CN108766895A - A kind of camera module pad gluing method, camera module and technique - Google Patents
A kind of camera module pad gluing method, camera module and technique Download PDFInfo
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- CN108766895A CN108766895A CN201810629335.8A CN201810629335A CN108766895A CN 108766895 A CN108766895 A CN 108766895A CN 201810629335 A CN201810629335 A CN 201810629335A CN 108766895 A CN108766895 A CN 108766895A
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 286
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 238000009434 installation Methods 0.000 claims abstract description 28
- 238000007711 solidification Methods 0.000 claims abstract description 14
- 230000008023 solidification Effects 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003384 imaging method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 241000208340 Araliaceae Species 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lens Barrels (AREA)
Abstract
The present invention discloses a kind of camera module pad gluing method, camera module and technique, the method includes：Determine that target pad glue region, target pad glue region are located on the substrate of camera module and/or on the support element of the camera module；According to target pad glue parameter corresponding with target pad glue region, pad glue is carried out in target pad glue region；Glue medium is padded in solidification, so that the angle between the chip and the camera lens of the camera module of the camera module after installation meets a predetermined angle range.Said program ensures that the chip of camera module is parallel with camera lens by way of padding glue, while ensureing the imaging effect of camera module, has saved the cost of manufacture of camera module.
Description
Technical field
The present invention relates to a kind of camera module encapsulation field more particularly to camera module pad gluing method, camera module and works
Skill.
Background technology
Camera module includes multiple components, such as substrate, chip, support element, motor, camera lens.Generally, in camera shooting mould
In the encapsulation process of group, substrate is located at bottom, and chip is attached on substrate, and support element is located above chip, motor and camera lens position
In on support element, in order to ensure the imaging effect of camera module, need to ensure that chip and the position of camera lens are relatively parallel.But
The case where there are out-of-flatnesses due to substrate, such as there are certain angles of inclination for substrate surface, when chip is attached to substrate surface
When upper, chip with respect to the horizontal plane also will appear inclination, finally result in camera lens and chip injustice in the camera module installed
Row, causes camera module image blur.
In the related technology, ensure the flatness of substrate by promoting the making sheet specification of substrate, but promote specification to cause
The increase of substrate manufacture cost, and then increase the production cost of camera module.
Invention content
In view of the above problems, it is proposed that the present invention overcoming the above problem in order to provide one kind or solves at least partly
State camera module pad gluing method, camera module and the technique of problem.
According to a first aspect of the embodiments of the present invention, a kind of camera module pad gluing method is provided, which is characterized in that the side
Method includes：
Determine target pad glue region, target pad glue region is located on the substrate of camera module and/or the camera shooting mould
On the support element of group；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium so that the camera lens of chip and the camera module of the camera module after installation it
Between angle meet a predetermined angle range.
Optionally, before the determining target pad glue region, the method further includes：
Obtain the chip sticking area parameter on the substrate of the camera module；
The determining target pad glue region, including：
According to the chip sticking area parameter, target pad glue region is determined.
Optionally, described according to the chip sticking area parameter when adjusting the angle of the chip, determine target pad
Glue region, including：
According to the chip sticking area parameter, target pad glue region is determined in chip sticking area, so that institute
When stating the chip sticking area after chip is pasted onto pad glue, the angle between the chip and the camera lens meets described pre-
If angular range.
Optionally, described to be joined according to the chip sticking area when adjusting the angle of support element of the camera module
Number, determines target pad glue region, including：
According to the fixed area ginseng for fixing the support element on the chip sticking area parameter and the substrate
Number determines target pad glue region in fixed area, so that the support element is fixed on the fixed area after pad glue
When, the angle between the chip and the camera lens meets the predetermined angle range.
Optionally, described according to the chip sticking area parameter when adjusting the angle of the camera lens, determine target pad
Glue region, including：
According to the support element for fixing the camera module on the chip sticking area parameter and the substrate
Fixed area parameter determines target pad glue region on the support element for installing in the installation region of the camera lens,
When so that the camera lens being mounted on the installation region after padding glue, described in the angle satisfaction between the chip and the camera lens
Predetermined angle range.
Optionally, after the solidification pad glue medium, the method further includes：
Glue is drawn with default picture glue parameter in predeterminable area, the predeterminable area is located on the substrate of the camera module or institute
It states on the support element of camera module；
Cure picture glue medium, to paste the target component in the camera module.
According to a second aspect of the embodiments of the present invention, a kind of camera module is provided, the camera module includes：Camera lens, branch
Support member, chip, substrate, the pad glue medium after solidification；
The chip attaches on the substrate；
The support element is fixed on the substrate；
The camera lens is mounted on the support element；
Pad glue medium after the solidification is arranged on the substrate and/or on support element so that the chip with it is described
Angle between camera lens meets a predetermined angle range.
According to a third aspect of the embodiments of the present invention, a kind of viscous brilliant technique is provided, the technique includes：
Target pad glue region is determined in the chip sticking area of substrate；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the chip sticking area；
Chip is pasted onto the chip sticking area；
Cure picture glue medium.
According to a fourth aspect of the embodiments of the present invention, a kind of support element barbola work is provided, the technique includes：
Target pad glue region is determined in the support element fixed area of substrate；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the support element fixed area；
The support element of camera module is pasted onto the support element fixed area；
Cure picture glue medium.
According to a fifth aspect of the embodiments of the present invention, a kind of lens assembling technique is provided, the technique includes：
Target pad glue region is determined in the camera lens installation region of support element；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the camera lens installation region；
The camera lens of camera module is pasted onto the camera lens installation region；
Cure picture glue medium.
Said one in the embodiment of the present application or multiple technical solutions at least have following one or more technology effects
Fruit：
In the technical solution of the embodiment of the present invention, on the substrate of the camera module or the support of the camera module
Target pad glue region is determined on part, according to target pad glue parameter corresponding with target pad glue region, in the target pad glue
Region carries out pad glue, and cures pad glue medium.The height in target pad glue region can be adjusted through the above way, such as
The substrate surface of the camera module, which exists, to be tilted, can be by surface in order to ensure that chip does not tilt in paste process
A lower height of region is padded by height by padding glue so that the support holding by pad glue and water when chip is pasted onto on substrate
Plane is parallel, and then ensures that chip is parallel with the camera lens of camera module.As it can be seen that the application ensures to image mould by way of padding glue
The chip of group is parallel with camera lens, it is easy to accomplish, and pad glue cost is relatively low, therefore the scheme in the application is ensureing camera module
While imaging effect, the cost of manufacture of camera module has been saved.
Description of the drawings
By reading the detailed description of hereafter preferred embodiment, various other advantages and benefit are common for this field
Technical staff will become clear.Attached drawing only for the purpose of illustrating preferred embodiments, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings：
Fig. 1 is a kind of flow chart of camera module pad gluing method shown in one exemplary embodiment of the application；
Fig. 2 is the schematic diagram in target pad glue region in the application when adjusting the angle of chip；
Fig. 3 is the schematic diagram in target pad glue region in the application when adjusting the angle of support element；
Fig. 4 is the schematic diagram in target pad glue region in the application when adjusting the angle of camera lens；
Fig. 5 is the picture glue schematic diagram shown in one exemplary embodiment of the application；
Fig. 6 is the pad glue schematic diagram shown in one exemplary embodiment of the application.
Specific implementation mode
The present embodiment discloses a kind of camera module pad gluing method, camera module and technique.Can ensure camera module at
As effect, and solve the cost of manufacture of camera module.The camera module pads gluing method：Determine target pad glue region, it is described
Target pad glue region is located on the substrate of the camera module and/or on the support element of the camera module；According to the mesh
The corresponding target pad glue parameter in mark pad glue region, pad glue is carried out in target pad glue region；Solidification pad glue medium, so that installation
Angle between the chip and the camera lens of the camera module of the camera module afterwards meets a predetermined angle range.
Technical solution of the present invention is described in detail below by attached drawing and specific embodiment, it should be understood that the application
Specific features in embodiment and embodiment are the detailed description to technical scheme, rather than to present techniques
The restriction of scheme, in the absence of conflict, the technical characteristic in the embodiment of the present application and embodiment can be combined with each other.
The terms "and/or", only a kind of incidence relation of description affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate：Individualism A exists simultaneously A and B, these three situations of individualism B.In addition, herein
Middle character "/", it is a kind of relationship of "or" to typically represent forward-backward correlation object.
Embodiment
As shown in Figure 1, padding gluing method for a kind of camera module shown in one exemplary embodiment of the application, this method includes
Following steps：
Step S11：Determine target pad glue region, target pad glue region is located on the substrate of camera module and/or institute
It states on the support element of camera module；
Step S12：According to target pad glue parameter corresponding with target pad glue region, used in target pad glue region
Pad glue medium carries out pad glue；
Step S13：Cure the pad glue medium, so that the chip of the camera module after installation and the camera module
Camera lens between angle meet a predetermined angle range.
In the embodiment of the present application, the angle between the chip of camera module and the camera lens of camera module can refer to：Core
Angle between plane where the lens of piece upper surface and camera lens, wherein the plane where lens is vertical with the lens axis
Plane.
The chip of camera module is parallel with the camera lens of camera module to be may also mean that：The lens of chip upper surface and camera lens institute
It is parallel in plane, wherein the plane where lens is the plane vertical with the lens axis.
In the application, camera module includes but not limited to lower component：Substrate, chip, support element, camera lens.Wherein, substrate
Type can be selected according to actual needs, such as printed circuit board (Printed Circuit Board, PCB).Chip
Can be the sensitive chip of camera module, support element is for being supported the components such as camera lens.In one embodiment, on substrate
It is provided with the fixed area of the sticking area and securing supports for adhering chip, chip and support element can be by viscous
The mode of patch is respectively adhered in above-mentioned sticking area and fixed area, certainly, support element can also by snap fit or
Other manner is mounted in fixed area.
It should be understood that work as substrate out-of-flatness, such as surface exist tilt when, if in the conventional mode to chip into
Row fitting, then chip can be tilted relative to camera lens, lead to the image blur of camera module.In the application, by target
Pad glue region carries out pad glue to adjust the angle between chip and camera lens.
Since camera module includes multiple components, when adjusting the angle between chip and camera lens by padding glue, deposit
In a variety of pad glue modes, target pad glue region can be arranged as required on one or more components, target pad glue region
Quantity may be one or more.
In the present embodiment, target pad glue region can be located on substrate and/or on support element.Specifically, when to chip
Angle when being adjusted, since chip is attached on substrate, can determine target in the sticking area on substrate
Pad glue region.When being adjusted to angle lens, since camera lens is mounted on support element, can be determined on support element
Go out target pad glue region, or target pad glue region is determined in the support element fixed area on substrate, with to support element
Angle is adjusted, and then adjusts the angle of camera lens.It is, of course, also possible to be adjusted simultaneously to the angle of chip and camera lens, i.e.,
It all include target pad glue region on substrate and support element.
After target pad glue region is determined, pad glue is carried out in target pad glue region.It is multiple in target pad glue region
When, for each target pad glue region, there can be a corresponding target pad glue parameter, multiple target pad glue parameters can be with
It is identical, can also be different, the application does not limit.Target pad glue parameter may include injecting glue amount, injecting glue speed, note
Glue time etc..Target pad glue parameter can be default value, can also be the parameter set according to the flatness of substrate.In a reality
It applies in example, target pad glue region is upper surface of base plate region, when target pad glue region is a lower height of region, in order to by mesh
Mark pad glue region is padded, then needs to increase injecting glue amount corresponding with the target pad glue region.
In the embodiment of the present application, pad glue medium can be selected according to actual needs, such as epoxy resin.It is situated between according to pad glue
The difference of matter, solidification process can be realized by modes such as high-temperature baking, ultraviolet light irradiations.Pass through the pad glue medium after solidification
Component angles on pad glue medium are adjusted, to make the chip of camera module and camera lens close to parallel, i.e. chip
Angle between camera lens meets a predetermined angle range, which can be set according to actual needs, the application
It does not limit.
Optionally, before the determining target pad glue region, the method further includes：Obtain the base of the camera module
Chip sticking area parameter on plate；The determining target pad glue region, including：According to the chip sticking area parameter, really
Fixed target pad glue region.
In the embodiment of the present application, chip sticking area parameter is that can reflect the parameter of the site flatness, for example, chip
The distance between sticking area and reference level surface, angle of inclination etc. of the chip sticking area between reference level surface.
In turn, chip sticking area parameter can characterize the angle of inclination between chip and reference level surface after chip is pasted.According to core
Piece sticking area parameter determines the target pad glue region for carrying out pad glue, so as to adjust the angle between chip and camera lens.
Different according to the component of adjustment in the embodiment of the present application, the position in target pad glue region is also different.In the following, to adjust
Integeral part is chip, for support element, camera lens, illustrates the position in target pad glue region respectively.
It is described that target pad glue region is determined according to the chip sticking area parameter when adjusting the angle of the chip,
Including：According to the chip sticking area parameter, target pad glue region is determined in chip sticking area, so that the core
When piece is pasted onto the chip sticking area after padding glue, the angle between the chip and the camera lens meets the preset angle
Spend range.
As shown in Fig. 2, being the schematic diagram in target pad glue region in the application when adjusting the angle of chip.It should be understood that
It is that chip sticking area can be pre-set, which can be region identical with chip form size.In Fig. 2,
There are bumps on chip sticking area, is tilted relative to reference level surface after chip can be caused to paste, in order to ensure chip
Level, pad glue can be carried out using the region being recessed in the region as target pad glue region.
In one embodiment, chip sticking area parameter can be thickness value, in implementation process, to chip paste area
Domain is sampled, and the thickness value of multiple sampling areas is obtained, and the region that thickness value is less than to a threshold value is determined as target pad Jiao Qu
Domain.In another embodiment, target pad glue region can be chosen in the border area of chip sticking area.Such as every pre-
If,, can in adhering chip if the height of border area can reach consistent by padding glue apart from a region is chosen
To ensure that chip is in level.In the specific implementation, height of each point on border area relative to reference level surface is determined, it will
Height is less than the region of a threshold value as target pad glue region.As shown in Fig. 2, pasting core on the chip sticking area after padding glue
Piece can make chip holding horizontal, to realize that chip is horizontal with camera lens holding.
It is described according to the chip sticking area parameter when adjusting the angle of support element of the camera module, it determines
Target pad glue region, including：According on the chip sticking area parameter and the substrate for fixing the support element
Fixed area parameter determines target pad glue region in fixed area, so that the support element is fixed on the institute after pad glue
When stating fixed area, the angle between the chip and the camera lens meets the predetermined angle range.
As shown in figure 3, when to adjust support element angle in the application, the schematic diagram in target pad glue region.It should be understood that
The fixed area that securing supports are used on substrate can be preset, and fixed area can be located at the outer of chip sticking area
Edge, support element can be fixed by stickup or other modes with substrate.As shown in figure 3, there are bumps on chip sticking area, lead
It is tilted relative to reference level surface after causing chip to paste, by fixed area parameter, determines that support element is fixed on fixed area
Relative to the state of reference level surface when domain, and the position in target pad glue region is further determined according to the angle of inclination of chip.
In one embodiment, it if according to fixed area parameter, determines when support element is fixed on fixed area relative to ginseng
It is parallel to examine horizontal plane, in this case, if without padding glue, it is not parallel between support element and chip, and camera lens and support element
It is parallel, then cause chip not parallel with camera lens.In this embodiment it is possible to according to chip sticking area parameter, chip phase is determined
For the angle of inclination of reference level surface, target pad glue region is determined in fixed area further according to the angle of inclination, in target
It is the angle of inclination that pad glue region pad glue, which makes the angle between support element and reference level surface also, i.e. support element is parallel with chip,
And then camera lens is parallel with chip.
It should be understood that other than carrying out pad glue to support element, can be adjusted by the structure to support element, example
Such as, in order to ensure that camera lens is parallel with chip, the support construction of support element can be made asymmetric structure, makes the one of support element
End is higher than the other end, or the surface of support element is made inclined, makes camera lens and chip when camera lens is mounted on support element
Keeping parallelism.
It is described that target pad glue region is determined according to the chip sticking area parameter when adjusting the angle of the camera lens,
Including：According to consolidating for the support element for fixing the camera module on the chip sticking area parameter and the substrate
Determine region parameter, target pad glue region is determined in the installation region on the support element for installing the camera lens, with
When the camera lens being made to be mounted on the installation region after padding glue, the angle between the chip and the camera lens meets described pre-
If angular range.
As shown in figure 4, being the schematic diagram in target pad glue region in the application when adjusting the angle of camera lens.It should be understood that
Be, the installation region on support element for installing camera lens can be it is preset, installation region can on the surface of support element, or
Installation region is determined according to the concrete structure of support element.For example, support element may include supporting table, it is arranged in supporting table useful
In the hollow for accommodating camera lens, installation region can be located at the inner surface of hollow.When chip sticking area and/or support element are solid
May exist when determining region in the presence of bumps, between chip and support element and tilt, cause camera lens not parallel with chip.
As shown in figure 4, according to chip sticking area parameter, determine between chip and reference level surface there are angle of inclination,
According to fixed area parameter, determine whether support element is parallel with reference level surface.Installation region is located at the surface of support element, according to
The angle of inclination of chip and horizontal plane determines target pad glue region in installation region, and in target pad glue region, pad glue makes camera lens
Angle between reference level surface is also the angle of inclination, i.e. camera lens is parallel with chip.
It should be understood that other than upper surface of base plate has concave-convex state, there is likely to be bending, inclinations etc. for substrate
Situation also results in the chip being pasted onto on substrate and tilts, in varied situations, can according to different substrate parameter or
Other parameters determine target pad glue region, as long as ensureing that chip is parallel with camera lens after pad glue.
Optionally, after the solidification pad glue medium, the method further includes：It is drawn with default picture glue parameter in predeterminable area
Glue, the predeterminable area are located on the substrate of the camera module or on the support element of the camera module；Cure picture glue medium,
To paste the target component in the camera module.
In the embodiment of the present application, for different pad glue modes, predeterminable area can be located at different positions.For example,
When padding glue adjustment chip angle on substrate, predeterminable area can be the sticking area on substrate.Glue adjustment support is padded on substrate
When part angle, predeterminable area can be the fixed area on substrate.When padding glue adjustment angle lens on support element, predeterminable area
It can be the installation region on support element.Default picture glue parameter may include default picture glue pattern, preset picture glue amount etc., preset picture
Glue pattern can be that rice font or other patterns, the application do not limit.
Since the gap close to target pad glue region is larger, can be less than in the distance away from target pad glue region default
The colloid for increasing picture glue at the region of distance, to ensure colloid coverage rate.As shown in figure 5, being one exemplary embodiment of the application
The picture glue schematic diagram shown, target pad glue region are 1 and 2 in Fig. 5, and picture glue pattern is rice font, is divided into seven stroke glue, due to
Pad glue is carried out at 1,2, therefore the gap at 1,2 between chip and substrate is larger, it can be by the first stroke, second and third
The glue amount of pen increases, to ensure colloid coverage rate.After drawing glue, colloid is cured to paste target component, in the application,
Target component can be chip, support element or camera lens.
In addition, in order to carry out management and control to padding cementing fruit, management and control standard can be set.I.e. after glue medium is padded in solidification, root
According to default management and control standard, the parameter after pad glue is detected, it can be height to pad the parameter after glue.As shown in fig. 6, being this Shen
Pad glue schematic diagram that please be shown in an exemplary embodiment.In Fig. 6, pad glue is carried out in the chip sticking area of substrate, chip is length
Rectangular, sticking area is rectangular region, and target paste region is 1 region and 2 regions in Fig. 6.Management and control standard is 1 after pad glue
The height in region is more than the height in 4 regions, and the height for padding 2 regions after glue is more than the height in 3 regions, and pads 1 region after glue
The height in 3 regions and 4 regions is all higher than with the height in 2 regions, in addition, the difference in height in 1 region and 3 regions after pad glue, pad glue
The difference in height in 2 regions afterwards and 4 regions is satisfied by a preset range, such as 10~50um.Certainly, management and control standard can also basis
Actual needs is set, and the disclosure does not limit.
Viscous brilliant (Die Bond, DB) technique of one kind that the application also provides, the technique include the following steps：
Target pad glue region is determined in the chip sticking area of substrate；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the chip sticking area；
Chip is pasted onto the chip sticking area；
Cure picture glue medium.
In the process, by adjusting the angle of chip to substrate pad glue, keep chip parallel with the camera lens of camera module.
About above-mentioned technique, wherein the concrete mode of each step pads gluing method in camera module provided by the present application
Embodiment in be described in detail, explanation will be not set forth in detail herein.
A kind of support element that the application also provides pastes (Holder Mount, HM) technique, which includes the following steps：
Target pad glue region is determined in the support element fixed area of substrate；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the support element fixed area；
The support element of camera module is pasted onto the support element fixed area；
Cure picture glue medium.
In the process, by adjusting the angle of support element to substrate pad glue, to realize that adjustment is mounted on support element
The angle of camera module group lens keeps camera lens parallel with chip.
About above-mentioned technique, wherein the concrete mode of each step pads gluing method in camera module provided by the present application
Embodiment in be described in detail, explanation will be not set forth in detail herein.
A kind of lens assembling technique that the application also provides, the technique include the following steps：
Target pad glue region is determined in the camera lens installation region of support element；
According to target pad glue parameter corresponding with target pad glue region, in target pad glue region pad glue medium
Carry out pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the camera lens installation region；
The camera lens of camera module is pasted onto the camera lens installation region；
Cure picture glue medium.
In the process, pad glue adjustment is carried out by the installation region of the support element for installing camera lens to camera module
The angle of camera lens keeps camera lens parallel with chip.
About above-mentioned technique, wherein the concrete mode of each step pads gluing method in camera module provided by the present application
Embodiment in be described in detail, explanation will be not set forth in detail herein.
The application also provides a kind of camera module, which includes：Camera lens, support element, chip, substrate, after solidification
Pad glue medium；
The chip attaches on the substrate；
The support element is fixed on the substrate；
The camera lens is mounted on the support element；
Pad glue medium after the solidification is arranged on the substrate and/or on support element so that the chip with it is described
Angle between camera lens meets a predetermined angle range.
About above-mentioned camera module, the wherein function of all parts pads gluing method in camera module provided by the present application
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of camera module pads gluing method, which is characterized in that the method includes：
Determine target pad glue region, target pad glue region is located on the substrate of camera module and/or the camera module
On support element；
According to target pad glue parameter corresponding with target pad glue region, carried out with pad glue medium in target pad glue region
Pad glue；
Cure the pad glue medium, so that between the chip and the camera lens of the camera module of the camera module after installation
Angle meets a predetermined angle range.
2. camera module according to claim 1 pads gluing method, which is characterized in that the determining target pad glue region it
Before, the method further includes：
Obtain the chip sticking area parameter on the substrate of the camera module；
The determining target pad glue region, including：
According to the chip sticking area parameter, target pad glue region is determined.
3. camera module according to claim 2 pads gluing method, which is characterized in that when adjusting the angle of the chip,
It is described that target pad glue region is determined according to the chip sticking area parameter, including：
According to the chip sticking area parameter, target pad glue region is determined in chip sticking area, so that the core
When piece is pasted onto the chip sticking area after padding glue, the angle between the chip and the camera lens meets the preset angle
Spend range.
4. camera module according to claim 2 pads gluing method, which is characterized in that in the support for adjusting the camera module
It is described that target pad glue region is determined according to the chip sticking area parameter when angle of part, including：
According on the chip sticking area parameter and the substrate for fixing the fixed area parameter of the support element,
Target pad glue region is determined in fixed area, when so that the support element being fixed on the fixed area after padding glue,
Angle between the chip and the camera lens meets the predetermined angle range.
5. camera module according to claim 2 pads gluing method, which is characterized in that when adjusting the angle of the camera lens,
It is described that target pad glue region is determined according to the chip sticking area parameter, including：
According to the fixation of the support element for fixing the camera module on the chip sticking area parameter and the substrate
Region parameter determines target pad glue region on the support element for installing in the installation region of the camera lens, so that
When the camera lens is mounted on the installation region after padding glue, the angle between the chip and the camera lens meets described default
Angular range.
6. camera module according to claim 1 pads gluing method, which is characterized in that after the solidification pad glue medium, institute
The method of stating further includes：
Glue is drawn with default picture glue parameter on predeterminable area, the predeterminable area is located on the substrate of the camera module or described
On the support element of camera module；
Cure picture glue medium, to paste the target component in the camera module.
7. a kind of camera module, which is characterized in that the camera module includes：Camera lens, support element, chip, substrate, after solidification
Pad glue medium；
The chip attaches on the substrate；
The support element is fixed on the substrate；
The camera lens is mounted on the support element；
Pad glue medium after the solidification is arranged on the substrate and/or on support element, so that the chip and the camera lens
Between angle meet a predetermined angle range.
8. the viscous brilliant technique of one kind, which is characterized in that the technique includes：
Target pad glue region is determined in the chip sticking area of substrate；
According to target pad glue parameter corresponding with target pad glue region, carried out with pad glue medium in target pad glue region
Pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the chip sticking area；
Chip is pasted onto the chip sticking area；
Cure picture glue medium.
9. a kind of support element barbola work, which is characterized in that the technique includes：
Target pad glue region is determined in the support element fixed area of substrate；
According to target pad glue parameter corresponding with target pad glue region, carried out with pad glue medium in target pad glue region
Pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the support element fixed area；
The support element of camera module is pasted onto the support element fixed area；
Cure picture glue medium.
10. a kind of lens assembling technique, which is characterized in that the technique includes：
Target pad glue region is determined in the camera lens installation region of support element；
According to target pad glue parameter corresponding with target pad glue region, carried out with pad glue medium in target pad glue region
Pad glue；
Cure the pad glue medium；
Glue is drawn with default picture glue parameter in the camera lens installation region；
The camera lens of camera module is pasted onto the camera lens installation region；
Cure picture glue medium.
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| CN201810629335.8A CN108766895B (en) | 2018-06-19 | 2018-06-19 | Camera module glue filling method, camera module and camera module process |
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| CN201810629335.8A CN108766895B (en) | 2018-06-19 | 2018-06-19 | Camera module glue filling method, camera module and camera module process |
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| CN108766895B CN108766895B (en) | 2020-06-30 |
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| CN108766895B (en) | 2020-06-30 |
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Address after: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300 Patentee after: Kunshan Qiuti Microelectronics Technology Co.,Ltd. Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300 Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |