CN108769466B - Camera module, manufacturing method and electronic equipment - Google Patents
Camera module, manufacturing method and electronic equipment Download PDFInfo
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- CN108769466B CN108769466B CN201810538300.3A CN201810538300A CN108769466B CN 108769466 B CN108769466 B CN 108769466B CN 201810538300 A CN201810538300 A CN 201810538300A CN 108769466 B CN108769466 B CN 108769466B
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- camera
- substrate
- camera module
- bonding pad
- projection
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
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- Studio Devices (AREA)
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Abstract
This scheme provides a camera module, manufacturing method and electronic equipment, and this camera module includes: the device comprises a substrate, a bonding pad, at least one camera, a light filter, a connecting lead and a plastic package film layer. The pad has a preset pattern and is arranged on the surface of the substrate, and the camera is arranged at a preset position of the pad. Specifically, the optical filter is arranged on one side of the camera, which is far away from the bonding pad, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate. Except that this, this scheme makes camera and pad link to each other through connecting the lead wire, and finally, carries out the plastic envelope to the camera after the subsides dress. Adopt the mode of plastic envelope, compare the base loading mode among the prior art, can reduce the height of whole camera module, and then reduce the volume of camera module.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a camera module, a manufacturing method and electronic equipment.
Background
With the rapid development of electronic devices, the photographing function has become a basic configuration of mobile electronic devices. In order to further improve the definition of the shot picture, the shooting of the picture by using two cameras has become the mainstream.
Specifically, an image can be shot by the two cameras respectively, and then the obtained image is processed, so that a shooting effect which is clearer than that of a picture directly obtained by a single camera is obtained. However, the increase in the number of cameras leads to an increase in the volume of the camera module, which is contrary to the current trend of light weight electronic devices.
Therefore, how to provide a camera module, when satisfying many cameras and shoot, reduce the volume of camera module is a technical problem that technical staff in the field need to solve urgently.
Disclosure of Invention
In view of this, the present invention provides a camera module, which uses a plastic package to package a base, so as to reduce the height of the camera module.
In order to achieve the purpose, the invention provides the following technical scheme:
a camera module, comprising:
a substrate;
the bonding pad is arranged on the surface of the substrate and is provided with a preset pattern;
the camera is arranged at a preset position of the bonding pad;
the optical filter is arranged on one side, away from the bonding pad, of the camera, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate;
one end of the connecting lead is electrically connected with the camera, and the other end of the connecting lead is electrically connected with the bonding pad;
and the plastic package film layer covers the connecting point of the connecting lead and the bonding pad and the connecting point of the connecting lead and the camera.
Alternatively to this, the first and second parts may,
and the thickness of the plastic package film layer is more than or equal to the height of the connecting lead from the substrate along a first direction perpendicular to the substrate.
Alternatively to this, the first and second parts may,
the plastic package film layer also covers the camera and the optical filter.
Alternatively to this, the first and second parts may,
the camera module comprises two cameras, one camera is arranged at a first preset position of the bonding pad, the other camera is arranged at a second preset position of the bonding pad, and the projections of the two cameras on the substrate are not overlapped with each other.
Alternatively to this, the first and second parts may,
the camera module further comprises two light shielding sheets, the projection of one light shielding sheet on the substrate covers the projection of one camera on the substrate, and the projection of the other light shielding sheet on the substrate covers the projection of the other camera on the substrate.
Alternatively to this, the first and second parts may,
the projection parts of the two cameras in the second direction parallel to the substrate are overlapped.
Alternatively to this, the first and second parts may,
the projections of the two cameras in a second direction parallel to the substrate all overlap.
Alternatively to this, the first and second parts may,
projections of the two cameras in a second direction parallel to the substrate do not overlap.
A method of manufacturing a camera module for packaging any one of the above camera modules, the method comprising:
providing the substrate;
forming the pad on the substrate;
laying at least one camera and the optical filter on the bonding pad;
welding the connecting points of the camera and the bonding pad through a connecting lead to form an intermediate piece;
and carrying out plastic package on the middleware to form the camera module.
An electronic device comprises any one of the camera modules.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
this scheme provides a camera module, includes: the device comprises a substrate, a bonding pad, at least one camera, a light filter, a connecting lead and a plastic package film layer. The pad has a preset pattern and is arranged on the surface of the substrate, and the camera is arranged at a preset position of the pad. Specifically, the optical filter is arranged on one side of the camera, which is far away from the bonding pad, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate. Except that this, this scheme makes camera and pad link to each other through connecting the lead wire, and finally, carries out the plastic envelope to the camera after the subsides dress. Adopt the mode of plastic envelope, compare the base loading mode among the prior art, can reduce the height of whole camera module, and then reduce the volume of camera module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a camera module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a method for manufacturing a camera module according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present invention, where the camera module includes: the device comprises a substrate 11, a bonding pad 12, at least one camera 13, a filter 14, a connecting lead 15 and a plastic film layer.
The bonding pad is arranged on the surface of the substrate and is provided with a preset pattern. The camera is arranged at a preset position of the bonding pad. The optical filter is arranged on one side, far away from the bonding pad, of the camera, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate. One end of the connecting lead is electrically connected with the camera, and the other end of the connecting lead is electrically connected with the bonding pad. The plastic package film layer covers the connecting point of the connecting lead and the bonding pad and the connecting point of the connecting lead and the camera.
It is thus clear that the camera module that this scheme provided adopts the mode of plastic envelope to encapsulate the camera, compares and adopts Holder integrated into one piece's mode among the prior art, and the thickness of camera module reduces to some extent.
Specifically, the LCP material is adopted to the Holder structure among the prior art, and the line arc height is considered in the shaping needs, therefore the safe interval need be reserved in the design, and this scheme adopts plastic envelope structural style, and plastic envelope direct forming wholly fills to be parallel with connecting lead (for example gold thread), reduces Holder safe interval difference in height, and consequently the camera module that this scheme provided is more frivolous, and the volume is littleer.
On the basis of the foregoing embodiments, in the camera module provided in this embodiment, as shown in fig. 2, along a first direction Y perpendicular to the substrate, the thickness of the plastic film layer 16 is greater than or equal to the height of the connecting leads from the substrate.
That is, the plastic package is entirely filled to be parallel to the connection leads.
In addition, in the camera module provided by this embodiment, the plastic package film layer may further cover the camera and the optical filter.
Specifically, the camera module that this embodiment provided includes two cameras, one the camera setting is in the first default position of pad, another camera setting is in the second default position of pad, and two the camera is in projection on the base plate does not overlap each other.
Correspondingly, the camera module further comprises two light shielding sheets, the projection of one light shielding sheet on the substrate covers the projection of one camera on the substrate, and the projection of the other light shielding sheet on the substrate covers the projection of the other camera on the substrate.
It should be noted that, according to different design positions of the two cameras, in this embodiment, as shown in fig. 3 to fig. 5, the cameras in the camera module may present various positional relationships, for example: the projections of the two cameras in the second direction X parallel to the substrate are partially overlapped. As another example, projections of the two cameras in a second direction parallel to the substrate all overlap. For another example, projections of the two cameras in a second direction parallel to the substrate do not overlap.
However, no matter how the position of camera, the mode of plastic envelope is all adopted to the camera module that this scheme provided, reduces the whole size of camera module.
On the basis of the foregoing embodiments, the present embodiment further provides a manufacturing method for packaging any one of the foregoing camera modules, as shown in fig. 6, the manufacturing method includes:
s61, providing the substrate;
s62, forming the pad on the substrate;
s63, laying at least one camera and the optical filter on the welding pad;
s64, welding the connection points of the camera and the bonding pad through a connection lead to form an intermediate piece;
and S65, carrying out plastic package on the middleware to form the camera module.
That is, in the prior art, after the traditional PCB is subjected to plastic package after SMT, a package method of Holder mounting is adopted, and the flow thereof is as follows: SMT (surface mounting technology) -Die Bonding-Wire Bonding-Holder carrying and COB semi-finished product packaging are completed.
The technical process of the scheme is as follows: SMT-plastic packaging-Die Bonding-Wire Bonding to complete COB packaging, and the plastic packaging structure is remarkably reduced in finishing height due to the changed production structure and process flow mode.
In addition, the embodiment also provides an electronic device including any one of the camera modules. The working principle of the camera module is as described above.
To sum up, this scheme provides a camera module, manufacturing method and electronic equipment, and this camera module includes: the device comprises a substrate, a bonding pad, at least one camera, a light filter, a connecting lead and a plastic package film layer. The pad has a preset pattern and is arranged on the surface of the substrate, and the camera is arranged at a preset position of the pad. Specifically, the optical filter is arranged on one side of the camera, which is far away from the bonding pad, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate. Except that this, this scheme makes camera and pad link to each other through connecting the lead wire, and finally, carries out the plastic envelope to the camera after the subsides dress. Adopt the mode of plastic envelope, compare the base loading mode among the prior art, can reduce the height of whole camera module, and then reduce the volume of camera module.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The utility model provides a camera module which characterized in that includes:
a substrate;
the bonding pad is arranged on the surface of the substrate and is provided with a preset pattern;
the camera is arranged at a preset position of the bonding pad;
the optical filter is arranged on one side, away from the bonding pad, of the camera, and the projection of the optical filter on the substrate covers the projection of the camera on the substrate;
one end of the connecting lead is electrically connected with the camera, and the other end of the connecting lead is electrically connected with the bonding pad;
the plastic package rete, the plastic package rete covers the connecting lead with the tie point of pad and the connecting lead with the tie point of camera, the plastic package rete still covers the camera and the light filter.
2. The camera module of claim 1,
and the thickness of the plastic package film layer is more than or equal to the height of the connecting lead from the substrate along a first direction perpendicular to the substrate.
3. The camera module according to claim 1, wherein the camera module comprises two cameras, one camera is disposed at a first preset position of the bonding pad, the other camera is disposed at a second preset position of the bonding pad, and projections of the two cameras on the substrate do not overlap with each other.
4. The camera module of claim 3, further comprising two gobos, a projection of one of the gobos onto the substrate overlapping a projection of one of the cameras onto the substrate, and a projection of the other of the gobos onto the substrate overlapping a projection of the other of the cameras onto the substrate.
5. The camera module of claim 3, wherein the projections of the two cameras in the second direction parallel to the substrate overlap.
6. The camera module of claim 3, wherein projections of the two cameras in a second direction parallel to the substrate all overlap.
7. The camera module of claim 3, wherein projections of the two cameras in a second direction parallel to the substrate do not overlap.
8. A method of manufacturing for packaging a camera module according to any one of claims 1-7, the method comprising:
providing the substrate;
forming the pad on the substrate;
laying at least one camera and the optical filter on the bonding pad;
welding the connecting points of the camera and the bonding pad through a connecting lead to form an intermediate piece;
and carrying out plastic package on the middleware to form the camera module.
9. An electronic device, comprising the camera module according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810538300.3A CN108769466B (en) | 2018-05-30 | 2018-05-30 | Camera module, manufacturing method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810538300.3A CN108769466B (en) | 2018-05-30 | 2018-05-30 | Camera module, manufacturing method and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN108769466A CN108769466A (en) | 2018-11-06 |
| CN108769466B true CN108769466B (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810538300.3A Active CN108769466B (en) | 2018-05-30 | 2018-05-30 | Camera module, manufacturing method and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111881719B (en) * | 2020-06-09 | 2024-04-16 | 青岛奥美克生物信息科技有限公司 | Non-contact type biological recognition guiding device, method and biological feature recognition system |
Citations (5)
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| CN101968563A (en) * | 2009-07-27 | 2011-02-09 | 昆山钜亮光电科技有限公司 | Reflow soldering stacked lens component |
| CN103581557A (en) * | 2012-07-30 | 2014-02-12 | Lg伊诺特有限公司 | Camera module |
| CN205123864U (en) * | 2015-11-20 | 2016-03-30 | 乐视移动智能信息技术（北京）有限公司 | Camera packaging part and electronic product encapsulating shell |
| WO2017166798A1 (en) * | 2016-03-28 | 2017-10-05 | 宁波舜宇光电信息有限公司 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| CN108012055A (en) * | 2017-11-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of multi-cam module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108810343A (en) * | 2017-05-06 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
-
2018
- 2018-05-30 CN CN201810538300.3A patent/CN108769466B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101968563A (en) * | 2009-07-27 | 2011-02-09 | 昆山钜亮光电科技有限公司 | Reflow soldering stacked lens component |
| CN103581557A (en) * | 2012-07-30 | 2014-02-12 | Lg伊诺特有限公司 | Camera module |
| CN205123864U (en) * | 2015-11-20 | 2016-03-30 | 乐视移动智能信息技术（北京）有限公司 | Camera packaging part and electronic product encapsulating shell |
| WO2017166798A1 (en) * | 2016-03-28 | 2017-10-05 | 宁波舜宇光电信息有限公司 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| CN108012055A (en) * | 2017-11-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of multi-cam module |
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| CN108769466A (en) | 2018-11-06 |
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