CN206272705U - Array camera module and double camera modules and its circuit board module and electronic equipment - Google Patents

Array camera module and double camera modules and its circuit board module and electronic equipment Download PDF

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Publication number
CN206272705U
CN206272705U CN201620823927.XU CN201620823927U CN206272705U CN 206272705 U CN206272705 U CN 206272705U CN 201620823927 U CN201620823927 U CN 201620823927U CN 206272705 U CN206272705 U CN 206272705U
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CN
China
Prior art keywords
module
encapsulation part
wiring board
circuit
main body
Prior art date
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Active
Application number
CN201620823927.XU
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Chinese (zh)
Inventor
王明珠
赵波杰
田中武彦
陈飞帆
丁亮
蒋恒
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Priority to CN201620823927.XU priority Critical patent/CN206272705U/en
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Abstract

An array camera module and double camera modules and its circuit board module and electronic equipment, wherein the circuit board module of the array camera module includes：One circuit plate portion and a disjunctor encapsulation part；The circuit plate portion is used to be electrically connected with least two sensitive chips, and circuit plate portion described in the disjunctor encapsulation part integral packaging meets user for the multi-functional application demand of mobile electronic device.

Description

Array camera module and double camera modules and its circuit board module and electronic equipment
The explanation of related application
It is on March 15th, 2016 applying date that this case is, Application No. 201620200264.6, invention and created name is " battle array The divisional application of row camera module and its circuit board module ".
Technical field
The utility model is related to camera module field, further, is related to an array camera module and its circuit board module.
Background technology
At present, all increasingly integrated more functions of most electronic product, this trend causes that gas producing formation transboundary goes out Not poor, such as mobile phone forms collection communication, shooting, online, a navigation etc. after being highly integrated via initial communication equipment Variation, three-dimensional function are integrated arrival mobile electronic device.
However, the camera module for being configured in mobile electronic device at present is mostly single-lens camera module, this single mirror Head camera module is either that all cannot meet user in the quality of image or effect to be set for mobile electron in shooting Standby multi-functional application demand.
Occur and ever more popular has been have more than a camera module for camera lens, for example twin-lens shooting mould Group, twin-lens camera module provides the style of shooting of apish eyes structure, and this twin-lens camera module is in 3D Shoot and scanning, hand gesture location identification, color fidelity, rapid focus, panorama all many-sides such as shooting, background blurring shooting deeply The performance more more excellent than single-lens camera module is suffered from, therefore, the camera module for having more than a camera lens is to image from now on The important directions of the development of module industry.During using twin-lens camera module filmed image, twin-lens camera module Image is obtained from two positions respectively using two imaging modules with differences in spatial location, then according to image combining method After the Image compounding shot respectively to two imaging modules, the final image of many camera lens camera modules is obtained.May be appreciated It is, in this process, the one of the image effect such as resolving power, shading, color of each imaging modules of many camera lens camera modules Cause property, and in level, vertically, longitudinally three deviations in direction, be the weight of the image quality for weighing twin-lens camera module Want index.
However, the structure of current stage manufacture, the technique of assembling twin-lens camera module and twin-lens camera module is all remote The image quality of twin-lens camera module cannot far be ensured.Fig. 1 shows the twin-lens camera module of prior art, and it includes one Wiring board 10P, two microscope base 20P and two image-forming module 30P, each described image-forming module 30P include a motor camera lens respectively Component 31P.Each microscope base 20P is individually located in the homonymy of the wiring board 10P, and each described microscope base 20P passes through The wiring board 10P is linked together, and each described motor lens assembly 31P is separately positioned on each described microscope base 20P, with Supported by microscope base 20P each described.It is understood that the packaging technology from the twin-lens camera module of prior art comes See, each described microscope base 20P is individually mounted on the wiring board 10P, thus can cause each described microscope base 20P it Between the more difficult to govern control such as size, position so that so that size, position between each described twin-lens camera module support etc. The uniformity of parameter is poor.From the point of view of the structure of the twin-lens camera module of prior art, each described microscope base 20P difference It is independent, and each described microscope base 20P is only attached by the wiring board 10P, because the wiring board 10P is generally selected PCB so that wiring board 10P itself is more soft and easily deformable, at this moment, the twin-lens camera module Overall rigidity is difficult to ensure that, during the use that the twin-lens camera module is assembled after completing, such knot Structure is easily caused each element of the image-forming module 30P, such as the relative size between described motor lens assembly 31P is unstable Fixed, position of related features is big, and the generation of the optical axis of each image-forming module 30P the problems such as easily deviate default position, one Any one appearance in denier these situations, can all give the image quality of the twin-lens camera module, such as Image compounding etc. Final imaging effect brings uncontrollable factor or larger adverse effect.
Additionally, the assembling of many camera lens camera modules is based on traditional COB (Chip On Board chip packages) technique, Generally there is the circuit devcie 11P of protrusion on the wiring board 10P, and a sensitive chip 12P, institute are installed on the wiring board State sensitive chip 12P and the wiring board 10P is generally connected to by gold thread 121P, and the gold thread 121P is generally curved convex Go out with the wiring board main body, therefore, these protrusion the circuit devcie 11P and the gold thread 121P for camera module Assembling also brings some unfavorable factors.
The circuit devcie 11P and the gold thread 21P are directly exposed to the surface of the wiring board 10P, therefore rear During continuous assembling, such as paste the microscope base 20P, weld the processes such as the motor lens assembly 31P, inevitably It is affected, solder resist, dust during welding etc. is easily attached to the circuit devcie 11P, and the circuit devcie 11P and institute Sensitive chip 12P is stated to be located in an interconnected space, therefore dust pollutant is easy to influence the sensitive chip 12P, such influence is likely to result in the camera module after assembling and there is the bad phenomenons such as dirty stain, reduces product yield.
Secondly, the microscope base 20P is located at the outside of the circuit devcie 11P, therefore is installing the microscope base 20P and described , it is necessary to reserve certain safe distance between the microscope base 20P and the circuit devcie 11P during wiring board 10P, and in level Direction and upwardly direction are required for reserved safe distance, and this increases the demand of camera module thickness to a certain extent Amount, makes its thickness be difficult to reduce.
Additionally, the molding of single camera relative for the molding of multi-cam, is related to the coordination between multiple camera modules Problem, requires that optical axis is consistent between multiple camera lenses, and the uniformity for being based on multiple camera lens optical axis of traditional COB techniques is rareer To guarantee.And multi-cam module overall volume is larger, the intensity and flatness to wiring board are more sensitive, therefore wiring board Thickness is larger.
Utility model content
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Board component includes a disjunctor encapsulation part and a circuit plate portion, and the disjunctor encapsulation part encapsulated moulding is described in the circuit plate portion Disjunctor encapsulation part is suitable to correspondence multiple camera lens.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Board component includes a wiring board main body and an at least circuit element, and the circuit element protrudes from the wiring board main body, described Circuit element is coated by the disjunctor encapsulation part, so as to outside will not be directly exposed to.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the array Camera module includes multiple sensitive chips, and the disjunctor encapsulation part is around the outside of each sensitive chip.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the disjunctor Encapsulation part includes an optical filter construction section, is suitable to install multiple optical filters, without extra independent support member.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Plate main body has multiple inner groovies, and each sensitive chip is arranged in the inner groovy, in order to reduce the photosensitive core The relative altitude of piece and the wiring board main body, so as to reduce the requirement for height to the disjunctor encapsulation part.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Plate main body has multiple paths and multiple external grooves, and the external groove is communicated in the path, and the external groove is suitable to upside-down mounting ground The sensitive chip is installed.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Plate portion includes a back-up coat, is arranged at the wiring board bottom part body lamination, strong with the structure for strengthening the wiring board main body Degree and heat dispersion.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the circuit Plate main body has an at least reinforced hole, and the disjunctor encapsulation part extends into the reinforced hole, so as to strengthen the line plate main body Structural strength.
A purpose of the present utility model is to provide an array camera module and its circuit board module, wherein the disjunctor Encapsulation part includes a camera lens construction section, is suitable to install multiple camera lenses, so that for the camera lens provides installation site.
In order to realize above utility model purpose, one side of the present utility model provides the wiring board of an array camera module Component, it includes：One circuit plate portion, its at least two sensitive chip for being used to be electrically connected with the array camera module；Connect with one Body encapsulation part；The disjunctor encapsulation part integral packaging is in the circuit plate portion.
According to an embodiment of the present utility model, disjunctor encapsulation part described in the circuit board module forms at least two and leads to Hole, each through hole is relative with each sensitive chip, to provide the sensitive chip passage of light.
According to an embodiment of the present utility model, disjunctor encapsulation part top described in the circuit board module in plane, For installing support, camera lens, motor or the optical filter of the array camera module.
According to an embodiment of the present utility model, disjunctor encapsulation part top described in the circuit board module has at least two Mounting groove, each mounting groove is communicated in the corresponding through hole, be respectively used to install the array camera module support, Optical filter, camera lens or motor.
According to an embodiment of the present utility model, disjunctor encapsulation part described in the circuit board module include one cladding section, One optical filter construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively by the cladding section Molding extends upwards, and internal in step-like, in order to install the optical filter and camera lens of the array camera module.
According to an embodiment of the present utility model, optical filter construction section described in the circuit board module is with least two peaces Tankage, each mounting groove is communicated in the corresponding through hole, the first step-like rank is formed, in order to install the filter Mating plate, the camera lens construction section has at least two camera lens mounting grooves, and each camera lens mounting groove is communicated in the corresponding through hole, The step-like second-order is formed, in order to install the camera lens of the array camera module.
According to an embodiment of the present utility model, camera lens construction section described in the circuit board module has at least two camera lenses Inwall, each camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
According to an embodiment of the present utility model, circuit plate portion described in the circuit board module includes an at least circuit elements Part, the circuit element protrudes from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, described to cause Circuit element will not be directly exposed to outside.
According to an embodiment of the present utility model, the selection combination of circuit element described in the circuit board module：Resistance, electricity The one or more of which of appearance, diode, triode, potentiometer and relay.
According to an embodiment of the present utility model, circuit plate portion described in the circuit board module includes a back-up coat, institute State reinforcing layer laminate and be arranged at the wiring board bottom part body, to strengthen the structural strength of the wiring board main body.
According to an embodiment of the present utility model, back-up coat described in the circuit board module is metallic plate, to strengthen State the heat dispersion of circuit plate portion.
According to an embodiment of the present utility model, circuit plate portion described in the circuit board module includes a screen layer, institute Screen layer parcel the wiring board main body and the disjunctor encapsulation part are stated, to strengthen the electromagnetism interference of the circuit board module Energy.
According to an embodiment of the present utility model, screen layer described in the circuit board module is metallic plate or wire netting.
According to an embodiment of the present utility model, wiring board main body has an at least reinforced hole in the circuit board module, The disjunctor encapsulation part extends into the reinforced hole, in order to strengthen the structural strength of the wiring board main body.
According to an embodiment of the present utility model, reinforced hole described in the circuit board module is groove-like.
According to an embodiment of the present utility model, reinforced hole described in the circuit board module is through hole, described to cause The moulding material of disjunctor encapsulation part is fully contacted with the wiring board main body, and easily fabricated.
According to an embodiment of the present utility model, wiring board main body has at least two paths in the circuit board module, fits In each sensitive chip the wiring board main body is installed on from the wiring board main body back side direction.
According to an embodiment of the present utility model, path described in the circuit board module is in step-like, in order to be institute State the installation site that sensitive chip provides stabilization.
According to an embodiment of the present utility model, the material of wiring board main body can be selected from described in the circuit board module Combination：Rigid Flex, ceramic substrate, PCB hardboards or FPC.
According to an embodiment of the present utility model, the material of disjunctor encapsulation part described in the circuit board module is selected from group Close：One or more in epoxy resin, nylon, LCP or PP.
According to an embodiment of the present utility model, circuit board module described in the circuit board module includes at least two motors Attachment structure, each motor attachment structure includes an at least lead, and the lead is arranged at the disjunctor encapsulation part, and is electrically connected The wiring board main body is connected to, the lead includes a motor connection end, the disjunctor encapsulation part is revealed in, in order to connect one Motor pin.
According to an embodiment of the present utility model, circuit board module described in the circuit board module includes at least two motors Attachment structure, each motor attachment structure includes an at least lead and an at least pin groove, and the lead is arranged at described Disjunctor encapsulation part, and the wiring board main body is electrically connected to, the pin groove is arranged at the disjunctor encapsulation part upper end, institute Stating lead includes a motor connection end, and the motor connects end line in the groove bottom wall, is plugged in order to a motor pin The motor connection end is electrically connected to during the pin groove.
According to an embodiment of the present utility model, circuit board module described in the circuit board module includes at least two motors Attachment structure, each motor attachment structure includes at least a pin groove and at least a circuit junction, and the circuit junction is electrically connected The wiring board main body is connected to, the pin groove is arranged at the disjunctor encapsulation part, and institute is extended to by the wiring board main body The top of disjunctor encapsulation part is stated, and the circuit junction is revealed in the pin groove, is plugged in order to a motor pin described The circuit junction is electrically connected to during pin groove.
According to an embodiment of the present utility model, circuit board module described in the circuit board module includes at least two motors Attachment structure, each motor attachment structure includes at least one engraving circuit, and the engraving circuit is arranged at the disjunctor encapsulation Portion, is electrically connected to the wiring board main body, in order to electrically connect a motor pin.
According to an embodiment of the present utility model, engraving circuit described in the circuit board module is in the way of laser formation It is arranged at the disjunctor encapsulation part.
Another aspect of the present utility model provides an array camera module, and it includes circuit board module described in one, at least Camera lens and at least sensitive chip；Each camera lens is located at the photosensitive path of the corresponding sensitive chip, each sensitive chip It is electrically connected to the circuit board module.
According to another embodiment of the present utility model, described camera module includes a support, and the support is installed in The circuit board module, described camera module includes at least two optical filters, and each optical filter is installed in the support.
According to another embodiment of the present utility model, described camera module includes at least two motors, each camera lens quilt The corresponding motor is installed on, each motor is installed on the circuit board module.
According to another embodiment of the present utility model, described camera module includes at least two optical filters, each optical filtering Piece is installed in the circuit board module.
The utility model also provides the circuit board module of a pair of camera module, and it includes：
Circuit plate portion, it is used to be electrically connected at two sensitive chips；With
Disjunctor encapsulation part, it is integrally packaged in the circuit plate portion, and forms two through hole, each described through hole and each The sensitive chip position is corresponding, passage of light is provided with to the corresponding sensitive chip, wherein the disjunctor encapsulation part Support is also equipped with, the support is suitable to install optical filter.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, two monomers Support is installed on the disjunctor encapsulation part, to be respectively mounted two optical filters.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, disjunctor it is described Support is installed on the disjunctor encapsulation part, for installing two optical filters.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, two motors are fitted In the top for being installed on the support or the disjunctor packaging body.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the wiring board Portion includes wiring board main body and is raised in the circuit element of the wiring board main body, and the disjunctor encapsulation part coats the circuit elements Part.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the disjunctor envelope Dress portion includes connector and two outer ring bodies, wherein the connector is connected integrally between two outer ring body, and by institute State two outer ring bodies and be divided into adjacent two parts, to form two through holes, sensitive chip described in two is adapted to be arranged at institute State the both sides of connector.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the wiring board Portion includes wiring board main body and is raised in the circuit element of the wiring board main body, and the disjunctor encapsulation part coats the circuit elements Part, circuit element described in a portion is located at the position between two through holes, and circuit element quilt described in this part The connector cladding.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the wiring board Main body has the reinforced hole of groove-like or perforated, and the disjunctor encapsulation part integrally extends into the reinforced hole.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the wiring board Main body is Rigid Flex, ceramic substrate, PCB hardboards or FPC plates.
According to an embodiment of the present utility model, in the circuit board module of above-mentioned double camera modules, the disjunctor envelope Formed in the circuit plate portion dress portion one molding, and its material is selected from the one kind in epoxy resin, nylon, LCP and PP.
The utility model also provides a pair of camera module, and it includes：
Two camera lenses；
Two sensitive chips；
Two optical filters；
Support, optical filter described in two be installed on the support and be located at the corresponding camera lens and the sensitive chip it Between；
Circuit plate portion, it is electrically connected at sensitive chip described in two；With
Disjunctor encapsulation part, it is integrally packaged in the circuit plate portion, and forms two through hole, each described through hole and each The sensitive chip position is corresponding, and passage of light, the support are provided with to the corresponding camera lens and the sensitive chip It is installed on the disjunctor encapsulation part.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the support of two monomers is installed on institute Disjunctor encapsulation part is stated, to be respectively mounted two optical filters.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the support of disjunctor is installed on institute Disjunctor encapsulation part is stated, to install two optical filters.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the circuit plate portion includes wiring board Main body and the circuit element for being raised in the wiring board main body, the disjunctor encapsulation part coat the circuit element.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the wiring board main body has groove The reinforced hole of shape or perforated, the disjunctor encapsulation part integrally extends into the reinforced hole.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the wiring board main body is soft or hard knot Plywood, ceramic substrate, PCB hardboards or FPC plates.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the disjunctor encapsulation part includes connection Body and two outer ring bodies, wherein the connector is connected integrally between two outer ring body, and two outer ring body are divided Adjacent two parts are divided into, to form two through holes, sensitive chip described in two is arranged at the both sides of the connector.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the disjunctor encapsulation part includes connection Body and two outer ring bodies, wherein the connector is connected integrally between two outer ring body, and two outer ring body are divided Adjacent two parts are divided into, to form two through holes, sensitive chip described in two is arranged at the both sides of the connector, its Middle a part of circuit element is located at the position between two through holes, and circuit element described in this part is by the company Junctor is coated.
According to an embodiment of the present utility model, in above-mentioned double camera modules, the disjunctor encapsulation part one is molded Be formed at the circuit plate portion, and its material is selected from one or more in epoxy resin, nylon, LCP and PP.
According to an embodiment of the present utility model, in above-mentioned double camera modules, described pair of camera module is to focus to take the photograph As module.
According to an embodiment of the present utility model, in above-mentioned double camera modules, described pair of camera module is that Jiao takes the photograph As module, it also includes two motors, and wherein each described camera lens is installed on the corresponding motor, and the motor is installed on described Support.
According to an embodiment of the present utility model, in above-mentioned double camera modules, described pair of camera module is that Jiao takes the photograph As module, it also includes two motors, and wherein each described camera lens is installed on the corresponding motor, and the motor is installed on described The top of disjunctor encapsulation part.
The utility model also provides an electronic equipment, and it includes above-mentioned double camera modules, wherein the electronic equipment is Mobile phone or panel computer equipment.
Brief description of the drawings
Fig. 1 is that cuing open for prior art twin-lens camera module shows schematic diagram.
Fig. 2A is the array camera module and its circuit board module according to first preferred embodiment of the present utility model Cut-away view.
Fig. 2 B are cutd open according to another array camera module and its wiring board of first preferred embodiment of the present utility model Diagram.
Fig. 3 is the manufacturing process schematic diagram of the circuit board module according to first preferred embodiment of the present utility model.
Fig. 4 is the circuit board module manufacture method schematic diagram according to first preferred embodiment of the present utility model.
Fig. 5 A, 5B and 5C are the motor connections of the molding circuit pack according to first preferred embodiment of the present utility model The different embodiments of structure.
Fig. 6 is another array camera module schematic diagram according to first preferred embodiment of the present utility model.
Fig. 7 is according to second array camera module of preferred embodiment of the present utility model and its cuing open for circuit board module Diagram.
Fig. 8 is according to the 3rd array camera module of preferred embodiment of the present utility model and its cuing open for circuit board module Diagram.
Fig. 9 is according to the 4th array camera module of preferred embodiment of the present utility model and its cuing open for circuit board module Diagram.
Figure 10 is the array camera module and its circuit board module according to the 5th preferred embodiment of the present utility model Cut-away view.
Figure 11 is the array camera module and its circuit board module according to the 6th preferred embodiment of the present utility model Cut-away view.
Figure 12 is the array camera module and its circuit board module according to the 7th preferred embodiment of the present utility model Cut-away view.
Figure 13 is the array camera module and its circuit board module according to the 8th preferred embodiment of the present utility model Cut-away view.
Figure 14 is the array camera module and its circuit board module according to the 9th preferred embodiment of the present utility model Sectional view.
Specific embodiment
Hereinafter describe for disclosing the utility model so that those skilled in the art can realize the utility model.Hereinafter retouch Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", The orientation of the instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed System is that, based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies and describes, without Be indicate or imply meaning device or element must have specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.
If Fig. 2A to Fig. 4 is the array camera module and its wiring board according to first preferred embodiment of the present utility model Component.The array camera module can be applied to various electronic equipments, to aid in user to be taken the photograph by the array The image of object or person is shot as module, such as described array camera module can be used to shoot the figure of object or personage The image data such as picture or video.Preferably, the array camera module can be applied to a mobile electronic device, for example institute Stating mobile electronic device can be but not limited to mobile phone or panel computer equipment.
As shown in Fig. 2 B to Fig. 4, the array camera module of the present utility model is carried out in following description with it To illustrate content of the present utility model and advantage as a example by the array camera module of a twin-lens.The array camera module includes one Circuit board module 10, two camera lenses 50 and two sensitive chips 30.
It is noted that the utility model is disclosed for convenience, in this embodiment of the present utility model, with two Illustrated as a example by the array camera module that the camera lens 50 is constituted, and in other embodiment of the present utility model, The quantity of involved camera lens 50 can be more, and such as two or more, those skilled in the art is it should be appreciated that the camera lens 50 quantity is not the limitation of array camera module of the present utility model.
Further, each described sensitive chip 30 is installed in the module circuit board module respectively, each described camera lens 50 are installed on the circuit board module 10, and each described camera lens 50 is located at each described sensitive chip 30 of correspondence position Photosensitive path, the circuit board module 10 can be coupled to the electronic equipment.Those skilled in the art should be understood , a camera lens 50 and a sensitive chip 30 can cooperate for filmed image.Specifically, clapped Object is taken the photograph, the light of such as object or person reflection can be received to carry out after by the camera lens 50 by the sensitive chip 30 Photoelectric conversion, in other words, the sensitive chip 30 can convert optical signal into electric signal, and the electric signal can pass through The circuit board module 10 is transferred into the electronic equipment, related to reference object so as to be generated on the electronic equipment Image.
The circuit board module 10 includes a disjunctor encapsulation part 11 and a circuit plate portion 12, the one of the disjunctor encapsulation part 11 The circuit plate portion 12 is connected to encapsulation, such as the circuit plate portion 12 is connected to molding.More specifically, the disjunctor encapsulation (Molding On Board, the MOB) molding by way of being molded into wiring board of portion 11 is connected to the circuit plate portion 12.
The circuit plate portion 12 includes a wiring board main body 121, and the disjunctor encapsulation part 11 forms two through hole 1100, so that The disjunctor encapsulation part 11 respectively around the outside of each sensitive chip 30, and provide each camera lens 50 with it is corresponding The passage of light of the sensitive chip 30.Each sensitive chip 30 is arranged at the line of position corresponding to each through hole 1100 Road plate main body 121.
The disjunctor encapsulation part 11 includes a connector 114 and two outer ring bodies 115, and the connector 114 is molded integratedly It is connected between two outer ring body 115, and outer ring body described in two 115 is divided into adjacent two parts, forms two through hole 1100, sensitive chip 30 described in two is located at the both sides of the connector 114, so as to be suitable to be used to assemble the array shooting mould Group.It is noted that common portion of the connector 114 for camera lens 50 described in two, i.e., when the camera lens 50 is installed, respectively The camera lens 50 is each accounted for the corresponding part of the connector 114.
The circuit plate portion 12 includes a connection line (not shown) and an at least circuit element 122.The connection Circuit defaults in the wiring board main body 121, and the circuit element 122 is electrically connected to the connection line and the photosensitive core Piece 30, for the photosensitive course of work of the sensitive chip 30.The circuit element 122 can be, citing ground but be not limited to, electricity Resistance, electric capacity, diode, triode, potentiometer, relay, driver etc..
In this embodiment of the present utility model, each sensitive chip 30 of each correspondence of the circuit element 122, so as to In the work for coordinating each sensitive chip 30.
It is noted that the circuit element 122 can be coated on inside by the disjunctor encapsulation part 11, hence in so that The circuit element 122 will not be directly exposed in space, more specifically, be not exposed to be communicated with the sensitive chip 30 Enclosed environment in, different from the existing way of circuit element 122 in traditional camera module, such as capacitance resistance ware, so as to prevent Dust, debris stay in circuit element 122, pollute sensitive chip 30.In this embodiment, it is convex with the circuit element 122 Go out as a example by the wiring board main body 121 and illustrate, in the other embodiment of utility model, the circuit element 122 is buried Inside the wiring board main body 121, without protruding from the wiring board main body 121, those skilled in the art should manage Solution, the structure of the circuit element 122, type and set location are not limitation of the present utility model.
It is noted that the disjunctor encapsulation part 11 coats the circuit element 122 has the protection circuit element Advantage in terms of 122 advantage and corresponding camera module, it will be understood by those skilled in the art that the disjunctor Encapsulation part 11 is not limited to coat the circuit element 122.That is, in other embodiments of the present utility model, the company Body encapsulation part 11 can directly be molded into the wiring board of the circuit element 122 not protruded, or be molded into described The diverse locations such as outside, the surrounding of circuit element 122.
It is noted that in an embodiment of the present utility model, the disjunctor encapsulation part 11 is raisedly around institute The outside of sensitive chip 30 is stated, especially, the disjunctor encapsulation part 11 integratedly closes connection, makes it have good sealing, In when each camera lens 50 is installed in the disjunctor encapsulation part 11, each sensitive chip 30 is sealed in respectively Portion, forms space in each self-corresponding closing.
Reference picture 3 and Fig. 4, specifically, when the circuit board module 10 is manufactured, can be in a traditional wiring board conduct The wiring board main body 121, is molded on the surface of wiring board main body 121.Such as, in one embodiment, note can be used Molding machine, SMT techniques (Surface Mount Technology tables will be carried out by insert molding (insert molding) technique Face attachment process) after wiring board carry out integral packaging, such as molded packages, form the disjunctor encapsulation part 11, or by half The mould pressing process commonly used in conductor encapsulation forms the disjunctor encapsulation part 11.Further, each sensitive chip 30 is mounted on , then with the wiring board main body 121 be electrically connected each sensitive chip 30 by the wiring board main body 121, such as beat Gold thread is electrically connected.The wiring board main body 121 can be selected, citing ground but be not limited to, Rigid Flex, ceramic substrate are (no Band soft board), PCB hardboards (without soft board) etc..The mode that the disjunctor encapsulation part 11 is formed can be selected, and citing ground but not limited In Shooting Technique, mould pressing process etc..The material that the disjunctor encapsulation part 11 can be selected is, citing ground but is not limited to, and is molded work Skill can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, Polypropylene) etc., mould pressing process can use epoxy resin.Can be selected it will be apparent to a skilled person that foregoing Manufacture and the material that can be selected, are illustrative only the mode that can implement of the present utility model, are not this The limitation of utility model.
In other embodiment of the present utility model, the process for manufacturing the circuit board module 10 is also possible that first to institute Stating wiring board 121 carries out SMT techniques, and then each sensitive chip 30 is mounted on into the wiring board main body 121, and will be each The sensitive chip 30 is electrically connected with the wiring board main body 121, such as play gold thread electrical connection, then will be to the circuit Plate main body 121 carries out integral packaging, such as molded packages form the disjunctor encapsulation part 11 by way of insert molding, or The disjunctor encapsulation part 11 is formed by the mould pressing process commonly used in semiconductor packages.What those skilled in the art should be understood It is that the manufacturing sequence of the circuit board module 10 is not limitation of the present utility model.
It will also be appreciated that each camera lens 50 is installed in the disjunctor encapsulation part of the circuit board module 10 11 so that function of the disjunctor encapsulation part 11 equivalent to the support in traditional camera module, be the camera lens 50 provide support, Fixed position, but assembling is but different from tradition COB technical process.The support of the camera module of traditional COB techniques is pasting Mode is fixed on wiring board, and the disjunctor encapsulation part 11 by way of being molded into wiring board (Molding On Board, MOB) it is fixed on the wiring board main body 121, it is not necessary to paste fixation procedure, molding mode is fixed with more preferable relative to pasting Connective stability and technical process controllability, and between the disjunctor encapsulation part 11 and the wiring board main body 121 The glue space of AA adjustment need not be reserved, therefore reduces the headspace of traditional camera module AA adjustment so that array is taken the photograph As the thickness of module is reduced；On the other hand, the disjunctor encapsulation part 11 is coated on the circuit element 122 so that tradition Cradling function and circuit element 122 can spatially overlap, it is not necessary to as traditional camera module, in circuit devcie week Reserved safe distance is enclosed, so that the height of the disjunctor encapsulation part 11 with cradling function can be arranged on less model Enclose, so as to further provide the space that camera module thickness can reduce.Additionally, the disjunctor encapsulation part 11 replaces traditional Support, it is to avoid the heeling error that support brings when assembling is pasted, the accumulation for reducing the array camera module assembling is public Difference.
It will also be appreciated that the shape of the disjunctor encapsulation part 11 can more it needs to be determined that, such as in the circuit The position of element 122 extends internally, and forms a protuberance, so that increase the corresponding width of the disjunctor encapsulation part 11, and There is no the position of the circuit element 122, the disjunctor molded section 11 as one man extends, form the shape of comparison rule, and it is wide Degree is smaller.Those skilled in the art is it should be appreciated that the concrete shape of the disjunctor encapsulation part 11 is not new this practicality The limitation of type.
Further, the disjunctor encapsulation part 11 includes a cladding optical filter construction section 112 of section 111 and, the optical filter It is integrally connected to the cladding section 111, cladding section 111 molding is connected to the wiring board main body molding of construction section 112 121, for coating the circuit element 122.The optical filter construction section 112 is used to install two optical filters 40, the optical filter 40 may be implemented as but be not limited to cutoff filter (IRCF).
That is, when the circuit board module 10 be used to assemble the array camera module, the array shooting Each described optical filter 40 of module is installed in the optical filter construction section 112 so that the optical filter 40 is located at corresponding institute State on the photosensitive path of sensitive chip 30, and the extra mounting bracket of optical filter 40 need not be provided.That is, the disjunctor Encapsulation part 11 is pushed up in the function with conventional stent herein, but the advantage based on moulding technology, the optical filter construction section 112 Portion can make it have good planarization by the technology mode of mold so that the optical filter 40 entirely by Install, this point is also an advantage over traditional camera module.
Further, the optical filter construction section 112 forms two mounting grooves 1121, and each mounting groove 1121 is respectively communicated with It is that the optical filter 40 provides sufficient installing space so that the optical filter 40 will not be convex in the corresponding through hole 1100 For the top surface of optical filter construction section 112.That is, the upper end of disjunctor encapsulation part 11 sets mounting groove described in two 1121, so that each disjunctor encapsulation part 11 that is installed on by the stabilization of the optical filter 40, and the disjunctor envelope will not be protruded from The top in dress portion 11.
It is noted that in this embodiment of the present utility model, the mounting groove 1121 can be used for installing institute Optical filter 40 is stated, and in other implementations of the present utility model, the mounting groove 1121 can be used to install the array shooting The parts such as the motor or camera lens of module, those skilled in the art it should be appreciated that the purposes of the mounting groove 1121 not It is limitation of the present utility model.
According to this embodiment of the present utility model, the sensitive chip 30 is connected to described by an at least connecting line 31 Wiring board main body 121, and it is electrically connected to the connection line.The lead may be implemented as, citing ground but be not limited to, gold Line, copper cash, aluminum steel, silver wire.Especially, the connecting line 31 of the sensitive chip 30 can be connected by traditional COB modes It is connected to the wiring board main body 121, citing ground but is not limited to, the mode of welding.That is, the sensitive chip 30 with it is described The connection of wiring board main body 121 can make full use of existing ripe interconnection technique, to reduce the cost of improved technology, to traditional Technique and equipment are made full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art is it is to be understood that institute State sensitive chip 30 and the wiring board main body 121 connection can also by other it is any can realize it is of the present utility model The connected mode of utility model purpose realizes that the utility model is unrestricted in this regard.
It is noted that in this embodiment of the present utility model, each sensitive chip 30 is arranged at described The upper surface of wiring board main body 121, the disjunctor encapsulation part 11 is manufacturing the line around the outside of the sensitive chip 30 During the board component 10 of road, different manufacturing sequences can be selected, citing ground but be not limited to, in one embodiment, can first in institute State and sensitive chip 30 described in two is installed in wiring board main body 121, then in the outside of each sensitive chip 30, the wiring board master Molding forms the disjunctor encapsulation part 11 on body 121, and will protrude above the circuit element of the wiring board main body 121 122 are coated on inside it.And in another embodiment of the present utility model, can first in the wiring board main body 121 Mold and form the disjunctor encapsulation part 11, and will protrude above the circuit element 122 of the wiring board main body 121 and be coated on Inside it, the sensitive chip 30 is then installed on the wiring board main body 121, is located at the disjunctor encapsulation part 11 Inner side.
In this embodiment of the present utility model, said by taking two array camera modules of the composition of camera lens 50 as an example It is bright, a kind of mode that the array camera module can be carried out, and be optical filter 40 described in two by the advantage of moulding technology Consistent installation environment is provided with camera lens described in two 50, so that the array camera module obtains more excellent optical property. In other embodiment of the present utility model, the array camera module can also include two or more camera module, correspondingly, The circuit board module 10 forms more than two through holes 1100, those skilled in the art it should be appreciated that the camera lens 50 quantity is not limitation of the present utility model.
Reference picture 6, in one of the present utility model preferably implementation method, each described camera lens 50 can include respectively One lens bracket 80, each described lens bracket 80 can be directly connected in the disjunctor envelope of the circuit board module 10 Dress portion 11.That is, in this embodiment, the camera lens 50 is tight shot component, i.e., the focal length of described camera lens 50 Cannot freely be adjusted, it will be appreciated by those skilled in the art that, the optical frames described by the utility model First 50 can be directly connected in the disjunctor encapsulation part 11, including the optical lens 50 be connected to by a housing it is described The situation of disjunctor.And in preferably implementation method of the present utility model, reference picture 2B, the array camera module includes one Motor 60, each described motor 60 is installed in the disjunctor encapsulation part 11, and the camera lens 50 can be drivingly coupled to described Motor 60, so that the motor 60 can drive the optics to be moved along the photosensitive path of the sensitive chip 30, to adjust The focal length of the camera lens 50.That is, in this embodiment, the camera lens 50 is zoom lens component, i.e., described mirror First 50 focal length can be adjusted, and such as user, can be by adjusting when using the twin-lens camera module filmed image The focal length of the whole camera lens 50 adjusts shooting effect.
It is noted that according to this preferred embodiment of the present utility model, the disjunctor encapsulation part 11 can be used to Each optical filter 40, each camera lens 50 or each motor 60, the function with conventional stent are installed in support, and are based on mould The advantage of modeling, the disjunctor encapsulation part 11 can control the planarization and uniformity of the disjunctor encapsulation part by mould, from And be that each described optical filter 40, each camera lens 50 and each motor 60 of the array camera module provides smooth and one The installation environment of cause, so as to be easier to ensure that the uniformity of each camera lens optical axis, this point is that traditional array camera module is not allowed It is readily accessible.
It will also be appreciated that the disjunctor encapsulation part 11 integratedly disjunctor is molded to wiring board main body 121, enhancing The structural strength of the wiring board main body, thus relatively conventional COB modes array camera module, battle array of the present utility model The wiring board main body 121 of row camera module can reach smaller thickness, and disclosure satisfy that each camera lens and each motor strength It is required that.On the other hand, the disjunctor encapsulation part 11 can cause that the distance between each described camera lens 50 reduces, therefore further subtract The horizontal length and width size of the small array camera module.
Further, according to this preferred embodiment of the present utility model, the circuit board module 10 includes at least two motors Attachment structure 13, is respectively used to connect two motors 60 of the array camera module.Each motor 60 has an at least motor Pin 61.Each motor attachment structure 13 includes an at least lead 131, and each lead 131 is used to electrically connect the motor 60 and the wiring board main body 121.Each lead 131 is electrically connected to wiring board main body 121.Further, each lead 131 It is electrically connected to the connection circuit of the wiring board main body 121.The lead 131 is arranged at the disjunctor encapsulation part 11, and Extend to the top of the disjunctor encapsulation part 11.The lead 131 includes a motor connection end 1311, is revealed in the disjunctor envelope The top in dress portion 11, the pin 61 for electrically connecting the motor 60.It is noted that the lead 131 can be Embedding manner is set when forming the disjunctor encapsulation part 11.In traditional connected mode, the part such as drive motor is all Wiring board is connected to by setting single wire, manufacturing process is relative complex, and in this molding of the present utility model The mode of the embedded lead 131 technical process such as traditional motor can be replaced weld, and it is more steady to cause that circuit is connected It is fixed.Especially, in implementing of the present utility model one, the lead 131 is a wire, is embedded in the disjunctor encapsulation part 11 It is internal.Citing ground, the motor pin 61 can be connected to the motor connection end 1311, also may be used by anisotropic conductive film The motor connection end 1311 is connected to by way of welding.
It is noted that the motor connection end 1311 of the burial place of the lead 131 and the lead 131 Can be arranged as required in the position of the disjunctor encapsulation part 11 display, such as, in an embodiment of the present utility model, institute Stating the motor connection end 1311 of lead 131 can be arranged at the periphery of the disjunctor encapsulation part 11, i.e., described disjunctor envelope The top surface in dress portion 11, the top surface of the optical filter construction section 112, and in another embodiment of the present utility model, it is described Motor connection end 1311 can be arranged at the interior of the disjunctor encapsulation part 11 and enclose, i.e., the installation of described disjunctor encapsulation part 11 The bottom surface of groove 1121, such that it is able to provide the motor 60 different installation sites.In other words, when the motor 60 needs to install During to disjunctor encapsulation part top, the motor connection end 1311 is arranged at disjunctor encapsulation part periphery top surface, works as institute When stating motor 60 and needing to be attached to the mounting groove 1121, the motor connection end 1311 is arranged at the disjunctor encapsulation part 11 Inside enclose, i.e., the described bottom surface of mounting groove 1121.
That is, when the circuit board module 10 is manufactured, can first mount each sensitive chip 30 to the line Road plate main body 121, then molds the disjunctor encapsulation part 11 in the wiring board main body 121 in the way of MOB, and in molding When the lead 131 can be set inside the disjunctor encapsulation part 11 with embedding manner, and cause that the lead 131 is electrically connected The wiring board main body 121 is connected to, and causes that the motor connection end 1311 of the lead 131 is shown in the disjunctor encapsulation The top in portion, in order to be connected to the motor pin 61 of the motor 60.Citing ground, the circuit board module 10 by with When the shooting molding is assembled, each described pin 41 of the motor 60 is connected to the lead 131 by way of welding The motor connection end 1311 so that the motor 60 is electrically connected to the wiring board main body 121, and need to set single Only wire connects the motor 60 and the wiring board main body 121, and causes the motor pin 61 of the motor 60 Length can reduce.
Reference picture 5A is an equivalent reality of the motor attachment structure according to above preferred embodiment of the present utility model Apply example.Each motor attachment structure 13 includes a pin groove 133, and the pin groove 133 is used to accommodate the array shooting mould The motor pin 61 of the motor 60 of group.The pin groove 133 is arranged at the upper end of disjunctor encapsulation part 11.It is described Motor attachment structure 13 includes that at least each lead 134 of a lead 134 is used to electrically connect the motor 60 and the wiring board Main body 121.The lead 134 is arranged at the disjunctor encapsulation part 11, and extends upwardly to the disjunctor encapsulation part 11 The groove bottom wall of the pin groove 133.The lead 134 includes a motor connection end 1341, is revealed in the disjunctor encapsulation part 11 The pin groove 133 groove bottom wall, the motor pin 61 for electrically connecting the motor 60.Especially, a kind of real Apply in mode, the motor connection end 1341 may be implemented as a pad.The lead 134 may be implemented as a wire, It is embedded in inside the disjunctor encapsulation part 11.
That is, when the circuit board module 10 is manufactured, the sensitive chip 30 is first mounted, then in the circuit In plate main body 121, mold the disjunctor encapsulation part 11 in the way of MOB, and default predetermined length the pin groove 133, And the lead 134 can be set with embedding manner in molding, and cause that the lead 134 is electrically connected to the wiring board master Body 121, and cause that the motor connection end 1341 of the lead 134 is shown in the pin groove of the disjunctor encapsulation part 11 133 groove bottom wall, in order to be connected to the pin 41 of the motor 60.Citing ground, the circuit board module 10 by with When the shooting molding is assembled, each described motor pin 61 of the motor 60 inserts the pin groove 133, and by welding Mode be connected to the motor connection end 1341 of the lead 134 so that the motor 60 is electrically connected to the line Road plate main body 121, and need to set single wire and connect the motor 60 and the wiring board main body 121, and cause institute The motor pin 61 for stating motor 60 can be connected stably, prevent from outside unwanted touching the motor pin 61. Especially, the lead 134 may be implemented as a wire, be embedded in inside the disjunctor encapsulation part 11.
Reference picture 5B, is another equivalence enforcement of the motor attachment structure according to above preferred embodiment of the present utility model Example.Each motor attachment structure 13 includes a pin groove 135, and the pin groove 135 is used to accommodate the array camera module The motor 60 the motor pin 61.The pin groove 135 is arranged at the disjunctor encapsulation part 11.The motor connects Binding structure 13 includes an at least circuit junction 132, and the circuit junction 132 defaults in the wiring board main body 121, and is electrically connected It is connected to the connection line in the wiring board main body 121.Further, each pin groove 135 is encapsulated by the disjunctor The top in portion 11 extends to the wiring board main body 121, and causes that the circuit junction 132 shows.In a kind of embodiment side In formula, the motor pin 61 is adapted for insertion into the pin groove 135, and can be welded to connect with the circuit junction 132.
That is, when the circuit board module 10 is manufactured, each circuit is preset in the wiring board main body 121 Contact 132, and then the sensitive chip 30 is mounted, then in the wiring board main body 121, molded in the way of MOB described Disjunctor encapsulation part 11, and the pin groove 135 of predetermined length is preset, and cause that the circuit junction 132 is drawn by described Pin groove 135 shows, in order to be connected to the motor pin 61 of the motor 60.Citing ground, in the circuit board module 10 When be used to assemble the shooting molding, each described motor pin 61 of the motor 60 inserts the pin groove 135, and passes through The mode of welding is connected to the circuit junction 132 in wiring board main body 121, so that the motor 60 is electrically connected to institute Wiring board main body 121 is stated, and allows that the motor pin 61 of the motor 60 is stably connected, prevent outside not needing Touch the motor pin 61.
Reference picture 5C, is according to the above-mentioned another equivalence enforcement for being preferable to carry out inner motor attachment structure of the present utility model Example.The motor attachment structure 13 includes an engraving circuit 136, and the engraving circuit 136 is used to electrically connect the wiring board master The parts such as the connection line, the sensitive chip 30 and motor on body 121.Citing ground but be not limited to, the engraved lines Road 136 can be set by way of laser formation (LDS) when the disjunctor encapsulation part 11 is formed.In traditional connected mode In, the part such as drive motor is all to be connected to wiring board by setting single wire, and manufacturing process is relative complex, and The mode of the engraving circuit 136 technique such as traditional motor can be replaced to weld is set in this molding of the present utility model Process, and cause that circuit connection is more stablized.More specifically, the forming process of the engraving circuit 136 can be, present institute State disjunctor encapsulation part 11 and engraving groove is set, circuit then is set in the way of electroplating in the engraving groove.
In one embodiment of the present utility model, the motor 60 of the array camera module is connected to the company The mode of body encapsulation is illustrated by taking the connected mode of the motor attachment structure 13 as an example, as described using the lead 131 Mode, and in other embodiment of the present utility model, the connected mode of the motor 60 can also be with Fig. 5 A, 5B and 5C Corresponding connected mode is combined, as described in pin groove 133 and lead 134, as described in pin groove 135 and the circuit connect Point 132.And in an embodiment of the present utility model, reference picture 2A, the motor 60 can be connected to by traditional mode The circuit board module 10, such as by way of welding.Those skilled in the art is it should be appreciated that the He of the motor 60 The connected mode of the circuit board module 10 is not the utility model limitation.
As shown in fig. 7, being the array camera module and its wiring board according to second preferred embodiment of the present utility model Component 10.It is not both with above preferred embodiment, the circuit board module 10 includes a wiring board main body 121A.The wiring board Main body 121A includes two inner groovy 1211A, and each sensitive chip 30 is arranged in the corresponding inner groovy 1211A.No Circuit board module 10 in above-described embodiment is same as, the sensitive chip 30 is set in the inner groovy 1211A, and will be described photosensitive Chip 30 is accommodated therein so that the sensitive chip 30 will not substantially protrude from the upper surface of the wiring board main body 121A, So that the height reduction of the relatively described disjunctor encapsulation part 11 of the sensitive chip 30, so as to reduce described in the sensitive chip 30 pairs The height limitation of disjunctor encapsulation part 11, there is provided further reduce the possibility of height.
Further, the sensitive chip 30 is connected to the wiring board main body 121 by the connecting line 31, and is electrically connected It is connected to the connection line.The lead may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Also It is to say, the sensitive chip 30 and the connecting line 31 are all located in the inner groovy 1211A of the wiring board main body 121A. In one embodiment, when the circuit board module 10 is manufactured, it is necessary to first be set on the wiring board main body 121A in described Groove 1211A.That is, opening the inner groovy 1211A on traditional wiring board, it is adapted to accommodate and installs described photosensitive Chip 30.
Fig. 8 is according to the 3rd array camera module of preferred embodiment of the present utility model and its cuing open for circuit board module Diagram.
Different from above preferred embodiment, the circuit board module 10 includes a wiring board main body 121B, the line Road plate main body 121B has two path 1212B, and the bottom of each path 1212B is suitable to install the sensitive chip 30.Each institute Path 1212B is stated so that the upper and lower both sides of wiring board main body 121B are connected, so that when the sensitive chip 30 is by the line The back side of road plate main body 121B and when photosensitive area is installed on the wiring board main body 121B upward, the sensitive chip 30 Photosensitive area can receive the light entered by the camera lens 50.
Further, there are the wiring board main body two external groove 1213B, each external groove 1213B to be communicated in correspondence The path 1212B, there is provided the installation site of the sensitive chip 30.Especially, when the sensitive chip 30 is installed in During the external groove 1213B, the outer surface of the sensitive chip 30 is consistent with the surface of the wiring board main body 121B, positioned at same One plane, so as to ensure the profile pattern of the circuit board module 10.
In this embodiment of the present utility model, the path 1212B is in step-like, consequently facilitating installing described photosensitive Chip 30, is that the sensitive chip 30 provides the installation site of stabilization, and its photosensitive area is represented in interior space.
It is noted that in this embodiment of the present utility model, there is provided a kind of to be installed different from traditional chip Mode, i.e. flip-chip mode (Flip Chip, FC).By the sensitive chip 30 from the back side of the wiring board main body 121B Direction is installed on the wiring board main body 121B, rather than as being needed in above-described embodiment from the wiring board main body 121B just Face, i.e. from the top of the wiring board main body 121B, and the photosensitive area of the sensitive chip 30 is installed on the circuit upward Plate main body 121B.Such structure and mounting means so that the sensitive chip 30 and the disjunctor encapsulation part 11 are relatively only Vertical, the installation of the sensitive chip 30 will not be influenceed by the disjunctor encapsulation part 11, the molding of the disjunctor encapsulation part 11 The influence being molded to the sensitive chip 30 is also smaller.Additionally, the sensitive chip 30 is embedded in the wiring board main body 121B's Lateral surface, and the medial surface of the wiring board main body 121B will not be protruded from, so that wiring board main body 121B inner sides Reserve bigger space so that the height of the disjunctor encapsulation part 11 will not be subject to the height limitation of the sensitive chip 30, make Obtaining the disjunctor encapsulation part 11 can reach smaller height.
It is noted that in other embodiments of the present utility model, the filter is installed in the upper end of the path 1212B Mating plate 40, that is to say, that, it is not necessary to the optical filter 40 is installed on the disjunctor encapsulation part 11, so as to reduce the array take the photograph As the back focal length of module, reduce the height of the shooting.Especially, the optical filter 40 can be carried out example for IR-cut is filtered Mating plate IRCF.
Fig. 9 is the array camera module and its circuit board module 10 according to the 4th preferred embodiment of the present utility model Cut-away view.
The circuit board module 10 includes a back-up coat 123C, is connected to the wiring board back-up coat 123C laminations The bottom of main body 121, in order to strengthen the structural strength of the wiring board main body 121.That is, in the wiring board main body The region bottom at the disjunctor encapsulation part 11 and the place of the sensitive chip 30 mounts the back-up coat 123C on 121, so that So that the wiring board main body 121 reliablely and stablely supports the disjunctor encapsulation part 11 and the sensitive chip 30.
Further, the back-up coat 123C is a metallic plate, and the metallic plate is attached at the bottom of the wiring board main body 121 Layer, increases the structural strength of the wiring board main body 121, on the other hand, increases the heat dispersion of the circuit board module, can have The heat that the lost sensitive chip 30 of effect sends.
It is noted that the wiring board main body 121 can be using FPC (Flex Print Circuit, flexibility printing Circuit board), and by the rigidity of FPC described in the back-up coat 123C so that the FPC with excellent bending performance disclosure satisfy that institute State the bearing requirements of circuit board module.That is, the selectable range of the wiring board main body 121 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).By described Back-up coat 123B increases the structural strength of the wiring board main body 121 and improves heat dispersion, such that it is able to reduce the line The thickness of road plate main body 121 so that the height of the circuit board module further reduces, and the shooting mould obtained by its assembling The height of group reduces.
Figure 10 is the array camera module and its circuit board module according to the 5th preferred embodiment of the present utility model Cut-away view.
Different from above preferred embodiment, the wiring board main body 121D has an at least reinforced hole 1214D, described Disjunctor encapsulation part 11 is extended into the reinforced hole 1214D, so as to strengthen the structural strength of the wiring board main body 121D.
The position of the reinforced hole 1214D can select as needed, and according to the structural strength need of the wiring board Ask to set, such as in symmetrical structure.The knot of the wiring board main body 121D is caused by the setting of the reinforced hole 1214D Structure intensity enhancing, such that it is able to reduce the thickness of the wiring board main body 121D, reduces by the thickness of its camera module for assembling, And improve the heat dispersion of the circuit board module.
It is noted that the reinforced hole 1214D is groove-like, so that when manufacturing the circuit board module, the company The moulding material of body encapsulation part 11 will not be spilt by the reinforced hole 1214D.
Figure 11 is the array camera module and its circuit board module 10 according to the 6th preferred embodiment of the present utility model Cut-away view.
Different from above preferred embodiment, the wiring board main body 121E has an at least reinforced hole 1214E, described Disjunctor encapsulation part 11 is extended into the reinforced hole 1214E, so as to strengthen the structural strength of the wiring board main body 121E.
The position of the reinforced hole 1214E can select as needed, and according to the structural strength need of the wiring board Ask to set, such as in symmetrical structure.The knot of the wiring board main body 121E is caused by the setting of the reinforced hole 1214E Structure intensity enhancing, such that it is able to reduce the thickness of the wiring board main body 121E, reduces by the thickness of its camera module for assembling, And improve the heat dispersion of the circuit board module.
It is noted that the reinforced hole 1214E is perforation, that is to say, that through the wiring board main body 121E, So that the both sides connection of the wiring board main body 121E, so that when manufacturing the circuit board module, the disjunctor encapsulation part 11 Moulding material is fully combined with the wiring board main body 121E, forms more firm composite structure, and relatively described The structure of groove-like, the perforation is easier processing and manufacturing.
Figure 12 is the array camera module and its circuit board module according to the 7th preferred embodiment of the present utility model Cut-away view.
Different from above preferred embodiment, the disjunctor encapsulation part 11F includes a cladding section 111F, optical filter peace Dress section 112F and camera lens construction section a 113F, the optical filter construction section 112F and camera lens construction section 113F is successively integratedly Molding is connected to the cladding section 111F, and the cladding section 111F moldings are connected to the wiring board main body 121, for coating State circuit element 122 and the connecting line 31.The optical filter construction section 112F is used to install the optical filter 40, that is, Say, when the circuit board module be used to assemble the array camera module, the quilt of optical filter 40 of the array camera module It is installed on the optical filter construction section 112F so that the optical filter 40 is located on the photosensitive path of the sensitive chip 30, and The extra mounting bracket of optical filter 40 need not be provided.That is, the disjunctor encapsulation part 11F has conventional stent herein Function, but the advantage based on moulding technology, optical filter construction section 112F top can be by the technique side of mold Formula, makes it have good planarization, so that the optical filter 40 is entirely mounted, this point is also an advantage over traditional Camera module.The camera lens construction section 113F is used to install the camera lens 50, that is to say, that when the circuit board module is used for When assembling the array camera module, the camera lens 50 is installed in the camera lens construction section of the disjunctor encapsulation part 11F 113F inner sides, in order to provide the installation site of stabilization for the camera lens 50.
Further, there is the optical filter construction section 112F two mounting groove 1121F, the mounting groove 1121F to be communicated in The corresponding through hole 1100F, is that each optical filter 40 provides sufficient installing space so that each stabilization of the optical filter 40 Install.There are the camera lens construction section 113F two camera lens mounting groove 1131F, each camera lens mounting groove 1131F to be communicated in correspondence The through hole 1100F, respectively each camera lens 50 provide abundance installing space.
In other words, the optical filter construction section 112F and the camera lens construction section 113F are integratedly upwardly extended, and interior Portion forms step-like structure, and respectively described optical filter 40 and the camera lens 50 provide support fixed position, without carrying The optical filter 40 and the camera lens 50 are installed for extra part.
It is in respectively close ring that the camera lens construction section 113F has two camera lens inwall 1132F, each camera lens inwall 1132F Shape, is suitable to camera lens 50 and provides installing space.It is noted that each described camera lens inwall of the camera lens construction section 1132F 1132F surfacings, so as to be suitable to install the camera lens 50 of non-threaded, formation focuses module.Especially, the camera lens 50 can The camera lens construction section 113F is fixed on by way of bonding.
Reference picture 13, is the circuit board module and camera module according to the 9th preferred embodiment of the present utility model.No Above preferred embodiment is same as, the circuit board module 10 includes a screen layer 126, and the screen layer 126 wraps up described Wiring board main body 121 and the disjunctor encapsulation part 11, so that while the structural strength of the wiring board main body 121 is strengthened, Strengthen the anti-electromagnetic interference capability of the circuit board module 10.
Reference picture 14, according to the of the present utility model ten camera module and its circuit board module of preferred embodiment.No Above preferred embodiment is same as, the camera module includes an at least support 70, for installing each optical filter 40, each The camera lens 50 or each motor 60.According to this embodiment of the present utility model, the support 70 is installed in the company Body encapsulation part 11, each optical filter 40 is installed in the support 70, and each motor 60 is installed in the support 70.Institute The concrete shape for stating support 70 can be arranged as required to, such as set boss, in order to install each optical filter.Shown branch Frame 70 can be a disjunctor support, that is to say, that can with the multiple optical filters 40 of once mounting, or support unit, One optical filter 40 is namely installed.In this embodiment of the present utility model, the support 70 is preferably disjunctor branch Frame.Those skilled in the art is it should be appreciated that the concrete shape of the support 70 is not limitation of the present utility model.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as Illustrate and be not intended to limit the utility model.The purpose of this utility model completely and is effectively realized.Work(of the present utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, implementation method of the present utility model Can there are any deformation or modification.

Claims (24)

1. the circuit board module of pair camera module, it is characterised in that including：
Circuit plate portion, it is used to be electrically connected at two sensitive chips；With
Disjunctor encapsulation part, it is integrally packaged in the circuit plate portion, and forms two through hole, each described through hole with each described in Sensitive chip position is corresponding, passage of light is provided with to the corresponding sensitive chip, wherein the disjunctor encapsulation part is also pacified Equipped with support, the support is suitable to install optical filter.
2. the according to claim 1 pair of circuit board module of camera module, the support of two of which monomer is installed on described Disjunctor encapsulation part, to be respectively mounted two optical filters.
3. the according to claim 1 pair of circuit board module of camera module, the support of wherein disjunctor is installed on described Disjunctor encapsulation part, for installing two optical filters.
4., according to the circuit board module of any described double camera modules in claims 1 to 3, two of which motor is suitable to install In the support or the top of the disjunctor packaging body.
5., according to the circuit board module of any described double camera modules in claims 1 to 3, the circuit plate portion includes circuit Plate main body and the circuit element for being raised in the wiring board main body, the disjunctor encapsulation part coat the circuit element.
6. according to the circuit board module of any described double camera modules in claims 1 to 3, wherein the disjunctor encapsulation part bag Connector and two outer ring bodies are included, wherein the connector is connected integrally between two outer ring body, and by outside described two Ring body is divided into adjacent two parts, and to form two through holes, sensitive chip described in two is adapted to be arranged at the connection The both sides of body.
7. the according to claim 6 pair of circuit board module of camera module, wherein the wiring board portion includes wiring board master Body and the circuit element for being raised in the wiring board main body, the disjunctor encapsulation part coat the circuit element, a portion The circuit element is located at the position between two through holes, and circuit element described in this part is by the connector bag Cover.
8. according to the circuit board module of any described double camera modules in claims 1 to 3, wherein the wiring board main body has The reinforced hole of fluted shape or perforated, the disjunctor encapsulation part integrally extends into the reinforced hole.
9. according to the circuit board module of any described double camera modules in claims 1 to 3, wherein the wiring board main body is Rigid Flex, ceramic substrate, PCB hardboards or FPC plates.
10. according to the circuit board module of any described double camera modules in claims 1 to 3, wherein the disjunctor encapsulation part Formed in the circuit plate portion one molding, and its material is selected from the one kind in epoxy resin, nylon, LCP and PP.
11. pairs of camera modules, it is characterised in that including：
Two camera lenses；
Two sensitive chips；
Two optical filters；
Support, optical filter described in two is installed on the support and is located between the corresponding camera lens and the sensitive chip；
Circuit plate portion, it is electrically connected at sensitive chip described in two；With
Disjunctor encapsulation part, it is integrally packaged in the circuit plate portion, and forms two through hole, each described through hole with each described in Sensitive chip position is corresponding, and passage of light is provided with to the corresponding camera lens and the sensitive chip, and the support is installed In the disjunctor encapsulation part.
12. according to claim 11 pairs of camera modules, the support of two of which monomer is installed on the disjunctor encapsulation part, To be respectively mounted two optical filters.
The support of 13. according to claim 11 pairs of camera modules, wherein disjunctor is installed on the disjunctor encapsulation part, To install two optical filters.
14. according to any described double camera modules in claim 11 to 13, wherein the wiring board portion includes wiring board master Body and the circuit element for being raised in the wiring board main body, the disjunctor encapsulation part coat the circuit element.
15. according to claim 14 pairs of camera modules, wherein the wiring board main body has groove-like or perforated Reinforced hole, the disjunctor encapsulation part integrally extends into the reinforced hole.
16. according to claim 14 pairs of camera modules, wherein the wiring board main body is Rigid Flex, ceramic base Plate, PCB hardboards or FPC plates.
17. according to any described double camera modules in claim 11 to 13, wherein the disjunctor encapsulation part includes connector With two outer ring bodies, wherein the connector is connected integrally between two outer ring body, and two outer ring body is separated It is adjacent two parts, to form two through holes, sensitive chip described in two is arranged at the both sides of the connector.
18. according to claim 14 pairs of camera modules, the disjunctor encapsulation part includes connector and two outer ring bodies, wherein The connector is connected integrally between two outer ring body, and two outer ring body is divided into adjacent two parts, To form two through holes, sensitive chip described in two is arranged at the both sides of the connector, circuit described in a portion Element is located at the position between two through holes, and circuit element is coated by the connector described in this part.
19. according to any described double camera modules in claim 11 to 13, wherein disjunctor encapsulation part one molding ground The circuit plate portion is formed at, and its material is selected from the one kind in epoxy resin, nylon, LCP and PP.
20. according to any described double camera modules in claim 11 to 13, wherein described pair of camera module is to focus shooting Module.
21. according to any described double camera modules in claim 11 to 13, wherein described pair of camera module is burnt shooting Module, it also includes two motors, and wherein each described camera lens is installed on the corresponding motor, and the motor is installed on the branch Frame.
22. according to any described double camera modules in claim 11 to 13, wherein described pair of camera module is burnt shooting Module, it also includes two motors, and wherein each described camera lens is installed on the corresponding motor, and the motor is installed on the company The top of body encapsulation part.
23. electronic equipments, it is characterised in that it is included according to any described double camera modules in claim 11-22.
24. electronic equipments according to claim 23, wherein the electronic equipment is mobile phone or panel computer equipment.
CN201620823927.XU 2016-03-15 2016-03-15 Array camera module and double camera modules and its circuit board module and electronic equipment Active CN206272705U (en)

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CN201620200264.6U CN205430411U (en) 2016-03-15 2016-03-15 Array module of making a video recording and wiring board assembly thereof
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CN201620814827.0U Active CN206294240U (en) 2016-03-15 2016-03-15 Array camera module and double camera modules and its circuit board module and electronic equipment
CN201620200264.6U Withdrawn - After Issue CN205430411U (en) 2016-02-18 2016-03-15 Array module of making a video recording and wiring board assembly thereof
CN201620814843.XU Active CN206294241U (en) 2016-03-15 2016-03-15 Array camera module and double camera modules and its circuit board module and electronic equipment
CN201620823928.4U Active CN206272706U (en) 2016-03-15 2016-03-15 Array camera module and double camera modules and its circuit board module and electronic equipment
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110892702A (en) * 2017-07-21 2020-03-17 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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US10197890B2 (en) * 2016-02-18 2019-02-05 Ningbo Sunny Opotech Co., Ltd. Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
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US10750071B2 (en) 2016-03-12 2020-08-18 Ningbo Sunny Opotech Co., Ltd. Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
KR102152517B1 (en) * 2016-04-21 2020-09-07 닝보 써니 오포테크 코., 엘티디. Camera module and array camera module based on integrated packaging process
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TWM561915U (en) * 2016-10-14 2018-06-11 Ningbo Sunny Opotech Co Ltd Photographing module and array photographing module based upon integrally packaging technique
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CN108243296A (en) * 2016-12-23 2018-07-03 宁波舜宇光电信息有限公司 Circuit board assemblies and camera module and its manufacturing method and the electronic equipment with camera module
CN108886566B (en) 2016-12-27 2021-10-22 华为技术有限公司 Camera substrate assembly, camera module and terminal equipment
JP6976688B2 (en) * 2017-01-26 2021-12-08 ソニーセミコンダクタソリューションズ株式会社 Camera modules and their manufacturing methods, as well as electronic devices
CN107561667B (en) * 2017-09-28 2020-05-22 歌尔股份有限公司 Method for assembling lens base of common-substrate dual-camera module
CN207665056U (en) * 2017-10-18 2018-07-27 宁波舜宇光电信息有限公司 Photosensory assembly array for camera module array and corresponding camera module array
CN109698894B (en) * 2017-10-20 2023-06-30 宁波舜宇光电信息有限公司 Photosensitive assembly and camera module based on metal support
CN107948495B (en) * 2018-01-12 2020-11-20 信利光电股份有限公司 Subregion formation of image sensitization chip and module, camera device of making a video recording
CN109361834A (en) * 2018-10-15 2019-02-19 信利光电股份有限公司 Camera module structure
CN109361877B (en) * 2018-12-25 2020-11-27 信利光电股份有限公司 Multi-camera module assembly and method
CN113281874A (en) * 2021-06-30 2021-08-20 成都易迅光电科技有限公司 Telescopic multi-lens module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110892702A (en) * 2017-07-21 2020-03-17 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment

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CN206294241U (en) 2017-06-30
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CN205430411U (en) 2016-08-03
CN206272704U (en) 2017-06-20

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