CN104079803B - Wiring board and camera module - Google Patents
Wiring board and camera module Download PDFInfo
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- CN104079803B CN104079803B CN201310102644.7A CN201310102644A CN104079803B CN 104079803 B CN104079803 B CN 104079803B CN 201310102644 A CN201310102644 A CN 201310102644A CN 104079803 B CN104079803 B CN 104079803B
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- wiring board
- support portion
- plane
- sensitive chip
- pedestal
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Abstract
The present invention provides a kind of wiring board and camera modules, wherein wiring board includes: substrate and at least three support portion positioned at upper surface of base plate, support portion determines a plane, and the upper surface of all support portions is respectively positioned in the plane, to support to carry device in the circuit board.Wiring board and camera module provided by the present invention, at least three support portion is set on the substrate of assist side, support portion determines a plane, the upper surface of all support portions is respectively positioned on same plane, sensitive chip and camera lens with pedestal are mounted on support portion, the two plane mounted is determined by limited several support portions, the flatness of the plane is higher, so the raising of the depth of parallelism on lens plane and sensitive chip surface than in the prior art, therefore the light on sensitive chip surface is reached more evenly by camera lens, it is embodied in image quality as without dark angle, power is parsed to improve, achieve the purpose that improve high-pixel camera mould group image quality effect.
Description
Technical field
The present invention relates to wiring board technology fields, more specifically to a kind of wiring board and camera module.
Background technique
Camera module be widely used in mobile phone, computer, the vehicle-mounted camera of automobile industry, security industry monitoring camera
Equal fields.
Conventional camera module is made of the part such as camera lens, pedestal, sensitive chip, wiring board, and camera lens is carried by pedestal
In the circuit board, while sensitive chip also carries in the circuit board.
High pixel is the important development direction of camera module, and still, the image quality effect of the camera module of current high pixel is simultaneously
It is undesirable.
Summary of the invention
The present invention provides a kind of wiring board and camera module, to improve the image quality effect of high-pixel camera mould group.
To achieve the above object, the embodiment of the invention provides following technical solutions:
A kind of wiring board, the wiring board include: substrate and at least three support portion positioned at upper surface of base plate, the branch
Support part determines a plane, and the upper surface of all support portions is respectively positioned in the plane, to support to be mounted in the route
Device on plate.
Preferably, the number of the support portion is 3, and the center of the line of the support portion triangle that is in and institute
The center for stating substrate is overlapped.
Preferably, the height of the support portion is identical, and plane determined by the support portion is parallel to the substrate
Upper surface.
Preferably, the height of the support portion is less than or equal to 10 μm.
Preferably, the support portion is cuboid or cylindrical body.
Preferably, the height of the support portion is different, and the upper table of plane determined by the support portion and the substrate
The angle that face is in is greater than 0 degree, less than 90 degree.
The present invention also provides a kind of camera modules, comprising: camera lens, pedestal, sensitive chip and wiring board, the wiring board
For above-described wiring board, the camera lens is mounted on the wiring board by the pedestal, and the sensitive chip is mounted in
On the wiring board, the surface of the pedestal towards the wiring board side is frame shape surface, and the sensitive chip is located at the frame
Shape interior surface, the upper surface of the support portion of the wiring board are contacted with frame shape surface, the upper surface of the support portion with
The surface of the sensitive chip towards the wiring board side contacts.
Compared with prior art, technical solution provided by the present invention has at least the following advantages:
At least three support portion, support are arranged on the substrate of assist side for wiring board and camera module provided by the present invention
Portion determines a plane, and the upper surface of all support portions is respectively positioned on same plane, and sensitive chip and the camera lens with pedestal are taken
It is loaded on support portion, the two plane mounted determines that the flatness of the plane is higher by limited several support portions, so mirror
The raising of the depth of parallelism on head plane and sensitive chip surface than in the prior art, therefore sensitive chip surface is reached by camera lens
Light more evenly, is embodied in image quality to parse power and improving, reached and improved high-pixel camera mould group image quality effect without dark angle
Purpose.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the top view of the wiring board provided by the embodiment of the present invention two with 3 support portions；
Fig. 2 is the basic block diagram of camera module provided by the embodiment of the present invention three；
Fig. 3 is the positional relationship of the pedestal of camera module provided by the embodiment of the present invention three, sensitive chip and wiring board
Figure.
Specific embodiment
As described in background, the image quality effect of conventional high-pixel camera mould group is undesirable, inventor the study found that
The main reason for generating this phenomenon is that the pixel of the camera module of high pixel is smaller more more dense than common camera module,
The light that each pixel receives tails off, and in the prior art by the light uniformity on camera lens arrival sensitive chip surface compared with
Difference, becoming apparent from for the more common camera module of difference of this light for resulting in each pixel to be received, shows image quality effect
Upper to be exactly, some region of picture is obvious dark (having dark angle), and the parsing power of picture is not high, poor so as to cause image quality effect.
As the above analysis, it is to influence high-pixel camera mould group image quality effect that sensitive chip surface light uniformity is poor
Principal element, inventor has found again, and the camera lens of camera module is carried in the circuit board by pedestal, and sensitive chip is also mounted in
On wiring board, the two is the different zones carried respectively in the circuit board.Limited due to technology, wiring board itself can not be kept away
Exempt from there are deformation, surfaces just to rise and fall everywhere the problems such as inconsistent, i.e. the surface of wiring board be not one absolutely it is smooth
Plane, the plane on wiring board where different regions are not fully overlapped or parallel, so being mounted in its surface different zones
On camera lens and the surface of sensitive chip and not parallel, it is also just uneven to reach the light on sensitive chip through camera lens.It can
See, the flatness of wiring board is not high, and to result in sensitive chip glazed thread uniformity poor, and then makes the picture of high-pixel camera mould group
Matter effect is bad.For example, supplier manages ability at +/- 30 μm or so to the flatness of wiring board in the industry at present, but 8,000,000
Above camera module requires the deformation quantity of wiring board less than 20 μm, and existing wiring board cannot make high-pixel camera mould group at all
Reach ideal image quality effect.
Based on this, the present invention provides a kind of wiring boards, comprising: substrate and at least three positioned at upper surface of base plate support
Portion, the support portion determines a plane, and the upper surface of all support portions is respectively positioned in the plane, to support to be mounted in
Device on the wiring board.
The present invention also provides a kind of camera modules, comprising: camera lens, pedestal, sensitive chip and wiring board, wherein wiring board
For above-described wiring board, the camera lens is mounted on the wiring board by the pedestal, and the sensitive chip is mounted in
On the wiring board, the surface of the pedestal towards the wiring board side is frame shape surface, and the sensitive chip is located at the frame
Shape interior surface, the upper surface of the support portion of the wiring board are contacted with frame shape surface, the upper surface of the support portion with
The surface of the sensitive chip towards the wiring board side contacts.
At least three support portion, support are arranged on the substrate of assist side for wiring board and camera module provided by the present invention
Portion determines a plane, and the upper surface of all support portions is respectively positioned on same plane, and sensitive chip and the camera lens with pedestal are taken
It is loaded on support portion, the two plane mounted determines that the flatness of the plane is higher by limited several support portions, so mirror
The raising of the depth of parallelism on head plane and sensitive chip surface than in the prior art, therefore sensitive chip surface is reached by camera lens
Light more evenly, is embodied in image quality to parse power and improving, reached and improved high-pixel camera mould group image quality effect without dark angle
Purpose.
It is core of the invention thought above, to keep the above objects, features and advantages of the present invention more obvious easily
Understand, specific embodiments of the present invention will be described in detail with reference to the accompanying drawing.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
Secondly, combination schematic diagram of the present invention is described in detail, when describing the embodiments of the present invention, for purposes of illustration only, table
The sectional view of showing device structure can disobey general proportion and make partial enlargement, and the schematic diagram is example, is not answered herein
Limit the scope of protection of the invention.In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
Embodiment one
A kind of wiring board is present embodiments provided, which includes: substrate and at least three branch positioned at upper surface of base plate
Support part, the support portion determines a plane, and the upper surface of all support portions is respectively positioned in the plane, to support to carry
Device on the wiring board.
In the present embodiment, the device carried in the circuit board is needed only to contact with the upper surface of support portion, it is viscous by glue
It is attached on support portion, i.e., the carrying that device realizes device is supported by support portion and pasted to wiring board provided by the present embodiment.
Device plane mounted is determined by support portion in the present embodiment, and the practical plane only includes several support portions
Upper surface, flatness is that the upper surface of support portion is determined, and device is to carry table in the circuit board in the prior art
Face, which is the plane of an entire physical presence, and flatness is determined by an entire plane, for coplanar flat
The control of degree, certainly the real area of plane is smaller, and the uneven region of appearance is fewer, and flatness can reach higher
Standard has the flatness for the plane for carrying device function higher that is, on the wiring board of the present embodiment.
The present embodiment does not limit the number of support portion, as long as whole support portions can determine a plane,
This just needs the upper surface of all support portions to be a flat surface, and in the same plane.
It should be noted that " upper surface of base plate " refers to substrate towards the one side of device mounted；" the upper table of support portion
Face " refers to the one side that support portion is in contact with device mounted.
Embodiment two
Since the number of support portion is more, the flatness of plane determined by support portion is more difficult to control in higher standard, and
And device needs stable carrying in the circuit board, needs support portion The more the better, so being based on embodiment one, the present embodiment is mentioned
A kind of wiring board is supplied, the number of support portion is 3.
Specifically, as shown in Figure 1,101 upper surface of substrate is provided with the upper surface of 3 support portions, 102,3 support portions 102
It is plane, and in the same plane, when device needs to carry on the circuit board, device and 3 support portions 102
Upper surface is directly touched, and is pasted on 102 upper surface of support portion by glue, and device is not contact with substrate 101.The present embodiment
The flatness (i.e. the flatness of plane determined by support portion) of provided wiring board can reach within +/- 20 μm, completely
It can satisfy the demand of the camera module of 8 mega pixels or more.
It is more firm on support portion 102 in order to be mounted in device, a plane, above-mentioned 3 supports are determined according to 3 points
Portion 102 is preferably located at the edge on three different sides of wiring board；More preferably, the line of support portion 102 can be made
The center for the triangle for being in is overlapped with the center of substrate 101, when such device is mounted on support portion 102, center and base
The center of plate 101 is overlapped, and the power on substrate 101 distributes very evenly, and device is more firm.
The height of support portion 102 can be identical, and identified plane can be parallel to the upper surface of substrate 101；Support portion
102 height can have certain angle with difference, identified plane with the upper surface of substrate 101, which is greater than 0
Degree, less than 90 degree.
Also, the height of support portion 102 is higher than the height of other parts on wiring board, to ensure that device is only mounted in branch
It in plane determined by support part 102, is not contacted with the part on wiring board in addition to support portion 102, however, to ensure that device
The stability and fastness carried with wiring board, the height of support portion 102 again cannot be too high above the height of other parts on wiring board
Degree, therefore, the height of support portion 102 need to be designed with the above for foundation, it is preferred that the height of support portion 102 is small
In or equal to 10 μm.
In addition, the present embodiment does not limit the shape of support portion 102, shape can preferably be designed to cuboid or cylinder
Body etc., the present embodiment are preferably cuboid.
Embodiment three
A kind of camera module is present embodiments provided, which applies wiring board provided by above-described embodiment,
As shown in Fig. 2, the camera module specifically includes: camera lens 201, pedestal 202, sensitive chip 203 and wiring board 204, the route
Plate 204 is the wiring board disclosed in above-described embodiment, and the camera lens 201 is mounted in the wiring board by the pedestal 202
On 204, the sensitive chip 203 is mounted on the wiring board 204.
In addition to above structure, the camera module further include: the protective film 205 being attached on the camera lens 201, for protecting
Camera lens is not contaminated, scratches etc.；The VCM(Voice Coil Motor for matching and connecting with the camera lens 201, voice coil motor)
206, it can be realized the automatic focusing function of camera module, support that camera lens 201 is flexible, realize that smooth and continuous camera lens 201 moves
It is dynamic；Insulation PET(polyethylene terephthalate positioned at the periphery VCM206) 207；Between VCM206 and pedestal 202
IR(Infra-Red, infrared) optical filter, for adjusting the color reducibility of entire mould group；Driving IC positioned at 202 lower section of pedestal
(Integrated Circuit, integrated circuit)；It is covered on the conductive double-sided adhesive 210 of 204 lower surface of wiring board；It is set to route
Connector 211 on plate 204.
Wherein, camera lens 201 is connect with VCM206, and is passed through pedestal 202 and carried on the support portion of assist side 204, photosensitive
Chip 203 also carries on the support portion of assist side 204, pedestal 202, sensitive chip 203, the position between 204 three of wiring board
Set relationship as shown in figure 3, the pedestal 202 towards 204 side of wiring board surface be frame shape surface 302, it is described photosensitive
Chip 203 is located inside the frame shape surface 302, the upper surface and frame shape surface of the support portion 301 of the wiring board 204
302 contacts, the upper surface of the support portion 301 and the surface of the sensitive chip 203 towards 204 side of wiring board connect
Touching, the contact area of the two are bar-shaped zone 303.
Above-mentioned camera lens 201 carries in plane determined by the support portion 301 of assist side 204 with sensitive chip 203, this is flat
The flatness of the flatness in the face entire plane of wiring board one than in the prior art is high, frame shape surface 302 and the equal position of bar-shaped zone 303
In the plane determined by support portion 301, therefore, contact surface and sensitive chip 203 and the support portion of pedestal 202 and support portion
The depth of parallelism of contact surface is high, and the depth of parallelism on camera lens 201 and 204 surface of sensitive chip is high, ensure that reached across camera lens 201 it is photosensitive
The light uniformity on 204 surface of chip is preferable, and for the camera module of high pixel, the light of each pixel is more equal
Even, difference is little, and image quality is improved without dark angle, analytic ability, and image quality effect is improved compared with the prior art.
Although the present invention has been disclosed in the preferred embodiments as above, however, it is not intended to limit the invention.It is any to be familiar with ability
The technical staff in domain, without departing from the scope of the technical proposal of the invention, all using in the methods and techniques of the disclosure above
Appearance makes many possible changes and modifications or equivalent example modified to equivalent change to technical solution of the present invention.Therefore,
Anything that does not depart from the technical scheme of the invention are made to the above embodiment any simple according to the technical essence of the invention
Modification, equivalent variations and modification, all of which are still within the scope of protection of the technical scheme of the invention.
Claims (5)
1. a kind of wiring board, which is characterized in that the wiring board includes: substrate and supports positioned at least three of upper surface of base plate
Portion, the support portion determines a plane, and the upper surface of all support portions is respectively positioned in the plane, to support to be mounted in
Device on the wiring board, wherein the device being mounted on the wiring board includes sensitive chip and the camera lens with pedestal,
The sensitive chip and the camera lens with pedestal are only contacted with the upper surface of the support portion, are not contacted with the substrate；
Wherein, the height of the support portion is identical, and plane determined by the support portion is parallel to the upper surface of the substrate；
Alternatively, the height of the support portion is different, and the folder that the upper surface of plane determined by the support portion and the substrate is in
Angle is greater than 0 degree, less than 90 degree.
2. wiring board according to claim 1, which is characterized in that the number of the support portion is 3, and the support portion
The center of the line triangle that is in be overlapped with the center of the substrate.
3. wiring board according to claim 2, which is characterized in that the height of the support portion is less than or equal to 10 μm.
4. wiring board according to claim 2, which is characterized in that the support portion is cuboid or cylindrical body.
5. a kind of camera module characterized by comprising camera lens, pedestal, sensitive chip and wiring board, the wiring board are power
Benefit requires 1~4 described in any item wiring boards, and the camera lens is mounted on the wiring board by the pedestal, described photosensitive
For chip carrying on the wiring board, the surface of the pedestal towards the wiring board side is frame shape surface, the photosensitive core
Piece is located at the frame shape interior surface, and the upper surface of the support portion of the wiring board is contacted with frame shape surface, the support portion
Upper surface contacted with the surface of the sensitive chip towards the wiring board side, and the sensitive chip and the pedestal
It is not contacted with the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310102644.7A CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310102644.7A CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104079803A CN104079803A (en) | 2014-10-01 |
| CN104079803B true CN104079803B (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310102644.7A Active CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016180378A2 (en) * | 2015-05-14 | 2016-11-17 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| CN104954654A (en) * | 2015-07-03 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Double-camera module and camera shooting device |
| CN105472216B (en) * | 2015-12-01 | 2020-01-10 | 宁波舜宇光电信息有限公司 | Electric support and camera module with buffer structure |
| CN105472215A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Camera module group with electrical support, and assembly method and application of camera module group |
| CN105451017A (en) * | 2015-12-29 | 2016-03-30 | 努比亚技术有限公司 | Camera module photosensitive quality detection method and device |
| CN105812632A (en) * | 2016-03-25 | 2016-07-27 | 信利光电股份有限公司 | Circuit board and camera module thereof |
| CN108766895B (en) * | 2018-06-19 | 2020-06-30 | 昆山丘钛微电子科技有限公司 | Camera module glue filling method, camera module and camera module process |
| CN108943564B (en) * | 2018-06-19 | 2021-01-12 | 昆山丘钛微电子科技有限公司 | Injection molding method and camera module |
| CN109916279B (en) * | 2019-03-04 | 2020-09-22 | Oppo广东移动通信有限公司 | Flatness detection method and device for terminal cover plate, test machine table and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303444A (en) * | 2007-05-11 | 2008-11-12 | 鸿富锦精密工业（深圳）有限公司 | Camera module group and assembling method thereof |
| CN101431609A (en) * | 2007-11-09 | 2009-05-13 | 鸿富锦精密工业（深圳）有限公司 | Imaging module group |
| CN201311932Y (en) * | 2008-10-31 | 2009-09-16 | 昆山钜亮光电科技有限公司 | High temperature resistant integrated molding videography group |
| CN102377951A (en) * | 2010-08-27 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and camera module |
| CN202281891U (en) * | 2011-08-26 | 2012-06-20 | 宁波舜宇光电信息有限公司 | Camera module with lens stand located on chip surface |
| CN102590970A (en) * | 2011-01-11 | 2012-07-18 | 鸿富锦精密工业（深圳）有限公司 | Support plate and camera module using same |
-
2013
- 2013-03-27 CN CN201310102644.7A patent/CN104079803B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303444A (en) * | 2007-05-11 | 2008-11-12 | 鸿富锦精密工业（深圳）有限公司 | Camera module group and assembling method thereof |
| CN101431609A (en) * | 2007-11-09 | 2009-05-13 | 鸿富锦精密工业（深圳）有限公司 | Imaging module group |
| CN201311932Y (en) * | 2008-10-31 | 2009-09-16 | 昆山钜亮光电科技有限公司 | High temperature resistant integrated molding videography group |
| CN102377951A (en) * | 2010-08-27 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and camera module |
| CN102590970A (en) * | 2011-01-11 | 2012-07-18 | 鸿富锦精密工业（深圳）有限公司 | Support plate and camera module using same |
| CN202281891U (en) * | 2011-08-26 | 2012-06-20 | 宁波舜宇光电信息有限公司 | Camera module with lens stand located on chip surface |
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| Publication number | Publication date |
|---|---|
| CN104079803A (en) | 2014-10-01 |
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