KR20070066782A - Camera module package using two-layered fpcb and manufacturing method thereof - Google Patents

Abstract

A camera module package using a two-layered FPCB(Flexible Printed Circuit Board) and a method for manufacturing the camera module package are provided to reduce the manufacturing cost and the number of manufacturing processes by constructing the camera module package using a single two-layered FPCB. A camera module package includes a housing(20) having a lens, a two-layered FPCB, and a guide(40). The two-layered FPCB is combined with the housing and includes a window for capturing an image from the lens of the housing, an IR(Infrared Ray) cut filter, an image sensor, and a connector. The IR cut filter is upwardly attached to a portion of the two-layered FPCB which corresponds to the window. The image sensor is attached to the two-layered FPCB through flip chip bonding. The connector is mounted on the side of the two-sided FPCB which is opposite to the side to which the image sensor is attached. The guide bends the portion of the two-layered FPCB on which the connector is mounted such that the connector faces downward, is located under the image sensor and fixes the bent portion.

Description

Camera module package using double-sided FPC and manufacturing method {CAMERA MODULE PACKAGE USING TWO-LAYERED FPCB AND MANUFACTURING METHOD THEREOF}

1 is a view showing a COB type lens unit and a connector detachable module of a conventional camera module package.

Figure 2 is a view showing a socket type module of a conventional camera module package.

3 is a view showing a camera module package using a double-sided FPCB according to the present invention.

4 is an exploded view of a camera module package using a double-sided FPCB according to the present invention.

Figure 5 is a side view showing a state before the camera module package folded by the guide means according to the present invention.

6 is a process chart showing a camera module package manufacturing method using a double-sided FPCB according to the present invention.

<Description of Major Symbols in Drawing>

10: Lens Barrel 20: Housing

30: image sensor module 31: double-sided FPCB (Two-Layered Flexible Printed Circuit Board)

32: Window 33: Image sensor

34: IR cut filter

40: guide 41: upper surface

42: side leg 43: inner protrusion

50: connector

The present invention relates to a camera module package and a method for manufacturing the same used in a digital camera, a mobile device or various monitoring apparatuses, and more specifically, to manufacture a more compact camera module while reducing the cost and the number of processes according to the module production. The present invention relates to a mobile camera module package using a double-sided FPCB and a method of manufacturing the same.

Recently, due to the rapid development of information and communication technology, the improvement of data communication speed and the increase of data communication amount are realized, and the imaging devices such as CCD image sensor and CMOS image sensor are mounted on mobile electronic devices such as mobile phones and laptops. It is spread | distributing and these can transmit the image data image | photographed by the camera module besides the text data by real-time process.

In general, the packaging method of an image sensor for a camera includes a flip-chip (Chip On Flim) method, a wire bonding method of a chip on board (COB) method, and a chip scale package (CSP) method. Among them, a COF packaging method and a COB packaging method are widely used.

In particular, the bump-based COF method, which has an external projecting joint, does not require a space for attaching the wire, as compared to the COB method, which reduces the package area and reduces the height of the barrel. have. In addition, since a thin film or flexible printed circuit board (FPCB) is used, a reliable package that can withstand external shocks is possible, and the process is relatively simple. In addition, the COF system meets the trend of high-speed processing, high density, and multipinning of signals due to miniaturization and resistance reduction.

However, the COF method is concentrated in the smallest and lightest chip size wafer level package, but the process cost is high and the delivery time is unstable, and thus there is a limitation for the image sensor. In addition, the module miniaturization, which is an advantage of the COF method, cannot be used in a module that uses a mega-level or higher sensor, in which a variety of functions are added due to the single-layer structure. There was no. Currently, a double-sided flexible printed circuit board (FPCB) can be used to have a size similar to that of the COB method, but since it is less than the miniaturization of the above-described COF method, the COB method is gradually used. Design and process technology development is required to take advantage of the miniaturization of the advantage.

Then, with reference to the accompanying drawings will be described with respect to the conventional camera module including a connector portion and its problems, the mobile camera module that is generally used, as shown in Figures 1 and 2 respectively. It has the same structure. Here, FIG. 1 shows a detachable module of a lens unit and a connector unit of a conventional camera module, and FIG. 2 shows a socket type module of a conventional camera module.

First, the lens unit and the connector unit detachable camera module illustrated in FIG. 1 are largely connected to the lens unit 101 and the connector unit 103 and the FPCB for connecting the lens unit 101 and the connector unit 103 to each other. 102). In the detachable camera module, the substrate in the lens unit 101 and the image sensor attached to the substrate are configured as rigid PCBs for the application of a wire bonding type chip on board (COB) packaging method. The configuration of the connection FPCB 112 is essentially required for the interface. Similarly, the substrate used for the connector portion 103 is also composed of a rigid PCB and a connector is attached to the lower surface of the PCB.

However, such a lens unit and a connector unit detachable camera module, if the fixed type that the camera module does not rotate in the mobile phone, the connector unit 103 and the connection FPCB 102 connected to the connector unit 103 is There is a problem that the size of the entire module is increased by occupying unnecessary space, and there is a problem that the unit cost of the entire module is increased due to the use of the connection FPCB 102. In addition, due to the use of the FPCB 102 for the connection, there is a problem that the electrical characteristics such as signal lines are prolonged and vulnerable to ESD.

Next, a commonly used socket type camera module may be divided into a bottom contact type and a side contact type, and FIG. 2 illustrates an example of a bottom contact socket type camera module. Is shown. 2A is a perspective view of such a bottom contact socket type camera module, and FIG. 2B shows a bottom view of the bottom contact socket type camera module.

In FIG. 2B, a substrate 202 having an image sensor mounted by a COB packaging method of a wire bonding method is coupled to a lower end of the lens unit 201, and the lens unit 201 is a socket on a user side (not shown). It is fitted in the fastening method. On the other hand, the socket contact portion 203 formed on the lower surface of the substrate 202 is in contact with the socket terminal on the user side.

However, such a socket-type camera module has a problem in that the outer shell of the PCB must be designed differently for each socket specification, and a user has to use an expensive socket. In particular, in the case of the side contact type, there is a problem that the cost of the PCB increases with the difficulty of the design.

On the other hand, according to the COF type module of the conventional camera module package, it is typically packaged using a ONE-LAYERED FPCB. In the conventional COF type module, since the module was formed using the single-sided FPCB, the pattern layer formed on the single-sided FPCB was unable to conduct electrical conduction up and down. As a result, a connector for electrical conduction with the motherboard and the like has to be mounted on the same surface where the image sensor is flip-chip bonded. As a result, the part where the image sensor is located (same as the housing part) and the connector are positioned. There was a problem in that the portion occupied by the separate portion of the camera module as a whole.

Therefore, the present invention was devised to solve the above-described problems, and by reducing the cost and the number of steps due to the module package fabrication compared to the conventional one by constructing a camera module using a single-sided FPCB, the pattern layer is capable of conducting up and down. It is an object of the present invention to provide a method for manufacturing a camera module package.

In addition, by constructing a camera module using one double-sided FPCB, it is possible to manufacture a camera module of a more compact size, and the signal line is very shorter than the conventional one, so that electrical characteristics such as vulnerability to ESD, which is a problem in the prior art, are improved. The purpose is to provide a camera module package that can be used.

Camera module package using a double-sided FPCB according to the present invention to achieve the above object, the lens unit is mounted; Is coupled to the housing, a window window for capturing an image passing through the lens portion of the housing is formed on one side, the IR cut filter is attached to a position corresponding to the window window facing upward, and corresponds to the window window A double-sided FPCB attached in a flip chip type such that the image sensor is directed downward in a position where the image sensor is attached, and a connector mounted on the other side of the image sensor on the opposite side to the surface; And a guide for aligning the double-sided FPCB portion in which the connector is mounted among the double-sided FPCBs so that the connector is positioned below the attachment position of the image sensor while facing downward, and fixing the folded double-sided FPCB portion.

Here, the guide is formed integrally with the housing, or characterized in that formed in a separate member from the housing.

On the other hand, the camera module package manufacturing method using a double-sided FPCB according to the present invention in order to achieve the above object, a window for receiving light in the image sensor is formed, the bottom surface is formed on the pad side for flip-chip bonding the image sensor Providing a double-sided FPCB having a pattern for mounting a connector on the other side of the upper surface; Attaching an image sensor from a lower surface direction of the double-sided FPCB to electrically connect with a pad formed on one side of the lower surface of the double-sided FPCB; Mounting a connector from an upper surface direction of the double-sided FPCB to electrically connect the pattern formed on the other side of the upper surface of the double-sided FPCB; Coupling a housing including a double-sided FPCB including the image sensor and the connector and a lens unit to an outer circumferential surface of the IR cut filter attached to the double-sided FPCB as a guide surface; Folding a double-sided FPCB portion in which the connector is mounted among the double-sided FPCBs, and aligning the connectors so that the connector is positioned below the attachment position of the image sensor while facing downward; And fixing the folded double-sided FPCB portion with a guide.

Camera Module Package

First, the camera module package according to the present invention will be described with reference to FIGS. 3 to 5.

3A to 3C are respectively a perspective view, a front view and a rear view of a camera module package according to the present invention, FIG. 4 is an exploded perspective view of the camera module package according to the present invention, and FIG. 5 is a camera module package according to the present invention. It is a side view which shows the state before folding by a guide means. On the other hand, in the camera module package according to the present invention, a plurality of lenses may be mounted directly inside the housing, or a lens barrel equipped with a plurality of lenses may be combined with the housing. Hereinafter, a case in which a lens barrel equipped with a plurality of lenses is combined with a housing will be described.

The lens barrel 10 functions as a lens holder and is typically formed of a resin such as polycarbonate or the like, and has apertures and condensing on the bottom side inserted into the housing 20. A lens or the like is installed. The aperture defines a passage of light passing through the condenser lens, and the condenser lens receives light passing through the aperture to the light receiving portion of the image sensor 33 element described later. IR coated glass is adhered to the upper surface of the lens barrel 10 to prevent foreign matter from penetrating into the aperture or the condenser lens.

The housing 20 is formed with an upper opening and a lower opening, and is coupled to the lens barrel 10 at the upper opening and to the image sensor module 30 at the lower opening. In addition, the housing 20 has a cylindrical shape at the top and a rectangular frame at the bottom, and can be coupled to the upper cylinder portion of the housing 20 through the through hole of the guide 40 to be described later. On the other hand, such a coupling method that will be apparent to those skilled in the art according to the specific shape of the guide 40, it will be apparent that the housing 20 and the guide 40 may be formed in an integrally formed combination. The structure of the specific guide 40 is mentioned later.

The image sensor module 30 coupled to the lower opening of the housing 20 includes a double-sided FPCB 31 having a window window 32 through which light passing through the lens unit can pass, and the window window 32. And an image sensor 33 attached to the double-sided FPCB 31 to receive and process the light passing through it.

As shown in FIG. 5, the double-sided FPCB 31 has a pad for flip chip bonding the image sensor 33 on one side thereof, and a pattern for mounting the connector 50 on the other side thereof. Is formed. Accordingly, the image sensor 33 is attached from the lower surface direction of the double-sided FPCB 31 so as to be electrically connected to the pad formed on one side of the lower surface of the double-sided FPCB 31, and on the other side of the upper surface of the double-sided FPCB 31. The connector 50 is mounted from the upper surface direction of the said double-sided FPCB 31 so that it may electrically connect with the formed pattern. That is, as the FPCB applied to the present invention, since the pattern layer adopts the configuration of one double-sided FPCB 31 capable of electrical conduction up and down, the image sensor 33 and the other surface of the double-sided FPCB 31 are different. It is possible to attach and mount the connector 50, respectively.

Here, the image sensor 33 is attached to the pad formed on one side of the lower surface of the double-sided FPCB 31 from the lower surface of the double-sided FPCB 31 and formed on the other side of the upper surface of the double-sided FPCB 31. The reason why the connector 50 is mounted from the upper surface direction of the double-sided FPCB 31 so as to be electrically connected to the pattern is that the double-sided FPCB portion on which the connector 50 is mounted is folded out of the double-sided FPCB 31. This is to align so as to be positioned below the attachment position of the image sensor 33 while facing downward.

That is, by folding the double-sided FPCB portion in which the connector 50 is mounted among the double-sided FPCB 31 so that the connector 50 faces downward, it is positioned directly below the attachment position of the image sensor 33. Since the space occupied by the connection FPCB and the connector part can be removed, not only the module can be miniaturized but also the problem that the cost of the entire module increases due to the use of a separate additional connection FPCB. In addition, in the present invention, since a signal line such as the FPCB for connection is very short, it is possible to solve the problem of deterioration of electrical characteristics such as weakening of ESD, which has conventionally occurred.

On the other hand, the upper surface of the double-sided FPCB 31 is attached to the IR cut filter 34 machined to the size of the inner peripheral surface of the lower opening of the housing, the outer peripheral surface of the IR cut filter 34 as a coupling guide surface to the outer peripheral surface The inner circumferential surfaces of the lower opening of the housing including the lens portion are sealed to each other in such a manner that the inner circumferential surfaces are in close contact with each other.

The image sensor 33 is attached to the lower surface of the FPCB 31, a pixel area for receiving light received from the condensing lens of the lens unit 10 and performing photoelectric conversion, and a signal generated by the light receiving unit. Can be configured as a signal processing unit (ISP) such as for transmitting as image data. A plurality of electrode pads (not shown) are formed on a bottom surface of the FPCB 31, and bumps are formed on the electrode pads. In this case, when the image sensor 33 is attached to the COF flip chip method, bumps and anisotropic conductive films (ACFs) or non-conductive pastes (NCPs) or protrusions protruding from the outer surface of the electrode pads may be used. It adheres using a non-conductive film (NCF). The bump may be configured of any one of a stud type bump, an electroless bump, and an electrolytic bump. Since the stud type bump may reduce the height of the bump during flip chip pressurization, the step between ceramic leads may be improved. It is also advantageous in terms of improving the reliability of the product.

As described above, the guide 40 folds the double-sided FPCB portion in which the connector 50 is mounted among the double-sided FPCBs 31 so that the connector 50 faces downward and attaches the image sensor 33. It is arranged to be located below the position and serves to secure the folded double-sided FPCB portion.

The guide 40, as shown in Figure 4, consists of a rectangular parallelepiped-shaped frame, the upper surface 41 is perforated so that the upper cylinder portion of the housing 20 can be coupled and the upper surface 41 A side leg portion 42 extending downward from the side is formed. An end portion of the side leg portion 42 is formed with a protrusion 43 protruding inward to support and fix the folded FPCB portion. Due to the inner protrusion 43, the connector 50 is directed downward in the guide 40 even when the double-sided FPCB portion of the double-sided FPCB 31 on which the connector 50 is mounted is folded. It can be fixed to be located directly below the attachment position of the sensor (33).

Meanwhile, the guide 40 is not limited to the above-described detailed configuration and shape, and the guide 40 may be fixed if the connector 50 is fixed to a predetermined position inside the guide 40. It should be noted that may be designed in a free shape, such as molded integrally with the housing.

Manufacturing Method of Camera Module Package

Hereinafter, a method of manufacturing a camera module package according to the present invention will be described with reference to FIG. 6. 6 is a process chart showing a camera module package manufacturing method using a double-sided FPCB according to the present invention.

First, as shown in FIG. 6 (a), a window window 32 is formed to receive light from the image sensor 33, and a pad for flip chip bonding the image sensor 33 is formed on one side of the bottom surface. Then, a double-sided FPCB 31 having a pattern for mounting the connector 50 on the other side of the upper surface is prepared. Here, the length of the double-sided FPCB 31 is set to the minimum length that the connector 50 can be located directly below the image sensor 33 attaching position when the double-sided FPCB portion including the connector unit is later folded. It is desirable to. As described above, the image sensor 33 is attached from the lower surface direction of the double-sided FPCB 31 so as to be electrically connected to the pad formed on one side of the lower surface of the double-sided FPCB 31, and The reason for mounting the connector 50 from the upper surface direction of the double-sided FPCB 31 so as to electrically connect with the pattern formed on the other side of the upper surface is to fold the double-sided FPCB portion in which the connector 50 is mounted in the double-sided FPCB 31. This is to align the connector 50 to be positioned below the attachment position of the image sensor 33 while facing downward.

Next, as shown in Figure 6 (b), after cutting the image sensor wafer to prepare a unit image sensor 33 of a predetermined size, and to electrically connect with the pad formed on one side of the lower surface of the double-sided FPCB (31) The image sensor 33 is attached from the lower surface direction of the double-sided FPCB 31. The attachment is performed by pressing the rear surface of the image sensor 33 and the FPCB 31 with the bonding means interposed therebetween, the adhesion between the rear surface of the FPCB 31 and the image sensor 33. As a means, any one of the group consisting of anisotropic conductive film (ACF), non-conductive film (NCF) and non-conductive paste (NCP) may be inserted and then pressed and attached.

Then, as shown in Figure 6 (c), after preparing the connector 50 for electrically energizing the motherboard, the connector 50 to electrically connect with the pattern formed on the other side of the upper surface of the double-sided FPCB (31). ) Is mounted from the upper surface direction of the double-sided FPCB 31.

Then, as shown in Fig. 6 (d), the IR cut filter 34 to serve only as a visible light from the incident light passing through the lens portion, and at the same time serves as a coupling guide surface for coupling with the housing described later. To one side of the upper surface of the double-sided FPCB (31). Of course, the IR cut filter 34 may be attached before the step performed previously.

Thereafter, as shown in FIG. 6 (e), the double-sided FPCB 31 including the image sensor 33 and the connector 50 and the housing including the lens unit are combined.

Thereafter, as shown in FIG. 6 (f), the double-sided FPCB portion of the double-sided FPCB 31 on which the connector 50 is mounted is folded so that the connector 50 faces downward and the image sensor 33. Align it so that it is located under the attachment position of. As described above, the double-sided FPCB portion of the double-sided FPCB 31 on which the connector 50 is mounted is folded so that the connector 50 faces downwardly outside the assembly and directly below the attachment position of the image sensor 33. Since the space occupied by the conventional connection FPCB and the connector portion can be removed, the module can be miniaturized and the unit cost of the entire module increases due to the use of a separate additional connection FPCB. In addition, in the present invention, since a signal line such as the connection FPCB becomes very short, it is possible to solve the problem of deterioration of electrical characteristics such as weakness in the conventional ESD.

Finally, as shown in Figure 6 (g), by combining the guide 40 member with the housing to secure the folded double-sided FPCB portion by a fixing means such as a projection of the guide 40, according to the present invention This completes the manufacture of the camera module package.

Although preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

As described above, according to the method of manufacturing a camera module package using the double-sided FPCB of the present invention, by using a single-sided FPCB with a pattern layer capable of conducting up and down, it is possible to reduce the cost and the number of steps due to the production of the module package compared with the conventional It can be effective.

In addition, according to the camera module package using the double-sided FPCB of the present invention, it is possible to manufacture a camera module of a more compact size by configuring the camera module using a single-sided FPCB, and also because the signal line is very short compared to the conventional The electrical characteristics such as vulnerability to ESD, which is a problem in the prior art, are created.

Claims (4)

A housing equipped with a lens unit; A window window coupled to the housing and configured to capture an image passing through the lens part of the housing is formed at one side thereof, and an IR cut filter is attached to a position corresponding to the window window so as to face upward, and corresponding to the window window. A double-sided FPCB attached in a flip chip type such that an image sensor is directed downward in a position and a connector mounted on the other side thereof on an opposite surface to which the image sensor is attached; And A guide for folding the double-sided FPCB portion in which the connector is mounted among the double-sided FPCBs so that the connector is positioned below the attachment position of the image sensor while facing downward, and fixing the folded double-sided FPCB portion; Camera module package using a double-sided FPCB including. The method of claim 1, The guide is a camera module package using a double-sided FPCB, characterized in that molded integrally with the housing. The method of claim 1, The guide is a camera module package using a double-sided FPCB, characterized in that formed as a separate member from the housing. Providing a double-sided FPCB having a window for receiving light in the image sensor, a pad for flip chip bonding the image sensor on one side thereof, and a pattern for mounting a connector on the other side thereof; Attaching an image sensor from a lower surface direction of the double-sided FPCB to electrically connect with a pad formed on one side of the lower surface of the double-sided FPCB; Mounting a connector from an upper surface direction of the double-sided FPCB to electrically connect the pattern formed on the other side of the upper surface of the double-sided FPCB; Coupling a housing including a double-sided FPCB including the image sensor and the connector and a lens unit to an outer circumferential surface of the IR cut filter attached to the double-sided FPCB as a guide surface; Folding a double-sided FPCB portion in which the connector is mounted among the double-sided FPCBs, and aligning the connectors so that the connector is positioned below the attachment position of the image sensor while facing downward; And Securing the folded double-sided FPCB portion with a guide; Camera module package manufacturing method using a double-sided FPCB comprising a.

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