CN107948495B - Subregion formation of image sensitization chip and module, camera device of making a video recording - Google Patents
Subregion formation of image sensitization chip and module, camera device of making a video recording Download PDFInfo
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- CN107948495B CN107948495B CN201810029277.5A CN201810029277A CN107948495B CN 107948495 B CN107948495 B CN 107948495B CN 201810029277 A CN201810029277 A CN 201810029277A CN 107948495 B CN107948495 B CN 107948495B
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- 206010070834 Sensitisation Diseases 0.000 title claims description 14
- 230000008313 sensitization Effects 0.000 title claims description 14
- 230000015572 biosynthetic process Effects 0.000 title claims description 8
- 238000003384 imaging method Methods 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000009826 distribution Methods 0.000 claims description 40
- 238000003466 welding Methods 0.000 claims description 17
- 238000012858 packaging process Methods 0.000 claims description 7
- 238000012806 monitoring device Methods 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 230000009977 dual effect Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The application provides a partitioned imaging photosensitive chip, a camera module and a camera device, wherein the partitioned imaging photosensitive chip comprises a photosensitive chip substrate; and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate. According to the photosensitive chip provided by the invention, the plurality of photosensitive areas are formed on one photosensitive substrate, so that a plurality of photosensitive areas on the same plane can be formed through one-time installation in the production process of the camera module or the camera device, the problem that the plurality of camera modules are not completely consistent due to the inclination when the plurality of photosensitive chips are required to be installed in the plurality of camera modules in the prior art is solved, the imaging quality of the plurality of camera modules can be improved to be consistent, and the final whole imaging quality is higher.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a partitioned imaging photosensitive chip, a camera module and a camera device.
Background
Electronic products including a dual camera module and a quad camera module are getting hotter in the market, and the consumer demand for electronic products including a dual camera module and a quad camera module is also increasing. The electronic product with the double-camera module can divide the function of one lens into two parts, so that the captured picture is clearer, the imaging is more delicate, and the color is more bright. The imaging of the electronic product with the four camera modules is more delicate and bright compared with the imaging of the double camera modules.
But cause a plurality of modules of making a video recording incompletely unanimously easily in the production process of the electronic product of the module of making a video recording among the prior art at present, lead to the relatively poor problem of imaging quality.
Disclosure of Invention
In view of the above, the present invention provides a partitioned imaging photosensitive chip, a camera module and a camera device, so as to solve the problem of poor imaging quality caused by incomplete consistency of multiple camera modules in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a segmented imaging photosensitive chip, comprising:
a light sensing chip substrate;
and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate.
Preferably, the partitioned imaging photosensitive chip is packaged by a CSP packaging process, and a plurality of pads are further disposed on a second surface of the photosensitive chip substrate, the second surface being opposite to the first surface.
Preferably, the distribution of the plurality of bonding pads on the second surface is partitioned, and the distribution of the plurality of bonding pads is arranged corresponding to the distribution of the plurality of photosensitive areas.
Preferably, the distribution of the plurality of pads on the second surface is a mixed distribution.
Preferably, the subregion formation of image sensitization chip adopts COB packaging technology to encapsulate, still be provided with a plurality of welding points on the sensitization chip substrate, the welding point is located the sensitization chip substrate the border region of first surface.
Preferably, the distribution of the plurality of welding points is a subarea distribution, and the distribution of the plurality of welding points is arranged corresponding to the distribution of the plurality of photosensitive areas.
Preferably, the distribution of the plurality of welding points is a mixed distribution.
The invention also provides a camera module which comprises any one of the subarea imaging photosensitive chips and the lenses with the same number as the photosensitive areas;
the photosensitive areas and the lenses are arranged in a one-to-one correspondence mode.
The invention also provides a camera device which comprises the camera module.
Preferably, the camera device is a mobile phone, a tablet computer or a monitoring device.
According to the technical scheme, the partitioned imaging photosensitive chip comprises a photosensitive chip substrate; and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate. According to the photosensitive chip provided by the invention, the plurality of photosensitive areas are formed on one photosensitive substrate, so that a plurality of photosensitive areas on the same plane can be formed through one-time installation in the production process of the camera module or the camera device, the problem that the plurality of camera modules are not completely consistent due to the inclination when the plurality of photosensitive chips are required to be installed in the plurality of camera modules in the prior art is solved, the imaging quality of the plurality of camera modules can be improved to be consistent, and the final whole imaging quality is higher.
The invention also provides a camera module and a camera device, which comprise the partitioned imaging photosensitive chip, so that the imaging quality can be greatly improved.
Simultaneously, because set up the subregion formation of image on a sensitization chip, replace a plurality of sensitization chips among the prior art, in the assembly process of module and camera device of making a video recording, can reduce the equipment time to the equipment is convenient, and packaging efficiency promotes greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic diagram of a dual camera module according to the prior art;
fig. 2 is a schematic structural diagram of a front side of a partitioned imaging photosensitive chip formed by a CSP process according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a back structure of a partitioned imaging photosensitive chip formed by a CSP process according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a backside structure of a partitioned imaging photosensitive chip formed by a CSP process according to another embodiment of the present invention;
fig. 5 is a schematic structural view of a partitioned imaging photosensitive chip formed by a COB process according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a partitioned imaging photosensitive chip formed by another COB process according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a dual camera module according to an embodiment of the present invention.
Detailed Description
Just as the background art part said, cause a plurality of modules of making a video recording incompletely unanimously easily in the production process of the electronic product of many modules of making a video recording among the prior art, lead to the relatively poor problem of imaging quality.
The inventor finds that the above problem occurs because, in the prior art, no matter a double-camera module or a four-camera module or a camera module with more cameras, in the production process, when photosensitive chips are assembled, all the photosensitive chips cannot be completely kept on the same plane due to process errors, and when the assembly angle of one or more photosensitive chips is different from that of other photosensitive chips, an image formed by the camera module corresponding to the photosensitive chip and an image formed by other camera modules cannot be kept consistently in the subsequent synthesis process, thereby resulting in poor imaging quality.
Specifically, please refer to fig. 1, which is a structure of a dual camera module in the prior art, and includes two lenses and two photosensitive chips corresponding to the two lenses, where the photosensitive chip 011 is configured to receive light passing through the lens 02 for imaging, and the photosensitive chip 012 is configured to receive light passing through the lens 03 for imaging, as shown in fig. 1, when the photosensitive chip 011 is installed and tilted, an image formed thereon is distorted, and when a subsequent calculation module synthesizes a final image based on the images on the photosensitive chip 011 and the photosensitive chip 012, the final image will appear unclear and the imaging quality is poor.
Based on this, the invention provides a partitioned imaging photosensitive chip, comprising:
a light sensing chip substrate;
and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate.
The invention provides a subarea imaging photosensitive chip, which comprises a photosensitive chip substrate; and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate. According to the photosensitive chip provided by the invention, the plurality of photosensitive areas are formed on one photosensitive substrate, so that a plurality of photosensitive areas on the same plane can be formed through one-time installation in the production process of the camera module or the camera device, the problem that the plurality of camera modules are not completely consistent due to the inclination when the plurality of photosensitive chips are required to be installed in the plurality of camera modules in the prior art is solved, the imaging quality of the plurality of camera modules can be improved to be consistent, and the final whole imaging quality is higher.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2, a photosensitive chip for area division imaging according to an embodiment of the present invention includes:
a photosensitive chip substrate 11;
the photosensitive chip comprises a plurality of photosensitive areas (12, 13) located on the first surface of the photosensitive chip substrate 11, and the plurality of photosensitive areas (12, 13) are isolated from each other through the photosensitive chip substrate 11.
It should be noted that, in this embodiment, the specific number of the photosensitive areas is not limited, if double-shot is to be implemented, the number of the photosensitive areas on the photosensitive chip is two, and if four-shot is to be implemented, the number of the photosensitive areas on the photosensitive chip may be four, and in actual design, the number of the lenses on the camera module is set according to the number of the lenses, or by designing the optical path, it is also possible to implement that one photosensitive area corresponds to multiple lenses, so as to reduce the setting of the photosensitive areas.
It should be noted that, in this embodiment, the packaging manner of the partitioned imaging photosensitive Chip is not limited, and optionally, as shown in fig. 3, a partitioned photosensitive Chip packaged by using a CSP (Chip Scale Package) packaging process according to an embodiment of the present invention includes a first surface and a second surface that are oppositely disposed, where the first surface is used to form a photosensitive region, and the second surface is used to form a plurality of pads connected to the photosensitive region.
In this embodiment, the distribution manner of the plurality of pads is not limited, and the plurality of pads on the second surface may be distributed in a partition manner or a composite distribution manner. As shown in fig. 3, the distribution of the plurality of pads on the second surface is a partitioned distribution, and the distribution of the plurality of pads is arranged corresponding to the distribution of the plurality of photosensitive regions.
In this embodiment, two photosensitive regions are taken as an example, as shown in fig. 2, the first surface of the substrate of the photosensitive chip includes a first photosensitive region 12 and a second photosensitive region 13, as shown in fig. 3, the photosensitive regions corresponding to the first surface of the photosensitive chip shown in fig. 2 are distributed, and the second surface includes a first bonding pad 14 corresponding to the first photosensitive region 12 and a second bonding pad 15 corresponding to the second photosensitive region 13.
The distribution of the plurality of pads on the second surface may also be a mixed distribution, as shown in fig. 4, and the plurality of pads 16 are mixed on the second surface and are all used to connect the first photosensitive region 12 and the second photosensitive region 13.
The partitioned imaging photosensitive chip in the embodiment of the present invention may also be formed by a COB (chip on Board) process, as shown in fig. 5, for the partitioned imaging photosensitive chip provided in the embodiment of the present invention, the partitioned imaging photosensitive chip includes a photosensitive chip substrate 21, and a third photosensitive region 22 and a fourth photosensitive region 23 located on one surface of the photosensitive chip substrate 21.
It should be noted that, because the chip is formed by the COB process, a plurality of solder joints are further disposed on the photosensitive chip substrate, and the solder joints are located in an edge area of the first surface of the photosensitive chip substrate. And the welding points are connected with the welding points on the circuit board bearing the partitioned imaging photosensitive chip to realize the photosensitive. The circuit board in this embodiment may be a flexible circuit board (FPC) or a Printed Circuit Board (PCB).
Similar to the CSP process, the distribution of the plurality of solder joints on the segmented imaging photosensitive chip formed by the COB process in this embodiment may also be a segmented distribution or a mixed distribution, which is not limited in this embodiment.
When the distribution of a plurality of welding points on the subarea imaging photosensitive chip is subarea distribution, the distribution of the plurality of welding points is correspondingly arranged with the distribution of the plurality of photosensitive areas. As shown in fig. 5, a plurality of first welding points 24 are provided around the corresponding third photosensitive regions 22; a plurality of second welding points 25 are provided around the corresponding fourth photosensitive regions 23. The first and second welding points 24 and 25 control the light sensing functions of the corresponding third and fourth light sensing regions 22 and 23, respectively.
The distribution of the plurality of welding points may also be a mixed distribution, as shown in fig. 6, a plurality of welding points 26 are arranged around the third photosensitive area 22 and the fourth photosensitive area 23, and the plurality of welding points 26 are used to comprehensively control the photosensitive functions of the third photosensitive area 22 and the fourth photosensitive area 23, and how to control the photosensitive functions is specifically described, which is not described in detail in this embodiment, and different settings may be performed according to actual requirements.
The invention provides a subarea imaging photosensitive chip, which comprises a photosensitive chip substrate; and the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated from each other through the photosensitive chip substrate. According to the photosensitive chip provided by the invention, the plurality of photosensitive areas are formed on one photosensitive substrate, so that a plurality of photosensitive areas on the same plane can be formed through one-time installation in the production process of the camera module or the camera device, the problem that the plurality of camera modules are not completely consistent due to the inclination when the plurality of photosensitive chips are required to be installed in the plurality of camera modules in the prior art is solved, the imaging quality of the plurality of camera modules can be improved to be consistent, and the final whole imaging quality is higher.
Another embodiment of the present invention provides a camera module, which includes the partitioned imaging photosensitive chip described in the above embodiment, and lenses having the same number as the photosensitive areas; the photosensitive areas and the lenses are arranged in a one-to-one correspondence mode.
As shown in fig. 7, a schematic structural diagram of a dual-camera module according to an embodiment of the present invention includes a partitioned imaging photosensitive chip 71, a first lens 72, and a second lens 73, wherein the partitioned imaging photosensitive chip 71 faces the first lens 72, and a first photosensitive area 711 is disposed at a position corresponding to the first lens 72; the divisional imaging photosensitive chip 71 faces the second lens 73, and a first photosensitive area 712 is disposed at a position corresponding to the second lens 73.
The photosensitive chip provided by the embodiment of the invention forms a plurality of photosensitive areas on one photosensitive substrate, so that a plurality of photosensitive areas on the same plane can be formed by one-time installation in the production process of the camera module or the camera device, the problem that a plurality of camera modules are not completely consistent due to the inclination when a plurality of photosensitive chips are required to be installed in the plurality of camera modules in the prior art is solved, the imaging quality of the plurality of camera modules can be improved to be consistent, and the final whole imaging quality is higher.
Simultaneously, because set up the subregion formation of image on a sensitization chip, replace a plurality of sensitization chips among the prior art, in the assembling process of the module of making a video recording, can reduce the equipment time to the equipment is convenient, and the packaging efficiency promotes greatly.
The invention also provides a camera device which comprises the camera module, namely a double-camera module with one photosensitive chip corresponding to two lenses.
In this embodiment, the specific structure of the camera device is not limited, and optionally, the camera device may be a currently-used smart phone or tablet computer, or may also be other devices for taking a picture, such as a monitoring device, which is not limited in this embodiment.
The camera device provided by the embodiment of the invention comprises the camera module, so that the imaging quality is greatly improved.
Simultaneously, because set up the subregion formation of image on a sensitization chip, replace a plurality of sensitization chips among the prior art, in camera device's assembling process, can reduce the equipment time to the equipment is convenient, and the packaging efficiency promotes greatly.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A segmented imaging photosensitive chip, comprising:
a photosensitive chip substrate;
the photosensitive areas are positioned on the first surface of the photosensitive chip substrate and are isolated by the photosensitive chip substrate, the photosensitive areas are positioned on the same plane, and the photosensitive areas replace a plurality of photosensitive chips;
the partitioned imaging photosensitive chip is packaged by adopting a CSP packaging process, and a plurality of bonding pads are further arranged on a second surface, opposite to the first surface, of the photosensitive chip substrate;
or, subregion formation of image sensitization chip adopts COB packaging technology to encapsulate, still be provided with a plurality of welding points on the sensitization chip substrate, the welding point is located the sensitization chip substrate the border region of first surface.
2. The subarea imaging photosensitive chip of claim 1, wherein when the subarea imaging photosensitive chip is packaged by a CSP packaging process, the distribution of the plurality of pads on the second surface is subarea distribution, and the distribution of the plurality of pads is arranged corresponding to the distribution of the plurality of photosensitive areas.
3. The subarea imaging photosensitive chip of claim 1, wherein when the subarea imaging photosensitive chip is packaged by a CSP packaging process, the distribution of the plurality of pads on the second surface is a mixed distribution.
4. The chip of claim 1, wherein when the chip is packaged by a COB packaging process, the distribution of the plurality of bonding pads is a partitioned distribution, and the distribution of the plurality of bonding pads is corresponding to the distribution of the plurality of photosensitive areas.
5. The sectional imaging photosensitive chip of claim 1, wherein when the sectional imaging photosensitive chip is packaged by a COB packaging process, the distribution of the plurality of bonding pads is a mixed distribution.
6. A camera module, characterized in that, it comprises the partitioned imaging photosensitive chip of any one of claims 1 to 5, and the number of lenses is the same as the number of the photosensitive areas;
the photosensitive areas and the lenses are arranged in a one-to-one correspondence mode.
7. An image pickup apparatus comprising the image pickup module according to claim 6.
8. The camera device according to claim 7, wherein the camera device is a mobile phone, a tablet computer or a monitoring device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810029277.5A CN107948495B (en) | 2018-01-12 | 2018-01-12 | Subregion formation of image sensitization chip and module, camera device of making a video recording |
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| CN201810029277.5A CN107948495B (en) | 2018-01-12 | 2018-01-12 | Subregion formation of image sensitization chip and module, camera device of making a video recording |
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| CN107948495B true CN107948495B (en) | 2020-11-20 |
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| CN108712600A (en) * | 2018-08-23 | 2018-10-26 | Oppo广东移动通信有限公司 | A kind of camera module and electronic equipment |
| CN108668068A (en) * | 2018-08-23 | 2018-10-16 | Oppo广东移动通信有限公司 | A kind of camera module and electronic equipment |
| CN109981961A (en) * | 2019-05-15 | 2019-07-05 | 德淮半导体有限公司 | A kind of camera module structure and preparation method thereof |
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