CN211266942U - Photosensitive assembly, camera module and electronic equipment - Google Patents

Abstract

The application discloses sensitization subassembly, module and electronic equipment of making a video recording includes: the circuit board comprises a bearing surface, the bearing surface comprises a chip mounting area and a frame area positioned on the periphery of the chip mounting area, and the frame area is provided with a sink; the photosensitive chip is arranged in the chip mounting area; the electronic component is arranged in the sinking groove; the support comprises a supporting main body, wherein the supporting main body is positioned on one side, deviating from the circuit board, of the photosensitive chip, the supporting main body is provided with a supporting surface facing the photosensitive chip, the outer edge of the supporting surface and the frame area are arranged at intervals, so that a filling space is formed between the supporting main body and the frame area, and a sealing material is filled in the filling space. When filling sealing material, sealing material will flow into heavy groove, and the lateral wall that is close to the sensitization chip of heavy groove can effectively block sealing material flow direction sensitization chip, so sensitization subassembly in this application can promote the imaging quality of sensitization chip under the prerequisite of saving space.

Description

Photosensitive assembly, camera module and electronic equipment

Technical Field

The application relates to the technical field of optical elements, in particular to a photosensitive assembly, a camera module and electronic equipment.

Background

The camera module generally includes a circuit board, a photosensitive chip, a bracket, a lens barrel, and a lens. The photosensitive assembly is formed by combining the photosensitive chip, the support, the circuit board and other components. The photosensitive chip is arranged in the center of the circuit board, and a plurality of electronic components are arranged around the photosensitive chip. The support is connected with the surface of the circuit board, which is provided with the photosensitive chip. The support may be a framed support or a frameless support. Frame support's frame is owing to give electronic components and parts and stepping down, and it can only be arranged in electronic components's periphery, and the space that occupies is great, and the circuit board need increase peripheral size for cooperation and frame butt, so the whole volume of the module of making a video recording great. Although the frameless bracket can reduce the size of the outer edge of the circuit board, when the sealing material is filled, the sealing material is easy to flow into a photosensitive area of the photosensitive chip, so that the imaging quality is influenced.

SUMMERY OF THE UTILITY MODEL

The application provides a sensitization subassembly, module and electronic equipment make a video recording, when can making to fill between support and the circuit board in the sensitization subassembly and have sealing material, on the photosensitive region that filling material is difficult for flowing into the sensitization chip.

According to an aspect of the present application, there is provided a photosensitive assembly including:

the circuit board comprises a bearing surface, the bearing surface comprises a chip mounting area and a frame area positioned on the periphery of the chip mounting area, and the frame area is provided with a sink;

the photosensitive chip is arranged in the chip mounting area;

the electronic component is arranged in the sinking groove;

the support comprises a supporting main body, wherein the supporting main body is positioned on one side, deviating from the circuit board, of the photosensitive chip, the supporting main body is provided with a supporting surface facing the photosensitive chip, the outer edge of the supporting surface is arranged at intervals in the frame region, so that a filling space is formed between the supporting main body and the frame region, and a sealing material is filled in the filling space.

Above-mentioned scheme makes when filling sealing material, and sealing material will flow into heavy groove, and the lateral wall that is close to the sensitization chip of heavy groove can effectively block sealing material flow direction sensitization chip, so the sensitization subassembly in this application can prevent sealing material flow direction sensitization chip under the prerequisite of saving space, has promoted the yields of sensitization subassembly.

According to some embodiments, the sink is located at an edge of the circuit board.

Above-mentioned scheme makes the processing in heavy groove more convenient, and when heavy groove was located the edge, can reduce the invalid position that is located outside the heavy groove of circuit board, reduces photosensitive assembly's occupation space.

According to some embodiments, the number of the sinking grooves is multiple, and the multiple sinking grooves are distributed around the periphery of the chip mounting area; or

The number of the sinking grooves is one, and the sinking grooves are arranged around the chip mounting area.

When the number of the sinking grooves is multiple, the corresponding positions for forming the sinking grooves can be selected according to the arrangement positions of the electronic components, the glue dispensing amount is reduced, and the probability that glue overflows to the photosensitive chip is reduced. When the number of the sinking grooves is one, the sinking grooves can be processed at one time, so that the processing efficiency of the sinking grooves is improved.

According to some embodiments, the stent further comprises:

the supporting protrusion is arranged on the surface of the supporting main body facing the frame area, and the end part of the supporting protrusion departing from the supporting main body is abutted against the frame area.

Above-mentioned scheme makes the location of supporting the main part more firm, supports protruding certain sealed effect that can also play simultaneously to can reduce the point volume of gluing, reduce the probability that glue spills over to the photosensitive chip.

According to some embodiments, the frame region includes a first blank region located in the sinking groove, and the supporting protrusion abuts against the first blank region.

In the above scheme, the supporting protrusions are not directly supported on the electronic components, so that the electronic components can be effectively protected, and the electronic components are prevented from being damaged.

According to some embodiments, the frame region includes a second blank region outside the sinking groove, and the supporting protrusion abuts against the second blank region.

In the above scheme, the supporting protrusions are not directly supported on the electronic components, so that the electronic components can be effectively protected, and the electronic components are prevented from being damaged. Meanwhile, the supporting protrusions are supported outside the sinking grooves, so that the length of the supporting protrusions can be reduced, and the occupied space of the supporting protrusions is reduced.

According to some embodiments, the stent further comprises:

the sealing flange is arranged on the surface of the support main body facing the circuit board, and one end, far away from the support main body, of the sealing flange extends towards the direction close to the circuit board and abuts against the electronic component;

the number of the supporting bulges is multiple, the sealing flange is arranged between the two supporting bulges, one end of the sealing flange is connected with one of the supporting bulges, and the other end of the sealing flange is connected with the other supporting bulge.

In the above scheme, the sealing flange can improve the sealing performance of the photosensitive assembly, and meanwhile, the glue dispensing amount can be reduced, and the probability that glue overflows to the photosensitive chip is reduced.

According to some embodiments, the number of the sealing flanges is plural, and one sealing flange is arranged between each two supporting protrusions.

In the above scheme, the sealing flange is arranged between the two supporting bulges, and the two ends of the sealing flange are respectively connected with the two supporting bulges, so that the sealing flange can completely seal the gap between the two manufactured bulges, and the optimal sealing effect is achieved.

According to some embodiments, the sink includes a bottom wall of the tank and a side wall of the tank adjacent to the photosensitive chip;

the size of the electronic component along the direction vertical to the bottom wall of the groove is a first size, and the size along the direction vertical to the side wall of the groove is a second size;

the first size is larger than or equal to the second size, a circuit connector is arranged on the bottom wall of the groove, and the electronic component is electrically connected with the circuit connector.

In the above scheme, the first size is larger than the second size, so that the electronic component can fill the gap between the support main body and the circuit board as much as possible, the glue dispensing amount is reduced, and the probability that glue overflows to the photosensitive chip is reduced.

According to some embodiments, the sink includes a bottom wall of the tank and a side wall of the tank adjacent to the photosensitive chip;

the size of the electronic component along the direction vertical to the bottom wall of the groove is a first size, and the size along the direction vertical to the side wall of the groove is a second size;

the first size is smaller than the second size, the groove side wall is provided with a circuit connector, and the electronic component is electrically connected with the circuit connector.

In the above scheme, the first size is larger than the second size, so that the electronic component can fill the gap between the support main body and the circuit board as much as possible, the glue dispensing amount is reduced, and the probability that glue overflows to the photosensitive chip is reduced. Simultaneously, set up the circuit electrical interface in the processing that the heavy groove of groove lateral wall can be convenient for the degree of depth in heavy groove is not influenced by the position of circuit connector.

The support body according to some embodiments, the chip mounting region includes an isolation hole, the photosensitive chip being disposed in the isolation hole, the isolation hole including a peripheral wall arranged around a circumference of the photosensitive chip;

along sensitization chip circumference, perisporium and sensitization chip are all set up at interval.

By the scheme, when the glue overflows to the chip mounting area, the space of the isolation hole, which is positioned at the peripheral part of the photosensitive chip, can further store the glue, so that the probability of the glue overflowing to the photosensitive chip is reduced.

According to some embodiments, the surface of the photosensitive chip, which faces away from the circuit board, is provided with a first bonding pad, the region of the chip mounting region, which is located outside the isolation hole, is provided with a second bonding pad, and the first bonding pad and the second bonding pad are connected by a conductive wire.

The scheme can effectively utilize the gap between the photosensitive chip and the peripheral wall of the isolation hole to place the conducting wire.

According to some embodiments, the isolation well includes a well bottom wall facing the photosensitive chip, the photosensitive chip being spaced apart from the well bottom wall;

the conductive wire generates a supporting force for supporting the photosensitive chip.

By the scheme, the gap between the photosensitive chip and the bottom wall of the hole of the isolation hole can also store the glue overflowing into the chip mounting area, and the probability that the glue overflows onto the photosensitive chip is reduced.

According to some embodiments, the isolation hole is a through hole;

the conductive wire generates a supporting force for supporting the photosensitive chip.

According to the scheme, even if the glue overflows to the chip mounting area, the glue cannot flow to the upper part of the photosensitive chip.

The second aspect of the present application further provides a camera module, including:

the photosensitive assembly of any one of the above; and

the lens assembly is connected to the surface of the support body far away from the circuit board.

In the course of working of the photosensitive assembly in the module of making a video recording in the above-mentioned scheme, glue is more difficult for flowing to the sensitization chip.

The third aspect of the present application further provides an electronic device including the above camera module.

In the processing procedure of the photosensitive assembly of the electronic equipment in the scheme, the glue is more difficult to flow to the photosensitive chip.

The application provides a sensitization subassembly, this sensitization subassembly includes circuit board, sensitization chip, electronic components and support. The support and the bearing surface of the circuit board are arranged at intervals, and sealing materials are filled between the support and the frame area of the bearing surface. The sensitization subassembly in this application sets up heavy groove in the frame district to set up electronic components in heavy groove. Like this, when filling sealing material, sealing material will flow into heavy groove, and the lateral wall that is close to the photosensitive chip of heavy groove can effectively block sealing material flow direction photosensitive chip, so photosensitive assembly in this application can prevent sealing material flow direction photosensitive chip under the prerequisite of saving space, has promoted photosensitive assembly's yields.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is an exploded view of a prior art photosensitive assembly;

FIG. 2 is a schematic view of a photosensitive assembly in an embodiment of the present application;

FIG. 3 is an enlarged partial schematic view of FIG. 2;

FIG. 4 is a schematic view of a photosensitive assembly in an embodiment of the present application; wherein the photosensitive assembly is being filled with a sealing material;

FIG. 5 is a perspective illustration of a circuit board in one embodiment of the present application;

FIG. 6 is an enlarged partial schematic view of FIG. 5;

FIG. 7 is a perspective illustration of a bracket in one embodiment of the present application;

FIG. 8 is a full section schematic of a camera group in an embodiment of the present application;

FIG. 9 is a full section schematic of a camera group in another embodiment of the present application;

FIG. 10 is an enlarged partial schematic view of FIG. 9;

FIG. 11 is a full section schematic of an image group in a further embodiment of the present application;

FIG. 12 is a perspective view of a circuit board in accordance with yet another embodiment of the present application;

fig. 13 is a partially enlarged schematic view of fig. 12.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1, in the prior art, the photosensitive assembly mainly includes a circuit board 100 ', a photosensitive chip 300', an electronic component 400 ', and a support 500'.

In order to reduce the volume of the photosensitive assembly, the frame 500 'generally has no frame, and the frame 500' includes a support plate 510 'and a sealing material is filled between the support plate and the circuit board 100'. The sealing material is likely to overflow onto the photosensitive region of the photosensitive chip 300', thereby affecting the performance of the photosensitive element.

As shown in fig. 2 to 8, the present embodiment provides a photosensitive assembly 10, where the photosensitive assembly 10 includes a circuit board 100, a photosensitive chip 300, an electronic component 400, and a bracket 500.

The circuit board 100 is used to carry the photosensitive chip 300 and the electronic component 400. The circuit board 100 is provided with a circuit having a circuit connection port 120 electrically connected to the electronic component 400. The circuit board 100 includes a carrier surface 110, and the carrier surface 110 includes a chip mounting region 111 and a frame region 112 located at the periphery of the chip mounting region 111. The frame region 112 may have a closed ring shape or an unclosed ring shape disposed around the photosensitive chip 300. The frame region 112 has a sinking groove 113, and the electronic component 400 is disposed in the sinking groove 113 and electrically connected to the circuit connecting port 120 also located in the sinking groove 113.

The photosensitive chip 300 is disposed on the chip mounting region 111 of the carrying surface 110. The photosensitive chip 300 may be provided with an adhesive layer between the chip mounting region 111, and the adhesive layer is used to fix the photosensitive chip 300 on the circuit board 100. The photosensitive chip 300 includes a photosensitive surface 310, and the photosensitive surface 310 of the photosensitive chip 300 is disposed away from the circuit board 100. The photosensitive surface 310 of the photosensitive chip 300 is used for receiving light and converting the received light signal into an electrical signal. The photosensitive chip 300 is electrically connected to the circuit on the circuit board 100 to transmit the generated electrical signal to the circuit on the circuit board 100.

The support 500 includes a support body, which may be a plate-shaped support plate 510, and the support plate 510 is located on a side of the photosensitive chip 300 away from the circuit board 100. The supporting plate 510 has a supporting surface facing the photosensitive chip 300, and an outer edge of the supporting surface is spaced apart from the frame region 112 such that the filling space 130 is formed between the edge of the supporting plate 510 and the frame region 112. The filling space 130 is filled with the sealing material 140, the function of the sealing material 140 in this embodiment is similar to that of the frame bracket 500 in the prior art, and the sealing material 140 encloses the photosensitive chip 300 by filling the filling space 130, so that dust or other foreign matters are effectively prevented from falling onto the photosensitive surface 310 of the photosensitive chip 300. Since the electronic component 400 is located at the filling space 130, the filling material will coat the electronic component 400, and the filling material completely fills the gap between the electronic component 400 and the supporting plate 510.

Since the electronic component 400 is disposed in the sinking groove 113, the distance between the supporting plate 510 and the circuit board 100 can be set smaller, so that the overall thickness of the photosensitive assembly 10 is reduced. Moreover, when the sealing material 140 is used to seal the filling space 130, the sinking groove 113 is filled with the sealing material 140, and if the sealing material 140 is required to overflow to the photo sensor chip 300, the sealing material 140 first needs to go over the side wall of the sinking groove 113 close to the photo sensor chip 300 (i.e. the groove side wall 1132 of the sinking groove 113), which makes it more difficult for the sealing material 140 to overflow to the photo sensor chip 300, so that the possibility that the photosensitive surface 310 of the photo sensor chip 300 is shielded by the sealing material 140 is smaller, and the yield of the photo sensor assembly 10 is improved.

The sinking tank 113 may be a semi-closed tank body or a semi-open tank body. When the sink tank 113 is a semi-closed tank body, the sink tank 113 is composed of a bottom wall and a ring-shaped peripheral wall distributed around the periphery of the bottom wall; when the sinking tank 113 is a semi-open tank, the side wall of the sinking tank 113 (i.e. the tank side wall 1132 of the sinking tank 113) extends out of the edge of the circuit board 100, and the sinking tank 113 is composed of a bottom wall and an unclosed peripheral wall distributed around the periphery of the bottom wall. As shown in fig. 3, sink 113 has a bottom wall 1131 and a trough side wall 1132, where the trough side wall 1132 is distributed around the outer circumference of the bottom wall 1131, but the trough side wall 1132 is not closed.

The shape of the sink grooves 113 is not limited herein, and the shape of the sink grooves 113 may be regularly arranged or irregularly arranged. In fig. 3 to 5, the shape of the sink 113 is rectangular, the bottom wall 1131 of the groove is rectangular, and the side wall 1132 is formed by two adjacent rectangular walls. Two side wall surfaces of the sink 113 in fig. 5 extend beyond the edge of the circuit board 100. Of course, in other embodiments, when the bottom wall 1131 is rectangular, the slot sidewall 1132 may also be composed of three rectangular walls, and one sidewall of the slot 113 extends beyond the edge of the circuit board 100.

When the slot sidewall 1132 of the sinking slot 113 extends beyond the edge of the circuit board 100 (which can be understood as the slot sidewall 1132 of the sinking slot 113 is exposed to the circuit board 100 along the direction parallel to the slot bottom wall 1131), the circuit board 100 can subtract the dead volume at the periphery thereof, thereby reducing the occupied space of the circuit board 100.

The number and size of the sinking grooves 113 may be any, and only need to be sufficient to accommodate all of the electronic components 400. The number of the sinking grooves 113 may be one, and one sinking groove 113 is disposed around the chip mounting region 111, and the sinking groove 113 may be in a closed ring shape disposed around the chip mounting region 111 or in an unclosed ring shape disposed around the chip mounting region 111. The number of the sinking grooves 113 may be multiple (two or more), and the multiple sinking grooves 113 are distributed around the periphery of the chip mounting region 111. In one embodiment, as shown in fig. 5, the number of the sinking grooves 113 is two, and the two sinking grooves 113 are distributed on two opposite sides of the chip mounting region 111. In other embodiments, the number of the sinking grooves 113 may also be four, and four sinking grooves 113 are respectively arranged at four sides of the chip mounting region 111 in a one-to-one correspondence manner.

The number of the electronic components 400 may be one or more, and when the number of the electronic components 400 is multiple, the electronic components 400 are all disposed in the sink 113. The type of the electronic component 400 is not limited herein, depending on the actual requirements. Specifically, the electronic component 400 may be a capacitor, an inductor, a resistor, a diode, a transistor, or the like. The electronic components 400 have connection pins, the circuit board 100 has circuit connectors 120, and the electronic components 400 are electrically connected to the circuit connectors 120 on the circuit board 100.

The different types of electronic components 400 have different shapes, which makes the arrangement positions of the wiring pins of the different electronic components 400 different. The size of some electronic components 400 in the direction in which the length of the terminal pins extends is larger than the size in the direction perpendicular to the direction in which the length of the terminal pins extends; and the size of some of the electronic components 400 in the direction in which the length of the terminal pins extends is smaller than the size in the direction perpendicular to the direction in which the length of the terminal pins extends.

In order to make the dimension (hereinafter referred to as a first dimension) of the electronic component 400 in the direction perpendicular to the groove side wall 1132 be greater than or equal to the dimension (hereinafter referred to as a second dimension) of the electronic component 400 in the direction perpendicular to the groove side wall 1131 after being mounted on the circuit board 100 as much as possible, each circuit connection port 120 on the circuit board 100 may be disposed on the groove side wall 1132 or the groove side wall 1131 of the sunken groove 113, respectively, as required. For example, when the dimension of the electronic component 400 in the direction in which the length of the terminal pin extends is larger than the dimension in the direction perpendicular to the direction in which the length of the terminal pin extends, the terminal pin of the electronic component 400 is arranged perpendicular to the groove bottom wall 1131. And the connection pins of the electronic component 400 are electrically connected to the circuit connection ports 120 disposed on the bottom wall 1131 of the groove, so that the first dimension of the electronic component 400 is greater than or equal to the second dimension. When the dimension of the electronic component 400 along the length extension direction of the terminal pin is smaller than the dimension perpendicular to the length extension direction of the terminal pin, the terminal pin of the electronic component 400 is arranged parallel to the groove bottom wall 1131, and the terminal pin of the electronic component 400 is electrically connected to the circuit connection port 120 disposed on the groove side wall 1132, so that the first dimension of the electronic component 400 is greater than or equal to the second dimension.

When the electronic component 400 is disposed as above, the size of the circuit board 100 can be reduced as much as possible, and the overall occupied space of the photosensitive assembly 10 can be effectively reduced.

In order to control the spacing distance between the supporting plate 510 of the bracket 500 and the circuit board 100, as shown in fig. 2 to 3, in one embodiment, the bracket 500 may further include a supporting protrusion 520, the supporting protrusion 520 is disposed on a surface of the supporting plate 510 facing the frame area 112, and an end of the supporting protrusion 520 facing away from the supporting plate 510 abuts against the frame area 112. Specifically, the frame area 112 includes blank areas where the electronic component 400 is not disposed, that is, both the portion of the frame area 112 located outside the sinking groove 113 and the portion located in the sinking groove 113 where the electronic component 400 is not disposed are blank areas. The supporting protrusion 520 may abut against a first blank area outside the sinking groove 113 of the frame area 112, or may abut against a second blank area inside the sinking groove 113 of the frame area 112 (the second blank area is located on the groove bottom wall 1131).

After the supporting protrusions 520 abut against the blank area, the gap between the supporting plate 510 and the circuit board 100 is determined by the length of the supporting protrusions 520, so that the gap between the supporting plate 510 and the circuit board 100 can be controlled by arranging the supporting protrusions 520 with corresponding lengths as required. Meanwhile, the support bumps 520 can also serve as an attachment for the sealing material 140, so that the sealing material 140 is less likely to escape and overflow to the photo chip 300 when the sealing material 140 is filled.

The number of the support protrusions 520 may be one or more. When the number of the supporting protrusions 520 is plural, the end of each supporting protrusion 520 away from the supporting plate 510 abuts against the blank area of the frame area 112, each supporting protrusion 520 may abut against the first blank area in the sinking groove 113, may abut against the second blank area of the frame area 112 outside the sinking groove 113, or may abut against a part of the first blank area in the sinking groove 113 and a part of the second blank area outside the sinking groove 113. As shown in fig. 7, the supporting plate 510 is provided with three supporting protrusions 520, the supporting plate 510 is rectangular, the three supporting protrusions 520 are respectively and correspondingly disposed at three corner ends of the supporting plate 510, and each supporting protrusion 520 abuts against the first blank area in the sinking groove 113.

In one embodiment, the bracket 500 further includes a sealing flange 530. The sealing flange 530 is provided on a surface of the support plate 510 facing the circuit board 100. One end of the sealing flange 530 away from the supporting plate 510 extends toward the circuit board 100 and abuts against the electronic component 400. The sealing flange 530 may reduce the gap between the support plate 510 and the electronic component 400, reducing the amount of the sealing material 140 required, thereby preventing the problem of the overflow of the sealing material 140 to the photo chip 300. Meanwhile, sealing the peripheral space of the photosensitive chip 300 with the sealing flange 530 may improve sealing performance relative to sealing the peripheral space of the photosensitive chip 300 with the sealing material 140. Meanwhile, since the sealing flange 530 abuts the electronic component 400 (when the electronic component 400 is plural, the sealing flange 530 abuts the electronic component 400 of the first size largest), the positioning of the support plate 510 is more stable and accurate.

The sealing flange 530 may not abut against the electronic component 400, and for example, when the electronic component 400 is not provided at a portion of the frame section 112 facing the edge of the support plate 510, the sealing flange 530 may abut against a surface of the frame section 112 excluding the sink 113. Sealing flange 530 may be multiple, and sealing flange 530, which is disposed against electronic component 400, extends to abut the end of electronic component 400 that faces away from slot bottom wall 1131; the sealing flange 530, which is not disposed against the electronic component 400, extends to abut against the surface wall of the frame region 112 except for the region where the sink 113 portion is opened.

When the number of the supporting protrusions 520 is plural, the sealing flange 530 may be disposed between two supporting protrusions 520, and one end of the sealing flange 530 is connected to one of the supporting protrusions 520, and the other end is connected to the other supporting protrusion 520, so that the sealing effect of the sealing flange 530 is better, and the manufacturing of the protrusions and the sealing flange 530 is more convenient.

The photosensitive assembly 10 further includes an optical filter 600, and the optical filter 600 is used for filtering light rays, specifically infrared rays, which are emitted to the photosensitive chip 300. In the prior art, the optical filters 600 are disposed on the surface of the support 500 away from the circuit board 100. In one embodiment, in order to reduce the thickness of the photosensitive assembly 10, the supporting plate 510 may further include a light hole 511, and the surface of the supporting plate 510 facing the photosensitive chip 300 is connected with the filter 600, i.e., the filter 600 is disposed between the support 500 and the photosensitive chip 300. The filter 600 covers the light transmitting hole 511, and after the filter 600 is mounted, external light may pass through the light transmitting hole 511 and pass through the filter 600, and then irradiate the photosensitive chip 300. The filter 600 is disposed between the supporting plate 510 and the circuit board 100, so that the gap between the supporting plate 510 and the photosensitive chip 300 can be effectively utilized, and the thickness of the photosensitive assembly 10 can be reduced.

Further, an annular groove 512 disposed around the light-transmitting hole 511 may be provided at an edge of the light-transmitting hole 511 close to the photosensitive chip 300, and an edge of the optical filter 600 is provided at the annular groove 512. That is, when the thickness of the support plate 510 is large, the influence of the thickness of the support plate 510 on the overall thickness of the photosensitive assembly 10 can be reduced by the above-described structure. The groove depth dimension of the annular groove 512 in the direction perpendicular to the support plate 510 may be smaller than the thickness of the optical filter 600, and of course, it is preferable that the groove depth dimension of the annular groove 512 in the direction perpendicular to the support plate 510 be greater than or equal to the thickness of the optical filter 600, so that the influence of the thickness of the optical filter 600 on the thickness of the photosensitive assembly 10 can be completely avoided. How much the groove depth dimension of the circular groove 512 in the direction perpendicular to the supporting plate 510 is related to the thickness dimension of the optical filter 600 depends on the thickness of the supporting plate 510 and the actual requirements.

The shape and size of the annular groove 512 are independent of the shape and size of the optical filter 600, and it is only necessary that the edge of the optical filter 600 can be embedded in the annular groove 512. For example, when the filter 600 has a circular shape, the outer contour line of the annular groove 512 may have a rectangular shape, and it is only necessary that the length of the short side of the outer contour line is greater than or equal to the diameter of the filter 600. Of course, the outer contour of the annular groove 512 may be circular, and it is only necessary that the diameter of the outer contour of the annular groove 512 is greater than or equal to the diameter of the filter 600.

As shown in fig. 9-10, in one embodiment, in order to further prevent the sealing material 140 from overflowing to the photosensitive surface 310 of the photosensitive chip 300, an isolation hole 114 may be disposed in the chip mounting region 111, and the photosensitive chip 300 may be disposed in the isolation hole 114. The isolation hole 114 includes a peripheral wall 1141 disposed around the circumferential direction of the photosensitive chip 300, and the peripheral wall 1141 is spaced apart from the photosensitive chip 300 along the circumferential direction of the photosensitive chip 300 (i.e., the peripheral edge of the photosensitive chip 300 is not in contact with the peripheral wall 1141 of the isolation hole 114). The above structure forms a groove body in a ring shape between the photosensitive chip 300 and the peripheral wall 1141, so that when the sealing material 140 is filled too much and passes over the groove sidewall 1132 of the sinking groove 113 near the photosensitive chip 300, the sealing material 140 will flow into the groove body between the photosensitive chip 300 and the peripheral wall 1141 of the isolation hole 114, and will not flow to the photosensitive surface 310 of the photosensitive chip 300. The groove body corresponding to between the photosensitive chip 300 and the peripheral wall 1141 of the isolation hole 114 has a capacity to store a small amount of the sealing material 140.

After the photo chip 300 is disposed in the isolation hole 114, a first pad is disposed on a surface (i.e., the photo surface 310) of the photo chip 300 facing away from the circuit board 100, a second pad is disposed on a region of the chip mounting region 111 located outside the isolation hole 114, and the first pad and the second pad are connected by a conductive wire 320, that is, the conductive wire 320 crosses a slot between the photo chip 300 and the peripheral wall 1141 of the isolation hole 114, and one end of the conductive wire is connected to the first pad, and the other end of the conductive wire is connected to the second pad.

In order to increase the storage capacity of the sealing material 140, in one embodiment, the bottom wall of the isolation hole 114 facing the photosensitive chip 300 may be spaced from the photosensitive chip 300, i.e. the photosensitive chip 300 is not connected to any surface wall of the isolation hole 114 and is in a suspended state, and the conductive wire 320 generates a supporting force for supporting the photosensitive chip 300. Thus, not only the groove between the photosensitive chip 300 and the peripheral wall 1141 of the isolation hole 114 can store the sealing material 140, but also the gap between the photosensitive chip 300 and the bottom wall of the hole can store the sealing material 140, further reducing the possibility that the sealing material 140 flows to the photosensitive region of the photosensitive chip 300.

As shown in fig. 11 to 13, when the hole bottom wall of the isolation hole 114 does not support the photosensitive chip 300 and the conductive wire 320 generates a supporting force for supporting the photosensitive chip 300, the isolation hole 114 may also be a through hole, so that the sealing material 140 flows out of the circuit board 100 through the isolation hole 114 when it passes over the groove sidewall 1132 of the sinking groove 113 near the photosensitive chip 300.

The second aspect of the present application also provides a camera module 20, where the camera module 20 includes the photosensitive assembly 10 in any of the above embodiments. The camera module 20 further includes a lens assembly, which may specifically include a lens barrel 700 and a lens 800 disposed in the lens barrel 700, the lens barrel 700 is connected to a surface of the bracket 500 facing away from the circuit board 100, and external light passes through the lens barrel 700 and the lens 800 and is emitted to the photosensitive assembly 10.

The third aspect of the present application also provides an electronic apparatus, which includes the camera module 20 described above. The electronic device is any device having a function of acquiring an image. For example, the electronic device may be a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, etc., and the camera module 20 is used in cooperation with the electronic device to capture and reproduce images of a target object.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (16)

1. A photosensitive assembly, comprising:

the circuit board comprises a bearing surface, wherein the bearing surface comprises a chip mounting area and a frame area positioned on the periphery of the chip mounting area, and the frame area is provided with a sink groove;

the photosensitive chip is arranged in the chip mounting area;

the electronic component is arranged in the sinking groove;

the support comprises a supporting main body, wherein the supporting main body is positioned on one side, deviating from the circuit board, of the photosensitive chip, the supporting main body is provided with a supporting surface facing the photosensitive chip, the outer edge of the supporting surface and the frame area are arranged at intervals, so that a filling space is formed between the supporting main body and the frame area, and a sealing material is filled in the filling space.

2. A photosensitive assembly according to claim 1,

the sink is located at the edge of the circuit board.

3. A photosensitive assembly according to claim 1,

the number of the sinking grooves is multiple, and the sinking grooves are distributed around the periphery of the chip mounting area; or

The number of the sinking grooves is one, and the sinking grooves are arranged around the chip mounting area.

4. A photosensitive assembly according to claim 1, wherein said carriage further comprises:

the supporting protrusion is arranged on the supporting surface, and the end part of the supporting protrusion, which deviates from the supporting main body, is abutted against the frame area.

5. A photosensitive assembly according to claim 4,

the frame area comprises a first blank area located outside the sinking groove, and the supporting protrusions are abutted to the first blank area.

6. A photosensitive assembly according to claim 4,

the frame area comprises a second blank area located in the sinking groove, and the supporting protrusions are abutted to the second blank area.

7. A photosensitive assembly according to claim 4, wherein said carriage further comprises:

the sealing flange is arranged on the supporting surface, and one end of the sealing flange, which is far away from the supporting main body, extends towards the direction close to the circuit board and extends to abut against the electronic component;

the number of the supporting bulges is multiple, the sealing flange is arranged between the two supporting bulges, one end of the sealing flange is connected with one of the supporting bulges, and the other end of the sealing flange is connected with the other supporting bulge.

8. A photosensitive assembly according to claim 7,

the number of the sealing flanges is multiple, and one sealing flange is arranged between every two supporting bulges.

9. A photosensitive assembly according to claim 1,

the sinking groove comprises a groove bottom wall and a groove side wall close to the photosensitive chip;

the size of the electronic component along the direction vertical to the bottom wall of the groove is a first size, and the size along the direction vertical to the side wall of the groove is a second size;

the first size is larger than or equal to the second size, a circuit connector is arranged on the bottom wall of the groove, and the electronic component is electrically connected with the circuit connector.

10. A photosensitive assembly according to claim 1,

the sinking groove comprises a groove bottom wall and a groove side wall close to the photosensitive chip;

the size of the electronic component along the direction vertical to the bottom wall of the groove is a first size, and the size along the direction vertical to the side wall of the groove is a second size;

the first size is smaller than the second size, the groove side wall is provided with a circuit connector, and the electronic component is electrically connected with the circuit connector.

11. A photosensitive assembly according to claim 1,

the chip mounting area comprises an isolation hole, the photosensitive chip is arranged in the isolation hole, and the isolation hole comprises a peripheral wall arranged around the circumferential direction of the photosensitive chip;

and the peripheral wall and the photosensitive chip are arranged at intervals along the circumferential direction of the photosensitive chip.

12. A photosensitive assembly according to claim 11,

the surface of sensitization chip deviating from the circuit board is equipped with first pad, the region that is located of chip installing zone outside the isolation hole is equipped with the second pad, first pad with the second pad utilizes the conductor wire to connect.

13. The photosensitive assembly of claim 12,

the isolation hole is a blind hole and comprises a hole bottom wall facing the photosensitive chip, and the photosensitive chip and the hole bottom wall are arranged at intervals;

the conductive wire generates a supporting force for supporting the photosensitive chip.

14. The photosensitive assembly of claim 12,

the isolation holes are through holes;

the conductive wire generates a supporting force for supporting the photosensitive chip.

15. The utility model provides a module of making a video recording which characterized in that includes:

the photosensitive assembly of any one of claims 1-14; and

the lens assembly is connected to the surface of the support body far away from the circuit board.

16. An electronic apparatus characterized by comprising the camera module according to claim 15.

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