CN201594864U - Hardboard structured camera module capable of being directly welded on main board - Google Patents
Hardboard structured camera module capable of being directly welded on main board Download PDFInfo
- Publication number
- CN201594864U CN201594864U CN2010201095773U CN201020109577U CN201594864U CN 201594864 U CN201594864 U CN 201594864U CN 2010201095773 U CN2010201095773 U CN 2010201095773U CN 201020109577 U CN201020109577 U CN 201020109577U CN 201594864 U CN201594864 U CN 201594864U
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- camera module
- main board
- hardboard
- directly welded
- group lens
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Abstract
The embodiment of the utility model discloses a hardboard structured camera module capable of being directly welded on a main board, which comprises a camera module lens, a photosensitive chip mounted on the camera module lens, a camera module lens seat mounting the camera module lens and a PCB substrate carrying the camera module lens seat, wherein a copper plated half hole is formed on the PCB substrate. In the hardboard structured module capable of being directly welded on the main board of a mobile phone disclosed by the embodiment of the utility model, the PCB type camera module does not need a connector or an FPC during the assembly and connection process with the main board of the mobile phone, and the welding way is adopted for realizing the connection with the main board of the mobile phone, thereby being very firmly welded on the main board of the mobile phone and improving the anti-drop performance of the product.
Description
Technical field
The utility model relates to picture pick-up device manufacturing technology field, more particularly, relates to the hardboard structure shooting module that can be directly welded on the mainboard.
Background technology
At present, the shooting module adopt usually BTB connector or pluging connector realize with cell phone mainboard between be connected, need make a video recording module and cell phone mainboard of the connection of BTB connector welds a set of connectors respectively, is connected with connector on the cell phone mainboard by the connector of shooting module and realizes connecting; Need the make a video recording FPC of design strip on the module of pluging connector, the corresponding pluging connector of welding on the cell phone mainboard, the shooting module is realized connecting by being connected of strip FPC on the shooting module and pluging connector with cell phone mainboard, be that the BTB connector or the connection of plug-in type all are unstable, the shatter-resistant performance is not good, and the assembly cost of BTB connector or pluging connector shooting module and cell phone mainboard is unfavorable for that than higher manufacturer reduces production costs.
The utility model content
In view of this, the utility model provides the hardboard structure shooting that can be directly welded on mainboard module, is used to realize making a video recording module and more firm being connected of cell phone mainboard.
For achieving the above object, the utility model provides following technical scheme:
A kind of hardboard structure shooting module that is directly welded on the mainboard comprises:
Camera module group lens;
Be installed in the sensitive chip on the described camera module group lens;
The camera module group lens seat of described camera module group lens is installed;
Be equipped with the PCB substrate of described camera module group lens seat, described PCB substrate is provided with copper facing half hole.
Preferably, in the above-mentioned hardboard mechanism module that is directly welded on the mainboard, the monolateral monolateral big 0.5~10.mm of described PCB substrate than described camera module group lens seat.
Preferably, in the above-mentioned hardboard mechanism module that is directly welded on the mainboard, described PCB substrate is provided with and the identical groove of described camera module group lens seat size.
From above-mentioned technical scheme as can be seen, being directly welded in the hardboard mechanism module on the mainboard among the utility model embodiment, the shooting module of PCB type with the assembling connection procedure of cell phone mainboard in do not need connector or FPC, adopt the mode of welding to realize and being connected of cell phone mainboard, can be very firm be welded on the cell phone mainboard improved the shatter-resistant performance of product.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the hardboard structure shooting module on the be directly welded in mainboard that Fig. 1 provides for the utility model embodiment;
The structural perspective of the hardboard structure shooting module on the be directly welded in mainboard that Fig. 2 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of hardboard structure shooting module that is directly welded on the mainboard, to realize shooting module and more firm being connected of cell phone mainboard.
Shown in Fig. 1-2, a kind of hardboard structure shooting module that is directly welded on the mainboard comprises: camera module group lens 4; Be installed in the sensitive chip on the described camera module group lens; The camera module group lens seat 3 of described camera module group lens is installed; Be equipped with the PCB substrate 1 of described camera module group lens seat, described PCB substrate 1 is provided with copper facing half hole 2, and the monolateral monolateral big 0.5~10.mm than described camera module group lens seat of described PCB substrate scalds lens mount when preventing to weld.
When the assembling of welding PCB type shooting module, do not need connector or FPC in the utility model, effectively reduce the assembly cost of module cost and shooting module and cell phone mainboard.And the PCB substrate can be very firm be welded on the cell phone mainboard, improved the shatter-resistant reliability of product.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (3)
1. the hardboard structure shooting module that can be directly welded on the mainboard is characterized in that, comprising:
Camera module group lens;
Be installed in the sensitive chip on the described camera module group lens;
The camera module group lens seat of described camera module group lens is installed;
Be equipped with the PCB substrate of described camera module group lens seat, described PCB substrate is provided with copper facing half hole.
2. the hardboard structure shooting module that is directly welded on the mainboard according to claim 1 is characterized in that the monolateral monolateral big 0.5~10.mm than described camera module group lens seat of described PCB substrate.
3. the hardboard structure shooting module that is directly welded on the mainboard according to claim 2 is characterized in that, described PCB substrate is provided with and the identical groove of described camera module group lens seat size.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201095773U CN201594864U (en) | 2010-01-29 | 2010-01-29 | Hardboard structured camera module capable of being directly welded on main board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201095773U CN201594864U (en) | 2010-01-29 | 2010-01-29 | Hardboard structured camera module capable of being directly welded on main board |
Publications (1)
Publication Number | Publication Date |
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CN201594864U true CN201594864U (en) | 2010-09-29 |
Family
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CN2010201095773U Expired - Lifetime CN201594864U (en) | 2010-01-29 | 2010-01-29 | Hardboard structured camera module capable of being directly welded on main board |
Country Status (1)
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CN (1) | CN201594864U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576674A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module and image sensing chip package structure thereof |
CN104580862A (en) * | 2014-12-31 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
CN105516574A (en) * | 2016-02-23 | 2016-04-20 | 珠海格力电器股份有限公司 | Electronic apparatus and connecting component of camera thereof |
-
2010
- 2010-01-29 CN CN2010201095773U patent/CN201594864U/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576674A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module and image sensing chip package structure thereof |
CN104576674B (en) * | 2014-12-25 | 2017-07-11 | 南昌欧菲光电技术有限公司 | Camera module and its encapsulation structure of image sensing chip |
CN104580862A (en) * | 2014-12-31 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
CN104580862B (en) * | 2014-12-31 | 2018-04-06 | 南昌欧菲光电技术有限公司 | Camera module |
CN105516574A (en) * | 2016-02-23 | 2016-04-20 | 珠海格力电器股份有限公司 | Electronic apparatus and connecting component of camera thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TRULY OPTO-ELECTRONICS LTD. Free format text: FORMER NAME: TRULY OPTO-ELECTRONICS LIMITED |
|
CP03 | Change of name, title or address |
Address after: 516600 Guangdong Industrial Zone, Shanwei City Road, Lee Lee Industrial City, a district of the building fifteenth Patentee after: Truly Opto-Electronics Ltd. Address before: 516600, Xinli industrial town, industrial road, Shanwei City, Guangdong Patentee before: Truly Semiconductors (Shanwei) Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20100929 |
|
CX01 | Expiry of patent term |