CN107948495A - One kind is divided into as sensitive chip and camera module, camera device - Google Patents
One kind is divided into as sensitive chip and camera module, camera device Download PDFInfo
- Publication number
- CN107948495A CN107948495A CN201810029277.5A CN201810029277A CN107948495A CN 107948495 A CN107948495 A CN 107948495A CN 201810029277 A CN201810029277 A CN 201810029277A CN 107948495 A CN107948495 A CN 107948495A
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- sensitive chip
- camera
- divide
- photosensitive
- distribution
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- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000009826 distribution Methods 0.000 claims description 28
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000012536 packaging technology Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The application provides one kind and divides into as sensitive chip and camera module, camera device, wherein, it is described to divide into as sensitive chip, including sensitive chip substrate;Positioned at multiple photosensitive areas of the sensitive chip substrate first surface, isolated between multiple photosensitive areas by the sensitive chip substrate.Sensitive chip provided by the invention, multiple photosensitive areas are formed in a photosensitive substrate, so as in the production process of camera module or camera device, once mounting can be passed through, form multiple photosensitive areas in approximately the same plane, avoid the inclination occurred when needing to install multiple sensitive chips in multiple camera modules in the prior art, the problem of caused multiple camera modules are not quite identical, and then the image quality that can improve multiple camera modules is consistent so that final whole image quality is higher.
Description
Technical field
The present invention relates to technical field of semiconductor device, more particularly to one kind divide into as sensitive chip and camera module,
Camera device.
Background technology
Take the photograph that the electronic product of module is commercially burning hot all the more, and consumer comprising double to taking the photograph module comprising double modules and four of taking the photograph
Also lifted with the demand of four electronic products for taking the photograph module.Have the function of that double electronic products for taking the photograph module can be by a camera lens
It is divided into two, is become apparent from so that catching picture, imaging is exquisiter, color is more bright-coloured.With four electricity for taking the photograph module
The imaging of sub- product is exquisiter and bright-coloured compared to double imagings for taking the photograph module.
But multiple shooting moulds are be easy to cause in the production process of the electronic product of more camera modules in currently available technology
Group is not quite identical, the problem of causing image quality poor.
The content of the invention
In view of this, the present invention provides one kind and divides into as sensitive chip and camera module, camera device, existing to solve
The problem of image quality caused by more camera modules are not quite identical in technology is poor.
To achieve the above object, the present invention provides following technical solution:
One kind is divided into as sensitive chip, including:
Sensitive chip substrate;
Positioned at multiple photosensitive areas of the sensitive chip substrate first surface, pass through the sense between multiple photosensitive areas
Optical chip substrate is isolated.
Preferably, it is described to divide into as sensitive chip is packaged using CSP packaging technologies, on the sensitive chip substrate
Multiple pads are additionally provided with the second surface being oppositely arranged with the first surface.
Preferably, the subregion that is distributed as of multiple pads on the second surface is distributed, and the distribution of multiple pads
Distribution with the multiple photosensitive area is correspondingly arranged.
Preferably, multiple pads on the second surface are distributed as mixed distribution.
Preferably, it is described to divide into as sensitive chip is packaged using COB packaging technologies, on the sensitive chip substrate
Multiple pads are additionally provided with, the pad is located at the fringe region of the first surface of the sensitive chip substrate.
Preferably, multiple pads be distributed as subregion distribution, and the distribution of multiple pads with it is described more
The distribution of a photosensitive area is correspondingly arranged.
Preferably, multiple pads are distributed as mixed distribution.
The present invention also provides a kind of camera module, including dividing into as sensitive chip described in any of the above one, and
The camera lens identical with the photosensitive area number;
Wherein, the photosensitive area is corresponded with the camera lens and set.
The present invention also provides a kind of camera device, including camera module recited above.
Preferably, the camera device is mobile phone, tablet computer or monitoring device.
It can be seen via above technical scheme that provided by the invention divide into as sensitive chip, including sensitive chip substrate;
Positioned at multiple photosensitive areas of the sensitive chip substrate first surface, served as a contrast between multiple photosensitive areas by the sensitive chip
Bottom isolates.Sensitive chip provided by the invention, multiple photosensitive areas are formed in a photosensitive substrate, so as in camera module or take the photograph
As device production process in, multiple photosensitive areas in the approximately the same plane can be formed by once mounting, avoided existing
There is the inclination occurred when needing to install multiple sensitive chips in multiple camera modules in technology, caused multiple camera modules are endless
The problem of complete consistent, and then the image quality that can improve multiple camera modules is consistent so that final whole image quality is higher.
The present invention also provides a kind of camera module and camera device, including it is recited above divide into as sensitive chip, from
And image quality is enabled to greatly improve.
Picture is divided into simultaneously as being set on a sensitive chip, instead of multiple sensitive chips of the prior art,
In the assembling process of camera module and camera device, built-up time can be reduced, so that easy to assembly, packaging efficiency carries significantly
Rise.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the double structure diagrams for taking the photograph module of the prior art;
Fig. 2 is that the picture sensitive chip Facad structure that divides into that a kind of CSP techniques provided in an embodiment of the present invention are formed is illustrated
Figure;
Fig. 3 is that the picture sensitive chip backside structure that divides into that a kind of CSP techniques provided in an embodiment of the present invention are formed is illustrated
Figure;
Fig. 4 is divided into as sensitive chip backside structure is shown for what another kind CSP techniques provided in an embodiment of the present invention were formed
It is intended to;
Fig. 5 is divided into as sensitive chip structure diagram for what a kind of COB techniques provided in an embodiment of the present invention were formed;
Fig. 6 is divided into as sensitive chip structure diagram for what another kind COB techniques provided in an embodiment of the present invention were formed;
Fig. 7 is the structure diagram of double photography/videography modules provided in an embodiment of the present invention.
Embodiment
Just as described in the background section, easily made in the production process of the electronic product of more camera modules in the prior art
It is not quite identical into multiple camera modules, the problem of causing image quality poor.
Inventor has found that the reasons for the above problems are, either double in the prior art to take the photograph module or four take the photograph module,
Or the camera module of more multi-cam, in process of production, when assembling sensitive chip, due to fabrication error, all is photosensitive
Chip can not remain in same plane completely, and work as the assembling angle and other photosensitive cores of some or multiple sensitive chips
The assembling angle of piece is different, will cause what the image that the corresponding camera module of the sensitive chip is formed was formed with other camera modules
Image can not be kept always in subsequent synthetic run, so as to cause image quality poor.
Specifically, please as shown in Figure 1, be double structures for taking the photograph module in the prior art, it include two camera lenses and with two mirrors
Corresponding two sensitive chips, sensitive chip 011 is used to receive to be imaged by the light of camera lens 02, and sensitive chip 012 is used
It is imaged in receiving by the light of camera lens 03, as shown in fig. 1, when installation, which occurs, for sensitive chip 011 tilts, then on it
Into picture be distorted, follow-up computing module based on sensitive chip 011 and sensitive chip 012 image synthesize final image
When, final image will appear from unintelligible, the situation of image quality difference.
Based on this, the present invention provides one kind and divides into as sensitive chip, including:
Sensitive chip substrate;
Positioned at multiple photosensitive areas of the sensitive chip substrate first surface, pass through the sense between multiple photosensitive areas
Optical chip substrate is isolated.
It is provided by the invention to divide into as sensitive chip, including sensitive chip substrate;Positioned at the sensitive chip substrate
Multiple photosensitive areas on one surface, pass through the sensitive chip substrate between multiple photosensitive areas and isolate.Sense provided by the invention
Optical chip, multiple photosensitive areas are formed in a photosensitive substrate, so that in the production process of camera module or camera device, energy
Enough by once mounting, multiple photosensitive areas in approximately the same plane are formed, avoid multiple camera modules in the prior art
It is middle to need to install the inclination occurred during multiple sensitive chips, the problem of caused multiple camera modules are not quite identical, Jin Erneng
The image quality for enough improving multiple camera modules is consistent so that final whole image quality is higher.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
It is shown in Figure 2, divided into for one kind provided in an embodiment of the present invention as sensitive chip, including:
Sensitive chip substrate 11;
Positioned at multiple photosensitive areas (12,13) of 11 first surface of sensitive chip substrate, the multiple photosensitive areas (12,
13) isolated between by the sensitive chip substrate 11.
It should be noted that not limiting the specific number of photosensitive area in the present embodiment, taken the photograph to realization is double, then it is described photosensitive
Photosensitive area on chip is two, and to realize that four take the photograph, then the photosensitive area on the sensitive chip can be four, actual design
In, it is configured according to the camera lens number of camera module, or by light path design, realize that a photosensitive area corresponds to a plurality of lenses
Can also, so as to reduce the setting of photosensitive area.
It should be noted that the packaged type divided into as sensitive chip is not limited in the present embodiment, optionally, such as
Shown in Fig. 3, work is encapsulated using CSP (Chip Scale Package, wafer-level package) for one kind provided in an embodiment of the present invention
The subregion sensitive chip that skill is packaged, the subregion sensitive chip of CSP techniques encapsulation include the first surface that is oppositely arranged and the
Two surfaces, wherein, first surface is used to form photosensitive area, and second surface is used to form the multiple welderings being connected with the photosensitive area
Disk.
The distribution mode of the multiple pad is not limited in the present embodiment, multiple pads of second surface can use subregion
Distribution mode, can also use Compound Distribution mode.As shown in figure 3, multiple pads on the second surface are distributed as point
Area is distributed, and the distribution and the distribution of the multiple photosensitive area of multiple pads are correspondingly arranged.
Illustrated in the present embodiment by taking two photosensitive areas as an example, as shown in Fig. 2, on the first surface of sensitive chip substrate
Including the first photosensitive area 12 and the second photosensitive area 13, as shown in figure 3, the sense of the first surface of sensitive chip shown in corresponding diagram 2
Light area is distributed, and includes the first pad 14 being correspondingly arranged with the first photosensitive area 12 on second surface, and with the second photosensitive area 13
The second pad 15 being correspondingly arranged.
The distribution of multiple pads on second surface can also be mixed distribution, as shown in figure 4, the mixing point of multiple pads 16
Cloth on a second surface, is used to be connected with the first photosensitive area 12 and the second photosensitive area 13.
Dividing into as sensitive chip can also use COB (Chips on Board, chip on board in the embodiment of the present invention
Encapsulation) technique encapsulates to be formed, as shown in figure 5, divide picture sensitive chip into for one kind provided in an embodiment of the present invention, including it is photosensitive
Chip substrate 21, the 3rd photosensitive area 22 and the 4th photosensitive area 23 on a surface of sensitive chip substrate 21.
It should be noted that to be formed due to being encapsulated using COB techniques, it is additionally provided with sensitive chip substrate more
A pad, the pad are located at the fringe region of the first surface of the sensitive chip substrate.Pass through the welding
The pad that point is divided into carrying on the circuit board as sensitive chip is connected, and is realized photosensitive.Circuit board described in the present embodiment
Can be flexible PCB (FPC) or printed circuit board (PCB) (PCB).
It is identical with CSP techniques, dividing into as on sensitive chip of being formed is encapsulated using COB techniques more in the present embodiment
The distribution of a pad can also be subregion distribution or mixed distribution, this is not limited in the present embodiment.
Divide into as multiple pads on sensitive chip be distributed as subregion distribution when, and multiple pads point
The distribution of cloth and the multiple photosensitive area is correspondingly arranged.As shown in Figure 5, it is provided with around corresponding 3rd photosensitive area 22 multiple
First pad 24;Multiple second pads 25 are provided with around corresponding 4th photosensitive area 23.First pad 24 and second
Pad 25 controls the sensitization function of corresponding 3rd photosensitive area 22 and the 4th photosensitive area 23 respectively.
The distribution of multiple pads can also be mixed distribution, as shown in fig. 6, the 3rd photosensitive area 22 and the 4th is photosensitive
Multiple pads 26 are provided with around area 23, multiple pads 26 are used for the 3rd photosensitive area 22 of Comprehensive Control and the 4th photosensitive area
How 23 sensitization function, specifically control, be not described in detail in the present embodiment, can carry out different set according to the actual requirements
Put.
It is provided by the invention to divide into as sensitive chip, including sensitive chip substrate;Positioned at the sensitive chip substrate
Multiple photosensitive areas on one surface, pass through the sensitive chip substrate between multiple photosensitive areas and isolate.Sense provided by the invention
Optical chip, multiple photosensitive areas are formed in a photosensitive substrate, so that in the production process of camera module or camera device, energy
Enough by once mounting, multiple photosensitive areas in approximately the same plane are formed, avoid multiple camera modules in the prior art
It is middle to need to install the inclination occurred during multiple sensitive chips, the problem of caused multiple camera modules are not quite identical, Jin Erneng
The image quality for enough improving multiple camera modules is consistent so that final whole image quality is higher.
An alternative embodiment of the invention provides a kind of camera module, including dividing into as sense described in above example
Optical chip, and the camera lens identical with the photosensitive area number;Wherein, the photosensitive area is corresponded with the camera lens and set.
As shown in fig. 7, being the structure diagram of double photography/videography modules provided in an embodiment of the present invention, including divide into as sense
Optical chip 71, the first camera lens 72 and the second camera lens 73, wherein, divide into as the first camera lens 72 of direction on sensitive chip 71, and with
First camera lens, 72 correspondence position is provided with the first photosensitive area 711;Divide into as the second camera lens 73 of direction on sensitive chip 71, and with
Second camera lens, 73 correspondence position is provided with the first photosensitive area 712.
Since the sensitive chip provided in the embodiment of the present invention forms multiple photosensitive areas in a photosensitive substrate, so that
In the production process of camera module or camera device, multiple senses in approximately the same plane can be formed by once mounting
Light area, avoids the inclination occurred when needing to install multiple sensitive chips in multiple camera modules in the prior art, caused more
The problem of a camera module is not quite identical, and then the image quality that can improve multiple camera modules is consistent so that it is final whole
A image quality is higher.
Picture is divided into simultaneously as being set on a sensitive chip, instead of multiple sensitive chips of the prior art,
In the assembling process of camera module, built-up time can be reduced, so that easy to assembly, packaging efficiency greatly promotes.
The present invention also provides a kind of camera device, the camera device includes the camera module described in above example, i.e.,
One sensitive chip corresponds to two the double of camera lens and takes the photograph module.
It is what not limit the camera device concrete structure in the present embodiment, and optionally, camera device can be current
Common smart mobile phone or tablet computer, can also be devices that other are used to image, such as monitoring device, to this in the present embodiment
Do not limit.
Camera device provided in an embodiment of the present invention, including the camera module described in above example, so that
Image quality greatly improves.
Picture is divided into simultaneously as being set on a sensitive chip, instead of multiple sensitive chips of the prior art,
In the assembling process of camera device, built-up time can be reduced, so that easy to assembly, packaging efficiency greatly promotes.
It should be noted that each embodiment in this specification is described by the way of progressive, each embodiment weight
Point explanation is all difference with other embodiment, between each embodiment identical similar part mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
1. one kind is divided into as sensitive chip, it is characterised in that including:
Sensitive chip substrate;
Positioned at multiple photosensitive areas of the sensitive chip substrate first surface, pass through the photosensitive core between multiple photosensitive areas
Piece substrate is isolated.
2. according to claim 1 divide into as sensitive chip, it is characterised in that described to divide into as sensitive chip uses
CSP packaging technologies are packaged, and are also set on the second surface being oppositely arranged on the sensitive chip substrate with the first surface
It is equipped with multiple pads.
3. according to claim 2 divide into as sensitive chip, it is characterised in that multiple pads on the second surface
Be distributed as subregion distribution, and the distribution and the distribution of the multiple photosensitive area of multiple pads are correspondingly arranged.
4. according to claim 2 divide into as sensitive chip, it is characterised in that multiple pads on the second surface
Be distributed as mixed distribution.
5. according to claim 1 divide into as sensitive chip, it is characterised in that described to divide into as sensitive chip uses
COB packaging technologies are packaged, and multiple pads are additionally provided with the sensitive chip substrate, and the pad is located at the sense
The fringe region of the first surface of optical chip substrate.
6. according to claim 5 divide into as sensitive chip, it is characterised in that multiple pads are distributed as point
Area is distributed, and the distribution and the distribution of the multiple photosensitive area of multiple pads are correspondingly arranged.
7. according to claim 5 divide into as sensitive chip, it is characterised in that multiple pads are distributed as mixing
Close distribution.
A kind of 8. camera module, it is characterised in that including dividing picture sensitive chip into described in claim 1-7 any one,
And the camera lens identical with the photosensitive area number;
Wherein, the photosensitive area is corresponded with the camera lens and set.
9. a kind of camera device, it is characterised in that including the camera module described in claim 8.
10. camera device according to claim 9, it is characterised in that the camera device is mobile phone, tablet computer or prison
Control equipment.
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CN201810029277.5A CN107948495B (en) | 2018-01-12 | 2018-01-12 | Subregion formation of image sensitization chip and module, camera device of making a video recording |
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CN201810029277.5A CN107948495B (en) | 2018-01-12 | 2018-01-12 | Subregion formation of image sensitization chip and module, camera device of making a video recording |
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CN108712600A (en) * | 2018-08-23 | 2018-10-26 | Oppo广东移动通信有限公司 | A kind of camera module and electronic equipment |
CN109981961A (en) * | 2019-05-15 | 2019-07-05 | 德淮半导体有限公司 | A kind of camera module structure and preparation method thereof |
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