CN202335061U - Semi-hole printed circuit board - Google Patents

Semi-hole printed circuit board Download PDF

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Publication number
CN202335061U
CN202335061U CN2011203749023U CN201120374902U CN202335061U CN 202335061 U CN202335061 U CN 202335061U CN 2011203749023 U CN2011203749023 U CN 2011203749023U CN 201120374902 U CN201120374902 U CN 201120374902U CN 202335061 U CN202335061 U CN 202335061U
Authority
CN
China
Prior art keywords
hole
semi
printed circuit
circuit board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203749023U
Other languages
Chinese (zh)
Inventor
黄朝安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN XINGDA PCB CO Ltd
Original Assignee
SHENZHEN XINGDA PCB CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN XINGDA PCB CO Ltd filed Critical SHENZHEN XINGDA PCB CO Ltd
Priority to CN2011203749023U priority Critical patent/CN202335061U/en
Application granted granted Critical
Publication of CN202335061U publication Critical patent/CN202335061U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a semi-hole printed circuit board, comprising a basal plate, a through hole and at least one semi-hole, wherein the basal plate is a metal basal plate with double faces; the round through hole is arranged on the basal plate; and the semi-hole is arranged on the basal plate; the semi-hole side face serves as a fitting face for pressing and connecting to form a subplate with increased functions; the semi-metallized hole of the subplate plate is welded with a mother plate or a pin of an element device to enhance the welding performance, so as to improve product quality, reduce product volume and realize the characteristics of various functions and light volume. The semi-hole printed circuit board is small in volume, high in practicability and sufficient in welding and is in favor of product mounting.

Description

A kind of half hole printed circuit board
Technical field
The utility model relates to a kind of printed circuit board, is specifically related to a kind of half hole printed circuit board.
Background technology
Printed circuit board is a kind of element of electronic product, and along with the continuous development of electronic product, common printed circuit board can't satisfy users' demand; The client is also more and more diversified to the requirement of printed circuit board, the increase day by day of electronic product function, and it is more and more littler that corresponding volume but requires; But as a rule increased functionally, then in circuit board manufacturing, need increase a lot of circuits, utilized the connection of circuit to realize multi-functional; Usually all be the integral body connection through circular hole, being added in the lump on the same plate of some extra functions, circuit too much can cause entire area to increase; This model will strengthen the area of plate accordingly; Also can cause welding performance bad and in welding process, cause short circuit easily, thereby influence product quality, and can not satisfy the little demand of volume.
The utility model content
The utility model technical problem to be solved is to provide a kind of avoiding to increase solder shorts and the half excessive hole printed circuit board of volume that causes because of function.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme:
A kind of half hole printed circuit board comprises substrate and through hole, and said substrate is the double-sided metal substrate, and said through hole is located at said substrate, and said through hole is circular, also comprises at least one half hole, and said substrate is located in said half hole.
Preferably, in the utility model, said half hole one side is connected with said substrate, and opposite side is empty, and said half hole can be located in the plate of said substrate, also can be located at the edges of boards of said substrate.
Preferably, in the utility model, said half hole internal surface of hole has metal level.
The utility model contrast prior art has following advantage: utilize the mating surface of side, half hole as crimping; Forming a product increases the daughter board of function; The semi-metal hole of daughter board and the pin of motherboard or components and parts be welded together strengthening welding performance, and the volume that has improved the quality of product and reduced product has been realized the characteristics of functional diversities, lightweight and portable in volumeization; Small product size is little, practical, welding is abundant, helps product and mounts.
Description of drawings
Accompanying drawing 1 is the utility model main structure chart;
Accompanying drawing 2 is the utility model first embodiment sketch map;
Accompanying drawing 3 is the utility model second embodiment sketch map.
Embodiment
Existing with reference to accompanying drawing, further explain the utility model.
As shown in Figure 1, a kind of half hole printed circuit board comprises substrate 1 and through hole 2, and substrate 1 be the double-sided metal substrate, and through hole 2 is located at substrate 1, and through hole 2 is a circle, comprises that also at least one 3, half hole 3, half hole is located at substrate 1.
Half hole, 3 one sides are connected with substrate 1, and opposite side is empty, and half hole 3 can be located in the plate of substrate 1, also can be located at the edges of boards of substrate 1, and the number in half hole 3 can be provided with according to the production needs voluntarily.
As shown in Figure 2, among the utility model first embodiment, the number in half hole 3 forms row, position in the plate of substrate 1, and the opposite side that a side connects substrate 1, half hole 3 is empty groove.
As shown in Figure 3, different is the edges of boards that half hole 3 can also be located at substrate 1 for the utility model second embodiment and the utility model first embodiment.
Half hole, 3 internal surface of hole have metal level; Utilize the mating surface of 3 sides, half hole as crimping, form the daughter board that a product increases function, the semi-metal hole of daughter board and the pin of motherboard or components and parts are welded together to strengthen welding performance; The volume that has improved the quality of product and reduced product; Realized the characteristics of functional diversities, lightweight and portable in volumeization, small product size is little, practical, welding fully, help product and mount.
Above-described the utility model execution mode does not constitute the qualification to the utility model protection range.The modification of being done within any spirit and principle at the utility model, be equal to replacement and improvement etc., all should be included within the claim protection range of the utility model.

Claims (3)

1. one and half hole printed circuit boards comprise substrate and through hole, and said substrate is the double-sided metal substrate, and said through hole is located at said substrate, and said through hole is circular, it is characterized in that also comprise at least one half hole, said substrate is located in said half hole.
2. a kind of half hole printed circuit board according to claim 1 is characterized in that, said half hole one side is connected with said substrate, and opposite side is empty.
3. a kind of half hole printed circuit board according to claim 1 is characterized in that said half hole internal surface of hole has metal level.
CN2011203749023U 2011-09-28 2011-09-28 Semi-hole printed circuit board Expired - Fee Related CN202335061U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203749023U CN202335061U (en) 2011-09-28 2011-09-28 Semi-hole printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203749023U CN202335061U (en) 2011-09-28 2011-09-28 Semi-hole printed circuit board

Publications (1)

Publication Number Publication Date
CN202335061U true CN202335061U (en) 2012-07-11

Family

ID=46447023

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203749023U Expired - Fee Related CN202335061U (en) 2011-09-28 2011-09-28 Semi-hole printed circuit board

Country Status (1)

Country Link
CN (1) CN202335061U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104219879A (en) * 2014-09-05 2014-12-17 武汉永力睿源科技有限公司 Electrical connection method of printed circuit boards and products
CN105979699A (en) * 2016-07-22 2016-09-28 深圳天珑无线科技有限公司 Printed circuit board and mobile phone housing
CN111402882A (en) * 2020-03-27 2020-07-10 四川虹美智能科技有限公司 Intelligent voice module and operation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104219879A (en) * 2014-09-05 2014-12-17 武汉永力睿源科技有限公司 Electrical connection method of printed circuit boards and products
CN105979699A (en) * 2016-07-22 2016-09-28 深圳天珑无线科技有限公司 Printed circuit board and mobile phone housing
CN111402882A (en) * 2020-03-27 2020-07-10 四川虹美智能科技有限公司 Intelligent voice module and operation method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120711

Termination date: 20190928