CN202602845U - Micro circuit board apparatus for minitype loudspeaker device - Google Patents
Micro circuit board apparatus for minitype loudspeaker device Download PDFInfo
- Publication number
- CN202602845U CN202602845U CN 201220000415 CN201220000415U CN202602845U CN 202602845 U CN202602845 U CN 202602845U CN 201220000415 CN201220000415 CN 201220000415 CN 201220000415 U CN201220000415 U CN 201220000415U CN 202602845 U CN202602845 U CN 202602845U
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- Prior art keywords
- microcircuit
- circuit board
- hole structure
- ground connection
- board apparatus
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- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 230000006698 induction Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 2
- 230000002596 correlated effect Effects 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a micro circuit board apparatus for a minitype loudspeaker device, wherein the micro circuit board apparatus has an improved structure and an innovation function. The micro circuit board apparatus comprises a substrate portion, a loudspeaker signal line pad portion, and two-sided grounding plate portions with a through hole structure. The micro circuit board apparatus is characterized in that the substrate portion is in a plane structure and the loudspeaker signal line pad portion is arranged at the right side; and the two-sided grounding plate portions with the through hole structure are arranged at the right side and the back side of the substrate. And the signal line pad, the two-sided grounding plate surfaces with the through hole structure as well as the inner wall of the through hole are covered by gold-plating layers. According to the utility model, the advantages of the micro circuit board apparatus are at least as follows: compared with the traditional micro circuit board apparatus, the provided micro circuit board apparatus enables the two-sided grounding plates with the through hole structure to be added based on the basic cost neutrality and the guarantee of original functions and manufacturability of the micro circuit board apparatus; the manufacturability of correlated minitype loudspeaker products are substantially improved; the difficulty of the manufacturing process and the production cost are effectively reduced; and the application range is wide.
Description
Technical field
The utility model relates to a kind of electrical signal conduction and electromagnetic shielding servicing unit, and particularly a kind of microcircuit panel assembly that is applied in the Microspeaker device belongs to the electroacoustics field.
Background technology
The microcircuit panel assembly that is used for the Microspeaker device in the market generally adopts dull and stereotyped single-sided structure; The manufacturing processing of this kind microcircuit panel assembly is simple relatively; But its function singleness is handled if need carry out ground connection to the Microspeaker metal shell because of the electromagnetic shielding purpose, need add the ground connection wire rod and uses resistance welded to add modes such as adhesive is bonding and assemble; Technology difficulty is big, and manufacturing cost is high; And it is relatively poor that traditional microcircuit plate adds the environmental stability of ground connection wire rod mode, and the variation of ambient temperature, humidity all can cause negative effect greatly to its ground connection performance.In a word, the mode that existing microcircuit plate adds the earth connection material has difficult technique, high, the unsettled deficiency of cost, has limited further developing of Related product.
Summary of the invention
The utility model is intended to propose a kind of microcircuit panel assembly of Microspeaker device; It has kept the function and the characteristics of traditional microcircuit plate design and has done reasonable optimizing and innovation; Greatly improved the manufacturability of Related product; Reduced its manufacturing cost effectively, and, have very great help for the enhancing of product environmental stability.
For realizing the foregoing invention purpose, the utility model has adopted following technical scheme:
A kind of microcircuit panel assembly that is used for Microspeaker with structure-improved and new function, it is by substrate portion, and loudspeaker signal line pad portion is formed with two-sided ground connection disc portion three parts that have through-hole structure.It is characterized in that: said substrate portion is a planar structure, is equipped with said loudspeaker signal line pad portion in its front, simultaneously, also is equipped with the two-sided ground connection disc portion of said band through-hole structure at its tow sides.
Further; The two-sided ground connection panel surface of said holding wire pad and band through-hole structure and through-hole wall all have Gold plated Layer to cover; Guaranteeing the solderability of said holding wire pad, and the two sides of the two-sided ground connection dish of said band through-hole structure is the integral body of a conducting on circuit.
Simultaneously, the signal line group of the magnetic induction coil of said Microspeaker device is connected with the conducting of said holding wire pad respectively, and the metal shell of said Microspeaker device is connected with the two-sided ground connection dish reverse side conducting of said band through-hole structure.
Preferably, the conducting connected mode between the signal line group of the magnetic induction coil of said holding wire pad and said Microspeaker device is scolding tin or resistance welded; Conducting connected mode between the two-sided ground connection dish reverse side of said band through-hole structure and the metal shell of said Microspeaker device is the bonding or resistance welded of electroconductive binder.
Compared with prior art, the advantage of the utility model is:
(1) than existing dull and stereotyped single face microcircuit panel assembly, the utility model has kept the function and the characteristics of traditional microcircuit plate design and has done reasonable optimizing and innovation, has added the two-sided ground connection dish of band through-hole structure, has enriched the function of microcircuit plate;
(2) the microcircuit plate has reasonably added the two-sided ground connection dish of band through-hole structure in the utility model, has greatly reduced the technology difficulty that ground connection that Microspeaker device metal shell carries out because of electromagnetic shielding is handled, and has reduced its manufacturing cost effectively;
(3) the two-sided ground connection dish of the band through-hole structure that added of the microcircuit panel assembly in the utility model; Compare traditional ground connection wire rod and increased the contact area with Microspeaker device metal shell; For Microspeaker device metal shell provides a kind of more stable implementation effectively because of the ground connection processing that electromagnetic shielding carries out; Conscientiously improved the environmental stability of relevant Microspeaker device; Widened its scope of application greatly, strengthened competitiveness of product, very big market popularization value has been arranged.
Description of drawings
Fig. 1 is existing dull and stereotyped single-sided structure microcircuit plate sketch map;
Fig. 2 is the reverse side sketch map of Fig. 1;
Fig. 3 is the micro-circuit board structural representation that the utility model is used for the Microspeaker device;
Fig. 4 is the reverse side sketch map of Fig. 3;
Fig. 5 is that the circuit that microcircuit panel assembly that the utility model is used for the Microspeaker device is applied to a kind of Microspeaker device connects sketch map;
Fig. 6 is the structural representation that microcircuit panel assembly that the utility model is used for the Microspeaker device is applied to a kind of Microspeaker device;
Each Reference numeral and indicated assembly thereof are respectively among the figure:
The A1-substrate, A2-holding wire pad, the two-sided ground connection dish of A 3-band through-hole structure
The B1-Microspeaker, B2-magnetic induction coil signal line group
C1-classical signals line pad, C2-tradition ground connection dish
Embodiment
Be further described below in conjunction with accompanying drawing and a preferred embodiment technical scheme the utility model.
Consult Fig. 2-6; Present embodiment relates to a kind of microcircuit panel assembly that is applied to the Microspeaker device, and it comprises substrate portion A1, and loudspeaker signal line pad portion A2 forms with two-sided ground connection disc portion A3 three parts that have through-hole structure; Aforesaid base plate part A 1 is a planar structure; Be equipped with said loudspeaker signal line pad portion A2 in its front, simultaneously, aforesaid base plate part A 1 tow sides also are equipped with the two-sided ground connection disc portion A3 of said band through-hole structure.
Because the self structure characteristics of microcircuit plate in the present embodiment are preferred, the microcircuit plate among this embodiment is processed by operations such as punching, plating, etching are die-cut again on manufacture craft.
Simultaneously; Surface and the through-hole wall of the two-sided ground connection dish A3 of aforementioned holding wire pad A2 and band through-hole structure all have Gold plated Layer to cover; Guaranteeing the solderability of said holding wire pad A2, and the two sides of the two-sided ground connection dish A3 of aforementioned band through-hole structure is the integral body of a conducting on circuit.
In the time of in being applied to Microspeaker device B1; Aforementioned holding wire pad A2 is connected with the signal line group B2 difference conducting of the magnetic induction coil of Microspeaker device, and the reverse side of the two-sided ground connection dish A3 of aforementioned band through-hole structure is connected with the metal shell conducting of Microspeaker device B1.Preferred conducting connects execution mode, and the conducting connected mode between the signal line group B2 of said holding wire pad A2 and the magnetic induction coil of said Microspeaker device B1 is that scolding tin is connected; Conducting connected mode between the reverse side of the two-sided ground connection dish A 3 of said band through-hole structure and the metal shell of said Microspeaker device B1 is that electroconductive binder is bonding.
During work; The signal of telecommunication is imported into the input of signal line group B2 of the magnetic induction coil of the Microspeaker device B1 that is connected with its conducting by the end of holding wire pad A2; Microspeaker device B1 is inner accomplish the transducing sounding after, form the loop with the other end of holding wire pad A2 and spread out of.Simultaneously; The front of the two-sided ground connection dish A3 of said band through-hole structure is owing to the metal shell of the reverse side that is connected with its conducting and said Microspeaker device B1 also conducting is connected the integral body that forms a conducting, can be used for the effect of playing ground connection with being connected of peripheral auxiliary circuits and then reaching effectiveness.
The utility model has been done reasonable optimizing and innovation than existing microcircuit panel assembly on the basis of function that keeps traditional microcircuit plate design and characteristics, added the two-sided ground connection dish of band through-hole structure, has enriched the function of microcircuit plate; In the utility model the microcircuit plate has reasonably added the two-sided ground connection dish of band through-hole structure, has greatly reduced the technology difficulty that ground connection that Microspeaker device metal shell carries out because of electromagnetic shielding is handled, and has reduced its manufacturing cost effectively; The two-sided ground connection dish of the band through-hole structure that the microcircuit panel assembly in the utility model is added; Compare traditional ground connection wire rod and increased the contact area with Microspeaker device metal shell; For Microspeaker device metal shell provides a kind of more stable implementation effectively because of the ground connection processing that electromagnetic shielding carries out; Conscientiously improved the environmental stability of relevant Microspeaker device; Widened its scope of application greatly, strengthened competitiveness of product, very big market popularization value has been arranged.
More than purpose, technical scheme and the beneficial effect of the utility model carried out further explain; Institute is understood that; The preferred embodiment that the above is merely the utility model is not limited to the utility model, and is all within the spirit and principle of the utility model; Any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.
Claims (6)
1. microcircuit panel assembly that is used for the Microspeaker device is characterized in that: said microcircuit panel assembly is by substrate portion, and loudspeaker signal line pad portion is formed with two-sided ground connection disc portion three parts that have through-hole structure.
2. the microcircuit panel assembly that is used for the Microspeaker device according to claim 1; It is characterized in that: said substrate portion is a planar structure; Be equipped with said loudspeaker signal line pad portion in its front; Simultaneously, also be equipped with the two-sided ground connection disc portion of said band through-hole structure at its tow sides.
3. the microcircuit panel assembly that is used for the Microspeaker device according to claim 1 and 2; It is characterized in that: the two-sided ground connection panel surface and the through-hole wall of said holding wire pad and band through-hole structure all have Gold plated Layer to cover; Guaranteeing the solderability of said holding wire pad, and the two sides of the two-sided ground connection dish of said band through-hole structure is the integral body of a conducting on circuit.
4. the microcircuit panel assembly that is used for the Microspeaker device according to claim 1; It is characterized in that: used said microcircuit panel assembly in the said Microspeaker device; The signal line group of the magnetic induction coil of said Microspeaker device is connected with the conducting of said holding wire pad respectively, and the metal shell of said Microspeaker device is connected with the two-sided ground connection dish reverse side conducting of said band through-hole structure.
5. the microcircuit panel assembly that is used for the Microspeaker device according to claim 4 is characterized in that: the conducting connected mode between the signal line group of the magnetic induction coil of said holding wire pad and said Microspeaker device is scolding tin or resistance welded.
6. the microcircuit panel assembly that is used for the Microspeaker device according to claim 4 is characterized in that: the conducting connected mode between the two-sided ground connection dish reverse side of said band through-hole structure and the metal shell of said Microspeaker device is the bonding or resistance welded of electroconductive binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220000415 CN202602845U (en) | 2012-01-04 | 2012-01-04 | Micro circuit board apparatus for minitype loudspeaker device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220000415 CN202602845U (en) | 2012-01-04 | 2012-01-04 | Micro circuit board apparatus for minitype loudspeaker device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202602845U true CN202602845U (en) | 2012-12-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220000415 Expired - Lifetime CN202602845U (en) | 2012-01-04 | 2012-01-04 | Micro circuit board apparatus for minitype loudspeaker device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202602845U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079131A (en) * | 2012-12-25 | 2013-05-01 | 苏州恒听电子有限公司 | Circuit board with open and close hole and telephone receiver thereof |
| CN103200474A (en) * | 2012-01-04 | 2013-07-10 | 苏州恒听电子有限公司 | Micro circuit board device used for minitype loudspeaker device |
-
2012
- 2012-01-04 CN CN 201220000415 patent/CN202602845U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200474A (en) * | 2012-01-04 | 2013-07-10 | 苏州恒听电子有限公司 | Micro circuit board device used for minitype loudspeaker device |
| CN103079131A (en) * | 2012-12-25 | 2013-05-01 | 苏州恒听电子有限公司 | Circuit board with open and close hole and telephone receiver thereof |
| CN103079131B (en) * | 2012-12-25 | 2016-08-03 | 苏州恒听电子有限公司 | A kind of circuit board with opening and closing hole and receiver thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170122 Address after: The front road 215000 in Jiangsu province Suzhou city high tech Development Zone No. 299 Building 1 Patentee after: Suzhou Puliansi Electronic Technology Co., Ltd. Address before: High tech Zone Suzhou city Jiangsu province 215011 Chuk Yuen Road No. 209 Patentee before: Suzhou Hengting Electronic Co., Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170314 Address after: Song Ling Zhen Wujiang District of Suzhou City, Jiangsu province 215299 Suzhou River Road No. 18 Patentee after: Suzhou Yi Acoustic Technology Co. Ltd.. Address before: The front road 215000 in Jiangsu province Suzhou city high tech Development Zone No. 299 Building 1 Patentee before: Suzhou Puliansi Electronic Technology Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Suzhou Hengting Electronic Co., Ltd. Document name: Notification of Passing Examination on Formalities |
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| CP03 | Change of name, title or address |
Address after: 368 Youyi Road, Babai friendship Industrial Zone, Songling Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou Yiyi Electronic Technology Co., Ltd Address before: Song Ling Zhen Wujiang District of Suzhou City, Jiangsu province 215299 Suzhou River Road No. 18 Patentee before: Suzhou Yilan Acoustic Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215299 No. 168, Ludang Road, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province (north of the original Lingyi Road) Patentee after: Suzhou Yiyi Technology Co.,Ltd. Address before: No. 368, Youyi Road, Bache Youyi Industrial Zone, Songling Town, Wujiang District, Suzhou City, Jiangsu Province Patentee before: Suzhou Yiyi Electronic Technology Co., Ltd |
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| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121212 |
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| CX01 | Expiry of patent term |