CN105206640A - Camera module and assembling method thereof - Google Patents

Camera module and assembling method thereof Download PDF

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Publication number
CN105206640A
CN105206640A CN201510641103.0A CN201510641103A CN105206640A CN 105206640 A CN105206640 A CN 105206640A CN 201510641103 A CN201510641103 A CN 201510641103A CN 105206640 A CN105206640 A CN 105206640A
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China
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image sensor
metal wire
sensor chip
camera module
end
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CN201510641103.0A
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Chinese (zh)
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赵立新
侯欣楠
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格科微电子(上海)有限公司
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Priority to CN201510641103.0A priority Critical patent/CN105206640A/en
Publication of CN105206640A publication Critical patent/CN105206640A/en

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Abstract

The invention provides an assembling method of a camera module. The assembling method comprises the following steps that an image sensor chip with a suspension metal wire is provided, wherein the first end of the metal wire is bonded to a bonding pad of the image sensor chip, and the second of the metal wire is suspended on the image sensor chip; the image sensor chip and a lens module are assembled to form a standard part, and then the standard part and a circuit board are electrically connected and assembled through the second end of the metal wire to form the camera module.

Description

摄像头模组及其装配方法 Method of assembling the camera module

技术领域 FIELD

[0001] 本发明涉及半导体制造领域,尤其涉及一种摄像头模组的装配方法。 [0001] The present invention relates to semiconductor manufacturing, and more particularly relates to a method for assembling the camera module.

背景技术 Background technique

[0002] 目前,主流的图像传感器(CIS:CM0S Image Sensor)的封装方法包括:芯片级封装(Chip Scale Package,CSP)、板上集成封装(Chip On Board, COB)及倒装芯片封装(Flip [0002] Currently, the mainstream of the image sensor: encapsulation method (CIS CM0S Image Sensor) comprising: a chip scale package (Chip Scale Package, CSP), onboard packaging (Chip On Board, COB) and flip-chip packages (Flip

Chip,FC)o Chip, FC) o

[0003] CIS CSP是一种目前普遍应用在中低端、低像素(2M像素或以下)图像传感器的封装技术,可采用Die level(芯片级)或Wafer level (晶圆级)封装技术。 [0003] CIS CSP is a currently widely used in low-end, low pixel packaging technology (2M pixels or less) image sensor may be employed Die level (chip level), or Wafer level (wafer level) packaging technology. 该封装技术通常使用晶圆级玻璃与晶圆bonding并在晶圆的图像传感器芯片之间使用围堰隔开,然后在研磨后的晶圆的焊盘区域通过制作焊盘表面或焊盘面内孔侧面环金属连接的硅穿孔技术(TSV:Through Silicon Via)或切割后焊盘侧面的T型金属接触芯片尺寸封装技术,并在晶圆背面延伸线路后制作焊球栅阵列(BGA:Ball Grid Array),然后切割后形成单个密封空腔的图像传感器单元。 The wafer level packaging technique is generally used with the glass wafer bonding and dike spaced between the image sensor chip wafer, and then the pad region of the wafer after polishing pad surface or by making the inner surface of the hole pads TSV technology ring side (TSV: Through silicon Via) connected to the metal or metal T-shaped cutting chip size packaging technology contacting side of the pad, and after making a solder ball grid array wafer backside extending line (BGA: Ball grid array ), and then cut to form individual sealed cavity after the image sensor unit. 后端通过SMT的方法形成模块组装结构。 The rear end module assembly structure formed by the method of the SMT. 但是,CSP封装具有如下明显的问题影响产品性能:厚的支撑玻璃对光的吸收、折射、反射及散射对图像传感器尤其是小像素尺寸产品的性能具有很大的影响;2可靠性问题:封装结构中的构件之间的热膨胀系数差异及空腔内密封气体在后面的SMT工艺或产品使用环境的变化中出现可靠性问题;3投资规模大、环境污染控制要求大,生产周期较长,单位芯片成本较高尤其对于高像素大尺寸图像传感器产品。 However, the CSP package has a significant problem affect product performance: light absorbing supporting glass thickness, refraction, scattering and reflection has a great influence on the performance of the image sensor, especially small pixel size of the product; 2 reliability issues: a package structure and thermal expansion coefficient difference between the gas cavity seal member variations occur in the SMT process or the product in the environment behind the reliability; 3 large investment, environmental pollution control requirements of large, long production cycle, the unit especially for high chip cost large-size high-pixel image sensors.

CIS COB封装是一种目前普遍应用在高端、高像素产品(5M像素或以上)图像传感器的Die Level (芯片级)封装技术。 CIS COB package is a currently widely used in Die Level (chip level) packaging technology high-end, high-resolution product (5M or more pixels) of the image sensor. 该封装技术把经研磨切割后的芯片背面bonding在PCB板的焊盘上使用键合金属导线,装上具有IR玻璃片的支架和镜头,形成组装模块结构。 The chip packaging technology to the milled back surface of the cut bonding pad on the PCB board using bonding metal wire, and an IR glass holder mounted on the lens, assembling module structure is formed. 但是,COB封装如下明显的问题:1、微尘控制非常困难,需要超高的洁净室等级,制造维持成本高;2、产品设计定制化、周期长、灵活度不够;3不容易规模化生产; However, COB packaging obvious problems as follows: 1, dust control is very difficult, requiring ultra clean room level, to maintain a high manufacturing cost; 2, customized product design, cycle length, is not enough flexibility; 3 is not easy to scale production ;

CIS FC封装最近兴起的高端、高像素(5M像素或以上)图像传感器的Die Level (芯片级)封装技术。 Die Level (chip level) packaging technology CIS FC package recent rise of high-end, high resolution (5M or more pixels) of the image sensor. 该封装技术把在焊盘做好金素凸块经研磨切割的芯片焊盘直接与PCB的焊盘通过热超声的作用一次性所有接触凸块与焊盘进行连接,形成封装结构。 The packaging technology to make the gold bumps milled pigment dicing die pad in the pad and the pad PCB by direct thermal contact with the ultrasonic action all at once, to connect with the bump pads, forming a package structure. 后端通过PCB外侧的焊盘或锡球采用SMT的方法形成模块组装结构。 The rear end module assembly structure formed by the method using SMT PCB outside the pad or solder ball. 但是,FC封装如下明显的问题:I该封装对PCB基板要求很高,与Si具有相近的热膨胀系数,成本很高;2制造可靠性难度很大,热超声所有凸块与焊盘连接的一致性要求非常高,凸块与焊盘硬连接,延展性不好;3微尘控制难度大、工艺环境要求高,成本很高; However, FC package as obvious question: I of the package to the PCB substrate demanding, and Si having a thermal expansion coefficient close to, the cost is high; 2 Manufacturing Reliability great difficulty, all consistent with the bump pad connections thermosonic requirement is very high, hard bumps and connecting pads, good ductility; 3 difficult to control dust, high process requirements of the environment, high cost;

此外,以往的CIS模组的装配方法是: Further, the conventional CIS module assembly method is:

步骤1,将图像传感器芯片焊接到电路板上,形成第一个部件; Step 1, the image sensor chip is soldered to the board, forming a first member;

步骤2,将镜头模块与套筒模块组装,形成第二个部件; Step 2, the lens module and module assembly of the sleeve, to form a second member;

步骤3,将第一个部件和第二个部件组装,从而形成一个完整的摄像头模组。 Step 3, the first member and a second member assembled to form a complete camera module.

[0004] 此种摄像头模组的装配方法有如下缺点:对于摄像头模组而言,需要使用高精密的安装设备才能进行上述步骤3的精确安装,否则将影响到摄像头模组的成像效果,进而装配而成的摄像头模组的成品合格率不高;尤其是对于高像素的摄像头模组,使用普通的安装设备很难较好地完成上述步骤3的精确安装,使得高像素的摄像头模组的成像效果受到较大影响,所成图像的成像质量较差,尤其是图像四周的成像质量明显不好。 [0004] Such a method of assembling the camera module has the following disadvantages: for the camera module, the need to use high-precision mounting device can be mounted precisely above step 3, otherwise it will affect the imaging of the camera module, and further assembled camera module finished passing rate is not high; especially for high-pixel camera module, it is difficult using an ordinary mounting apparatus preferably complete the above steps precise mounting 3 so that the high-pixel camera module imaging severely affected, poor image quality of an image, particularly around the image of the image quality significantly bad.

[0005] 并且,在采用金属导线键合的图像传感器芯片封装工艺中,通常先将图像传感器芯片固晶(例如粘附)到转接板(柔性电路板)上,然后进行键合焊线,将金属导线的第一端连接于图像传感器芯片的焊盘上,第二端连接于转接板上,由此实现图像传感器芯片和转接板的电气连接,然后再将封装后的图像传感器芯片通过转接板上的引线或锡球连接到电路板上。 [0005] Further, in the metallic wire bonding process using the image sensor chip packaging usually first image sensor chip die bonding (e.g., adhered) to the adapter plate (flexible circuit boards), and then bonding the bonding wire, after the end of the first metal wire is connected to the image sensor chip pads, a second end connected to the adapter plate, thereby electrically connecting the image sensor chip and the adapter plate, an image sensor chip and then packaged leads connected to the circuit board by solder balls or transition board.

[0006] 现有导线键合方法容易造成封装后的结构灵活性较差,摄像头模组的后续装配精度要求高,镜头和图像传感器芯片的相对位置难以控制影响摄像头模组的性能;而且由于现有方法的流程较长,封装效率较低,导致图像传感器芯片较长时间暴露于空气中,需要多次的检测和清洗,降低良品率,增加摄像头模组的成本。 [0006] The conventional wire bonding method is easy to cause a poor structural flexibility of the package, a subsequent high precision assembly of the camera module, the relative position of the lens and the image sensor chip is difficult to control affecting the performance of the camera module; and because now the method of processes have long encapsulation efficiency is low, resulting in a long image sensor chip is exposed to the air time, requiring multiple testing and cleaning, reduce yield, increase in cost of the camera module. 尤其是,对于一些金属导线第二端采用其他工艺进行连接的图像传感器芯片,需要一种新的键合方法和装置,以使导线的第一端连接于图像传感器芯片的焊盘,第二端悬空于图像传感器芯片之外。 In particular, the second end of the metal wire for some other process uses an image sensor chip is connected, a need for a new method and a bonding apparatus, so that a first end connected to the conductor pads of the image sensor chip, a second end suspended outside the image sensor chip.

[0007] 综上所述,亟需一种实现高像素、大芯片尺寸图像传感器的低成本、高性能、高可靠性、超薄的封装结构技术。 [0007] In summary, high resolution, low cost image sensors large chip size, high performance, high reliability, thin package structure need an implementation technique.

发明内容 SUMMARY

[0008] 基于以上考虑,提出一种摄像头模组的装配方法,包括以下步骤: [0008] Based on the above considerations, is proposed a method of assembling the camera module, comprising the steps of:

提供具有悬空金属导线的图像传感器芯片,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片; Providing a metal wire hanging image sensor chip, a first end of said metal wires bonded to the pads of the image sensor chip, at a second end of the floating image sensor chip;

将所述图像传感器芯片与镜头模块装配形成标准件,然后通过所述金属导线的第二端将所述标准件与电路板装配形成摄像头模组。 The image sensor chip and the lens module assembly formed of standard parts, and the camera module is formed by a second end of the standard circuit board assembly of the metal wire.

[0009] 优选的,所述金属导线形成弹性结构,且所述金属导线的第二端低于所述图像传感器芯片下表面5微米至300微米。 [0009] Preferably, the metal wire forming an elastic structure, and a second end of the metal wire surface is less than 5 microns to 300 microns at the image sensor chip.

[0010] 优选的,于所述标准件的电性测试过程中,所述金属导线的弹性结构发生弹性形变以提供接触压力,提高金属导线与测试装置的连接性能;于所述标准件与电路板的装配过程中,所述金属导线的弹性结构发生弹性形变以提供接触压力,提高金属导线与电路板的连接性能。 [0010] Preferably, the electrical properties of the standard test procedure, the resilient structure of the metal wire is elastically deformed to provide a contact pressure to improve the performance of metal wires connected to the test device; and the circuit to the standard board assembly process, the structure of an elastic metal wire is elastically deformed to provide a contact pressure to improve the performance of metal wires connected to the circuit board.

[0011] 优选的,将所述标准件与电路板装配的步骤包括:通过压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式将所述金属导线的第二端与所述电路板电学连接。 [0011] Preferably, the step of the standard circuit board assembly comprising: press-fit contact manner, fast welding, conductive or non-conductive glue gluing the second end of the embodiment of the metal wire electrically connected to the circuit board.

[0012] 本发明还提供一种摄像头模组,包括: [0012] The present invention also provides a camera module, comprising:

图像传感器芯片,所述图像传感器芯片电学连接有悬空的金属导线,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片; The image sensor chip, the image sensor chip is electrically connected to the metal wires dangling, a first end of said metal wire is bonded to the pads of the image sensor chip, at a second end of the floating image sensor chip;

镜头模块,所述镜头模块与所述图像传感器芯片装配形成标准件; Lens module, the standard lens module is formed with the image sensor chip is mounted;

电路板,所述电路板与所述标准件通过所述金属导线的第二端连接。 Circuit board, the circuit board and the second terminal connected to the standard member by a metal wire.

[0013] 优选的,所述金属导线形成弹性结构且所述金属导线的第二端低于所述图像传感器芯片下表面5微米至300微米。 [0013] Preferably, said resilient metal wire forming the metal wire structure and a second end surface is less than 5 microns to 300 microns at the image sensor chip.

[0014] 优选的,所述金属导线的第二端与所述电路板通过压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式的方式连接。 [0014] Preferably, the second end of the metal wire to the circuit board by means of press-fit contact manner, fast welding, conductive or non-conductive glue gluing method.

[0015] 本发明的摄像头模组的装配方法使用普通的安装设备就能精确地对摄像头模组进行组装,克服了现有技术中摄像头模组的装配方法需要采用高精度的安装设备的不足,本发明的装配方法简单易行,易于调整图像传感器芯片至镜头的焦平面,易于矫正镜头和图像传感器芯片的倾斜度,以保证摄像头模组装配完成后的光学性能,本发明的装配步骤使得所述摄像头模组具有高质量的成像效果,尤其是对于高像素的摄像头模组,能够使其图像四周的成像质量显著提高。 [0015] The method of assembling the camera module of the present invention using conventional mounting apparatus can be accurately assembled to the camera module overcomes the prior art method of assembling the camera module requires the use of high-precision mounting apparatus is insufficient, assembly method of the present invention is simple, easy to adjust the focal plane of the image sensor chip to the lens, and the lens is easy to correct the inclination of the image sensor chip, to ensure the optical properties of the camera module assembly is completed, the assembly step of the present invention is such that said camera module with a high quality imaging, particularly for high-pixel camera module, so that the image quality can be significantly improved around the image.

[0016] 本发明通过将图像传感器的芯片切割后通过键合金属导线形成悬空的金属导线,并且进一步将镜头模组组装至图像传感器芯片上,再通过金属导线的悬空端与电路板进行电学连接,并且金属导线为弹性结构,能发生弹性形变,能更好的提高电学性能,比传统CSP的焊盘、BGA及焊锡三者SMT连接更具有工艺优势 [0016] By the present invention, an image sensor chip formed by cutting a metal wire by dangling bonding metal wire, and further assembling the camera module onto the image sensor chip, and then electrically connected by a metal wire free ends of the circuit board , an elastic metal wire structure, can be deformed elastically, can improve the electrical performance better than conventional pad CSP, BGA and solder SMT connectors and three more process advantages

本发明使用金线直接连接芯片与PCB基板焊盘,金线延展性能好,环境适应性强,可靠性佳。 The present invention uses a gold wire directly connecting the chip and the PCB substrate pads, gold good ductility, environmental adaptability, good reliability. 本发明的镜筒框架可与图像传感器芯片形成开放结构,有效的减少光线在摄像头模组中的杂散光,提供模组性能。 Barrel framework of the invention may be formed with the open structure of the image sensor chip, effectively reduce stray light rays in the camera module, there is provided module performance. .

[0017] 本发明的各个方面将通过下文中的具体实施例的说明而更加清晰。 [0017] Various aspects of the present invention will become more apparent from the following description of specific embodiments in FIG.

附图说明 BRIEF DESCRIPTION

[0018] 通过参照附图阅读以下所作的对非限制性实施例的详细描述,本发明的其它特征、目的和优点将会变得更明显。 [0018] Non-limiting detailed description of embodiments taken with reference to the accompanying drawings, the present invention further features, objects and advantages will become more apparent.

[0019]图1为依据本发明实施例的具有悬空金属导线的图像传感器芯片的示意图; [0019] FIG. 1 is a schematic view of a floating metal wire image sensor chip according to an embodiment of the present invention;

图2为依据本发明实施例的标准件的示意图; FIG 2 is a schematic diagram of the embodiment of the present standard according to the invention;

图3为依据本发明实施例的摄像头模组的装配初始状态示意图; 3 is a schematic assembled initial state of the camera module according to an embodiment of the present invention;

图4为依据本发明实施例的摄像头模组的装配完成状态示意图; FIG 4 is a camera module assembly in accordance with embodiments of the present invention, a schematic view of the state of completion;

图5为依据本发明的摄像头模组的装配方法的流程图。 5 is a method for assembling the camera module according to the present invention, the flowchart of FIG.

[0020] 在图中,贯穿不同的示图,相同或类似的附图标记表示相同或相似的装置(模块)或步骤。 [0020] In the drawings, throughout the different views, the same or similar reference numerals designate the same or similar means (module) or step.

具体实施方式 Detailed ways

[0021] 在以下优选的实施例的具体描述中,将参考构成本发明一部分的所附的附图。 [0021] In the following detailed description of preferred embodiments, reference is made to the accompanying drawings part of the invention. 所附的附图通过示例的方式示出了能够实现本发明的特定的实施例。 By way of example to the accompanying drawings shows a specific embodiment of the present invention can be achieved. 示例的实施例并不旨在穷尽根据本发明的所有实施例。 Example exemplary embodiments are not intended to be exhaustive of all embodiments according to the present invention. 可以理解,在不偏离本发明的范围的前提下,可以利用其他实施例,也可以进行结构性或者逻辑性的修改。 It will be appreciated, without departing from the scope of the present invention, other embodiments may be utilized, or structural modifications may be logical. 因此,以下的具体描述并非限制性的,且本发明的范围由所附的权利要求所限定。 Accordingly, the following detailed description is not restrictive, and the scope of the invention as defined by the appended claims.

[0022] 为了更清晰地阐述本发明的封装方法,在下面的实施例中,采用玻璃作为基板。 [0022] In order to more clearly set forth in the packaging method of the present invention, in the following embodiment, as the glass substrate. 本领域技术人员能够理解的是,基板也可以由其它透明的材质构成。 Those skilled in the art will be appreciated that the substrate may be made of other transparent material.

[0023]图1为依据本发明实施例的具有悬空金属导线的图像传感器芯片的示意图;图2为依据本发明实施例的标准件的示意图;图3为依据本发明实施例的摄像头模组的装配初始状态示意图;图4为依据本发明实施例的摄像头模组的装配完成状态示意图;图5为依据本发明实施例的摄像头模组的装配方法的流程图。 [0023] FIG. 1 is a schematic view of an image sensor chip floating metal wire to an embodiment of the present invention is based; 2 is a schematic embodiment standard embodiment of the present invention is based; Figure 3 is based on the camera module of the embodiment of the present invention a schematic view of the initial state of assembly; FIG. 4 is an assembled camera module according to an embodiment of the present invention showing a state is completed; FIG. 5 is a flowchart illustrating a method of assembling the camera module according to an embodiment of the present invention.

[0024] 如图5所示,并请同时参考图1至图4该封装方法包括以下步骤: [0024] 5, and please also to FIG. 4 of the package 1 with reference to FIG method comprising the steps of:

首先,执行步骤Sll:提供具有悬空金属导线120的图像传感器芯片110,所述金属导线120的第一端121键合于所述图像传感器芯片的焊盘111,第二端122悬空于所述图像传感器芯片110。 First, step Sll: providing a metal wire having a floating image sensor 120 of the chip 110, the first end 120 of the metal wire 121 bonded to the pads 111 of the image sensor chip, a second end 122 to the floating image the sensor chip 110.

[0025] 在该步骤中,图像传感器芯片110的正面有图像感应区112,以及环绕图像感应区112的焊盘区域113,焊盘区域113包含有若干焊盘111。 [0025] In this step, the front surface of the image sensor chip 110, 112, and 112 of the pad region 113 surrounds the image sensing area of ​​the image sensing region, a pad region 113 comprises a plurality of pads 111. 本步骤中金属导线120的第二端悬空不与任何介质相键合,金属导线为金线、银线、铜线等具有良好导线性能,并为弹性结构,在作用力于第二端122时能发生弹性形变; In this step, the second end of the metal wire 120 is not suspended and bonded to any medium, the metal wire is a gold wire, silver wire, copper wire and other conductors have good performance, and an elastic structure, the biasing force of the second end 122 elastic deformation can occur;

请同时参考图2至图4,步骤S12:将所述图像传感器芯片110与镜头模块130装配形成标准件200,然后通过所述金属导线的第二端122将所述标准件200与电路板300装配形成摄像头模组400 ; Please refer to FIG. 2 to FIG. 4, Step S12: the image sensor chip 110 and the lens assembly 130 to form a standard module 200, and the standard 122 by 200 and the second end of the circuit board 300 of metal wire assembly formed camera module 400;

在本步骤中,具有悬空金属导线的图像传感器芯片110与镜头模块130装配在一起,镜头模块130包括镜筒框架131 (安装框架)及位于镜筒框架内部的镜头132,在一实施例中镜筒框架131的内表面还具有台阶1311,台阶1311对应于镜头132朝向图像传感器芯片110的一端设置,适于装配一封装基板140,封装基板140为玻璃材质、塑料材质,封装基板140的表面覆盖有IR膜或AR膜;在另一实施例中未设置台阶1311和封装基板140,在镜头132靠近图像感应区112的表面直接覆盖IR膜或AR膜。 In this step, a metal wire having a floating image sensor chip module 110 and the lens 130 are assembled together, the lens barrel module 130 comprises a frame 131 (mounting frame) located inside the barrel and the lens frame 132, in one embodiment, the mirror embodiment the inner surface of the tubular frame 131 further has a step 1311, step 1311 corresponds to a lens 132 disposed toward the end of the image sensor chip 110, 140 adapted to fit a package substrate, the package substrate 140 made of glass, plastic material surface of the package substrate 140 to cover an IR film or the AR film; in another embodiment, step 1311 is not provided and the package substrate 140, IR film or the AR film covering directly on the surface close to the image sensing region 112 of the lens 132.

[0026] 在完成图像传感器芯片110与镜头模块130的装配后,通过金属导线的第二端122压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式将标准件200与电路板300装配形成摄像头模组400。 [0026] After completion of the assembly of the image sensor chip 110 and the lens module 130, a second end 122 nip contact manner by a metal wire, flash welding, conductive or non-conductive glue gluing the standard mode 200 forming the camera module assembly 300 and the circuit board 400.

[0027] 具体的,在第一实施例中采用压合接触方式则通过第二端122与电路板300上的焊盘310良好接触,标准件200通过卡扣或粘接的方式与电路板300的部分区域固定。 [0027] Specifically, the embodiment uses a contact nip in a first embodiment, the second end 122 by a good contact of the pad 310 on the circuit board 300, standard 200 by an adhesive or a snap-in manner with the circuit board 300 fixing the partial region.

[0028] 在第二实施例中,采用快速焊接方式,具体方式为:于金属导线的第二端122或者电路板300的焊盘310上镀一层金锡合金焊接层,通过局部快速焊接,控制焊接区域的热量传导,以不影响镜头部件的性能; [0028] In the second embodiment, using flash welding, specifically way: plated with gold-tin alloy solder layer to the pad 310 of the second end of the metal wire 122 or circuit board 300, by partially welding flash, control the heat conduction weld zone, so as not to affect the performance of the lens member;

(一)焊盘镀金锡合金方式:S201提供摄像头模组,所述摄像头模组包含有对温度敏感的镜头,所述摄像头模组还包含有一端悬空的与图像传感器芯片电学连接的金属导线;S203提供具有若干焊盘的电路板;S205所述电路板的焊盘预先附着焊料层,对金属导线悬空端与电路板的焊盘进行快速焊接。 (A) a tin alloy plated pad mode: S201 providing camera module, the camera module comprises a temperature sensitive lens, the camera module further comprises a metal wire with a floating end electrically connected to the image sensor chip; S203 provides a circuit board having a plurality of pads; S205 pads of the circuit board, the solder layer is attached in advance, on the free end of the metal wire pads of the circuit board for rapid welding. 金属导线为金线,金线的直径大于等于10微米,焊料层为锡层,通过控制锡层的厚度,使得在后续的快速局部焊接中,金线与锡层能够形成稳定的金含量较高的金锡合金焊接层。 Metal wire is a gold wire, gold wire diameter of greater than or equal to 10 micrometers, the solder layer is a tin layer, by controlling the thickness of the tin layer, such that in the subsequent fast local welding, gold-tin layer can be formed with a high content of gold stable the gold-tin alloy solder layer. 在另外一实施例中:电路板的焊盘预先附着焊料层的步骤还包括:S206采用印刷工艺与电路板的焊盘上附着焊料,回流焊形成焊料层。 In a further embodiment, the steps of: pre-adhesion pads of the circuit board further comprises a solder layer: S206 using the pad printing process of the circuit board is attached solder reflow solder layer is formed. 在另一实施例中,电路板的焊盘预先附着焊料层的步骤还包括:S206'采用波峰焊工艺于电路板的焊盘上附着焊料层。 In another embodiment, the step, the pads of the circuit board previously attached solder layer further comprises: S206 'using the wave soldering process the solder layer attached to the pads of the circuit board. 在一实施例中,控制锡层的厚度的方法包括:控制波峰焊工艺的参数,使得锡层厚度小于金线直径。 In one embodiment the method, controlling the thickness of the tin layer comprises: controlling the parameters of the wave soldering process, so that the tin layer is less than the diameter of gold wire. 在另一实施例中,控制锡层的厚度的方法包括:采用印刷工艺于电路板的焊盘上附着锡膏,回流焊形成锡层,采用风刀方式、吸枪吸取方式或焊头粘附方式使得锡层厚度小于进行厚度。 In another embodiment, a method of controlling the thickness of the tin layer comprises: using a printing process adheres to the solder pads of the circuit board, the reflow tin layer is formed, using air knife embodiment, suction means or suction gun horn adhesion such a way that for a thickness smaller than the thickness of the tin layer. 锡层厚度小于金线厚度,金锡合金在焊接过程中,具有良好的材质优势,能减小晶脆,具有流动性好,电阻率低,导热性好的特点。 The tin layer is less than the thickness of a gold wire, gold-tin alloy in the welding process, the material has a good advantage, brittle crystal can be reduced, with good fluidity, low resistivity, and good thermal conductivity. 快速焊接包括:脉冲热压焊工艺、激光焊接工艺、超声热压焊工艺,并且快速焊接为局部焊接方式,加热范围小于所述摄像头模组底部面积的1/2。 Fast welding comprising: a hot pulse welding process, a laser welding process, an ultrasonic thermocompression welding process, welding flash and a partial welding, the heating range is less than 1/2 of the bottom area of ​​the camera module.

[0029] (二)金属导线第二端122镀金锡合金方式,SlOl提供摄像头模组,所述摄像头模组包含有对温度敏感的镜头,所述摄像头模组还包含有一端悬空的与图像传感器芯片电学连接的金属导线;S103提供具有若干焊盘的电路板;S105所述金属导线的悬空端预先附着焊料层,对金属导线悬空端与电路板的焊盘进行快速焊接。 [0029] (ii) a second end of the metal wire 122 tin alloy plated embodiment, the SLOL provide camera module, the camera module comprises a temperature sensitive lens, the camera module further comprises a floating one end of the image sensor a metal wire electrically connected to the chip; S103 providing a circuit board having a plurality of pads; S105 free ends of the metal wire preliminarily adhered to the solder layer, the metal wire free ends of the pad with the circuit board for rapid welding. 金属导线为金线,金线的直径大于等于10微米,焊料层为锡层,通过控制锡层的厚度,使得在后续的快速局部焊接中,金线与锡层能够形成稳定的金含量较高(富金)的金锡合金焊接层,其中锡层厚度小于金线厚度,金锡合金在焊接过程中,具有良好的材质优势,能减小晶脆,具有流动性好,电阻率低,导热性好的特点。 Metal wire is a gold wire, gold wire diameter of greater than or equal to 10 micrometers, the solder layer is a tin layer, by controlling the thickness of the tin layer, such that in the subsequent fast local welding, gold-tin layer can be formed with a high content of gold stable (gold-rich) layer of gold-tin alloy solder, wherein the tin layer is less than the thickness of a gold wire, gold-tin alloy in the welding process, the material has a good advantage, brittle crystal can be reduced, with good fluidity, low electrical resistivity, thermal conductivity and good. 快速焊接包括:脉冲热压焊工艺、激光焊接工艺、超声热压焊工艺,并且快速焊接为局部焊接方式,加热范围小于所述摄像头模组底部面积的1/2。 Fast welding comprising: a hot pulse welding process, a laser welding process, an ultrasonic thermocompression welding process, welding flash and a partial welding, the heating range is less than 1/2 of the bottom area of ​​the camera module.

[0030] 在第三实施例中,采用导电胶粘合方式,具体的金属导线的悬空端预先附着导电胶,在本实施例中导电胶为银浆,对金属导线悬空端与电路板的焊盘进行固化进行电气连接。 [0030] In the third embodiment, the embodiment using a conductive glue, specifically the free ends of the metal wire preliminarily adhered to the conductive paste, the conductive paste is a silver paste in the embodiment in the present embodiment, the welding of the free end of the metal wire of the circuit board curing disk electrically connected. 由于银浆具有良好的粘合性、导电性可以用于做点电极浆料,在固化后根据可控的仍具有很好的性能。 Since silver paste having good adhesion, the conductive electrode paste may be used to do, after curing controlled according to still has a good performance. 金属导线为金线,金线的直径大于等于5微米,银浆的厚度为2微米至100微米。 Metal wire is a gold wire, the diameter of gold wire is less than 5 microns, a thickness of the silver paste of 2 microns to 100 microns. 固化方式采用热固化或UV固化的方式进行。 Cure mode using UV curing or thermal curing is performed. 本实施例中银浆的成分为:环氧树脂胶或者UV胶,和微小银片的混合物,银浆的厚度为:2微米至100微米。 Silver paste component of the present embodiment is implemented: a mixture, the thickness of the silver epoxy glue or UV adhesive, and a sheet of fine silver: 2 microns to 100 microns. 此外还可采用:电路板的焊盘预先附着银浆,对金属导线悬空端与电路板的焊盘进行固化并电气连接。 Further it may be employed: the pads of the circuit board previously attached paste, metal wire free ends of the pads of the circuit board and electrically connected cured. 由于银浆具有良好的粘合性、导电性可以用于做点电极浆料,在固化后根据可控的仍具有很好的性能。 Since silver paste having good adhesion, the conductive electrode paste may be used to do, after curing controlled according to still has a good performance. 金属导线为金线,金线的直径大于等于5微米,银浆的厚度为2微米至100微米。 Metal wire is a gold wire, the diameter of gold wire is less than 5 microns, a thickness of the silver paste of 2 microns to 100 microns. 固化方式采用热固化或UV固化的方式进行。 Cure mode using UV curing or thermal curing is performed. 本实施例中银浆的成分为:环氧树脂胶或者UV胶,和微小银片的混合物,银浆的厚度为:2微米至100微米。 Silver paste component of the present embodiment is implemented: a mixture, the thickness of the silver epoxy glue or UV adhesive, and a sheet of fine silver: 2 microns to 100 microns. 本实施例中导电胶还可采用具有导电性能的其他金属材质。 In this embodiment the conductive paste material may also be employed with other metallic conductive properties.

[0031] 在第四实施例中,可采用非导电胶粘合方式,但金属导线第二端122需与电路板的焊盘具有良好的电学接触。 [0031] In the fourth embodiment, the non-conductive adhesive bonding method may be employed, but the pad 122 for an end of the metal wire and a second circuit board having a good electrical contact.

[0032] 在形成标准件200后,还可以对标准件200进行测试,于所述标准件200的电性测试过程中,所述金属导线120的弹性结构发生弹性形变以提供接触压力,由于金属导线的第二端122低于所述图像传感器芯片110下表面5微米至300微米(请参见图1,距离为h),提高金属导线120与测试装置(未标注)的连接性能;并且在于所述标准件200与电路板300的装配过程中,所述金属导线120的弹性结构发生弹性形变以提供接触压力,由于金属导线的第二端122低于所述图像传感器芯片110下表面5微米至300微米(请参见图1,距离为h),可提高金属导线与电路板的连接性能。 [0032] After forming member 200 standard, the standard may be tested 200, the electrical properties of the standard test procedure 200, the resilient structure of the metal wire 120 is elastically deformed to provide a contact pressure, since the metal the second end 122 is lower than the surface of the wire 5 to 300 microns at the image sensor chip 110 (see FIG. 1, a distance h), advanced testing apparatus 120 and the metal wiring (not labeled) connection performance; and in that process of the standard assembly 200 and the circuit board 300, the resilient structure of the metal wire 120 is elastically deformed to provide a contact pressure, since the second end of the metal wire 122 is below the surface of the image sensor chip 110 micrometers to 5 300 m (see FIG. 1, a distance H), can improve the performance of metal wires connected to the circuit board. 请参考图4,图4中虚线120'显示的为标准件200未与电路板300装配时,金属导线120的第一形状状态;实线120' '显示的为标准件200与电路板300装配完成后,金属导线的第二形状状态,此时金属导线的第二形状状态发生弹性形变,金属导线的第二端与焊盘的接触更为良好,有利于信号的传输,此时第二端与焊盘接触面积为大于等于0.01平方毫米。 Please refer to FIG 4, a broken line 120 in FIG. 4 '200 is not displayed and the circuit board 300 is assembled standard parts, a first metal wire 120 form the state; solid line 120' 'as the standard 200 and the circuit board assembly 300 shown in after completion, the shape of the second state of the metal wire, in which case the shape of the second state of the metal wire is elastically deformed, the second end of the metal wire in contact with the pad is more favorable, facilitate the transmission signal, in which case the second end the contact area with the pad than 0.01 square millimeters.

[0033] 本发明还提供一种摄像头模组,其特征在于,包括:图像传感器芯片,所述图像传感器芯片电学连接有悬空的金属导线,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片;镜头模块,所述镜头模块与所述图像传感器芯片装配形成标准件;电路板,所述电路板与所述标准件通过所述金属导线的第二端连接。 [0033] The present invention also provides a camera module, characterized by comprising: an image sensor chip, the image sensor chip is electrically connected to the metal wires dangling, a first end of said bond wire bonded to said metal image sensor chip pads, to a second end of the floating image sensor chip; lens module, a lens module and the image sensor chip to form a standard mounting member; a circuit board, said circuit board through said member and said standard connecting a second end of the metal wire. 金属导线形成弹性结构且所述金属导线的第二端低于所述图像传感器芯片下表面5微米至300微米。 An elastic metal wire forming the metal wire structure and a second end surface is less than 5 microns to 300 microns at the image sensor chip. 金属导线的第二端与所述电路板通过压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式的方式连接。 A second end of the metal wire of the circuit board, is connected through a contact nip fast manner by welding, gluing a conductive or non-conductive glue embodiment. 对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。 To those skilled in the art, that the invention is not limited to the details of the above-described exemplary embodiment, but without departing from the spirit or essential characteristics of the present invention, the present invention can be realized in other specific forms. 因此,无论如何来看,均应将实施例看作是示范性的,而且是非限制性的。 Thus, in any case the point of view, the embodiments should be considered exemplary and non-limiting. 此外,明显的,“包括”一词不排除其他元素和步骤,并且措辞“一个”不排除复数。 Furthermore, it is obvious, "comprising" does not exclude other elements and steps, and the term "an" does not exclude a plurality. 装置权利要求中陈述的多个元件也可以由一个元件来实现。 The plurality of elements recited in the claims means may also be implemented by one member. 第一,第二等词语用来表示名称,而并不表示任何特定的顺序。 The first, second, etc. are used to indicate the name, but does not indicate any particular sequence.

Claims (7)

1.一种摄像头模组的装配方法,其特征在于,包括以下步骤: 提供具有悬空金属导线的图像传感器芯片,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片; 将所述图像传感器芯片与镜头模块装配形成标准件,然后通过所述金属导线的第二端将所述标准件与电路板装配形成摄像头模组。 CLAIMS 1. A method for assembling the camera module, characterized by comprising the steps of: providing an image sensor chip having a floating metal wire, a first end of bond wire bonded to the metal pads of the image sensor chip, the first dangling ends to the image sensor chip; the image sensor chip and the lens module assembly formed of standard parts, and the camera module is formed by a second end of the standard circuit board assembly of the metal wire.
2.如权利要求1所述的摄像头模组的装配方法,其特征在于,所述金属导线形成弹性结构,且所述金属导线的第二端低于所述图像传感器芯片下表面5微米至300微米。 2. The method of assembling the camera module as claimed in claim, wherein said resilient structure is formed of metal wire, metal wire and the second end surface is less than 5 microns to 300 at the image sensor chip m.
3.如权利要求2所述的摄像头模组的装配方法,其特征在于,于所述标准件的电性测试过程中,所述金属导线的弹性结构发生弹性形变以提供接触压力,提高金属导线与测试装置的电学连接性能;于所述标准件与电路板的装配过程中,所述金属导线的弹性结构发生弹性形变以提供接触压力,提高金属导线与电路板的电学连接性能。 3. The method of assembling the camera module according to claim 2, characterized in that, during the electrical test of the standard, the resilient structure of the metal wire is elastically deformed to provide a contact pressure, improved metal wire performance test with the electrical connector apparatus; in the standard assembly process of the circuit board, the resilient structure of the metal wire is elastically deformed to provide a contact pressure to improve the electrical properties of the metal wire and connected to the circuit board.
4.如权利要求1所述的摄像头模组的装配方法,其特征在于,将所述标准件与电路板装配的步骤包括:通过压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式将所述金属导线的第二端与所述电路板电学连接。 4. The method of assembling the camera module according to claim 1, characterized in that the step of standard circuit board assembly comprising: press-fit contact manner, fast welding, gluing or non-conductive conductive glue manner the second end of the metal wire electrically connected to the circuit board.
5.一种摄像头模组,其特征在于,包括: 图像传感器芯片,所述图像传感器芯片电学连接有悬空的金属导线,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片; 镜头模块,所述镜头模块与所述图像传感器芯片装配形成标准件; 电路板,所述电路板与所述标准件通过所述金属导线的第二端电学连接。 A camera module, characterized by comprising: an image sensor chip, the image sensor chip is electrically connected to the metal wires dangling, a first end of bond wire bonded to the metal pads of the image sensor chip , to a second end of the floating image sensor chip; lens module, a lens module and the image sensor chip to form a standard mounting member; a circuit board, said circuit board and said standard member through said second metallic wire end electrically connected.
6.如权利要求5所述的摄像头模组,其特征在于,所述金属导线形成弹性结构且所述金属导线的第二端低于所述图像传感器芯片下表面5微米至300微米。 6. The camera module according to claim 5, characterized in that the metal wire forming an elastic structure and the second end surface is less than 5 microns to 300 microns at the image sensor chip metal wire.
7.如权利要求5所述的摄像头模组,其特征在于,所述金属导线的第二端与所述电路板通过压合接触方式、快速焊接方式、导电胶粘合方式或非导电胶粘合方式的方式连接。 7. The camera module as claimed in claim 5, wherein said second end of the metal wire of the circuit board by press fit-contact manner, fast welding, conductive or non-conductive adhesive glue together connection mode.
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