CN110868521A - Camera module and mobile terminal - Google Patents
Camera module and mobile terminal Download PDFInfo
- Publication number
- CN110868521A CN110868521A CN201910989398.9A CN201910989398A CN110868521A CN 110868521 A CN110868521 A CN 110868521A CN 201910989398 A CN201910989398 A CN 201910989398A CN 110868521 A CN110868521 A CN 110868521A
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- China
- Prior art keywords
- image sensor
- camera module
- circuit board
- filter
- mounting hole
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application provides a camera module and a mobile terminal, wherein the camera module comprises a circuit board, an image sensor is fixed on the circuit board, and the image sensor is electrically connected with the circuit board; the camera module also comprises a cover body for sealing the image sensor; the cover body comprises a bracket and an optical filter. The bracket is of a shell structure, is arranged around the image sensor and is connected with the circuit board in a sealing way; the bracket is provided with a mounting hole, and the side wall of the optical filter is connected with the side wall of the mounting hole in an adhesive manner. It can be seen from the above description that, in this application embodiment, buckle on image sensor and with circuit board sealing connection through the support, and the light filter is fixed on the support, compare with the scheme among the prior art, the cover body does not contact with image sensor to can not pollute image sensor, adopt the light filter to assemble with the circuit board assembly again after the cover body with the support assembly in addition, convenient equipment has also reduced the height of camera module simultaneously.
Description
Technical Field
The application relates to the technical field of mobile terminals, in particular to a camera module and a mobile terminal.
Background
The miniaturization and ultrathin design of the current mobile phone is continuously promoted, the requirements on the miniaturization and the thinning of each mobile phone part are more and more strict, and the camera module is used as an important module part of the mobile phone and also faces strong challenges of miniaturization and thinning; especially, the current high screen accounts for than and the design of full face screen, and the overall dimension to the camera module reduces the demand more strongly. The structure of the camera module adopted in the prior art is shown in fig. 1, the camera module adopts an injection molding technology, and the edges of the surface-mounted device 4, the lead bonding alloy wire 2 and the image sensor 3 are plastically packaged on the circuit board 1 through the packaging layer 5, so that the height of the camera module is reduced; however, in this method, the image sensor 3 is easily contaminated by plastic-sealing the image sensor 3, and the technical cost is high and the yield is low.
Disclosure of Invention
The application provides a camera module and a mobile terminal for make things convenient for the miniaturization of camera module, improve the yield of the module of making a video recording.
In a first aspect, a camera module is provided, which is applied to a mobile terminal, and includes a circuit board, an image sensor is fixed on the circuit board, and the image sensor is electrically connected to the circuit board for processing a signal of the image sensor; in addition, the camera module also comprises a cover body for sealing the image sensor; the cover body comprises two parts, namely a bracket and an optical filter. When the optical filter is arranged, the support is of a shell structure, surrounds the image sensor and is in sealing connection with the circuit board, the support is provided with a mounting hole, and the side wall of the optical filter is in bonding connection with the side wall of the mounting hole. The side wall of the optical filter is fixedly connected with the side wall of the mounting hole in an adhesive mode. When the optical filter is used, external light passes through the optical filter and then irradiates the image sensor. It can be seen from the above description that, detain on image sensor and with circuit board sealing connection through the support in this application embodiment, and the light filter sets up on the support, compare with the scheme among the prior art, the cover body does not contact with image sensor to can not pollute image sensor, adopt the light filter to assemble with the circuit board assembly again after the cover body with the support assembly in addition, convenient equipment has also reduced the height of camera module simultaneously.
In a specific embodiment, the top of the support and the filter are spaced from the image sensor by a gap. Contamination of the image sensor is avoided.
In a specific embodiment, the mounting hole is a through hole. Therefore, the height of the optical filter can be reduced, and the height of the whole module is further reduced.
In a specific embodiment, the support is provided with a support surface for supporting the optical filter. The supporting surface is arranged to support the optical filter, so that the stability of the optical filter is improved.
In a specific embodiment, a sidewall of the mounting hole is provided with a supporting protrusion for supporting the optical filter. The supporting surface is formed by the supporting bulges to support the optical filter.
In a specific possible embodiment, the number of the support protrusions is plural, and the plural support protrusions are arranged around the axis of the mounting hole. Thereby improving the stability of the optical filter.
In a specific embodiment, the mounting hole is a stepped hole, and a boss is formed in the mounting hole, and a surface of the boss is a supporting surface to support the optical filter, so as to improve the stability of the optical filter.
In a specific possible embodiment, the bracket is provided with an adhesive overflow groove, and the adhesive overflow groove is arranged around the mounting hole. The glue containing amount is increased through the glue overflowing groove, and the glue is prevented from dripping to the image touch sensor.
In a specific embodiment, the glue overflow groove is arranged on the side wall of the mounting hole. The bonding stability of the filter and the bracket is improved.
In a specific embodiment, the electronic device further comprises a surface mount component fixed on the circuit board, and the surface mount component is located in the bracket.
In a specific embodiment, the filter is disposed coaxially with the image sensor.
In a second aspect, a method for manufacturing a camera module is provided, the method including fixing an image sensor to a circuit board; assembling a cover body, and bonding and connecting the side wall of the optical filter with the side wall of the mounting hole on the bracket; the cover body is hermetically connected with the circuit board, and a support in the cover body surrounds the image sensor so as to seal the image sensor through the cover body. In this application embodiment detain on image sensor and with circuit board sealing connection through the support, and the light filter setting is on the support, compare with the scheme among the prior art in, the cover body does not contact with image sensor to can not pollute image sensor, adopt in addition the light filter and assemble with the circuit board assembly again after the cover body with the support, convenient equipment has also reduced the height of camera module simultaneously.
In a specific embodiment, the support is provided with a support surface for supporting the optical filter, so as to improve the stability of the optical filter.
In a specific possible embodiment, the bracket is provided with an adhesive overflow groove, and the adhesive overflow groove is arranged around the mounting hole. The stability of the connection of the optical filter and the bracket is improved.
In a third aspect, a mobile terminal is provided, where the mobile terminal may be a mobile phone, a tablet computer, and the like, and the mobile terminal includes a housing and any one of the above-mentioned camera modules fixed in the housing. It can be seen from the above description that, detain on image sensor and with circuit board sealing connection through the support in this application embodiment, and the light filter sets up on the support, compare with the scheme among the prior art, the cover body does not contact with image sensor to can not pollute image sensor, adopt the light filter to assemble with the circuit board assembly again after the cover body with the support assembly in addition, convenient equipment has also reduced the height of camera module simultaneously.
Drawings
FIG. 1 is a schematic view of a camera module according to the prior art;
fig. 2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a camera module according to an embodiment of the present application;
FIG. 4 is a cross-sectional view taken at A-A of FIG. 3;
fig. 5 is a schematic structural diagram of a main body of a camera module according to an embodiment of the present disclosure;
FIG. 6 is a cross-sectional view taken at B-B of FIG. 5;
fig. 7 is a schematic structural diagram of another main body of the camera module according to the embodiment of the present application;
FIG. 8 is a cross-sectional view taken at C-C of FIG. 7;
fig. 9 is a schematic structural diagram of another main body of the camera module according to the embodiment of the present application;
FIG. 10 is a cross-sectional view taken at D-D of FIG. 9;
fig. 11 is a schematic structural diagram of another main body of the camera module according to the embodiment of the present application;
fig. 12 is a cross-sectional view at E-E in fig. 11.
Detailed Description
In order to facilitate understanding of the camera module provided in the embodiment of the present application, an application scenario of the camera module provided in the embodiment of the present application is first described below, where the camera module provided in the embodiment of the present application is applied to a mobile terminal, such as a mobile phone, a tablet computer, or a notebook computer. The camera module is used for providing the camera function of the mobile terminal when being applied to the mobile terminal, and a mobile phone is taken as an example for explanation for convenience in understanding. When the camera module is applied to a mobile phone, the camera module can be used as a front camera module or a rear camera module, but the principle of the front camera module and the principle of the rear camera module are the same, and the following description will be given by taking the rear camera module as an example. As shown in fig. 2, fig. 2 shows a schematic view of the camera module 10 as a rear camera module 10 assembled in a mobile phone; as can be seen from fig. 2, the camera module 10 is fixed in the mobile phone, and the lens of the camera module 10 is exposed on the surface of the mobile phone, and when shooting, images are collected by the camera module 10 for shooting. With the development of the thinning of the mobile phone, the space for accommodating the camera module 10 in the mobile phone is also smaller and smaller, so that the camera module 10 is required to be miniaturized. To this end, the present invention provides a camera module 10, which is described in detail below with reference to the accompanying drawings and specific embodiments.
Referring first to fig. 3, fig. 3 illustrates a partial structure of a camera module 10 provided in an embodiment of the present application, where the camera module 10 illustrated in fig. 3 includes at least a main body 11 and a lens 12 connected to the main body 11; in which the lens 12 is used to collect light and the body 11 is used to convert optical signals into electrical signals and form an image. In fig. 3, a lens 12 is provided on the body 11 and connected to the body 11; in use, external light may pass through the lens 12 and then irradiate into the body 11, and the body 11 may convert the sensed light into an electrical signal as an optical signal to form an image.
Referring also to fig. 4, fig. 4 shows a schematic structural view at a-a in fig. 3, wherein the schematic structural view at a-a is a view obtained by cutting the camera module in the direction of a-a in fig. 3. First, the lens barrel 12 in fig. 4 is explained, and the lens barrel 12 includes a lens barrel 123, and a plurality of lenses 121 disposed inside the lens barrel 123, as shown in fig. 4, the plurality of lenses 121 have the same axis and are disposed at intervals in the height direction (i.e., the X direction shown in fig. 4). In the camera module 10 shown in fig. 4, four lenses 121 are shown, but the number of the lenses 121 is not particularly limited in the embodiment of the present application, and in actual production, the number of the lenses 121 may be adjusted as needed, such as two, three, five, six, and so on. In addition, parameters such as the focal length and the curvature of each lens 121 may be adjusted according to actual needs, and are not limited herein. With reference to fig. 4, the lens 12 further includes a voice coil motor 122, the voice coil motor 122 is sleeved outside the lens barrel 123 and is used for driving the lens barrel 123 to slide along the axial direction of the lens 121, so as to achieve an effect of driving the lens 121 to move, and achieve focusing of the lens 12. When the voice coil motor 122 is arranged, the voice coil motor 122 is fixedly connected with the main body, and the lens barrel 123 is fixedly connected with the main body through the voice coil motor 122, when the voice coil motor 122 works, the lens barrel 123 can be driven to move upwards or downwards, so that the distance between the lens 12 and the main body is adjusted, and the focusing of the lens 12 is realized.
With continued reference to fig. 4, the main body of the camera module 10 may include a circuit board 113, and an image sensor 114 disposed on the circuit board 113. The circuit board 113 serves as both a carrier and a transmission component for electrical signals. Two opposing surfaces of the circuit board 113 are named for convenience of description: the mobile terminal comprises a first surface and a second surface, wherein the first surface is a surface of the circuit board 113 for carrying a device, and the second surface is a surface of the circuit board 113 connected with other structures of the mobile terminal. In the specific selection of the circuit board 113, different types of circuit boards, such as a printed circuit board, or different types of circuit boards, such as a single-sided circuit board, a double-sided circuit board, and the like, may be selected.
With continued reference to fig. 4, the image sensor 114 utilizes the photoelectric conversion function of the photoelectric device to divide the light image on the light receiving surface into many small cells, and converts the small cells into usable electrical signals. In a specific arrangement, the image sensor 114 may employ different types of image sensors such as a photoconductive camera tube and a solid-state image sensor. With continued reference to fig. 4, when the image sensor 114 is disposed, the image sensor 114 is fixed on the first surface of the circuit board 113, and when the image sensor 114 is fixed on the circuit board 113, the image sensor 114 may be fixed on the circuit board 113 by using a common fixing process such as bonding, soldering, and the like. After the image sensor 114 is fixed on the circuit board 113, the light receiving surface of the image sensor 114 faces away from the circuit board 113, so that the light receiving surface faces the lens 12, and the light entering the lens 12 can directly irradiate the image sensor 114.
With continued reference to fig. 4, in addition to the above-mentioned fixed connection, the image sensor 114 and the circuit board 113 are electrically connected, as shown in fig. 4, the image sensor 114 is electrically connected through a metal flying wire 115, and an electrical signal converted by the image sensor 114 can be transmitted to the circuit board 113 through the metal flying wire 115 and transmitted to a processor of the mobile terminal through the circuit board 113. In addition, the surface mount elements 117 are further disposed on the first surface of the circuit board 113, and as shown in fig. 4, one surface mount element 117 is disposed on each side of the image sensor 114, but the disposition positions and the number of the surface mount elements 117 in fig. 4 are merely an example, and the specific number and disposition positions of the surface mount elements 117 are not limited in the embodiment of the present application. The surface-mounted component 117 may be various electrical devices, such as an inductor, a capacitor, or other electrical devices. It should be understood that in the embodiment of the present application, the surface mount element 117 is an optional component, and a different number of surface mount elements 117 may be provided on the circuit board 113 or no surface mount elements 117 may be provided as needed.
With reference to fig. 4, it can be seen from the operation principle of the image sensor 114 that when the image sensor 114 is used, if impurities fall on the light receiving surface of the image sensor 114, the imaging effect of the camera module 10 is affected. Therefore, the main body 11 of the camera module 10 provided in the embodiment of the present application further includes a cover for sealing the image sensor 114 to prevent dust from falling on the light receiving surface of the image sensor 114. With continued reference to fig. 4, fig. 4 illustrates a specific cover structure that includes a holder 111 and an optical filter 112. The bracket 111 shown in fig. 4 is a housing structure, and reference is also made to the structure shown in the dotted line portion in fig. 3, which is a frame outline of the invisible portion of the camera module 10. As shown in fig. 3 and 4, the bracket 111 is a structure with two open ends, and includes four sidewalls and a bottom wall, and the bottom wall is provided with a mounting hole (not numbered) for matching with the optical filter 112, and the side of the bracket 111 opposite to the bottom wall is an opening. When the bracket 111 is connected with the circuit board 113, one side of the opening of the bracket 111 covers the first surface of the circuit board 113, the bracket 111 is arranged around the image sensor 114, and the surface mount component 117 and the image sensor 114 cover the bracket 111. When the bracket 111 is fixed on the circuit board 113, the bracket 111 is further connected to the circuit board 113 in a sealing manner, for example, a circle of adhesive is coated on the circuit board 113, and the bracket 111 is connected to the circuit board 113 in an adhesive manner and sealed by the adhesive, although the adhesive is merely an example of a specific connection manner, in the embodiment of the present application, other manners may also be used to connect and seal. The material of the bracket 111 may be selected from different materials according to the requirement, such as metal material or plastic material, and the metal material may be made of different materials, such as aluminum, steel, alloy steel, and the like.
With continued reference to fig. 4, the cover provided in the embodiment of the present application further includes a filter 112, and the filter 112 is disposed in the mounting hole, as shown in fig. 4, the mounting hole is a through hole, and the through hole is located above the image sensor 114 (with the placement direction of the main body shown in fig. 4 as a reference direction). Referring to fig. 3 together, it can be seen in fig. 3 that the through hole is circular and the shape of the corresponding filter 112 is also circular, but the embodiment of the present application is not limited to the specific shape of the filter 112, and the filter 112 may be a square, an oval, a special shape, or other symmetrical or asymmetrical shape. However, whatever shape the filter 112 takes, it should be ensured that the perpendicular projection of the filter 112 on the plane of the light-receiving surface covers the light-receiving surface so that light can be transmitted through the filter 112 to the light-receiving surface. When the filter 112 is circular, the axis of the filter 112 is the same as the axis of the image sensor 114, and the axis is also the same as the axis of the lens 121 in the lens 12, and the axis is also the axis of the camera module 10.
With continued reference to fig. 4, when the filter 112 is disposed in the through-hole, the sidewall of the filter 112 is adhesively connected to the sidewall of the through-hole. As shown in fig. 4, the size of the through hole is larger than that of the filter 112, when the filter 112 is disposed in the through hole, a gap is formed between the sidewall of the through hole and the sidewall of the filter 112, and the adhesive 116 is filled in the gap, so that the filter 112 and the holder 111 are adhesively fixed to each other, and the filter 112 and the holder 111 are sealed to each other.
When assembling the main body 11, the holder 111 in the cover is first assembled with the filter 112, and then the entire cover is connected to the circuit board 113. When the cover body is assembled, the support 111 is placed on a support jig, the support jig is inserted into the support 111 and abuts against the bottom wall of the support 111, so that the mounting hole is located above the support jig, when the optical filter 112 is placed in the mounting hole, the optical filter 112 is supported and positioned by the support jig, and then the adhesive 116 is coated to bond the optical filter 112 and the support 111 together. When the cover is assembled with the circuit board 113, the bracket 111 is fixed on the circuit board 113 by the adhesive 116 and is connected to the circuit board 113 in a sealing manner, and after the cover is fixed, the image sensor 114 is sealed in a space enclosed by the circuit board 113 and the cover, so that dust is prevented from falling onto the image sensor 114. In addition, because the cover body is not in direct contact with the image sensor 114 (the side wall and the top of the bracket 111 and a certain gap is formed between the optical filter 112 and the image sensor 114), the image sensor 114 is not polluted in the assembling process, and the safety of the image sensor 114 is improved.
In addition, as can be seen from fig. 4, when the filter 112 is fixed to the bracket 111, the thickness of the bottom wall can be thinner due to the connection between the side walls between the filter 112 and the bracket 111, so that the height of the bracket 111 can be effectively reduced in height, and further, the height of the whole main body 11 is reduced, and the height of the whole camera module 10 is also reduced.
Of course, the manner of matching the holder 111 and the filter 112 in the cover provided in the embodiment of the present application is not limited to the manner shown in fig. 4, and other manners may be adopted. As shown in fig. 5 and 6, fig. 5 is a schematic structural diagram of a main body 11 of another camera module; fig. 6 shows fig. 5, wherein the structural diagram at B-B refers to the diagram obtained by cutting the camera module along the direction shown by B-B in fig. 5. The reference numerals shown in fig. 5 may refer to the same reference numerals in fig. 4. The structural schematic diagrams of the main body 11 of the camera shown in fig. 5 and 6 are different from the matching manner of the distinguishing filter 112 and the bracket 111 of fig. 4. As shown in fig. 5, the bracket 111 provided in the embodiment of the present application is further provided with an overflow glue groove 118, the overflow glue groove 118 is disposed around the mounting hole, in fig. 5, the overflow glue groove 118 is disposed on a side wall of the mounting hole, and the overflow glue groove 118 is located on a side of a bottom wall of the bracket 111 facing away from the image sensor 114. Referring also to fig. 6, as can be seen from fig. 5 and 6, the glue overflow groove 118 is communicated with the mounting hole, so as to form a stepped hole, wherein the part with the larger diameter is an area for accommodating the glue overflow, and the part with the smaller diameter is used for accommodating the optical filter 112. As shown in fig. 6, when the filter 112 is placed in the mounting hole, a gap is formed between the filter 112 and the sidewall of the stepped hole, and the gap is filled with the adhesive 116, and the adhesive 116 fills the gap to fixedly connect the filter 112 and the bracket 111. During assembly, the assembly method is the same as the assembly method of the main body 11 shown in fig. 4, the supporting jig supporting bracket 111 and the optical filter 112 are used, and then the adhesive 116 is filled in the gap, so that when the adhesive 116 is filled, the excess adhesive 116 can flow into the overflow groove 118, and the influence of the outflow of the adhesive 116 on the image sensor 114 is avoided. In addition, when the glue overflow groove 118 is adopted, as can be seen from fig. 6, the filling amount of the adhesive glue 116 is increased, and the stability of the connection between the optical filter 112 and the bracket 111 is improved.
As shown in fig. 7 and 8, fig. 7 shows a schematic structural diagram of another main body provided by the embodiment of the present application, and fig. 8 shows a cross-sectional view at C-C in fig. 7, where the schematic structural diagram at C-C refers to a schematic diagram obtained by cutting the camera module along a direction shown by C-C in fig. 7. The reference numerals shown in fig. 7 may refer to the same reference numerals in fig. 4. The structural schematic diagrams of the main body 11 of the camera shown in fig. 7 and 8 are different from the matching manner of the distinguishing filter 112 and the bracket 111 of fig. 4. As shown in fig. 7, the mounting hole of the bracket 111 provided in the embodiment of the present application is a stepped hole, in which a hole with a smaller diameter is close to the image sensor 114 and a hole with a larger diameter is far from the image sensor 114. As shown in fig. 8, the stepped surface in the stepped hole serves as a support surface for supporting the filter 112. When the filter 112 is placed in the mounting hole, the filter 112 is placed in the hole having a larger diameter and supports the filter 112 via the support surface. In assembly, the optical filter 112 is first placed in the mounting hole and supported by the supporting surface, and then the adhesive 116 is filled to fix the optical filter 112 in the mounting hole, and the optical filter 112 is sealed by the adhesive 116. When the above structure is adopted, as can be seen from fig. 8, the weight of the optical filter 112 can be supported by the supporting surface, and the side wall of the optical filter 112 is adhesively connected to the bracket 111 by the adhesive 116, so that the stability of the optical filter 112 can be improved. In addition to the above, the adhesive 116 may be applied to the supporting surface so that the portion of the filter 112 overlapping the supporting surface is also bonded to the holder 111, thereby improving the stability of bonding between the filter 112 and the holder 111, and simultaneously sealing the gap between the filter 112 and the holder 111 in the axial direction and the radial direction, thereby improving the sealing effect between the filter 112 and the holder 111.
As shown in fig. 9 and 10, fig. 9 shows a schematic structural diagram of another main body 11 provided in an embodiment of the present application, and fig. 10 shows a cross-sectional view at D-D in fig. 9, where the schematic structural diagram at D-D refers to a schematic diagram obtained by cutting the camera module along a direction shown by D-D in fig. 9. The reference numerals shown in fig. 9 may refer to the same reference numerals in fig. 4. The structural schematic diagrams of the main body 11 of the camera shown in fig. 9 and 10 are different from the manner of matching the distinguishing filter 112 with the holder 111 of fig. 4. As shown in fig. 9, the mounting hole of the bracket 111 provided in the embodiment of the present application is a through hole, and the sidewall of the mounting hole is provided with a plurality of supporting protrusions 119 for supporting the optical filter 112, the number of the supporting protrusions 119 may be different, such as two, three, four, and the like, the plurality of supporting protrusions 119 are arranged around the axis of the mounting hole, and the heights of the plurality of supporting protrusions 119 are the same, so that the upper surfaces of the supporting protrusions 119 (the surfaces of the supporting protrusions 119 facing away from the image sensor 114) form a supporting surface. When the optical filter 112 is placed in the mounting hole, the optical filter 112 is placed on and supported by the supporting surface, and then the adhesive 116 is filled to fix the optical filter 112 in the mounting hole, and the optical filter 112 is sealed by the adhesive 116. When the above structure is adopted, as can be seen from fig. 10, the weight of the optical filter 112 can be supported by the supporting surface, and the side wall of the optical filter 112 is adhesively connected to the bracket 111 by the adhesive 116, so that the stability of the optical filter 112 can be improved.
Fig. 11 shows a schematic structural diagram of another main body 11 provided in the embodiment of the present application, as shown in fig. 11 and 12, fig. 11 shows a schematic structural diagram of another main body 11 provided in the embodiment of the present application, and fig. 12 shows a cross-sectional view at E-E in fig. 11, where the schematic structural diagram at E-E refers to a schematic diagram obtained by cutting a camera module along a direction shown by E-E in fig. 11. The reference numerals shown in fig. 11 may refer to the same reference numerals in fig. 4. The structural schematic diagrams of the main body 11 of the camera shown in fig. 11 and 12 are different from the manner of matching the distinguishing filter 112 with the holder 111 of fig. 4. As shown in fig. 11, the mounting hole of the bracket 111 provided in the embodiment of the present application is a through hole, and the through hole is a tapered hole. Wherein, the opening with smaller diameter is close to the image sensor 114, and the opening with larger diameter is far away from the image sensor 114; of course, larger diameter openings toward image sensor 114 and smaller diameter openings away from image sensor 114 may be used. As shown in fig. 12, the corresponding filter 112 also adopts a tapered surface that matches the mounting hole, and the taper angle of the tapered surface of the filter 112 may be greater than, equal to, or less than the taper angle of the tapered surface of the mounting hole at the time of specific matching. The side walls of the mounting holes serve as support surfaces for supporting the filter 112 when the filter 112 is assembled. As shown in fig. 12, when the filter 112 is inserted into the mounting hole, and since the filter 112 has a tapered surface matching the mounting hole and the maximum diameter of the tapered surface of the filter 112 is larger than the diameter of the opening of the mounting hole, the filter 112 can be supported by the side wall of the mounting hole when the filter 112 is inserted into the mounting hole. Taking the example that the taper angles of the taper surface of the filter 112 and the taper surface of the mounting hole are equal, in this case, the taper surface of the filter 112 and the taper surface plane of the mounting hole. During assembly, the support 111 is placed on a support jig, the support jig is inserted into the support 111 and pressed against the bottom wall of the support 111, so that the mounting holes are located above the support jig, when the optical filter 112 is placed in the mounting holes, the optical filter 112 is supported and positioned by the support jig, and then the adhesive 116 is coated to bond the optical filter 112 and the support 111 together. When the cover is assembled with the circuit board 113, the bracket 111 is fixed on the circuit board 113 by the adhesive 116 and is connected to the circuit board 113 in a sealing manner, and after the cover is fixed, the image sensor 114 is sealed in a space enclosed by the circuit board 113 and the cover, so that dust is prevented from falling onto the image sensor 114. In addition, since there is no direct contact between the cover and the image sensor 114: the side wall and the top of the bracket 111 and the gap between the filter 112 and the image sensor 114 are certain, so that the image sensor 114 is not polluted in the assembling process, and the safety of the image sensor 114 is improved.
When the taper angle of the taper surface of the filter 112 is larger or smaller than the taper angle of the taper surface of the mounting hole, the side wall of the mounting hole can be used as a supporting surface to support the filter 112, and the filter 112 is positioned by the supporting surface, so that a supporting jig is not needed to support the filter 112 during assembly.
It should be understood that the structures illustrated in fig. 6, 8, 10, and 12 can be different structures to form a supporting surface on the support 111 to support the filter 112, so as to improve the stability of the filter 112. It should be understood that fig. 6-12 are merely exemplary, and that other structures may be used to form the supporting surface to support the filter 112 in the embodiments disclosed herein.
As can be seen from the above description, in the camera module 10 provided in the embodiment of the present application, the cover body is fastened on the image sensor 114 and is hermetically connected to the circuit board 113, and there is no contact between the cover body structure and the image sensor 114, so that the security of the image sensor 114 can be improved. Compared with the scheme in the prior art, the cover body is not in contact with the image sensor 114, so that the image sensor 114 cannot be polluted, and the optical filter 112 and the support 111 are assembled into the cover body and then assembled with the circuit board 113, so that the assembly is convenient, and meanwhile, the height of the camera module 10 is also reduced.
For the convenience of understanding the camera module provided by the embodiment of the present application, the embodiment of the present application further provides a method for manufacturing a camera module, and the method specifically includes:
the method comprises the following steps: the image sensor is fixed on the circuit board;
specifically, as shown in fig. 4, when the image sensor 114 is disposed, the image sensor 114 is fixed on the first surface of the circuit board 113, and when the image sensor 114 is fixed on the circuit board 113, the image sensor 114 may be fixed on the circuit board 113 by using a common fixing process such as bonding, soldering, and the like. After the image sensor 114 is fixed on the circuit board 113, the light receiving surface of the image sensor 114 faces away from the circuit board 113, so that the light receiving surface faces the lens 12, and the light entering the lens 12 can directly irradiate the image sensor 114. Besides the fixed connection, the image sensor 114 and the circuit board 113 are electrically connected, as shown in fig. 4, the image sensor 114 is electrically connected through a metal flying wire 115, and an electrical signal converted by the image sensor 114 can be transmitted to the circuit board 113 through the metal flying wire 115 and transmitted to a processor of the mobile terminal through the circuit board 113. In addition, the surface mount elements 117 are further disposed on the first surface of the circuit board 113, and as shown in fig. 4, one surface mount element 117 is disposed on each side of the image sensor 114, but the disposition positions and the number of the surface mount elements 117 in fig. 4 are merely an example, and the specific number and disposition positions of the surface mount elements 117 are not limited in the embodiment of the present application. The surface-mounted component 117 may be various electrical devices, such as an inductor, a capacitor, or other electrical devices. It should be understood that in the embodiment of the present application, the surface mount element 117 is an optional component, and a different number of surface mount elements 117 may be provided on the circuit board 113 or no surface mount elements 117 may be provided as needed.
Assembling a cover body, and bonding and connecting the side wall of the optical filter with the side wall of the mounting hole on the bracket;
specifically, the side wall of the optical filter is bonded and connected with the side wall of the mounting hole, specifically, the shape of the mounting hole may be different, and referring to the relevant descriptions in fig. 4, fig. 6, fig. 8, fig. 10, and fig. 12, it can be seen that the optical filter may be supported by using a through hole, the optical filter may be supported by arranging a support surface for supporting the optical filter on the support, and the support may be provided with an adhesive overflow groove, etc. The detailed description may refer to the detailed description above, which is not intended to be limiting.
And thirdly, the cover body is connected with the circuit board in a sealing mode, and the support in the cover body surrounds the image sensor so as to seal the image sensor through the cover body.
Specifically, when the cover body is assembled with the circuit board, the support is fixed on the circuit board through the adhesive and is in sealing connection with the circuit board, and after the cover body is fixed, the image sensor is sealed in a space enclosed by the circuit board and the cover body, so that dust is prevented from falling onto the image sensor. In addition, the cover body is not in direct contact with the image sensor (a certain gap is formed between the side wall and the top of the support and between the optical filter and the image sensor), so that the image sensor is not polluted in the assembling process, and the safety of the image sensor is improved.
Can see through above-mentioned mode, detain on image sensor and with circuit board sealing connection through the support in this application embodiment, and the light filter sets up on the support, compare with the scheme among the prior art in, the cover body does not contact with image sensor to can not pollute image sensor, adopt the light filter to assemble with the circuit board assembly again after the cover body with the support assembly in addition, convenient equipment has also reduced the height of camera module simultaneously.
The embodiment of the application further provides a mobile terminal, and the mobile terminal can be a common mobile terminal such as a mobile phone, a tablet computer or a notebook computer. When the camera module is applied to the mobile terminal, the camera module is used for providing the camera function of the mobile terminal, and a mobile phone is taken as an example for explanation for convenience in understanding. When the camera module is applied to a mobile phone, the camera module can be used as a front camera module or a rear camera module, but the principle of the front camera module and the principle of the rear camera module are the same, and the following description will be given by taking the rear camera module as an example. As shown in fig. 2, fig. 2 shows a schematic view of the camera module 10 assembled in a mobile phone as a rear camera module 10, the mobile phone includes a housing 20 and the camera module 10 fixed in the housing 20, and fig. 2 shows three camera modules, the three camera modules are arranged in a straight line, and each camera module is the camera module 10 described above, but it should be understood that fig. 2 only shows a specific arrangement of the camera modules, and the mobile phone provided in the embodiment of the present application is not limited to the number and arrangement of the camera modules, for example, three camera modules are adopted, but the three camera modules are arranged in different manners such as triangle, straight line, etc., or four camera modules are adopted, and the four camera modules are arranged in a forward direction, straight line, etc Trapezoidal, and the like. However, no matter which mode is adopted, the lens of each camera module 10 is exposed on the surface of the mobile phone, and when shooting is carried out, images are collected through the camera modules 10 to shoot. The structure of the camera module can refer to the description above, the camera module 10 of the embodiment of the present application is buckled on the image sensor through the support and is connected with the circuit board in a sealing manner, and the optical filter is arranged on the support.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a camera module which characterized in that includes: the circuit board is fixed on the circuit board and is electrically connected with the image sensor; further comprising a cover sealing the image sensor; wherein the content of the first and second substances,
the cover body comprises a bracket and an optical filter; the bracket is arranged around the image sensor and is connected with the circuit board in a sealing way, and a mounting hole is formed in the bracket; and the side wall of the optical filter is connected with the side wall of the mounting hole in an adhesive manner.
2. The camera module of claim 1, wherein said mounting hole is a through hole.
3. The camera module according to claim 1, wherein the holder is provided with a support surface for supporting the filter.
4. The camera module according to claim 3, wherein a supporting protrusion for supporting the optical filter is disposed on a sidewall of the mounting hole.
5. The camera module according to claim 4, wherein the number of the supporting protrusions is plural, and the plural supporting protrusions are arranged around an axis of the mounting hole.
6. The camera module according to any one of claims 1 to 5, wherein the bracket is provided with an adhesive overflow groove, and the adhesive overflow groove is disposed around the mounting hole.
7. The camera module according to claim 6, wherein the glue overflow groove is formed in a side wall of the mounting hole.
8. The camera module according to any one of claims 1 to 7, further comprising a surface mount component fixed on the circuit board, wherein the surface mount component is located in the bracket.
9. The camera module according to any one of claims 1 to 8, wherein the optical filter is disposed coaxially with the image sensor.
10. A mobile terminal, characterized in that, it comprises a housing, and the camera module according to any one of claims 1-9 fixed in the housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989398.9A CN110868521A (en) | 2019-10-17 | 2019-10-17 | Camera module and mobile terminal |
| PCT/CN2020/102486 WO2021073181A1 (en) | 2019-10-17 | 2020-07-16 | Camera module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989398.9A CN110868521A (en) | 2019-10-17 | 2019-10-17 | Camera module and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110868521A true CN110868521A (en) | 2020-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910989398.9A Pending CN110868521A (en) | 2019-10-17 | 2019-10-17 | Camera module and mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110868521A (en) |
| WO (1) | WO2021073181A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021073181A1 (en) * | 2019-10-17 | 2021-04-22 | 华为技术有限公司 | Camera module and mobile terminal |
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| CN207782987U (en) * | 2018-03-14 | 2018-08-28 | 欧菲影像技术（广州）有限公司 | Integral type camera module |
| CN208862957U (en) * | 2018-10-29 | 2019-05-14 | 维沃移动通信有限公司 | Mobile terminal and fixed-focus camera module |
| CN209299368U (en) * | 2018-12-25 | 2019-08-23 | 南昌欧菲光电技术有限公司 | Microscope base, lens assembly, camera module and intelligent terminal |
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| CN104811589A (en) * | 2014-01-27 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module set thereof |
| US10192914B2 (en) * | 2016-03-20 | 2019-01-29 | Ningbo Sunny Opotech Co., Ltd. | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof |
| CN208489924U (en) * | 2018-08-10 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN110868521A (en) * | 2019-10-17 | 2020-03-06 | 华为技术有限公司 | Camera module and mobile terminal |
| CN110913099B (en) * | 2019-10-28 | 2021-09-07 | 华为技术有限公司 | Camera module and terminal |
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- 2019-10-17 CN CN201910989398.9A patent/CN110868521A/en active Pending
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| CN204013814U (en) * | 2014-04-30 | 2014-12-10 | 深圳市金立通信设备有限公司 | Camera and terminal |
| CN207782987U (en) * | 2018-03-14 | 2018-08-28 | 欧菲影像技术（广州）有限公司 | Integral type camera module |
| CN208862957U (en) * | 2018-10-29 | 2019-05-14 | 维沃移动通信有限公司 | Mobile terminal and fixed-focus camera module |
| CN209299368U (en) * | 2018-12-25 | 2019-08-23 | 南昌欧菲光电技术有限公司 | Microscope base, lens assembly, camera module and intelligent terminal |
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| WO2021073181A1 (en) * | 2019-10-17 | 2021-04-22 | 华为技术有限公司 | Camera module and mobile terminal |
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| WO2021073181A1 (en) | 2021-04-22 |
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