CN202281891U - Camera module with lens stand located on chip surface - Google Patents

Abstract

The utility model relates to a camera module with a lens stand located on a chip surface, comprising a lens, a motor, a base, a chip, a gold thread, a circuit board and peripheral devices. The base is directly adhered to an upper surface of the chip through a boss formed in a core space center section, in such a way that dust can be effectively prevented from penetrating into the surface of an inductor to minimize stain and defective pixel; the chip surface is selected for locating, which can increase locating precision, guarantee flatness, minimize inclination and bad image blurring and raise a production yield rate.

Description

Microscope base is positioned the shooting module of chip surface

Technical field

The utility model relates to a kind of cell-phone camera module of novel microscope base attaching method based on the inductor surface alignment.

Background technology

Along with the fast development of mobile phone industry, the high-end type such as mobile phone, 3G mobile, giant-screen touch-screen mobile phone that possesses high pixel camera function will enjoy favor.Cell phone manufacturer increases the requirement of camera gradually, and to high pixel development, current pixel has reached 8,000,000,1,200 ten thousand even higher gradually.

Existing design proposal generally is to be positioned on the wiring board through base when carrying out microscope base attaching assembling, like this flatness of wiring board is had relatively high expectations.The problem that is easy to generate has: beveled and picture paste, shading etc. were bad when factors such as wiring board is prone to produce after Reflow Soldering and is out of shape, the wiring board upper surface covers out-of-flatness because of printing ink caused the module assembling.Simultaneously, photosensitive area and peripheral devices are in same inner chamber, and dirty easy entering photosensitive area such as scaling powder causes stain bad with bad point.Add many factors such as processing procedure capabilities limits of supplier, to stain, bad point, shading, as all more difficult to govern control of problems such as paste, this is challenge greatly beyond doubt concerning mobile phone module manufacturer.

In order to improve the production yield of high-pixel mobile phone camera, guarantee product with stable quality property, improve bad point, control assembling inclinations etc. are bad, and it is particularly important to research and develop a kind of new design proposal.

The utility model content

In view of the above problems; The shooting module that the utility model provides a kind of microscope base to be positioned chip surface; Be used for overcoming base in the prior art high-pixel mobile phone module assembling process attach shading that the existing attaching of link tilts to cause, as bad defectives such as pastes, improve bad defectives such as the bad point that produces in the processing procedure, stain.

The technical scheme of the utility model is following:

A kind of microscope base is positioned the shooting module of chip surface, comprises camera lens, motor, base, chip, gold thread, wiring board and peripheral devices, and said base directly is attached at chip upper surface through the boss that its lumen centers place forms.Make between photosensitive region and other the peripheral electron device of chip separatedly simultaneously, prevent that dust from getting into photosensitive area by boss.

Said boss wall thickness is 0.25mm-0.35mm, and the shape of said boss and chip profile and photosensitive area scope thereof match.

Said base is suspended on the wiring board, in order to reserve glue thickness gap.

On said chip, draw glue, and need with a certain distance from photosensitive region, monolateral made allowance is not less than 0.2mm, overflows to the chip photosensitive region in order to avoid microscope base attaches back glue.

Said base attaches, and through the base attaching device boss profile is carried out identification positioning.

Base directly is attached at chip upper surface through boss, can prevents effectively that dust from getting into the Sensor surface, reduce stain, bad point is bad; Select the chip surface location for use, increase its bearing accuracy, guarantee flatness, reduce inclination and bad, improve and produce yield as sticking with paste.

Description of drawings

Through the description of its exemplary embodiment being carried out below in conjunction with accompanying drawing, the above-mentioned feature and advantage of the utility model will become apparent and understand easily.

Fig. 1 is that microscope base that the utility model relates to is positioned the explosive view among the shooting module embodiment of chip surface;

Fig. 2 is that microscope base of the prior art attaches technological sectional view;

Fig. 3 is that the microscope base among the embodiment attaches technological sectional view;

Fig. 4 is the mirror-seat structure figure among the embodiment;

Fig. 5 is the process flow diagram of the cell-phone camera module assembly method that relates to of the utility model.

Embodiment

Below in conjunction with accompanying drawing the utility model is described in further detail.

As shown in Figure 1, can find out that from explosive view the cell-phone camera module that microscope base is positioned chip surface comprises camera lens 1, motor 2, base 3, chip 4, gold thread 5 and peripheral devices 6, chip 4 is positioned on the wiring board.

Fig. 2 is that microscope base of the prior art attaches technological sectional view, can find out that microscope base 3 is attached on the chip 4.

Fig. 3 is that the microscope base among the embodiment attaches technological sectional view; Fig. 4 is the mirror-seat structure figure among the embodiment; Can from Fig. 4, find out; There is the square boss 7 of a wall thickness 0.3mm at the lumen centers place of said base 3, and the shape of said boss 7 and chip 4 profiles and photosensitive area scope thereof etc. match, and promptly the length size of square boss 7 need combine concrete chip 4 physical dimension, photosensitive area size and draw glue thickness and design definite.

Said base 3 directly is attached at chip 4 upper surfaces through boss 7, reaches the location purpose, and base 3 is suspended on the wiring board, reserves glue thickness gap 8 and gets final product.

The flatness and the physical dimension precision of that face that attaches with chip 4 on the square boss 7 of said base 3 need the strict control of mould.

Fig. 5 is the process flow diagram of the cell-phone camera module assembly method that relates to of the utility model, comprises the following steps:

(1) camera lens 1, motor 2 assemblings;

(2) carry out in the circuit board that the SMT components and parts mount, chip 4 binds;

(3) microscope base 3 is attached at chip 4 through boss 7 and toasts, cuts;

(4) camera lens 1, motor 2 are installed on the microscope base 3, are combined into camera and debug.

Before said base 3 attaches, need around chip 4 upper surfaces and wiring board, to draw earlier glue.

Draw glue on the said chip 4, need, overflow to chip 4 photosensitive regions monolateral made allowance 0.25mm in order to avoid microscope base attaches back glue with a certain distance from photosensitive region.

Drawing glue around the said wiring board, mainly is the power of evading that strengthens base 3, reaches sealing effectiveness simultaneously, in order to avoid external environment corrosion gold thread.

When said base 3 attaches, boss 7 profiles are carried out identification positioning through the base attaching device, rather than base profile identification positioning, higher precision guaranteed.

After said base 3 attaches, excessive glue can not be arranged, break the situation generation that gold thread etc. influence yield.

From the characteristics of mathematics angle analysis the utility model, in the prior art, the requirement of the high pixel module of mobile phone inclination eccentricity control is following below:

Generally speaking, chip diagonal line flatness is greater than 0.025mm the time, and it is bad to influence that monolateral picture is stuck with paste, CS is inconsistent etc., is equal to tilt eccentric, therefore can calculate " φ " value according to formula.

Φ=Arctg (0.025mm/ chip imaging area catercorner length)

According to general chip specification, eccentric general angle φ＜25 that tilt '

Inclination control criterion 25 ' change into distance, promptly chip center and optical center deviation 25 ', be converted into the difference in height of chip face and motor sub-assembly:

With the 8.5*8.5 profile is example: Tg (25/60)=L/8.5

L＝62um

Promptly theoretical at present permission is tilted should be less than 62um.

But and management and control maximal value: the 75um at present that tilts

D/A tilt quantity: 25um

H/A tilt quantity: 25um

The relative motor tilt quantity of camera lens: 25um

Greater than theory demand value: 62um

Obviously, the new technique scheme directly through chip 4 upper surfaces location, needn't be considered the D/A tilt quantity; Promptly accumulating the inclination tolerance is 50um; 62um is little than the theory demand value, has promptly controlled high pixel module inclination eccentricity issues, thus reach control well dark angle, as bad generation such as sticking with paste, CS is inconsistent; Simultaneously that chip 4 photosensitive regions are separated separately; The particle (granules such as dust and chip) that the electron device of chip 4 peripheries, glue etc. cause can not enter into photosensitive region and cause bad point, and base 3 can not interfered with electron device simultaneously, can not cause problems such as module assembling, baking base openings yet.

Though described the principle and the embodiment of the utility model above to the cell-phone camera module; But under the above-mentioned instruction of the utility model; Those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description, and these improve or distortion all drops in the protection domain of the utility model.It will be understood by those skilled in the art that top specific descriptions just in order to explain the purpose of the utility model, and be not to be used to limit the utility model that the protection domain of the utility model is limited claim and equivalent thereof.

Claims (5)

1. a microscope base is positioned the shooting module of chip surface, comprises camera lens, motor, base, chip, gold thread, wiring board and peripheral devices, it is characterized in that, said base directly is attached at chip upper surface through the boss that its lumen centers place forms.

2. shooting module according to claim 1 is characterized in that, the wall thickness of said boss is 0.25mm-0.35mm.

3. shooting module according to claim 1 is characterized in that, the shape of said boss and chip profile and photosensitive area scope thereof match.

4. shooting module according to claim 1 is characterized in that said base is suspended on the wiring board, in order to reserve glue thickness gap.

5. shooting module according to claim 1 is characterized in that, the monolateral made allowance that the photosensitive region on the said chip is drawn glue is not less than 0.2mm.

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