CN105472216B

CN105472216B - Electric support and camera module with buffer structure

Info

Publication number: CN105472216B
Application number: CN201510867694.3A
Authority: CN
Inventors: 张宝忠; 王明珠; 陈振宇; 王胤欢; 黄桢
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2015-12-01
Filing date: 2015-12-01
Publication date: 2020-01-10
Anticipated expiration: 2035-12-01
Also published as: CN105472216A

Abstract

The electric bracket comprises a bracket part and a bottom part, wherein the bracket part is connected with the bottom part and is suitable for supportingly installing a photosensitive chip, and the bottom part is provided with a buffer structure which is convexly arranged on the bottom part so as to be buffered and pressed for installation.

Description

Electric support and camera module with buffer structure

Technical Field

The invention relates to the field of camera modules, in particular to an electric support with a buffer structure and a camera module.

Background

With the increasing demand for portability and miniaturization of electronic devices, it is a challenge to provide various functions of electronic devices, such as a camera module that is widely used, and most commonly, a camera module that is installed in a smart phone. The imaging requirement on the camera module arranged on the smart phone product is continuously improved, the image is required to be clear and beautiful, and the high-quality imaging effect is usually matched with more and larger components. For example, the bigger the pixel is, the larger the chip area will be, and the number of passive components such as driving resistor and capacitor will also be increased, and the module size will also be bigger and bigger, and simultaneously, the assembly degree of difficulty of the camera module also improves thereupon. Therefore, smart phone products are becoming thinner and lighter, and there are two trends in the surface of smart phones with high requirements for the imaging quality of the camera module disposed in the smart phone.

For catering to solve above-mentioned problem, be applied to the use of the electric support of making a video recording module appearance and solved along with making a video recording under the prerequisite of the high-demand development of module product at to a great extent, the problem of the module product volume of controlling to make a video recording can reduce the problem of the module volume of making a video recording even to can simplify the equipment process of the module of making a video recording, optimize the inner structure environment of the module of making a video recording.

The electric bracket applied to the camera module can be manufactured into various required shapes and sizes, a connecting circuit is preset in the electric bracket, connecting pins and/or bonding pads are preset on the surface of the electric bracket, a motor (an optical lens is installed on the motor) for installing the camera module, an optical filter is installed on the electric bracket, and a photosensitive chip and a flexible circuit board of the camera module are electrically connected. Simultaneously, the electric support can be guaranteed the rationality that sets up the position between each subassembly of module of making a video recording realizes the high-quality while of effect of appearing, more can provide the clear required dustless environment that appears of each components and parts and the beneficial effect of simple assembly.

In the assembly process of the camera module comprising the electric bracket, the electric connection between the pins and/or the bonding pads on the surface of the photosensitive chip of the camera module and the pins and/or the bonding pads on the surface of the electric bracket is one of the ways of realizing the connection between the photosensitive chip and the electric bracket. In a conventional assembly process of the camera module including the electrical support, the photosensitive chip and the electrical support are pressed together by an external force in a heating or ultrasonic environment, that is, the connection between the pins and/or pads on the photosensitive chip and the pins and/or pads on the surface of the electrical support is pressed together by an external force in a heating or ultrasonic environment. However, due to the non-uniform flatness of the respective surface sheets of the photo sensor chip and the electrical support, that is, the difference in surface flatness between the photo sensor chip and the electrical support, the pressing force during the assembly process often cannot be uniformly applied to each of the pins and/or pads on the surface of the photo sensor chip and the surface of the electrical support, thereby causing damage to the pins and/or pads on the surface of the photo sensor chip and the surface of the electrical support due to excessive stress or poor circuit passing due to insufficient stress. Both of the above phenomena will ultimately affect the quality and yield of the product of the camera module.

Disclosure of Invention

An object of the present invention is to provide an electrical rack having a press-fit buffer structure, which provides a buffer structure on the surface of the electrical rack, thereby allowing components to be mounted on the electrical rack to be mounted in a buffered manner.

Another objective of the present invention is to provide an electrical bracket with a press-fit buffer structure, wherein the buffer structure is uniformly distributed on the surface of the electrical bracket, so that the mounted components are uniformly stressed and smoothly mounted.

Another objective of the present invention is to provide an electrical bracket with a press-fit buffer structure, wherein the buffer structure relieves the pressure when an electrical component is mounted on the electrical bracket, and improves the pressure resistance of the electrical bracket.

Another objective of the present invention is to provide an electrical rack with a pressure buffering structure, wherein the pressure buffering structure buffers the pressure generated during the mounting of the component on the electrical rack, so as to prevent the component from being damaged during the stamping and mounting process, thereby improving the yield of the product.

Another objective of the present invention is to provide a camera module with a pressure buffering structure, which has a buffering structure disposed on an electrical bracket, so that the camera module has higher stability and reliability.

Another objective of the present invention is to provide a camera module with a pressure buffering structure, which has better electrical stability when the camera module is in an orbiting state in an external environment.

Another objective of the present invention is to provide a camera module with a pressure buffering structure, wherein the buffering structure can be convexly disposed on the electrical bracket in a one-step forming manner to form a limiting boss, so as to prevent assembly inclination caused by non-uniform pressing force.

To achieve the above objects, one aspect of the present invention provides an electrical stand including a stand portion connected to a base portion adapted to supportingly mount components, and a base portion having a cushioning structure thereon protrudingly disposed on the base portion so as to be cushioned press-fit.

According to an embodiment of the present invention, the electric rack with a buffering structure includes a plurality of buffering units, and the buffering units are disposed on the bottom in a square layout.

According to an embodiment of the present invention, the electric rack with a buffering structure includes a plurality of buffering units, and the buffering units are disposed on the bottom in a grid-like layout.

According to an embodiment of the present invention, the electrical rack with a buffering structure includes a plurality of buffering units, and the buffering units are disposed on the bottom in a laid layout.

According to an embodiment of the present invention, the electrical rack with a buffer structure comprises at least one buffer unit, and the buffer unit is arranged at the bottom in a ring shape.

According to an embodiment of the present invention, the damping unit of the electrical rack with a damping structure is a block structure.

According to an embodiment of the present invention, the buffering unit of the electrical rack with a buffering structure is an arc-shaped structure.

According to an embodiment of the present invention, the buffer of the electrical rack with a buffer structure has a step-like structure.

According to an embodiment of the present invention, the buffering unit in the electric bracket with the buffering structure has a hollow structure, and the hollow position is suitable for arranging the electric element.

According to an embodiment of the present invention, the bottom of the electrical rack with the buffer structure is provided with an electrical component, and the buffer unit is attached to the electrical component.

According to an embodiment of the present invention, a cross-sectional area of the buffer unit in the electrical rack with the buffer structure is larger than a cross-sectional area of the electrical component.

According to an embodiment of the present invention, the electrical component in the electrical support with the buffer structure is a pad or a circuit pin.

According to an embodiment of the present invention, the support portion of the electrical support with the buffering structure is a boss-type support structure suitable for supportingly mounting a color filter.

According to an embodiment of the present invention, the bottom of the electrical support with the buffer structure is suitable for disposing a photosensitive chip, and the buffer structure is located between the photosensitive chip and the bottom.

According to an embodiment of the present invention, the material of the buffer structure in the electrical rack with buffer structure is selected from the group consisting of: one or more of an insulating polymer, a conductive polymer, a metal or a metal oxide.

It will be appreciated by those skilled in the art that the materials of the cushioning structure described above are merely examples, and are not limiting to the invention. In practical application, any material may be used as long as it can play a role of buffering. The shape of the above-described cushion structure is also merely an example, and the present invention is not limited thereto. In practical application, the device can be designed into various shapes.

Another aspect of the present invention provides a camera module, including:

a lens assembly; and

a bracket assembly; the lens component is arranged on the front side of the support component, and the support component comprises the electric support with the buffering structure.

According to an embodiment of the present invention, the bracket assembly of the camera module with the buffering structure includes an electrical component assembly, and the electrical component assembly is mounted on the electrical bracket in a buffering and supporting manner by the buffering structure.

According to an embodiment of the present invention, the electric element in the camera module with the buffer structure is a photosensitive chip, the photosensitive chip and the electric bracket respectively include corresponding circuit pins, and the buffer structure is attached to the circuit pins.

According to an embodiment of the present invention, a height of the buffer structure in the camera module with the buffer structure is smaller than a gap between the photosensitive chip and the electrical support after the circuit pin is pressed.

According to an embodiment of the present invention, in the camera module with the buffering structure, the buffering structure is convexly disposed on the electrical support in a one-step forming manner to form a limiting boss, so as to prevent assembly inclination caused by non-uniform pressing force.

Drawings

Fig. 1 is a sectional view of a camera module having a buffer structure according to the above preferred embodiment of the present invention.

Fig. 2 is a schematic structural view of a buffer structure according to the above preferred embodiment of the present invention.

Fig. 3 is a plan view of the buffering structure according to the above preferred embodiment of the present invention.

Fig. 4A, 4B, 4C and 4D are different layout views of the buffer structure according to the above preferred embodiment of the present invention.

Fig. 5A, 5B and 5C are different shape schematic views of the buffering structure according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

Referring to fig. 1 to 3, there is shown a camera module according to a first preferred embodiment of the present invention. The electric part of the camera module is provided with a buffer structure, so that a circuit element in the camera module can be mounted in a buffer manner when being mounted, and the circuit element can keep better structural stability after being mounted, so that the circuit element in the camera module reduces instability caused by the influence of the external environment, such as the camera module is vibrated, shaken and the like.

The camera module with the buffer structure comprises a lens assembly 10 and a bracket assembly 20, wherein the lens assembly 10 is supportedly mounted on the bracket assembly 20.

In an embodiment of the present invention, the lens assembly 10 includes a lens 11 and a motor 12, the motor 12 is mounted on the front side of the frame assembly 20, and the lens is mounted on the motor 12 such that the lens 11 is located on the front side of the frame assembly 20.

The bracket assembly 20 includes an electrical bracket 21 and an electrical component assembly 22, the electrical component assembly being mounted to the electrical bracket to form an electrical portion of the camera module. That is, the light incident from the lens assembly 10 is projected to the electrical component group 22 provided to the electrical holder 21, thereby converting optical information into electrical information and recording a captured image.

The electric bracket 21 comprises a bracket portion 211 and a bottom portion 212, the bracket portion 211 is connected to the bottom portion 212 and is adapted to supportingly mount the motor 12, and the buffer structure is disposed on the bottom portion 212 so that the components of the electric component set 22 are buffer-mounted on the bottom portion 212.

It should be understood by those skilled in the art that the lens assembly 10 may be a focus lens assembly or a zoom lens assembly, and thus the connecting element of the holder portion 211 is not limited to the motor 12, and may be a lens holder or other components. The type of lens assembly 10 is not a limitation of the present invention.

For example, in an embodiment of the present invention, the electrical bracket 21 is formed by forming a groove on a PCB to form a hollow bracket-shaped structure, the bottom 212 of the electrical bracket 21 forms a bottom of the groove for disposing the electrical component set 22, and the bracket portion 211 of the electrical bracket 21 forms a sidewall of the groove for supporting and connecting the motor 12. Thus, in this embodiment, the bracket portion 211 is integrally connected to the base portion 212. The electric bracket 21 may be formed in one step by means of die forming.

It should be noted that the components in the electrical component group 22 may be circuit components, circuit pins, bonding pads, chips, etc.

In an embodiment of the invention, the buffer structure 100 is convexly disposed on the bottom 212 of the electrical support 21, and the buffer structure 100 is disposed along with the components or some components in the electrical component group 22, so that when other components of the electrical component group 22 are press-fit and mounted on the electrical support 21, the instant pressure applied to the electrical support 21 and the electrical components on the electrical support 21 is buffered.

According to an embodiment of the invention, the electrical bracket can be stepped to carry IRCF or lenses. And passive components such as capacitors and resistors are embedded in the electric bracket. The electric bracket can be provided with a bonding pad and a pin on the step-shaped main body so as to be in circuit interconnection with the chip and the motor.

In an embodiment of the present invention, the buffering structure 100 is disposed at a blank position of the bottom 212 of the electrical rack 21, that is, the buffering structure 100 is disposed at a periphery of the bottom 212 or a vacant position where no electrical component is mounted.

In another embodiment of the present invention, the buffer structure 100 is disposed at a peripheral position of each element or a part of the elements in the electrical element group 22. That is, the position of the buffer structure 100 is set according to the position of each element of the electrical element group 22. So that the momentary pressure to which the respective electrical element 22 is subjected is damped.

Referring to fig. 1 and 2, according to an embodiment of the present invention, the electrical component group 22 includes a photosensitive chip 221, and the photosensitive chip is mounted on the bottom 212 of the electrical support 21. The lens 11 of the lens assembly 10 is located above the photosensitive chip 221. The light passing through the lens 11 reaches the photosensitive chip 221, so that a photosensitive reaction is performed, optical information is converted into electrical information, and shot image information is recorded.

The photosensitive chip 221 has circuit pins 222, and the bottom 212 of the electrical support 21 is provided with corresponding circuit pins 222, so that the photosensitive chip 221 and the electrical elements arranged on the bottom 212 of the electrical support 21 are electrically connected.

It is worth mentioning that the photosensitive chips 221 are bonded together by external force pressing under a heating or ultrasonic environment when being mounted, and because the photosensitive chips 22 and the electrical support 21 have different surface flatness due to structural limitations of the photosensitive chips 22 and the electrical support 21, in the prior art, the circuit pins 222 are easily damaged due to uneven stress between the photosensitive chips 22 and the electrical support 21. According to this embodiment of the present invention, the supporting structure is disposed around the circuit pins 222 disposed on the bottom 212 of the electrical support 21, so that the pressure of the circuit pins 222 during the pressing process is buffered and the stress tends to be uniform. Protruding buffer structure 100 design will improve the whole upper limit that bears pressure and impact force of electric support, reduces the operation degree of difficulty of pressfitting technology, improves the reliability of the module of making a video recording.

Further, referring to fig. 3, in an embodiment of the invention, the buffer structure 100 is disposed around each of the circuit pins 222 or a portion of the circuit pins 222. In this embodiment, the height of the buffer structure 100 is less than the height of the leads. In particular, in one embodiment, the buffer structure 100 is configured according to the shape of the circuit pin 222. For example, when the circuit pin 222 is square, the buffer structure 100 is square around the circuit pin 222. And the area of the top view of the buffer structure 100 is larger than the area of the circuit pin 222, so that the additional pressure can be rapidly reduced when the compressive deformation of the circuit pin 222 exceeds the design value, and the circuit pin 222 is not damaged.

According to an embodiment of the invention, the buffer structure 100 includes at least one buffer unit 110, and the buffer unit 110 is disposed around each of the circuit pins 222 or a portion of the circuit pins 222. In an embodiment of the invention, the distribution of the buffer units 110 is set according to the distribution of the circuit pins 222.

Referring to fig. 4A to 4D, different layouts of the buffer structure are shown. The layout of the buffer structure may be set as desired without being limited to being set around the circuit pin 222 or being set in accordance with the shape of the circuit pin 222.

Referring to fig. 4A, the buffer unit 110 of the buffer structure 100 is a square cloth, that is, the buffer unit 110 is disposed at the bottom 212 of the electrical support 21 and corresponds to four corners of the photosensitive chip 22, so as to buffer and support the photosensitive chip 22 at the four corners of the photosensitive chip 22.

Referring to fig. 4B, the buffer units 110 of the buffer structure 100 are arranged in a grid at the bottom 212 of the electrical support 21 and between the photosensitive chip 22 and the bottom 212, so that the stress on the photosensitive chip 22 and the electrical support 21 is uniformly buffered as a whole during the lamination process.

Referring to fig. 4C, the buffer units 110 of the buffer structure 100 are disposed in a lattice layout between the electrical support 21 and the bottom 212, and between the prime photosensitive chip 22 and the bottom 212.

Referring to fig. 4D, the buffer units 110 of the buffer structure 100 are annularly arranged and disposed at a position between the bottom 212 of the electrical support 21, the photosensitive chip 22 and the bottom 212. In particular, when the buffer units 110 are communicated with each other, an annular, continuous buffer structure 100 is formed.

It should be noted that, according to the embodiment of the present invention, the buffer units 110 of the buffer structure 100 may be arranged in different layouts according to needs, and the shapes of the buffer units 110 may also be arranged according to needs. In the above embodiment of the present invention, the buffer unit 110 is a hollow square cylinder, but in other embodiments of the present invention, it is a different shape.

Referring to fig. 5A to 5C, there are schematic diagrams of different shapes of the buffer units 110 of the buffer structure 100 according to the above preferred embodiment of the present invention.

Referring to fig. 5A, when the buffer unit 100 is disposed according to the circuit pin 222 and the structure of the circuit pin is square, the buffer unit 110 is shaped as a corresponding hollow square cylinder.

Referring to fig. 5B, the buffer unit 110 is in a gradually changing arc structure, so that the buffer between the photosensitive chip 22 and the electrical component 21 gradually changes according to the shape, and the structure mechanics principle is better satisfied.

Referring to fig. 5C, the buffer unit 110 has a stepped shape, so that the buffer between the photosensitive chip 22 and the electrical contact 21 is gradually changed according to the shape, and is easier to manufacture compared to an arc structure.

In the above-mentioned fig. 5A, 5B, and 5C, the attached object of the buffer unit 110 is a square, and therefore, the hollow structure is a square, and it should be understood by those skilled in the art that the attached object of the buffer unit 110 is not a limitation of the present invention, and the buffer unit 110 may be attached to different objects selectively, or may not be attached to and independently disposed, and therefore, the buffer unit may be a hollow structure with different shapes, or may be a solid structure, or is not hollow.

It should be noted that the material of the buffer structure 100 may be selected from the following combinations: one or more of an insulating polymer, a conductive polymer, a metal or a metal oxide.

It is worth mentioning that, in the manufacturing process, the buffer structure 100 may be formed by one-step molding, and the bottom 212 of the electrical support 21 is protruded to form an integrated protruded buffer structure, so as to buffer the huge pressing force applied to each electrical element and the electrical support 21, especially the huge pressing force applied to the connected circuit pins.

The height of the buffer structure 100 is slightly lower than the designed gap after pressing, and a deformation space is reserved for the circuit pin 222 according to pressure requirements, so that the circuit pin 222 is fully pressed.

The stand assembly 20 further includes a color filter 23 supportably mounted to the stand portion 211 of the electrical stand 21. Further, in one embodiment, the bracket portion 211 forms a mesa-shaped support structure to supportively couple the color filter 23. When an image is acquired, light reflected by an object enters the lens 11, reaches the color filter 23 after the optical action of the lens 11, further reaches the photosensitive chip 221 positioned at the bottom 212 of the electric bracket 21 through the color filtering action of the color filter, and the photosensitive chip 221 carries out photosensitive reaction to convert an optical signal into an electric signal, so that the whole image acquisition process is completed.

The buffering structure not only enables the pressing force between the electric support 21 and the electric element of the support assembly 20 during assembly to be buffered, and shares the local pressure on the electric element, so that the electric support and the electric element are not easy to be damaged, the yield of products is improved, but also the upper limit of the whole bearing pressure and impact force of the assembly 20 between the electric is improved, the operation difficulty of the pressing process is reduced, the reliability of the camera module is improved, and the influence of the change of the external environment, such as vibration, on the stability of the electric element in the camera module is reduced.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. An electrical support having a buffer structure for being disposed with an electrical component set, wherein the electrical component set includes a photosensitive chip and at least one circuit pin disposed on the photosensitive chip, comprising:

a support part; and

a bottom portion; the support part is integrally connected with the bottom part so that the support part is suitable for supporting and mounting the element, the bottom part is provided with a buffer structure which protrudes out of the bottom part so as to be buffered and pressed and mounted, the bottom part is provided with at least one circuit pin, the buffer structure is arranged by depending on at least one part of the circuit pin, and when the electric element group is arranged on the bottom part in a manner that the circuit pin of the electric element group corresponds to the circuit pin of the bottom part, the buffer structure enables the pressing force applied to the circuit pin in the pressing process to be buffered.

2. The electrical rack with buffering structure of claim 1, wherein the buffering structure comprises a plurality of buffering units, the buffering units are disposed on the bottom in a square layout.

3. The electrical rack with buffering structure of claim 1, wherein the buffering structure comprises a plurality of buffering units, and the buffering units are disposed on the bottom in a grid-like layout.

4. The electrical rack with buffer structure of claim 1, wherein the buffer structure comprises a plurality of buffer units, and the buffer units are arranged at the bottom in a radial arrangement.

5. The electrical rack having a buffering structure as set forth in claim 1, wherein the buffering structure comprises at least one buffering unit, the buffering unit being annularly arranged at the bottom.

6. The electric bracket with a buffering structure according to any one of claims 2 to 5, wherein the buffering unit is in a block structure.

7. The electric bracket with a buffering structure according to any one of claims 2 to 5, wherein the buffering unit has an arc-shaped structure.

8. The electric bracket with a buffering structure according to any one of claims 2 to 5, wherein the buffering unit has a stepped structure.

9. The electrical rack with buffer structure as claimed in any one of claims 2 to 5, wherein the buffer unit is a hollow structure, and the hollow position is suitable for disposing the circuit pin of the bottom.

10. The electrical rack with buffer structure as claimed in any one of claims 2 to 5, wherein the cross-sectional area of the buffer unit is larger than the cross-sectional area of the circuit pin of the bottom.

11. The electrical bracket with a buffer structure of claim 10, wherein the circuit pins are replaced with pads.

12. The electrical stand with buffer structure as claimed in any one of claims 2 to 5, wherein the stand portion is a boss type support structure adapted to supportively mount a color filter.

13. The electrical rack with buffer structure of any of claims 1 to 5, wherein the material of the buffer structure is selected from the group consisting of: one or more of an insulating polymer, a conductive polymer, a metal or a metal oxide.

14. A camera module, comprising:

a lens assembly; and

a frame assembly, wherein the frame assembly comprises an electrical frame and an electrical component assembly, wherein the electrical frame comprises a bottom and a frame portion integrally connected to the bottom, the bottom is provided with a buffer structure protruding from the bottom so as to be mounted in a buffered press fit, the bottom is provided with at least one circuit pin, the buffer structure is attached to at least a portion of the circuit pin, wherein the electrical component assembly comprises a photosensitive chip and at least one circuit pin disposed on the photosensitive chip, wherein when the electrical component assembly is disposed on the bottom in a manner that the circuit pin of the electrical component assembly corresponds to the circuit pin of the bottom, the buffer structure buffers a pressing force to which the circuit pin is subjected during the pressing process, and wherein the lens assembly is mounted on a front side of the frame assembly, so as to allow the light rays incident through the lens assembly to be projected to the photosensitive chip.

15. The camera module according to claim 14, wherein the height of the buffer structure is smaller than the gap between the photo-sensing chip and the electrical frame after the circuit pins are bonded.

16. The camera module of claim 14, wherein the buffer structure is convexly disposed on the electrical bracket by one-step molding to form a limiting boss, so as to prevent assembly inclination caused by non-uniform pressing force.

17. The camera module of claim 14, wherein the buffer structure comprises a plurality of buffer cells disposed in a square arrangement at the bottom; or the buffer structure comprises a plurality of buffer units which are arranged on the bottom in a grid-shaped layout manner; or the buffer structure comprises a plurality of buffer units which are arranged at the bottom in a radial layout manner; or wherein the buffer structure comprises at least one buffer unit, which is arranged in a ring-like arrangement at the bottom.

18. The camera module of claim 17, wherein the buffer unit is a block structure; or the buffer unit is of an arc structure; or the buffer unit is in a step-shaped structure; or the buffer unit is of a hollow structure, and the hollow position is suitable for arranging the circuit pins at the bottom.

19. The camera module of claim 14, wherein the material of the buffer structure is selected from the group consisting of: one or more of an insulating polymer, a conductive polymer, a metal or a metal oxide.