CN104576674B - Camera module and its encapsulation structure of image sensing chip - Google Patents
Camera module and its encapsulation structure of image sensing chip Download PDFInfo
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- CN104576674B CN104576674B CN201410824849.0A CN201410824849A CN104576674B CN 104576674 B CN104576674 B CN 104576674B CN 201410824849 A CN201410824849 A CN 201410824849A CN 104576674 B CN104576674 B CN 104576674B
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Abstract
The present invention relates to a kind of camera module and its encapsulation structure of image sensing chip.A kind of encapsulation structure of image sensing chip includes substrate, image sensing wafer, many conductive lead wires and cover lid.Substrate includes stiffening plate, the first pcb board, FPC plates and the second pcb board being cascading, and substrate has upper surface and lower surface, and the lower surface of stiffening plate is the lower surface of substrate, and the upper surface of the second pcb board is the upper surface of substrate, and upper surface opens up fluted.Image sensing wafer is contained in groove.Using the packaged type of " sunk type ", groove is opened up by the upper surface in substrate, image sensing wafer is contained in groove, so that the packaging height summation of whole image sensing wafer is less than height of the height plus image sensing wafer of substrate, the height of encapsulation structure of image sensing chip can be effectively reduced, frivolous, short and small growth requirement is increasingly tended to meet.
Description
Technical field
The present invention relates to camera technical field, more particularly to a kind of camera module and its image sensing chip package
Structure.
Background technology
With continuing to develop for science and technology, camera module will not only meet higher camera function, also increasingly be intended to light
Thin, short and small direction is developed.And the encapsulating structure of image sensing wafer is the weight for the volume size for influenceing image camera module
One of factor is wanted, therefore improves the encapsulating structure of image sensing wafer, is minimized and light-weighted to camera module is conducive to
Direction, which is developed, just to seem and is even more important.
During conventional package image sensing wafer, using the envelope being directly packaged in image sensing wafer on the upper surface of substrate
Dress mode, the packaging height summation of whole image sensing wafer is equal to height of the height plus image sensing wafer of substrate, leads
Cause the height of whole camera module larger, it is impossible to meet light, thin, short and small demand.
The content of the invention
Based on this, it is necessary to can effectively reduce the packaging height of image sensing wafer there is provided a kind of regarding to the issue above
Camera module and its encapsulation structure of image sensing chip.
A kind of encapsulation structure of image sensing chip, including：
Substrate, with upper surface and lower surface, the substrate include be cascading stiffening plate, the first pcb board,
FPC plates and the second pcb board, the lower surface of the stiffening plate are the lower surface of the substrate, and the upper surface of second pcb board is
The upper surface of the substrate, the upper surface opens up fluted, and the groove runs through first pcb board, the FPC plates and institute
State the position on the second pcb board, the upper surface of the substrate close to and around the groove and be provided with multiple first weld pads；
Image sensing wafer, is contained in the groove, and the image sensing wafer has first surface and back on institute
Stating on the second surface of first surface, the first surface has sensing area and is surrounded on the non-sensing area of the sensing area, institute
The edge for stating non-sensing area is provided with multiple second weld pads, and the second surface is arranged on stiffening plate；
Many conductive lead wires, one end of each conductive lead wire is connected with the first weld pad described in one, described in the other end and one
Two weld pads are connected；And
Cover lid, covers on the substrate and is bonded in the first weld pad periphery, and be collectively forming a cavity with the substrate.
In wherein one embodiment, the upper level of the first surface of the image sensing wafer and the substrate is neat
It is flat.
In wherein one embodiment, the stiffening plate has a stiffening plate upper surface, the stiffening plate upper table face closure
One end of the groove, the second surface of the image sensing wafer is by the first paste adhesive in the stiffening plate of the stiffening plate
Upper surface.
In wherein one embodiment, the stiffening plate is metallic heat radiating plate.
In wherein one embodiment, also including the second viscose glue, second viscose glue is coated on the image sensing wafer
Non-sensing area around, to cover conductive lead wire, the first weld pad and the second weld pad.
In wherein one embodiment, the height of second viscose glue is higher than the height of the conductive lead wire.
In wherein one embodiment, second viscose glue is black matte glue.
In wherein one embodiment, second viscose glue forms continuous loop configuration.
A kind of camera module, including：
Encapsulation structure of image sensing chip as described in any of the above one；
Camera lens module, is arranged at the cover and covers；
Optical filter, is carried on the cover and covers；And
Connector, is arranged on the substrate, and the camera lens module is realized and exterior electrical components by the connector
Electric connection.
In wherein one embodiment, the camera lens module include camera lens support component and camera lens, the lens assembling in
In the camera lens support component.
Above-mentioned encapsulation structure of image sensing chip at least includes advantages below：
Substrate includes stiffening plate, the first pcb board, FPC plates and the second pcb board being cascading, the following table of stiffening plate
Face is the lower surface of substrate, and the upper surface of the second pcb board is the upper surface of substrate, using the packaged type of " sunk type ", is passed through
Groove, i.e. groove are opened up in the upper surface of substrate through the first pcb board, FPC plates and the second pcb board, and by image sensing wafer
It is contained in groove, so that the height that the packaging height summation of whole image sensing wafer is less than substrate is brilliant plus image sensing
The height of piece, can effectively reduce the height of encapsulation structure of image sensing chip, and frivolous, short and small development is increasingly tended to meet
Demand.And using the packaged type of " sunk type ", be conducive to increasing substrate and cover cap-shaped into cavity volume, reduce light
Ghost caused by line multiple refraction or diffraction, so as to improve the quality of imaging.
Above-mentioned camera module effectively reduces whole shooting because applying above-mentioned encapsulation structure of image sensing chip
The height of head mould group, so as to meet the growth requirement for increasingly tending to be frivolous, short and small.And using the encapsulation side of " sunk type "
Formula, be conducive to increasing substrate and cover cap-shaped into cavity volume, reduce ghost caused by light multiple refraction or diffraction, from
And improve the quality of imaging.
Brief description of the drawings
Fig. 1 is the structural representation of camera module in an embodiment；
Fig. 2 is the side view of encapsulation structure of image sensing chip in Fig. 1；
Fig. 3 is the top view of encapsulation structure of image sensing chip shown in Fig. 2.
Embodiment
To enable the above objects, features and advantages of the present invention more obvious understandable, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Term as used herein " vertical ", " level ", "left", "right" and similar statement simply to illustrate that
Purpose, it is unique embodiment to be not offered as.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Referring to Fig. 1, being the camera module 10 in an embodiment.The camera module 10 includes image sensing wafer
Encapsulating structure 100, camera lens module 200, connector 300 and optical filter 400.
Also referring to Fig. 2 and Fig. 3, encapsulation structure of image sensing chip 100 includes substrate 110, image sensing wafer
120th, many conductive lead wires 130 and cover lid 140.Substrate 110 has upper surface 110a and lower surface 110b, the upper table of substrate 110
Face 110a opens up fluted 110c, and the upper surface 110a of substrate 110 is provided with multiple the close to and around groove 110c position
One weld pad 150.
Specifically, substrate 110 includes the stiffening plate 111, the first pcb board 112, FPC plates 113 and second being cascading
Pcb board 114.Groove 110c runs through the first pcb board 112, the pcb board 114 of FPC plates 113 and second.The lower surface of stiffening plate 111 is
The lower surface 110b of substrate 110, the upper surface of the second pcb board 114 is the upper surface 110a of substrate 110.Stiffening plate 111 can be
Metallic heat radiating plate, specifically, can be made up of stainless steel, so as to optimize heat dispersion, improve radiating efficiency, extend product
Service life.
Image sensing wafer 120 is contained in groove 110c.Specific in present embodiment, groove 110c depth can be with
For 0.25mm.The width of image sensing wafer 120 can be slightly less than groove 110c width.Image sensing wafer 120 has the
On one surface 121 and the second surface 122 back on first surface 121, first surface 121 have sensing area 121a and around
Sensing area 121a non-sensing area 121b.Non-sensing area 121b edge sets multiple second weld pads 160, each second weld pad pair
Answer first weld pad.Stiffening plate 111 has a stiffening plate upper surface 1111, the closed pockets 110c's of stiffening plate upper surface 1111
One end, the second surface 122 of image sensing wafer 120 is pasted on the stiffening plate upper surface of stiffening plate 111 by the first viscose glue 170
1111, so that image sensing wafer 120 is more firm.In present embodiment, groove 110c is square.
One end of each conductive lead wire 130 is connected with first weld pad 150 in many conductive lead wires 130, the other end with
One the second weld pad 160 of correspondence is connected, so that on the signal transmission that image sensing wafer 120 is produced to substrate 110.Specifically
Ground, the material of conductive lead wire 130 can be metal.Encapsulation structure of image sensing chip 100 can also include the second viscose glue 180,
Second viscose glue 180 is coated on around the non-sensing area 121b of image sensing wafer 120, is welded to cover conductive lead wire 130, first
The weld pad 160 of pad 150 and second.Specifically, the height of the second viscose glue 180 is higher than the height of conductive lead wire 130, can prevent conduction
Lead 130 is exposed, effectively protection conductive lead wire 130.Second viscose glue 180 can be black matte glue.Second viscose glue 180 can be with shape
Into continuous loop configuration, to ensure to cover conductive lead wire 130, the first weld pad 150 and the second weld pad 160.
Specific in present embodiment, the first surface 121 of image sensing wafer 120 and the upper surface 110a of substrate 110
Highly flush.I.e. the first surface 121 of image sensing encapsulated wafer 120 is flushed with the upper level of the second pcb board 114.No
Only facilitate routing, and the length of routing can be effectively reduced, reduce production cost.Meanwhile, what the angle of routing can be set
It is very small, when the second viscose glue 180 is set, reflection of the light of camera lens module 200 on conductive lead wire 130 is reduced, image is improved
Quality.
Cover lid 140 is covered on substrate 110, and is collectively forming a cavity 190 with substrate 110.Specifically, cover lid 140 covers
On the second pcb board 114, and it is bonded in the periphery of the first weld pad 150.Optical filter 400 is carried on cover lid 140.Specifically, filter
Mating plate 400 is cutoff filter.
Camera lens module 200 is arranged on cover lid 140, and connector 300 is arranged on substrate 110.Camera lens module 200 includes mirror
Head support component 210 and camera lens 220, camera lens 220 are assembled in camera lens support component 210.Camera lens support component 210 can be one
Plastics microscope base, a voice coil motor or a MEMS.Camera lens module 200 is realized and exterior electrical components by connector 300
Electric connection.Specifically, connector 300 is arranged at the extended end of FPC plates 113, can also be located at connector in FPC plates 113
Part between 300 and camera lens module 200 sets two-sided electromagnetic shielding film 500.
Above-mentioned camera module 10 at least includes advantages below：
Substrate 110 includes the stiffening plate 111, the first pcb board 112, the pcb board of FPC plates 113 and second being cascading
114, the lower surface of stiffening plate 111 is the lower surface of substrate 110, and the upper surface of the second pcb board 112 is the upper surface of substrate 110,
Using the packaged type of " sunk type ", by opening up groove 110c, i.e. groove 110c through the in the upper surface 110a of substrate 110
One pcb board 112, the pcb board 114 of FPC plates 113 and second, and image sensing wafer 120 is contained in groove 110c, so that
The height summation of whole image sensing chip package 100 is less than height of the height plus image sensing wafer 120 of substrate 110,
The height of encapsulation structure of image sensing chip 100 can be effectively reduced, frivolous, short and small growth requirement is increasingly tended to meet.
And using the packaged type of " sunk type ", be conducive to increasing the volume of substrate 110 and the cavity 190 of the formation of cover lid 140, reduce
Ghost caused by light multiple refraction or diffraction, so as to improve the quality of imaging.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.For the person of ordinary skill of the art, do not departing from
On the premise of present inventive concept, various modifications and improvements can be made, these belong to protection scope of the present invention.Therefore,
The protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of encapsulation structure of image sensing chip, it is characterised in that including：
Substrate, with upper surface and lower surface, the substrate includes the stiffening plate, the first pcb board, FPC plates being cascading
And second pcb board, the lower surface of the stiffening plate is the lower surface of the substrate, and the upper surface of second pcb board is described
The upper surface of substrate, the upper surface opens up fluted, and the groove is through first pcb board, the FPC plates and described the
Position on two pcb boards, the upper surface of the substrate close to and around the groove is provided with multiple first weld pads；
Image sensing wafer, is contained in the groove, and the image sensing wafer has first surface and back on described
There is sensing area on the second surface on one surface, the first surface and the non-sensing area of the sensing area is surrounded on, it is described non-
The edge of sensing area is provided with multiple second weld pads, and the second surface is arranged on stiffening plate；
Many conductive lead wires, one end of each conductive lead wire is connected with the first weld pad described in one, the second weldering described in the other end and one
Pad is connected；And
Cover lid, covers on the substrate and is bonded in the first weld pad periphery, and be collectively forming a cavity with the substrate.
2. encapsulation structure of image sensing chip according to claim 1, it is characterised in that the of the image sensing wafer
One surface is flushed with the upper level of the substrate.
3. encapsulation structure of image sensing chip according to claim 1, it is characterised in that the stiffening plate has a reinforcement
Plate upper surface, one end of groove described in the stiffening plate upper table face closure, the second surface of the image sensing wafer passes through
One paste adhesive is in the stiffening plate upper surface of the stiffening plate.
4. encapsulation structure of image sensing chip according to claim 1, it is characterised in that the stiffening plate is heat dissipation metal
Plate.
5. encapsulation structure of image sensing chip according to claim 1, it is characterised in that described also including the second viscose glue
Second viscose glue is coated on around the non-sensing area of the image sensing wafer, to cover conductive lead wire, the first weld pad and second
Weld pad.
6. encapsulation structure of image sensing chip according to claim 5, it is characterised in that the height of second viscose glue is high
In the height of the conductive lead wire.
7. encapsulation structure of image sensing chip according to claim 5, it is characterised in that second viscose glue is that black is mute
Optical cement.
8. encapsulation structure of image sensing chip according to claim 5, it is characterised in that second viscose glue is formed continuously
Loop configuration.
9. a kind of camera module, it is characterised in that including：
Encapsulation structure of image sensing chip as claimed in any of claims 1 to 8 in one of claims；
Camera lens module, is arranged at the cover and covers；
Optical filter, is carried on the cover and covers；And
Connector, is arranged on the substrate, and the camera lens module realizes the electricity with exterior electrical components by the connector
Property connection.
10. camera module according to claim 9, it is characterised in that the camera lens module includes camera lens support component
And camera lens, the lens assembling is in the camera lens support component.
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| CN201410824849.0A CN104576674B (en) | 2014-12-25 | 2014-12-25 | Camera module and its encapsulation structure of image sensing chip |
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| CN201410824849.0A CN104576674B (en) | 2014-12-25 | 2014-12-25 | Camera module and its encapsulation structure of image sensing chip |
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| CN104576674B true CN104576674B (en) | 2017-07-11 |
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| TWI572935B (en) * | 2015-11-02 | 2017-03-01 | 峰川光電股份有限公司 | Photoelectric conversion module |
| TWI579611B (en) * | 2015-11-02 | 2017-04-21 | 峰川光電股份有限公司 | Photoelectric conversion assembly |
| CN109510932B (en) * | 2016-02-18 | 2021-05-04 | 宁波舜宇光电信息有限公司 | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module |
| CN107734215B (en) * | 2016-08-12 | 2023-10-27 | 宁波舜宇光电信息有限公司 | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment |
| KR102152516B1 (en) | 2016-03-28 | 2020-09-04 | 닝보 써니 오포테크 코., 엘티디. | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| CN105915769A (en) * | 2016-03-30 | 2016-08-31 | 努比亚技术有限公司 | Pick-up head heat dissipation apparatus and mobile terminal |
| CN108124082B (en) * | 2016-11-28 | 2022-08-23 | 宁波舜宇光电信息有限公司 | Sinking type camera module, sinking type photosensitive assembly and manufacturing method thereof |
| KR102464978B1 (en) * | 2016-07-03 | 2022-11-09 | 닝보 써니 오포테크 코., 엘티디. | Photosensitive component, and camera module and manufacturing method therefor |
| CN108270948A (en) * | 2016-12-30 | 2018-07-10 | 宁波舜宇光电信息有限公司 | Camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module |
| CN108810333A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its assemble method, sunk type photosensory assembly |
| CN207665056U (en) * | 2017-10-18 | 2018-07-27 | 宁波舜宇光电信息有限公司 | Photosensory assembly array for camera module array and corresponding camera module array |
| CN111199985B (en) * | 2018-11-20 | 2023-04-18 | 中芯集成电路（宁波）有限公司 | Camera shooting assembly, packaging method thereof, lens module and electronic equipment |
| US10861895B2 (en) | 2018-11-20 | 2020-12-08 | Ningbo Semiconductor International Corporation | Image capturing assembly and packaging method thereof, lens module and electronic device |
| CN111446213A (en) * | 2020-03-23 | 2020-07-24 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
| CN111785756A (en) * | 2020-07-08 | 2020-10-16 | 京东方科技集团股份有限公司 | Flexible display panel, preparation method thereof and display device |
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Effective date of registration: 20180929 Address after: 330000 room 1408, red Gucheng tower, 545 Exhibition Road, Nanchang, Jiangxi. Patentee after: Nanchang Institute of virtual reality Limited by Share Ltd Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: Suzhou OFilm Tech. Co.,Ltd. |