WO2021073181A1

WO2021073181A1 - Camera module and mobile terminal

Info

Publication number: WO2021073181A1
Application number: PCT/CN2020/102486
Authority: WO
Inventors: 冉坤; 罗振东; 缪伟亮
Original assignee: 华为技术有限公司
Priority date: 2019-10-17
Filing date: 2020-07-16
Publication date: 2021-04-22
Also published as: CN110868521A

Abstract

The present application provides a camera module and a mobile terminal. The camera module comprises a circuit board, an image sensor is fixed on the circuit board, and the image sensor is electrically connected to the circuit board; the camera module further comprises a cover for sealing the image sensor; and the cover comprises a support and a filter. The support is a housing structure, is provided around the image sensor, and is connected to the circuit board in a sealed manner; a mounting hole is provided on the support, and the side wall of the filter is connected to the side wall of the mounting hole in an adhered manner. It can be determined from the description above that, in the embodiments of the present application, the support covers the image sensor and is connected to the circuit board in a sealed manner, and the filter is fixed on the support; compared with the solution in the prior art, the cover is not in contact with the image sensor, and thus cannot contaminate the image sensor; in addition, the filter is assembled with the support to form the cover and then fitted to the circuit board, facilitating assembly, and reducing the height of the camera module.

Description

Camera module and mobile terminal

Cross-references to related applications

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201910989398.9, and the application name is "a camera module and mobile terminal" on October 17, 2019, the entire content of which is incorporated into this application by reference in.

Technical field

This application relates to the technical field of mobile terminals, and in particular to a camera module and a mobile terminal.

Background technique

At present, the miniaturization and ultra-thin design of mobile phones continue to advance, and the requirements for miniaturization and thinning of various mobile phone components are becoming more and more stringent. As an important module component of mobile phones, camera modules are also facing strong challenges of miniaturization and thinning; In particular, the current high-screen-to-body ratio and full-screen design have a stronger demand for the reduction of the size of the camera module. The structure of the camera module used in the prior art is shown in Figure 1. The camera module adopts injection molding technology, and the edges of the surface mount device 4, the wire bond alloy wire 2 and the image sensor 3 are plastic-encapsulated through the encapsulation layer 5. On the circuit board 1, the height of the camera module is reduced; however, when this method is adopted, plastic packaging on the image sensor 3 is likely to cause pollution of the image sensor 3, and the technical cost is high, and the yield rate is low.

Summary of the invention

The present application provides a camera module and a mobile terminal to facilitate the miniaturization of the camera module and improve the yield rate of the camera module.

In a first aspect, a camera module is provided, the camera module is applied to a mobile terminal, the camera module includes a circuit board, and the circuit board is fixed with an image sensor, and the image sensor and the circuit board are electrically connected to each other. It is connected to process the signal of the image sensor; in addition, the camera module also includes a cover that seals the image sensor; the cover includes two parts, a bracket and a filter. When set up, the bracket is a shell structure, and is arranged around the image sensor and connected to the circuit board in a sealed manner, and a mounting hole is provided on the bracket, and the side wall of the filter is glued to the side wall of the mounting hole.接连接。 Connected. The side wall of the filter is bonded and fixed with the side wall of the mounting hole. When in use, external light passes through the filter and irradiates the image sensor. It can be seen from the above description that, in the embodiment of the present application, the bracket is buckled on the image sensor and is sealed to the circuit board, and the filter is arranged on the bracket. Compared with the solution in the prior art, the cover is not It is in contact with the image sensor so as not to pollute the image sensor. In addition, the filter and the bracket are used to assemble the cover and then assembled with the circuit board, which is convenient for assembly and reduces the height of the camera module.

In a specific implementation, the top of the bracket and the filter are separated from the image sensor by a certain gap. Avoid contaminating the image sensor.

In a specific implementation, the mounting hole is a through hole. Thus, the height of the filter can be reduced, thereby reducing the height of the entire module.

In a specific implementation, the support is provided with a supporting surface for supporting the filter. The filter is supported by the supporting surface to improve the stability of the filter.

In a specific implementation, a supporting protrusion for supporting the filter is provided on the side wall of the mounting hole. A supporting surface is formed by the provided supporting protrusions to support the filter.

In a specific implementation, the number of the supporting protrusions is multiple, and the multiple supporting protrusions are arranged around the axis of the mounting hole. In turn, the stability of the filter is improved.

In a specific implementation, the mounting hole is a stepped hole, a boss is formed in the mounting hole, and one surface of the boss is a supporting surface to support the filter to improve the stability of the filter .

In a specific implementation, a glue overflow groove is provided on the bracket, and the glue overflow groove is arranged around the mounting hole. The glue overflow groove is used to increase the amount of glue to avoid glue dripping onto the image sensor.

In a specific implementation, the glue overflow groove is arranged on the side wall of the mounting hole. Increase the stability of the adhesion of the filter and the bracket.

In a specific implementation, it further includes a surface mount component fixed on the circuit board, and the surface mount component is located in the bracket.

In a specific implementation, the filter and the image sensor are arranged coaxially.

In a second aspect, a method for preparing a camera module is provided. The method includes fixing an image sensor on a circuit board; assembling a cover body, adhering and connecting the side wall of the filter with the side wall of the mounting hole on the bracket; The cover body is sealed with the circuit board, and the bracket in the cover body surrounds the image sensor to seal the image sensor through the cover body. In the embodiment of the present application, the bracket is buckled on the image sensor and connected to the circuit board in a sealed manner, and the filter is arranged on the bracket. Compared with the solution in the prior art, the cover body is not in contact with the image sensor. It will contaminate the image sensor. In addition, the filter and bracket are used to assemble the cover and then assembled with the circuit board, which is convenient for assembly and reduces the height of the camera module.

In a specific implementation, the support is provided with a supporting surface for supporting the filter, so as to improve the stability of the filter.

In a specific implementation, a glue overflow groove is provided on the bracket, and the glue overflow groove is arranged around the mounting hole. Improve the stability of the connection between the filter and the bracket.

In a third aspect, a mobile terminal is provided. The mobile terminal may be a mobile phone, a tablet computer, or the like. The mobile terminal includes a housing and the camera module according to any one of the above fixed in the housing. It can be seen from the above description that, in the embodiment of the present application, the bracket is buckled on the image sensor and is sealed to the circuit board, and the filter is arranged on the bracket. Compared with the solution in the prior art, the cover is not It is in contact with the image sensor so as not to pollute the image sensor. In addition, the filter and the bracket are used to assemble the cover and then assembled with the circuit board, which is convenient for assembly and reduces the height of the camera module.

Description of the drawings

FIG. 1 is a schematic diagram of the structure of a camera module in the prior art;

Figure 2 is a schematic structural diagram of a mobile terminal provided by an embodiment of the application;

FIG. 3 is a schematic structural diagram of a camera module provided by an embodiment of the application;

Figure 4 is a cross-sectional view at A-A in Figure 3;

5 is a schematic structural diagram of a main body of a camera module provided by an embodiment of the application;

Figure 6 is a cross-sectional view at B-B in Figure 5;

FIG. 7 is a schematic structural diagram of another main body of a camera module provided by an embodiment of the application;

Figure 8 is a cross-sectional view at C-C in Figure 7;

9 is a schematic structural diagram of another main body of a camera module provided by an embodiment of the application;

Figure 10 is a cross-sectional view at D-D in Figure 9;

11 is a schematic structural diagram of another main body of a camera module provided by an embodiment of the application;

Fig. 12 is a cross-sectional view at E-E in Fig. 11.

Detailed ways

In order to facilitate the understanding of the camera module provided in the embodiments of this application, the following first describes the application scenarios of the camera modules provided in the embodiments of this application. The camera modules provided in the embodiments of this application are applied to mobile terminals, such as mobile phones, tablet computers or Common mobile terminals such as laptops. When the camera module is applied to the mobile terminal, it is used to provide the camera function of the mobile terminal. For the convenience of understanding, a mobile phone is used as an example for description. When the camera module is applied to a mobile phone, it can be used as a front camera module or a rear camera module, but the principle is the same whether it is a front camera module or a rear camera module. Take the camera module as an example for description. As shown in Figure 2, Figure 2 shows a schematic diagram of the camera module 10 as a rear camera module 10 assembled in a mobile phone; as can be seen from Figure 2, the camera module 10 is fixed in the mobile phone, and the camera module The lens of 10 is exposed on the surface of the mobile phone. When shooting, the camera module 10 collects images for shooting. With the development of thinner mobile phones, the space for accommodating the camera module 10 in the mobile phone is getting smaller and smaller. Therefore, the camera module 10 needs to be miniaturized. For this reason, an embodiment of the present application provides a camera module 10, which will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring first to FIG. 3, FIG. 3 shows a partial structure of the camera module 10 provided by an embodiment of the present application. The camera module 10 shown in FIG. 3 at least includes a main body 11 and a lens 12 connected to the main body 11; 12 is used to collect light, and the main body 11 is used to convert light signals into electrical signals and form images. In Figure 3, the lens 12 is set on the main body 11 and connected to the main body 11; when in use, the external light can pass through the lens 12 and irradiate the main body 11, and the main body 11 then uses the sensed light as a light signal. It is converted into an electrical signal to form an image.

4 together, FIG. 4 shows a schematic diagram of the structure at A-A in FIG. 3, wherein the schematic diagram of the structure at A-A refers to a schematic diagram of the camera module cut along the direction shown by A-A in FIG. 3. First, the lens 12 in FIG. 4 will be described. The lens 12 includes a lens barrel 123 and a plurality of lenses 121 arranged in the lens barrel 123. As shown in FIG. 4, the axes of the plurality of lenses 121 are the same and are along the height direction. (That is, the X direction shown in Fig. 4) are arranged at intervals. In the camera module 10 shown in FIG. 4, four lenses 121 are shown, but the number of lenses 121 is not specifically limited in the embodiment of the present application. In actual production, the lens 121 can be adjusted as needed. Number, such as two, three, five, six, etc. different numbers. In addition, the focal length, curvature and other parameters of each lens 121 can be adjusted according to actual needs, which are not limited here. 4, the lens 12 also includes a voice coil motor 122, the voice coil motor 122 is set outside the lens barrel 123, and is used to drive the lens barrel 123 to slide along the axis of the lens 121, so as to achieve the effect of driving the lens 121 to move. In order to realize the focusing of the lens 12. When the voice coil motor 122 is set, the voice coil motor 122 is fixedly connected to the main body, and the lens barrel 123 is fixedly connected to the main body through the voice coil motor 122. When the voice coil motor 122 is working, the lens barrel 123 can be driven up or down. Movement, so as to adjust the distance between the lens 12 and the main body, and realize the focusing of the lens 12.

Continuing to refer to FIG. 4, the main body of the camera module 10 may include a circuit board 113 and an image sensor 114 provided on the circuit board 113. The circuit board 113 serves as a carrier and also as a transmission component of electrical signals. For the convenience of description, two opposite surfaces of the circuit board 113 are named: the first surface and the second surface. The first surface is the surface of the circuit board 113 for carrying devices, and the second surface is the surface of the circuit board 113 and the mobile terminal. The surface connected to other structures, of course, the second surface can also be used to carry the device. During specific installation, the device can be selected to be installed on the first surface or the second surface as required. When specifically selecting the circuit board 113, different types of circuit boards can be selected, such as printed circuit boards, or different types of circuit boards such as single-sided circuit boards and double-sided circuit boards can be used.

Continuing to refer to FIG. 4, the image sensor 114 uses the photoelectric conversion function of the photoelectric device to divide the light image on the light-receiving surface into many small units and convert it into a functional device that can be used as an electrical signal. In specific settings, the image sensor 114 may adopt different types of image sensors such as a light guide tube and a solid-state image sensor. 4, when the image sensor 114 is set, the image sensor 114 is fixed on the first surface of the circuit board 113. For specific fixing, the image sensor 114 can be fixed on the circuit board 113 by common fixing techniques such as bonding and welding. on. After the image sensor 114 is fixed on the circuit board 113, the light-receiving surface of the image sensor 114 faces away from the circuit board 113, so that the light-receiving surface faces the lens 12, and the light incident from the lens 12 can directly irradiate the image sensor 114.

Continuing to refer to FIG. 4, in addition to the above-mentioned fixed connection between the image sensor 114 and the circuit board 113, the two are also electrically connected. As shown in FIG. 4, the image sensor 114 is electrically connected through a metal flying wire 115, and the image sensor The electrical signal converted by 114 can be transmitted to the circuit board 113 through the metal flying wire 115 and transmitted to the processor of the mobile terminal through the circuit board 113. In addition, a surface mount component 117 is also provided on the first surface of the circuit board 113. As shown in FIG. 4, a surface mount component 117 is provided on both sides of the image sensor 114, but the surface mount component 117 in FIG. 4 The setting position and the number are only an example, and the specific number and setting positions of the surface mount components 117 are not limited in the embodiment of the present application. The surface mount component 117 may be different electrical devices, such as inductors, capacitors, or other electrical devices. It should be understood that, in the embodiment of the present application, the surface mount component 117 is an optional component, and a different number of surface mount components 117 can be provided on the circuit board 113 as required, or no surface mount component 117 can be provided.

Continuing to refer to FIG. 4, it can be seen from the working principle of the above-mentioned image sensor 114 that when the image sensor 114 is in use, if impurities fall on the light-receiving surface of the image sensor 114, the imaging effect of the camera module 10 will be affected. Therefore, the main body 11 of the camera module 10 provided by the embodiment of the present application further includes a cover for sealing the image sensor 114 to prevent dust from falling on the light-receiving surface of the image sensor 114. Continuing to refer to FIG. 4, FIG. 4 illustrates a specific cover structure, which includes a bracket 111 and a filter 112. Wherein, the bracket 111 shown in FIG. 4 is a shell structure. Refer to the structure shown in the dotted line in FIG. 3 together. The dotted line shows the frame outline of the invisible part of the camera module 10. It can be seen from Figures 3 and 4 that the bracket 111 is a structure with two ends open, which includes four side walls and a bottom wall, and a mounting hole matching the filter 112 is provided on the bottom wall (Figure (Not numbered in)), the side of the bracket 111 opposite to the bottom wall is an opening. When the bracket 111 is connected to the circuit board 113, one side of the opening of the bracket 111 is covered on the first surface of the circuit board 113, the bracket 111 is arranged around the image sensor 114, and the surface mount component 117 and the image sensor 114 are covered on the bracket Within 111. When the bracket 111 is fixed on the circuit board 113, the bracket 111 is also sealed and connected to the circuit board 113. For example, a circle of adhesive glue is coated on the circuit board 113, and the bracket 111 is connected to the circuit board 113 through the adhesive glue. For sealing, of course, the above-mentioned adhesive only exemplifies a specific connection method. In the embodiment of the present application, other methods may also be used for connection and sealing. For the material of the bracket 111, different materials can be selected according to needs, such as a metal material or a plastic material. Taking the metal material as an example, it can be made of different materials such as aluminum, steel, and alloy steel.

Continuing to refer to FIG. 4, the cover provided by the embodiment of the present application further includes a filter 112, which is arranged in the mounting hole. As shown in FIG. 4, the mounting hole is a through hole, and the through hole is located in the image Above the sensor 114 (take the placement direction of the main body shown in FIG. 4 as the reference direction). Referring to FIG. 3 together, it can be seen in FIG. 3 that the through hole is circular, and the shape of the corresponding filter 112 is also circular, but the specific embodiment of the filter 112 is not limited in the embodiment of the present application. In terms of shape, the filter 112 may adopt a symmetrical or asymmetrical shape such as a square, an ellipse, and a special shape. However, no matter what shape the filter 112 adopts, it should be able to ensure that the vertical projection of the filter 112 on the plane where the light-receiving surface is located can cover the light-receiving surface, so that light can pass through the filter 112 and irradiate the light-receiving surface. When the filter 112 is circular, the axis of the filter 112 and the axis of the image sensor 114 are the same axis, and the axis is also coaxial with the axis of the lens 121 in the lens 12, and the axis is also the camera module. Group 10 axis.

Continuing to refer to FIG. 4, when the filter 112 is disposed in the above-mentioned through hole, the side wall of the filter 112 and the side wall of the through hole are adhesively connected. As shown in FIG. 4, the size of the through hole is larger than the size of the filter 112. When the filter 112 is disposed in the through hole, there is a certain interval between the side wall of the through hole and the side wall of the filter 112. In the gap, the adhesive 116 is filled in the gap to bond and fix the filter 112 and the bracket 111, and seal the filter 112 and the bracket 111.

When assembling the main body 11, the bracket 111 in the cover and the filter 112 are assembled together, and then the entire cover is connected to the circuit board 113. When assembling the cover, the bracket 111 is placed on a support fixture, and the support fixture is inserted into the support 111 and pressed against the bottom wall of the support 111 so that the mounting hole is located above the support fixture. When the filter 112 is placed in the mounting hole, the filter 112 is supported and positioned by a supporting fixture, and then an adhesive 116 is applied to bond the filter 112 and the bracket 111 together. When assembling the cover with the circuit board 113, the bracket 111 is fixed on the circuit board 113 by the adhesive 116 and connected to the circuit board 113 in a sealed manner, and after the cover is fixed, the image sensor 114 is sealed on the circuit board 113 In the space enclosed by the cover, dust is prevented from falling on the image sensor 114. In addition, because there is no direct contact between the cover and the image sensor 114 (the side wall and top of the bracket 111 and the filter 112 and the image sensor 114 are separated by a certain gap), the image sensor 114 will not be contaminated during the assembly process. , Improve the security of the image sensor 114.

In addition, it can be seen from FIG. 4 that when the filter 112 is fixed to the bracket 111, since the filter 112 and the bracket 111 are connected between the side walls, the thickness of the bottom wall can be relatively thin. In terms of height, the height of the bracket 111 can be effectively reduced, thereby reducing the height of the entire main body 11, and thus the height of the entire camera module 10 is reduced.

Of course, the matching manner of the bracket 111 and the filter 112 in the cover provided by the embodiment of the present application is not limited to the manner shown in FIG. 4, and other manners may also be adopted. As shown in Figures 5 and 6, where Figure 5 shows a schematic structural diagram of the main body 11 of another camera module; Figure 6 shows in Figure 5, where the schematic structural diagram at BB refers to the The schematic diagram of the camera module after the camera module is cut in the direction shown by BB in FIG. 5. The reference numerals shown in FIG. 5 can refer to the same reference numerals in FIG. 4. The structural schematic diagram of the main body 11 of the camera shown in FIGS. 5 and 6 is different from that of the differential filter 112 and the bracket 111 in FIG. 4. As shown in FIG. 5, the bracket 111 provided by the embodiment of the present application is further provided with a glue overflow groove 118 which is arranged around the installation hole. In FIG. 5, the glue overflow groove 118 is arranged on the side wall of the installation hole. In addition, the glue overflow groove 118 is located on a side of the bottom wall of the bracket 111 facing away from the image sensor 114. Referring to Figure 6 together, it can be seen from Figures 5 and 6 that the glue overflow groove 118 is connected to the mounting hole to form a stepped hole. The part with a larger diameter is the area for accommodating the glue overflow, and the diameter is larger. The small part is used to hold the filter 112. As shown in FIG. 6, when the filter 112 is put into the mounting hole, there is a gap between the filter 112 and the side wall of the stepped hole, and the gap is filled with adhesive 116, which is passed through the adhesive 116 fills up the gap to fix the filter 112 and the bracket 111. During assembly, the assembly method is the same as the assembly method of the main body 11 shown in FIG. When the glue 116 is applied, the excess glue 116 can flow into the glue overflow groove 118 to avoid the outflow of the glue 116 and affect the image sensor 114. In addition, when the glue overflow groove 118 is used, it can be seen from FIG. 6 that the filling amount of the adhesive glue 116 is increased, and the stability of the connection between the filter 112 and the bracket 111 is improved.

As shown in FIGS. 7 and 8, FIG. 7 shows a schematic structural diagram of another main body provided by an embodiment of the present application, and FIG. 8 shows a cross-sectional view at CC in FIG. 7, where the schematic structural diagram at CC refers to A schematic diagram of the camera module cut along the direction shown by CC in FIG. 7. The reference numerals shown in FIG. 7 can refer to the same reference numerals in FIG. 4. The structural schematic diagram of the main body 11 of the camera shown in FIGS. 7 and 8 is different from that of the differential filter 112 and the bracket 111 in FIG. 4. As shown in FIG. 7, the mounting hole of the bracket 111 provided by the embodiment of the present application is a stepped hole, wherein a hole with a smaller diameter is close to the image sensor 114, and a hole with a larger diameter is far away from the image sensor 114. As shown in FIG. 8, the stepped surface in the stepped hole serves as a supporting surface for supporting the filter 112. When the filter 112 is placed in the mounting hole, the filter 112 is placed in the hole with a larger diameter and the filter 112 is supported by the supporting surface. When assembling, first put the filter 112 into the mounting hole and support it by the supporting surface, then fill the adhesive 116 to fix the filter 112 in the mounting hole, and seal the filter 112 with the adhesive 116 . When the above structure is adopted, it can be seen from FIG. 8 that the weight of the filter 112 can be supported by the supporting surface, and the side wall of the filter 112 is adhesively connected to the bracket 111 by the adhesive 116, thereby improving the filtering. The stability of the sheet 112. In addition, in addition to the above methods, the support surface can also be coated with adhesive 116, so that the part of the filter 112 that overlaps the support surface is also adhesively connected to the support 111, so as to improve the relationship between the filter 112 and the support 111. The stability of the bonding can simultaneously seal the gap between the filter 112 and the holder 111 in the axial and radial directions, thereby improving the sealing effect of the filter 112 and the holder 111.

As shown in FIGS. 9 and 10, FIG. 9 shows a schematic structural diagram of another main body 11 provided by an embodiment of the present application, and FIG. 10 shows a cross-sectional view at DD in FIG. 9, where the schematic structural diagram at DD refers to It is a schematic diagram of the camera module cut along the direction shown by DD in FIG. 9. The reference numerals shown in FIG. 9 can refer to the same reference numerals in FIG. 4. The structural schematic diagram of the main body 11 of the camera shown in FIGS. 9 and 10 is different from that of the differential filter 112 and the bracket 111 in FIG. 4. As shown in FIG. 9, the mounting hole of the bracket 111 provided by the embodiment of the present application is a through hole, and the side wall of the mounting hole is provided with a supporting protrusion 119 for supporting the filter 112, and each of the supporting protrusions 119 The number can be multiple, such as two, three, four, etc., different numbers, multiple support protrusions 119 are arranged around the axis of the mounting hole, and the heights of the multiple support protrusions 119 are the same, so that the support protrusions The upper surface of 119 (the surface of the supporting protrusion 119 facing away from the image sensor 114) forms a supporting surface. When the filter 112 is placed in the mounting hole, the filter 112 is placed on the supporting surface and supported by the supporting surface, and then the adhesive 116 is filled to fix the filter 112 in the mounting hole, and the adhesive 116 is used to fix the filter 112 in the mounting hole. Seal the filter 112. When the above structure is adopted, it can be seen from FIG. 10 that the weight of the filter 112 can be supported by the supporting surface, and the side wall of the filter 112 is adhesively connected to the bracket 111 through the adhesive 116, so that the filter can be improved. 112's stability.

As shown in FIGS. 11 and 12, FIG. 11 shows a schematic structural diagram of another main body 11 provided by an embodiment of the present application, as shown in FIGS. 11 and 12, and FIG. 11 shows another example provided by an embodiment of the present application. A structural schematic diagram of the main body 11, FIG. 12 shows a cross-sectional view at EE in FIG. 11, wherein the structural schematic diagram at EE refers to a schematic diagram of the camera module cut along the direction shown in EE in FIG. The reference numerals shown in FIG. 11 can refer to the same reference numerals in FIG. 4. The structural schematic diagram of the main body 11 of the camera shown in FIGS. 11 and 12 is different from that of the differential filter 112 and the bracket 111 in FIG. 4. As shown in FIG. 11, the mounting hole of the bracket 111 provided by the embodiment of the present application is a through hole, and the through hole is a tapered hole. Wherein, the opening with a smaller diameter is close to the image sensor 114, and the opening with a larger diameter is far away from the image sensor 114; of course, an opening with a larger diameter can also be used to face the image sensor 114, and an opening with a smaller diameter is away from the image sensor 114. As shown in FIG. 12, the corresponding filter 112 also adopts a tapered surface that matches the mounting hole. In specific matching, the tapered angle of the tapered surface of the filter 112 may be greater than, equal to, or less than that of the tapered surface of the mounting hole. Cone angle. When assembling the filter 112, the side wall of the mounting hole serves as a supporting surface to support the filter 112. As shown in FIG. 12, when the filter 112 is put into the mounting hole, the filter 112 is put into the mounting hole, because the filter 112 has a tapered surface that matches the mounting hole, and the filter 112 The maximum diameter of the tapered surface is larger than the smaller diameter of the opening on the mounting hole. Therefore, when the filter 112 is inserted into the mounting hole, the filter 112 can be supported by the side wall of the mounting hole. Taking the cone angle of the cone surface of the filter 112 and the cone surface of the mounting hole as an example, at this time, the cone surface of the filter 112 is flat with the cone surface of the mounting hole. During assembly, the bracket 111 is placed on a support fixture, and the support fixture is inserted into the support 111 and pressed against the bottom wall of the support 111 so that the mounting hole is located above the support fixture. When the sheet 112 is placed in the mounting hole, the filter 112 is supported and positioned by a supporting fixture, and then an adhesive glue 116 is applied to bond the filter 112 and the bracket 111 together. When assembling the cover with the circuit board 113, the bracket 111 is fixed on the circuit board 113 by the adhesive 116 and connected to the circuit board 113 in a sealed manner, and after the cover is fixed, the image sensor 114 is sealed on the circuit board 113 In the space enclosed by the cover, dust is prevented from falling on the image sensor 114. In addition, because there is no direct contact between the cover and the image sensor 114: the side walls and top of the bracket 111 and the filter 112 are separated from the image sensor 114 by a certain gap, so the image sensor 114 will not be contaminated during the assembly process. The security of the image sensor 114 is improved.

When the taper angle of the tapered surface of the filter 112 is greater than or less than the taper angle of the tapered surface of the mounting hole, the side wall of the mounting hole can be used as a support surface to support the filter 112, and the support surface is used for positioning, Therefore, there is no need for a supporting jig to support the filter 112 during assembly.

It should be understood that the structures illustrated in FIGS. 6, 8, 10, and 12 can be seen that different structures can be used to form a supporting surface on the bracket 111 to support the filter 112 to improve the filter 112. The stability. Of course, it should be understood that the foregoing FIGS. 6 to 12 are only an example. In the disclosed embodiments of the present application, other structures may also be used to form a supporting surface to support the filter 112.

It can be seen from the above description that the camera module 10 provided by the embodiment of the present application is buckled on the image sensor 114 through a cover and is sealed to the circuit board 113, and there is no contact between the cover structure and the image sensor 114, so that The security of the image sensor 114 is improved. Compared with the solution in the prior art, the cover body is not in contact with the image sensor 114, thereby not contaminating the image sensor 114. In addition, the filter 112 and the bracket 111 are used to assemble the cover body and then assembled with the circuit board 113, which is convenient The assembly also reduces the height of the camera module 10.

In order to facilitate the understanding of the camera module provided by the embodiment of the present application, the embodiment of the present application also provides a preparation method of the camera module, and the preparation method specifically includes:

Step 1: Fix the image sensor on the circuit board;

Specifically, as shown in FIG. 4, when the image sensor 114 is set, the image sensor 114 is fixed on the first surface of the circuit board 113. For specific fixing, the image sensor 114 can be fixed by common fixing techniques such as bonding and welding. On the circuit board 113. After the image sensor 114 is fixed on the circuit board 113, the light-receiving surface of the image sensor 114 faces away from the circuit board 113, so that the light-receiving surface faces the lens 12, and the light incident from the lens 12 can directly irradiate the image sensor 114. In addition to the above-mentioned fixed connection between the image sensor 114 and the circuit board 113, the two are also electrically connected. As shown in FIG. 4, the image sensor 114 is electrically connected through a metal flying wire 115, and the electrical signal converted by the image sensor 114 It can be transferred to the circuit board 113 through the metal flying wire 115, and transferred to the processor of the mobile terminal through the circuit board 113. In addition, a surface mount component 117 is also provided on the first surface of the circuit board 113. As shown in FIG. 4, a surface mount component 117 is provided on both sides of the image sensor 114, but the surface mount component 117 in FIG. 4 The setting position and the number are only an example, and the specific number and setting positions of the surface mount components 117 are not limited in the embodiment of the present application. The surface mount component 117 may be different electrical devices, such as inductors, capacitors, or other electrical devices. It should be understood that, in the embodiment of the present application, the surface mount component 117 is an optional component, and a different number of surface mount components 117 can be provided on the circuit board 113 as required, or no surface mount component 117 can be provided.

Step 2: Assemble the cover, and glue the side wall of the filter with the side wall of the mounting hole on the bracket;

Specifically, the side wall of the filter and the side wall of the mounting hole are adhesively connected. Specifically, the shape of the mounting hole can be different shapes. Refer to Figure 4, Figure 6, Figure 8, Figure 10, and Figure 12. From the related description, it can be seen that either the through hole can be used to support the filter, the support can also be provided with a support surface for supporting the filter to support the filter, and the support can also be provided with a glue overflow groove, etc. For specific description, please refer to the above detailed description, which is not specifically limited here.

Step three: sealingly connect the cover body and the circuit board, and the bracket in the cover body surrounds the image sensor to seal the image sensor through the cover body.

Specifically, when assembling the cover and the circuit board, the bracket is fixed on the circuit board and connected to the circuit board by adhesive glue, and after the cover is fixed, the image sensor is sealed on the circuit board and the cover. In order to prevent dust from falling on the image sensor. In addition, because there is no direct contact between the cover and the image sensor (the side wall, top of the bracket, and a certain gap between the filter and the image sensor), the image sensor will not be contaminated during the assembly process, which improves the image sensor. Security.

It can be seen from the above method that, in the embodiment of the present application, the bracket is buckled on the image sensor and sealedly connected to the circuit board, and the filter is arranged on the bracket. Compared with the solution in the prior art, the cover is not It is in contact with the image sensor so as not to pollute the image sensor. In addition, the filter and the bracket are used to assemble the cover and then assembled with the circuit board, which is convenient for assembly and reduces the height of the camera module.

The embodiments of the present application also provide a mobile terminal, which may be a common mobile terminal such as a mobile phone, a tablet computer, or a notebook computer. When the camera module is applied to a mobile terminal, it is used to provide the camera function of the mobile terminal. For ease of understanding, a mobile phone is used as an example for description. When the camera module is applied to a mobile phone, it can be used as a front camera module or a rear camera module, but the principle is the same whether it is a front camera module or a rear camera module. Take the camera module as an example for description. As shown in FIG. 2, FIG. 2 shows a schematic diagram of the camera module 10 as a rear camera module 10 assembled in a mobile phone. The mobile phone includes a housing 20 and any of the above items fixed in the housing 20. The camera module 10 of FIG. 2 shows three camera modules, the three camera modules are arranged in a straight line, and each camera module is the camera module 10 described above, but it should be understood that, Figure 2 only shows a specific arrangement of camera modules. The number and arrangement of camera modules are not limited in the mobile phone provided in the embodiment of this application. For example, three camera modules are used. The three camera modules are arranged in different ways such as triangles and linear, or four camera modules are used, and the four camera modules are arranged in different shapes such as positive direction, linear, trapezoidal, etc. However, no matter which method is adopted, the lens of each camera module 10 is exposed on the surface of the mobile phone. When shooting, the camera module 10 collects images for shooting. The structure of the camera module can refer to the above description. In the embodiment of the present application, the camera module 10 is buckled on the image sensor through a bracket and is hermetically connected with the circuit board, and the filter is arranged on the bracket. In some technical solutions, the cover is not in contact with the image sensor, so that it will not pollute the image sensor. In addition, the filter and bracket are used to assemble the cover and then assembled with the circuit board, which is convenient for assembly and reduces the camera module. the height of.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope disclosed in this application, which shall cover Within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A camera module, characterized by comprising: a circuit board, an image sensor fixed on the circuit board and electrically connected to the circuit board; and a cover for sealing the image sensor; wherein,

The cover includes a support and a filter; wherein the support is arranged around the image sensor and is connected to the circuit board in a sealed manner, and a mounting hole is provided on the support; the side wall of the filter Adhesively connect with the side wall of the mounting hole.
The camera module of claim 1, wherein the mounting hole is a through hole.
The camera module according to claim 1, wherein the support is provided with a supporting surface for supporting the filter.
The camera module according to claim 3, wherein the side wall of the mounting hole is provided with a supporting protrusion for supporting the filter.
4. The camera module of claim 4, wherein the number of the supporting protrusions is multiple, and the multiple supporting protrusions are arranged around the axis of the mounting hole.
The camera module according to any one of claims 1 to 5, wherein a glue overflow groove is provided on the bracket, and the glue overflow groove is arranged around the mounting hole.
7. The camera module of claim 6, wherein the glue overflow groove is provided on a side wall of the mounting hole.
The camera module according to any one of claims 1 to 7, further comprising a surface mount component fixed on the circuit board, and the surface mount component is located in the bracket.
The camera module according to any one of claims 1 to 8, wherein the filter and the image sensor are arranged coaxially.
A mobile terminal, characterized by comprising a housing, and the camera module according to any one of claims 1-9 fixed in the housing.