CN104079803A - Circuit board and camera module - Google Patents
Circuit board and camera module Download PDFInfo
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- CN104079803A CN104079803A CN201310102644.7A CN201310102644A CN104079803A CN 104079803 A CN104079803 A CN 104079803A CN 201310102644 A CN201310102644 A CN 201310102644A CN 104079803 A CN104079803 A CN 104079803A
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- wiring board
- support portion
- plane
- sensitive chip
- camera module
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Abstract
The invention provides a circuit board and a camera module. The circuit board comprises a substrate and at least three supporting parts positioned on the upper surface of the substrate, wherein the supporting parts determine a plane, and the upper surfaces of all supporting parts are positioned on the plane to support a device carried on the circuit board. According to the circuit board and the camera module provided by the invention, at least three supporting parts are arranged on the substrate of the circuit board, the supporting parts determine a plane, the upper surfaces of all supporting parts are positioned on the same plane, a light-sensitive chip and a lens with a base are carried on the supporting parts, a plane carrying the light-sensitive chip and the lens is determined by certain limited supporting parts, and the flatness of the plane is high, so that the parallelism between a lens plane and the surface of the light-sensitive chip is increased in comparison to the prior art. Thus, light rays reaching the surface of the light-sensitive chip through the lens are more uniform, dark corners are prevented on the aspect of image quality, the resolution is increased, and the aim of enhancing the image quality effect of a high-resolution camera module is fulfilled.
Description
Technical field
The present invention relates to wiring board technical field, more particularly, relate to a kind of wiring board and camera module.
Background technology
Camera module is widely used in the vehicle-mounted camera of mobile phone, computer, automobile industry, the first-class field of monitoring camera of security protection industry.
Conventional camera module is made up of parts such as camera lens, pedestal, sensitive chip, wiring boards, and camera lens carries in the circuit board by pedestal, and sensitive chip also carries in the circuit board simultaneously.
High pixel is the important development direction of camera module, and still, the image quality effect of the camera module of current high pixel is unsatisfactory.
Summary of the invention
The invention provides a kind of wiring board and camera module, to improve the image quality effect of high-pixel camera module.
For achieving the above object, the embodiment of the present invention provides following technical scheme:
A kind of wiring board, described wiring board comprises: substrate and be positioned at least 3 support portions of upper surface of base plate, a plane is determined in described support portion, and the upper surface of all described support portions is all positioned in this plane, to support to be mounted in the device on described wiring board.
Preferably, the number of described support portion is 3, and the leg-of-mutton center that is of the line of described support portion and the center superposition of described substrate.
Preferably, the height of described support portion is identical, and the determined plane parallel in described support portion is in the upper surface of described substrate.
Preferably, the height of described support portion is less than or equal to 10 μ m.
Preferably, described support portion is cuboid or cylinder.
Preferably, the height difference of described support portion, and the angle that the upper surface of the determined plane in described support portion and described substrate is is greater than 0 degree, is less than 90 degree.
The present invention also provides a kind of camera module, comprise: camera lens, pedestal, sensitive chip and wiring board, described wiring board is above-described wiring board, described camera lens is mounted on described wiring board by described pedestal, described sensitive chip is mounted on described wiring board, described pedestal is shaped as frame surface towards the surface of described wiring board one side, described sensitive chip is positioned at this shaped as frame interior surface, the upper surface of the support portion of described wiring board and described shaped as frame Surface Contact, the upper surface of described support portion and described sensitive chip are towards the Surface Contact of described wiring board one side.
Compared with prior art, technical scheme provided by the present invention at least has the following advantages:
Wiring board provided by the present invention and camera module, at least 3 support portions are set on the substrate of wiring board, a plane is determined in support portion, the upper surface of all support portions is all in the same plane, sensitive chip and being mounted on support portion with the camera lens of pedestal, the two plane of carrying is determined by limited several support portions, the evenness of this plane is higher, so lens plane with the depth of parallelism on sensitive chip surface than raising of the prior art, therefore arrive the light on sensitive chip surface by camera lens more even, be embodied in image quality is the dark angle of nothing, parsing power improves, reach the object that improves high-pixel camera module image quality effect.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The vertical view of the wiring board with 3 support portions that Fig. 1 provides for the embodiment of the present invention two;
The basic block diagram of the camera module that Fig. 2 provides for the embodiment of the present invention three;
The location diagram of pedestal, sensitive chip and the wiring board of the camera module that Fig. 3 provides for the embodiment of the present invention three.
Embodiment
As described in background, the image quality effect of conventional high-pixel camera module is undesirable, inventor studies discovery, the main cause that produces this phenomenon is, the pixel of the camera module of high pixel is less more intensive than common camera module, the light that each pixel is accepted tails off, and it is poor in prior art, to arrive the light uniformity on sensitive chip surface by camera lens, this just causes the more common camera module of difference more obvious of the light that each pixel accepts, show in image quality effect and be exactly, certain region of picture obviously dark (having dark angle), the parsing power of picture is not high, thereby cause image quality effect poor.
As the above analysis, sensitive chip surface light uniformity is poor is the principal element that affects high-pixel camera module image quality effect, inventor finds again, the camera lens of camera module carries in the circuit board by pedestal, sensitive chip also carries in the circuit board, and the two is to carry respectively zones of different in the circuit board.Limited due to technology, the problems such as it is inconsistent that the inevitable existence of wiring board itself is out of shape, surface just rises and falls everywhere, the surface that is wiring board is not an absolute smooth plane, the plane at different places, region not exclusively coincidence or parallel on wiring board, so be mounted in the surface of camera lens in its surperficial zones of different and sensitive chip not parallel, seeing through camera lens, to arrive light on sensitive chip also just inhomogeneous.Visible, the not high sensitive chip glazed thread uniformity that caused of the evenness of wiring board is poor, and then makes the image quality effect of high-pixel camera module bad.For example, at present in the industry supplier to the evenness management and control ability of wiring board in +/-30 μ m left and right, but more than 800 ten thousand camera modules requires the deformation quantity of wiring board to be less than 20 μ m, and existing wiring board can not make the desirable image quality effect of reaching of high-pixel camera module at all.
Based on this, the invention provides a kind of wiring board, comprising: substrate and at least 3 support portions that are positioned at upper surface of base plate, a plane is determined in described support portion, and the upper surface of all described support portions is all positioned in this plane, to support to be mounted in the device on described wiring board.
The present invention also provides a kind of camera module, comprise: camera lens, pedestal, sensitive chip and wiring board, wherein wiring board is above-described wiring board, described camera lens is mounted on described wiring board by described pedestal, described sensitive chip is mounted on described wiring board, described pedestal is shaped as frame surface towards the surface of described wiring board one side, described sensitive chip is positioned at this shaped as frame interior surface, the upper surface of the support portion of described wiring board and described shaped as frame Surface Contact, the upper surface of described support portion and described sensitive chip are towards the Surface Contact of described wiring board one side.
Wiring board provided by the present invention and camera module, at least 3 support portions are set on the substrate of wiring board, a plane is determined in support portion, the upper surface of all support portions is all in the same plane, sensitive chip and being mounted on support portion with the camera lens of pedestal, the two plane of carrying is determined by limited several support portions, the evenness of this plane is higher, so lens plane with the depth of parallelism on sensitive chip surface than raising of the prior art, therefore arrive the light on sensitive chip surface by camera lens more even, be embodied in image quality is the dark angle of nothing, parsing power improves, reach the object that improves high-pixel camera module image quality effect.
Be more than core concept of the present invention, for above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention be described in detail.
A lot of details are set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization without prejudice to intension of the present invention in the situation that, and therefore the present invention is not subject to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, in the time that the embodiment of the present invention is described in detail in detail; for ease of explanation; the profile of indication device structure can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.In addition in actual fabrication, should comprise, the three-dimensional space of length, width and the degree of depth.
Embodiment mono-
The present embodiment provides a kind of wiring board, this wiring board comprises: substrate and at least 3 support portions that are positioned at upper surface of base plate, a plane is determined in described support portion, and the upper surface of all described support portions is all positioned in this plane, to support to be mounted in the device on described wiring board.
In the present embodiment, need to carry device in the circuit board and only contact with the upper surface of support portion, stick on support portion by glue, the lift-launch of device is supported and pasted device and realize to the wiring board that the present embodiment provides by support portion.
The plane that in the present embodiment, device carries is determined by support portion, this plane reality only comprises the upper surface of several support portions, its evenness is that the upper surface of support portion determines, and device is mounted in wiring board upper surface in prior art, this plane is a whole in esse plane, its evenness is to be determined by a whole plane, for the control of planar smoothness, the real area of plane that yes is less, the uneven region occurring is fewer, evenness can reach higher standard, be that on the wiring board of the present embodiment, to have the evenness of the plane of carrying device function higher.
The present embodiment does not limit the number of support portion, as long as whole support portions can determine a plane, the upper surface that these just need to all support portions is a plane, and all at grade.
It should be noted that, " upper surface of base plate " refers to the one side of substrate towards carried device; " upper surface of support portion " refers to the one side that support portion contacts with carried device.
Embodiment bis-
Because the number of support portion is more, the more difficult higher standard that is controlled at of evenness of the determined plane in support portion, and device needs stable lift-launch in the circuit board, need support portion The more the better, so based on embodiment mono-, the present embodiment provides a kind of wiring board, and the number of its support portion is 3.
Concrete, as shown in Figure 1, substrate 101 upper surfaces are provided with 3 support portions 102, the upper surface of 3 support portions 102 is plane, and in the same plane, in the time that device need to be mounted on this wiring board, the upper surface of device and 3 support portions 102 directly touches, be pasted on support portion 102 upper surfaces by glue, and device does not contact with substrate 101.The evenness (being the evenness of the determined plane in support portion) of the wiring board that the present embodiment provides can reach in +/-20 μ m, can meet the demand of camera modules more than 8 mega pixels completely.
More firm for device is mounted on support portion 102, according to 3 definite planes, above-mentioned 3 support portions 102 preferably lay respectively at the edge on three different limits of wiring board; More preferred, can make leg-of-mutton center that the line of support portion 102 is and the center superposition of substrate 101, when device is mounted on support portion 102 like this, the center superposition of its center and substrate 101, power on substrate 101 distributes very evenly, and device is more firm.
The height of support portion 102 can be identical, and determined plane can be parallel to the upper surface of substrate 101; The height of support portion 102 can also be different, and determined plane can have certain angle with the upper surface of substrate 101, and this angle is greater than 0 degree, is less than 90 degree.
And, the height of support portion 102 will be higher than the height of other parts on wiring board, to guarantee that device is only mounted in the determined plane in support portion 102, do not contact with the part except support portion 102 on wiring board, but for the stability and the fastness that ensure that device and wiring board carry, the height of support portion 102 again can not be too higher than the height of other parts on wiring board, therefore, the height of support portion 102 need to design taking the above as foundation, preferably, the height of support portion 102 is less than or equal to 10 μ m.
In addition, the present embodiment does not limit the shape of support portion 102, and its shape preferably can be designed to cuboid or cylinder etc., and the present embodiment is preferably cuboid.
Embodiment tri-
The present embodiment provides a kind of camera module, this camera module has been applied the wiring board that above-described embodiment provides, as shown in Figure 2, this camera module specifically comprises: camera lens 201, pedestal 202, sensitive chip 203 and wiring board 204, described wiring board 204 is disclosed wiring board in above-described embodiment, described camera lens 201 is mounted on described wiring board 204 by described pedestal 202, and described sensitive chip 203 is mounted on described wiring board 204.
Except said structure, this camera module also comprises: be attached to the diaphragm 205 on described camera lens 201,, scuffing not contaminated for the protection of camera lens etc.; The VCM(Voice Coil Motor that mates and be connected with described camera lens 201, voice coil motor) 206, can realize the automatic focusing function of camera module, support that camera lens 201 is flexible, realize level and smooth and continuous camera lens 201 and move; Be positioned at the insulation PET(PETG of VCM206 periphery) 207; IR(Infra-Red between VCM206 and pedestal 202, infrared) filter, for adjusting the color reducibility of whole module; Be positioned at the drive IC (Integrated Circuit, integrated circuit) of pedestal 202 belows; Be covered on the conduction double-sided adhesive 210 of wiring board 204 lower surfaces; Be arranged at the connector 211 on wiring board 204.
Wherein, camera lens 201 is connected with VCM206, and be mounted in by pedestal 202 on the support portion of wiring board 204, sensitive chip 203 is also mounted on the support portion of wiring board 204, pedestal 202, sensitive chip 203, position relationship between wiring board 204 threes as shown in Figure 3, described pedestal 202 is shaped as frame surface 302 towards the surface of described wiring board 204 1 sides, described sensitive chip 203 is positioned at this 302 inside, shaped as frame surface, the upper surface of the support portion 301 of described wiring board 204 contacts with described shaped as frame surface 302, the upper surface of described support portion 301 and described sensitive chip 203 are towards the Surface Contact of described wiring board 204 1 sides, the contact area of the two is bar-shaped zone 303.
Above-mentioned camera lens 201 is mounted in the determined plane in support portion 301 of wiring board 204 with sensitive chip 203, the evenness of this plane is higher than the evenness of the one whole plane of wiring board in prior art, shaped as frame surface 302 is all positioned in the determined plane in support portion 301 with bar-shaped zone 303, therefore, pedestal 202 is high with the depth of parallelism of the contact-making surface of support portion with contact-making surface and the sensitive chip 203 of support portion, camera lens 201 is high with the depth of parallelism on sensitive chip 204 surfaces, the light uniformity that has ensured to arrive through camera lens 201 sensitive chip 204 surfaces is better, thereby for the camera module of high pixel, the light of each pixel is more even, difference is little, image quality is without dark angle, analytic ability improves, image quality effect improves compared with prior art.
Although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention.Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (7)
1. a wiring board, it is characterized in that, described wiring board comprises: substrate and at least 3 support portions that are positioned at upper surface of base plate, and a plane is determined in described support portion, and the upper surface of all described support portions is all positioned in this plane, to support to be mounted in the device on described wiring board.
2. wiring board according to claim 1, is characterized in that, the number of described support portion is 3, and the leg-of-mutton center that is of the line of described support portion and the center superposition of described substrate.
3. wiring board according to claim 2, is characterized in that, the height of described support portion is identical, and the determined plane parallel in described support portion is in the upper surface of described substrate.
4. wiring board according to claim 3, is characterized in that, the height of described support portion is less than or equal to 10 μ m.
5. wiring board according to claim 2, is characterized in that, described support portion is cuboid or cylinder.
6. wiring board according to claim 2, is characterized in that, the height difference of described support portion, and the angle that the upper surface of the determined plane in described support portion and described substrate is is greater than 0 degree, is less than 90 degree.
7. a camera module, it is characterized in that, comprise: camera lens, pedestal, sensitive chip and wiring board, described wiring board is the wiring board described in claim 1～4 any one, described camera lens is mounted on described wiring board by described pedestal, described sensitive chip is mounted on described wiring board, described pedestal is shaped as frame surface towards the surface of described wiring board one side, described sensitive chip is positioned at this shaped as frame interior surface, the upper surface of the support portion of described wiring board and described shaped as frame Surface Contact, the upper surface of described support portion and described sensitive chip are towards the Surface Contact of described wiring board one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310102644.7A CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310102644.7A CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
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| Publication Number | Publication Date |
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| CN104079803A true CN104079803A (en) | 2014-10-01 |
| CN104079803B CN104079803B (en) | 2019-03-01 |
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| CN201310102644.7A Active CN104079803B (en) | 2013-03-27 | 2013-03-27 | Wiring board and camera module |
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Cited By (9)
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| CN104954654A (en) * | 2015-07-03 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Double-camera module and camera shooting device |
| CN105451017A (en) * | 2015-12-29 | 2016-03-30 | 努比亚技术有限公司 | Camera module photosensitive quality detection method and device |
| CN105472216A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Electrical support with buffering structure, and camera module group |
| CN105472215A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Camera module group with electrical support, and assembly method and application of camera module group |
| CN105812632A (en) * | 2016-03-25 | 2016-07-27 | 信利光电股份有限公司 | Circuit board and camera module thereof |
| WO2016180378A3 (en) * | 2015-05-14 | 2016-12-29 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| CN108766895A (en) * | 2018-06-19 | 2018-11-06 | 昆山丘钛微电子科技有限公司 | A kind of camera module pad gluing method, camera module and technique |
| CN108943564A (en) * | 2018-06-19 | 2018-12-07 | 昆山丘钛微电子科技有限公司 | A kind of injection moulding process and camera module |
| CN109916279A (en) * | 2019-03-04 | 2019-06-21 | Oppo广东移动通信有限公司 | Measurement method of planeness, device, tester table and the storage medium of terminal cover board |
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| CN109916279A (en) * | 2019-03-04 | 2019-06-21 | Oppo广东移动通信有限公司 | Measurement method of planeness, device, tester table and the storage medium of terminal cover board |
| CN109916279B (en) * | 2019-03-04 | 2020-09-22 | Oppo广东移动通信有限公司 | Flatness detection method and device for terminal cover plate, test machine table and storage medium |
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| CN104079803B (en) | 2019-03-01 |
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