CN206212112U - Array camera module and its photosensory assembly - Google Patents

Array camera module and its photosensory assembly Download PDF

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Publication number
CN206212112U
CN206212112U CN201620201261.4U CN201620201261U CN206212112U CN 206212112 U CN206212112 U CN 206212112U CN 201620201261 U CN201620201261 U CN 201620201261U CN 206212112 U CN206212112 U CN 206212112U
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CN
China
Prior art keywords
encapsulation part
wiring board
main body
camera module
disjunctor encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620201261.4U
Other languages
Chinese (zh)
Inventor
王明珠
赵波杰
田中武彦
陈飞帆
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201720663471.XU priority Critical patent/CN207491066U/en
Priority to CN201720661019.XU priority patent/CN207530910U/en
Priority to CN201720663838.8U priority patent/CN207491068U/en
Priority to CN201720663335.0U priority patent/CN207530911U/en
Priority to CN201720663612.8U priority patent/CN207491067U/en
Priority to CN201620201261.4U priority patent/CN206212112U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to US15/317,117 priority patent/US10908324B2/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to EP16894174.8A priority patent/EP3429181A4/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW106203625U priority patent/TWM556869U/en
Priority to TW106108561A priority patent/TWI648586B/en
Priority to TW107147598A priority patent/TWI701493B/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to US15/473,607 priority patent/US9826132B2/en
Publication of CN206212112U publication Critical patent/CN206212112U/en
Application granted granted Critical
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

An array camera module and its photosensory assembly, wherein the photosensory assembly of the array camera module, it includes：One disjunctor encapsulation part and a photographic department；The photographic department includes a wiring board main body and at least two sensitive chips, wiring board main body described in the disjunctor encapsulation part integral packaging and each sensitive chip, meets user for the multi-functional application demand of mobile electronic device.

Description

Array camera module and its photosensory assembly
Technical field
The utility model is related to camera module field, further, is related to an array camera module and its photosensory assembly.
Background technology
At present, all increasingly integrated more functions of most electronic product, this trend causes that gas producing formation transboundary goes out Not poor, such as mobile phone forms collection communication, shooting, online, a navigation etc. after being highly integrated via initial communication equipment Variation, three-dimensional function are integrated arrival mobile electronic device.
However, the camera module for being configured in mobile electronic device at present is mostly single-lens camera module, this single mirror Head camera module is either that all cannot meet user in the quality of image or effect to be set for mobile electron in shooting Standby multi-functional application demand.
Occur and ever more popular has been have more than a camera module for camera lens, for example twin-lens shooting mould Group, twin-lens camera module provides the style of shooting of apish eyes structure, and this twin-lens camera module is in 3D Shoot and scanning, hand gesture location identification, color fidelity, rapid focus, panorama all many-sides such as shooting, background blurring shooting deeply The performance more more excellent than single-lens camera module is suffered from, therefore, the camera module for having more than a camera lens is to image from now on The important directions of the development of module industry.During using twin-lens camera module filmed image, twin-lens camera module Image is obtained from two positions respectively using two imaging modules with differences in spatial location, then according to image combining method After the Image compounding shot respectively to two imaging modules, the final image of many camera lens camera modules is obtained.May be appreciated It is, in this process, the one of the image effect such as resolving power, shading, color of each imaging modules of many camera lens camera modules Cause property, and in level, vertically, longitudinally three deviations in direction, be the weight of the image quality for weighing twin-lens camera module Want index.
However, the structure of current stage manufacture, the technique of assembling twin-lens camera module and twin-lens camera module is all remote The image quality of twin-lens camera module cannot far be ensured.Fig. 1 shows the twin-lens camera module of prior art, and it includes one Wiring board 10P, two microscope base 20P and two image-forming module 30P, each described image-forming module 30P include a motor camera lens respectively Component 31P.Each microscope base 20P is individually located in the homonymy of the wiring board 10P, and each described microscope base 20P passes through The wiring board 10P is linked together, and each described motor lens assembly 31P is separately positioned on each described microscope base 20P, with Supported by microscope base 20P each described.It is understood that the packaging technology from the twin-lens camera module of prior art comes See, each described microscope base 20P is individually mounted on the wiring board 10P, thus can cause each described microscope base 20P it Between the more difficult to govern control such as size, position so that so that size, position between each described twin-lens camera module support etc. The uniformity of parameter is poor.From the point of view of the structure of the twin-lens camera module of prior art, each described microscope base 20P difference It is independent, and each described microscope base 20P is only attached by the wiring board 10P, because the wiring board 10P is generally selected PCB so that wiring board 10P itself is more soft and easily deformable, at this moment, the twin-lens camera module Overall rigidity is difficult to ensure that, during the use that the twin-lens camera module is assembled after completing, such knot Structure is easily caused each element of the image-forming module 30P, such as the relative size between described motor lens assembly 31P is unstable Fixed, position of related features is big, and the generation of the optical axis of each image-forming module 30P the problems such as easily deviate default position, one Any one appearance in denier these situations, can all give the image quality of the twin-lens camera module, such as Image compounding etc. Final imaging effect brings uncontrollable factor or larger adverse effect.
Additionally, the assembling of many camera lens camera modules is based on traditional COB (Chip On Board chip packages) technique, Generally there is the circuit devcie 11P of protrusion on the wiring board 10P, and a sensitive chip 12P, institute are installed on the wiring board State sensitive chip 12P and the wiring board 10P is generally connected to by gold thread 121P, and the gold thread 121P is generally curved convex Go out with the wiring board main body, therefore, these protrusion the circuit devcie 11P and the gold thread 121P for camera module Assembling also brings some unfavorable factors.
The circuit devcie 11P and the gold thread 21P are directly exposed to the surface of the wiring board 10P, therefore rear During continuous assembling, such as paste the microscope base 20P, weld the processes such as the motor lens assembly 31P, inevitably It is affected, solder resist, dust during welding etc. is easily attached to the circuit devcie 11P, and the circuit devcie 11P and institute Sensitive chip 12P is stated to be located in an interconnected space, therefore dust pollutant is easy to influence the sensitive chip 12P, such influence is likely to result in the camera module after assembling and there is the bad phenomenons such as dirty stain, reduces product yield.
Secondly, the microscope base 20P is located at the outside of the circuit devcie 11P, therefore is installing the microscope base 20P and described , it is necessary to reserve certain safe distance between the microscope base 20P and the circuit devcie 11P during wiring board 10P, and in level Direction and upwardly direction are required for reserved safe distance, and this increases the demand of camera module thickness to a certain extent Amount, makes its thickness be difficult to reduce.
Additionally, the molding of single camera relative for the molding of multi-cam, is related to the coordination between multiple camera modules Problem, requires that optical axis is consistent between multiple camera lenses, and the uniformity for being based on multiple camera lens optical axis of traditional COB techniques is rareer To guarantee.And multi-cam module overall volume is larger, the intensity and flatness to wiring board are more sensitive, therefore wiring board Thickness is larger.
Utility model content
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein photosensory assembly bag A disjunctor encapsulation part and a photographic department are included, the photographic department includes a wiring board main body and a sensitive chip, the sensitive chip The wiring board main body is connected to by the disjunctor encapsulation part integral packaging.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the photosensitive core Piece is electrically connected to the wiring board main body by an at least connecting line, and the disjunctor encapsulation part coats the connecting line.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly and its manufacture method, its Described in sensitive chip there is a photosensitive area and a non-photo-sensing area, the disjunctor encapsulation part extends to the non-photo-sensing area, with to The mouldable region of the interior extension disjunctor encapsulation part, and reduce the outward flange of the photosensory assembly.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein described photosensitive group Part includes a wiring board main body and an at least circuit element, and the circuit element protrudes from the wiring board main body, the circuit Element is coated by the disjunctor encapsulation part, so as to outside will not be directly exposed to.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the disjunctor is sealed Dress portion includes an optical filter construction section, is suitable to install multiple optical filters, without extra independent support member.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the wiring board Main body has multiple inner groovies, and each sensitive chip is arranged in the inner groovy, in order to reduce the sensitive chip With the relative altitude of the wiring board main body, so as to reduce the requirement for height to the disjunctor encapsulation part.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the wiring board Main body has multiple paths and multiple external grooves, and the external groove is communicated in the path, and the external groove is pacified with being suitable to upside-down mounting Fill the sensitive chip.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the wiring board Portion includes a back-up coat, the wiring board bottom part body is arranged at, to strengthen the structural strength of the wiring board main body lamination And heat dispersion.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein described state circuit Plate main body has an at least reinforced hole, and the disjunctor encapsulation part extends into the reinforced hole, so as to strengthen the line plate main body Structural strength.
A purpose of the present utility model is to provide an array camera module and its photosensory assembly, wherein the disjunctor is sealed Dress portion includes a camera lens construction section, is suitable to install multiple camera lenses, so that for the camera lens provides installation site.
In order to realize above utility model purpose, one side of the present utility model provides photosensitive group of an array camera module Part, it includes a disjunctor encapsulation part and a photographic department；The photographic department includes a wiring board main body and at least two sensitive chips, institute State disjunctor encapsulation part and be molded to the wiring board main body and each sensitive chip.
According to another embodiment of the present utility model, disjunctor encapsulation part described in described photosensory assembly forms at least two and leads to Hole, each through hole is relative with each sensitive chip, to provide the sensitive chip passage of light.
According to another embodiment of the present utility model, each described through hole of disjunctor encapsulation part described in described photosensory assembly Bottom be in gradually increase from the bottom to top it is skewed, to increase the light ray flux of the sensitive chip.
According to another embodiment of the present utility model, disjunctor encapsulation part top described in described photosensory assembly is in plane Shape, for installing support, camera lens, motor or the optical filter of the array camera module.
According to another embodiment of the present utility model, disjunctor encapsulation part top described in described photosensory assembly has at least Two mounting grooves, each mounting groove is communicated in the corresponding through hole, for install the array camera module optical filter, Camera lens or motor.
According to another embodiment of the present utility model, disjunctor encapsulation part described in described photosensory assembly includes a cladding Section, an optical filter construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively by the bag Cover section and mold extension upwards, and it is internal in step-like, in order to install the optical filter and camera lens of the array camera module.
According to another embodiment of the present utility model, disjunctor encapsulation part described in described photosensory assembly is with least two peaces Tankage, is respectively communicated with the corresponding through hole, two step-like optical filter construction sections is formed, in order to be respectively mounted an optical filtering Piece, the disjunctor encapsulation part has at least two camera lens mounting grooves, two step-like camera lens construction sections is formed, in order to be respectively mounted One camera lens of the array camera module.
According to another embodiment of the present utility model, camera lens construction section described in described photosensory assembly has at least two mirrors Head inwall, the camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
According to another embodiment of the present utility model, photographic department described in described photosensory assembly includes at least one connection Line, each connecting line the electrical connection sensitive chip and the wiring board main body, the disjunctor encapsulation part coats the connection Line, to cause that the connecting line will not be directly exposed to outside.
According to another embodiment of the present utility model, connecting line described in described photosensory assembly is selected from combination：Gold thread, silver One kind in line, copper cash or aluminum steel.
According to another embodiment of the present utility model, connecting line described in described photosensory assembly curvedly connects described Wiring board main body and the sensitive chip, to reduce the damage to the connecting line.
According to another embodiment of the present utility model, each sensitive chip includes a photosensitive area in described photosensory assembly With a non-photo-sensing area, the non-photo-sensing area extends to the sense around photosensitive area periphery, the disjunctor encapsulation part molding The non-photo-sensing area of optical chip, the mouldable scope inside to extend the disjunctor encapsulation part reduces the disjunctor encapsulation part Outside Dimensions.
According to another embodiment of the present utility model, photographic department described in described photosensory assembly includes an at least circuit elements Part, the circuit element protrudes from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, described to cause Circuit element will not be directly exposed to outside.
According to another embodiment of the present utility model, the selection combination of circuit element described in described photosensory assembly：Resistance, One or more of which in electric capacity, diode, triode, potentiometer, relay and relay.
According to another embodiment of the present utility model, photographic department described in described photosensory assembly filters including at least two Piece, the optical filter is covered in the sensitive chip, and the disjunctor encapsulation part takes shape in the wiring board main body, the photosensitive core Piece and the optical filter, protect the sensitive chip, and reduce the array camera module in order to pass through the optical filter Back focal length, reduces its height.
According to another embodiment of the present utility model, photographic department described in described photosensory assembly includes a back-up coat, institute State reinforcing layer laminate and be arranged at the wiring board bottom part body, to strengthen the structural strength of the wiring board main body.
According to another embodiment of the present utility model, back-up coat described in described photosensory assembly is metallic plate, to strengthen The heat dispersion of the photographic department.
According to another embodiment of the present utility model, photographic department described in described photosensory assembly includes a screen layer, institute Screen layer parcel the wiring board main body and the disjunctor encapsulation part are stated, to strengthen the electromagnetism interference of the photosensory assembly Energy.
According to another embodiment of the present utility model, screen layer described in described photosensory assembly is metallic plate or metal Net.
According to another embodiment of the present utility model, wiring board main body is reinforced with least one in described photosensory assembly Hole, the disjunctor encapsulation part extends into the reinforced hole, in order to strengthen the structural strength of the wiring board main body.
According to another embodiment of the present utility model, reinforced hole described in described photosensory assembly is groove-like.
According to another embodiment of the present utility model, reinforced hole described in described photosensory assembly is through hole, to cause institute The moulding material and the wiring board main body for stating disjunctor encapsulation part are fully contacted, and easily fabricated.
According to another embodiment of the present utility model, the material of wiring board main body can be selected described in described photosensory assembly From combination：Rigid Flex, ceramic substrate, PCB hardboards or FPC.
According to another embodiment of the present utility model, the material of disjunctor encapsulation part described in described photosensory assembly is selected from group Close：One or more in nylon, LCP, PP or resin.
According to another embodiment of the present utility model, photosensory assembly described in described photosensory assembly includes at least two motors Attachment structure, the motor attachment structure includes an at least lead, and the lead is arranged at the disjunctor encapsulation part, and electrical connection In the wiring board main body, the lead includes a motor connection end, the disjunctor encapsulation part is revealed in, in order to connect a horse Up to pin.
According to another embodiment of the present utility model, photosensory assembly described in described photosensory assembly includes at least two motors Attachment structure, the motor attachment structure includes an at least lead and an at least pin groove, and the lead is arranged at the company Body encapsulation part, and the wiring board main body is electrically connected to, the pin groove is arranged at the disjunctor encapsulation part upper end, described Lead includes a motor connection end, and the motor connects end line in the groove bottom wall, institute is plugged in order to a motor pin The motor connection end is electrically connected to when stating pin groove.
According to another embodiment of the present utility model, photosensory assembly described in described photosensory assembly includes at least two motors Attachment structure, the motor attachment structure includes at least a pin groove and at least a circuit junction, the circuit junction electrical connection In the wiring board main body, the pin groove is arranged at the disjunctor encapsulation part, is extended to by the wiring board main body described The top of disjunctor encapsulation part, and the circuit junction is revealed in the pin groove, and described drawing is plugged in order to a motor pin The circuit junction is electrically connected to during pin groove.
According to another embodiment of the present utility model, photosensory assembly described in described photosensory assembly includes at least two motors Attachment structure, the motor attachment structure includes at least one engraving circuit, and the engraving circuit is arranged at the disjunctor encapsulation part, The wiring board main body is electrically connected to, in order to electrically connect a motor pin.
Circuit is carved according to another embodiment of the present utility model, described in described photosensory assembly with the side of electronics carving Formula is arranged at the disjunctor encapsulation part.
Another aspect of the present utility model provides an array camera module, and it includes the photosensory assembly and at least two described in one Camera lens；The camera lens is located at the photosensitive path of the sensitive chip of the photosensory assembly.
Array camera module includes an at least support according to another embodiment of the present utility model, and the support is pacified Loaded on the photosensory assembly, the array camera module includes at least two optical filters, and each optical filter is installed in the branch Frame.
According to another embodiment of the present utility model, the array camera module includes at least two motors, each camera lens The corresponding motor is installed in, each motor is installed in the photosensory assembly.
According to another embodiment of the present utility model, the array camera module includes at least two optical filters, each filter Mating plate is installed in the photosensory assembly.
According to another embodiment of the present utility model, the array camera module includes at least two optical filters, each filter Mating plate is by integral packaging in the corresponding sensitive chip.
Brief description of the drawings
Fig. 1 is that cuing open for prior art twin-lens camera module shows schematic diagram.
Fig. 2 is the stereogram of the photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 3 is the sectional view of the photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 4 is the manufacturing process schematic diagram of the photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 5 is the manufacture method schematic diagram of the photosensory assembly according to first preferred embodiment of the present utility model.
Fig. 6 A, 6B are the different camera module cut-away views according to first preferred embodiment of the present utility model.
Fig. 7 A, 7B and 7C are the motor attachment structures of the photosensory assembly according to first preferred embodiment of the present utility model Different embodiments.
Fig. 8 is another camera module sectional view according to first preferred embodiment of the present utility model.
Fig. 9 is shown according to the array camera module of second preferred embodiment of the present utility model and its cuing open for photosensory assembly Figure.
Figure 10 is according to the 3rd array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 11 is according to the 4th array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 12 is according to the 5th array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 13 is according to the 6th array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 14 is according to the 7th array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 15 is according to the 8th array camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly Diagram.
Figure 16 is the manufacture method schematic diagram according to the photosensory assembly of above preferred embodiment of the present utility model.
Figure 17 is according to the 9th camera module of preferred embodiment of the present utility model and its cuing open for photosensory assembly
View.
Specific embodiment
Hereinafter describe for disclosing the utility model so that those skilled in the art can realize the utility model.Hereinafter retouch Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", The orientation of the instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed System is that, based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies and describes, without Be indicate or imply meaning device or element must have specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.
As shown in Fig. 2 to Fig. 6 A, according to the photosensory assembly and camera module of first preferred embodiment of the present utility model. The photosensory assembly 20 is used for array camera module described in assembly, so as to obtain the camera module of moulding type.It is described photosensitive Component 20 includes a disjunctor encapsulation part 21 and a photographic department 22, is connected to described photosensitive the integral packaging of disjunctor encapsulation part 21 Portion 22, is such as connected to the photographic department 12 molding.
The photographic department 22 includes a wiring board main body 222 and two sensitive chips 221, and each sensitive chip 221 is set It is placed in the wiring board main body 222.According to this embodiment of the present utility model, the ground connection of the molding of the sensitive chip 221 In the wiring board main body 222.More specifically, the disjunctor encapsulation part 21 (Molding on by way of being molded into chip Chip, MOC) molding be connected to the photographic department 22.
The disjunctor encapsulation part 21 forms two through hole 2100, to cause the disjunctor encapsulation part 21 respectively around each described The outside of sensitive chip 221, and the passage of light of each camera lens 50 and the corresponding sensitive chip 221 is provided.It is each described Sensitive chip 221 is arranged at the wiring board main body 222 of position corresponding to each through hole 2100.
The disjunctor encapsulation part 21 includes a connector 214 and two outer ring bodies 215, and the connector 214 is molded integratedly It is connected between two outer ring body 215, and the outer shroud is divided into adjacent two parts, forms through hole described in two 2100, chip described in two is located at the both sides of the connector 214, so as to be suitable to be used to assemble the array camera module.Value Obtain one to be mentioned that, the connector 214 is the common portion of camera lens 50 described in two, i.e., it is each described when the camera lens 50 is installed Camera lens 50 is each accounted for the corresponding part of the connector 214.
According to this embodiment of the utility model, the photographic department 22 is including a connection line (not shown) and at least One circuit element 223.The connection line defaults in the wiring board main body 222, and the circuit element 223 is electrically connected to described Connection line and the sensitive chip 221, for the photosensitive course of work of the sensitive chip 221.The circuit element 223 Projectedly it is arranged at the wiring board main body 222.The circuit element 223 can be, citing ground but be not limited to, resistance, electric capacity, Diode, triode, potentiometer, relay or driver etc..
It is noted that be coated on the circuit element 223 inside it by the disjunctor encapsulation part 21, hence in so that institute Stating circuit element 223 will not be directly exposed in space, more specifically, be not exposed to be communicated with the sensitive chip 221 Environment in, so as to will not be infected with when the array camera module is assembled into, on the circuit element 223 dust etc. pollution Thing, does not interfere with the sensitive chip 221 yet, different from the exposed existing way of circuit element in traditional camera module 223, such as Capacitance resistance ware, so as to prevent dust, debris from staying in the surface of the circuit element 223 by way of molding cladding, it is to avoid dirty Contaminate the sensitive chip 221 and cause that the bad phenomenons such as dirty stain occurs in camera module.
It is noted that in this embodiment, protruding the wiring board main body 222 with the circuit element 223 is Example is illustrated, and in the other embodiment of utility model, the circuit element 223 is embedded in the wiring board main body 222 Inside, without protruding from the wiring board main body 222, those skilled in the art it should be appreciated that the circuit element 223 Structure, type and set location be not limitation of the present utility model.
According to this preferred embodiment of the present utility model, the photographic department 22 includes multiple connecting lines 224, for being electrically connected Connect each sensitive chip 221 and the wiring board main body 222.Further, each connecting line 224 may be implemented as, tool Body ground but be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..
It is noted that each connecting line 224 is molded into inside the disjunctor encapsulation part 21, such that it is able to by The disjunctor encapsulation part 21 is coated each connecting line 224, without being directly exposed to outside, so as to assemble the battle array During row camera module so that the connecting line 224 will not be touched damage by any, while reducing environmental factor to individual described The influence of connecting line 224, such as temperature so that the communication connection between the sensitive chip 221 and the wiring board main body 222 is steady Fixed, this point is not to be provided in prior art completely.
The bottom of the through hole 2100 of the disjunctor encapsulation part 21 is skewed in what is gradually increased from the bottom to top.
It is noted that the disjunctor encapsulation part 21 coats the circuit element 223 and the connecting line 224, have Protect the circuit element 223 and the connecting line 224 and its more had the advantage of the aspects such as the camera module of performance, but Those skilled in the art is it should be appreciated that the disjunctor encapsulation part 21 is not limited to coat the circuit element 223 or described Connecting line 224.That is, in other embodiment of the present utility model, the disjunctor encapsulation part 21 can directly be molded into There is no the wiring board main body 222 of the circuit element 223 of protrusion, or be molded into outside the circuit element 223 The diverse locations such as side, surrounding.
Further, the sensitive chip 221 has a photosensitive area 2211 and a non-photo-sensing area 2212, the non-photo-sensing area 2212 are surrounded on the periphery of the photosensitive area 2211.The photosensitive area 2211 is used to carry out photosensitization, and the connecting line 224 is connected In the non-photo-sensing area 2212.
According to this preferred embodiment of the present utility model, the disjunctor encapsulation part 21 extends the sensitive chip 221 The non-photo-sensing area 2212, so as to by the sensitive chip 221 molding by way of lamination be fixed on the wiring board master Body 222.By such mode, the mode (Molding on Chip, MOC) for being such as molded into chip expands the disjunctor envelope The inside mouldable scope in dress portion 21, such that it is able to reduce the wiring board main body 222 and the disjunctor encapsulation part 21 The structural moiety in outside, further reduces the length and width size of the molding photographic department 22, the battle array that reduction is assembled by it The length and width size of row camera module.
In this embodiment of the present utility model, the disjunctor encapsulation part 21 is raisedly around the sensitive chip 221 outside of the photosensitive area 2211, especially, the disjunctor encapsulation part 21 integratedly closes connection so that with good Sealing, so as to when the photosensory assembly 20 be used to assemble the array camera module, the sensitive chip 221 is sealed In inside, space in a closing is formed.
Reference picture 4 and Fig. 5, specifically, when the photosensory assembly 20 is manufactured, can choose a traditional wiring board conduct The wiring board main body 222, sensitive chip 221 described in setting two, such as mount each sense in the wiring board main body 222 Optical chip 221 is electrically connected the sensitive chip 221 by the connecting line 224 to the wiring board main body 222, than Such as beat the mode of gold thread, and then carried out in the wiring board main body 222 and the part of the sensitive chip 221 after preliminary assembling Integral packaging, such as the mode for molding, with injection machine, SMT works will be carried out by insert molding (Insert Molding) technique Wiring board after skill (Surface Mount Technology surface mount process) carries out molding and forms the disjunctor encapsulation part 21, or the disjunctor encapsulation part 21 is formed by the mould pressing process commonly used in semiconductor packages.The wiring board main body 222 can be with Select be, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboards (without soft board) etc..It is described Disjunctor encapsulation part 21 formed mode can select be, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The disjunctor The material that encapsulation part 21 can be selected is, citing ground but is not limited to, and Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can be used Resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and the material that can be selected, only make It is not limitation of the present utility model to illustrate the mode that can implement of the present utility model.Above-mentioned integral packaging process Only illustrate a kind of mode that can implement of the present utility model, those skilled in the art as an example it should be appreciated that The manufacturing sequence of the photosensory assembly 20 is not limitation of the present utility model.
Further, the disjunctor encapsulation part 21 includes a cladding optical filter construction section 212 of section 211 and, the optical filter It is integrally connected to the cladding section 211, cladding section 211 molding is connected to the wiring board main body molding of construction section 212 222, for coating the circuit element 223 and the connecting line 224.The optical filter construction section 212 is used to install the filter Mating plate 40, that is to say, that when the photosensory assembly 20 be used to assemble the array camera module, the array camera module Optical filter 40 be installed in the optical filter construction section 212 so that the optical filter 40 be located at the sensitive chip 221 sense On light path, and the extra mounting bracket of optical filter 40 need not be provided.That is, the disjunctor encapsulation part 21 has herein There is a function of conventional stent, but the advantage based on moulding technology, and the top of the optical filter construction section 212 can be by mold Technology mode, make it have good planarization so that the optical filter 40 is entirely mounted, this point is also excellent In traditional camera module.
Further, the optical filter construction section 212 has two mounting grooves 2121, and each support slot is communicated in corresponding The through hole 2100, optical filter 40 provides the installing space of abundance respectively described in two so that each optical filter 40 will not be convex For the top surface of optical filter construction section 212.That is, the disjunctor encapsulation part 21 is provided with tankage 2121 described in two, so as to In each optical filter 40 of installation to the disjunctor encapsulation part 21, and cause that each optical filter will not protrude from the disjunctor envelope Dress portion 21.Especially, the optical filter 40 is cutoff filter IRCF.
It is noted that in this embodiment of the present utility model, the mounting groove 2121 can be used for installing filter Mating plate 20, and in other implementations of the present utility model, the mounting groove 2121 can be used to install the array camera module Motor or the part, those skilled in the art such as camera lens it should be appreciated that the shape of the mounting groove 2121 with purposes simultaneously It is not limitation of the present utility model.
It is noted that the inwall of the disjunctor encapsulation part 21 can set according to the shape of the connecting line 224 Put, such as be set to it is skewed, so as to coat connecting line 224 while allow that the sensitive chip 221 is received To more light.Those skilled in the art is it should be appreciated that the shape of the disjunctor encapsulation part 21 is not new this practicality The limitation of type.
Further, according to this preferred embodiment of the present utility model, the photosensory assembly 20 connects including at least two motors Binding structure 23, each motor attachment structure 23 is used to connect a motor 60 of the array camera module.The motor 60 has There is an at least motor pin 61.Each motor attachment structure 23 includes an at least lead 231, and each lead 231 is used for electricity Connect the motor 60 and the wiring board main body 222.Each lead 231 is electrically connected to wiring board main body 222.Further, The lead 231 is electrically connected to the connection circuit of the wiring board main body 222.The lead 231 is arranged at the disjunctor envelope Dress portion 21, and extend to the top of the disjunctor encapsulation part 21.The lead 231 includes a motor connection end 2311, appears In the top of the disjunctor encapsulation part 21, the motor pin 61 for electrically connecting the motor 60.It is noted that institute State lead 231 embedding manner can be set when the disjunctor encapsulation part 21 is formed.In traditional connected mode, such as drive The parts such as motor are all to be connected to wiring board by setting single wire, and manufacturing process is relative complex, and new in this practicality The technical process such as the mode of the lead 231 is buried during this molding of type traditional motor can be replaced to weld, and cause Circuit connection is more stablized.Especially, in implementing of the present utility model one, the lead 231 is a wire, is embedded in institute State inside disjunctor encapsulation part 21.Citing ground, the motor pin 61 can be connected to the motor by anisotropic conductive film Connection end 2311, it is also possible to be connected to the motor connection end 2311 by way of welding.
It is noted that the motor connection end 2311 of the burial place of the lead 231 and the lead 231 Can be arranged as required in the position of the disjunctor encapsulation part 21 display, such as, in an embodiment of the present utility model, institute Stating the motor connection end 2311 of lead 231 can be arranged at the periphery of the disjunctor encapsulation part 21, i.e., described disjunctor envelope The top surface in dress portion 21, the top surface of the optical filter construction section 212, and in another embodiment of the present utility model, it is described Motor connection end 2311 can be arranged at the interior of the disjunctor encapsulation part 21 and enclose, i.e., the installation of described disjunctor encapsulation part 21 The bottom surface of groove 2121, such that it is able to provide the motor 60 different installation sites.In other words, when the motor 60 needs to install During to 21 top of disjunctor encapsulation part, the motor connection end 2311 is arranged at the peripheral top surface of the disjunctor encapsulation part 21, When the motor 60 needs to be attached to the mounting groove 2121, the motor connection end 2311 is arranged at the disjunctor encapsulation part Enclosed in 21, i.e., the described bottom surface of mounting groove 2121.
That is, when the photosensory assembly 20 is manufactured, 221, the photosensitive core is first mounted, then in the circuit In plate main body 222 and the sensitive chip 221, the disjunctor encapsulation part 21 is molded in the way of MOC, and can be with molding The lead 231 is set inside the disjunctor encapsulation part 21 with embedding manner, and causes that the lead 231 is electrically connected to institute Wiring board main body 222 is stated, and causes that the motor connection end 2311 of the lead 231 is shown in the top of the disjunctor encapsulation part End, in order to be connected to the motor pin 61 of the motor 60.Citing ground, be used to assemble institute in the photosensory assembly 20 When stating array shooting molding, each described motor pin 61 of the motor 60 is connected to the lead 231 by way of welding The motor connection end 2311 so that the motor 60 is electrically connected to the wiring board main body 222, and need to set single Only wire connects the motor 60 and the wiring board main body 222, and causes the motor pin 61 of the motor 60 Length can reduce.
Reference picture 2, to Fig. 6 A, is the camera module according to first preferred embodiment of the present utility model, the array Camera module can be dynamic Jiao's camera module (Automatic Focus Camera Module, AFCM).The array shooting Module includes camera lens 50 described in motor 60 and two described in optical filter 40, two described in photosensory assembly 20, two described in.
Each optical filter 40 is installed in the photosensory assembly 20, and each camera lens 50 is installed in each motor 60, each motor 60 is installed on the photosensory assembly 20.
Further, the optical filter 40 is installed in the filter of the disjunctor encapsulation part 21 of the photosensory assembly 20 The mounting groove 2121 of mating plate construction section 212.Each motor 60 is installed in the disjunctor mould of the photosensory assembly 20 The optical filter construction section top in group portion 21.
Further, the motor pin 61 of the motor 60 is electrically connected to the motor of the motor attachment structure 23 Connection end 2311, so as to be electrically connected to the wiring board main body 222 by the motor attachment structure 23.
It will be apparent to a skilled person that the structure and type of above-mentioned array camera module are only as an example, come The mode that the array camera module can be carried out is illustrated, is not limitation of the present utility model.
Reference picture 7A is an equivalent reality of the motor attachment structure according to above preferred embodiment of the present utility model Apply example.The motor attachment structure 23 includes a pin groove 233, and the pin groove 233 is used to accommodate the array camera module The motor 60 the motor pin 61.The pin groove 233 is arranged at the upper end of disjunctor encapsulation part 21.The horse Include that at least each lead 234 of a lead 234 is used to electrically connect the motor 60 and the wiring board master up to attachment structure 23 Body 222.The lead 234 is arranged at the disjunctor encapsulation part 21, and extends upwardly to the institute of the disjunctor encapsulation part 21 State the groove bottom wall of pin groove 233.The lead 234 includes a motor connection end 2341, is revealed in the disjunctor encapsulation part 21 The groove bottom wall of the pin groove 233, the pin 41 for electrically connecting the motor 60.Especially, in a kind of implementation method In, the motor connection end 2341 may be implemented as a pad.The lead 234 may be implemented as a wire, be buried Inside the disjunctor encapsulation part 21.
That is, when the photosensory assembly 20 is manufactured, 221, the photosensitive core is first mounted, then in the circuit In plate main body 222 and the sensitive chip 221, the disjunctor encapsulation part 21 is molded in the way of MOC, and preset pre- fixed length The pin groove 233 of degree, and the lead 234 can be set with embedding manner in molding, and cause the electricity of the lead 234 The wiring board main body 222 is connected to, and causes that the motor connection end 2341 of the lead 234 is shown in the disjunctor envelope The groove bottom wall of the pin groove 233 in dress portion 21, in order to be connected to the pin 41 of the motor 60.Citing ground, in institute When stating photosensory assembly 20 and be used to assembling the shooting molding, each described pin 41 of the motor 60 inserts the pin groove 233, and the motor connection end 2341 of the lead 234 is connected to by way of welding, so that the motor 60 The wiring board main body 222 is electrically connected to, and needs to set single wire by the motor 60 and the wiring board main body 222 Connection, and cause that the pin 42 of the motor 60 can be connected stably, prevents from outside unwanted touching the horse Up to pin 61.Especially, the lead 234 may be implemented as a wire, be embedded in inside the disjunctor encapsulation part 21.
Reference picture 7B, is another equivalence enforcement of the motor attachment structure according to above preferred embodiment of the present utility model Example.The motor attachment structure 23 includes a pin groove 235, and the pin groove 235 is used to accommodate the array camera module The pin 41 of the motor 60.The pin groove 235 is arranged at the disjunctor encapsulation part 21.The motor attachment structure 23 include an at least circuit junction 232, and the circuit junction 232 defaults in the wiring board main body 222, and is electrically connected to institute State in wiring board main body 222 connection line.Further, each pin groove 235 is by the disjunctor encapsulation part 21 Top extends to the wiring board main body 222, and causes that the circuit junction 232 shows.In a kind of way of example, institute State motor pin 61 and insert the pin groove 235, and can be welded to connect with the circuit junction 232.
That is, when the photosensory assembly 20 is manufactured, default each circuit connects in the wiring board main body 222 Point 232, and then 221, the photosensitive core is mounted, then in the wiring board main body 222 and the sensitive chip 221, with The mode of MOC molds the disjunctor encapsulation part 21, and presets the pin groove 235 of predetermined length, and causes the circuit Contact 232 is shown by the pin groove 235, in order to be connected to the motor pin 61 of the motor 60.Citing ground, When the photosensory assembly 20 be used to assemble the shooting molding, each described motor pin 61 of the motor 60 inserts described drawing Pin groove 235, and the circuit junction 232 in wiring board main body 222 is connected to by way of welding, so that the horse The wiring board main body 222 is electrically connected to up to 60, and cause can stably connecting for the motor pin 61 of the motor 60 Connect, prevent from outside unwanted touching the motor pin 61.
Reference picture 7C, is according to the above-mentioned another equivalence enforcement for being preferable to carry out inner motor attachment structure of the present utility model Example.The motor attachment structure 23 includes an engraving circuit 236, and the engraving circuit 236 is used to electrically connect the wiring board master The parts such as the connection line, the sensitive chip 221 and motor on body 222.Citing ground but be not limited to, the engraved lines Road 236 can be set by way of electronics carving (LDS) when the disjunctor encapsulation part 21 is formed.In traditional connected mode In, the part such as drive motor is all to be connected to wiring board by setting single wire, and manufacturing process is relative complex, and The mode of the engraving circuit 236 technique such as traditional motor can be replaced to weld is set in this molding of the present utility model Process, and cause that circuit connection is more stablized.More specifically, the forming process of the engraving circuit 236 can be, present institute State disjunctor encapsulation part 21 and engraving groove is set, circuit then is set in the way of electroplating in the engraving groove.
In one embodiment of the present utility model, the motor 60 of the array camera module is connected to the sense The mode of optical assembly 20 is illustrated by taking the connected mode of the motor attachment structure 23 as an example, as described using the lead 231 mode, and in other embodiment of the present utility model, the connected mode of the motor 60 can also with Fig. 7 A, 7B with And the corresponding connected modes of 7C are combined, using the pin groove 233 and lead 234, as described in pin groove 235 and the electricity Road contact 232.And in another embodiment of the present utility model, reference picture 6B, the motor 60 can be by traditional mode The photosensory assembly 10 is connected to, such as by way of welding.Those skilled in the art is it should be appreciated that the motor 60 and the photosensory assembly 10 connected mode be not the utility model limitation.
Reference picture 8, according to another camera module of first preferred embodiment of the present utility model.The array images mould Group can one focus module.The array camera module includes the institute of optical filter 40 and two described in photosensory assembly 20, two described in State camera lens 50.
Each optical filter 40 is installed in the photosensory assembly 20, and each camera lens 50 is installed in the photosensory assembly On 20.
More specifically, each optical filter 40 is installed in each institute of the disjunctor encapsulation part 21 of the photosensory assembly 20 State the mounting groove 2121 of optical filter construction section 212.Each camera lens 50 is installed in the company of the photosensory assembly 20 The top of body encapsulation part 21.
It will also be appreciated that each camera lens 50 is installed in the disjunctor encapsulation part 21 of the photosensory assembly 20 Top, so that function of the disjunctor encapsulation part 21 equivalent to the support in traditional camera module, is that the camera lens 50 provides branch Support, fixed position, but assembling is but different from tradition COB technical process.The support of the camera module of traditional COB techniques is pasting Mode be fixed on wiring board, and the disjunctor encapsulation part 21 is fixed on the wiring board main body 222 by moulding technology, is not required to Paste fixation procedure, molding mode is fixed controllable with more preferable connective stability and technical process relative to pasting Property, and the glue space that AA is adjusted need not be reserved between the disjunctor encapsulation part 21 and the wiring board main body 222, therefore Reduce the headspace of traditional camera module AA adjustment so that the thickness of camera module is reduced；On the other hand, the company Body encapsulation part 21 coats the circuit element 223 and the connecting line 224 so that traditional cradling function and circuit element 223 And the connecting line 224 can be overlapped spatially, it is not necessary to as traditional camera module, reserved around circuit devcie Safe distance, so that the height of the disjunctor encapsulation part 21 with cradling function can be arranged on less scope, from And further provide the space that camera module thickness can reduce.Additionally, the disjunctor encapsulation part 21 replaces traditional support, The heeling error that support brings when assembling is pasted is avoided, the cumulative limit of camera module assembling is reduced.And the disjunctor Encapsulation part 21 coats the connecting line 224, and the disjunctor encapsulation part 21 extends to the non-photo-sensing area of the sensitive chip 221 2212 so that the disjunctor encapsulation part 21 can be to contract, so as to further reduce the horizontal of the array camera module Length and width size.
As shown in figure 9, being the array camera module according to second preferred embodiment of the present utility model and its photosensitive group Part.Different from above preferred embodiment, the wiring board main body 222H has two inner groovy 2222H, each photosensitive core Piece 221 is arranged in the inner groovy 2222H, so that the sensitive chip 221 and the wiring board main body 222H Relative altitude reduction, so as to when the disjunctor encapsulation part 21 coats the sensitive chip 221, reduce to the disjunctor encapsulation part 21 Requirement for height so that reduce the photosensory assembly 20 assembling the array camera module height.
As shown in Figure 10, it is array camera module according to the 3rd preferred embodiment of the present utility model and its photosensitive group Part.
Different from above preferred embodiment, in this embodiment of the present utility model, the photosensory assembly 20 The photographic department 22 includes a back-up coat 225I, is connected to the bottom of wiring board main body 222 the back-up coat 225I laminations, In order to strengthen the structural strength of the wiring board main body 222.That is, in the wiring board main body 222 disjunctor Region bottom where encapsulation part 21 and the sensitive chip 221 mounts the back-up coat 225I, so that the circuit Plate main body 222 reliablely and stablely supports the disjunctor encapsulation part 21 and the sensitive chip 221.
Further, the back-up coat 225I is a metallic plate, and the metallic plate is attached at the bottom of the wiring board main body 222 Layer, increases the structural strength of the wiring board main body 222, on the other hand, increases the heat dispersion of the photosensory assembly 20, can have The heat that the lost sensitive chip 221 of effect sends.
It is noted that the wiring board main body 222 can be using FPC (Flex Print Circuit, flexibility printing Circuit board), and by the rigidity of FPC described in the back-up coat 225I so that the FPC with excellent bending performance disclosure satisfy that institute State the bearing requirements of photosensory assembly 20.That is, the selectable range of the wiring board main body 222 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).By described Back-up coat 225I increases the structural strength of the wiring board main body 222 and improves heat dispersion, such that it is able to reduce the line The thickness of road plate main body 222 so that the height of the photosensory assembly 20 further reduces, and the battle array obtained by its assembling The height of row camera module reduces.
As shown in figure 11, it is array camera module according to the 4th preferred embodiment of the present utility model and its photosensitive group The cut-away view of part.
Different from above preferred embodiment, the wiring board main body 222J has an at least reinforced hole 2221J, described Disjunctor encapsulation part is extended into the reinforced hole 2221J, so as to strengthen the structural strength of the wiring board main body 222J.
The position of the reinforced hole 2221J can select as needed, and according to the structural strength need of the wiring board Ask to set, such as in symmetrical structure.The knot of the wiring board main body 222J is caused by the setting of the reinforced hole 2221J Structure intensity enhancing, such that it is able to reduce the thickness of the wiring board main body 222J, reduces by the thickness of its camera module for assembling, And improve the heat dispersion of the photosensory assembly 20.
It is noted that the reinforced hole 2221J is groove-like, so that when manufacturing the photosensory assembly 20, the company The moulding material of body encapsulation part will not be spilt by the reinforced hole 2221J.
As shown in figure 12, it is array camera module according to the 5th preferred embodiment of the present utility model and its photosensitive group Part 20.
Different from above preferred embodiment, the wiring board main body 222K has an at least reinforced hole 2221K, described Disjunctor encapsulation part is extended into the reinforced hole 2221K, so as to strengthen the structural strength of the wiring board main body 222K.
The position of the reinforced hole 2221K can select as needed, and according to the structural strength need of the wiring board Ask to set, such as in symmetrical structure.The knot of the wiring board main body 222K is caused by the setting of the reinforced hole 2221K Structure intensity enhancing, such that it is able to reduce the thickness of the wiring board main body 222K, reduces by the thickness of its camera module for assembling, And improve the heat dispersion of the photosensory assembly 20.
It is noted that the reinforced hole 2221K is perforation, that is to say, that through the wiring board main body 222K, So that the both sides connection of the wiring board main body 222K, so that when manufacturing the photosensory assembly 20, the mould of the disjunctor encapsulation part Moulding material is sufficiently combined with the wiring board main body 222K, forms more firm composite structure, and relatively described recessed The structure of groove, the perforation is easier processing and manufacturing.
As shown in figure 13, it is array camera module according to the 6th preferred embodiment of the present utility model and its photosensitive group Part.
The disjunctor encapsulation part 21L includes a cladding section 211L, an optical filter construction section 212L and a camera lens construction section Integratedly molding is connected to the cladding section successively for 213L, the optical filter construction section 212L and the camera lens construction section 213L 211L, cladding section 211L moldings are connected to the wiring board main body 222, for coating the circuit element 223 and described Connecting line 224.The optical filter construction section 212L is used to install optical filter 40 described in two, that is to say, that when the photosensory assembly 20 when be used to assemble the array camera module, and each optical filter 40 of the array camera module is installed in the optical filter Construction section 212L so that each optical filter 40 is located on the photosensitive path of each sensitive chip 221, and need not provide volume The outer mounting bracket of optical filter 40.That is, the disjunctor encapsulation part 21L is in the function with conventional stent herein, but Advantage based on moulding technology, the optical filter construction section 212L tops can make it have by the technology mode of mold Good planarization, so that each optical filter 40 is entirely mounted, this point is also an advantage over traditional array shooting Module.The camera lens construction section 213L is used to install camera lens 50 described in two, that is to say, that when the photosensory assembly 20 is used for group When filling the array camera module, each camera lens 50 is installed in the camera lens construction section of the disjunctor encapsulation part 21L 213L inner sides, in order to provide the installation site of stabilization for the camera lens 50.
The disjunctor encapsulation part 21L includes a connector 214L and two outer ring body 215L, the connector 214L moldings one It is connected between the two outer ring bodies 215L body, and the outer shroud is divided into adjacent two parts, is formed and lead to described in two Hole 2100L, chip described in two is located at the both sides of the connector 214L, so as to be suitable to be used to assemble the array shooting mould Group.It is noted that the connector 214L is the common portion of camera lens 50 described in two, i.e., when the camera lens 50 is installed, Each camera lens 50 is each accounted for the corresponding parts of the connector 214L.
Further, the optical filter construction section 212L has two mounting groove 2121L, each mounting groove 2121L connections It is that the optical filter 40 provides sufficient installing space so that the optical filter 40 will not be convex in the corresponding through hole 2100L For the top surface of optical filter construction section.The camera lens construction section 213L has two camera lens mounting groove 2131L, and the camera lens is installed Groove 2131L is communicated in the corresponding through hole 2100L, is the installing space that the camera lens 50 provides abundance.
In other words, the optical filter construction section 212L and the camera lens construction section 213L are integratedly upwardly extended, and interior Portion forms step-like structure, and respectively described optical filter 40 and the camera lens 50 provide support fixed position, without carrying The optical filter 40 and the camera lens 50 are installed for extra part.
It is in closed annular that the camera lens construction section 213L has two camera lens inwall 2132L, the camera lens inwall 2132L, is fitted Installing space is provided in respectively each camera lens 50.It is noted that in the camera lens of the camera lens construction section 213L Wall 2132L surfacings, so as to be suitable to install the camera lens 50 of non-threaded, formation focuses module.Especially, the camera lens 50 The camera lens construction section 213L can be fixed on by way of bonding.
Reference picture 14 is the photosensory assembly and camera module according to the 7th preferred embodiment of the present utility model.It is different from Above preferred embodiment, the photosensory assembly 20 includes a screen layer 227, and the screen layer 227 wraps up the wiring board Main body 222 and the disjunctor encapsulation part 21, so as to while the structural strength of the wiring board main body 222 is strengthened, strengthen institute State the anti-electromagnetic interference capability of photosensory assembly 20.
As shown in Figure 15 and Figure 16, be according to the array camera module of the 8th preferred embodiment of the present utility model and its Photosensory assembly.The array camera module includes a photosensory assembly 20N.The camera lens 50 is installed in the photosensory assembly 20N On, assembling forms the array camera module.
Especially, the camera lens 50 can be fixed on the disjunctor envelope of the photosensory assembly 20N by way of bonding The top of dress portion 21N, and by moulding technology the characteristics of Making mold so that the top of the disjunctor encapsulation part 21N has Preferable planarization, is that the camera lens 50 provides good mounting condition, so as to obtain the camera module of high-quality.Described photosensitive group Part 20N is used for array camera module described in assembly, so as to obtain the camera module of moulding type.
The photosensory assembly 20N includes an a disjunctor encapsulation part 21N and photographic department 22N, the disjunctor encapsulation part 21N moldings Be connected to the photographic department 22N.
The circuit plate portion includes that wiring board main body a 222N, the disjunctor encapsulation part 21N forms two through hole 2100N, with So that the disjunctor encapsulation part 21N is respectively around each sensitive chip 221N outside, and provide each camera lens 50 with The passage of light of the corresponding sensitive chip 221N.Each sensitive chip 221N is arranged at each through hole 2100N institutes The wiring board main body 222N of correspondence position.
The disjunctor encapsulation part 21N includes a connector 214N and two outer ring body 215N, the connector 214N moldings one It is connected between the two outer ring bodies 215N body, and the outer shroud is divided into adjacent two parts, is formed and lead to described in two Hole 2100N, chip described in two is located at the both sides of the connector 214N, so as to be suitable to be used to assemble the array shooting mould Group.It is noted that the connector 214N is the common portion of camera lens 50 described in two, i.e., when the camera lens 50 is installed, Each camera lens 50 is each accounted for the corresponding parts of the connector 214N.
The photographic department 22N includes a wiring board main body 222N and two sensitive chip 221N, each sensitive chip 221N It is arranged on the wiring board main body 222N.According to this embodiment of the present utility model, the sensitive chip 221N moldings Be connected to the circuit version main body.
According to this embodiment of the utility model, the photographic department 22N is including a connection line (not shown) and extremely A few circuit element 223N.The connection line defaults in the wiring board main body 222N, the circuit element 223N electrical connections In the connection line and the sensitive chip 221N, for the photosensitive course of work of the sensitive chip 221N.The electricity Circuit component 223N is projectedly arranged at the wiring board main body 222N.The circuit element 223N can be, citing ground but not limit In resistance, electric capacity, diode, triode, potentiometer, relay or driver etc..
It is noted that be coated on the circuit element 223N inside it by the disjunctor encapsulation part 21N, hence in so that The circuit element 223N will not be directly exposed in space, more specifically, be not exposed to and the sensitive chip 221N In the environment for communicating, so as to when the array camera module is assembled into, dust etc. will not be infected with the circuit element 223N Pollutant, does not interfere with the sensitive chip 221N yet, different from the exposed presence of circuit element 223N in traditional camera module Mode, such as capacitance resistance ware, so as to prevent dust, debris from staying in the circuit element 223N tables by way of molding cladding Face, it is to avoid pollute the sensitive chip 221N and cause that the bad phenomenons such as dirty stain occurs in camera module.
According to this preferred embodiment of the present utility model, the photographic department 22N includes multiple connecting line 224N, for electricity Connect each sensitive chip 221N and wiring board main body 222N.Further, each connecting line 224N can be carried out Specifically but to be not necessarily limited to, gold thread, copper cash, aluminum steel, silver wire etc..
It is noted that each connecting line 224N is molded into inside the disjunctor encapsulation part 21N, such that it is able to borrow The disjunctor encapsulation part 21N is helped to be coated each connecting line 224N, without being directly exposed to outside, so as to assemble institute When stating array camera module so that the connecting line 224N will not be touched damage by any, while reducing environmental factor pair The influence of the individual connecting line 224N, such as temperature so that between the sensitive chip 221N and the wiring board main body 222N Communication stable connection, this point is not to be provided in prior art completely.
It is noted that the disjunctor encapsulation part 21N coats the circuit element 223N and connecting line 224N, tool There is the protection circuit element 223N and connecting line 224N and its more had the advantage of the aspects such as the camera module of performance, But those skilled in the art is it should be appreciated that the disjunctor encapsulation part 21N is not limited to coat the circuit element 223N Or the connecting line 224N.That is, in other embodiment of the present utility model, the disjunctor encapsulation part 21N can be straight Meet the wiring board main body 222N that is molded into the circuit element 223N not protruded, or be molded into the circuit The diverse locations such as element 223N outsides, surrounding.
Further, the sensitive chip 221N has an a photosensitive area 2211N and non-photo-sensing area 2212N, the non-photo-sensing Area 2212N is surrounded on the photosensitive area 2211N peripheries.The photosensitive area 2211N is used to carry out photosensitization, the connecting line 224N is connected to the non-photo-sensing area 2212N.
According to this preferred embodiment of the present utility model, the disjunctor encapsulation part 21N extends the sensitive chip The non-photo-sensing area 2212N of 221N, so as to lamination is fixed on the line by way of molding by the sensitive chip 221N Road plate main body 222N.By such mode, the mode (Molding on chip) for being such as molded into chip expands the disjunctor The inside mouldable scope of encapsulation part 21N, such that it is able to reduce the wiring board main body 222N and the disjunctor encapsulation part The structural moiety in the outside of 21N, further reduces the length and width size of the molding photographic department 22N parts, what reduction was assembled by it The length and width size of the array camera module.
The photosensory assembly 20N further includes two optical filter 226N, and each optical filter 226N moldings ground lamination is set In on the corresponding sensitive chip 221N.The edge of each optical filter 226N is molded into the disjunctor encapsulation part 21N, from And the fixation optical filter 226N.It is noted that the optical filter 226N is covered in the sensitive chip 221N tops, will The sensitive chip 221N isolates with external environment condition, protects the sensitive chip 221N to sustain damage.
When the photosensitive circuit pack of the molding is manufactured, the sensitive chip 221N is first attached at the wiring board main body 222N, and the sensitive chip 221N and wiring board main body 222N is connected to by described, and then by the optical filter 226N It is attached on the sensitive chip 221N, further, by the wiring board main body 222N and sensitive chip 221N and described Optical filter 226N is molded, and forms the disjunctor encapsulation part 21N.In molding, by the optical filter 226N is covered in institute State on sensitive chip 221N, therefore, it is possible to prevent the injury of the mould for the sensitive chip 221N of molding, and due to described The distance of the optical filter 226N and sensitive chip 221N reduces, therefore can cause by the rear burnt religion of its camera module for assembling Tool reduces, so that reduce the height of the array camera module, on the other hand, due to that need not be provided for the optical filter 226N Extra support member, therefore also cause that the thickness of the array camera module is further reduced to a certain extent.
In this embodiment of the present utility model, the disjunctor encapsulation part 21N is raisedly around each photosensitive core The photosensitive area 2211N outsides of piece 221N, especially, the disjunctor encapsulation part 21N integratedly closes connection so that with good Good sealing, so that when the photosensory assembly 20N be used to assemble the array camera module, the sensitive chip 221N Inside is sealed in, space in a closing is formed.
Specifically, when the photosensory assembly 20N is manufactured, a traditional wiring board can be chosen as the wiring board master Body 222N, sensitive chip 221N described in is set on the wiring board main body 222N, and the sensitive chip 221N is passed through into institute Connecting line 224N electrical connections are stated, further each optical filter 226N is overlapped and is attached at the corresponding sensitive chip 221N On, and then molded on the molding wiring board main body 222N and sensitive chip 221N parts after preliminary assembling, such as use Injection machine, SNT techniques (Surface Mount Technology will be carried out by insert molding (Insert Molding) technique Surface mount process) after wiring board carry out molding and form the disjunctor encapsulation part 21N, or with the mould commonly used in semiconductor packages Pressure technique forms the disjunctor encapsulation part 21N.The wiring board main body 222N can be selected, citing ground but be not limited to, it is soft or hard Board, ceramic substrate (without soft board), PCB hardboards (without soft board) etc..The mode that the disjunctor encapsulation part 21N is formed can be with Select be, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the disjunctor encapsulation part 21N can be selected is, Citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer polymerization Thing), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It should be understood by those skilled in the art that Be, the foregoing manufacture that can be selected and the material that can be selected be illustrative only it is of the present utility model can be real The mode applied, is not limitation of the present utility model.
Reference picture 17, according to the array camera module and its wiring board group of the 9th preferred embodiment of the present utility model Part.Different from above preferred embodiment, the array camera module includes an at least support 70, for installing each filter Mating plate 40, each camera lens 50 or each motor 60.According to this embodiment of the present utility model, the support 70 is mounted In the disjunctor encapsulation part 11, each optical filter 40 is installed in the support 70, and each motor 60 is installed in described Support 70.The concrete shape of the support 70 can be arranged as required to, such as set boss, in order to install each optical filtering Piece.Shown support 70 can be a disjunctor support, that is to say, that can with the multiple optical filters 40 of once mounting, or Support unit, that is, an optical filter 40 is installed.In this embodiment of the present utility model, the support 70 is preferred It is disjunctor support.Those skilled in the art is it should be appreciated that the concrete shape of the support 70 is not the utility model Limitation.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as Illustrate and be not intended to limit the utility model.The purpose of this utility model completely and is effectively realized.Work(of the present utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, implementation method of the present utility model Can there are any deformation or modification.

Claims (62)

1. the photosensory assembly of an array camera module, it is characterised in that including：
One disjunctor encapsulation part；With
One photographic department；The photographic department includes a wiring board main body and at least two sensitive chips, and the disjunctor encapsulation part one is sealed Fill the wiring board main body and each sensitive chip.
2. photosensory assembly according to claim 1, wherein the disjunctor encapsulation part forms at least two through hole, each through hole It is relative with each sensitive chip, to provide the sensitive chip passage of light.
3. photosensory assembly according to claim 2, wherein the bottom of each described through hole of the disjunctor encapsulation part is under It is supreme gradually increase it is skewed.
4. photosensory assembly according to claim 2, wherein the disjunctor encapsulation part top is suitable to install the array shooting The support of module, camera lens, motor or optical filter.
5. photosensory assembly according to claim 2, wherein the disjunctor encapsulation part top has at least two mounting grooves, each institute State mounting groove and be communicated in the corresponding through hole, for installing support, optical filter, camera lens or the horse of the array camera module Reach.
6. photosensory assembly according to claim 2, wherein the disjunctor encapsulation part includes that a cladding section, an optical filter are installed By the cladding section, molding prolongs upwards successively for section and a camera lens construction section, the optical filter construction section and the camera lens construction section Stretch, and it is internal in step-like, in order to install the optical filter and camera lens of the array camera module.
7. photosensory assembly according to claim 2, wherein the disjunctor encapsulation part has at least two mounting grooves, is respectively communicated with In the corresponding through hole, two step-like optical filter construction sections are formed, in order to be respectively mounted an optical filter, the disjunctor envelope Dress portion has at least two camera lens mounting grooves, forms two step-like camera lens construction sections, in order to be respectively mounted the array shooting One camera lens of module.
8. photosensory assembly according to claim 7, wherein the camera lens construction section has at least two camera lens inwalls, the mirror Head inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
9. according to any described photosensory assembly of claim 1 to 8, wherein the photographic department includes an at least connecting line, each institute Connecting line the electrical connection sensitive chip and the wiring board main body are stated, the disjunctor encapsulation part coats the connecting line, so that Obtaining the connecting line will not be directly exposed to outside.
10. photosensory assembly according to claim 9, wherein the connecting line is selected from combination：Gold thread, silver wire, copper cash or aluminium One kind in line.
11. photosensory assemblies according to claim 9, wherein the connecting line curvedly connect the wiring board main body and The sensitive chip, to reduce the damage to the connecting line.
12. photosensory assemblies according to claim 9, wherein each sensitive chip includes a photosensitive area and a non-photo-sensing Area, the non-photo-sensing area extends to the institute of the sensitive chip around photosensitive area periphery, the disjunctor encapsulation part molding Non-photo-sensing area is stated, the mouldable scope inside to extend the disjunctor encapsulation part reduces the Outside Dimensions of the disjunctor encapsulation part.
13. photosensory assemblies according to claim 9, wherein the photographic department includes an at least circuit element, the circuit Element protrudes from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, to cause the circuit element not Outside can be directly exposed to.
14. photosensory assemblies according to claim 13, wherein circuit element selection combination：Resistance, electric capacity, two poles One or more of which in pipe, triode, potentiometer, relay and relay.
15. photosensory assemblies according to claim 9, wherein the photographic department includes at least two optical filters, the optical filter The sensitive chip is covered in, the disjunctor encapsulation part takes shape in the wiring board main body, the sensitive chip and the optical filtering Piece, the sensitive chip is protected in order to pass through the optical filter, and reduces the back focal length of the array camera module, makes its high Degree reduces.
16. photosensory assemblies according to claim 9, wherein the photographic department includes a back-up coat, the reinforcing layer laminate The wiring board bottom part body is arranged at, to strengthen the structural strength of the wiring board main body.
17. photosensory assemblies according to claim 16, wherein the back-up coat is metallic plate, to strengthen the photographic department Heat dispersion.
18. photosensory assemblies according to claim 9, wherein the photographic department includes a screen layer, the screen layer parcel The wiring board main body and the disjunctor encapsulation part, to strengthen the electromagnetism interference performance of the photosensory assembly.
19. photosensory assemblies according to claim 18, wherein the screen layer is metallic plate or wire netting.
20. photosensory assemblies according to claim 9, wherein wiring board main body have an at least reinforced hole, the disjunctor envelope Dress portion extends into the reinforced hole, in order to strengthen the structural strength of the wiring board main body.
21. photosensory assemblies according to claim 20, wherein the reinforced hole is groove-like.
22. photosensory assemblies according to claim 20, wherein the reinforced hole is through hole, to cause the disjunctor encapsulation part Moulding material be fully contacted with the wiring board main body, it is and easily fabricated.
23. photosensory assemblies according to claim 9, wherein the material of the wiring board main body can be selected from combination：It is soft or hard Board, ceramic substrate, PCB hardboards or FPC.
24. according to any described photosensory assembly in claim 1 to 8, wherein the material of the disjunctor encapsulation part is selected from combination： One kind in epoxy resin, nylon, LCP or PP.
25. photosensory assemblies according to claim 9, wherein the photosensory assembly includes at least two motor attachment structures, respectively The motor attachment structure includes an at least lead, and the lead is arranged at the disjunctor encapsulation part, and is electrically connected to the line Road plate main body, the lead includes a motor connection end, the disjunctor encapsulation part is revealed in, in order to connect a motor pin.
26. photosensory assemblies according to claim 9, wherein the photosensory assembly includes at least two motor attachment structures, its bag An at least lead and at least a pin groove are included, the lead is arranged at the disjunctor encapsulation part, and is electrically connected to the circuit Plate main body, the pin groove is arranged at the disjunctor encapsulation part upper end, and the lead includes a motor connection end, the horse Up to connection end line in the groove bottom wall, the motor is electrically connected to when being plugged in the pin groove in order to a motor pin and is connected Connect end.
27. photosensory assemblies according to claim 9, wherein the photosensory assembly includes at least two motor attachment structures, respectively The motor attachment structure includes at least a pin groove and at least a circuit junction, and the circuit junction is electrically connected to the circuit Plate main body, the pin groove is arranged at the disjunctor encapsulation part, and the disjunctor encapsulation part is extended to by the wiring board main body Top, and the circuit junction is revealed in the pin groove, is electrically connected when being plugged in the pin groove in order to a motor pin It is connected to the circuit junction.
28. photosensory assemblies according to claim 9, wherein the photosensory assembly includes at least two motor attachment structures, respectively The motor attachment structure includes at least one engraving circuit, and the engraving circuit is arranged at the disjunctor encapsulation part, is electrically connected to The wiring board main body, in order to electrically connect a motor pin.
29. photosensory assemblies according to claim 28, wherein the engraved lines road is arranged at institute in the way of laser formation State disjunctor encapsulation part.
30. an array camera modules, it is characterised in that including：
One photosensory assembly；With
At least two camera lenses；Wherein described photosensory assembly includes：
One disjunctor encapsulation part；With
One photographic department；The photographic department includes a wiring board main body and at least two sensitive chips, and the disjunctor encapsulation part one is sealed Fill the wiring board main body and each sensitive chip；Each camera lens is located at each described sensitive chip of the photosensory assembly On photosensitive path.
31. array camera modules according to claim 30, wherein the disjunctor encapsulation part forms at least two through hole, each institute Through hole is stated relative with each sensitive chip, to provide the sensitive chip passage of light.
32. array camera modules according to claim 31, wherein the bottom of each described through hole of the disjunctor encapsulation part It is skewed in what is gradually increased from the bottom to top.
33. array camera modules according to claim 31, wherein the disjunctor encapsulation part top is suitable to install the battle array The support of row camera module, camera lens, motor or optical filter.
34. array camera modules according to claim 31, wherein the disjunctor encapsulation part top is installed with least two Groove, each mounting groove is communicated in the corresponding through hole, for install the support of the array camera module, optical filter, Camera lens or motor.
35. array camera modules according to claim 31, wherein the disjunctor encapsulation part includes that a cladding section, one filter Piece construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively by the cladding upward mould of section Modeling extends, and internal in step-like, in order to install the optical filter and camera lens of the array camera module.
36. array camera modules according to claim 31, wherein the disjunctor encapsulation part has at least two mounting grooves, even The corresponding through hole is passed through, two step-like optical filter construction sections are formed, in order to be respectively mounted an optical filter, institute's disjunctor envelope Dress portion has at least two camera lens mounting grooves, forms two step-like camera lens construction sections, in order to be respectively mounted the array shooting One camera lens of module.
37. array camera modules according to claim 36, wherein the camera lens construction section has at least two camera lens inwalls, The camera lens inner wall surface is smooth, is suitable for installing a non-threaded camera lens.
38. according to any described array camera module of claim 30 to 37, wherein the photographic department includes at least one connection Line, each connecting line the electrical connection sensitive chip and the wiring board main body, the disjunctor encapsulation part coats the connection Line, to cause that the connecting line will not be directly exposed to outside.
The 39. array camera module according to claim 38, wherein the connecting line is selected from combination：Gold thread, silver wire, copper cash Or the one kind in aluminum steel.
The 40. array camera module according to claim 38, wherein the connecting line curvedly connects the wiring board Main body and the sensitive chip, to reduce the damage to the connecting line.
The 41. array camera module according to claim 38, wherein each sensitive chip is non-including a photosensitive area and one Photosensitive area, the non-photo-sensing area extends to the sensitive chip around photosensitive area periphery, the disjunctor encapsulation part molding The non-photo-sensing area, the mouldable scope inside to extend the disjunctor encapsulation part reduce the periphery of the disjunctor encapsulation part Size.
The 42. array camera module according to claim 38, wherein the photographic department includes an at least circuit element, it is described Circuit element protrudes from the wiring board main body, and the disjunctor encapsulation part coats the circuit element, to cause the circuit elements Part will not be directly exposed to outside.
43. array camera modules according to claim 42, wherein circuit element selection combination：Resistance, electric capacity, two One or more of which in pole pipe, triode, potentiometer, relay and relay.
The 44. array camera module according to claim 38, wherein the photographic department includes at least two optical filters, the filter Mating plate is covered in the sensitive chip, and the disjunctor encapsulation part takes shape in the wiring board main body, the sensitive chip and described Optical filter, the sensitive chip is protected in order to pass through the optical filter, and reduces the back focal length of the array camera module, is made Its height reduces.
The 45. array camera module according to claim 38, wherein the photographic department includes a back-up coat, the back-up coat Lamination is arranged at the wiring board bottom part body, to strengthen the structural strength of the wiring board main body.
46. array camera modules according to claim 45, wherein the back-up coat is metallic plate, it is described photosensitive to strengthen The heat dispersion in portion.
The 47. array camera module according to claim 38, wherein the photographic department includes a screen layer, the screen layer The wiring board main body and the disjunctor encapsulation part are wrapped up, to strengthen the electromagnetism interference performance of the photosensory assembly.
48. array camera modules according to claim 47, wherein the screen layer is metallic plate or wire netting.
The 49. array camera module according to claim 38, wherein wiring board main body have an at least reinforced hole, the company Body encapsulation part extends into the reinforced hole, in order to strengthen the structural strength of the wiring board main body.
50. array camera modules according to claim 49, wherein the reinforced hole is groove-like.
51. array camera modules according to claim 49, wherein the reinforced hole is through hole, to cause that the disjunctor is sealed The moulding material in dress portion is fully contacted with the wiring board main body, and easily fabricated.
The 52. array camera module according to claim 38, wherein the material of the wiring board main body can be selected from combination： Rigid Flex, ceramic substrate, PCB hardboards or FPC.
The 53. array camera module according to claim 38, wherein the material of the disjunctor encapsulation part is selected from combination：Epoxy One kind in resin, nylon, LCP or PP.
The 54. array camera module according to claim 38, wherein the photosensory assembly includes that at least two motors connect knot Structure, each motor attachment structure includes an at least lead, and the lead is arranged at the disjunctor encapsulation part, and is electrically connected to institute Wiring board main body is stated, the lead includes a motor connection end, is revealed in the disjunctor encapsulation part, draws in order to connect a motor Pin.
The 55. array camera module according to claim 38, wherein the photosensory assembly includes that at least two motors connect knot Structure, it includes an at least lead and at least a pin groove, and the lead is arranged at the disjunctor encapsulation part, and is electrically connected to institute Wiring board main body is stated, the pin groove is arranged at the disjunctor encapsulation part upper end, and the lead includes a motor connection end, The motor connects end line in the groove bottom wall, is electrically connected to when being plugged in the pin groove in order to a motor pin described Motor connection end.
The 56. array camera module according to claim 38, wherein the photosensory assembly includes that at least two motors connect knot Structure, each motor attachment structure includes at least a pin groove and at least a circuit junction, and the circuit junction is electrically connected to institute Wiring board main body is stated, the pin groove is arranged at the disjunctor encapsulation part, and the disjunctor is extended to by the wiring board main body The top of encapsulation part, and the circuit junction is revealed in the pin groove, and the pin groove is plugged in order to a motor pin When be electrically connected to the circuit junction.
The 57. array camera module according to claim 38, wherein the photosensory assembly includes that at least two motors connect knot Structure, each motor attachment structure includes at least one engraving circuit, and the engraving circuit is arranged at the disjunctor encapsulation part, is electrically connected The wiring board main body is connected to, in order to electrically connect a motor pin.
58. array camera modules according to claim 57, wherein the engraved lines road is set in the way of laser formation In the disjunctor encapsulation part.
The 59. array camera module according to claim 38, wherein the array camera module includes an at least support, institute State support and be installed in the photosensory assembly, wherein the array camera module includes at least two optical filters, each optical filter It is installed on the support.
The 60. array camera module according to claim 38, wherein the array camera module includes at least two motors, respectively The camera lens is installed in the corresponding motor, and each motor is installed on the photosensory assembly.
The 61. array camera module according to claim 38, wherein the array camera module includes at least two optical filters, Each optical filter is installed in the photosensory assembly.
The 62. array camera module according to claim 38, wherein the array camera module includes at least two optical filters, Each optical filter is by integral packaging in the corresponding sensitive chip.
CN201620201261.4U 2016-03-12 2016-03-15 Array camera module and its photosensory assembly Active CN206212112U (en)

Priority Applications (28)

Application Number Priority Date Filing Date Title
CN201720663838.8U CN207491068U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
CN201720663335.0U CN207530911U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
CN201720663612.8U CN207491067U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
CN201620201261.4U CN206212112U (en) 2016-03-15 2016-03-15 Array camera module and its photosensory assembly
CN201720663471.XU CN207491066U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
CN201720661019.XU CN207530910U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187029337A KR102193819B1 (en) 2016-03-12 2016-10-28 Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
US15/317,117 US10908324B2 (en) 2016-03-12 2016-10-28 Molded photosensitive assembly of array imaging module
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
EP16894174.8A EP3429181A4 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
TW106108124A TWI703715B (en) 2016-03-12 2017-03-13 Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment
TW106203473U TWM565451U (en) 2016-03-12 2017-03-13 Array camera module and its molded photosensitive element and electronic device
TW106203625U TWM556869U (en) 2016-03-15 2017-03-15 Photographing module and array photographing module based upon integrally packaging technique
TW106108561A TWI648586B (en) 2016-03-15 2017-03-15 Camera module and array camera module based on integrated packaging process
TW107147598A TWI701493B (en) 2016-03-15 2017-03-15 One-piece base assembly, camera module and array camera module based on integrated packaging process
US15/473,573 US9781325B1 (en) 2016-03-12 2017-03-29 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,609 US9906700B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,605 US10033913B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,607 US9826132B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/679,146 US10274694B2 (en) 2016-03-12 2017-08-16 Manufacturing method of a molded photosensitive assembly of an array imaging module
US15/705,225 US10175447B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/705,232 US10126519B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/784,167 US10578837B2 (en) 2016-03-12 2017-10-15 Molded photosensitive assembly for array imaging module for electronic device
US16/737,863 US20200218034A1 (en) 2016-03-12 2020-01-08 Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
US17/114,466 US11822099B2 (en) 2016-03-12 2020-12-07 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof

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CN201720661019.XU Division CN207530910U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
CN201720663838.8U Division CN207491068U (en) 2016-03-15 2016-03-15 Double camera modules and its photosensory assembly and electronic equipment
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CN105681637B (en) * 2016-03-15 2019-12-31 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly and manufacturing method thereof
CN109688301A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Photosensory assembly array and corresponding camera module array
CN109688299A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Camera module array and corresponding unitary substrate
CN109688299B (en) * 2017-10-18 2024-04-09 宁波舜宇光电信息有限公司 Camera module array and corresponding integrated substrate
CN109729241A (en) * 2017-10-27 2019-05-07 宁波舜宇光电信息有限公司 Camera module and its extension wiring encapsulation photosensory assembly and its production method
CN109729242A (en) * 2017-10-27 2019-05-07 宁波舜宇光电信息有限公司 Camera module and its extension cabling encapsulation photosensory assembly, jigsaw component and manufacturing method
CN109729242B (en) * 2017-10-27 2020-10-02 宁波舜宇光电信息有限公司 Camera module, expansion wiring packaging photosensitive assembly thereof, jointed board assembly and manufacturing method
CN109729241B (en) * 2017-10-27 2020-10-02 宁波舜宇光电信息有限公司 Camera module, extended wiring packaging photosensitive assembly thereof and manufacturing method thereof

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