CN207665056U - Photosensory assembly array for camera module array and corresponding camera module array - Google Patents
Photosensory assembly array for camera module array and corresponding camera module array Download PDFInfo
- Publication number
- CN207665056U CN207665056U CN201721385479.0U CN201721385479U CN207665056U CN 207665056 U CN207665056 U CN 207665056U CN 201721385479 U CN201721385479 U CN 201721385479U CN 207665056 U CN207665056 U CN 207665056U
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- Prior art keywords
- camera module
- wiring board
- module array
- array
- camera
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
- G03B17/14—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets interchangeably
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The utility model provides a kind of photosensory assembly array for camera module array, including：First, second photosensitive element；Unitary substrate comprising wiring board and molded section；First colour filter；And first microscope base comprising：It in flat basic courses department, is installed on the wiring board and is centered around around first photosensitive element, and its lower surface is contacted with the first surface, upper surface is suitable for installing first lens assembly；And extension, extend from the basic courses department to the direction at the center towards the first area, and the lower surface of the extension is not contacted with the first surface；The colour filter is installed on the extension.The utility model additionally provides corresponding camera module array.Tool can be enhanced there are two the structural strength of double substrates for taking the photograph module of different optical designs, can reduced the radial dimension of camera module array while the different two photosensitive element mounting surfaces of height are provided and reduce the shoulder height of camera module array and total high.
Description
Technical field
The utility model is related to optical technical fields, specifically, the utility model is related to camera module array and accordingly
Integral type photosensory assembly array solution.
Background technology
With the continuous development of smart machine, the requirement to camera module is higher and higher.For example, over the past two years, intelligent hand
The camera of machine is by individually becoming dual camera, and the development of dual camera module also becomes one of mobile phone camera module development
Important trend.In simple terms, dual camera can acquire image by the cooperation of two cameras, abundanter to realize
Image collecting function.Existing dual camera can be mainly divided into two classes according to function：One kind is to generate to stand using dual camera
Body vision obtains the depth of field of image, background blurring using depth of view information progress, scanning, auxiliary focusing, the applications such as action recognition,
Or it is merged using the information of two pictures；Another kind of merged using the two different pictures in left and right, it is expected
Obtain higher resolution ratio, better color, the better images such as dynamic range quality or the function of realizing optical zoom.
The dual camera of either any function, is required for the support of hardware, needs to consider that most basic one asks
Topic, that is, the assembling fixation problem between two cameras.How by two cameras steadily, compact-sizedly be assembled in one
It rises, becomes the module of an entirety, be the basic problem that dual camera module considers.On the other hand, dual camera is constituted
Two cameras be typically two different types be camera, for example one for being imaged, and one for recording the depth of field.It is this
The requirement of different function, usually so that the volume of two cameras is of different sizes, for example height is different, and how by two such
The camera of different height carries out stable bond, becomes an entirety, be encountered in the development of dual camera module it is another
A major issue.
In the prior art, a metallic support is usually made, holder tool there are two accommodating hole, make respectively by two cameras
After the completion of work, the two camera modules are respectively placed in two accommodating holes of the metallic support, material is thus formed more
It is reliable and stable double to take the photograph module.However the problems such as said program is there is also module larger, and cost increases.
On the other hand, in the prior art, it is the image quality of guarantee camera module, it usually needs colour filter and peace are provided
The small microscope base of colour filter is filled, the size and shape of this small microscope base can impact the overall size of camera module.In order to avoid
Appearance resistance element on wiring board and the gold thread with certain camber, at the same in order to make the overall radial dimension of camera module compared with
Small, the rectangular bending of tool would generally be made in existing small microscope base, and this shape can cause shadow to the structural strength of small microscope base
It rings, more limitation has been will also result in the manufacture craft of small microscope base.
Therefore, the solution of drawbacks described above currently can urgently be overcome.
Utility model content
The utility model is intended to provide a kind of solution for the above-mentioned at least one defect that can overcome the prior art.
One side according to the present utility model provides a kind of photosensory assembly array for camera module array, packet
It includes：
First photosensitive element；
Second photosensitive element；
Unitary substrate comprising：
Wiring board has the first area for being suitable for installing the first lens assembly containing the first camera lens and contains suitable for installation
There are the second area of the second lens assembly of the second camera lens, the wiring board also to have close to first camera lens and described second
The first surface of camera lens and the second surface opposite with the first surface；With
Molded section is integrally formed the second surface in the wiring board, and the mould by moulding technology
Modeling portion covers the second surface corresponding at least part of the first area and the second surface corresponding to described
At least part of second area；Wherein, the unitary substrate has the first burnishing surface and second in different height
Burnishing surface, first photosensitive element are installed on first burnishing surface, and it is flat that second photosensitive element is installed on described second
Whole face；
First colour filter；And
First microscope base comprising：
In flat basic courses department, it is installed on the wiring board and is centered around around first photosensitive element, and
And its lower surface is contacted with the first surface, upper surface is suitable for installing first lens assembly；With
Extension extends from the basic courses department to the direction at the center towards the first area, and the extension
The lower surface in portion is not contacted with the first surface；The colour filter is installed on the extension.
In one example, in flat basic courses department, the area ratio of lower surface and upper surface is more than 0.8.When
When the area ratio is more than 1, the support of more firm stable will be formed to the first lens assembly.
Wherein, there is first through hole, first burnishing surface to be located at the first through hole for the first area of the wiring board.
Wherein, there is the first groove, first burnishing surface to be located at first groove for the first area of the wiring board.
Wherein, the unitary substrate further includes the first sheet metal, and the molded section has corresponding with the first through hole
The second through-hole for being suitable for accommodating first photosensitive element, first sheet metal covers the first through hole and described second
Through-hole, first burnishing surface are located at first sheet metal.
Wherein, at least one capacitance or resistive element are mounted on the second surface, described in the molded section covering at least
One capacitance or resistive element.
Wherein, first microscope base further includes changeover portion, and the changeover portion connects the basic courses department and the extension, institute
The optical axis that changeover portion is stated relative to first lens assembly is inclined.
Wherein, first microscope base is made of metal material.
Wherein, the molded section has the contact surface contacted with the second surface, and extends shape by the contact surface
At the covering first through hole non-contact face, first burnishing surface is formed in the non-contact face.
Wherein, the non-contact face is in same plane with the contact surface.
Wherein, the non-contact face forms boss or groove, first burnishing surface are located at the boss in the non-contact face
Or groove.
Wherein, there is first sheet metal boss, first burnishing surface to be located at the boss of first sheet metal.
Wherein, first colour filter is mounted on the lower surface of the extension.
Wherein, the wiring board has the second groove for being suitable for accommodating second photosensitive element, second burnishing surface
Positioned at second groove.
Wherein, the wiring board has the second groove for being suitable for accommodating second photosensitive element, second burnishing surface
Positioned at second groove.
Wherein, there is the wiring board second boss, second burnishing surface to be located at the second boss.
Wherein, also there is the unitary substrate the second sheet metal, second sheet metal to be mounted on the wiring board the
At the position corresponding to the second area on one surface, second burnishing surface is located at second sheet metal.
Wherein, the wiring board is integral type wiring board.
Wherein, the wiring board include have the first line plate of the first area and with the second area
Two wiring boards, the first line plate and second wiring board are electrically connected by flexible circuitry.
Another aspect according to the present utility model additionally provides a kind of camera module array, including：First lens assembly and
Second lens assembly；And it is previously described for the photosensory assembly array of camera module array.
Wherein, there is annular mounting surface, first lens assembly to pass through the ring for the bottom of first lens assembly
Shape mounting surface is mounted on the upper surface of the basic courses department.
Wherein, the lower surface of the basic courses department and the area ratio of the annular mounting surface are more than 0.8.
Wherein, first lens assembly includes the first camera lens and the first motor, and first camera lens is installed on described the
One motor, first motor are installed on the upper surface of the basic courses department.In one example, the mounting surface of the first motor bottom surface
It can be used as the annular mounting surface of first lens assembly bottom.
Compared with prior art, the utility model has following at least one technique effect：
1, the utility model can enhance the structural strength for having double substrates for taking the photograph module there are two different optical designs.
2, the utility model is capable of providing the mounting surface of two different photosensitive elements of height, to which preferably adaptation has
Two the double of different optical designs take the photograph module.
3, the utility model can be while two different photosensitive element mounting surfaces of offer height, by colour filter
Microscope base special designing, to reduce the radial dimension of camera module array and reduce the shoulder height of camera module array and total height.
4, there are two the double of different optical designs to take the photograph module for tool for the utility model, can cancel the tool in traditional scheme
There are two the metallic supports of accommodating hole, to save cost, reduce production process.
Description of the drawings
Exemplary embodiment is shown in refer to the attached drawing.Embodiment and attached drawing disclosed herein should be considered illustrative
, and not restrictive.
Fig. 1 shows the camera module array in the utility model one embodiment；
Fig. 2 shows the examples of 500 shape of module portion in the utility model some embodiments；
Fig. 3 A show the partial enlarged view near the microscope base 105 in the utility model one embodiment；
Fig. 3 B show the partial enlarged view near the microscope base in a comparative example；
Fig. 4 shows the camera module array in another embodiment of the utility model；
Fig. 5 shows the camera module array in another embodiment of the utility model；
Fig. 6 shows the camera module array in the utility model further embodiment；
Fig. 7~9 show the embodiment of several first gaskets 800 with U-typed shape in the utility model
Schematic diagram；
Figure 10 shows the schematic diagram of the embodiment with flat first gasket 800 in the utility model.
Specific implementation mode
Refer to the attached drawing is made more detailed description by the application in order to better understand to the various aspects of the application.It answers
Understand, the description of the only illustrative embodiments to the application is described in detail in these, rather than limits the application in any way
Range.In the specification, the identical element of identical reference numbers.It includes associated institute to state "and/or"
Any and all combinations of one or more of list of items.
It should be noted that in the present specification, the first, second equal statement is only used for a feature and another feature differentiation
It comes, and does not indicate that any restrictions to feature.Therefore, discussed below without departing substantially from teachings of the present application
First main body is also known as the second main body.
In the accompanying drawings, for convenience of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative
And it is and non-critical drawn to scale.
It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory
In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or
It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or combination thereof.In addition, ought be such as
When the statement of at least one of " ... " appears in after the list of listed feature, entire listed feature is modified, rather than is modified
Individual component in list.In addition, when describing presently filed embodiment, use " can with " indicate " one of the application or
Multiple embodiments ".Also, term " illustrative " is intended to refer to example or illustration.
As it is used in the present context, term " substantially ", " about " and similar term are used as the approximate term of table, and
Be not used as the term of table degree, and be intended to illustrate by by those skilled in the art will appreciate that, measured value or calculated value
In inherent variability.
Unless otherwise defined, otherwise all terms (including technical terms and scientific words) used herein all have with
The application one skilled in the art's is generally understood identical meaning.It will also be appreciated that term (such as in everyday words
Term defined in allusion quotation) it should be interpreted as having the meaning consistent with their meanings in the context of the relevant technologies, and
It will not be explained with idealization or excessively formal sense, unless clear herein so limit.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 1 shows that the camera module array in the utility model one embodiment, the camera module array at least wrap
Include optical design different the first camera module 100 and the second camera module 200, first camera module 100 and described
Two camera modules 200 share unitary substrate 600.Wherein, the first camera module 100 includes the first lens assembly.Second camera shooting
Module 200 includes the second lens assembly.The unitary substrate 600 is including integral type wiring board 400 and passes through moulding technology shape
At the molded section 500 in the integral type wiring board 400.
The integral type wiring board 400 has one to be located at the upside of the integral type wiring board 400 (i.e. close to described first
The side of lens assembly and second lens assembly) first surface 410 and the second surface opposite with the first surface
420, wherein the first surface 410 is for installing first lens assembly and second lens assembly.For ease of hereafter
Description, first area is defined as installing the region of first lens assembly on the wiring board 400, for installing
The region for stating the second lens assembly is defined as second area.
In the present embodiment, the molded section 500 is formed in described the of the integral type wiring board 400 by moulding technology
Two surfaces 420, and the first area and the second area are covered, the molded section 500 forms plate, and to the one
Formula wiring board 400 plays strengthening action, so that the integral type wiring board 400 combined with the molded section 500 has more
Excellent structural strength and stability improves the reliability of module entirety.The molded section 500 has and the integral type wiring board
The contact surface 510 that 400 second surface 420 is in contact also has one to extend simultaneously from the contact surface 510 to the first area
It is covered in the non-contact face 520 of the first area.In the present embodiment, the contact surface 510 and the non-contact face 520 are in
Same plane.
In the present embodiment, the first area of the integral type wiring board 400 has for accommodating first camera module
The through-hole of 100 the first photosensitive element 104, the molded section 500 are described logical in the covering of the bottom of the integral type wiring board 400
Hole, therefore first photosensitive element 104 is installed on the non-contact face 520 of the molded section 500.
For taking the photograph module using the double of different designs, the size of two camera modules is often different, and the two
The distance of incidence surface (i.e. camera lens front end) to the photosurface (i.e. photosensitive member surface) of camera module also tends to be different.Example
Such as, double to take the photograph in module, a camera module is main camera module, another camera module is secondary camera module, then main camera shooting
The size of module is typically larger than secondary camera module.The incidence surface (i.e. camera lens front end) of main camera module is (i.e. photosensitive to photosurface
Element surface) distance, can also be more than the incidence surface (i.e. camera lens front end) of secondary camera module to photosurface (i.e. photosensitive element table
Face) distance.
Assuming that the module height of first camera module 100 is more than the module height of second camera module 200,
So by the difference in height between appropriately designed first photosensitive element 104 and second photosensitive element 204, can make described
The upper surface (i.e. the incidence surface of camera module or camera lens front end) of first camera module 100 and second camera module 200
Maintain an equal level.Upper surface, which maintains an equal level, contributes to the design optimization of intelligent terminal (such as smart mobile phone).Such as it is double take the photograph that upper surface maintains an equal level can be with
Make more beautiful using double intelligent terminals for taking the photograph module.For another example it is double take the photograph upper surface maintain an equal level two camera modules can be made to be clapped
It takes the photograph that image is more consistent, contributes to the image processing algorithm of simplified intelligent terminal.
However, due to the limitation of circuit board manufacturing process, integral type wiring board itself is difficult to form above-mentioned difference in height, this will
Cause for two cameras have the different depth of field it is double take the photograph module for, the upper surface of two different camera modules cannot be held
It is flat.This also causes double modules of taking the photograph currently on the market not use integral type wiring board usually, but on two wiring boards respectively
Two camera modules are made, then recycling tool, there are two the metallic supports of accommodating hole, and the two camera modules are assembled in one
It rises.Wherein, each accommodating hole of metallic support is respectively packed into a camera module.
And in the present embodiment, make first through hole, and assist side 400 in the first area of integral type wiring board 400
Molded section 500 is formed on bottom, using the molded section 500, can the first photosensitive element 104 be installed the first of assist side 400 and led to
In hole.On the other hand, the second area of the integral type wiring board 400 is without through-hole, therefore the second of second camera module 200
Photosensitive element 204 can be directly mounted on the first surface 410 of the wiring board 400.Such first photosensitive element 104 and second
There are a difference in height between photosensitive element 204, this difference in height may make first camera module 100 and second camera shooting
The upper surface of module 200 maintains an equal level.Also, since molded section 500 covers the first area and the second area, to wiring board
400 form reinforcement, so that integral type wiring board has better structural strength so that double modules of taking the photograph can be cancelled with two
The metallic support of a accommodating hole reduces size to reduce cost.
In above-described embodiment, the molded section 500 completely cover the integral type wiring board 400 first area and
Second area.It may be noted that the utility model is not limited to this.For example, in other embodiments, the molded section 500 can only be covered
It is placed on the subregion of the second surface 420 of the integral type wiring board 400.Fig. 2 shows some embodiments of the utility model
In 500 shape of module portion example.With reference to figure 2, in one example, the bottom of the first area opening area is all covered
Lid, and the bottom of the second area only has subregion to be capped, it is high so as to form one in the bottom of the second area
Low difference provides certain avoiding space, is adapted to the design requirement of different modules.
Further, the second area bottom preferably covers second camera module 200 and the integral type circuit
The binding site of plate 400, and be preferably covered in the molded section 500 of the second area bottom and be covered in the first area
The molded section 500 of bottom is integrally joined to each other, to enhance the connection between the first area and the second area
Intensity.
It is noted that being covered to the bottom of the integral type wiring board 400 using molded section 500 in this programme
Lid is not only able to improve the structural strength of module, can also form difference by moulding technology according to the actual design demand of module
The molding of size, different-thickness, to adapt in Cell Phone Design, the demand of different accommodation spaces has higher production flexible
Property.
Further, first photosensitive element 104 and second photosensitive element 204 respectively with the integral type circuit
Plate 400 is realized by the first metal wire 103 (such as gold thread) and is electrically connected, and there are certain banks for first metal wire 103
Highly, in subsequent packaging technology, it should be noted that the loop height is avoided, to prevent being caused to first metal wire 103
Double functions of taking the photograph module described in destroying infection.
Simultaneously as the first area of integral type wiring board 400 has for accommodating first camera module 100
The through-hole of one photosensitive element 104, causes the being wired of first area or installation region more nervous, passes through the capacitance or electricity
The electricity can not installed or be installed less to the first surface 410 of the first area by the arrangement mode of resistance element 108
Perhaps resistive element 108, and the part or all of capacitance or resistive element 108 are installed on the integral type wiring board 400
The second surface 420.Additionally due to the capacitance or resistive element 108 become in the space that the first surface 410 occupies
It is small, can be the installation space that installation camera lens, motor and chip installation provide bigger, to not increase the integral type
Under the premise of the size of wiring board 400, it disclosure satisfy that normal cabling arrangement and the installation of other elements, institute will not be increased
State double overall dimensions for taking the photograph module.
Further, referring still to Fig. 1, in one embodiment, at least part capacitance or resistive element 108 are mounted on
The second surface 420 of wiring board 400.Capacitance or resistive element of the cladding of the molded section 500 mounted on the second surface 420
108.The thickness of the molded section 500 need to only be slightly above 108 maximum height of the capacitance or resistive element, can be by the electricity
Perhaps the cladding of resistive element 108 wherein, the capacitance or electricity is covered without reserving the devices such as microscope base or other protective shells
Required avoiding space when resistance element 108.
In one embodiment, first camera module 100 further includes microscope base 105, and the microscope base 105 is installed on described
Integral type wiring board 400, and the microscope base 105 includes basic courses department 105a and extension 105b, the basic courses department 105a is seated
Non-through bore region in the first area.The extension 105b from the basic courses department 105a to the center of the through-hole at prolong
It stretches, and a difference in height is formed with the basic courses department 105a, and the position of the extension 105b is higher than the basic courses department 105a.Institute
Basic courses department 105a is stated in flat.
The microscope base 105 further comprises an interconnecting piece 105c, wherein the both ends of the interconnecting piece 105c are connected to
The basic courses department 105a and extension 105b, the interconnecting piece 105c obliquely extend upwards from the basic courses department 105a,
Finally intersect with the extension 105b, so that having foot between the extension 105b and first photosensitive element 104
Enough spaces can avoid first metal wire 103, prevent from generating interference with first metal wire 103, influence described double
Take the photograph the image quality and imaging function of module.
Further, it is to be formed to first metal wire 103 that the extension 105b, which is obliquely upwardly extended,
Bank avoided, prevent the structure of the extension 105b and first metal wire 103 be formed by bank generate it is dry
It relates to and damages first metal wire 103 and be formed by bank, influence double imagings for taking the photograph module.
First color-filter element 106 of first camera module 100 is installed on the top surface or bottom of the extension 105b
Face, when first color-filter element 106 is installed on the bottom surface of the extension 105b, additionally it is possible to reduce the microscope base 105 with
The integral type wiring board 400 is formed by the height of semi-finished product after installing, for rear burnt reserved more space (wherein institutes of camera lens
It states height and refers to each element thickness possessed by the direction of the optical axis of first camera module 100).
Further, it when ensureing that the avoiding space between first camera lens 101 and the extension 105b is enough, answers
Make first color-filter element 106 far from first photosensitive element 104 as possible, dirt is generated when the module imaging to reduce
The probability of stain, and then improve double production yields for taking the photograph module.
Since the part or all of capacitance or resistive element 108 are arranged at described in the integral type wiring board 400
The second surface 410 of first area, therefore on the first surface 410 of the first area, need the capacitance avoided
Or resistive element 108 tails off or needs to avoid without the capacitance or resistive element 108, thus the integral type wiring board 400
On can be the microscope base 105 reserve installation space become larger, the basic courses department 105a connects with the integral type wiring board 400
Contacting surface accumulates the contact area for being greater than microscope base wall and wiring board in traditional handicraft, therefore the extension of the microscope base 105
When 105b extends internally from the basic courses department 105a, it need to only avoid a small amount of or be not required to avoid the capacitance or resistive element 108, institute
When stating interconnecting piece 105c and obliquely upwardly extending, as long as evacuation opens first metal wire 103 and is formed by bank, improve
Double space availability ratios for taking the photograph module.
Fig. 3 A show that the partial enlarged view near the microscope base 105 in the utility model one embodiment, Fig. 3 B are shown
The partial enlarged view near microscope base in one comparative example.It is to be appreciated that the knot for traditional microscope base that the comparison in Fig. 3 B exemplifies
Structure and its position relationship between the other components of camera module, this is in order to which utility model skill is better described by comparison
Art effect.It must not believe that the comparative example shown by Fig. 3 B belongs to the scope of the prior art.
With reference to figure 3B, wherein microscope base includes microscope base side wall 1001 and microscope base roof 1002, and the microscope base roof 1002 is from institute
The top for stating microscope base side wall 1001 extends internally, and the microscope base side wall 1001 is installed on wiring board, the microscope base roof 1002
Avoiding space is formed between wiring board, is prevented from being formed with the capacitance or resistive element 108 and be interfered.
Since the capacitance or resistive element are arranged at the front surface of the wiring board, it is thus possible to leave the mirror for
Seat side wall 1001 installation space there was only the outer peripheral sub-fraction space of the wiring board, cause the microscope base side wall 1001 with
The contact area of the wiring board can not increase because of the limitation of installation space.
To avoid the capacitance or resistive element, 1001 height of the microscope base side wall also needs to be more than the capacitance or resistance member
Part 108 prevents to do so that can have enough space evacuation capacitance resistance elements between microscope base roof and wiring board
Relate to, cause the height of microscope base in traditional handicraft to be difficult to be further continued for reducing since above a variety of installations limit, microscope base and wiring board
Contact area also be difficult to increase again.
In comparison, since the capacitance or resistive element 108 are partly or entirely set to institute in the present embodiment
It states on the second surface 420 of integral type wiring board 400, thus is that the microscope base 105 is reserved on the first surface 410
Installation space becomes larger, and the contact area of the basic courses department 105a and the integral type wiring board 400 are greater than institute in traditional handicraft
The contact area between microscope base side wall 1001 and wiring board is stated, and is not required to increase the size of the integral type wiring board 400.
Further, due to needing the capacitance avoided or resistive element 108 to tail off on the integral type wiring board 400
Or need to avoid without the capacitance or resistive element 108, therefore the extension 105b is not necessarily to from the basic courses department 105a's
Top extends internally,
Shangdi extension can be tilted towards from the basic courses department 105a, thus the height of the basic courses department 105a can be reduced effectively,
So that after the microscope base 105 is installed on the integral type wiring board 400, the height of semi-finished product can be effectively reduced.
First camera module 100 further includes the first camera lens 101 and the first horse for installing first camera lens 101
Up to 102, first motor 102 is installed on the basic courses department 105a, and first motor 102 and first camera lens
There are certain avoiding spaces between 101 and the extension 105b, reduce by first camera lens 101 in first motor
The probability interfered with the extension 105b and first color-filter element 106 when being axially moved in 102.
It is partly or entirely arranged at described in the first area accordingly, due to the capacitance or resistive element 108
Second surface 420, thus be that the reserved installations of the basic courses department 105a are empty on the first surface 410 of the first area
Between become larger, thus the basic courses department 105a can make flaky process so that the basic courses department 105a and the integral type wiring board
400 contact area becomes larger, and first motor 102 also can directly be seated the basic courses department 105a, compared to traditional handicraft
It is middle microscope base is seated extension for, can effectively reduce the shoulder height of first motor 102, improve the microscope base 105 and
The installation stability and structure stationarity of first motor 102.
Further, for ease of description, the contact surface between motor and microscope base is defined as the first contact surface, by microscope base with
Contact surface between wiring board is defined as the second contact surface.In traditional handicraft, just due to capacitance or resistive element assist side
Face occupies big quantity space, thus the installation space very little of microscope base and wiring board, first contact surface are contacted with described second
The area in face is than sometime up to 10:1.And in the present embodiment, since partly even all the capacitance or resistive element 108 can
It is arranged at the second surface 420, thus the radial dimension (ruler on direction perpendicular to camera lens optical axis can not increased
It is very little) under the premise of, increase the contact surface between microscope base and wiring board 400, more firm foundations portion is formed, to improve
State double structural stabilities and reliability for taking the photograph module entirety.For example, in the embodiment in figure 1, the lower surface of basic courses department 105a
Area is equal to the upper surface area of basic courses department 105a.First motor 102 is mounted on the upper surface of basic courses department 105a, and basic courses department
The upper surface of 105a to being solid (i.e. the upper surface of basic courses department 105a to very close to each other between lower surface) between lower surface, because
This can improve double structural stabilities and reliability for taking the photograph module entirety.According to the difference of actual conditions, basic courses department 105a
Lower surface and upper surface between area ratio can also be adjusted, for example, the lower surface of basic courses department 105a and upper surface it
Between area ratio can be more than 1, might be less that 1.But usually, in the present embodiment, the lower surface of basic courses department 105a with it is upper
Area ratio between surface is more than 0.8.It, can be with when the area ratio between the lower surface of basic courses department 105a and upper surface is more than 1
The support of more firm stable is formed to the first lens assembly.In one example, the bottom of first lens assembly has ring
Shape mounting surface, first lens assembly are mounted on the upper surface of the basic courses department by the annular mounting surface.It is described
The lower surface of basic courses department and the area ratio of the annular mounting surface are more than 0.8.It may be noted that taken the photograph in module double, the ring sometimes
The size of shape mounting surface is not essentially equal with the upper surface of basic courses department 105a.For example, the area of the sometimes described annular mounting surface
It is slightly less than the area of the upper surface of the basic courses department 105a.In one embodiment, first lens assembly includes the first mirror
Head and the first motor, first camera lens are installed on first motor, and first motor is installed on the upper of the basic courses department
Surface.The mounting surface of first motor bottom can be used as the annular mounting surface of first lens assembly.
Further, microscope base is typically to be formed by being molded in traditional handicraft, and structural strength will slightly be weaker than metal microscope base,
But be difficult to be processed into the microscope base of above-mentioned shape using metal material since extension and basic courses department are mutually perpendicular to, in technique, but
It is since the extension 105b is obliquely upwardly extended, thus from technique, to be also easier to be processed into the present embodiment
Metal microscope base.It on the other hand, can be by reducing microscope base thickness since the intensity of metal microscope base is better than injected plastics material microscope base
(thickness described herein refer to microscope base optical axis direction size) mode reduce by the shoulder height of first motor 102.
Second camera module 200 includes the second photosensitive element 204, and second photosensitive element 204 is installed on described
On the first surface 410 of the second area of integral type wiring board 400, and second photosensitive element 204 and described first
Photosensitive element 104 is in Different Plane, to meet first camera module 100 and second camera module 200 not
With optics design requirement so that described pair is taken the photograph module and can be preferably imaged.
Second camera module 200 further include the second sheet metal 207 be positioned over second photosensitive element 204 with it is described
Between first surface 410, to more easily adjust between second photosensitive element 204 and first photosensitive element 104
Difference in height.Further, certain heat, second metal are will produce when second photosensitive element 204 works
Piece 207 can play certain cooling effect.
In the present embodiment, first camera module 100 uses zoom module, second camera module 200 to use
Fixed-focus module, thus second camera module need not use motor, and described the is supported by a camera lens supporter 202
Second camera lens 201 of two camera modules 200.The camera lens supporter 202 is installed on the second of the integral type wiring board 400
Region, and there are an accommodation space, described second is photosensitive between the camera lens supporter 202 and the integral type wiring board 400
Element 204 is installed on the integral type wiring board 400 in the accommodation space 204.
Second camera module 200 further includes one second color-filter element 206, and second color-filter element 206 is mounted
There is a certain distance in the bottom side of the camera lens supporter 202 and with second photosensitive element 204.
Further, first camera module 100 and second camera module 200 are all made of zoom module, then institute
It further includes the second motor to state the second camera module, and second camera lens 201 is installed on second motor, second colour filter
Element 206 is installed on the lower section of second camera lens 201 or is installed on the lower section of second motor, the second motor peace
Second area loaded on the integral type wiring board 400, so as to save second motor and the integral type wiring board
Microscope base between 400 effectively reduces the axial dimension (i.e. optical axis direction size) of second camera module 200.
The camera module array further includes a separator 300, and the separator 300 is located at first camera module
Between 100 and second camera module 200, for being risen to first camera module 100 and second camera module 200
Reinforcement and demagnetizing action are assisted, the relative position between first camera module 100 and second camera module 200 is prevented
Changing influences the imaging effect of the camera module array.
According to the present embodiment, for there are two the double of different optical designs to take the photograph module, modular structure can be improved by molding
Firmness and stability not only can to cancel traditional double tools taken the photograph in manufacturing process there are two the metallic support of accommodating hole
Enough reduce technological process, additionally it is possible to reduce cost, bring higher profit.
Generally speaking, the via design of the integral type wiring board 400 makes first photosensitive element 104 and described
Two photosensitive elements 204 are in Different Plane, and there are differences in height, so that first camera lens 101 and described after installation is complete
The camera lens end face of second camera lens 201 maintains an equal level, to meet most double design needs for taking the photograph module；Secondly as the through-hole of wiring board
Design, part or all of capacitance or resistive element 108 are installed in the bottom of the integral type wiring board 400, and by the mould
Modeling portion 500 coats so that the top of the integral type wiring board 400 has more flat spaces for installing the microscope base
105, improve double integral space utilization ratios for taking the photograph module；Again, the molded section 500 has the spy of high intensity, high rigidity
Property, double overall construction intensities for taking the photograph module can be effectively improved, the stability of modular structure is improved, traditional pair can be cancelled and taken the photograph
Tool in module effectively reduces production cost there are two the metallic support of accommodating hole.
As shown in Fig. 4, in another embodiment, the non-contact face 520 of the molded section 500 can also have one
Groove, the groove correspond to the through-hole of the integral type wiring board 400, and first photosensitive element 104 is installed on described recessed
On slot.
The groove surfaces are smooth, to be effectively ensured the installation flatness of first photosensitive element 104, described second
Photosensitive element 204 is still installed on the contact surface 510, and the groove can increase by first photosensitive element 104 and institute
The difference in height between the second photosensitive element 204 is stated, thus is installed on second photosensitive element 204 and the contact surface originally
The thickness of second sheet metal 207 between 510 can reduce or cancel second sheet metal 207, consequently facilitating adjustment institute
The difference in height between the first photosensitive element 104 and second photosensitive element 204 is stated, described pair is better adapted to and takes the photograph setting for module
Meter demand and imaging demand.
Further, the non-contact face 520 of the molded section 500 can also have a boss, the boss with it is described
The position of groove is identical, when first photosensitive element 104 is installed on the boss, is installed on second photosensitive element
Second sheet metal 207 between 204 and the integral type wiring board 400 need to correspond to adjusting thickness, to ensure described
Difference in height needed between one photosensitive element 104 and second photosensitive element 204 meets double imaging need for taking the photograph module
It asks.
As shown in Fig. 5, when the non-contact face 520 of the molded section 500 has groove, the integral type circuit
The first surface 410 of plate 400 can also have main part 411 and changeover portion 412, and the main part 411 is for installing
The microscope base 105, the changeover portion 412 are generally aligned in the same plane with the first surface 410, and the changeover portion 412 is located at described
First surface 410 abuts the position of the through-hole, and the changeover portion 412 is with the main part 411 not in same plane and institute
It states changeover portion 412 and is less than the main part 411, to form a step-like structure, the step with the main part 411
Shape structure can be such that the loop height of first metal wire 103 reduces, and reduce the microscope base 105 and first metal wire
Interference risk between 103.
Further, the loop height of first metal wire 103 reduces, and can make the microscope base 105 and first gold medal
The accommodation space belonged between line 103 becomes larger, and the height of the extension 105b of the microscope base 105 can further decrease at this time,
Angle of inclination is formed by between the interconnecting piece 105c and the first surface 410 to become smaller, so that the microscope base 105
Difficulty of processing can further decrease.
Further, as shown in Fig. 6, the molded section 500 can also have a through-hole, and the molded section 500
Lead to the hole site and shape are identical as the lead to the hole site of the integral type wiring board 400 and shape, and with the integral type wiring board
400 through-hole is corresponding, and it is photosensitive to install described first need to increase by the first gasket 800 for the bottom of the molded section 500 at this time
Element 104, and first gasket 800 can only be covered in the via bottoms of the molded section 500, also can integrally cover
In all areas of the molded section 500.
The step structure of the integral type wiring board 400 and the second sheet metal of 204 bottom of the second photosensitive element
207 can be adjusted according to double design needs for taking the photograph module.
Further, Fig. 7~10 show that the through hole in the utility model in the integral type wiring board 400 increases
The embodiment of gasket.In these embodiments, the second surface 420 of the wiring board 400 is also equipped with the first gasket 800, institute
Through-hole is stated to be covered by first gasket 800, the upper surface of the gasket be it is smooth, to carry, provide a flat surface for
First photosensitive element 104 is installed.The molded section 500 is integrally formed the second surface in the wiring board 400
420 and first gasket 800 lower surface.First gasket 800 can be flat, can also be in U-typed shape.
Fig. 7~9 show the schematic diagram of the embodiment of several first gaskets 800 with U-typed shape.Wherein,
The upper surface of first gasket 800 of U-typed shape is smooth.
Figure 10 shows the schematic diagram of the embodiment with flat first gasket 800.In the integral type wiring board
Increase by first gasket 800 at 400 lead to the hole site, the technology difficulty of molding can be reduced, improves double quality for taking the photograph product.
It may be noted that the first gasket 800 of U-typed shape can be to lower recess, and can also be to raise up, it thus can be according to reality
The difference in height of first photosensitive element 104 and second photosensitive element 204 is arranged in border situation.First gasket can also make
At the shape of the first sheet metal 107 in Fig. 6 embodiments, i.e., raised solid platy structure.Utilize the upper of the bulge-structure
Surface is for installing first photosensitive element 104.
Above description is only the better embodiment of the application and the explanation to institute's application technology principle.Art technology
Personnel should be appreciated that utility model range involved in the application, however it is not limited to which the specific combination of above-mentioned technical characteristic forms
Technical solution, while should also cover in the case where not departing from utility model design, by above-mentioned technical characteristic or its etc.
The other technical solutions for carrying out arbitrary combination with feature and being formed.Such as features described above and (but not limited to) disclosed herein
Technical characteristic with similar functions is replaced mutually and the technical solution that is formed.
Claims (16)
1. a kind of photosensory assembly array for camera module array, which is characterized in that including：
First photosensitive element；
Second photosensitive element；
Unitary substrate comprising：
Wiring board has the first area for being suitable for installing the first lens assembly containing the first camera lens and contains the suitable for installation
The second area of second lens assembly of two camera lenses, the wiring board also have close to first camera lens and second camera lens
First surface and the second surface opposite with the first surface；With
Molded section is integrally formed the second surface in the wiring board, and the molded section by moulding technology
It covers the second surface and corresponds to described second corresponding at least part of the first area and the second surface
At least part in region；Wherein, the unitary substrate is smooth with the first burnishing surface and second for being in different height
Face, first photosensitive element are installed on first burnishing surface, and second photosensitive element is installed on second burnishing surface；
First colour filter；And
First microscope base comprising：
In flat basic courses department, it is installed on the wiring board and is centered around around first photosensitive element, and its
Lower surface is contacted with the first surface, and upper surface is suitable for installing first lens assembly；With
Extension extends from the basic courses department to the direction at the center towards the first area, and the extension
Lower surface is not contacted with the first surface；First colour filter is installed on the extension.
2. the photosensory assembly array according to claim 1 for camera module array, which is characterized in that the wiring board
First area there is first through hole, first burnishing surface is located at the first through hole.
3. the photosensory assembly array according to claim 1 for camera module array, which is characterized in that the wiring board
First area there is the first groove, first burnishing surface is located at first groove.
4. the photosensory assembly array according to claim 2 for camera module array, which is characterized in that the integral type
Substrate further includes the first sheet metal, and the molded section has corresponding with the first through hole suitable for accommodating described first photosensitive yuan
Second through-hole of part, first sheet metal covers the first through hole and second through-hole, first burnishing surface are located at
First sheet metal.
5. the photosensory assembly array for camera module array according to any one of Claims 1 to 4, feature exist
Be mounted on the second surface in, at least one capacitance or resistive element, the molded section cover at least one capacitance or
Resistive element.
6. the photosensory assembly array according to claim 1 for camera module array, which is characterized in that first mirror
Seat further includes changeover portion, and the changeover portion connects the basic courses department and the extension, and the changeover portion is relative to described first
The optical axis of lens assembly is inclined.
7. the photosensory assembly array according to claim 6 for camera module array, which is characterized in that first mirror
Seat is made of metal material.
8. the photosensory assembly array according to claim 2 for camera module array, which is characterized in that the molded section
The non-of the first through hole is covered with the contact surface contacted with the second surface, and by what the contact surface extended to form
Contact surface, first burnishing surface are formed in the non-contact face.
9. the photosensory assembly array according to claim 8 for camera module array, which is characterized in that described non-contact
Face is in same plane with the contact surface.
10. the photosensory assembly array according to claim 8 for camera module array, which is characterized in that described non-to connect
Contacting surface forms boss or groove, first burnishing surface are located at the boss or groove in the non-contact face.
11. the photosensory assembly array according to claim 4 for camera module array, which is characterized in that described first
There is sheet metal boss, first burnishing surface to be located at the boss of first sheet metal.
12. the photosensory assembly array according to claim 1 for camera module array, which is characterized in that described first
Colour filter is mounted on the lower surface of the extension.
13. a kind of camera module array, which is characterized in that including：
First lens assembly and the second lens assembly；And
The photosensory assembly array for camera module array described in any one of claim 1~12.
14. camera module array according to claim 13, which is characterized in that the bottom of first lens assembly has
Annular mounting surface, first lens assembly are mounted on the upper surface of the basic courses department by the annular mounting surface.
15. camera module array according to claim 14, which is characterized in that the lower surface of the basic courses department and the ring
The area ratio of shape mounting surface is more than 0.8.
16. camera module array according to claim 13, which is characterized in that first lens assembly includes the first mirror
Head and the first motor, first camera lens are installed on first motor, and first motor is installed on the upper of the basic courses department
Surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710973318 | 2017-10-18 | ||
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| CN201721385762.3U Active CN207766338U (en) | 2017-10-18 | 2017-10-25 | Camera module array and unitary substrate for camera module array |
| CN201721385479.0U Active CN207665056U (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array for camera module array and corresponding camera module array |
| CN201711008660.4A Active CN109688298B (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding integrated substrate |
| CN201721395664.8U Withdrawn - After Issue CN207978027U (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding unitary substrate |
| CN201711014959.0A Pending CN109688301A (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array and corresponding camera module array |
| CN201721440261.0U Active CN207663195U (en) | 2017-10-18 | 2017-11-02 | camera module array |
| CN201711060630.8A Pending CN109683434A (en) | 2017-10-18 | 2017-11-02 | Camera module array |
| CN201721470922.4U Active CN208369686U (en) | 2017-10-18 | 2017-11-07 | Unitary substrate and its production mold, photosensory assembly array and camera module array |
| CN201711085379.0A Active CN109688302B (en) | 2017-10-18 | 2017-11-07 | Integrated substrate for camera module array, manufacturing method and die thereof |
| CN201711249119.2A Active CN109688303B (en) | 2017-10-18 | 2017-12-01 | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method |
| CN201721656763.7U Active CN207691907U (en) | 2017-10-18 | 2017-12-01 | Photosensory assembly jigsaw, photosensory assembly and camera module |
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| CN201721385762.3U Active CN207766338U (en) | 2017-10-18 | 2017-10-25 | Camera module array and unitary substrate for camera module array |
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| CN201721395664.8U Withdrawn - After Issue CN207978027U (en) | 2017-10-18 | 2017-10-25 | Camera module array and corresponding unitary substrate |
| CN201711014959.0A Pending CN109688301A (en) | 2017-10-18 | 2017-10-25 | Photosensory assembly array and corresponding camera module array |
| CN201721440261.0U Active CN207663195U (en) | 2017-10-18 | 2017-11-02 | camera module array |
| CN201711060630.8A Pending CN109683434A (en) | 2017-10-18 | 2017-11-02 | Camera module array |
| CN201721470922.4U Active CN208369686U (en) | 2017-10-18 | 2017-11-07 | Unitary substrate and its production mold, photosensory assembly array and camera module array |
| CN201711085379.0A Active CN109688302B (en) | 2017-10-18 | 2017-11-07 | Integrated substrate for camera module array, manufacturing method and die thereof |
| CN201711249119.2A Active CN109688303B (en) | 2017-10-18 | 2017-12-01 | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method |
| CN201721656763.7U Active CN207691907U (en) | 2017-10-18 | 2017-12-01 | Photosensory assembly jigsaw, photosensory assembly and camera module |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688299B (en) * | 2017-10-18 | 2024-04-09 | 宁波舜宇光电信息有限公司 | Camera module array and corresponding integrated substrate |
| WO2020043116A1 (en) | 2018-08-28 | 2020-03-05 | Zhejiang Dahua Technology Co., Ltd. | Systems and methods for adjusting position of photosensitive chip of image acquisition device |
| CN109286743B (en) * | 2018-10-24 | 2020-04-03 | 浙江大华技术股份有限公司 | Flatness adjusting device and camera |
| CN109729645A (en) * | 2019-01-21 | 2019-05-07 | 宁波舜宇光电信息有限公司 | Circuit board, circuit boards half-finished product, electronic device, circuit board preparation method |
| CN111491074B (en) * | 2019-01-25 | 2021-08-06 | 宁波舜宇光电信息有限公司 | Composite support for camera module array and corresponding camera module array |
| CN109714515A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | TOF camera module and electronic product |
| CN110234001B (en) * | 2019-06-04 | 2021-03-05 | 深圳市华芯技研科技有限公司 | Portable binocular three-dimensional camera device |
| CN110290304B (en) * | 2019-07-29 | 2021-08-20 | Oppo广东移动通信有限公司 | Depth camera and terminal |
| CN112637447B (en) * | 2019-10-08 | 2022-08-16 | 宁波舜宇光电信息有限公司 | Composite substrate, photosensitive assembly, camera module and corresponding manufacturing method |
| CN112702475A (en) * | 2019-10-17 | 2021-04-23 | 广州立景创新科技有限公司 | Optical module |
| CN111491084B (en) * | 2020-04-21 | 2021-03-26 | Oppo广东移动通信有限公司 | A electronic equipment that is used for decoration of camera and has it |
| CN114650347B (en) * | 2020-12-21 | 2024-03-15 | 宁波舜宇光电信息有限公司 | Image sensor assembly, camera module and mobile device |
| CN113726995B (en) * | 2021-08-12 | 2022-06-10 | 荣耀终端有限公司 | Camera module structure and electronic equipment |
| TWI794101B (en) * | 2022-04-21 | 2023-02-21 | 大根光學工業股份有限公司 | Imaging lens module and electronic device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100529825C (en) * | 2007-10-31 | 2009-08-19 | 无锡凯尔科技有限公司 | Automatic microdistance regulation type mobile phone camera module group assembling process |
| JP2011039377A (en) * | 2009-08-17 | 2011-02-24 | Minebea Co Ltd | Camera module |
| CN102572320A (en) * | 2011-11-28 | 2012-07-11 | 北京思比科微电子技术股份有限公司 | Method for reducing height of CMOS (Complementary Metal-Oxide-Semiconductor Transistor) image sensor module and CMOS image sensor module |
| CN104576674B (en) * | 2014-12-25 | 2017-07-11 | 南昌欧菲光电技术有限公司 | Camera module and its encapsulation structure of image sensing chip |
| CN116567379A (en) * | 2015-06-29 | 2023-08-08 | Lg伊诺特有限公司 | Dual camera module and optical device |
| US9973669B2 (en) * | 2015-08-28 | 2018-05-15 | Apple Inc. | Dual overmolded reconstructed camera module |
| KR20170035237A (en) * | 2015-09-22 | 2017-03-30 | 엘지전자 주식회사 | Mobile terminal and method for controlling the same |
| US9781324B2 (en) * | 2016-02-18 | 2017-10-03 | Ningbo Sunny Opotech Co., Ltd. | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device |
| CN105721749B (en) * | 2016-02-24 | 2020-07-24 | 宁波舜宇光电信息有限公司 | Camera module, electric support and circuit board assembly thereof and manufacturing method |
| CN205545567U (en) * | 2016-03-03 | 2016-08-31 | 南昌欧菲光电技术有限公司 | Imaging module and electron device |
| CN206313866U (en) * | 2016-08-12 | 2017-07-07 | 宁波舜宇光电信息有限公司 | Array camera module and its molding photosensory assembly and the electronic equipment with array camera module |
| CN206272707U (en) * | 2016-03-15 | 2017-06-20 | 宁波舜宇光电信息有限公司 | Array camera module and double camera modules and its circuit board module and electronic equipment |
| CN207530910U (en) * | 2016-03-15 | 2018-06-22 | 宁波舜宇光电信息有限公司 | Double camera modules and its photosensory assembly and electronic equipment |
| WO2017174022A2 (en) * | 2016-04-07 | 2017-10-12 | 宁波舜宇光电信息有限公司 | Split array camera module, and assembly and application method therefor |
| CN112217969B (en) * | 2016-04-07 | 2022-10-21 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof |
| CN205809504U (en) * | 2016-06-23 | 2016-12-14 | 宁波舜宇光电信息有限公司 | Focus camera module and focussing mechanism thereof |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
| CN106550177A (en) * | 2016-09-06 | 2017-03-29 | 华为机器有限公司 | A kind of photographic head and its manufacture method and terminal |
| CN109688299B (en) * | 2017-10-18 | 2024-04-09 | 宁波舜宇光电信息有限公司 | Camera module array and corresponding integrated substrate |
-
2017
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- 2017-10-25 CN CN201721385762.3U patent/CN207766338U/en active Active
- 2017-10-25 CN CN201721385479.0U patent/CN207665056U/en active Active
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- 2017-10-25 CN CN201721395664.8U patent/CN207978027U/en not_active Withdrawn - After Issue
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| CN207663195U (en) | 2018-07-27 |
| CN207978027U (en) | 2018-10-16 |
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| CN109688301A (en) | 2019-04-26 |
| CN109688303A (en) | 2019-04-26 |
| CN207691907U (en) | 2018-08-03 |
| CN208369686U (en) | 2019-01-11 |
| CN109688299A (en) | 2019-04-26 |
| CN109688302A (en) | 2019-04-26 |
| CN109688302B (en) | 2023-11-03 |
| CN109683434A (en) | 2019-04-26 |
| CN109688303B (en) | 2024-02-02 |
| CN109688299B (en) | 2024-04-09 |
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