CN211509146U - Double-camera module and electronic equipment - Google Patents
Double-camera module and electronic equipment Download PDFInfo
- Publication number
- CN211509146U CN211509146U CN202020218787.XU CN202020218787U CN211509146U CN 211509146 U CN211509146 U CN 211509146U CN 202020218787 U CN202020218787 U CN 202020218787U CN 211509146 U CN211509146 U CN 211509146U
- Authority
- CN
- China
- Prior art keywords
- camera
- unit
- light incident
- lens module
- incident surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to a two module and electronic equipment of making a video recording. This two modules of making a video recording include: a substrate; a first imaging unit disposed on the substrate; a second imaging unit provided on the substrate, a size of the second imaging unit on an optical axis thereof being smaller than a size of the first imaging unit on the optical axis thereof; the substrate is provided with a boss, and the second camera shooting unit is arranged on the boss so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit; and/or the substrate is provided with a groove, and the first camera shooting unit is arranged in the groove so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit. The utility model discloses in, through corresponding setting such as lug or recess, reduced the difference in height that makes between the income plain noodles of first camera unit and the income plain noodles of second camera unit to can reduce sheltering from of first camera unit to second camera unit, improve the visual field scope of second camera unit.
Description
Technical Field
The utility model relates to a camera technical field especially relates to a two modules and electronic equipment of making a video recording.
Background
Among the two camera modules among the prior art, include a wide camera and a long burnt camera usually, and long burnt camera is greater than wide camera in its optical axis direction's size at its optical axis direction ascending size, and there is the difference in height between the two income plain noodles of assembling back wide camera and the income plain noodles of long burnt camera, and this leads to wide camera to be sheltered from by long burnt camera easily, causes wide camera's angle of vision to reduce, influences the field range of two camera module formation of image.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a dual camera module and an electronic device, which solve the problem that the wide-angle camera is easily blocked and the angle of view is reduced in the conventional dual camera module.
A dual camera module, comprising: a substrate; a first imaging unit disposed on the substrate; a second imaging unit provided on the substrate, a size of the second imaging unit on an optical axis thereof being smaller than a size of the first imaging unit on the optical axis thereof; the substrate is provided with a boss, and the second camera shooting unit is arranged on the boss so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit; and/or the substrate is provided with a groove, and the first camera shooting unit is arranged in the groove so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit.
The utility model discloses in, through corresponding setting such as lug and recess, reduced the difference in height that makes between the income plain noodles of first camera unit and the income plain noodles of second camera unit to can reduce sheltering from of first camera unit to second camera unit, improve the angle of view of second camera unit, thereby can improve the formation of image effect of whole two modules of making a video recording. Wherein, in the actual product, first camera unit can be the long focus camera, and second camera unit can be wide-angle camera, through the utility model discloses a set up the mode, can reduce sheltering from of long focus camera to wide-angle camera, improve wide-angle camera's angle of vision.
Furthermore, the income plain noodles of second camera unit with the income plain noodles parallel and level of first camera unit can avoid first camera unit to the sheltering from of second camera unit like this, improves the imaging effect of whole two modules of making a video recording.
Further, the substrate further comprises a bottom plate, the bottom plate is provided with an upper surface, and the first camera unit and the boss are arranged on the upper surface.
Furthermore, the second camera unit comprises a second lens module and a second photosensitive chip, the second photosensitive chip and the second lens module are both arranged on the boss, and the second photosensitive chip is opposite to the second lens module and used for receiving light projected from the second lens module to perform imaging; the light incident surface of the second lens module is the light incident surface of the second camera unit, the optical axis of the second lens module is the optical axis of the second camera unit, and the size of the second camera unit on the optical axis refers to the size between the light incident surface of the second lens module and the light sensing surface of the second light sensing chip.
Further, the support comprises a first surface and a second surface which are arranged oppositely, and a through hole which penetrates from the first surface to the second surface; the first surface is connected with the bottom plate, the second surface is connected with the second lens module, a supporting structure is arranged on the inner wall of the through hole, and the second photosensitive chip is arranged on the supporting structure.
Furthermore, the through hole is a stepped hole, and the second photosensitive chip is arranged on the stepped surface of the stepped hole, so that the production is simpler and more convenient.
Further, in the direction from the first surface to the second surface, the stepped hole comprises a first hole and a second hole which are sequentially arranged and communicated, wherein the equivalent diameter of the first hole is larger than that of the second hole; and/or a first electrode pin is arranged on the step surface, a second electrode pin is arranged on the first surface, and the first electrode pin is electrically connected with the second electrode pin; the second photosensitive chip is provided with a third electrode pin, the bottom plate is provided with a fourth electrode pin, the third electrode pin is electrically connected with the first electrode pin, and the fourth electrode pin is electrically connected with the second electrode pin.
Further, the substrate further comprises a bottom plate, the bottom plate is provided with an upper surface, the groove is formed in the upper surface, and the second camera unit is arranged on the upper surface.
Further, the first camera unit comprises a first lens module and a first photosensitive chip, the first lens module is arranged on the first surface, and the first photosensitive chip is arranged in the groove and opposite to the first lens module, and is used for receiving the light projected from the first lens module to perform imaging; the light incident surface of the first lens module is the light incident surface of the first camera unit, the optical axis of the first lens module is the optical axis of the first camera unit, and the size of the first camera unit on the optical axis refers to the size between the light incident surface of the first lens module and the light sensing surface of the first light sensing chip.
Further, the first camera unit comprises a first lens module, the first lens module comprises a first lens and a first lens holder, the first lens is mounted on the first lens holder, and the first lens holder is mounted on the substrate; the second camera shooting unit comprises a second lens module, the second lens module comprises a second lens and a second lens base, the second lens is arranged on the second lens base, and the second lens base is arranged on the substrate; the light incident surface of the first lens is the light incident surface of the first camera unit, the optical axis of the first lens is the optical axis of the first camera unit, the light incident surface of the second lens module is the light incident surface of the second camera unit, the optical axis of the second lens module is the optical axis of the second camera unit, and the optical axis of the first lens is parallel to the optical axis of the second lens; the first microscope base and the second microscope base are arranged in the same structure. Only one kind of microscope base in a two modules of making a video recording promptly, can reduce the manufacturing cost of two modules of making a video recording like this.
An electronic device comprises the double camera modules, so that the shooting effect of the electronic device is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a dual camera module according to a first embodiment of the present invention;
FIG. 2 is a schematic enlarged view of a portion of the area M in FIG. 1;
fig. 3 is a schematic cross-sectional view of a dual camera module according to a second embodiment of the present invention;
FIG. 4 is a schematic enlarged view of a portion of the N region in FIG. 3;
fig. 5 is a schematic cross-sectional view of a dual camera module according to a third embodiment of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, in the present embodiment, the dual camera module 100 is a common-substrate camera module, and the dual camera module 100 includes a substrate 10, and a first camera unit 20 and a second camera unit 30 disposed on the substrate 10, wherein the first camera unit 20 and the second camera unit 30 are located on the same side of the substrate 10, and a dimension of the second camera unit 30 on an optical axis thereof is smaller than a dimension of the first camera unit 20 on an optical axis thereof.
As shown in fig. 1, in the present embodiment, the substrate 10 includes a boss 1 and a base plate 2, wherein the base plate 2 has an upper surface 21, the first imaging unit 20 and the boss 1 are both disposed on the upper surface 21 of the base plate 2, and the second imaging unit 30 is disposed on the boss 1. The height of the second camera unit 30 is raised through the boss 1 to increase the distance between the light incident surface 301 and the upper surface 21 of the second camera unit 30, so that the height difference between the light incident surface 301 of the second camera unit 30 and the light incident surface 201 of the first camera unit 20 can be reduced, the shielding of the first camera unit 20 on the second camera unit 30 is reduced, and the field range of the second camera unit 30 is improved.
It can be understood that, through suitable setting to boss 1, can make the income plain noodles 301 of second camera unit 30 and the income plain noodles 201 parallel and level of first camera unit 20, can avoid first camera unit 20 to make a video recording sheltering from of unit 30 to the second this moment, improve whole two imaging module 100's of making a video recording effect.
As shown in fig. 1, in the present embodiment, the first image pickup unit 20 includes a first lens module 3 and a first photo-sensing chip 4, the first lens module 3 being disposed on an upper surface 21 of the base plate 2; the first photosensitive chip 4 is also disposed on the upper surface 21 of the base plate 2, and is opposite to the first lens module 3, for receiving the light projected from the first lens module 3 to perform imaging. In this embodiment, the optical axis of the first lens module 3 is the optical axis of the first camera unit 20, and the optical axis direction of the first lens module 3 is the direction from the first lens module 3 to the first photosensitive chip 4; the light incident surface 31 of the first lens module 3 is the light incident surface 201 of the first camera unit 20, and the light incident surface 31 of the first lens module 3 is the surface of the first lens module 3 away from the first photo sensor chip 4; the size of the first image capturing unit 20 on the optical axis thereof is defined as the size between the light incident surface 31 of the first lens module 3 and the light sensing surface 41 of the first light sensing chip 4. In this embodiment, the base plate 2 is a circuit board, and the first photosensitive chip 4 is electrically connected to the circuit board, it should be understood that the first camera unit 20 and the base plate 2 form a complete camera, and the camera can be used as a telephoto camera of the dual camera module 100, so that the shooting distance of the dual camera module 100 is further.
As shown in fig. 1, in the present embodiment, the second image pickup unit 30 includes a second lens module 5 and a second photosensitive chip 6, and the second photosensitive chip 6 and the second lens module 5 are both provided on the boss 1; the second photosensitive chip 6 is electrically connected to the circuit board, and is opposite to the second lens module 5, and is configured to receive light projected from the second lens module 5 for imaging. In this embodiment, the optical axis of the second lens module 5 is the optical axis of the second camera unit 30, and the optical axis direction of the second lens module 5 is the direction from the second lens module 5 to the second photosensitive chip 6; the light incident surface 51 of the second lens module 5 is the light incident surface 301 of the second camera unit 30, and the light incident surface 51 of the second lens module 5 is the surface of the second lens module 5 away from the second light sensing chip 6; the size of the second image capturing unit 30 on the optical axis thereof is defined as the size between the light incident surface 51 of the second lens module 5 and the light sensing surface 61 of the second light sensing chip 6. In this embodiment, the second camera unit 30 and the bottom plate 2 form a complete camera, which can be used as a wide-angle camera of the dual camera module 100, so as to make the shooting range of the dual camera module 100 wider.
It should be understood that, after the dual camera module 100 is designed according to actual requirements, the sizes of the second lens module 5 and the second photosensitive chip 6 on the optical axis of the second camera unit 30 are fixed, and the distance between the second lens module 5 and the second photosensitive chip 6 is already determined, and the determined distance is defined as the first set distance, in this embodiment, the heights of the second lens module 5 and the second photosensitive chip 6 are simultaneously raised by the arrangement of the boss 1, without changing the size of the first set distance between the second lens module 5 and the second photosensitive chip 6, so that the imaging quality of the dual camera module 100 is not affected. Similarly, after the dual camera module 100 is designed, the sizes of the first lens module 3 and the first photo sensor chip 4 on the optical axis of the first camera unit 20 are fixed, and the distance between the first lens module 3 and the first photo sensor chip 4 is also determined, which is defined as a second set distance.
As shown in fig. 1 and fig. 2, in the present embodiment, the boss 1 includes a first surface 11 and a second surface 12 opposite to each other, and a through hole 13 penetrating from the first surface 11 to the second surface 12, wherein the first surface 11 is connected to an upper surface 21 of the base plate 2, and the second surface 12 is connected to the second lens module 5. In addition, in the present embodiment, the through hole 13 is a stepped hole, and the second photosensitive chip 6 is provided on the stepped surface 131 of the stepped hole.
Specifically, in the present embodiment, the stepped hole includes a first hole 132 and a second hole 133 that are arranged in this order and communicate in a direction from the first surface 11 to the second surface 12, wherein the equivalent diameter of the first hole 132 is larger than the equivalent diameter of the second hole 133. Here, the equivalent diameter of the first hole 132 refers to the diameter of a circle having the same cross-sectional area as the first hole 132, and the equivalent diameter of the second hole 133 refers to the diameter of a circle having the same cross-sectional area as the second hole 133. In addition, in the present embodiment, the first hole 132 and the second hole 133 may be circular holes, square holes, or the like.
As shown in fig. 2, the step surface 131 is provided with a first electrode lead 14, the first surface 11 is provided with a second electrode lead 15, and the first electrode lead 14 and the second electrode lead 15 are electrically connected. Specifically, in this embodiment, the inner wall 134 of the through hole 13 is provided with a wire groove 16, the wire groove 16 extends from the step surface 131 to the first surface 11, a conductive trace 17 is embedded in the wire groove 16, the conductive trace 17 forms the first electrode pin 14 on the step surface 131, and forms the second electrode pin 15 on the first surface 11. The conductive circuit 17 may be formed by solidifying metal slurry such as silver paste filled in the wire groove 16, or may be a metal wire embedded in the wire groove 16.
In addition, as shown in fig. 2, a light-sensing surface 61 of the second light-sensing chip 6 is provided with a third electrode pin 62, wherein the light-sensing surface 61 of the second light-sensing chip 6 is used for receiving light projected from the second lens module 5 for imaging, the upper surface 21 of the base plate 2 is provided with a fourth electrode pin 22, after assembly, the light-sensing surface of the second light-sensing chip 6 is connected with the step surface 131, the first surface 11 is connected with the upper surface 21, where the first electrode pin 14 is electrically connected with the third electrode pin 62, the second electrode pin 15 is electrically connected with the fourth electrode pin 22, and the third electrode pin 62 is electrically connected with the fourth electrode pin 22, so that the electrical connection between the second light-sensing chip 6 and the base plate 2 is realized.
In other embodiments, the stepped hole may also be arranged in a manner that the diameter of the first hole 132 is smaller than the diameter of the second hole 133, at this time, the back surface 63 of the second photosensitive chip 6 is connected to the stepped surface 131, wherein the back surface 63 of the second photosensitive chip 6 is opposite to the photosensitive surface 61 of the second photosensitive chip 6. It is understood that the step structure of the stepped hole actually corresponds to a support structure for mounting the second photosensitive chip 6. In other embodiments, the supporting structure may be in other arrangements, for example, the through hole 13 may not be a stepped hole, and a protruding structure for bearing and mounting the second photosensitive chip 6 is disposed on an inner wall of the through hole 13, and the protruding structure is the supporting structure.
In addition, as shown in fig. 1, in the present embodiment, the first lens module 3 includes a first lens 32, a first lens holder 33, and a first supporting holder 34. The first supporting seat 34 has a connecting surface 341 and a bearing surface 342 disposed opposite to each other, and a light passing hole 343 penetrating from the bearing surface 342 to the connecting surface 341, wherein the connecting surface 341 is connected to the upper surface 21 of the base plate 2, the first lens seat 33 is disposed on the bearing surface 342, the first lens 32 is mounted on the first lens seat 33 and opposite to the light passing hole 343, and light projected from the first lens 32 passes through the light passing hole 343 and is received by the first photo sensor chip 4. In addition, in the present embodiment, the optical axis of the first image capturing unit 20 is the optical axis of the first lens 32, and the light incident surface 201 of the first image capturing unit 20 is the light incident surface 321 of the first lens 32. In addition, in the present embodiment, the first supporting base 34 is a package structure formed by curing the package adhesive. In order to make the mounting of the first photosensitive chip 4 on the base plate 2 more secure, the encapsulation structure covers the edge area of the photosensitive surface 41 of the first photosensitive chip 4.
As shown in fig. 1, in the present embodiment, the second lens module 5 includes a second lens 52 and a second lens holder 53. The second lens seat 53 is disposed on the second surface 12, the second lens 52 is disposed on the second lens seat 53 and opposite to the through hole 13, and the light projected from the second lens 52 passes through the through hole 13 and is received by the second photosensitive chip 6. In addition, in the present embodiment, the optical axis of the second image capturing unit 30 is the optical axis of the second lens 52, and the light incident surface 301 of the second image capturing unit 30 is the light incident surface 521 of the second lens 52.
In this embodiment, the first lens holder 33 and the second lens holder 53 are configured in the same structure, so that only one lens holder is required to be produced for preparing the dual camera module, thereby reducing the production cost of the dual camera module.
In addition, as shown in fig. 1, the first lens module 3 further includes a first mount 35 disposed between the first lens mount 33 and the first support 34, and a first filter 36 mounted on the first mount 35. The first filter 36 is located between the first lens 32 and the first photosensitive chip 4, and is used for filtering stray light emitted to the first photosensitive chip 4, so as to improve the imaging effect. The second lens module 5 further includes a second mount 54 disposed between the second mount 53 and the boss 1, and a second optical filter 55 mounted on the second mount 54. The second filter 55 is located between the second lens 52 and the second photosensitive chip 6, and is used for filtering stray light emitted to the second photosensitive chip 6, so as to improve the imaging effect. In the present embodiment, the first and second mounting seats 35 and 55 may be integrally formed for convenience of production and installation.
As shown in fig. 3 and 4, in the second embodiment of the present invention, the upper surface 21 of the bottom plate 2 is opened with a groove 7, wherein the first camera unit 20 is disposed in the groove 7, and the second camera unit 30 is disposed on the upper surface 21. In the embodiment, the first image capturing unit 20 is disposed in the groove 7, and compared to the case that the first image capturing unit 20 is directly disposed on the upper surface 21, the distance between the light incident surface 201 and the upper surface 21 is reduced, and further, the distance between the light incident surface 301 of the second image capturing unit 30 and the light incident surface 201 of the first image capturing unit 20 can be reduced. It will be appreciated that by appropriate setting of the depth of the recess 7, the light incident surface 301 of the second camera element 30 can be made flush with the light incident surface 201 of the first camera element 20.
As shown in fig. 3 and 4, the first photosensitive chip 4 is disposed in the groove 7 and is opposed to the first lens module 3. Specifically, the first photosensitive chip 4 is disposed on the bottom surface 18 of the recess 7. In addition, the second set pitch can be made constant by appropriately reducing the size of the first supporting seat 34 on the optical axis of the first lens module 3 when the photosensitive chip is disposed in the groove 7, as compared with when the second photosensitive chip 6 is disposed directly on the upper surface 21.
It will be appreciated that the first support base 34 is primarily intended to provide a cavity open at both ends so that light received by the corresponding photo-sensing chip can only be light projected from the lens corresponding thereto. In some embodiments, the first supporting seat 34 may not be provided, and the first mounting seat 35 directly connects to the upper surface 21, i.e. the first mounting seat 35 may function as the first supporting seat 34.
As shown in fig. 5, in the third embodiment of the present invention, the upper surface 21 of the bottom plate 2 is provided with the groove 7, and the upper surface 21 of the bottom plate 2 is also provided with the boss 1. Wherein the first camera element 20 is arranged in the recess 7 and the second camera element 30 is arranged on the boss 1. In this embodiment, the groove 7 is used to reduce the distance between the light incident surface 201 of the first imaging unit 20 and the upper surface 21, and the boss 1 is used to increase the distance between the light incident surface 301 of the second imaging unit 30 and the upper surface 21, so that the height difference between the light incident surface 301 of the second imaging unit 30 and the light incident surface 201 of the first imaging unit 20 can also be reduced. Of course, by properly arranging the groove 7 and the boss 1, the light incident surface 301 of the second image pickup unit 30 may be flush with the light incident surface 201 of the first image pickup unit 20.
Of course, in some embodiments, two grooves may be disposed on the bottom plate 2, which are defined as a first groove and a second groove, respectively, wherein the first camera unit 20 is disposed in the first groove, and the second camera unit 30 is disposed in the second groove. At this time, the depth of the first groove is greater than the depth of the second groove, so that the height of the light incident surface 201 of the first camera unit 20 relative to the upper surface 21 of the base plate 2 is reduced by a greater amount than the height of the light incident surface 301 of the second camera unit 30 relative to the upper surface 21 of the base plate 2, and when the difference is set properly, the light incident surface 201 of the first camera unit 20 may be flush with the light incident surface 301 of the second camera unit 30.
In some embodiments, two bosses may be disposed on the bottom plate 2, which are defined as a first boss and a second boss, respectively, wherein the first camera unit 20 is disposed on the first boss, and the second camera unit 30 is disposed on the second boss. At this time, the height of the first boss is smaller than that of the second boss, so that the increase of the height of the light incident surface 201 of the first image pickup unit 20 relative to the upper surface 21 of the base plate 2 is smaller than that of the height of the light incident surface 301 of the second image pickup unit 30 relative to the upper surface 21 of the base plate 2, and when this difference is set properly, the light incident surface 201 of the first image pickup unit 20 may be flush with the light incident surface 301 of the second image pickup unit 30.
The utility model also provides an electronic equipment, this electronic equipment use above-mentioned arbitrary embodiment two module 100 of making a video recording to improve electronic equipment's shooting effect. The electronic device can be a mobile phone, a tablet computer and other terminal products.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a two modules of making a video recording, its characterized in that includes:
a substrate;
a first imaging unit disposed on the substrate;
the second image pickup unit is arranged on the substrate, the second image pickup unit and the first image pickup unit are positioned on the same side of the substrate, and the size of the second image pickup unit on the optical axis is smaller than that of the first image pickup unit on the optical axis;
the substrate is provided with a boss, and the second camera shooting unit is arranged on the boss so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit; and/or the substrate is provided with a groove, and the first camera shooting unit is arranged in the groove so as to reduce the height difference between the light incident surface of the second camera shooting unit and the light incident surface of the first camera shooting unit.
2. The dual camera module of claim 1, wherein the light incident surface of the second camera unit is flush with the light incident surface of the first camera unit.
3. The dual camera module of claim 1, wherein the base plate further comprises a base plate having an upper surface, the first camera element and the boss both being disposed on the upper surface.
4. The dual camera module of claim 3, wherein the second camera unit comprises a second lens module and a second photosensitive chip, the second photosensitive chip and the second lens module are both disposed on the boss, and the second photosensitive chip is opposite to the second lens module and is configured to receive the light projected from the second lens module for imaging; the light incident surface of the second lens module is the light incident surface of the second camera shooting unit, the optical axis of the second lens module is the optical axis of the second camera shooting unit, and the size of the second camera shooting unit on the optical axis is the size between the light incident surface of the second lens module and the light sensing surface of the second light sensing chip.
5. The dual camera module of claim 4, wherein the boss includes a first surface and a second surface opposite to each other, and a through hole is formed in the boss and penetrates from the first surface to the second surface; the first surface is connected with the upper surface, the second surface is connected with the second lens module, a supporting structure is arranged on the inner wall of the through hole, and the second photosensitive chip is arranged on the supporting structure.
6. The dual camera module of claim 5, wherein the through hole is a stepped hole, and the second photo-sensing chip is disposed on a step surface of the stepped hole.
7. The dual camera module of claim 6, wherein the stepped hole comprises a first hole and a second hole sequentially arranged and communicated in a direction from the first surface to the second surface, wherein an equivalent diameter of the first hole is larger than an equivalent diameter of the second hole; and/or
A first electrode pin is arranged on the step surface, a second electrode pin is arranged on the first surface, and the first electrode pin is electrically connected with the second electrode pin; the second photosensitive chip is provided with a third electrode pin, the bottom plate is provided with a fourth electrode pin, the third electrode pin is electrically connected with the first electrode pin, and the fourth electrode pin is electrically connected with the second electrode pin.
8. The dual camera module of claim 1, wherein the base plate further comprises a base plate having an upper surface, the recess opening in the upper surface, the second camera element being disposed on the upper surface.
9. The dual camera module of claim 8, wherein the first camera unit comprises a first lens module disposed on the upper surface and a first photosensitive chip disposed in the recess and opposite to the first lens module for receiving the light projected from the first lens module for imaging;
the light incident surface of the first lens module is the light incident surface of the first camera unit, the optical axis of the first lens module is the optical axis of the first camera unit, and the size of the first camera unit on the optical axis is the size between the light incident surface of the first lens module and the light sensing surface of the first light sensing chip.
10. An electronic device comprising the dual camera module of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020218787.XU CN211509146U (en) | 2020-02-26 | 2020-02-26 | Double-camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020218787.XU CN211509146U (en) | 2020-02-26 | 2020-02-26 | Double-camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211509146U true CN211509146U (en) | 2020-09-15 |
Family
ID=72402046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020218787.XU Expired - Fee Related CN211509146U (en) | 2020-02-26 | 2020-02-26 | Double-camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211509146U (en) |
-
2020
- 2020-02-26 CN CN202020218787.XU patent/CN211509146U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11601576B2 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
| CN109688298B (en) | Camera module array and corresponding integrated substrate | |
| CN109698894B (en) | Photosensitive assembly and camera module based on metal support | |
| US20190361153A1 (en) | Lens, camera module and manufacturing method thereof | |
| KR20190113856A (en) | Photographing module and mold photosensitive assembly and manufacturing method thereof, and electronic device | |
| CN211089753U (en) | Image sensing module | |
| CN101582432A (en) | Image sensor module package structure with supporting element | |
| JP2007318761A (en) | Camera module and camera module assembly | |
| CN104469106A (en) | Camera module | |
| KR100856572B1 (en) | Camera module | |
| US7277242B1 (en) | Lens module | |
| CN211509146U (en) | Double-camera module and electronic equipment | |
| CN211018974U (en) | Camera module and electronic product | |
| CN211266942U (en) | Photosensitive assembly, camera module and electronic equipment | |
| CN210724992U (en) | Base, camera module and electronic equipment | |
| CN210629641U (en) | Photosensitive assembly, camera module and electronic equipment | |
| CN214412863U (en) | Camera module and mobile terminal | |
| WO2018121793A1 (en) | Separable photographic array module and manufacturing method thereof | |
| TW201811014A (en) | Split array camera module and manufacturing method thereof making the optical axis of each camera module unit consistent | |
| KR20080081726A (en) | Image sensor module and camera module comprising the same | |
| US20090213254A1 (en) | Solid-state image pickup device and electronic instruments | |
| CN208316840U (en) | Camera module and its image sensor and mobile terminal | |
| CN102300041A (en) | Image acquisition device for metal shield cover patch | |
| CN100461380C (en) | Solid-state imaging device and method for manufacturing the same | |
| CN210609374U (en) | Lens base, camera module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210615 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang, Jiangxi economic and Technological Development Zone, east of lilac Road, north of Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 |