CN105206640B - Camera module and assembling method thereof - Google Patents
Camera module and assembling method thereof Download PDFInfo
- Publication number
- CN105206640B CN105206640B CN201510641103.0A CN201510641103A CN105206640B CN 105206640 B CN105206640 B CN 105206640B CN 201510641103 A CN201510641103 A CN 201510641103A CN 105206640 B CN105206640 B CN 105206640B
- Authority
- CN
- China
- Prior art keywords
- image sensor
- metal wire
- sensor chip
- camera module
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides an assembly method of a camera module, which comprises the following steps: providing an image sensor chip with a suspended metal wire, wherein a first end of the metal wire is bonded to a bonding pad of the image sensor chip, and a second end of the metal wire is suspended in the image sensor chip; and assembling the image sensor chip and the lens module to form a standard part, and then electrically connecting and assembling the standard part and the circuit board through the second end of the metal wire to form the camera module.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to an assembling method of a camera module.
Background
Currently, a mainstream packaging method of an Image Sensor (CIS: CMOS Image Sensor) includes: chip Scale Package (CSP), Chip On Board (COB), and Flip Chip (FC).
The CIS CSP is a packaging technology commonly used in middle-low-end and low-pixel (2M pixel or less) image sensors at present, and can adopt a Die level or Wafer level packaging technology. The packaging technology generally uses wafer-level glass and wafer bonding and uses cofferdams to separate the image sensor chips of the wafer, then uses a Through Silicon Via (TSV) technology of making a ring metal connection on the surface of a bonding pad or on the inner hole side of the bonding pad or a T-shaped metal contact chip size packaging technology on the side of the bonding pad after cutting in the bonding pad area of the ground wafer, and makes a Ball Grid Array (BGA) after extending a circuit on the back of the wafer, and then cuts to form the image sensor unit with a single sealed cavity. The rear end forms a module assembly structure by an SMT method. CSP packages, however, have significant problems as follows: 1 influences the product performance: the absorption, refraction, reflection and scattering of light by the thick supporting glass have great influence on the performance of the image sensor, especially small-pixel-size products; 2 reliability problem: the difference in thermal expansion coefficient between the components in the package structure and the sealed gas in the cavity cause reliability problems in the following SMT process or changes in the product use environment; 3, large investment scale, large environmental pollution control requirement, longer production period, higher unit chip cost, and especially for high-pixel large-size image sensor products.
The CIS COB package is a Die Level (chip Level) package technology that is currently and generally applied to high-end and high-pixel products (5M pixels or more) image sensors. According to the packaging technology, a ground and cut chip back side is bonded on a bonding pad of a PCB by using a bonding metal wire, and a bracket and a lens with an IR glass sheet are mounted to form an assembled module structure. However, COB packaging has the following significant problems: 1. the control of the tiny dust is very difficult, an ultrahigh clean room grade is required, and the manufacturing maintenance cost is high; 2. the product design is customized, the period is long, and the flexibility is not enough; 3, the scale production is not easy;
CIS FC packaging recently emerged as a Die Level (chip Level) packaging technology for high-end, high-pixel (5M pixels or more) image sensors. According to the packaging technology, all the contact bumps are connected with the bonding pad at one time under the action of thermosonic action directly by the chip bonding pad which is prepared by grinding and cutting the metal bumps on the bonding pad and the bonding pad of the PCB, so that a packaging structure is formed. And the rear end forms a module assembly structure through a bonding pad or a solder ball on the outer side of the PCB by adopting an SMT method. However, FC packaging is a significant problem as follows: 1 the package has high requirements on a PCB substrate, has a thermal expansion coefficient similar to that of Si, and has high cost; 2, the manufacturing reliability difficulty is very high, the consistency requirement of the connection of all the bumps and the bonding pads of the thermosonic is very high, the bumps and the bonding pads are in hard connection, and the ductility is poor; 3, the control difficulty of the micro-dust is high, the requirement on the process environment is high, and the cost is very high;
further, a conventional method of assembling the CIS module includes:
step 1, welding an image sensor chip on a circuit board to form a first component;
step 2, assembling the lens module and the sleeve module to form a second component;
and 3, assembling the first component and the second component to form a complete camera module.
The assembling method of the camera module has the following defects: for the camera module, the accurate installation of the step 3 can be performed only by using high-precision installation equipment, otherwise, the imaging effect of the camera module is influenced, and the finished product qualification rate of the assembled camera module is not high; especially for the high-pixel camera module, the accurate installation of the step 3 is difficult to be completed well by using common installation equipment, so that the imaging effect of the high-pixel camera module is greatly influenced, the imaging quality of the formed image is poor, and especially the imaging quality of the periphery of the image is obviously poor.
In the image sensor chip packaging process using metal wire bonding, the image sensor chip is usually die-bonded (e.g., adhered) to an interposer (flexible circuit board), then bonding wires are performed, a first end of the metal wire is connected to a pad of the image sensor chip, and a second end of the metal wire is connected to the interposer, so as to electrically connect the image sensor chip and the interposer, and then the packaged image sensor chip is connected to the circuit board through a lead or a solder ball on the interposer.
The traditional wire bonding method easily causes poor structure flexibility after packaging, the subsequent assembly precision requirement of the camera module is high, and the relative position of a lens and an image sensor chip is difficult to control so as to influence the performance of the camera module; and because the flow of current method is longer, and encapsulation efficiency is lower, leads to image sensor chip to expose in the air for a long time, needs many times detection and washing, reduces the yields, increases the cost of camera module. In particular, for some image sensor chips in which the second ends of the metal wires are connected by other processes, a new bonding method and device are needed, so that the first ends of the wires are connected to the bonding pads of the image sensor chip, and the second ends of the wires are suspended outside the image sensor chip.
In summary, a low-cost, high-performance, high-reliability, ultra-thin package structure technology for realizing a high-pixel and large-chip-size image sensor is needed.
Disclosure of Invention
Based on the above consideration, the method for assembling the camera module is provided, and comprises the following steps:
providing an image sensor chip with a suspended metal wire, wherein a first end of the metal wire is bonded to a bonding pad of the image sensor chip, and a second end of the metal wire is suspended in the image sensor chip; the metal wire forms an elastic structure, and the second end of the metal wire is 5-300 microns lower than the lower surface of the image sensor chip;
in the electrical property test process of the standard component, the elastic structure of the metal lead is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal lead and the test device is improved; in the assembling process of the standard component and the circuit board, the elastic structure of the metal lead is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal lead and the circuit board is improved;
and assembling the image sensor chip and the lens module to form a standard part, and then assembling the standard part and the circuit board through the second end of the metal wire to form the camera module.
Preferably, the step of assembling the standard with the circuit board comprises: and electrically connecting the second end of the metal wire with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive bonding mode or a non-conductive adhesive bonding mode.
The invention also provides a camera module manufactured by the assembling method of the camera module, which comprises the following steps:
the image sensor chip is electrically connected with a suspended metal wire, the first end of the metal wire is bonded to a bonding pad of the image sensor chip, and the second end of the metal wire is suspended in the image sensor chip;
the lens module is assembled with the image sensor chip to form a standard part; and the circuit board is connected with the standard component through the second end of the metal lead.
Preferably, the second end of the metal wire is connected with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive bonding mode or a non-conductive adhesive bonding mode.
The assembling method of the camera module can accurately assemble the camera module by using common assembling equipment, overcomes the defect that the assembling method of the camera module in the prior art needs to adopt high-precision assembling equipment, is simple and easy to implement, is easy to adjust the focal plane from the image sensor chip to the lens, is easy to correct the inclination of the lens and the image sensor chip so as to ensure the optical performance of the assembled camera module, and has high-quality imaging effect for the camera module, especially for the camera module with high pixel, so that the imaging quality around the image of the camera module can be obviously improved.
According to the invention, the chip of the image sensor is cut, then the suspended metal wire is formed by bonding the metal wire, the lens module is further assembled on the chip of the image sensor, and then the suspended end of the metal wire is electrically connected with the circuit board, and the metal wire is of an elastic structure, can be elastically deformed, can better improve the electrical performance, and has more process advantages than the SMT connection of a bonding pad, BGA and soldering tin of the traditional CSP.
The gold wire is used for directly connecting the chip and the PCB substrate bonding pad, and has the advantages of good ductility, strong environmental adaptability and good reliability. The lens cone frame can form an open structure with the image sensor chip, effectively reduces stray light of light in the camera module and provides module performance.
Various aspects of the invention will become apparent from the following description of specific embodiments.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.
FIG. 1 is a diagram illustrating an image sensor chip with metal lines suspended therein according to an embodiment of the present invention;
FIG. 2 is a schematic view of a standard according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating an initial state of assembly of the camera module according to the embodiment of the invention;
fig. 4 is a schematic view illustrating an assembled state of a camera module according to an embodiment of the present invention;
fig. 5 is a flowchart of an assembling method of a camera module according to the present invention.
In the drawings, like or similar reference numbers indicate like or similar devices (modules) or steps throughout the different views.
Detailed Description
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
In order to more clearly illustrate the encapsulation method of the present invention, in the following examples, glass is used as a substrate. It will be appreciated by those skilled in the art that the substrate may be formed of other transparent materials.
FIG. 1 is a diagram illustrating an image sensor chip with metal lines suspended therein according to an embodiment of the present invention; FIG. 2 is a schematic view of a standard according to an embodiment of the present invention; fig. 3 is a schematic view illustrating an initial state of assembly of the camera module according to the embodiment of the invention; fig. 4 is a schematic view illustrating an assembled state of a camera module according to an embodiment of the present invention; fig. 5 is a flowchart of an assembling method of a camera module according to an embodiment of the invention.
As shown in fig. 5, with reference to fig. 1 to 4, the packaging method includes the following steps:
first, step S11 is executed: an image sensor chip 110 having a metal wire 120 suspended thereon is provided, wherein a first end 121 of the metal wire 120 is bonded to a pad 111 of the image sensor chip, and a second end 122 is suspended above the image sensor chip 110.
In this step, the front surface of the image sensor chip 110 has an image sensing area 112 and a pad area 113 surrounding the image sensing area 112, and the pad area 113 includes a plurality of pads 111. In this step, the second end of the metal wire 120 is suspended and not bonded with any medium, and the metal wire is a gold wire, a silver wire, a copper wire, and the like, has good wire performance, is of an elastic structure, and can be elastically deformed when acting force is applied to the second end 122;
referring to fig. 2 to 4, step S12: assembling the image sensor chip 110 and the lens module 130 to form a standard part 200, and then assembling the standard part 200 and the circuit board 300 through the second end 122 of the metal wire to form a camera module 400;
in this step, the image sensor chip 110 with suspended metal wires is assembled with the lens module 130, the lens module 130 includes a lens barrel frame 131 (mounting frame) and a lens 132 located inside the lens barrel frame, in an embodiment, the inner surface of the lens barrel frame 131 further has a step 1311, the step 1311 is disposed corresponding to one end of the lens 132 facing the image sensor chip 110, and is suitable for assembling a package substrate 140, the package substrate 140 is made of glass or plastic, and the surface of the package substrate 140 is covered with an IR film or an AR film; in another embodiment, the step 1311 and the package substrate 140 are not provided, and the surface of the lens 132 near the image sensing area 112 is directly covered with an IR film or an AR film.
After the assembly of the image sensor chip 110 and the lens module 130 is completed, the standard component 200 and the circuit board 300 are assembled to form the camera module 400 by the press-fit contact manner, the quick soldering manner, the conductive adhesive manner or the non-conductive adhesive manner of the second end 122 of the metal wire.
Specifically, in the first embodiment, the second end 122 is in good contact with the pad 310 on the circuit board 300 by using a press-fit contact method, and the standard component 200 is fixed to a partial area of the circuit board 300 by using a snap-fit or adhesive method.
In a second embodiment, a rapid welding method is adopted, and the specific method is as follows: plating a gold-tin alloy welding layer on the second end 122 of the metal wire or the welding pad 310 of the circuit board 300, and controlling heat conduction of a welding area through local rapid welding so as not to influence the performance of the lens component;
the method for plating tin alloy on the bonding pad comprises the following steps: s201, providing a camera module, wherein the camera module comprises a lens sensitive to temperature, and a metal wire with one suspended end and electrically connected with an image sensor chip; s203, providing a circuit board with a plurality of welding pads; s205, a solder layer is attached to the bonding pad of the circuit board in advance, and the suspended end of the metal lead and the bonding pad of the circuit board are quickly welded. The metal wire is a gold wire, the diameter of the gold wire is larger than or equal to 10 micrometers, the solder layer is a tin layer, and the thickness of the tin layer is controlled, so that the gold wire and the tin layer can form a stable gold-tin alloy welding layer with high gold content in subsequent rapid local welding. In another embodiment: the step of pre-attaching a solder layer to the land of the circuit board further comprises: s206, solder is attached to the bonding pad of the circuit board by adopting a printing process, and a solder layer is formed by reflow soldering. In another embodiment, the step of pre-attaching the solder layer to the land of the circuit board further comprises: s206' attaching a solder layer on the bonding pad of the circuit board by adopting a wave soldering process. In one embodiment, a method of controlling a thickness of a tin layer includes: and controlling parameters of the wave soldering process to ensure that the thickness of the tin layer is smaller than the diameter of the gold wire. In another embodiment, a method of controlling a thickness of a tin layer includes: and adhering solder paste on a bonding pad of the circuit board by adopting a printing process, forming a solder layer by reflow soldering, and enabling the thickness of the solder layer to be smaller than the thickness of the solder layer by adopting an air knife mode, a suction gun suction mode or a welding head adhesion mode. The thickness of the tin layer is smaller than that of the gold wire, and the gold-tin alloy has good material advantages in the welding process, can reduce the crystal brittleness, and has the characteristics of good fluidity, low resistivity and good heat conductivity. The rapid welding includes: the camera module comprises a pulse hot-press welding process, a laser welding process and an ultrasonic hot-press welding process, wherein rapid welding is a local welding mode, and the heating range is smaller than 1/2 of the area of the bottom of the camera module.
(II) plating a gold-tin alloy on the second end 122 of the metal wire, and S101 providing a camera module, wherein the camera module comprises a lens sensitive to temperature and a metal wire with one suspended end and electrically connected with the image sensor chip; s103, providing a circuit board with a plurality of welding pads; and S105, attaching a solder layer to the suspended end of the metal wire in advance, and quickly welding the suspended end of the metal wire and a bonding pad of the circuit board. The metal wire is a gold wire, the diameter of the gold wire is larger than or equal to 10 micrometers, the solder layer is a tin layer, and the thickness of the tin layer is controlled, so that the gold wire and the tin layer can form a stable gold-tin alloy welding layer with high gold content (rich in gold) in subsequent rapid local welding, wherein the thickness of the tin layer is smaller than that of the gold wire, and the gold-tin alloy has good material advantages in the welding process, can reduce crystal brittleness, and has the characteristics of good fluidity, low resistivity and good heat conductivity. The rapid welding includes: the camera module comprises a pulse hot-press welding process, a laser welding process and an ultrasonic hot-press welding process, wherein rapid welding is a local welding mode, and the heating range is smaller than 1/2 of the area of the bottom of the camera module.
In the third embodiment, a conductive adhesive bonding manner is adopted, specifically, conductive adhesive is adhered to the free end of the metal wire in advance, in this embodiment, the conductive adhesive is silver paste, and the free end of the metal wire and the pad of the circuit board are cured to be electrically connected. The silver paste has good adhesiveness and conductivity, can be used as point electrode paste, and still has good performance after being cured according to controllability. The metal wire is a gold wire, the diameter of the gold wire is more than or equal to 5 micrometers, and the thickness of the silver paste is 2 micrometers to 100 micrometers. The curing mode is carried out by adopting a thermal curing mode or a UV curing mode. The silver paste in the embodiment comprises the following components: epoxy glue or UV glue, and the mixture of tiny silver piece, the thickness of silver thick liquid is: 2 microns to 100 microns. In addition, it is also possible to employ: silver paste is adhered to the bonding pad of the circuit board in advance, and the suspended end of the metal lead and the bonding pad of the circuit board are solidified and electrically connected. The silver paste has good adhesiveness and conductivity, can be used as point electrode paste, and still has good performance after being cured according to controllability. The metal wire is a gold wire, the diameter of the gold wire is more than or equal to 5 micrometers, and the thickness of the silver paste is 2 micrometers to 100 micrometers. The curing mode is carried out by adopting a thermal curing mode or a UV curing mode. The silver paste in the embodiment comprises the following components: epoxy glue or UV glue, and the mixture of tiny silver piece, the thickness of silver thick liquid is: 2 microns to 100 microns. In this embodiment, the conductive adhesive may also be made of other metal materials with conductive performance.
In the fourth embodiment, a non-conductive adhesive is used, but the second ends 122 of the metal wires are in good electrical contact with the pads of the circuit board.
After the standard component 200 is formed, the standard component 200 may be tested, and in the electrical test process of the standard component 200, the elastic structure of the metal wire 120 is elastically deformed to provide a contact pressure, and since the second end 122 of the metal wire is 5 to 300 micrometers lower than the lower surface of the image sensor chip 110 (see fig. 1, the distance is h), the connection performance between the metal wire 120 and a test apparatus (not labeled) is improved; in the assembly process of the standard component 200 and the circuit board 300, the elastic structure of the metal wire 120 is elastically deformed to provide a contact pressure, and since the second end 122 of the metal wire is 5 to 300 micrometers lower than the lower surface of the image sensor chip 110 (see fig. 1, distance h), the connection performance between the metal wire and the circuit board can be improved. Referring to fig. 4, a broken line 120' in fig. 4 shows a first shape state of the metal wire 120 when the standard component 200 is not assembled with the circuit board 300; the solid line 120 ″ shows the second shape state of the metal wire after the assembly of the standard component 200 and the circuit board 300 is completed, and the second shape state of the metal wire is elastically deformed, so that the second end of the metal wire is in good contact with the pad, which is beneficial to signal transmission, and the contact area between the second end and the pad is greater than or equal to 0.01 square millimeter.
The present invention also provides a camera module, which comprises: the image sensor chip is electrically connected with a suspended metal wire, the first end of the metal wire is bonded to a bonding pad of the image sensor chip, and the second end of the metal wire is suspended in the image sensor chip; the lens module is assembled with the image sensor chip to form a standard part; and the circuit board is connected with the standard component through the second end of the metal lead. The metal wire forms an elastic structure and the second end of the metal wire is 5-300 microns lower than the lower surface of the image sensor chip. The second end of the metal lead is connected with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive bonding mode or a non-conductive adhesive bonding mode. It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it will be obvious that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Several elements recited in the apparatus claims may also be implemented by one element. The terms first, second, etc. are used to denote names, but not any particular order.
Claims (4)
1. The assembling method of the camera module is characterized by comprising the following steps of:
providing an image sensor chip with a suspended metal wire, wherein a first end of the metal wire is bonded to a bonding pad of the image sensor chip, and a second end of the metal wire is suspended in the image sensor chip; the metal wire forms an elastic structure, and the second end of the metal wire is 5-300 microns lower than the lower surface of the image sensor chip;
assembling the image sensor chip and a lens module to form a standard part, and then assembling the standard part and a circuit board through a second end of the metal wire to form a camera module;
in the electrical property test process of the standard component, the elastic structure of the metal lead is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal lead and the test device is improved; in the assembling process of the standard component and the circuit board, the elastic structure of the metal lead is elastically deformed to provide contact pressure, so that the electrical connection performance of the metal lead and the circuit board is improved.
2. The method of assembling a camera module of claim 1, wherein the step of assembling the standard with a circuit board comprises: and electrically connecting the second end of the metal wire with the circuit board in a pressing contact mode, a quick welding mode, a conductive adhesive bonding mode or a non-conductive adhesive bonding mode.
3. A camera module manufactured by the assembling method of a camera module according to claim 1, comprising:
the image sensor comprises an image sensor chip, a first conductive wire and a second conductive wire, wherein the image sensor chip is electrically connected with a suspended metal wire, and the first end of the metal wire is bonded with a bonding pad of the image sensor chip;
the lens module is assembled with the image sensor chip to form a standard part;
a circuit board electrically connected to the standard via the second end of the metal wire.
4. The camera module of claim 3, wherein the second end of the metal wire is connected to the circuit board by a press contact method, a quick soldering method, a conductive adhesive bonding method or a non-conductive adhesive bonding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510641103.0A CN105206640B (en) | 2015-10-08 | 2015-10-08 | Camera module and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510641103.0A CN105206640B (en) | 2015-10-08 | 2015-10-08 | Camera module and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105206640A CN105206640A (en) | 2015-12-30 |
| CN105206640B true CN105206640B (en) | 2020-04-21 |
Family
ID=54954209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510641103.0A Active CN105206640B (en) | 2015-10-08 | 2015-10-08 | Camera module and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105206640B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704354B (en) * | 2016-03-12 | 2019-07-05 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and manufacturing method |
| US10750071B2 (en) | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
| CN105744130B (en) * | 2016-03-12 | 2019-10-18 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and manufacturing method |
| CN107301988B (en) * | 2017-05-27 | 2023-06-13 | 格科微电子（上海）有限公司 | Camera module and assembly method thereof |
| CN109560090A (en) * | 2017-09-26 | 2019-04-02 | 格科微电子（上海）有限公司 | The encapsulating structure of imaging sensor |
| CN109698896A (en) * | 2017-10-24 | 2019-04-30 | 格科微电子（上海）有限公司 | Camera module and its electrical connection methods |
| CN107948495B (en) * | 2018-01-12 | 2020-11-20 | 信利光电股份有限公司 | Subregion formation of image sensitization chip and module, camera device of making a video recording |
| CN110661963A (en) * | 2018-06-28 | 2020-01-07 | 格科微电子（上海）有限公司 | Method for realizing optical anti-shake of camera module |
| CN109348105B (en) * | 2018-10-30 | 2021-01-08 | 维沃移动通信（杭州）有限公司 | Camera module and mobile terminal |
| WO2021184279A1 (en) * | 2020-03-19 | 2021-09-23 | 南昌欧菲光电技术有限公司 | Camera module and electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000113951A (en) * | 1998-10-08 | 2000-04-21 | Shin Etsu Polymer Co Ltd | Electric connector and its manufacture |
| CN1289146A (en) * | 1999-09-20 | 2001-03-28 | 日本电气株式会社 | Semiconductor and method for producing same |
| CN1372355A (en) * | 2001-02-19 | 2002-10-02 | 株式会社鼎新 | Contact structure with silicone grease contact point and general laminated structure using same |
| CN2757328Y (en) * | 2004-12-01 | 2006-02-08 | 资重兴 | Press type application combining device of package chip |
| CN103996684A (en) * | 2014-05-20 | 2014-08-20 | 格科微电子（上海）有限公司 | Image sensor structure and packaging method thereof |
| CN104966724A (en) * | 2015-06-15 | 2015-10-07 | 格科微电子（上海）有限公司 | Method for configuring camera module to terminal mainboard and terminal equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7371676B2 (en) * | 2005-04-08 | 2008-05-13 | Micron Technology, Inc. | Method for fabricating semiconductor components with through wire interconnects |
| JP2012222546A (en) * | 2011-04-07 | 2012-11-12 | Sony Corp | Solid-state imaging device, method for manufacturing the same, and electronic apparatus |
-
2015
- 2015-10-08 CN CN201510641103.0A patent/CN105206640B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000113951A (en) * | 1998-10-08 | 2000-04-21 | Shin Etsu Polymer Co Ltd | Electric connector and its manufacture |
| CN1289146A (en) * | 1999-09-20 | 2001-03-28 | 日本电气株式会社 | Semiconductor and method for producing same |
| CN1372355A (en) * | 2001-02-19 | 2002-10-02 | 株式会社鼎新 | Contact structure with silicone grease contact point and general laminated structure using same |
| CN2757328Y (en) * | 2004-12-01 | 2006-02-08 | 资重兴 | Press type application combining device of package chip |
| CN103996684A (en) * | 2014-05-20 | 2014-08-20 | 格科微电子（上海）有限公司 | Image sensor structure and packaging method thereof |
| CN104966724A (en) * | 2015-06-15 | 2015-10-07 | 格科微电子（上海）有限公司 | Method for configuring camera module to terminal mainboard and terminal equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105206640A (en) | 2015-12-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105206640B (en) | Camera module and assembling method thereof | |
| CN107301988B (en) | Camera module and assembly method thereof | |
| US10032824B2 (en) | Image sensor structure and packaging method thereof | |
| CN205621732U (en) | Many cameras module | |
| JP5732286B2 (en) | Manufacturing method of semiconductor device | |
| JP5757852B2 (en) | Imaging module and imaging unit | |
| JP2007288755A (en) | Camera module | |
| JP2008092417A (en) | Semiconductor imaging element, its manufacturing method, semiconductor imaging apparatus, and semiconductor imaging module | |
| CN111498791A (en) | Micro-electro-mechanical system packaging structure and manufacturing method thereof | |
| CN106024823B (en) | Packaging method of CMOS image sensor | |
| CN104811889B (en) | Assembling method of MEMS microphone packaging device | |
| JP5795411B2 (en) | Semiconductor device | |
| JP2009521798A (en) | Semiconductor package, manufacturing method thereof, and semiconductor package module for image sensor | |
| KR100868616B1 (en) | Semiconductor flip-chip package component and fabricating method | |
| JP2006080477A (en) | Flip chip packaging/manufacturing method, and device thereof | |
| CN105633108B (en) | Multi-camera module and assembly method thereof | |
| KR100653551B1 (en) | A manufacture method of a chip scale package of a image sensor using a supersonic junction | |
| CN105390517B (en) | Testing method and testing device for camera module | |
| US8900926B2 (en) | Chip package method | |
| US20170053856A1 (en) | Semiconductor die attachment with embedded stud bumps in attachment material | |
| CN107359173B (en) | Assembling method of image sensor module | |
| CN109860211B (en) | Packaging method of image sensor | |
| CN105633108A (en) | Multi-camera module and assembling method therefor | |
| KR20020061221A (en) | semiconductor package and manufacturing method the same | |
| CN107994039B (en) | Wafer level packaging method of CMOS image sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |