CN105812632A - Circuit board and camera module thereof - Google Patents
Circuit board and camera module thereof Download PDFInfo
- Publication number
- CN105812632A CN105812632A CN201610177322.2A CN201610177322A CN105812632A CN 105812632 A CN105812632 A CN 105812632A CN 201610177322 A CN201610177322 A CN 201610177322A CN 105812632 A CN105812632 A CN 105812632A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- camera module
- protecting film
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention provides a circuit board, comprising a substrate, a graphic conductive layer on the substrate, and a protective film located on the conductive layer and covering the substrate, wherein the protective film is a shading protective film, and the shading protective film is used for blocking light from passing through the circuit board. According to the circuit board and a camera module thereof, the protective film is a shading protective film which can block light from passing through the circuit board, thereby reducing the light transmittance of the circuit board, avoiding light leak of the camera module and improving the imaging quality of the camera module.
Description
Technical field
The application relates to optical camera technical field, particularly to a kind of wiring board and camera module thereof.
Background technology
Along with the development of science and technology, picture pick-up device is more and more applied in the middle of work and the daily life of people, brings huge facility to the work of people and daily life.
In recent years, along with smart mobile phone develops, cell-phone camera function obtains unprecedented development especially.At present, the optical lens of smart mobile phone has reached 13,000,000 pixels so that the pickup quality of smart mobile phone promotes further, and photographic effect is also become better and better.
But, the wiring board light transmittance of existing camera module is high, and when there being light to irradiate, light readily penetrates through wiring board and enters inside camera module, causes camera module light leak, affects the image quality of camera module.
Summary of the invention
For solving above-mentioned technical problem, the present invention provides a kind of wiring board and camera module thereof, and the light transmittance of this wiring board is low such that it is able to avoid camera module light leak, improves the image quality of camera module.
Technical scheme is as follows:
A kind of wiring board, including: substrate, it is positioned at the patterned conductive layer on substrate；And, it being positioned on described conductive layer, cover the protecting film of described substrate, described protecting film is shading protecting film, and described shading protecting film is used for stopping that light passes through described wiring board.
Preferably, the light transmittance of described shading protecting film is less than or equal to 40%.
Preferably, between described conductive layer and described shading protecting film, also including, adhesive linkage, the light transmittance of described adhesive linkage is less than or equal to 40%.
Preferably, also including, be positioned at the hole, location on described wiring board, described location is provided with the first light shield layer in hole.
Preferably, the material of described first light shield layer is copper or ink.
Preferably, also including, be positioned at the solder mask on described shading protecting film, described solder mask is black.
Preferably, also including, be positioned at the second light shield layer on described wiring board, described second light shield layer covers the top layer of described wiring board side.
Preferably, the light transmittance of described second light shield layer is less than or equal to 10%.
A kind of camera module, including: base, lens barrel, above-mentioned wiring board and the sensitive chip being positioned on described wiring board；
Wherein, described lens barrel and described wiring board are connected with described base respectively.
Preferably, described wiring board and described base junction are provided with photomask.
Compared with prior art, the invention have the benefit that
Wiring board in the present invention and camera module thereof, be shading protecting film by arranging described protecting film, such that it is able to stop that light is by described wiring board, reduces the light transmittance of described wiring board, it is to avoid camera module light leak, improves the image quality of camera module.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present application, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the circuit board structure schematic diagram of the present invention；
Fig. 2 is the circuit board structure schematic diagram of the embodiment of the present invention one.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described embodiment is only some embodiments of the present application, rather than whole embodiments.Based on the embodiment in the application, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of the application protection.
As stated in the Background Art, existing camera module image quality not high.Inventor finds through research, and this is owing to wiring board light transmittance is high, and when there being light to irradiate, light readily penetrates through wiring board and enters inside camera module, causes camera module light leak, thus affecting the image quality of camera module.
Based on this, the invention provides a kind of wiring board and camera module thereof, as it is shown in figure 1, include:
Substrate 11, is positioned at the patterned conductive layer 12 on substrate；And, it is positioned on described conductive layer, covers the protecting film 13 of described substrate, wherein, described protecting film 13 is shading protecting film, and described shading protecting film is used for stopping that light passes through described wiring board.
Concrete, in this application, described shading protecting film has very low light transmittance, such that it is able to stopping that light passes through, it is to avoid light therethrough wiring board enters inside camera module, causes camera module light leak, thus improving the image quality of camera module
Wiring board in the present invention and camera module thereof, be shading protecting film by arranging described protecting film, such that it is able to stop that light is by described wiring board, reduces the light transmittance of described wiring board, it is to avoid camera module light leak, improves the image quality of camera module.
It is above the central idea of the present invention, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that, described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Embodiment one
The present embodiment provides a kind of wiring board, particularly a kind of wiring board for camera module, refer to the structural representation of the present embodiment wiring board shown in Fig. 2, including:
Substrate 21, is positioned at the patterned conductive layer 22 on substrate；And, it is positioned on described conductive layer, covers the protecting film 23 of described substrate, wherein, described protecting film 23 is shading protecting film, and described shading protecting film is used for stopping that light passes through described wiring board.
Generally, the wiring board as camera module mostly is double-decker or four-layer structure, and the present embodiment provides a kind of double-deck wiring board; as in figure 2 it is shown, include substrate 21, it is positioned at the patterned conductive layer 22 of substrate both sides; and, cover the protecting film 23 of described substrate both sides.
Wherein, the material of substrate 21 can be polyimides or mylar, and in the present embodiment, substrate 21 is PI (polyimides) substrate.Conductive layer can be the conductive layer of the materials such as copper, silver, aluminum, and in the present embodiment, described conductive layer is layers of copper.
Concrete, in the present embodiment, the light transmittance of described shading protecting film 23 is less than or equal to 40%.In other embodiments of the application, described light transmittance is also less than 20%, preferred, it is also possible to selecting light transmittance is 10% even lower shading protecting film.For making shaded effect better, it is possible to selecting the shading protecting film that the material that color is dark makes, such as black, navy blue, darkviolet etc., at the present embodiment, described shading protecting film is black.
The material of described shading protecting film can be polyimides, and in the present embodiment, described shading protecting film is black polyamide (PI) film.
Concrete, in the present embodiment, between described conductive layer and described shading protecting film, also including adhesive linkage, the light transmittance of described adhesive linkage is less than or equal to 40%.In other embodiments of the application, described light transmittance can also be 20%, preferred, it is also possible to selecting light transmittance is 10% even lower adhesive linkage.For making shaded effect better, it is possible to selecting color is the adhesive linkage of dark material, and such as black, navy blue, darkviolet etc., at the present embodiment, described adhesive linkage is black.
Concrete, in the present embodiment, described wiring board also includes the hole, location being positioned on described wiring board, and described location is provided with the first light shield layer in hole.Wherein, the material of described first light shield layer can be copper or ink, or other can light screening material, such as dirty oil etc..By arranging light shield layer in hole, location, it is possible to avoid the leakage problem being likely to occur further, thus promoting the image quality of camera module.
In the present embodiment, described shading protecting film being additionally provided with solder mask 24, better for the shaded effect making described wiring board, the described solder mask 24 in the present embodiment is black.
In the present embodiment, described wiring board also includes the second light shield layer being positioned on described wiring board, and described second light shield layer covers the top layer of described wiring board side.Concrete, the end face that side is described wiring board of described wiring board electrical connection sensitive chip, the side of described end face is bottom surface dorsad, and described second light shield layer is positioned at the bottom surface of described wiring board, it is to avoid affect the electric connection structure of described wiring board end face.
Further, the light transmittance of described second light shield layer is less than or equal to 10%.Preferably, it is possible to less than 5%.Described second light shield layer can be black, such that it is able to better stop light.
In other embodiments of the application, described second light shield layer can also be steel disc, and described steel disc covers the bottom surface of wiring board, and has the size matched with camera module base.Described steel disc both can play the supporting role to wiring board, it is also possible to plays the effect of auxiliary shading.
Wiring board in the present embodiment, is shading protecting film by arranging described protecting film, such that it is able to stop that light is by described wiring board, reduces the light transmittance of described wiring board, it is to avoid camera module light leak, improves the image quality of camera module.
Embodiment two
Present embodiments providing a kind of camera module, described camera module includes: wiring board described in base, lens barrel, above-described embodiment and the sensitive chip being positioned on described wiring board；Wherein, described lens barrel and described wiring board are connected with described base respectively.
In the present embodiment, for increasing shaded effect further, it is to avoid camera module light leak, the wiring board of described camera module and described base junction are provided with photomask, and in the present embodiment, described photomask is black.
Concrete, described wiring board and described base junction can blacking glue to form one layer of black glued membrane, thus obtaining better shaded effect.
It addition, for avoiding camera module that light leakage phenomena occurs, affect image quality, it is possible to select, when assembling camera module to electronic equipment, camera module to be contained in the position can irradiated away from light as far as possible.
Camera module in the present embodiment, is shading protecting film by arranging described protecting film, such that it is able to stop that light is by described wiring board, reduces the light transmittance of described wiring board, it is to avoid camera module light leak, improves the image quality of camera module.
It should be noted that each embodiment in this specification all adopts the mode gone forward one by one to describe, what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar part mutually referring to.For device class embodiment, due to itself and embodiment of the method basic simlarity, so what describe is fairly simple, relevant part illustrates referring to the part of embodiment of the method.
Finally, it can further be stated that, in this article, the relational terms of such as first and second or the like is used merely to separate an entity or operation with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " includes ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include the process of a series of key element, method, article or equipment not only include those key elements, but also include other key elements being not expressly set out, or also include the key element intrinsic for this process, method, article or equipment.When there is no more restriction, statement " including ... " key element limited, it is not excluded that there is also other identical element in including the process of described key element, method, article or equipment.
Principle and the embodiment of the application are set forth by specific case used herein, and the explanation of above example is only intended to help and understands the present processes and core concept thereof；Simultaneously for one of ordinary skill in the art, according to the thought of the application, all will change in specific embodiments and applications, in sum, this specification content should not be construed as the restriction to the application.
Claims (10)
1. a wiring board, including: substrate, it is positioned at the patterned conductive layer on substrate；And, it is positioned on described conductive layer, covers the protecting film of described substrate, it is characterised in that:
Described protecting film is shading protecting film, and described shading protecting film is used for stopping that light passes through described wiring board.
2. wiring board according to claim 1, it is characterised in that the light transmittance of described shading protecting film is less than or equal to 40%.
3. wiring board according to claim 1, it is characterised in that between described conductive layer and described shading protecting film, also including, adhesive linkage, the light transmittance of described adhesive linkage is less than or equal to 40%.
4. wiring board according to claim 1, it is characterised in that also include, is positioned at the hole, location on described wiring board, and described location is provided with the first light shield layer in hole.
5. wiring board according to claim 5, it is characterised in that the material of described first light shield layer is copper or ink.
6. wiring board according to claim 1, it is characterised in that also include, is positioned at the solder mask on described shading protecting film, and described solder mask is black.
7. wiring board according to claim 1, it is characterised in that also include, is positioned at the second light shield layer on described wiring board, and described second light shield layer covers the top layer of described wiring board side.
8. wiring board according to claim 7, it is characterised in that the light transmittance of described second light shield layer is less than or equal to 10%.
9. a camera module, it is characterised in that including: wiring board described in base, lens barrel, claim 1 and the sensitive chip being positioned on described wiring board；
Wherein, described lens barrel and described wiring board are connected with described base respectively.
10. camera module according to claim 9, it is characterised in that described wiring board and described base junction are provided with photomask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177322.2A CN105812632A (en) | 2016-03-25 | 2016-03-25 | Circuit board and camera module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177322.2A CN105812632A (en) | 2016-03-25 | 2016-03-25 | Circuit board and camera module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105812632A true CN105812632A (en) | 2016-07-27 |
Family
ID=56453896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610177322.2A Pending CN105812632A (en) | 2016-03-25 | 2016-03-25 | Circuit board and camera module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105812632A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862245A (en) * | 2019-02-21 | 2019-06-07 | 信利光电股份有限公司 | A kind of camera module of anti-PCB light leakage |
| CN114501777A (en) * | 2021-12-24 | 2022-05-13 | 江西合力泰科技有限公司 | Prevent FPC structure and camera module of light leak |
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| US20100033647A1 (en) * | 2008-08-08 | 2010-02-11 | Sharp Kabushiki Kaisha | Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device |
| CN102902137A (en) * | 2012-10-31 | 2013-01-30 | 信利光电(汕尾)有限公司 | Camera module and base thereof |
| CN103997596A (en) * | 2014-06-10 | 2014-08-20 | 信利光电股份有限公司 | Camera module |
| CN104079803A (en) * | 2013-03-27 | 2014-10-01 | 信利光电股份有限公司 | Circuit board and camera module |
| CN204948506U (en) * | 2015-09-30 | 2016-01-06 | 信利光电股份有限公司 | A kind of camera module and mobile terminal |
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2016
- 2016-03-25 CN CN201610177322.2A patent/CN105812632A/en active Pending
Patent Citations (5)
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|---|---|---|---|---|
| US20100033647A1 (en) * | 2008-08-08 | 2010-02-11 | Sharp Kabushiki Kaisha | Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device |
| CN102902137A (en) * | 2012-10-31 | 2013-01-30 | 信利光电(汕尾)有限公司 | Camera module and base thereof |
| CN104079803A (en) * | 2013-03-27 | 2014-10-01 | 信利光电股份有限公司 | Circuit board and camera module |
| CN103997596A (en) * | 2014-06-10 | 2014-08-20 | 信利光电股份有限公司 | Camera module |
| CN204948506U (en) * | 2015-09-30 | 2016-01-06 | 信利光电股份有限公司 | A kind of camera module and mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862245A (en) * | 2019-02-21 | 2019-06-07 | 信利光电股份有限公司 | A kind of camera module of anti-PCB light leakage |
| CN114501777A (en) * | 2021-12-24 | 2022-05-13 | 江西合力泰科技有限公司 | Prevent FPC structure and camera module of light leak |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160727 |
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| RJ01 | Rejection of invention patent application after publication |