, and the development of dual camera module also becomes one of mobile phone camera module development
Important trend.In simple terms, dual camera can acquire image by the cooperation of two cameras, abundanter to realize
Image collecting function.Existing dual camera can be mainly divided into two classes according to function：One kind is to generate to stand using dual camera
Body vision obtains the depth of field of image, background blurring using depth of view information progress, scanning, auxiliary focusing, the applications such as action recognition,
Or it is merged using the information of two pictures；Another kind of merged using the two different pictures in left and right, it is expected
Obtain higher resolution ratio, better color, the better images such as dynamic range quality or the function of realizing optical zoom.
The dual camera of either any function, is required for the support of hardware, needs to consider that most basic one asks
Topic, that is, the assembling fixation problem between two cameras.How by two cameras steadily, compact-sizedly be assembled in one
It rises, becomes the module of an entirety, be the basic problem that dual camera module considers.On the other hand, dual camera is constituted
Two cameras be typically two different types be camera, for example one for being imaged, and one for recording the depth of field.It is this
The requirement of different function, usually so that the volume of two cameras is of different sizes, for example height is different, and how by two such
The camera of different height carries out stable bond, becomes an entirety, be encountered in the development of dual camera module it is another
A major issue.
In the prior art, a metallic support is usually made, holder tool there are two accommodating hole, make respectively by two cameras
After the completion of work, the two camera modules are respectively placed in two accommodating holes of the metallic support, material is thus formed more
It is reliable and stable double to take the photograph module.However the problems such as said program is there is also module larger, and cost increases.
Therefore, the solution of drawbacks described above currently can urgently be overcome.
Utility model content
The utility model is intended to provide a kind of solution for the above-mentioned at least one defect that can overcome the prior art.
One side according to the present utility model provides a kind of camera module array, including：First lens assembly,
Including the first camera lens and the first camera lens supporter；Second lens assembly；First photosensitive element；Second photosensitive element；First colour filter
Piece；And unitary substrate.Unitary substrate includes：Wiring board has the first area for being suitable for installing the first lens assembly
With the second area suitable for installing the second lens assembly, the wiring board also has close to first camera lens and second mirror
The first surface and the second surface opposite with the first surface of head；And molded section, it is integrally formed ground by moulding technology
It is formed in the second surface of the wiring board, and the molded section covers the second surface corresponding to the first area
At least part and the second surface correspond at least part of the second area；Wherein, the unitary substrate
With the first burnishing surface and the second burnishing surface in different height, it is smooth that first photosensitive element is installed on described first
Face, second photosensitive element are installed on second burnishing surface.
Wherein, the first camera lens supporter is installed on the first area of the wiring board and first camera lens
The bottom of supporter bears against the first surface, and first colour filter is mounted on the one by the first colour filter supporter
On formula substrate, the first colour filter supporter is detached with the first camera lens supporter.
Wherein, there is first through hole, first burnishing surface to be located at the first through hole for the first area of the wiring board.
Wherein, there is the first groove, first burnishing surface to be located at first groove for the first area of the wiring board.
Wherein, the unitary substrate further includes the first sheet metal, and the molded section has corresponding with the first through hole
The second through-hole for being suitable for accommodating first photosensitive element, first sheet metal covers the first through hole and described second
Through-hole, first burnishing surface are located at first sheet metal.
Wherein, at least one capacitance or resistive element are mounted on the second surface, described in the molded section covering at least
One capacitance or resistive element.
Wherein, the bottom of the first colour filter supporter is mounted on first photosensitive element, first colour filter
Piece is mounted on the top of the first colour filter supporter.
Wherein, the first colour filter supporter is in back-shaped.
Wherein, the first colour filter supporter include side wall (supporting body sidewall) and head cover with light hole (i.e.
Supporter extension), the bottom of the side wall is mounted on the wiring board.
Wherein, the unitary substrate further includes by the first gold medal of first photosensitive element and the circuit board electrical connection
Belong to line, the first colour filter supporter at least partly covers first metal wire.
Wherein, the first colour filter supporter is glue material.
Wherein, first colour filter is bonded in by glue material on first metal wire.
Wherein, the glue material covers first metal wire.
Wherein, the glue material fills the gap between first photosensitive element and the wiring board.
Wherein, the molded section has the contact surface contacted with the second surface, and extends shape by the contact surface
At the covering first through hole non-contact face, first burnishing surface is formed in the non-contact face.
Wherein, the non-contact face is in same plane with the contact surface.
Wherein, the non-contact face forms boss or groove, first burnishing surface are located at the boss in the non-contact face
Or groove.
Wherein, there is first sheet metal boss, first burnishing surface to be located at the boss of first sheet metal.
Wherein, first colour filter is mounted on the lower surface of the head cover (and supporter extension).
Wherein, the first camera lens supporter is the first motor.
Wherein, second lens assembly includes the second camera lens and the second camera lens supporter.
Wherein, first lens assembly is zoom lens assemblies, and second lens assembly is tight shot component.
Compared with prior art, the utility model has following at least one technique effect：
1, the utility model can enhance the structural strength for having double substrates for taking the photograph module there are two different optical designs.
2, the utility model is capable of providing the mounting surface of two different photosensitive elements of height, to which preferably adaptation has
Two the double of different optical designs take the photograph module.
3, there are two the double of different optical designs to take the photograph module for tool for the utility model, can cancel the tool in traditional scheme
There are two the metallic supports of accommodating hole, to save cost, reduce production process.
4, the utility model helps to reduce the radial dimension of camera module array, while avoiding camera lens rear end and colour filter
It is interfered between supporter.
5, contribute to reduce the shoulder height of camera module and total height.
Description of the drawings
Exemplary embodiment is shown in refer to the attached drawing.Embodiment and attached drawing disclosed herein should be considered illustrative
, and not restrictive.
Fig. 1 shows the camera module array of the utility model one embodiment；
Fig. 2 shows the shapes of the molded section 500 in other several embodiments；
Fig. 3 shows the camera module array of another embodiment of the utility model；
Fig. 4 shows the camera module array of another embodiment of the utility model；
Fig. 5 shows the camera module array of the utility model further embodiment；
Fig. 6 shows the camera module array of the utility model further embodiment；
Fig. 7 shows the camera module array of the utility model further embodiment；
Fig. 8 shows the camera module array of the utility model further embodiment；
Fig. 9 shows the camera module array of the utility model further embodiment；
Figure 10 shows the camera module array of the utility model further embodiment；
Figure 11 shows the camera module array of the utility model further embodiment；
Figure 12 shows the camera module array of the utility model further embodiment；
Figure 13 shows the camera module array of the utility model further embodiment；
Figure 14 shows the camera module array of the utility model further embodiment；
Figure 15 shows the camera module array of the utility model further embodiment；
Figure 16 shows the camera module array of the utility model further embodiment；
Figure 17 shows the camera module arrays of the utility model further embodiment；
Figure 18 shows the camera module array of the utility model further embodiment.
Specific implementation mode
Refer to the attached drawing is made more detailed description by the application in order to better understand to the various aspects of the application.It answers
Understand, the description of the only illustrative embodiments to the application is described in detail in these, rather than limits the application in any way
Range.In the specification, the identical element of identical reference numbers.It includes associated institute to state "and/or"
Any and all combinations of one or more of list of items.
It should be noted that in the present specification, the first, second equal statement is only used for a feature and another feature differentiation
It comes, and does not indicate that any restrictions to feature.Therefore, discussed below without departing substantially from teachings of the present application
First main body is also known as the second main body.
In the accompanying drawings, for convenience of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative
And it is and non-critical drawn to scale.
It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory
In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or
It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or combination thereof.In addition, ought be such as
When the statement of at least one of " ... " appears in after the list of listed feature, entire listed feature is modified, rather than is modified
Individual component in list.In addition, when describing presently filed embodiment, use " can with " indicate " one of the application or
Multiple embodiments ".Also, term " illustrative " is intended to refer to example or illustration.
As it is used in the present context, term " substantially ", " about " and similar term are used as the approximate term of table, and
Be not used as the term of table degree, and be intended to illustrate by by those skilled in the art will appreciate that, measured value or calculated value
In inherent variability.
Unless otherwise defined, otherwise all terms (including technical terms and scientific words) used herein all have with
The application one skilled in the art's is generally understood identical meaning.It will also be appreciated that term (such as in everyday words
Term defined in allusion quotation) it should be interpreted as having the meaning consistent with their meanings in the context of the relevant technologies, and
It will not be explained with idealization or excessively formal sense, unless clear herein so limit.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 1 shows the camera module array of the utility model one embodiment.With reference to figure 1, the camera module array
Including optical design different the first camera module and the second camera module, first camera module and the second camera shooting mould
Organize shared unitary substrate 600.Wherein, the unitary substrate 600 including integral type wiring board 400 and passes through moulding technology shape
At the molded section 500 in the integral type wiring board 400.
In the present embodiment, integral type wiring board 400 has the first surface positioned at the upside of the integral type wiring board 400
410 and the second surface 420 opposite with the first surface, wherein the first surface 410 is for installing the first lens assembly
100 and second lens assembly 200.For ease of description, will be used to install first lens assembly on wiring board 400 herein
100 region is known as first area, will be known as second for installing the region of second lens assembly 200 on wiring board 400
Region.Lens assembly includes camera lens, further includes the components such as motor or camera lens supporter sometimes.In the present embodiment, the first lens group
Part 100 includes the first camera lens 101 and the first motor 102, and the second lens assembly 200 includes the second camera lens 201, camera lens supporter
202 and mounted on camera lens supporter 202 and positioned at 202 rear end of the second camera lens the second colour filter 206.It is noted that
In other embodiments, the second lens assembly 200 can not include second colour filter 206, under this situation, the second colour filter
206 can be installed on the microscope base of integral type wiring board 400.
In the present embodiment, the molded section 500 is formed in described the of the integral type wiring board 400 by moulding technology
Two surfaces 420, and cover the first area and the second area.The molded section 500 forms plate, and to the one
Formula wiring board 400 plays strengthening action so that the integral type wiring board 400 combined with the molded section 500 has more preferably
Structural strength and stability improve the reliability of module entirety.
Further, the first area of wiring board 400 has be suitable for accommodating first photosensitive element 104 first to lead to
Hole.Molded section 500 covers first through hole, and the upper surface of the molded section 500, which is formed, is suitable for installing the of the first photosensitive element 104
One burnishing surface.Here upper surface, that is, molded section 500 covers the surface of the part of first through hole.Specifically, molded section 500 have with
The contact surface 510 that the second surface 420 of wiring board 400 contacts, and by covering that the contact surface 510 extends to form described the
The non-contact face 520 of one through-hole, first burnishing surface are formed in the non-contact face 520.In the present embodiment, covering described the
Contact surface 510 between the non-contact face 520 and wiring board 400 and molded section 500 of one through-hole is in same plane, but needs to note
Meaning, the utility model are not limited to this.In the other embodiments of the utility model, between wiring board 400 and molded section 500
Contact surface 510 can be not at same plane.
In one embodiment, it is formed at the second area of wiring board 400 and is suitable for installing the second of the second photosensitive element 204
Burnishing surface.First burnishing surface and second burnishing surface are in different height, so as to fitting optical design it is different (such as
It is burnt different afterwards) two camera modules.Here highly refer to the size (one on the thickness direction of the unitary substrate 600
The thickness direction of formula substrate 600 can be understood as along camera module optical axis direction, therefore can also become " axial direction ").Into one
Step ground, can increase by a dieelctric sheet 207, be provided by the dieelctric sheet 207 in one embodiment, on the second area of wiring board 400
Second burnishing surface.In this manner it is possible to adjust the difference in height of the first photosensitive element 104 and the second photosensitive element 204 more flexiblely.
Further, due to the rear burnt difference of first camera module 100 and second camera module 200, cause
Cause first camera module 100 different with the thickness direction size of second camera module 200, thus traditional one
Body formula is double to be taken the photograph in module, and the height of first camera module 100 and second camera module 200 is typically one high and one low
(in the present embodiment, the first camera module 100 is higher than the second camera module 200).But required pair of existing market takes the photograph mould
Group generally requires that camera lens front end face (either camera lens incidence surface) is made to maintain an equal level to meet beautiful or image processing algorithm etc.
Requirement.It is typically to make two camera modules respectively in the prior art, then again by there are two tools to meet above-mentioned requirements
The metallic support of accommodating hole combines two camera modules.
In the present embodiment, the first photosensitive element 104 can be made relative to the second sense by the first through hole of the wiring board 400
Optical element 204 sinks (described herein to sink to referring to that the height of the first photosensitive element 104 be less than the second photosensitive element 204
Highly), and first photosensitive element 104 is formed in the lower section of the wiring board 400 by the molded section 500 and is supported,
There are a differences in height to making between first photosensitive element 104 and second photosensitive element 204, and by the height
Spend the adjusting of difference so that the upper surface of first camera module 100 and second camera module 200 maintains an equal level, described in satisfaction
The double imaging demands for taking the photograph module of integral type.
In the embodiment in figure 1, the first area and the second area is completely covered in the molded section 500, but needs
It should be noted that the utility model is not limited to this.In other embodiments, the molded section 500 can partly cover described first
Region and the second area.Fig. 2 shows the shapes of the molded section 500 in other several embodiments.As shown in Fig. 2, described
Molded section 500 can only be covered in the subregion of the second surface 420 of the integral type wiring board 400, i.e., the described first area
The bottom of opening area all covers, and the bottom of the second area only has subregion capped.It in this way can be described
One difference of height is formed on the bottom in two regions, certain avoiding space is provided, to be adapted to different terminals (such as smart mobile phone)
Design requirement (such as other components of smart mobile phone can be accommodated in aforementioned avoiding space).Second lens assembly 200
The usually annular, therefore the combined area of second lens assembly 200 and the integral type wiring board 400 of camera lens support portion 202
Domain is an annular region in the second area.In a preferred embodiment, the molded section 500 covers the annulus
Domain, so as to wiring board 400 described in reinforcement.Also, in molded section 500, part and the covering described first of the annular region are covered
The part in region is integrally joined to each other, to enhance the bonding strength between the first area and the second area.
It is noted that being covered to the bottom of the integral type wiring board 400 using the molded section 500, no
But double structural strengths for taking the photograph module can be improved, it can also be according to double actual design demands for taking the photograph module by molding work
The molding of skill formation different size, different-thickness, to adapt in Cell Phone Design, the demand of different accommodation spaces has higher
Production chains.
There is the first sense for accommodating first camera module 100 due to the first area of integral type wiring board 400
The through-hole of optical element 104 causes the being wired of first area or installation region more nervous, passes through the capacitance or resistance member
Some or all of the first camera module capacitance or resistive element 108 can be installed on described by the arrangement mode of part 108
The second surface 420 of integral type wiring board 400, to make in the first surface 410 corresponding to the first area
Do not install or install less the capacitance or resistive element 108 in part.Additionally due to the capacitance or resistive element 108 are described
The space that first surface 410 occupies becomes smaller, and can be the installation space that installation camera lens, motor and chip installation provide bigger,
To under the premise of not expanding the area of the integral type wiring board 400, meet normal cabling arrangement and other elements
Installation, to not increase double overall dimensions for taking the photograph module.
Due to the particularity of moulding material, when the molded section 500 coats the capacitance or resistive element 108, the mould
The thickness in modeling portion 500 need to only be slightly above 108 maximum height of the capacitance or resistive element, can be by the capacitance or resistive element
108 claddings wherein, without reserving the devices such as microscope base or other protective shells cover the capacitance or resistive element 108 when institute
The avoiding space needed, thus axial dimension (i.e. the thickness direction of wiring board 400) very little of the molded section 500.
Further, sunk relative to the integral type wiring board 400 due to first sensitive chip 104, institute
The first lens assembly 100 is stated also and should reduce the axial distance between the integral type wiring board 400, so that it is guaranteed that described first
The rear coke of camera module is constant, to meet design requirement.
But when the space between diminution first lens assembly 100 and the integral type wiring board 400 is to meet
When stating the design requirement of the first camera module 100, it can cause between first lens assembly and the integral type wiring board 400
Installation space reach capacity, it is difficult to install other elements again, thus first lens assembly is directly mounted at the one
On formula wiring board.
In the embodiment of Fig. 1, first lens assembly 100 includes the first camera lens 101 and the first camera lens supporter 102.
First lens assembly 100 is installed on the first area of the integral type wiring board 400 by the first camera lens supporter 102.
In the present embodiment, the bottom surface of the first camera lens supporter 102 directly bears against the first surface 410 of assist side 400, so that institute
The first photosensitive element 104 is stated in the case where sunk type designs, can also ensure the rear burnt satisfaction of first camera module 100
Design requirement.
In the present embodiment, first camera module further includes the first color-filter element supporter 109 and the first color-filter element
106.The first color-filter element supporter 109 is hollow supporter for carrying the first color-filter element 106.In the present embodiment,
The first color-filter element supporter 109 is installed on the non-photo-sensing area of first photosensitive element 104, so that described first
Color-filter element supporter 109 neither influences first photosensitive element 104 and is imaged, and can also make the first microscope base supporter
102 prevent take up the installation site of the first surface 410 of the integral type wiring board 400, to avoid double radial direction (these for taking the photograph module
Literary middle finger is perpendicular to the direction of the optical axis of camera module) size increase.Also, in the present embodiment, the first camera lens supporter
102 directly bear against with the integral type wiring board 400, additionally it is possible to reduce the first color-filter element supporter 109 and described one
Axial dimension between body formula wiring board 400.
It is noted that the first color-filter element supporter 109 can be plastic material, can be metal material,
It can also be cured glue material.It is noted that the optional material of the first color-filter element supporter 109 is not limited to above-mentioned three
Kind, above-mentioned three kinds of materials are intended only as illustrating in the present embodiment, not as the limitation of the present embodiment.
Further, in one embodiment, when to be installed on described first photosensitive for the first color-filter element supporter 109
When the non-photo-sensing area of element 104, first metal wire 103 is located at the periphery of the first color-filter element supporter 109.
Still refer to the attached drawing 1, first photosensitive element 104 and second photosensitive element 204 pass through the first gold medal respectively
Belong to line 103 (such as gold thread) and second metal wire 203 (such as gold thread) realization is electrically connected with the integral type wiring board 400
It connects, and there are certain loop heights for the metal wire, in subsequent packaging technology, it should be noted that it is high to avoid the bank
Degree influences double functions of taking the photograph module to prevent being damaged on the metal wire.
When using the first color-filter element supporter 109 shown in FIG. 1, it is not necessary to consider in the direction of the optical axis because of the bank
First metal wire 103 highly is avoided, as long as considering the first color-filter element supporter 109 and first colour filter
106 do not interfere with first metal wire 103 radially, this makes the first color-filter element supporter 109
Height can further decrease.Also, since the part or all of capacitance or resistive element 108 are arranged at the one
The second surface 410 of the first area of formula wiring board 400, therefore on the first surface 410 of the first area, need
The capacitance or resistive element 108 to be avoided tail off or need to avoid without the capacitance or resistive element 108, thus described
There are enough installation spaces for installing the first camera lens branch on 400 first color-filter element supporter 109 of integral type wiring board
Support body 102.
Further, due to the contact area between the first camera lens supporter 102 and the integral type wiring board 400
It is significantly greater than in traditional handicraft, the contact area between microscope base side wall and wiring board, thus by the first camera lens supporter
102 are directly mounted on the integral type wiring board 400, and double modules of taking the photograph is enabled to have better flatness and structure
Stability also improves double space availability ratios for taking the photograph module.
In addition to this, since the first camera lens supporter 102 is directly born against on the integral type wiring board 400, phase
When the whole height in the module has lacked the thickness of the first color-filter element supporter 109, therefore by institute in the present embodiment
State the non-photo-sensing area that the first color-filter element supporter 109 is directly mounted at first photosensitive element 104, additionally it is possible to described in reduction
Double integral thickness (axial dimension) for taking the photograph module, conducive to double miniaturizations for taking the photograph module.
Further, ensureing that the avoiding space between first camera lens 101 and first color-filter element 106 is enough
When, it should make first color-filter element 106 far from first photosensitive element 104 as possible, that is, increase by first color-filter element
The thickness of supporter 109 takes the photograph mould to reduce double probability for taking the photograph generation dirty stain when module is imaged to improve described pair
The production yield of group.
In one embodiment, second camera module 200 include the second photosensitive element 204, described second photosensitive yuan
Part 204 is installed on the first surface 410 of the second area of the integral type wiring board 400, and described second photosensitive yuan
Part 204 is in Different Plane with first photosensitive element 104, to meet first camera module 100 and described second
The different optical design demands of camera module 200 so that described pair is taken the photograph module and can be preferably imaged.
In the present embodiment, first camera module uses zoom module, second camera module to use fixed-focus mould
Group, thus the first camera lens supporter 102 is the first motor, second camera module need not use motor, pass through one
A second camera lens supporter 202 supports the second camera lens 201 of second camera module 200.The second camera lens supporter
202 are installed on the second area of the integral type wiring board 400, and the second camera lens supporter 202 and the integral type line
There are an accommodation spaces, second photosensitive element 204, and described one is installed in the accommodation space 204 between road plate 400
Body formula wiring board 400.Second camera module further includes one second color-filter element 206, and second color-filter element 206 is pacified
Bottom side loaded on the second camera lens supporter 202 and with second photosensitive element 204 have a certain distance.
Further, first camera module and second camera module can also be all made of zoom module, described
First camera lens supporter and the second camera lens supporter can be respectively the first motor and the second motor.Second camera lens
201 are installed on second motor, and second color-filter element 206 is installed on the lower section of second camera lens 201 or is installed on
The lower section of second motor, and have enough spaces between second color-filter element 106 and second camera module 200
It, will not be with second color-filter element 206 to avoid second camera lens 201 when zooming for the second camera module zoom
It interferes.
Fig. 3 shows the camera module array of another embodiment of the utility model.In the present embodiment, described second takes the photograph
As module may also include the second sheet metal 207, it is set between second photosensitive element 204 and the first surface 410,
To more easily adjust the difference in height between second photosensitive element 204 and first photosensitive element 104.When described
When generating heat in two photosensitive elements, 204 imaging process, second sheet metal 207 can also play the function of helping to radiate.
Further, in one embodiment, the camera module array further includes a separator 300, the separator
300 between first camera module 100 and second camera module 200, for first camera module 100
Auxiliary reinforcement and demagnetizing action are played with second camera module 200, prevents first camera module 100 and described second from taking the photograph
The imaging effect of the camera module array is influenced as the relative position between module 200 changes.
In one embodiment, for there are two the double of different optical designs to take the photograph module, module knot can be improved by molding
The firmness and stability of structure, to cancel traditional double tools taken the photograph in manufacturing process, there are two the metallic supports of accommodating hole, not only
Technological process can be reduced, additionally it is possible to reduce cost.
Generally speaking, the via design of the integral type wiring board 400 makes first photosensitive element 104 and described
Two photosensitive elements 204 are in Different Plane, and there are differences in height, so that first camera lens 101 and described after installation is complete
The camera lens end face of second camera lens 201 maintains an equal level, to meet most double design needs for taking the photograph module；Secondly as the through-hole of wiring board
Design, part or all of capacitance or resistive element 108 are installed in the bottom of the integral type wiring board 400, and by the mould
Modeling portion 500 coats so that the top of the integral type wiring board 400 has more flat spaces, improves described pair and takes the photograph module
Integral space utilization ratio；Again, the first camera lens supporter 102 is directly mounted on the integral type wiring board 400, because
And the first color-filter element supporter 109 is mountable to the non-photo-sensing area of first photosensitive element 104, is not only able to reduce
The shoulder height of the first camera lens supporter 102, additionally it is possible to increase double structural stabilities for taking the photograph module；Again, the molding
Portion 500 has high intensity, the characteristic of high rigidity, can effectively improve double overall construction intensities for taking the photograph module, improve module
The stability of structure can cancel traditional double tools taken the photograph in module there are two the metallic support of accommodating hole, effectively reduce production cost.
Fig. 4 shows camera module array in another embodiment of the utility model.In the present embodiment, the molded section 500
The non-contact face 520 can also have a groove, the groove correspond to the integral type wiring board 400 through-hole, institute
The first photosensitive element 104 is stated to be installed on the groove.The groove surfaces are smooth, to be effectively ensured described first photosensitive yuan
The installation flatness of part 104, second photosensitive element 204 are still installed on the contact surface 510, and the groove can increase
Add the difference in height between first photosensitive element 104 and second photosensitive element 204, consequently facilitating adjustment first sense
Difference in height between optical element 104 and second photosensitive element 204, better adapt to double design requirement for taking the photograph module and
Imaging demand.
Further, in one embodiment, the non-contact face 520 of the molded section 500 can also have a boss,
When first photosensitive element 104 is installed on the boss, it is installed on second photosensitive element 204 and the integral type line
Second sheet metal 207 between road plate 400 need to correspond to adjusting thickness, to ensure first photosensitive element 104 and institute
Difference in height needed for stating between the second photosensitive element 204 meets double imaging demands for taking the photograph module.
Fig. 5 shows the camera module array in the utility model further embodiment.In the present embodiment, the integral type
The first surface 410 of wiring board 400 can also have main part 411 and changeover portion 412, the main part 411 to be used for
The first camera lens supporter 102 is installed, the changeover portion 412 is generally aligned in the same plane with the first surface 410, the transition
Section 412 is located at the position that the first surface 410 abuts the through-hole.The changeover portion 412 does not exist with the main part 411
Same plane and the changeover portion 412 are less than the main part 411, step-like to form one with the main part 411
Structure, the step-like structure can be such that the loop height of first metal wire 103 reduces, to reduce first colour filter
Interference risk between element supporter 109 and first metal wire 103.
In the present embodiment, the loop height of first metal wire 103 reduces, and can make the first color-filter element supporter
Accommodation space between 109 first motors 102 and first metal wire 103 becomes larger, and is meeting first motor 102 at this time
Under the premise of double design requirements for taking the photograph module, the longitudinal size of the first camera lens supporter 102 can further decrease,
To reduce the shoulder height of the first camera lens supporter 102.
Fig. 6 shows the camera module array in the utility model further embodiment.In the present embodiment, the molded section
500 can also have a through-hole, and the through-hole of the lead to the hole site of the molded section 500 and shape and the integral type wiring board 400
Location and shape are identical, and corresponding with the through-hole of the integral type wiring board 400, and the bottom of the molded section 500 is also at this time
It can increase by one first sheet metal 107, first sheet metal 107 is capable of providing a flat surface, for installing first sense
Optical element 104, and first sheet metal 107 can have a boss for installing first photosensitive element, can also be
The surface of one smooth no boss, the concrete shape of first sheet metal 107 can according to first photosensitive element 104 with it is described
Required difference in height is designed between second photosensitive element 204.First sheet metal 107, which has, helps first sense
The effect that optical element 104 radiates.
Further, first sheet metal 107 can only be covered in the via bottoms of the molded section 500, also can one
Body it is covered in all areas of the molded section 500.The step structure of the integral type wiring board 400 and second sense
Second sheet metal 207 of 204 bottom of optical element can then be adjusted according to double design needs for taking the photograph module.
Fig. 7 shows the camera module array in the utility model further embodiment.The present embodiment and reality shown in FIG. 1
It is essentially identical to apply example.Difference lies in the shapes and mounting means of the first color-filter element supporter 109 for the two.With reference to figure 7, this implementation
In example, first lens assembly includes that the first camera lens 101 and the first camera lens supporter 102 are used to support first camera lens
101, the first camera lens supporter 102 is directly mounted at the first area of the integral type wiring board 400, so that described
First photosensitive element 104 can also ensure that the rear burnt satisfaction of first camera module 100 is set in the case where sunk type designs
Meter requires.
First camera module further includes the first color-filter element supporter 109, the first color-filter element supporter 109
For hollow supporter, it is installed on the first surface of the integral type wiring board 400, and surround first through hole.First colour filter
Element supporter 109 separates placement with the first camera lens supporter 102.With reference to figure 7, the first color-filter element support
Body 109 includes support body sidewall and supporter extension.The support body sidewall is mounted on the wiring board 400, and is supported
The bottom surface of body sidewall bears against the wiring board 400.The top of the support body sidewall extends internally (i.e. photosensitive to described first
Extend at the center of element 104) form supporter extension.In a ring, centre forms a light hole to the supporter extension.
Supporter extension is for installing the first color-filter element 106.The light hole corresponds to the photosensitive of first photosensitive element 104
Area, light can enter the photosensitive area (i.e. described of first photosensitive element 104 by first color-filter element 106
The region that one photosensitive element can be imaged).Supporter extension does not contact the surface of wiring board 400, and in other words, supporter prolongs
There is gap between extending portion and wiring board.
Summarize in one embodiment, when the first color-filter element supporter 109 and 102nd area of the first camera lens supporter
When ground is set to the integral type wiring board 400, the capacitance or resistive element 108 are all set to the one as possible
The second surface 420 of formula wiring board 400, to enable first surface 410 to have enough flat surfaces for installing described the
One camera lens supporter 102 and the first color-filter element supporter 109.
The first camera lens supporter 102 and the first color-filter element branch are installed when being removed on the first surface 410
When the space, also remaining installation space of support body 109, it also may be selected the part capacitance or resistive element being set to described
First surface 410.
It is noted that the first color-filter element supporter 109 can be plastic material, can be metal material,
It can also be cured glue material.It may be noted that the optional material of the first color-filter element supporter 109 is not limited to above-mentioned three kinds,
Above-mentioned three kinds of materials are intended only as distance in the present embodiment and illustrate, not as the limitation of the present embodiment.
First camera module 100 further includes the first camera lens 101 and the first mirror for installing first camera lens 101
Head supporter 102, the first camera lens supporter 102 are installed on the integral type wiring board 400.
In one embodiment, it is deposited between the first camera lens supporter 102 and the first color-filter element supporter 109
In enough accommodation spaces so that when first camera module 100 is zoom module, first camera lens 101 is described
In first camera lens supporter 102 when moveable zoom, it will not be supported with first color-filter element 106 or first color-filter element
Body 109 interferes, to ensure the normal imaging of first camera module 100.
By in this present embodiment, the first color-filter element supporter 109 and the first camera lens supporter 102 are located
In on the integral type wiring board 400, to reserve enough installation spaces to the first camera lens supporter 102, described first
Color-filter element supporter 109 reduces the thickness of side wall and the first color-filter element supporter 109 is installed on close to described
The first through hole edge of the first area of integral type wiring board 400.
Further, first color-filter element 106 can be installed on the top surface of the first color-filter element supporter 109
Or bottom surface, but first camera lens 101 and the first microscope base supporter 102 and first color-filter element 106 it
Between accommodation space it is enough when, can make first color-filter element 106 as possible far from first photosensitive element 104, to
It reduces described pair and takes the photograph the probability for forming dirty stain when module imaging, and then improve double production yields for taking the photograph module.
Further, since the part or all of capacitance or resistive element 108 are arranged at the integral type circuit
The second surface 420 of plate 400, thus the first color-filter element supporter 109 does not need or only needs to avoid on a small quantity
The capacitance or resistive element 108.But the first color-filter element supporter 109 is in the design process, it may be noted that evacuation
The loop height of first metal wire 103, i.e., described first color-filter element supporter, 109 side wall or first color-filter element
Height need to be higher than first metal wire 103 bank peak, to avoid the first color-filter element supporter 109 with
First metal wire 103 interferes and damages first metal wire 103, influences double modules of taking the photograph and is imaged.
Further, due to the contact area between the first camera lens supporter 102 and the integral type wiring board 400
It is significantly greater than in traditional handicraft, the contact area between microscope base side wall and wiring board, thus first motor 102 is direct
It is installed on the integral type wiring board 400, enables to double modules of taking the photograph that there is better flatness and structural stability,
Also improve double space availability ratios for taking the photograph module.
In addition to this, since the first camera lens supporter 102 is directly mounted on the integral type wiring board 400, phase
When the whole height in the module has lacked the thickness of the first color-filter element supporter 109, described first is further decreased
(shoulder height described herein refers to that the first camera lens supporter 102 arrives the integral type circuit to the shoulder height of microscope base supporter 102
The height of the first surface 410 of plate 104), conducive to double miniaturizations for taking the photograph module.
Further, Fig. 8 shows the camera module array of the utility model further embodiment.In the present embodiment, institute
It states the second camera module and may also include the second sheet metal 207, be installed on second photosensitive element 204 and the first surface
Between 410, to more easily adjust the difference in height between second photosensitive element 204 and first photosensitive element 104.
Fig. 9 shows the camera module array of the utility model further embodiment.In the present embodiment, the molded section
The 500 non-contact face 520 can also have a groove, the groove to correspond to the through-hole of the integral type wiring board 400,
First photosensitive element 104 is installed on the groove.The groove surfaces are smooth, photosensitive to be effectively ensured described first
The installation flatness of element 104, second photosensitive element 204 are still installed on the contact surface 510, and the groove can
Increase the difference in height between first photosensitive element 104 and second photosensitive element 204, consequently facilitating adjustment described first
Difference in height between photosensitive element 104 and second photosensitive element 204 better adapts to double design requirements for taking the photograph module
And imaging demand.
Further, the non-contact face 520 of the molded section 500 can also have a boss (attached to be not shown in figure),
The boss is identical as the position of the groove, when first photosensitive element 104 is installed on the boss, is installed on described
Second sheet metal 207 between second photosensitive element 204 and the integral type wiring board 400 need to correspond to adjusting thickness, from
And the difference in height needed for ensureing between first photosensitive element 104 and second photosensitive element 204, meet described pair and takes the photograph mould
The imaging demand of group.
Figure 10 shows the camera module array of the utility model further embodiment.In the present embodiment, the integral type
The first surface 410 of wiring board 400 can also have main part 411 and changeover portion 412, the main part 411 to be used for
The first color-filter element supporter 109 is installed, the changeover portion 412 is generally aligned in the same plane with the first surface 410, described
Changeover portion 412 is located at the position that the first surface 410 abuts the through-hole.The changeover portion 412 and the main part 411
Not in same plane and the changeover portion 412 is less than the main part 411, to form one with the main part 411
Stepped structure, the step-like structure can be such that the loop height of first metal wire 103 reduces, reduce first colour filter
Interference risk between element supporter 109 and first metal wire 103.
Further, the loop height of first metal wire 103 reduces, and can make the first color-filter element supporter
Accommodation space between 109 and first metal wire 103 becomes larger, and is meeting first motor 102 at this time and described double is taking the photograph
Under the premise of the design requirement of module, the longitudinal size of the first color-filter element supporter 109 and first motor 102 can
It further decreases, to reduce the shoulder height of first motor 102.
Figure 11 shows the camera module array of the utility model further embodiment.In the present embodiment, the integral type
The via regions of wiring board 400 can become with the design of sunk type groove rather than via design, and described first is photosensitive at this time
Element 104 is installed on the groove surfaces of the integral type wiring board 400.
The groove surfaces are smooth, and to ensure the installation flatness of first photosensitive element 104, described second is photosensitive
Element 204 is still installed on the first surface 410 of the first area of the integral type wiring board 400, to make
Still remain difference in height between first photosensitive element 104 and second photosensitive element 204, and be adjusted described the
Difference in height between one photosensitive element 104 and second photosensitive element 204 so that first camera module 100 and described
The upper surface of second camera module 200 can maintain an equal level, to meet double design requirements for taking the photograph module.
Further, when the first area of the integral type wiring board 400 is designed for groove rather than via design,
It can be according to the installation between first camera module 100 and second camera module 200 and the integral type wiring board 400
Position, suitably adjust the molded section 500 the second surface 420 of the integral type wiring board 400 area coverage
And covering shape, but it is covered in the second surface 420 with being preferably covered in 500 integrally connected of the molded section, to more excellent
Ground enhances double structural strengths and structural stability for taking the photograph module.
Figure 12 shows the camera module array of the utility model further embodiment.In the present embodiment, the integral type
The first area of wiring board 400 is designed for groove rather than via design, second photosensitive element 204 and the integral type
It can increase by the second sheet metal 207 between wiring board 400, it is photosensitive preferably to adjust described first by second sheet metal 207
Difference in height between element 104 and second photosensitive element 204, to meet double design requirements for taking the photograph module.
Figure 13 shows the camera module array of the utility model further embodiment.In the present embodiment, the molded section
500 can also have a through-hole, and the through-hole of the lead to the hole site of the molded section 500 and shape and the integral type wiring board 400
Location and shape are identical, and corresponding with the through-hole of the integral type wiring board 400, and the bottom of the molded section 500 needs at this time
Increase by one first sheet metal 107 to install first photosensitive element 104, and the sheet metal can only be covered in the mould
The via bottoms in modeling portion 500 also can integrally be covered in all areas of the molded section 500.
The step structure of the integral type wiring board 400 and the second sheet metal of 204 bottom of the second photosensitive element
207 can be adjusted according to double design needs for taking the photograph module.
Figure 14 shows the camera module array of the utility model further embodiment.In the present embodiment, described first takes the photograph
As module can also be cancelled such as Fig. 1 or shown in Fig. 7 colour filter supporters, but first metal wire 103 is covered with glue material, it will
First color-filter element 106 is arranged in the glue material.First metal wire 103 is covered at this time acts as the first colour filter
The effect of supporter.Also, under this scheme, the first colour filter supporter will not occupy first table of the first area
The installation site in face 410 is further reduced the installation space installed occupied by first color-filter element 106, is described first
Camera lens supporter 102 reserves more sufficient installation space.And glue material has certain elasticity, can play cushioning effect, from
And avoiding the first metal wire 103 and the first colour filter 106 from hitting mutually causes the first metal wire 103 or the first colour filter 106 to damage
It is bad.In a preferred embodiment, the glue material is step glue.Although being noted that in above-described embodiment, first colour filter
Element 106 is installed in the glue material covered on first metal wire 103, but covers the material of first metal wire 103
It is not limited to glue material.
Further, double production costs for taking the photograph module can further be saved by cancelling the design of the microscope base, meanwhile, it will
First motor 102 is directly seated on the integral type wiring board 400, additionally it is possible to effectively reduce by first motor 102
Shoulder height, and first motor 102 is directly mounted on the integral type wiring board 400, additionally it is possible to effectively be enhanced described double
Take the photograph the structural strength and structural stability of module.
Being the integral type wiring board 400 shown in attached drawing 14 has groove and a non through hole scheme, but the present embodiment
It is not limited to illustrated scheme, can also be designed in the first area of the integral type wiring board 400 according to actual design requirement
Through-hole designs the through-hole or groove for adapting to the integral type wiring board 400, the second camera shooting mould in the molded section 500
Group 200 also can be according to actual design needs, described the of second photosensitive element 204 and the integral type wiring board 400
Increase by the second sheet metal 207 between two regions, for adjusting first photosensitive element 104 and second photosensitive element 204
Between difference in height, to preferably meet double design requirement for taking the photograph module.
Further, Figure 15~18 show that the through hole in the integral type wiring board 400 increases the implementation of gasket
Example.In these embodiments, the second surface 420 of the wiring board 400 is also equipped with the first gasket 800, and the through-hole is described
First gasket 800 covers, and the upper surface of first gasket 800 is smooth, to provide a flat surface for installation institute
State the first photosensitive element 104.The molded section 500 is integrally formed the second surface in the integral type wiring board 400
420 and first gasket 800 lower surface.First gasket 800 can be flat, can also be in U-typed shape.
Figure 15~16 show the schematic diagram of the embodiment of first gasket 800 with U-typed shape.Wherein, " U "
The upper surface of first gasket 800 of type shape is smooth.
Figure 17~18 show the schematic diagram of the embodiment of flat first gasket 800.In the integral type wiring board
Increase by first gasket 800 at 400 lead to the hole site, the technology difficulty of molding can be reduced, improves double quality for taking the photograph product.
It may be noted that the first gasket 800 of U-typed shape can be to lower recess, and can also be to raise up, it thus can be according to reality
The difference in height of first photosensitive element 104 and second photosensitive element 204 is arranged in border situation.First gasket 800
It can be fabricated to the shape of the first sheet metal 107 in Fig. 6 embodiments, i.e., raised solid platy structure.Utilize the protrusion
The upper surface of structure is for installing first photosensitive element 104.
Further, in attached embodiment illustrated in fig. 14, first color-filter element 106 is installed on covering first gold medal
Belong to the scheme in the glue material of line 103, can also take and increase institute between the integral type wiring board 400 and the molded section 500
The scheme for stating the first gasket 800 plays strengthening action to double modules of taking the photograph, enhances double structural strengths and stabilization for taking the photograph module
Property.
Above description is only the better embodiment of the application and the explanation to institute's application technology principle.Art technology
Personnel should be appreciated that utility model range involved in the application, however it is not limited to which the specific combination of above-mentioned technical characteristic forms
Technical solution, while should also cover in the case where not departing from utility model design, by above-mentioned technical characteristic or its etc.
The other technical solutions for carrying out arbitrary combination with feature and being formed.Such as features described above and (but not limited to) disclosed herein
Technical characteristic with similar functions is replaced mutually and the technical solution that is formed.
Claims (10)
1. a kind of camera module array, which is characterized in that including：
First lens assembly comprising the first camera lens and the first camera lens supporter；
Second lens assembly；
First photosensitive element；
Second photosensitive element；
First colour filter；And
Unitary substrate comprising：
Wiring board has the first area for being suitable for installing the first lens assembly and the secondth area suitable for installing the second lens assembly
Domain, the wiring board also have close to first camera lens and second camera lens first surface and with the first surface phase
Anti- second surface；With
Molded section is integrally formed the second surface in the wiring board, and the molded section by moulding technology
It covers the second surface and corresponds to described second corresponding at least part of the first area and the second surface
At least part in region；Wherein, the unitary substrate is smooth with the first burnishing surface and second for being in different height
Face, first photosensitive element are installed on first burnishing surface, and second photosensitive element is installed on second burnishing surface；
Wherein, the first camera lens supporter is installed on the first area of the wiring board and first camera lens supports
The bottom of body bears against the first surface, and first colour filter is mounted on the integral type base by the first colour filter supporter
On plate, the first colour filter supporter is detached with the first camera lens supporter.
2. camera module array according to claim 1, which is characterized in that the first area of the wiring board has first
Through-hole, first burnishing surface are located at the first through hole.
3. camera module array according to claim 1, which is characterized in that the first area of the wiring board has first
Groove, first burnishing surface are located at first groove.
4. camera module array according to claim 2, which is characterized in that the unitary substrate further includes the first metal
Piece, the molded section has the second through-hole for being suitable for accommodating first photosensitive element corresponding with the first through hole, described
First sheet metal covers the first through hole and second through-hole, first burnishing surface are located at first sheet metal.
5. the camera module array according to any one of Claims 1 to 4, which is characterized in that at least one capacitance or
Resistive element is mounted on the second surface, and the molded section covers at least one capacitance or resistive element.
6. the camera module array according to any one of Claims 1 to 4, which is characterized in that first colour filter
The bottom of supporter is mounted on first photosensitive element, and first colour filter is mounted on the first colour filter supporter
Top.
7. camera module array according to claim 6, which is characterized in that the first colour filter supporter is in back-shaped.
8. the camera module array according to any one of Claims 1 to 4, which is characterized in that first colour filter
Supporter includes side wall and the head cover with light hole, and the bottom of the side wall is mounted on the wiring board.
9. the camera module array according to any one of Claims 1 to 4, which is characterized in that the unitary substrate
Further include by the first metal wire of first photosensitive element and the circuit board electrical connection, the first colour filter supporter is extremely
Small part covers first metal wire.
10. camera module array according to claim 9, which is characterized in that the first colour filter supporter is glue material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710973318 | 2017-10-18 | ||
| CN2017109733181 | 2017-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721385479.0U Active CN207665056U (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array for camera module array and corresponding camera module array |
| CN201711014959.0A Pending CN109688301A (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array and corresponding camera module array |
| CN201711008660.4A Active CN109688298B (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding integrated substrate |
| CN201721395664.8U Withdrawn - After Issue CN207978027U (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding unitary substrate |
| CN201721385762.3U Active CN207766338U (en) | 2017-10-18 | 2017-10-25 | Camera module array and unitary substrate for camera module array |
| CN201711009864.XA Active CN109688299B (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding integrated substrate |
| CN201711060630.8A Active CN109683434B (en) | 2017-10-18 | 2017-11-02 | Camera module array |
| CN201721440261.0U Active CN207663195U (en) | 2017-10-18 | 2017-11-02 | camera module array |
| CN201711085379.0A Active CN109688302B (en) | 2017-10-18 | 2017-11-07 | Integrated substrate for camera module array, manufacturing method and die thereof |
| CN201721470922.4U Active CN208369686U (en) | 2017-10-18 | 2017-11-07 | Unitary substrate and its production mold, photosensory assembly array and camera module array |
| CN201711249119.2A Active CN109688303B (en) | 2017-10-18 | 2017-12-01 | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method |
| CN201721656763.7U Active CN207691907U (en) | 2017-10-18 | 2017-12-01 | Photosensory assembly jigsaw, photosensory assembly and camera module |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721385479.0U Active CN207665056U (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array for camera module array and corresponding camera module array |
| CN201711014959.0A Pending CN109688301A (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array and corresponding camera module array |
| CN201711008660.4A Active CN109688298B (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding integrated substrate |
| CN201721395664.8U Withdrawn - After Issue CN207978027U (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding unitary substrate |
| CN201721385762.3U Active CN207766338U (en) | 2017-10-18 | 2017-10-25 | Camera module array and unitary substrate for camera module array |
| CN201711009864.XA Active CN109688299B (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding integrated substrate |
| CN201711060630.8A Active CN109683434B (en) | 2017-10-18 | 2017-11-02 | Camera module array |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711085379.0A Active CN109688302B (en) | 2017-10-18 | 2017-11-07 | Integrated substrate for camera module array, manufacturing method and die thereof |
| CN201721470922.4U Active CN208369686U (en) | 2017-10-18 | 2017-11-07 | Unitary substrate and its production mold, photosensory assembly array and camera module array |
| CN201711249119.2A Active CN109688303B (en) | 2017-10-18 | 2017-12-01 | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method |
| CN201721656763.7U Active CN207691907U (en) | 2017-10-18 | 2017-12-01 | Photosensory assembly jigsaw, photosensory assembly and camera module |
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| CN109683434A (en) * | 2017-10-18 | 2019-04-26 | 宁波舜宇光电信息有限公司 | Camera module array |
| CN109714515A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | TOF camera module and electronic product |
| CN114650347A (en) * | 2020-12-21 | 2022-06-21 | 宁波舜宇光电信息有限公司 | Image sensor assembly, camera module and mobile device |
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| CN109286743B (en) * | 2018-10-24 | 2020-04-03 | 浙江大华技术股份有限公司 | Flatness adjusting device and camera |
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| CN109729645B (en) * | 2019-01-21 | 2024-10-15 | 宁波舜宇光电信息有限公司 | Circuit board, circuit board semi-finished product, electronic device and circuit board preparation method |
| CN111491074B (en) * | 2019-01-25 | 2021-08-06 | 宁波舜宇光电信息有限公司 | Composite support for camera module array and corresponding camera module array |
| CN110234001B (en) * | 2019-06-04 | 2021-03-05 | 深圳市华芯技研科技有限公司 | Portable binocular three-dimensional camera device |
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| CN112333350A (en) * | 2019-07-30 | 2021-02-05 | 宁波舜宇光电信息有限公司 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
| CN112637447B (en) * | 2019-10-08 | 2022-08-16 | 宁波舜宇光电信息有限公司 | Composite substrate, photosensitive assembly, camera module and corresponding manufacturing method |
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| CN109683434A (en) * | 2017-10-18 | 2019-04-26 | 宁波舜宇光电信息有限公司 | Camera module array |
| CN109683434B (en) * | 2017-10-18 | 2024-05-28 | 宁波舜宇光电信息有限公司 | Camera module array |
| CN109714515A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | TOF camera module and electronic product |
| CN114650347A (en) * | 2020-12-21 | 2022-06-21 | 宁波舜宇光电信息有限公司 | Image sensor assembly, camera module and mobile device |
| CN114650347B (en) * | 2020-12-21 | 2024-03-15 | 宁波舜宇光电信息有限公司 | Image sensor assembly, camera module and mobile device |
Also Published As
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| CN109688303B (en) | 2024-02-02 |
| CN109683434B (en) | 2024-05-28 |
| CN109688299A (en) | 2019-04-26 |
| CN208369686U (en) | 2019-01-11 |
| CN207691907U (en) | 2018-08-03 |
| CN109688299B (en) | 2024-04-09 |
| CN109688303A (en) | 2019-04-26 |
| CN207978027U (en) | 2018-10-16 |
| CN109688302B (en) | 2023-11-03 |
| CN109688298B (en) | 2024-03-22 |
| CN207766338U (en) | 2018-08-24 |
| CN207665056U (en) | 2018-07-27 |
| CN109683434A (en) | 2019-04-26 |
| CN109688302A (en) | 2019-04-26 |
| CN109688298A (en) | 2019-04-26 |
| CN109688301A (en) | 2019-04-26 |
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