CN209982574U - Camera shooting module - Google Patents

Camera shooting module Download PDF

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Publication number
CN209982574U
CN209982574U CN201920764689.3U CN201920764689U CN209982574U CN 209982574 U CN209982574 U CN 209982574U CN 201920764689 U CN201920764689 U CN 201920764689U CN 209982574 U CN209982574 U CN 209982574U
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CN
China
Prior art keywords
photosensitive
camera module
circuit board
filter
optical
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Active
Application number
CN201920764689.3U
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Chinese (zh)
Inventor
梅其敏
黄桢
刘丽
陈佳炜
仰宗春
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201920764689.3U priority Critical patent/CN209982574U/en
Priority to PCT/CN2019/095337 priority patent/WO2020038139A1/en
Priority to US17/266,776 priority patent/US20210321025A1/en
Priority to EP19853014.9A priority patent/EP3840353A4/en
Priority to US16/547,537 priority patent/US10986257B2/en
Application granted granted Critical
Publication of CN209982574U publication Critical patent/CN209982574U/en
Priority to US17/195,816 priority patent/US11412117B2/en
Priority to US17/195,785 priority patent/US11412116B2/en
Priority to US17/750,743 priority patent/US11758255B2/en
Priority to US17/983,592 priority patent/US11706514B2/en
Priority to US18/203,731 priority patent/US12003838B2/en
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Abstract

The utility model provides a camera module. The module of making a video recording is suitable for being fixed in an installation shell, and it includes: an optical assembly; a light filter; and a molded photosensitive assembly mounted under the optical assembly and the optical filter, wherein the molded photosensitive assembly includes a main body, some electronic devices, a photosensitive sheet and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive sheet, wherein the photosensitive sheet is fixed and surrounded by a bottom of the main body while keeping a distance from the optical filter, wherein the main body includes a housing body and a low body, wherein the optical assembly is eccentrically disposed in the housing body to be close to at least one side of the mounting case, wherein the optical filter is supported on the low upper surface of the low body.

Description

Camera shooting module
Technical Field
The utility model relates to an optical imaging technical field, in particular to module of making a video recording.
Background
In recent years, electronic products, smart devices, and the like are increasingly being made thinner and smaller, and the development trend of the electronic products and the smart devices puts more stringent requirements on the size (particularly, the height) of a camera module, which is one of standard configurations of the electronic products and the smart devices.
In the assembly process of the camera module in the prior art, a chip and an electronic component are usually attached to a circuit board, a lens base is formed on the circuit board through a lens base attaching process or a molding process, and meanwhile, a filter assembly is generally attached to the lens base, and an optical lens is attached to the filter assembly, so that the optical lens is kept on a photosensitive path of the chip.
However, the assembly method of the prior art makes the height of the camera module depend on the thickness of the circuit board, the height of the lens holder, the thickness of the filtering component and the height of the optical lens, that is, according to the existing structural design method, the sum of the thickness of the circuit board, the height of the lens holder, the thickness of the filtering component and the height of the optical lens is equal to the height of the camera module, which has many limitations for the slimmer camera module.
Need remain as the space of dodging about traditional attached mirror seat and between electronic components, simultaneously, the color filter is installed again on the support arm of mirror seat, and the support arm that the mirror seat is used for installing the color filter has a minimum shaping thickness, and the conventionality is more than 0.2mm, and in addition, the upper surface of color filter and the lower surface of camera lens also need set up a safe distance to in the equipment of traditional mirror seat, pile up the accumulation on high, lead to the mirror seat height to be difficult to reduce.
In addition, a similar situation exists in the molding process.
Firstly, in the molding process, the electronic component mounted on the circuit board is located in the molding die, because a safety distance needs to be reserved between the electronic component and the molding die to prevent the molding die from extruding each electronic component, that is, no matter in the horizontal direction or in the height direction, a safety distance needs to be reserved between the molding die and each electronic component to cover each electronic component after the molding base is molded, so that the height of the molding base needs to be greater than that of each electronic component, that is, the height of the molding base is limited by the height of each electronic component, which results in that the height of the molding base cannot be reduced.
Secondly, the filter assembly is composed of the filter and the support, and the support is usually made by injection molding process, and the part of the support supporting the filter needs to have a certain thickness to ensure that it has enough strength to firmly support the filter, so that the thickness of the filter assembly must be larger than the thickness of the filter, i.e. the thickness of the filter assembly is limited by the support and the filter together, which results in that the thickness of the filter assembly cannot be reduced.
Therefore, due to the limitation of the above factors, the height of the camera module cannot be reduced by the assembly method in the prior art, and the demands of the market on the lightness, thinness and miniaturization of the camera module cannot be met.
Today's smart devices must be equipped with high quality camera modules. For example, a smart phone senses the world by acquiring an image through a camera module. Along with the pursuit of smart machine is more and more frivolous, the module of making a video recording of small-size has market competition more.
A conventional camera module installed in a smart phone is disclosed in fig. 13. A filter assembly 20P is supported above a photosensitive assembly 30P. An optical lens 10P is installed above the filter assembly 20P, so that the shaped and filtered light is transmitted to a chip 300P of the photosensitive assembly 30P. In order to achieve better quality, the filter assembly 20P needs to be disposed between the optical lens 10P and the photosensitive assembly 30P. Then, the thickness of the conventional camera module is determined from the photosensitive element 30P to the optical lens 10P. Moreover, the thickness of the camera module is difficult to be reduced because of the height of the optical lens 10P, the thickness of the filter assembly 20P, and the height of the photosensitive assembly 30P. Such a size of camera module is neither suitable nor attractive in a slim and fashionable smart phone. In this example of the conventional camera module, the filter assembly 20P includes a filter 21P and a filter holder 22P, and the filter holder 22P supports the filter 21P between the optical lens 10P and the photosensitive assembly 30P. In addition, the height of the optical lens 10P and the thickness of the photosensitive member 30P are difficult to be reduced due to complicated optical design and the size of the electronic devices included in the photosensitive member 30P. In particular, since a short back focus camera module is usually required to be less than 0.6mm, the requirement cannot be met by the current technology level.
Some conventional camera modules attempt to mount the filter 21P directly on the bottom of the optical lens 10P without the filter holder 22P, thereby reducing the overall size of the camera module. However, the optical lens 10P has to be directly pressed against the filter 21P, and the filter 21P cannot bear the weight of the optical lens 10P or the movement of the optical lens 10P during use. And the glue to which the optical lens 10P is mounted easily flows into the center of the filter 21P to cover the area transmitting light. These broken filters 21P may cause the entire camera module to fail to acquire images.
In other prior arts, it is attempted to attach the filter 21P to the surface of the chip 300P or the bottom surface of the optical lens 10P. However, this requires more detail to attach the filter 21P to the surface, like attaching a film on glass. For example, flatness between the filter 21P and the chip 300P is hardly ensured, and durability of the filter 21P and the chip 300P is adversely affected. If there is a bubble or wrinkle, the filter 21P will have a reduced filtering effect and will not operate effectively, so that the quality and reliability of the camera module will be reduced.
In fact, the distance between the optical lens 10P and the filter 21P and the distance between the filter 21P and the chip 21P are critical to the imaging quality. After being reflected on the filter 21P, stray light enters the chip 300P. If the distance between the filter 21P and the chip 300P is too short, stray light enters the center of the chip 300P, that is, an imaging sensing area. If the distance between the filter 21P and the chip 300P is slightly long, stray light enters the edge of the chip 300P, i.e., the process summary is easily ignored. Therefore, if the filter 21P is attached to the surface of the chip 300P or the bottom surface of the optical lens 10P is capable of reducing the thickness of the camera module, the image capturing efficiency is reduced, that is, the filter 21P does not work effectively, which is not perfect for smart devices.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a camera module, it can reduce camera module's height is favorable to satisfying camera module's frivolousization and miniaturized development demand.
Another object of the present invention is to provide a camera module, which can reduce the height of the camera module by reducing the distance between a filter element and a circuit board.
Another object of the present invention is to provide a camera module, which can reduce the back focus of an optical lens of the camera module, and helps to realize a more miniaturized camera module, so as to satisfy the market demand.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, a molding base of the module photosensitive assembly has a stepped peripheral groove, and a filter element of the molding photosensitive assembly is installed in the stepped peripheral groove of the molding base, so that the filter element and the distance between the circuit boards is reduced.
It is another object of the present invention to provide a camera module, wherein, in some embodiments of the present invention, the molding base has a stepped peripheral groove, wherein the filter element is disposed in the stepped peripheral groove to reduce the distance between the filter element and the circuit board.
It is another object of the present invention to provide a camera module, wherein in some embodiments of the present invention, the mold base includes a first base portion and a second base portion, wherein the second base portion extends inward from the first base portion integrally along the circuit board, and a first top surface of the first base portion defines the first mounting surface, a second top surface of the second base portion defines the second mounting surface, wherein the first mounting surface is higher than the second mounting surface, and the filter element is mounted to the second mounting surface.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, the second mounting surface of the molding base is lower than the upper surface of the electronic component on the circuit board, so as to further reduce the distance between the filter element and the circuit board.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, the filter element is mounted on the first mounting surface of the mold base through a support member, and the filter element is located between the first mounting surface and the second mounting surface to reduce a distance between the filter element and the circuit board.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, the first mounting surface and the second mounting surface of the mold base are parallel to each other, which facilitates subsequent active calibration processes.
Another object of the present invention is to provide a camera module, wherein in some embodiments of the present invention, the height of the loop of the gold thread is reduced by reverse beating process, so as to avoid the pressure head of the forming mold, and further reduce the distance between the second mounting surface and the circuit board of the molding base.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, before the photosensitive element is mounted, the molding base is made by a molding process, so as to further reduce the distance between the second mounting surface of the molding base and the circuit board.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, the photosensitive element is mounted in a chip mounting groove of the circuit board to further reduce the distance between the second mounting surface of the molding base and the circuit board.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, the photosensitive element is mounted in a through-hole chip mounting groove of the circuit board, so as to further reduce the distance between the second mounting surface of the molding base and the circuit board.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, an upper surface of the filter element is not higher than the first mounting surface of the molding base, so that the filter element is effectively prevented from moving down and impacting due to the optical lens in the camera module with moving focus.
Another object of the present invention is to provide a camera module, wherein, in some embodiments of the present invention, a gap is reserved between the filter element and a first inner peripheral surface of the first base portion of the mold base, so as to mount the filter element.
Another object of the present invention is to provide a camera module, wherein the thickness of the camera module mainly depends on the height of a lens and the thickness of a molded photosensitive assembly, thereby saving the installation space in an intelligent device.
Another object of the present invention is to provide a camera module, which is capable of effectively producing a small-sized camera module, and the camera lens and the molding photosensitive assembly are not increased in difficulty and complexity.
Another object of the present invention is to provide a camera module, wherein the optical filter is supported well and need not to support the lens, so that the lens is supported stably without considering the damage to the optical filter.
Another object of the present invention is to provide a camera module, wherein a lens glue attached between the lens and the molded photosensitive assembly is kept away from the optical filter, so as to keep the filtering region of the optical filter uncovered.
Another object of the present invention is to provide a camera module, wherein the optical filter and the distance between the lenses are maintained to maintain a small amount of stray light entering the molded photosensitive film in the molding photosensitive assembly, so that the imaging quality is enhanced.
Another object of the present invention is to provide a camera module, wherein the filter and the distance between the photosensitive assemblies is kept to maintain a small amount of stray light entering the center of the photosensitive sheet, so that the imaging quality is enhanced.
Another object of the present invention is to provide a camera module, wherein the photosensitive film is hardly pressed by the optical filter and has better photosensitive performance.
Another object of the present invention is to provide a camera module, wherein the lens is directly supported by the molding photosensitive assembly, so that the lens has a strong support, and is convenient to start or move.
Another object of the present invention is to provide a camera module, wherein the light sensing module for molding is a high support for the lens, a low support for the optical filter is provided, so as to stably support the lens and the optical filter effectively avoid interference between the lens and the optical filter.
Another object of the present invention is to provide a camera module, wherein the lens can be installed the photosensitive assembly of moulding and adaptation the edge shape of the smart machine, so that the imaging ability is guaranteed under the condition of having a better appearance.
To achieve at least the above objects and other objects and advantages in accordance with the purpose of the invention, a molded photosensitive assembly includes:
an imaging assembly, wherein said imaging assembly includes a circuit board and at least one photosensitive element, and each said photosensitive element is conductively connected to said circuit board;
a molding base, wherein the molding base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, wherein the molding base covers a portion of the imaging assembly, and a photosensitive region of each photosensitive element corresponds to each light window of the molding base; and
a light filtering assembly, wherein said light filtering assembly comprises at least one light filtering element, wherein each said light filtering element is correspondingly disposed in each said stepped peripheral groove of said mold base, so that each said light filtering element corresponds to each said light window of said mold base.
In some embodiments of the present invention, the mold base includes at least one first base portion and at least one second base portion, wherein each of the second base portions integrally extends inward along the wiring board from an inner peripheral surface of each of the first base portions, and a first top surface of each of the first base portions is higher than a second top surface of the second base portion to form each of the stepped peripheral grooves of the mold base by each of the first base portions and each of the second base portions.
In some embodiments of the present invention, the circuit board includes a chip mounting area and an edge area located around the chip mounting area, the photosensitive element includes a photosensitive area and a non-photosensitive area located around the photosensitive area, wherein the molding base covers the first base portion of the circuit board at least a portion of the edge area, the molding base covers the second base portion of the photosensitive element at least a portion of the non-photosensitive area.
In some embodiments of the present invention, the first base portion covers a circuit board outer side portion of the edge region of the circuit board, and the second base portion covers a circuit board connecting portion and a circuit board inner side portion of the edge region of the circuit board and a chip outer side portion and a chip connecting portion of the non-photosensitive region of the photosensitive element.
In some embodiments of the present invention, the first base portion of the mold base covers a circuit board outer side portion and a circuit board connecting portion of the edge region of the circuit board, and the second base portion covers a circuit board inner side portion of the edge region of the circuit board and a chip outer side portion and a chip connecting portion of the non-photosensitive region of the photosensitive element.
In some embodiments of the present invention, the first base portion of the mold base covers a circuit board outer side portion, a circuit board connecting portion, and a circuit board inner side portion of the edge region of the circuit board, and the second base portion covers a chip outer side portion, a chip connecting portion, and a portion of an inner side portion of the non-photosensitive region of the photosensitive element.
In some embodiments of the present invention, the first base portion of the molding base covers a circuit board outer side portion, a circuit board connecting portion, and a circuit board inner side portion of the edge region of the circuit board and a chip outer side portion of the non-photosensitive region of the photosensitive element, and the second base portion covers a part of a chip connecting portion and a chip inner side portion of the non-photosensitive region of the photosensitive element.
In some embodiments of the present invention, the imaging module further includes at least one set of leads for conductively connecting the photosensitive element and the circuit board through each of the leads, wherein the height of the second base portion is greater than the loop height of each of the leads, and each of the leads of the imaging module is covered by the second base portion.
In some embodiments of the present invention, the imaging module further includes at least one set of electronic components, and each of the electronic components is attached to the circuit board outer side portion of the edge region of the circuit board, wherein the height of the first base portion of the molding base is greater than the height of each of the electronic components, and each of the electronic components of the imaging module is covered by the first base portion.
In some embodiments of the invention, the second top surface of the second base portion is lower than the top surface of the highest electronic component.
In some embodiments of the present invention, the circuit board includes a chip mounting region and an edge region located around the chip mounting region, wherein the first base portion and the second base portion of the molding base both cover an outer side portion of the circuit board of the edge region of the circuit board.
In some embodiments of the present invention, the imaging module further includes at least one set of electronic components, and each of the electronic components is attached to the circuit board outer side portion of the edge region of the circuit board, wherein the height of the first base portion of the molding base is greater than the height of each of the electronic components, and each of the electronic components of the imaging module is covered by the first base portion.
In some embodiments of the invention, the first top surface of each of the first base parts and the second top surface of the second base part are parallel to each other.
In some embodiments of the present invention, the first top surface of each of the first base portions of the molding base and a photosensitive surface of the photosensitive element are parallel to each other.
In some embodiments of the present invention, an inclination angle of the first inner peripheral surface of each of the first base portions with respect to a light-sensing surface of the light-sensing element is less than 30 °.
In some embodiments of the present invention, an inclination angle of a second inner peripheral surface of each of the second base portions with respect to the photosensitive surface of the photosensitive element is less than 30 °.
In some embodiments of the present invention, the filter assembly further includes at least one adhesive layer, wherein each of the adhesive layers is disposed between each of the filter elements and each of the second base portions, so that each of the filter elements is fixedly disposed on each of the second base portions of the mold base through each of the adhesive layers.
In some embodiments of the present invention, each of the adhesive layers is formed by curing a glue applied to the second top surface of each of the second base portions, and each of the adhesive layers is located between a lower surface of each of the filter elements and the second top surface of each of the second base portions.
In some embodiments of the present invention, each of the second base portions further has at least one glue groove, wherein each glue groove is recessed downward from the second top surface of each of the second base portions to form a groove for accommodating the glue.
In some embodiments of the present invention, each of the adhesive layers is formed by curing a glue applied to a lower surface of each of the filter elements, and each of the adhesive layers is located between the lower surface of each of the filter elements and the second top surface of each of the second base portions.
In some embodiments of the present invention, the molded photosensitive assembly further comprises a mounting gap, wherein the mounting gap is located between the filter element and the first inner peripheral surface of the first base portion.
In some embodiments of the present invention, each of the bonding layers has at least one air escape hole, wherein each of the air escape holes extends from the inner side of the bonding layer to the outer side of the bonding layer, so as to communicate the light filtering element and the space between the photosensitive elements with the outer space of the molded photosensitive assembly.
In some embodiments of the present invention, the filter assembly further includes at least one adhesive layer and at least one annular support member, wherein each of the adhesive layers is located between each of the upper surfaces of the filter elements and each of the support members, so that each of the filter elements is fixedly attached to each of the support members through each of the adhesive layers, wherein each of the support members is correspondingly disposed on the first base portion of the mold base, so that each of the filter elements is located in each of the stepped peripheral grooves of the mold base.
In some embodiments of the present invention, each of the supporting pieces of the filter assembly is attached to the first top surface of each of the first base parts so that the upper surface of each of the filter elements is lower than the first top surface of each of the first base parts.
In some embodiments of the present invention, the circuit board further has at least one chip mounting groove, wherein every chip mounting groove is located in a chip mounting area of the circuit board, and every chip mounting groove is from an upper side of the circuit board is recessed downward to form a groove for mounting the photosensitive element.
In some embodiments of the present invention, each chip mounting groove extends downward from the upper side surface of the circuit board to a lower side surface of the circuit board, so that the chip mounting area of the circuit board forms a through hole, wherein each photosensitive element is fixedly disposed at each chip mounting groove.
According to the utility model discloses an on the other hand, the utility model discloses still provide a module of making a video recording, include:
the above molded photosensitive member; and
and each optical lens is arranged on the photosensitive path of each photosensitive element of the imaging component of the molding photosensitive component so as to provide a light path for each optical lens and each photosensitive element through each optical window.
According to the utility model discloses an on the other hand, the utility model also provides an electronic equipment, include:
an electronic device body; and
the camera module is characterized in that each camera module is arranged on the electronic equipment body and used for acquiring images.
According to another aspect of the present invention, there is provided a method of manufacturing a molded photosensitive assembly, comprising the steps of:
mounting a photosensitive element and at least one group of electronic components on a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly;
forming a molding base with a stepped peripheral groove for covering a part of the circuit board and a part of the photosensitive element by a molding process so as to form an optical window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the optical window of the molding base, so as to manufacture a molding photosensitive assembly semi-finished product with an integrated structure; and
correspondingly arranging a filter element of a filter assembly in the stepped peripheral groove of the molding base of the semi-finished molding photosensitive assembly to assemble a molding photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element.
In some embodiments of the present invention, the mounting device comprises a photosensitive element and at least one set of electronic components, which are disposed on a circuit board, and are turned on to assemble the photosensitive element and the circuit board into an imaging assembly, comprising:
mounting the photosensitive element on a chip mounting area of the circuit board;
mounting each electronic component on an outer side of a circuit board in an edge area of the circuit board; and
a lead wire is extended from a chip connecting piece of the photosensitive element to a circuit board connecting piece of the circuit board by a gold wire bonding process so as to conductively connect the photosensitive element and the circuit board.
In some embodiments of the present invention, the mounting device comprises a photosensitive element and at least one set of electronic components, which are disposed on a circuit board, and are turned on to assemble the photosensitive element and the circuit board into an imaging assembly, comprising:
mounting the photosensitive element on a chip mounting area of the circuit board;
mounting each electronic component on an outer side of a circuit board in an edge area of the circuit board; and
a lead wire is extended from a circuit board connecting piece of the circuit board to a chip connecting piece of the photosensitive element by a gold wire bonding process so as to conductively connect the circuit board and the photosensitive element.
In some embodiments of the present invention, the step of forming a molding base having a stepped peripheral groove for covering a portion of the circuit board and a portion of the photosensitive element by a molding process to form an optical window through the stepped peripheral groove, wherein a photosensitive region of the photosensitive element corresponds to the optical window of the molding base to form a molded photosensitive element semi-finished product having an integral structure, includes the steps of:
placing the imaging assembly in a forming mold;
carrying out mold closing operation on an upper mold and a lower mold of the forming mold, and forming a forming space of the forming mold between the upper mold and the lower mold;
adding a molding material into the molding space of the molding mold to form the molding base with the stepped peripheral groove after the molding material is cured; and
and carrying out die drawing operation on the upper die and the lower die to obtain the semi-finished product of the molded photosensitive assembly.
In some embodiments of the present invention, the step of performing a mold closing operation on an upper mold and a lower mold of the forming mold to form a forming space of the forming mold between the upper mold and the lower mold includes the steps of:
arranging a covering film on a laminating surface of the upper die;
pressing the photosensitive element of the imaging component by the covering film so as to enable the covering film to be positioned between the laminating surface and the photosensitive element;
a first molding space forming the molding space between a first inner surface of the upper mold and at least a portion of the edge area of the circuit board; and
and forming a second forming space of the forming space between a second inner surface of the upper die and at least one part of a non-photosensitive area of the photosensitive element, wherein the first inner surface of the upper die is above the second inner surface of the upper die.
In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to form the molding base having the stepped peripheral groove after the molding material is cured includes the steps of:
adding the molding material into the first molding space to form a first base portion of the molding base after the molding material is cured, wherein the first base portion covers the at least one portion of the edge region of the circuit board; and
and adding the molding material into the second molding space to form a second base part of the molding base after the molding material is cured, wherein the second base part covers at least one part of the non-photosensitive region of the photosensitive element, and the height of the second base part is lower than that of the first base part.
In some embodiments of the present invention, said step of correspondingly disposing a filter element of a filter assembly in said stepped peripheral groove of said molding base of said molding photosensitive assembly semi-finished product to assemble a molding photosensitive assembly, wherein said photosensitive region of said photosensitive element corresponds to said filter element comprises the steps of:
applying a glue to a second top surface of said second base portion of said mold base;
correspondingly arranging the filter element on the second top surface of the second base part; and
after the glue is cured, an adhesive layer of the filter assembly is formed between a lower surface of the filter element and the second top surface of the second base portion.
In some embodiments of the present invention, said step of correspondingly disposing a filter element of a filter assembly in said stepped peripheral groove of said molding base of said molding photosensitive assembly semi-finished product to assemble a molding photosensitive assembly, wherein said photosensitive region of said photosensitive element corresponds to said filter element comprises the steps of:
applying glue to a lower surface of the filter element;
correspondingly arranging the filter element on a second top surface of the second base part; and
after the glue is cured, an adhesive layer of the filter assembly is formed between the lower surface of the filter element and the second top surface of the second base portion.
In some embodiments of the present invention, said step of correspondingly disposing a filter element of a filter assembly in said stepped peripheral groove of said molding base of said molding photosensitive assembly semi-finished product to assemble a molding photosensitive assembly, wherein said photosensitive region of said photosensitive element corresponds to said filter element comprises the steps of:
applying a glue to an annular support of the filter assembly;
correspondingly arranging the filter element on the support member to form an adhesive layer of the filter assembly between an upper surface of the filter element and the support member after the glue is cured; and
correspondingly, the support member is disposed on a first top surface of the first base portion, so that the filter element is located in the stepped peripheral groove of the molding base.
According to another aspect of the present invention, there is provided a method of manufacturing a molded photosensitive assembly, comprising the steps of:
forming a molding base with a stepped peripheral groove for covering the outer side part of a circuit board of an edge area of the circuit board by a molding process so as to form an optical window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the optical window of the molding base so as to manufacture a molding photosensitive assembly semi-finished product with an integrated structure;
mounting a photosensitive element on a chip mounting area of the circuit board, and conducting the photosensitive element and the circuit board; and
correspondingly arranging a filter element of a filter assembly in the stepped peripheral groove of the molding base to assemble a molding photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element.
According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:
according to the manufacturing method of the molding photosensitive assembly, the molding photosensitive assembly is manufactured; and
correspondingly arranging an optical lens on a photosensitive path of an imaging component of the molding photosensitive component to manufacture a camera module.
Other advantages and features of the invention will be fully apparent from the following detailed description and can be realized by means of the instruments and combinations particularly pointed out in the appended claims.
According to the utility model discloses an aspect can realize aforementioned purpose and other purposes and advantage the utility model discloses a module of making a video recording, it includes:
a camera module, comprising:
an optical assembly;
a light filter; and
a molded photosensitive assembly is mounted below the optical assembly and the optical filter, wherein the molded photosensitive assembly includes a main body, some electronic devices, a photosensitive sheet and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive sheet, wherein the main body covers the electronic devices and a portion of the circuit board, wherein the photosensitive sheet is surrounded by a bottom of the main body and is spaced apart from the optical filter, wherein the main body includes a container supporting the optical assembly thereon and a short body supporting the optical filter thereon, wherein the short body extends from an inner side of the container, and a distance between a short upper surface of the short body and the photosensitive sheet is equal to or greater than 0.15 mm.
In some embodiments of the present invention, the optical filter includes a filtering portion for filtering the imaging light and an edge portion extending outward from the filtering portion, wherein the edge portion is supported on the short upper surface of the short body of the molded photosensitive assembly, so that the filtering portion corresponds to the photosensitive sheet.
In some embodiments of the present invention, the optical filter portion has an incident surface and an emergent surface, wherein the incident surface faces the optical component, and wherein the emergent surface faces the photosensitive sheet.
In some embodiments of the present invention, the edge portion has an edge top surface, an edge side surface and an edge bottom surface, wherein the edge top surface is coplanar with the incident surface, and the edge bottom surface is coplanar with the exit surface.
In some embodiments of the present invention, a distance between the edge side of the edge portion of the optical filter and the high inner side of the containing body is greater than or equal to 0.15 mm.
In some embodiments of the present invention, a width between the edge bottom surface of the edge portion of the optical filter and the short upper surface of the short body has a maximum value, which is equal to the width of the edge portion.
In some embodiments of the present invention, a width of the edge portion of the optical filter is greater than or equal to 0.25 mm.
In some embodiments of the present invention, a distance between each of the electronic devices and the edge side of the edge portion of the optical filter is greater than or equal to 0.25 mm.
In some embodiments of the present invention, the short upper surface of the short body is lower than the high upper surface of the containing body, and the relative height of the short upper surface of the short body is lower than the height of the highest of the electronic devices.
In some embodiments of the present invention, the relative height of the high upper surface of the containing body is higher than the height of the highest electronic device among the electronic devices to at least coat the highest electronic device among the electronic devices through the containing body, wherein the optical component is mounted on the high upper surface of the containing body.
In some embodiments of the present invention, the distance between the high upper surface of the containing body and the short upper surface of the short body is greater than 0.1 mm.
In some embodiments of the present invention, the width of the short upper surface of the short body is a distance from the high inner side of the containing body to the short inner side of the short body, which is greater than or equal to 0.4 mm.
In some embodiments of the present invention, the containing body and the short body are shaped like a square with a chamfer, wherein the inscribed circle radius of the containing body and the chamfer of the short body is equal to or greater than 0.3 mm.
In some embodiments of the present invention, the height of the containing body is greater than or equal to 0.5 mm.
According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:
i connecting a photosensitive sheet with some wiring and some electronic devices on a circuit board;
II, placing the connected circuit board between an upper die and a lower die; and
and III covering the electronic device in a main body and on the circuit board to form a molded photosensitive assembly, wherein the main body comprises a containing body and a short body with the height lower than that of the containing body.
In some embodiments of the present invention, the method for manufacturing a camera module further includes:
IV, mounting a light filter on the short upper surface of the short body; and
and V, mounting an optical component on the high upper surface of the containing body.
In some embodiments of the present invention, in the step III, the short upper surface of the short body is lower than the high upper surface of the containing body, and the relative height of the short upper surface of the short body is lower than the height of the highest one of the electronic devices.
In some embodiments of the present invention, the electronic device, the wiring, and the edge of the photosensitive web are all covered by the main body.
In some embodiments of the present invention, the step III further comprises the step of:
III.1 injecting a molding material between an upper mold and a lower mold;
III.2 curing the moulding material between the upper and lower moulds to form the body; and
III.3 demolding the upper mold and the lower mold from the molded photosensitive assembly.
In some embodiments of the invention, the angle between the high inner side of the containing body and the low upper surface of the short body is greater than or equal to 95 °.
In some embodiments of the present invention, the step IV further comprises the steps of:
IV.1 applying a filter glue to the short upper surface of the short body in a C shape, so that a gap is reserved between two ends of the filter glue;
IV.2, mounting the optical filter on the optical filter glue;
IV.3, curing the light filtering glue; and
IV.4 filling the gap between the two ends of the filter glue with supplementary filter glue to form the square-like filter glue.
In some embodiments of the present invention, the length of the gap is greater than or equal to 0.7mm and less than or equal to 1.0 mm.
According to the utility model discloses an aspect can realize aforementioned purpose and other purposes and advantage the utility model discloses a module of making a video recording is suitable for and is fixed in an installation shell in, and it includes:
an optical assembly;
a light filter; and
a molded photosensitive assembly is mounted under the optical assembly and the optical filter, wherein the molded photosensitive assembly includes a main body, some electronic devices, a photosensitive sheet and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive sheet, wherein the photosensitive sheet is fixed and surrounded by the bottom of the main body while keeping a distance from the optical filter, wherein the main body includes a housing body and a low body, wherein the optical assembly is eccentrically disposed in the housing body to be close to at least one side of the mounting case, wherein the optical filter is supported on the low upper surface of the low body.
In some embodiments of the present invention, the containing body has a high upper surface and a low upper surface, wherein a height of the containing body at the high upper surface is greater than a height of the containing body at the low upper surface, wherein a portion of the optical assembly is supported at the high upper surface of the containing body and another portion of the optical assembly is supported at the low upper surface of the containing body.
In some embodiments of the present invention, the camera module further comprises a lens adhesive, wherein the lens adhesive comprises a fixing adhesive layer, wherein the fixing adhesive layer is disposed between the optical assembly and the high upper surface of the containing body.
In some embodiments of the present invention, the lens glue further comprises a glue supplementing layer, wherein the glue supplementing layer is disposed between the optical component and the lower surface of the containing body, and the thickness of the glue supplementing layer is greater than the thickness of the fixing glue layer.
In some embodiments of the invention, the high upper surface of the containing body is U-shaped to support the optical component trilaterally; the low upper surface of the containing body is linear and extends from one high outer side surface of the containing body to the other high outer side surface of the containing body so as to support the optical component at one side.
In some embodiments of the invention, the high upper surface of the containing body is U-shaped to support the optical component trilaterally; the lower upper surface of the containing body is linear and extends from one high inner side surface of the containing body to the other high inner side surface of the containing body so as to support the optical component at one side.
In some embodiments of the present invention, the high upper surface of the containing body is L-shaped to support the optical assembly adjacent two sides; wherein the lower upper surface of the containing body is also L-shaped to support the optical assembly adjacent two sides.
In some embodiments of the present invention, the fixing glue layer is U-shaped, and the adhesive supplementing layer is linear, so as to pass through the fixing glue layer and the adhesive supplementing layer forming the lens glue with a square structure.
In some embodiments of the present invention, the fixing glue layer is L-shaped, and the adhesive supplementing layer is L-shaped, so as to pass through the fixing glue layer and the adhesive supplementing layer forming the lens glue with a square structure.
In some embodiments of the present invention, the optical component protrudes outward from the low upper surface of the containing body over the molded photosensitive component.
In some embodiments of the present invention, the electronic device is enclosed by the enclosure, and the electronic device is located below the high upper surface of the enclosure.
In some embodiments of the present invention, the electronic device is disposed on two or three sides of the photosensitive sheet.
In some embodiments of the invention, the low upper surface of the containing body is flush with the low upper surface of the short body.
In some embodiments of the present invention, the optical component protrudes outward from the molded photosensitive component from at least one side of the containing body, so that the optical component is close to at least one side of the mounting housing.
In some embodiments of the present invention, the short upper surface of the short body is lower than the high upper surface of the containing body, and the relative height of the short upper surface of the short body is lower than the height of the highest of the electronic devices.
In some embodiments of the invention, the distance between the high upper surface of the containing body and the short upper surface of the short body is greater than 0.1 mm.
In some embodiments of the invention, the draft angle of the high medial side of the containment body is between 5 ° and 10 °.
In some embodiments of the invention, the fillet radius between the high inner side of the containment body and the low upper surface of the short body is substantially equal to 0.1 mm.
In some embodiments of the invention, the draft angle of the high outer side of the containing body is between 5 ° and 10 °.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:
i connecting a photosensitive sheet with some wiring and some electronic devices on a circuit board;
II, placing the connected circuit board between an upper die and a lower die;
III covering the electronic device in a main body and on the circuit board to form a molded photosensitive assembly, wherein the main body comprises a containing body and a short body with the height lower than that of the containing body;
IV, mounting a light filter on the short upper surface of the short body; and
and V, eccentrically arranging the optical component on the containing body so that the optical component is close to at least one side of a mounting shell.
In some embodiments of the present invention, the step V comprises the steps of:
v.1 fixing the optical component on the high upper surface of the containing body; and
v.2 reinforcing the optical component on the lower upper surface of the containing body, wherein the lower upper surface is lower than the upper surface.
In some embodiments of the present invention, in step v.1, a lens glue is applied to the high upper surface of the containing body to form a layer of fixing glue between the optical component and the high upper surface of the containing body.
In some embodiments of the invention, said step v.2 comprises the steps of:
v.2.1 inverting the optical assembly and the molding photosensitive assembly so that the optical assembly is located at the lower side of the molding photosensitive assembly; and
v.2.2 applying lens glue between the legs of the optical assembly and the lower upper surface of the containment body to form a layer of make-up glue.
In some embodiments of the invention, the high upper surface of the containing body is U-shaped to support the optical component trilaterally; the low upper surface of the containing body is linear and extends from one high outer side surface of the containing body to the other high outer side surface of the containing body so as to support the optical component at one side.
In some embodiments of the invention, the high upper surface of the containing body is U-shaped to support the optical component trilaterally; the lower upper surface of the containing body is linear and extends from one high inner side surface of the containing body to the other high inner side surface of the containing body so as to support the optical component at one side.
In some embodiments of the present invention, the high upper surface of the containing body is L-shaped to support the optical assembly adjacent two sides; wherein the lower upper surface of the containing body is also L-shaped to support the optical assembly adjacent two sides.
In some embodiments of the present invention, the fixing glue layer is U-shaped, and the adhesive supplement layer is linear.
In some embodiments of the present invention, the fixing glue layer is L-shaped, and the adhesive supplement layer is L-shaped.
In some embodiments of the present invention, the optical component protrudes outward from the low upper surface of the containing body over the molded photosensitive component.
In some embodiments of the invention, the angle between the high inner side of the containing body and the low upper surface of the short body is between 95 ° and 100 °.
According to the utility model discloses an aspect can realize aforementioned purpose and other purposes and advantage the utility model discloses a module of making a video recording, it includes:
an optical assembly;
a light filter; and
a molded light sensing assembly, wherein the molded light sensing assembly is mounted below the optical assembly and the optical filter, wherein the molded light sensing assembly comprises a main body, a plurality of electronic devices, a light sensing sheet and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the light sensing sheet, wherein the main body covers the electronic devices and a portion of the circuit board, wherein the light sensing sheet is fixed and surrounded by the bottom of the main body to keep a distance from the optical filter, wherein the main body comprises a container supporting the optical assembly thereon, and a short body extending from the inner side of the container, wherein at least a portion of the electronic devices is covered under the short body, and the short body supports the optical filter thereon.
In an embodiment of the present invention, the electronic device includes at least one short device, wherein at least a portion of the short device is covered under the short body, and the height of each short device is less than 0.3 mm.
In an embodiment of the present invention, the photosensitive sheet is electrically connected to the circuit board through some wirings, and the wirings are covered by the short body, wherein the wirings and the short devices are all disposed around the photosensitive sheet, and the wirings and the short devices are respectively located on different sides of the photosensitive sheet.
In an embodiment of the present invention, a thickness of at least one side of the containing body is smaller than a thickness of the short body, so that the optical component protrudes outward from the at least one side of the containing body to the molding photosensitive component.
In an embodiment of the present invention, the electronic device further includes at least one high device, wherein the high device is covered under the containing body, and the height of each high device is greater than or equal to 0.3 mm.
In an embodiment of the present invention, the tall device and the wiring are located on the same side of the photosensitive sheet.
In an embodiment of the present invention, the containing body has a high upper surface and a low upper surface, wherein the height of the containing body at the high upper surface is greater than the height of the containing body at the low upper surface, wherein a portion of the optical component is supported at the high upper surface of the containing body, and another portion of the optical component is supported at the low upper surface of the containing body.
In an embodiment of the present invention, each of the tall devices in the electronic device is covered under the tall upper surface of the containing body, wherein each of the short devices in the electronic device is covered under the short upper surface of the short body, and the short device is located on at least one side of the photosensitive sheet corresponding to the low upper surface of the containing body.
In an embodiment of the present invention, the optical component protrudes outward from the low upper surface of the containing body to the molding photosensitive component.
In an embodiment of the present invention, an angle between the high inner side surface of the containing body and the low upper surface of the short body is greater than or equal to 100 °.
In an embodiment of the present invention, a height difference between the containing body and the short body is greater than or equal to 0.1 mm.
In one embodiment of the present invention, the optical filter includes a filter portion for transmitting the imaging light to the photosensitive sheet, and an edge portion supported on the short body of the molded photosensitive member.
In an embodiment of the present invention, the molded photosensitive assembly further includes an upper cover, wherein the upper cover is mounted on the high upper surface of the containing body, and the upper cover extends inward to cover the edge portion of the optical filter.
In an embodiment of the present invention, the height of the upper cover is smaller than the thickness of the optical filter.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:
i connecting a photosensitive sheet with some wiring and some electronic devices on a circuit board;
II, placing the connected circuit board between an upper die and a lower die; and
and III covering the electronic device in a main body and on the circuit board to form a molded photosensitive assembly, wherein the main body comprises a containing body and a short body with the height lower than that of the containing body, and at least part of the electronic device is covered under the short body.
In an embodiment of the present invention, the method for manufacturing a camera module further includes:
IV, mounting a light filter on the short upper surface of the short body; and
and V, mounting an optical component on the containing body.
In an embodiment of the present invention, the electronic device includes at least one short device, wherein at least a portion of the short device is covered under the short upper surface of the short body, and the height of each short device is less than 0.3 mm.
In an embodiment of the present invention, the wiring is covered by the short body, wherein the wiring and the short device are all disposed around the photosensitive sheet, and the wiring and the short device are respectively located on different sides of the photosensitive sheet.
In an embodiment of the present invention, a thickness of at least one side of the containing body is smaller than a thickness of the short body, so that the optical component protrudes outward from the at least one side of the containing body to the molding photosensitive component.
In an embodiment of the present invention, the electronic device further includes at least one high device, wherein the high device is covered under the containing body, and the height of each high device is greater than or equal to 0.3 mm.
In an embodiment of the present invention, the tall device and the wiring are located on the same side of the photosensitive sheet.
In an embodiment of the present invention, an angle between the high inner side surface of the containing body and the short upper surface of the short body is greater than or equal to 100 °.
Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the like.
Drawings
Fig. 1 is a schematic perspective view of a camera module according to a first preferred embodiment of the present invention.
Fig. 2 is an exploded view of the camera module according to the first preferred embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a molded photosensitive component of the camera module according to the first preferred embodiment of the present invention.
Fig. 4A shows a first variant of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.
Fig. 4B shows a second variant of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.
Fig. 4C shows a third variant of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.
Fig. 5A and 5B are schematic cross-sectional views illustrating a manufacturing process of the camera module according to the first preferred embodiment of the present invention.
Fig. 6A shows a first variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6B shows a second variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6C shows a third variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6D shows a fourth variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6E shows a fifth variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6F shows a sixth variant of the camera module according to the first preferred embodiment of the present invention.
Fig. 6G shows a seventh modified implementation of the camera module according to the first preferred embodiment of the present invention.
Fig. 6H shows an eighth modified embodiment of the camera module according to the first preferred embodiment of the present invention.
Fig. 7A to 7D are schematic flow charts of the method for manufacturing the molded photosensitive assembly according to the first preferred embodiment of the present invention.
Fig. 8 is a schematic flow chart illustrating a method for manufacturing the camera module according to the first preferred embodiment of the present invention.
Fig. 9 is a schematic cross-sectional view of a camera module according to a second preferred embodiment of the present invention.
Fig. 10A and 10B are schematic cross-sectional views illustrating the manufacturing steps of the camera module according to the second preferred embodiment of the present invention.
Fig. 11 is a flow chart illustrating a method for manufacturing the molded photosensitive assembly according to the second preferred embodiment of the present invention.
Fig. 12 is a schematic view of an electronic device with the camera module according to the present invention.
Fig. 13 is a conventional camera module in a smart device.
Fig. 14 is a sectional view of a camera module according to a third embodiment of the present invention.
Fig. 15 is a schematic perspective view of the optical filter and the molded photosensitive component of the camera module according to the third embodiment of the present invention.
Fig. 16 is a schematic top view of the filter and the molded photosensitive member of the camera module according to the third embodiment of the present invention.
Fig. 17 is a schematic cross-sectional view of the filter and the molded photosensitive assembly of the camera module according to the third embodiment of the present invention.
Fig. 18 is a schematic cross-sectional view of the camera module according to the third embodiment of the present invention, illustrating a possible installation mode of the camera module in a smart phone.
Fig. 19 is a schematic flow chart of a method for manufacturing the camera module according to the third embodiment of the present invention.
Fig. 20 is a schematic flow chart of a method for manufacturing the camera module according to the third embodiment of the present invention.
Fig. 21 is a schematic cross-sectional view of a possible mode of the filter and the molded photosensitive member of the camera module according to the third embodiment of the present invention.
Fig. 22 is a schematic cross-sectional view of another possible mode of the filter and the molded photosensitive member of the camera module according to the third embodiment of the present invention.
Fig. 23 is a schematic cross-sectional view of another possible mode of the filter and the molded photosensitive member of the camera module according to the third embodiment of the present invention.
Fig. 24 is a schematic cross-sectional view of the camera module according to a fourth embodiment of the present invention.
Fig. 25 is a schematic perspective view of the camera module according to the fourth embodiment of the present invention.
Fig. 26 is a schematic top view of the filter and the molded photosensitive member of the camera module according to the fourth embodiment of the present invention.
Fig. 27 is a schematic cross-sectional view of the filter and the molded photosensitive assembly of the camera module according to the fourth embodiment of the present invention, illustrating a possible installation mode in a smart phone.
Fig. 28 is a schematic cross-sectional view of the camera module according to a fifth embodiment of the present invention.
Fig. 29 is an exploded schematic view of the optical filter and the molded photosensitive member of the camera module according to the fifth embodiment of the present invention.
Fig. 30 is a schematic top view of the optical filter and the molded photosensitive member of the camera module according to the fifth embodiment of the present invention.
Fig. 31 is a modified embodiment of the camera module according to the fifth embodiment of the present invention.
Fig. 32 is a schematic top view of the filter and the molded photosensitive member of the camera module according to the above modified embodiment of the present invention.
Fig. 33A to 33C are schematic flow charts of the method for manufacturing the image pickup module according to the above-described modified embodiment of the present invention.
Fig. 34 and 35 show another variant of the camera module according to the above-described fifth embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purposes of limitation.
In the present application, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element or a plurality of elements may be included in one embodiment or a plurality of elements may be included in another embodiment. The terms "a" and "an" and "the" and similar referents are to be construed to mean that the elements are limited to only one element or group, unless otherwise indicated in the disclosure.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
With the development of electronic products, smart devices, and the like toward being lighter, thinner, and smaller, the camera module is one of the standard configurations of electronic products or smart devices, and the size (especially the height) of the camera module is more demanding.
However, in the assembly method of the prior art, the chip and the electronic component are usually mounted on the circuit board, then the molded base is formed on the circuit board by the molding process, and then the lens is mounted on the filter assembly after the filter is mounted on the lens holder, so that the lens is kept on the photosensitive path of the chip. However, the assembly method of the prior art has great limitation on the height of the camera module.
On one hand, although the traditional lens base is replaced by the molding base to reduce the transverse size and height of the camera module, in the molding process, the used mold needs to avoid electronic components such as capacitors and resistors on a circuit board (particularly, the capacitors have larger sizes, and the minimum capacitor at present is also 0.38mm high), and a certain safety distance is reserved between the mold and various electronic components, so that the height of the molding base is at least larger than 0.4 mm; on the other hand, the optical filter is usually combined with a supporting member to form an optical filter assembly, and then the optical filter assembly is attached to the molding base, since the supporting member is usually made by an injection molding process, the thickness of the portion of the supporting member for supporting the optical filter is required to be substantially greater than 0.15mm, and the thickness of the optical filter itself is usually more than 0.21mm, so the thickness of the optical filter assembly is at least greater than 0.36 mm.
In summary, the distance between the lens and the circuit board is equal to the sum of the height of the mold base and the thickness of the optical filter assembly (at least greater than 0.76mm), and limited by all the above factors, the distance between the lens and the circuit board of the camera module of the prior art cannot be further reduced, that is, the height of the camera module of the prior art cannot be further reduced, so that the market demand for the slimness and miniaturization of the camera module cannot be satisfied. Therefore, in order to solve the above problem, the utility model provides a camera module.
Referring to fig. 1 to 8 of the drawings for describing the present invention, a camera module and a molded photosensitive device and a method for manufacturing the same according to a first preferred embodiment of the present invention are illustrated, wherein the camera module 1 ' includes at least an optical lens 10 ' and a molded photosensitive device 20 ', wherein the molded photosensitive device 20 ' includes an imaging device 21 ', a filter device 22 ', and a molded base 23 ', wherein the molded base 23 ' covers a portion of the imaging device 21 ' after being molded and has at least one stepped peripheral groove 230 ', wherein the filter device 22 ' includes at least one filter element 221 ', and each filter element 221 ' is correspondingly disposed in each stepped peripheral groove 230 ' of the molded base 23 ', such that each filter element 221 ' of the filter device 22 respectively corresponds to a photosensitive path of the imaging device 21 ', wherein each optical lens 10 ' is disposed in a photosensitive path of the imaging component 21 ' to form the camera module 1 '.
It should be noted that although the features and advantages of the camera module of the present invention are illustrated in fig. 1 to 8 and described below by taking the camera module as an example, which includes only one optical lens 10 ', those skilled in the art will understand that the camera module disclosed in fig. 1 to 8 and described below is only an example, and does not limit the scope and content of the present invention, for example, in other examples of the camera module, the number of the optical lens 10' may be more than one, so as to form an array camera module.
As shown in fig. 2, the imaging assembly 21 'of the molded photosensitive assembly 20' includes a circuit board 211 'and at least one photosensitive element 212', and each photosensitive element 212 'is attached to a different position of the circuit board 211'.
Further, as shown in fig. 3, the circuit board 211 'includes at least one flat chip mounting region 2111' and an edge region 2112 ', wherein each chip mounting region 2111' and the edge region 2112 'are integrally formed, the edge region 2112' is located around the chip mounting region 2111 ', and each photosensitive element 212' is mounted in each chip mounting region 2111 'of the circuit board 211', so as to ensure the flatness of each photosensitive element 212 'mounted in each chip mounting region 2111'. For example, in the specific example shown in fig. 3, the circuit board 211 ' may include one chip mounting region 2111 ' and one edge region 2112 ', wherein the chip mounting region 2111 ' is located in the middle of the circuit board 211 ' and the edge region 2112 ' is located outside the circuit board 211 '.
Generally, as shown in fig. 3, the circuit board 211 ' further includes at least one set of circuit board connectors 2113 ', wherein each circuit board connector 2113 ' is disposed at the edge region 2112 ' of the circuit board 211 '.
As shown in fig. 3, the photosensitive element 212 'includes a photosensitive region 2121', a non-photosensitive region 2122 ', and at least one set of chip connectors 2123'. The photosensitive region 2121 'and the non-photosensitive region 2122' are integrally formed, and the non-photosensitive region 2122 'is located around the photosensitive region 2121', that is, the photosensitive region 2121 'is located in the middle of the photosensitive element 212', the non-photosensitive region 2122 'is located outside the photosensitive element 212', and the non-photosensitive element 2122 'is arranged around the photosensitive region 2121'. Each of the chip connectors 2123 ' is disposed in the non-photosensitive region 2122 ' of the photosensitive element 212 '.
As shown in fig. 3, the imaging assembly 21 ' further includes at least one set of leads 213 ', each of which has a circuit board connecting end and a chip connecting end, wherein each of the leads 213 ' extends between the chip connecting end and the circuit board connecting end, and the chip connecting end of each of the leads 213 ' is connected to each of the chip connectors of the photosensitive element 212 ', and the circuit board connecting end of each of the leads 213 ' is connected to each of the circuit board connectors of the circuit board 211 ', respectively, to conduct the photosensitive element 212 ' and the circuit board 211 '.
It should be noted that the type of the lead 213 'may not be limited, for example, the lead 213' may be a gold wire, that is, after the photosensitive element 212 'is mounted on the chip mounting region 2111' of the circuit board 211 ', the lead 213' can be connected to the photosensitive element 212 'and the circuit board 211' by a gold wire process. However, in other examples, the lead 213 'may be other types of leads, such as silver wire, copper wire, etc., to ensure that the lead 213' can conduct the photosensitive element 212 'and the circuit board 211'.
It is worth noting that, in an example of the camera module of the present invention, each of the circuit board connectors 2113 ' of the circuit board 211 ' and each of the chip connectors 2123 ' of the photosensitive elements 212 ' may be a connecting pad, that is, each of the circuit board connectors 2113 ' of the circuit board 211 ' and each of the chip connectors 2123 ' of the photosensitive elements 212 ' may be respectively shaped like a disc, so that the circuit board connecting ends and the chip connecting ends of the leads 213 ' are respectively connected to the circuit board connectors 2113 ' of the circuit board 211 ' and the chip connectors 2123 ' of the photosensitive elements 212 '. In another example of the camera module of the present invention, the circuit board connector 2113 'of the circuit board 211' and the chip connector 2123 'of the photosensitive element 212' may be respectively spherical, for example, solder paste or other welding material may be dotted on the edge region 2112 'of the circuit board 211' and the non-photosensitive region 2122 'of the photosensitive element 212' to respectively form the circuit board connector 2113 'of the circuit board 211' and the chip connector 2123 'of the photosensitive element 212'. Nevertheless, it can be understood by those skilled in the art that the types of the circuit board connector 2113 'of the circuit board 211' and the chip connector 2123 'of the photosensitive element 212' do not constitute a limitation to the type and scope of the camera module of the present invention, i.e., in other examples of the camera module, the circuit board connector 2113 'of the circuit board 211' and the chip connector 2123 'of the photosensitive element 212' may have other shapes not illustrated above.
In addition, as shown in fig. 3, the imaging assembly 21 ' further includes a set of electronic components 214 ', and each of the electronic components 214 ' may be mounted on the edge region 2112 ' of the circuit board 211 ' at intervals by, for example, an smt (surface Mount technology) process. It should be noted that the light sensing element 212 ' and each of the electronic components 214 ' may be located on the same side or opposite sides of the circuit board 211 ', respectively. For example, in a specific example shown in fig. 3, the photosensitive element 212 ' and each of the electronic components 214 ' may be respectively located on the same side of the circuit board 211 ', and the photosensitive element 212 ' is mounted in the chip mounting region 2111 ' of the circuit board 211 ', and each of the electronic components 214 ' is mounted in the edge region 2112 ' of the circuit board 211 ' at intervals. It should be understood that, in the camera module of the present invention, the type of the electronic component 214 'may not be limited, for example, the electronic component 214' can be implemented as a resistor, a capacitor, a driving device, or the like.
According to the first preferred embodiment of the present invention, as shown in fig. 3, each of the stepped peripheral grooves 230 ' of the molding base 23 ' of the molding photosensitive assembly 20 ' respectively defines a light window 2301 ', and each of the filter elements 221 ' disposed in each of the stepped peripheral grooves 230 ' respectively corresponds to each of the light windows, wherein the photosensitive region 2121 ' of each of the photosensitive elements 212 ' respectively corresponds to each of the light windows 2301 ', so that each of the light windows 2301 ' provides a light path for each of the optical lenses 10 ' and each of the photosensitive elements 212 ', and each of the filter elements 221 ' is correspondingly located in the light path. For example, in this particular example shown in FIG. 3, the filter assembly 22 'includes one of the filter elements 221', and said molded base 23 ' has one said stepped peripheral groove 230 ' to define said light window 2301 ', wherein the filter element 221 ' is located between the optical lens 10 ' and the photosensitive element 212 ', and the filter element 221 ', the optical lens 10' and the light sensing element 212 'all correspond to the light window 2301', so as to provide the light path for the filter element 221 ', the optical lens 10' and the light sensing element 212 'through the light window 2301', after the light from the optical lens 10 ' entering the camera module 1 ' is filtered by the filter 221 ', can be received and photoelectrically converted by the photosensitive region 2121 'of the photosensitive element 212'.
It will be understood by those skilled in the art that, in different examples of the camera module, the filter element 221 ' can be implemented in different types, for example, the filter element 221 ' can be implemented as an infrared cut filter, a full-transmission spectrum filter, and other filters or a combination of filters, for example, the filter element 221 ' can be implemented as a combination of an infrared cut filter and a full-transmission spectrum filter, that is, the infrared cut filter and the full-transmission spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21 ', for example, when the camera module is used in an environment with sufficient light, such as daytime, the infrared cut filter can be switched to the photosensitive path of the photosensitive element 212 ' to filter the infrared rays in the light reflected by the object entering the camera module by the infrared cut filter, when the camera module is used in dark environments such as at night, the full-transmittance spectral filter can be switched to the photosensitive path of the photosensitive element 212' to allow the infrared part of the light reflected by the object entering the camera module to transmit.
It should be noted that, since the filter element 221 ' of the filter assembly 22 ' is disposed in the stepped peripheral groove 230 ' of the mold base 23 ', in the camera module 1 ' provided by the present invention, the distance between the optical lens 10 ' and the circuit board 211 ' is no longer limited by the thickness of the filter assembly 22 ', that is, the distance between the optical lens 10 ' and the circuit board 211 ' can be reduced to be smaller than the sum of the thickness of the filter assembly 22 ' and the height of the mold base 23 ', so as to reduce the height of the camera module 1 '.
Specifically, as shown in fig. 2 and 3, the mold base 23 ' includes a first base portion 231 ' and a second base portion 232 ', wherein the second base portion 232 ' integrally extends inward from a first inner peripheral surface 2311 ' of the first base portion 231 ' along the wiring board 211 ', wherein a height of the first base portion 231 ' is greater than a height of the second base portion 232 ', so that the stepped peripheral groove 230 ' is formed by the first base portion 231 ' and the second base portion 232 ', and the light window 1 ' is formed by the first inner peripheral surface 2311 ' of the first base portion 231 ' and a second inner peripheral surface 2321 ' of the second base portion 232 '. In other words, the first base part 231 ' is located around the second base part 232 ', wherein a first bottom surface 2313 ' of the first base part 231 ' and a second bottom surface 2323 ' of the second base part 232 ' are both attached to the circuit board 211 ', and a first top surface 2312 ' of the first base part 231 ' is higher than a second top surface 2322 ' of the second base part 232 ' to form the stepped peripheral groove 230 ' at an inner peripheral edge of the mold base 23 '.
Therefore, in the first preferred embodiment according to the present invention, as shown in fig. 3, the first top surface 2312 ' of the first base portion 231 ' of the mold base 23 ' is defined as a first mounting surface of the mold base 23 ' for mounting the optical lens 10 '; the second top surface 2322 ' of the second base portion 232 ' of the mold base 23 ' is positioned as a second mounting surface of the mold base 23 ' for mounting the filter element 221 '. Since the second mounting surface is lower than the first mounting surface, the mounting height of the filter element 221 'is reduced, and therefore the back focus of the optical lens 10' of the camera module 1 'is also reduced, and the overall height of the camera module 1' is reduced, so as to meet the market demand for the development of the camera module in light weight and small size. It should be appreciated that, compared to the camera module of the prior art, not only is the support member in the optical filter assembly eliminated, but also the optical filter is directly mounted on the second mounting surface of the mold base 23 ', and the lens is directly mounted on the first mounting surface of the module base 23', so that not only the mounting height of the optical filter is reduced, but also the distance between the lens and the circuit board is reduced to reduce the overall height of the camera module.
Preferably, the first top surface 2312 'of the first base part 231' and the light-sensing surface of the light-sensing element 212 'are parallel to each other, so as to facilitate the subsequent active alignment of the optical lens 10' mounted on the first top surface 2312 'and the light-sensing element 212'.
In addition, as shown in fig. 3, the second top surface 2322 'of the second base portion 232' and the first top surface 2312 'of the first base portion 231' are parallel to each other, that is, the second top surface 2322 'of the second base portion 232' and the light sensing surface of the light sensing element 212 'are also parallel to each other, so that the filter element 221' mounted on the second top surface 2322 'and the light sensing element 212' are kept parallel.
According to the first preferred embodiment of the present invention, as shown in fig. 2 and fig. 3, after the molding base 23 ' is formed by a molding process, the molding base 23 ' covers at least a portion of the edge region 2112 ' of the circuit board 211 ', each of the electronic components 214 ', each of the leads 213 ' and at least a portion of the non-photosensitive region 2122 ' of the photosensitive element 212 ', so as to integrate the circuit board 211 ', the photosensitive element 212 ', the leads 213 ' and the electronic components 214 ' of the imaging component 21 ', so that the imaging component 21 ' and the molding base 23 ' form an integrated structure.
For example, as shown in fig. 3, the first base portion 231 'of the molding base 23' covers at least a portion of the edge region 2112 'of the circuit board 211' and each of the electronic components 214 ', so as to isolate the adjacent electronic components 214' by the first base portion 231 'of the molding base 23'. Accordingly, the second base portion 232 'of the molding base 23' covers at least a portion of the edge region 2112 'of the circuit board 211', each of the leads 213 ', and at least a portion of the non-photosensitive region 2122' of the photosensitive element 212 ', so as to isolate the adjacent leads 213' by the second base portion 232 'of the molding base 23'.
Specifically, as shown in fig. 3, the non-photosensitive region 2122 'of the photosensitive element 212' has a chip inner side portion 21221 ', a chip connecting portion 21222', and a chip outer side portion 21223 ', wherein the chip inner side portion 21221' is located around the photosensitive region 2121 ', the chip connecting portion 21222' extends inward and outward to connect to the chip inner side portion 21221 'and the chip outer side portion 21223', respectively, and each chip connecting portion 2123 'is disposed at the chip connecting portion 21222'. In other words, in the present invention, the region of the photosensitive element 212 ' used for disposing the chip connector 2123 ' is defined as the chip connector 21222 ', the region of the photosensitive element 212 ' from the chip connector 21222 ' to the photosensitive region 2121 ' is defined as the chip inner portion 21221 ', and the region of the photosensitive element 212 ' from the chip connector 21222 ' to the outer edge of the photosensitive element 212 ' is defined as the chip outer portion 21223 '. In other words, the light-sensing element 212 ' includes, in order from the inside to the outside, the light-sensing region 2121 ', the chip inner portion 21221 ', the chip connecting portion 21222 ', and the chip outer portion 21223 '.
Similarly, as shown in fig. 3, the edge region 2112 'of the circuit board 211' has a circuit board inner side portion 21121 ', a circuit board connecting portion 21122' and a circuit board outer side portion 21123 ', wherein the circuit board inner side portion 21121' is located around the chip mounting region 2111 ', the circuit board connecting portion 21122' extends inward and outward to connect to the circuit board inner side portion 21121 'and the circuit board outer side portion 21123', respectively, and the circuit board connecting portion 2113 'is disposed at the circuit board connecting portion 21122'. In other words, in the present invention, the area of the circuit board 211 ' used for the arrangement of the circuit board connector 2113 ' is defined as the circuit board connector 21122 ', the area of the circuit board 211 ' from the circuit board connector 21122 ' to the chip photosensitive area 2111 ' is defined as the circuit board inner side 21121 ', and the area of the circuit board 211 ' from the circuit board connector 21122 ' to the outer edge of the circuit board 211 ' is defined as the circuit board outer side 21123 '. In other words, the circuit board 211 ' includes, in order from the inside to the outside, the chip mounting region 211 ', the circuit board inner portion 21121 ', the circuit board connecting portion 21122 ', and the circuit board outer portion 21123 ' in a plan view.
Thus, as shown in fig. 3, the first base portion 231 'of the mold base 23' is disposed to cover the circuit board outer portion 21123 'of the marginal area 2112' of the circuit board 211 ', and the second base portion 232' of the mold base 23 'is disposed to cover the circuit board connecting portion 21122' and the circuit board inner portion 21121 'of the marginal area 2112' of the circuit board 211 'and the chip outer portion 21223' and the chip connecting portion 21222 'of the non-photosensitive area 2122' of the photosensitive element 212 ', so that each of the electronic components 214' is covered by the first base portion 231 'of the mold base 23', and each of the leads 213 is covered by the second base portion 232 'of the mold base 23'. It is worth mentioning that, in the present invention, the height of the first base portion 231 'of the mold base 23' is limited by the height of each of the electronic components 214 ', and the height of the second base portion 232' of the mold base 23 'is limited by the height of each of the wire loops of the lead wires 213'.
Since a certain safety gap is required to be reserved between the die used and each of the electronic components 214 ' and the leads 213 ' in order to prevent any contact between the die used and each of the electronic components 214 ' and the leads 213 ' during the formation of the mold base 23 ' by the molding process. Therefore, the height of the first base portion 231 'must be greater than the height of the highest electronic component 214', and the height of the second base portion 232 'must be greater than the height of the wire loop of the highest lead wire 213'. Since the height of the capacitor in the electronic component 214 ' is relatively high (the current smallest capacitor is also 0 ', 38 ' mm high), and the height of the capacitor is also greater than the height of the wire loop of each lead wire 213 ', the height of the second base portion 232 ' can be smaller than the height of the first base portion 231 ', so as to reduce the height of the filter element 221 ' mounted on the second top surface 2322 ' of the second base portion 232 '.
Preferably, as shown in fig. 3, the height of the second base portion 232 'is smaller than the height of the electronic component 214', that is, the second top surface 2322 'of the second base portion 232' is lower than the top surface of the electronic component 214 ', so that the lower surface 2211' of the filter element 221 'is lower than the top surface of the electronic component 214'. Of course, since the heights of the electronic components 214 'are different, in some other embodiments of the present invention, the height of the second base portion 232' only needs to be smaller than the height of the highest electronic component 214 ', that is, the first top surface 2322' of the second base portion 232 'only needs to be lower than the top surface of the highest electronic component 214'.
It should be understood that the height difference between the first and second base parts 231 ' and 232 ' may be designed according to the height difference between the electronic component 214 ' and the leads 213 ', and the thickness of the filter element 221 ' is designed according to the filtering performance and the manufacturing process, such that an upper surface 2212 ' of the filter element 221 ' may be higher than the first top surface 2312 ' of the first base part 231 ', may be lower than the first top surface 2312 ' of the first base part 231 ', and may be flush with the first top surface 2312 ' of the first base part 231 '. Of course, in the first preferred embodiment of the present invention, since the thickness of the filter element 221 ' is greater than the height difference between the first base portion 231 ' and the second base portion 232 ', when the lower surface 2211 ' of the filter element 221 ' is attached to the second top surface 2322 ' of the second base portion 232 ', the upper surface 2212 ' of the filter element 221 ' is higher than the first top surface 2321 ' of the first base portion 231 '.
Fig. 4A shows a first variant embodiment of the molded photosensitive assembly 20 ' according to the above first preferred embodiment of the present invention, wherein the first base portion 231 ' of the molded base 23 ' is disposed to cover the circuit board outer side portion 21123 ' and the circuit board connecting portion 21122 ' of the marginal region 2112 ' of the circuit board 211 ', and the second base portion 232 ' of the molded base 23 ' is disposed to cover the circuit board inner side portion 21121 ' of the marginal region 2112 ' of the circuit board 211 ' and the chip outer side portion 21223 ' of the non-photosensitive region 2122 ' of the photosensitive element 212 ', the chip connecting portion 21222 ' and a portion of the chip inner side portion 21221 ', such that each of the electronic components 214 is covered by the first base portion 231 ' of the molded base 23 ', and each of the leads 213 is covered by the first base portion and the second base portion 231 ' of the molded base 23 ', respectively The seat portions 232 ' are commonly wrapped to commonly isolate the adjacent leads 213 ' by the first and second base portions 231 ', 232 ' of the mold base 23 '.
In this way, since the distance between the second base portion 232 ' of the mold base 23 ' and the electronic component 214 ' is increased, when the electronic component 232 ' is closer to the lead 213 ', the electronic component 232 ' does not affect the molding process of the second base portion 232 ' of the mold base 23 ', in other words, the electronic component 214 ' does not interfere with the portion of the mold base 23 ' where the second base portion 232 ' is molded during the molding process, so as to ensure the normal operation of the molding process.
Fig. 4B shows a second variant embodiment of the molded photosensitive assembly 20 'according to the above first preferred embodiment of the present invention, wherein the first base portion 231' of the molded base 23 'is arranged to cover the circuit board outer side portion 21123', the circuit board connecting portion 21122 'and the circuit board inner side portion 21121' of the edge region 2112 'of the circuit board 211', and the second base portion 232 'of the molded base 23' is arranged to cover the chip outer side portion 21223 ', the chip connecting portion 21222' and a portion of the chip inner side portion 21221 'of the non-photosensitive region 2122' of the photosensitive element 212 ', such that each of the electronic components 214' is covered by the first base portion 231 'of the molded base 23', and each of the leads 213 'is covered by the first base portion 231' and the second base portion 232 'of the molded base 23' together, so as to commonly isolate the adjacent leads 213 'by the first and second base portions 231', 232 'of the mold base 23'. In other words, the first base portion 231 'of the molding base 23' covers the edge region 2112 'of the circuit board 211', and the second base portion 232 'of the molding base 23' covers a portion of the non-photosensitive region 2122 'of the photosensitive element 212', which is beneficial to bringing the mounting position of the electronic component 214 'closer to the circuit board connector 2113' of the circuit board 211 ', so as to reduce the overall size of the circuit board 211'.
Fig. 4C shows a third variant embodiment of the molded photosensitive assembly 20 'according to the above first preferred embodiment of the present invention, wherein the first base portion 231' of the molded base 23 'is configured to cover the edge region 2112' of the circuit board 211 'and the chip outer portion 21223' of the non-photosensitive region 2122 'of the photosensitive element 212', and the second base portion 232 'of the molded base 23' is configured to cover the chip connecting portion 21222 'of the non-photosensitive region 2122' of the photosensitive element 212 'and a portion of the chip inner portion 21221', such that each of the electronic components 214 'is covered by the first base portion 231' of the molded base 23 ', and each of the leads 213 is covered by the first base portion 231' and the second base portion 232 'of the molded base 23', so as to commonly isolate the adjacent leads 213 'by the first and second base portions 231', 232 'of the mold base 23'.
In other words, the first base portion 231 ' of the molding base 23 ' covers not only the edge region 2112 ' of the circuit board 211 ', but also a portion of the non-photosensitive region 2122 ' of the photosensitive element 212 ', so as to enhance the connection strength between the photosensitive element 212 ' and the circuit board 211 ' through the first base portion 231 '. Meanwhile, since the second base portion 232 'of the mold base 23' only covers a portion of the non-photosensitive region 2122 'of the photosensitive element 212', the lateral dimension of the stepped peripheral groove 230 'of the module base 23' is smaller than the lateral dimension of the photosensitive element 212 ', and therefore, the lateral dimension of the filter element 221' disposed in the stepped peripheral groove 230 'is also smaller than the lateral dimension of the photosensitive element 212', but larger than the lateral dimension of the photosensitive region 2121 'of the photosensitive element 212'. In this way, it is not only ensured that the filter element 221 ' achieves the corresponding filtering effect, but also that the size of the filter element 221 ' can be reduced as much as possible, since the larger the size of the filter element 221 ' is, the easier it is to break, and the larger the size is, the higher the cost is.
Referring to fig. 1 to 5B, the camera module 1 ' further includes at least one driver 30 ', wherein each optical lens 10 ' is assembled to each driver 30 ', and each driver 30 ' is assembled to the first top surface 2312 ' of the first base portion 231 ' of the molding base 23 ', so that each optical lens 10 ' is respectively retained in the photosensitive path of each photosensitive element 212 ' of the molding photosensitive assembly 20 '. In addition, when the camera module is used, the driver 30 ' can drive the optical lens 10 ' to move back and forth along the light sensing path of the light sensing element 212 ', so as to adjust the focal length of the camera module by adjusting the distance between the optical lens 10 ' and the light sensing element 212 '. The utility model discloses a module of making a video recording 1 'the type of driver 30' is unrestricted, driver 30 'can be implemented as the voice coil motor, it can be connected in the electricity in circuit board 211' to be in operating condition after receiving electric energy and control signal, and the drive optical lens 10 'along photosensitive element 212's sensitization route round trip movement. However, it will be understood by those skilled in the art that the type of the driver 30 ' is not limited as long as it can drive the optical lens 10 ' to move back and forth along the photosensitive path of the photosensitive element 212 '.
Referring to fig. 5A and 5B, a process of manufacturing the camera module 1' according to the first preferred embodiment of the present invention is shown. It should be understood by those skilled in the art that the manufacturing process of the molded photosensitive assembly 20 'and the manufacturing process of the camera module 1' shown in fig. 5A and 5B are only examples to illustrate the features and advantages of the present invention, and do not limit the content and scope of the present invention.
Specifically, in fig. 5A, the photosensitive element 212 ' is mounted in the chip mounting region 2111 ' of the circuit board 211 ', the chip connection end of each lead 213 ' is connected to each chip connector 2123 ' of the photosensitive element 212 ', and the circuit board connection end of each lead 213 ' is connected to each circuit board connector 2113 ' of the circuit board 211 '. And attaching each electronic component 214 ' to the circuit board outer side portion 21123 ' of the edge region 2112 ' of the circuit board 211 ' at intervals, respectively, so as to assemble the imaging assembly 21 '.
In fig. 5A, the imaging assembly 21 'is placed in a forming mold 500' to perform a molding process by the forming mold 500 ', thereby forming the molding base 23' having the stepped peripheral groove 230 ', and the edge region 2112' of the circuit board 211 'and a portion of the non-photosensitive region 2122' of the photosensitive element 212 'are covered by the molding base 23'. It should be understood by those skilled in the art that in other embodiments of the present invention, a plurality of the imaging assemblies 21 'may be simultaneously placed into a forming mold, so that a plurality of the imaging assemblies 21' may be molded by the forming mold, thereby forming a plurality of the molding bases 23 'having the stepped peripheral grooves 230' at a time.
Specifically, the molding module 500 ' includes an upper mold 510 ' and a lower mold 520 ', wherein at least one of the upper and lower molds 510 ', 520 ' can be moved to enable the upper mold 510 ' and the lower mold 520 ' to be closed and pulled, and a molding space 530 ' is formed between the upper mold 510 ' and the lower mold 520 ' when the molding mold 500 ' is in a closed state, wherein the module base 23 ' is formed by a molding material being introduced into the molding space 530 ' and cured.
More specifically, the upper mold 510 ' has a first inner surface 511 ', a second inner surface 512 ', and a pressing surface 513 ', wherein the second inner surface 512 ' is located around the first inner surface 511 ', and the second inner surface 512 ' is located between the first inner surface 511 ' and the pressing surface 513 ', wherein the second inner surface 512 ' is lower than the first inner surface 511 ', and the pressing surface 513 ' is lower than the second inner surface 512 '.
In fig. 5A, after the imaging assembly 21 ' is placed in the upper mold 510 ' and/or the lower mold 520 ', the upper mold 510 ' and the lower mold 520 ' are operated to close the molds such that the imaging assembly 21 ' is located in the molding space 530 ' formed between the upper mold 510 ' and the lower mold 520 '. At this time, the first inner surface 511 'of the upper mold 510' corresponds to the circuit board outer side portion 21123 'of the marginal area 2112' of the circuit board 211 'to define a first molding space 531' between the first inner surface 511 'and the circuit board 211', and to form the first base portion 231 'after the molding material is added to the first molding space 531' and solidified; the second inner surface 512 ' of the upper mold 510 ' corresponds to the circuit board connecting portion 21122 ' and the circuit board inner portion 21121 ' of the rim region 2112 ' of the circuit board 211 ' and the chip outer portion 21223 ' and the chip inner portion 21221 ' of the non-photosensitive element 2122 ' of the photosensitive element 212 ', so as to define a second molding space 532 ' between the second inner surface 512 ' and the circuit board 211 ', and form the second base portion 232 ' after the molding material is added into the second molding space 532 ' and cured; the pressing surface 513 ' of the upper mold 510 ' presses the photosensitive element 212 ', and since the photosensitive element 212 ' is located in the chip mounting region 2111 ' of the circuit board 211 ' and the chip mounting region 2111 ' is located in the middle of the circuit board 211 ', the circuit board 211 ' can be pressed flat by the pressing surface 513 ', thereby ensuring the overall flatness of the circuit board 211 ', and providing a flat molding base surface for the molding process.
It is noted that the first forming space 531 'communicates with the second forming space 532' to form the forming space 530 'with an integrated structure, so that the forming material can flow from the first forming space 531' into the second forming space 532 'to form the molding base 23' with an integrated structure after the forming material is solidified. It should be understood that, when the molding material is solidified in the molding space 530 'to form the molding base 23', the first inner surface 511 'of the upper mold 510' corresponds to the first top surface 2312 'of the first base portion 231' of the molding base 23 ', and the second inner surface 512' of the upper mold 510 'corresponds to the second top surface 2322' of the second base portion 232 'of the molding base 23'. And the first inner surface 511 'of the upper mold 510' is higher than the second inner surface 512 'of the upper mold 520' such that the height of the first base part 231 'is greater than the height of the second base part 232' to form the stepped peripheral groove 230 'at the inner peripheral edge of the molding base 23'.
It should be noted that the first inner surface 511 'and the second inner surface 512' of the upper mold 510 'are parallel to the pressing surface 513' of the upper mold 510 ', and when the pressing surface 513' is pressed on the photosensitive element 212 'in an overlapping manner, the first inner surface 511' and the second inner surface 512 'are parallel to the photosensitive element 212', so that after the molding base 23 'is formed, the first top surface 2312' and the second top surface 2322 'are parallel to the photosensitive element 212', thereby facilitating active alignment in a subsequent assembly process.
Further, as shown in fig. 5A, the forming mold 500 ' further includes a cover film 540 ', wherein the cover film 540 ' is overlapped on the pressing surface 513 ' of the upper mold 510 '. When the pressing surface 513 ' of the upper mold 510 ' presses the photosensitive element 212 ', the cover film 540 ' is located between the pressing surface 513 ' of the upper mold 510 ' and the photosensitive element 212 ', so as to prevent the pressing surface 513 ' of the upper mold 510 ' from scratching the photosensitive element 212 ' or contaminating the photosensitive element 212 '. In addition, the cover film 540 ' can prevent a gap from being generated between the pressing surface 513 ' of the upper mold 510 ' and the photosensitive element 212 ', so as to prevent the molding material from entering between the pressing surface 513 ' of the upper mold 510 ' and the photosensitive element 212 ' to contaminate the photosensitive region 2121 ' of the photosensitive element 212 ' during the molding process. Of course, the cover film 540 ' can also absorb the impact force generated at the moment when the pressing surface 513 ' of the upper mold 510 ' contacts the photosensitive element 212 ' when the upper mold 510 ' and the lower mold 520 ' are closed, so as to prevent the photosensitive element 212 ' from being damaged by the closing of the upper mold 510 ' and the lower mold 520 '.
In another embodiment of the present invention, the cover film 540 ' of the forming mold 500 ' has an annular structure, wherein the cover film 540 ' is disposed at the peripheral edge of the pressing surface 513 ' of the upper mold 510 ', so that after the upper and lower molds 510 ', 520 ' are closed, the cover film 540 ' correspondingly presses the chip inner side portion 21221 ' of the non-photosensitive region 2122 ' of the photosensitive element 212 ', so as to prevent the cover film 540 ' and the pressing surface 513 ' from directly contacting the photosensitive region 2121 ' of the photosensitive element 212 ', and thus the photosensitive region 2121 ' of the photosensitive element 212 ' is not damaged by external pressure.
After the molding material is solidified in the molding space 530 'to form the molding base 23', a semi-finished molded photosensitive assembly is manufactured, as shown in fig. 5B, wherein the semi-finished molded photosensitive assembly includes the imaging assembly 21 'and the molding base 23'. Next, the upper mold 510 ' and the lower mold 520 ' are operated to perform mold drawing to open the forming space 530 ' of the forming mold 500 ' for taking out the molded photosensitive assembly semi-finished product from the forming space 530 '. Then, the filter element 221 ' is attached to the second top surface 2322 ' of the second base portion 232 ' of the molding base 23 ' to form the molded photosensitive assembly 20 '.
Generally, for better drawing operation, the inner peripheral surface of the mold base 23 'has a certain inclination angle with respect to the photosensitive surface of the photosensitive element 212'. In other words, as shown in fig. 3 and 5A, the first inner peripheral surface 2311 'of the first base portion 231' has a first predetermined inclination angle θ with respect to the light sensing surface of the light sensing element 2121And the second inner peripheral surface 2321 'of the second base portion 232' also has a second predetermined inclination angle θ with respect to the light-sensing surface of the light-sensing element 2122And the width of the first top surface 2312 'of the first base part 231' is smaller than the width of the first bottom surface 2313 'of the first base part 231', and the width of the second top surface 2322 'of the second base part 232' is smaller than the width of the second bottom surface 2323 'of the second base part 232'.
However, in order to make the filter element 221 ' have a wider attachment surface, that is, the second base portion 232 ' has a wider second top surface 2322 ', therefore, the first and second predetermined inclination angles θ1、θ2The smaller the better, even the first and second predetermined inclination angles θ1、θ2May be zero (i.e., the first inner peripheral surface 2311 ' and the second inner peripheral surface 2321 ' may be perpendicular to the light-sensing surface of the light-sensing element 212 ').
Preferably, the first and second predetermined inclination angles θ1、θ2Less than 30 ° to increase the attaching area between the filter element 221 'and the second top surface 2322' of the second base part 232 ', so as to improve the reliability of the adhesion between the filter element 221' and the second base part 232 ', and to prevent the filter element 221' from shifting or falling off.
According to the first preferred embodiment of the present invention, as shown in fig. 5B, the filter assembly 22 'further includes an adhesive layer 222', wherein the adhesive layer 222 'is disposed between the second top surface 2322' of the second base portion 232 'and the filter element 221' to adhere the filter element 221 'and the second base portion 232', so as to fixedly attach the filter element 221 'to the stepped peripheral groove 230' of the molding base 23 'and make the filter element 221' correspond to the light window 2301 'of the molding base 23'.
Specifically, in the embodiment of fig. 5B, a glue is applied to the second top surface 2322 'of the second base portion 232', and then the optical filter 221 'is correspondingly disposed on the second top surface 2322' of the second base portion 232 ', so as to form the adhesive layer 222' between the second top surface 2322 'of the second base portion 232' and the lower surface 2211 'of the optical filter 221' after the glue is cured, so as to fixedly connect the optical filter 221 'and the second base portion 232' of the molding base 23 'through the adhesive layer 222'.
In another embodiment of the present invention, the optical filter element 221 'may be mounted in the first base part 232', the lower surface 2211 'of the optical filter element 221' may be coated with glue, and then the optical filter element 221 'is correspondingly disposed on the second top surface 2322' of the second base part 232 ', so as to form the adhesive layer 222' between the second top surface 2322 'of the second base part 232' and the lower surface 2211 'of the optical filter element 221' after the glue is cured, so as to fixedly connect the optical filter element 221 'and the second base part 232' of the molding base 23 'through the adhesive layer 222'.
It is worth mentioning that the glue used for forming the adhesive layer 222' may be a thermosetting glue or other types of glue. Preferably, the adhesive layer 222 ' may have good elasticity to prevent the filter element 221 ' from being damaged when the camera module 1 ' collides. More preferably, the glue forming the bonding layer 222 ' has a low fluidity so as to prevent the glue from flowing down from the second inner peripheral surface 2321 ' of the second base portion 232 ', thereby ensuring the product yield of the camera module. On one hand, the reflectivity of the solidified glue is greater than that of the module base 23 ', and once the glue flows to the second inner peripheral surface 2321', stray light may be caused to the camera module; on the other hand, if the glue is left in the photosensitive region 2121 'of the photosensitive element 212', the photosensitive region 2121 'of the photosensitive element 212' will be contaminated.
In addition, as shown in fig. 5B, a mounting gap 2302 'is reserved between the filter element 221' and the first inner peripheral surface 2311 'of the first base portion 231', that is, the lateral dimension of the stepped peripheral groove 230 'of the mold base 23' is larger than that of the filter element 221 ', so as to attach the filter element 221' to the second top surface 2322 'of the second base portion 232'. In this way, since the outer periphery of the filter element 221 ' is not in direct contact with the first base portion 231 ', but the safety gap 2302 ' is reserved, the first base portion 231 ' of the mold base 23 ' can be effectively prevented from transmitting the stress to the filter element 221 ', so as to prevent the filter element 221 ' from being damaged. Of course, the lateral dimension of the filter element 221 ' is smaller than the lateral dimension of the stepped peripheral groove 230 ' of the mold base 23 ', which also facilitates the installation of the filter element 221 ' into the stepped peripheral groove 230 '.
Preferably, as shown in fig. 5B, the adhesive layer 222 'has at least one air escape hole 2221', wherein the air escape hole 2221 'extends from the inner side of the adhesive layer 222' to the outer side of the adhesive layer 222 'to communicate the inner space of the adhesive layer 222' with the safety gap 2302 'through the air escape hole 2221', and further communicate the inner space of the molded photosensitive assembly 20 'with the outer space of the molded photosensitive assembly 20', so as to allow the air between the filter element 221 'and the photosensitive element 212' to escape to the outside through the air escape hole 2221 'when the filter element 221' is mounted to the stepped peripheral groove 230 'of the mold base 23', so as to prevent the mounting of the filter element 221 from being affected.
In other words, the glue is applied on the second top surface 2322 'of the second base portion 232' in a glue-breaking manner, so as to form the adhesive layer 222 'with the air escape holes 2221' after the glue is cured. That is, a ring of the glue is not applied on the second top surface 2322 'of the second base part 232', but the glue is applied intermittently to reserve at least one notch, so that the air escape holes 2221 'are formed on the adhesive layer 222' after the glue is cured.
In fig. 3 and 5B, the optical lens 10 ' is assembled to the driver 30 ', and the driver 30 ' is assembled to the first top surface 2312 ' of the first base portion 231 ' of the mold base 23 ', so that the optical lens 10 ' is maintained in the photosensitive path of the photosensitive element 212 ', thereby forming the camera module 1 '.
Fig. 6A shows a first variant embodiment of the camera module 1 ', in which the camera module 1 ' is implemented as a fixed-focus camera module, i.e. the drive 30 ' may be absent in this embodiment of the camera module according to the invention. Specifically, the camera module 1 'includes at least one lens barrel 40', wherein the lens barrel 40 'integrally extends from the first top surface 2312' of the first base portion 231 'of the molding base 23', and each optical lens 10 'is respectively assembled to each lens barrel 40', so that each optical lens 10 'is retained in the photosensitive path of each photosensitive element 212' of the molding photosensitive element 20 'by each lens barrel 40'. That is, in this embodiment of the camera module of the present invention, the lens barrel 40 'and the mold base 23' may be integrally cured and molded by the molding material through a molding process, thereby enhancing stability and reliability of the camera module.
Fig. 6B shows a second variant embodiment of the camera module 1 ', wherein after the molding base 23' is formed by the solidification of the molding material through the molding process, the separately manufactured lens barrel 40 'is assembled to the first top surface 2312' of the first base portion 231 'of the module base 23', wherein the optical lens 10 'is assembled to the lens barrel 40', so that the optical lens 10 'is held in the photosensitive path of the photosensitive element 212' of the molded photosensitive element 20 'by the lens barrel 40'. In addition, during the process of assembling the lens barrel 40 ' to the first top surface 2312 ' of the first base portion 231 ' of the mold base 23 ', the angle at which the lens barrel 40 ' is assembled to the first top surface 2312 ' of the first base portion 231 ' of the mold base 23 ' can be adjusted by a calibration device, so that the optical axis of the optical lens 10 ' can be perpendicular to the light sensing surface of the light sensing element 212 ', thereby ensuring the imaging quality of the camera module 1 '. It is understood that the lens barrel 40 'may be separately fabricated, such that the lens barrel 40' may or may not be threaded, as the present invention is not limited in this respect.
Fig. 6C shows a third variant of the camera module 1 ', in which the leads 213 ' are connected to the circuit board 211 ' and the photosensitive element 212 ' by a "flip-chip" process during the mounting of the photosensitive element 212 '. In this way, the height of the wire 213 ' protruding upward may not exceed the height of the chip connector 2123 ' of the light sensing element 212 ', that is, the wire arc height of the wire 213 ' is reduced, so as to reduce the height of the second base portion 232 ' of the molding base 23 ', thereby increasing the height difference between the first top surface 2311 ' of the first base portion 231 ' and the second top surface 2321 ' of the second base portion 232 ', so that the upper surface 2212 ' of the filter element 221 ' is flush with the first top surface 2312 ' of the first base portion 231 ', even the upper surface 2212 of the filter element 221 ' is lower than the first top surface 2312 ' of the first base portion 231 ', so as to prevent the filter element 221 ' from being bumped when the optical lens 10 ' moves.
It should be mentioned that, the utility model relates to a "reverse beating" technology means that the lead 213 'is conducting the photosensitive element 212' with the in-process of circuit board 211 ', the routing mode of lead 213' is followed circuit board 211 'extremely photosensitive element 212'. Specifically, by disposing the circuit board connector 2113 'on the circuit board 211', a wire bonding tool is first wire bonded to the top end of the circuit board connector 2113 'to form the circuit board connection end connected to the lead 213' of the circuit board connector 2113 ', and then lifted to a predetermined position, and then translated toward the circuit board connector 2113' and formed at the top end of the chip connector 2123 'to form the chip connection end connected to the lead 213' of the chip connector 2123 ', so that the lead 213' extends in a curved shape, in such a way that the height of the upward protrusion of the lead 213 'can be substantially equal to the height of the chip connector 2123', and even the height of the upward protrusion of the lead 213 'can be lower than the height of the chip connector 2123'.
Fig. 6D shows a fourth modified embodiment of the image pickup module 1 ', wherein the second base portion 232 ' of the mold base 23 ' is further provided with a glue groove 2324 ', and the glue groove 2324 ' is formed by recessing the second top surface 2322 ' of the second base portion 232 ', wherein the glue can be applied into the glue groove 2324 ' of the second base portion 232 ', and the glue is protruded from the second top surface 2322 ' of the second base portion 232 ', so that after the optical filter 221 ' is correspondingly disposed on the imaging assembly 21 ', the adhesive layer 222 ' formed by curing the glue can be overlappingly disposed on the lower surface 2211 ' of the optical filter 221 ', thereby ensuring that the optical filter 221 ' is stably disposed in the stepped peripheral groove 230 ' of the mold base 23 ', and prevents the glue from flowing to the second inner peripheral surface 2321 ' of the second base portion 232 ' of the mold base 23 '.
Fig. 6E shows a fifth variant embodiment of the camera module 1 ', wherein the filter member 22' further comprises at least one annular support 223 ', wherein the filter element 221' is assembled to the support 223 ', and the support 223' is disposed on the first base portion 231 'of the mold base 23', so as to correspondingly dispose the filter element 221 'on the stepped peripheral groove 230' of the mold base 23 'via the support 223'.
Specifically, the upper surface 2212 ' of the filter element 221 ' is fixedly attached to the lower side of the support member 223 ' by the adhesive layer 222 ', so that the upper surface 2212 ' of the filter element 221 ' is positioned below the first top surface 2312 ' when the support member 223 ' is attached to the first top surface 2312 ' of the first base portion 231 ' of the mold base 23 '. By this attaching manner, the attaching width or the attaching area between the filter element 221 ' and the holder 223 ' can be increased to enhance the adhesive strength between the filter element 221 ' and the holder 223 ' to prevent the filter element 221 ' from being damaged by an impact. In addition, the driver 30 'of the camera module 1' is also attached to the first top surface 2312 'of the first base portion 231' of the mold base 23 ', and the support member 223' is located inside the driver 30 ', so that the overall height of the camera mold 1' is not increased.
It is worth mentioning that the supporting member 223' may be made of a material having a certain toughness, such as plastic, metal, etc. Since the support member 223 ' is made of a material having higher toughness than the material of the mold base 23 ', the filter element 221 ' is not easily separated from the mold base 23 ', so as to reduce the risk of breakage of the filter element 221 '.
Fig. 6F shows a sixth modified embodiment of the camera module 1 ', wherein the support piece 223 ' of the filter member 22 ' is disposed between the driver 30 ' and the first top surface 2312 ' of the first base part 231 ', that is, the support piece 223 ' is attached to the first top surface 2312 ' of the first base part 231 ', and the driver 30 ' is attached to the support piece 223 ' to correspondingly dispose the filter element 221 ' in the stepped peripheral groove 230 ' of the molding base 23 ' through the support piece 223 '.
It should be understood that although the height of the camera module 1 ' is increased by the thickness of the support member 223 ' in this modified embodiment, the height of the camera module 1 ' in this modified embodiment of the present invention is still reduced compared to the camera module of the prior art because the thickness of the support member 223 ' is smaller than the thickness of the filter element 221 '. In addition, since the contact area between the holder 223 'and the mold base 23' is greatly increased, the filter element 221 'can be more firmly mounted to the mold base 23' by the holder 223 ', so that the filter element 221' is prevented from being damaged by collision.
Fig. 6G shows a seventh variant embodiment of the camera module 1 ', wherein the chip mounting region 2111 ' of the circuit board 211 ' of the imaging assembly 21 ' of the molded photosensitive assembly 20 ' is sunk to form a chip mounting groove 2114 ' at the chip mounting region 2111 ' of the circuit board 211 ', wherein the photosensitive element 212 ' is correspondingly disposed in the chip mounting groove 2114 ' of the circuit board 211 ' to lower the height of the photosensitive surface of the photosensitive element 212 ', so that the height of the second base portion 232 ' of the molded base 23 ' is further lowered, thereby making the upper surface 2212 ' of the filter element 221 ' flush with the first top surface 2312 of the first base portion 231 ', and even making the upper surface 2212 ' of the filter element 221 ' lower than the first top surface 2312, 2312 ' of the first base portion 231 '. So as to prevent the optical lens 10 'from impacting the filter element 221' when moving.
In other words, the chip mounting groove 2114 'of the circuit board 211' is recessed downward from the upper side of the circuit board 211 'to form a recess in the chip mounting region 2111' of the circuit board 211 ', wherein the photosensitive element 212' is mounted in the recess to reduce the height of the photosensitive surface of the photosensitive element 212 ', thereby further reducing the height of the wire loop of the lead wire 213', which is helpful to reduce the height of the second base portion 232 'of the mold base 23'.
Fig. 6H shows an eighth modified embodiment of the camera module 1 ', wherein the circuit board 211' of the imaging assembly 21 'of the molded photosensitive assembly 20' is further provided with a through-hole type chip mounting groove 2114 ', wherein the chip mounting groove 2114' extends downward from the upper side of the circuit board 211 'to the lower side of the circuit board 211' to form a through-hole in the chip mounting region 2111 'of the circuit board 211', wherein the photosensitive element 212 'is correspondingly disposed in the through-hole to make the photosensitive surface of the photosensitive element 212' lower than the upper side of the circuit board 211 ', so as to reduce the height of the wire arc of the lead 213' to the maximum extent to reduce the height of the second base portion 232 'of the molded base 23'.
Referring to fig. 7A to 7D of the drawings, according to another aspect of the present invention, the first preferred embodiment of the present invention further provides a method for manufacturing a molded photosensitive assembly and a method for manufacturing a camera module. As shown in fig. 7A, the method of manufacturing the molded photosensitive member includes the steps of:
s1: mounting a photosensitive element 212 'and at least one group of electronic components 214' on a circuit board 211 ', and conducting the photosensitive element 212' and the circuit board 211 'to assemble an imaging assembly 21';
s2: forming a molding base 23 'having a stepped peripheral groove 230' for covering a portion of the circuit board 211 'and a portion of the photosensitive element 212' by a molding process to form a light window 2301 'through the stepped peripheral groove 230', wherein a photosensitive region 2121 'of the photosensitive element 212' corresponds to the light window 2301 'of the molding base 23' to form a molded photosensitive element semi-finished product having an integral structure; and
s3: correspondingly disposing a filter element 221 'of a filter assembly 22' in the stepped peripheral groove 230 'of the molding base 23' of the semi-finished product of the molded photosensitive assembly to assemble a molded photosensitive assembly 20 ', wherein the photosensitive region 2121' of the photosensitive element 212 'corresponds to the filter element 221'.
Note that, in an embodiment of the present invention, as shown in fig. 7B, the step S1 includes the steps of:
s11: a chip mounting region 2111 ' for mounting the photosensitive element 212 ' on the circuit board 211 ';
s12: a circuit board outer side portion 21123 'mounting each of the electronic components 214' on an edge region 2112 'of the circuit board 211'; and
s13: by a gold wire bonding process, a lead 213 ' is extended from a chip connector 2123 ' of the photosensitive element 212 ' to a circuit board connector 2113 ' of the circuit board 211 ' to conductively connect the photosensitive element 212 ' and the circuit board 21 '.
In another variant embodiment of the present invention, said step S1 further includes a step S13': by a reverse driving process, a lead 213 ' is extended from a circuit board connector 2113 ' of the circuit board 211 ' to a chip connector 2123 ' of the photosensitive element 212 ' to conductively connect the photosensitive element 212 ' and the circuit board 21 '.
Further, as shown in fig. 7C, the step S2 includes the steps of:
s21: placing the imaging assembly 21 'in a forming mold 500';
s22: performing a mold closing operation on an upper mold 510 ' and a lower mold 520 ' of the molding mold 500 ', forming a molding space 530 ' of the molding mold 500 ' between the upper mold 510 ' and the lower mold 520 ';
s23: adding a molding material into the molding space 103 'of the molding die 500' to form the molding base 23 'having the stepped peripheral groove 230' after the molding material is solidified; and
s24: and performing a die drawing operation on the forming die 500' to obtain the semi-finished product of the molded photosensitive assembly.
More specifically, the step S22 includes the steps of:
disposing a cover film 540 ' on a pressing surface 513 ' of the upper mold 510 ';
pressing the photosensitive element 212 'of the imaging assembly 21' by the cover film 540 'to locate the cover film 540' between the pressing surface 513 'and the photosensitive element 212';
a first forming space 531 ' forming the forming space 530 ' between a first inner surface 511 ' of the upper mold 510 ' and a circuit board outer side portion 21123 ' of the edge region 2112 ' of the circuit board 211 '; and
a second forming space 532 'of the forming space 530' is formed between a second inner surface 512 'of the upper mold 510', a circuit board connecting portion 21122 'and a circuit board inner side portion 21121' of the edge region 2112 'of the circuit board 211', and a chip outer side portion 21223 'and a chip connecting portion 21222' of a non-photosensitive region 2122 'of the photosensitive element 212', wherein the first inner surface 511 'of the upper mold 510' is above the second inner surface 512 'of the upper mold 510'.
Further, the step S23 includes the steps of:
adding the molding material to the first molding space 531 'to form a first base portion 231' of the molding base 23 'for covering the circuit board outer side portion 21123' of the marginal area 2112 'of the circuit board 211' after the molding material is cured; and
the molding material is added to the second molding space 532 ', so as to form the circuit board connecting portion 21122 ' and the circuit board inner side portion 21121 ' for covering the peripheral region 2112 ' of the circuit board 211 ' and the chip outer side portion 21223 ' and the chip connecting portion 21222 ' of the non-photosensitive region 2122 ' of the photosensitive element 212 ' after the molding material is cured, wherein the height of the second base portion 232 ' is lower than that of the first base portion 231 '.
In the first preferred embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:
s31: applying a glue to a second top surface 2322 ' of said second base portion 232 ' of said mold base 23 ';
s32: disposing the filter element 221 ' on the second top surface 2322 ' of the second base portion 232 ' correspondingly; and
s33: after the glue is cured, an adhesive layer 222 'of the filter assembly 22' between a lower surface 2211 'of the filter element 221' and the second top surface 2322 'of the second base portion 232' is formed.
In a modified embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:
s31': applying a glue to a lower surface 2211 'of the filter element 221';
s32': disposing the filter element 221 ' on a second top surface 2322 ' of the second base portion 232 ' correspondingly; and
s33': after the glue is cured, an adhesive layer 222 'of the filter assembly 22' between the lower surface 2211 'of the filter element 221' and the second top surface 2322 'of the second base portion 232' is formed.
In another modified embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:
s31': applying a glue to an annular support 223 'of the filter assembly 22';
s32': correspondingly arranging the filter element 221 ' on the support 223 ' to form an adhesive layer 222 ' of the filter assembly 22 ' between an upper surface 2212 ' of the filter element 221 ' and the support 223 ' after the glue is cured; and
s33': the supporting member 223 'is correspondingly disposed on a first top surface 2312' of the first base portion 231 'such that the filter element 221' is located in the stepped peripheral groove 230 'of the molding base 23'.
As shown in fig. 8, the method for manufacturing the camera module includes the steps of:
(a) mounting a photosensitive element 212 'and at least one group of electronic components 214' on a circuit board 211 ', and conducting the photosensitive element 212' and the circuit board 211 'to assemble an imaging assembly 21';
(b) forming a molding base 23 ' having a stepped peripheral groove 230 ' for covering a portion of the circuit board 211 ' and a portion of the photosensitive element 212 ' by a molding process to define an optical window 2301 ' on the molding base 23 ' through the stepped peripheral groove 230 ', wherein a photosensitive region 2121 ' of the photosensitive element 212 ' corresponds to the optical window 2301 ' of the molding base 23 ' to form a molded photosensitive element semi-finished product having an integral structure;
(c) correspondingly disposing a filter element 221 'of a filter assembly 22' in the stepped peripheral groove 230 'of the molding base 23' of the semi-finished product of the molded photosensitive assembly to assemble a molded photosensitive assembly 20 ', wherein the photosensitive region 2121' of the photosensitive element 212 'corresponds to the filter element 221'; and
(d) correspondingly disposing an optical lens 10 'in a photosensitive path of the imaging component 21' of the molded photosensitive component 20 'to form a camera module 1'.
Referring to fig. 9 to 11 of the drawings accompanying the present application, a camera module and a molded photosensitive assembly according to a second preferred embodiment of the present invention and a method of manufacturing the same are illustrated. Compare in according to the above-mentioned first preferred embodiment of the present invention, according to the present invention the difference of the camera module 1' a of the second preferred embodiment lies in: as shown in fig. 9, a molding base 23 'a of a molding photosensitive component 20' a of the camera module 1 'a only covers the circuit board outer side portion 21123' of the edge region 2112 'of the circuit board 211', but does not cover other portions of the edge region 2112 'of the circuit board 211' and the non-photosensitive region 2122 'of the photosensitive element 212'. In other words, the first base portion 231 'a and the second base portion 232' a of the molding base 23 'a are wrapped around the circuit board outer portion 21123' of the rim region 2112 'of the circuit board 211', and the first base portion 231 'a wraps each electronic component 214', while the second base portion 232 'a wraps neither the electronic component 214' nor each lead 213 ', so that a safety gap reserved between the second base portion 232' a and the lead 213 'can be further reduced, so as to further reduce the height of the second base portion 232' a.
It should be noted that, since the circuit board connector 2113 'and the chip mounting region 2111' of the circuit board 211 'are exposed outside the mold base 23' a, the mold base 23 'a may be formed on the circuit board 211' by a molding process, the photosensitive element 212 'may be mounted on the circuit board 211', and finally the circuit board 211 'and the photosensitive element 212' may be turned on.
Illustratively, as shown in fig. 10A and 10B, the circuit board 211 ' is placed into a forming mold 500 ' a, so as to perform a molding process by the forming mold 500 ' a, thereby forming the molding base 23 ' a having the stepped peripheral groove 230 ', and the circuit board outer side portion 21123 ' of the edge region 2112 ' of the circuit board 211 ' is covered by the molding base 23 ' a.
Specifically, the molding module 500 ' a includes an upper mold 510 ' a and a lower mold 520 ' a, wherein at least one of the upper and lower molds 510 ' a, 520 ' a can be moved to enable the closing and drawing operations of the upper mold 510 ' a and the lower mold 520 ' a, and a molding space 530 ' a is formed between the upper mold 510 ' a and the lower mold 520 ' a when the molding mold 500 ' a is in the closed state, wherein the module base 23 ' a is formed by a molding material introduced into the molding space 530 ' a and cured.
More specifically, the upper mold 510 ' a has a first inner surface 511 ' a, a second inner surface 512 ' a, and a pressing surface 513 ' a, wherein the second inner surface 512 ' a is located around the first inner surface 511 ' a, and the second inner surface 512 ' a is located between the first inner surface 511 ' a and the pressing surface 513 ' a, wherein the second inner surface 512 ' a is lower than the first inner surface 511 ' a, and the pressing surface 513 ' a is lower than the second inner surface 512 ' a.
In fig. 10A, after the circuit board 211 ' is placed in the upper mold 510 ' a and/or the lower mold 520 ' a, the upper mold 510 ' a and the lower mold 520 ' a are operated to close the molds, so that the circuit board 211 ' is located in the molding space 530 ' a formed between the upper mold 510 ' a and the lower mold 520 ' a. At this time, the first inner surface 511 ' a of the upper mold 510 ' a corresponds to the circuit board outer side portion 21123 ' of the marginal area 2112 ' of the circuit board 211 ' to form a first molding space 531 ' a between the first inner surface 511 ' a and the circuit board outer side portion 21123 ' of the circuit board 211 ', and to form the first base portion 231 ' a after the molding material is added to the first molding space 531 ' a and solidified; the second inner surface 512 ' a of the upper mold 510 ' a also corresponds to the circuit board outer side 21123 ' of the rim area 2112 ' of the circuit board 211 ', so as to form a second molding space 532 ' a between the second inner surface 512 ' a and the circuit board outer side 21123 ' of the circuit board 211 ', and form the second base portion 232 ' a after the molding material is added into the second molding space 532 ' a and solidified; the pressing surface 513 'a of the upper mold 510' a presses the chip mounting region 2111 'of the circuit board 211', and the circuit board inner side portion 21121 'and the circuit board connecting portion 21122' of the edge region 2112 ', and since the chip mounting region 2111' is located in the middle of the circuit board 211 ', the circuit board 211' can be pressed flat by the pressing surface 513 'a, so that the overall flatness of the circuit board 211' is ensured, that is, a flat molding base surface is provided for the molding process.
As shown in fig. 10B, after the molding material is solidified in the molding space 530 ' a to form the molding base 23 ' a, a molded photosensitive assembly semi-finished product having an integrated structure is manufactured, wherein the molded photosensitive assembly semi-finished product includes the circuit board 211 ' of the imaging assembly 21 ' and the molding base 23 '. Next, the upper mold 510 ' and the lower mold 520 ' are operated to perform mold drawing to open the forming space 530 ' of the forming mold 500 ' for taking out the molded photosensitive assembly semi-finished product from the forming space 530 '. Then, the photosensitive element 212 ' is attached to the chip attachment region 2111 ' of the circuit board 211 ', and the photosensitive element 21 ' and the circuit board 211 ' are electrically connected. Finally, the filter element 221 ' is attached to the second top surface 2322 ' of the second base portion 232 ' a of the molding base 23 ' a to form the molded photosensitive assembly 20 ' a.
It should be noted that, in the second preferred embodiment of the present invention, except for the above structure difference, other structures of the camera module 1 'a are the same as the structure of the camera module 1' according to the first preferred embodiment of the present invention, and the camera module 1 'a also has the similar or same modified embodiments as the various modified embodiments of the camera module 1' according to the first preferred embodiment, and the description thereof is omitted.
According to another aspect of the present invention, the second preferred embodiment of the present invention further provides a method for manufacturing a molded photosensitive assembly. As shown in FIG. 11, the method of manufacturing the molded photosensitive member 20' A includes the steps of:
(A) forming a molding base 23 ' a having a stepped peripheral groove 230 ' for covering an outer side 21123 ' of a circuit board of an edge region 2112 ' of a circuit board 211 ' by a molding process to form a light window 2301 ' through the stepped peripheral groove 230 ', wherein a light sensing region 2121 ' of the light sensing element 212 ' corresponds to the light window 2301 ' of the molding base 23 ' a to manufacture a molded light sensing element semi-finished product having an integral structure;
(B) mounting a photosensitive element 212 ' in a chip mounting region 2111 ' of the circuit board 211 ', and conducting the photosensitive element 212 ' and the circuit board 211 '; and
(C) a filter element 221 'of a filter assembly 22' is correspondingly disposed in the stepped peripheral groove 230 'of the mold base 23' a to assemble a molded photosensitive assembly 20 'a, wherein the photosensitive region 2121' of the photosensitive element 212 'corresponds to the filter element 221'.
Further, before the step (a), the method further comprises the steps of: at least one set of electronic components 214 'is mounted on the circuit board outer side portion 21123' of the edge region 2112 'of the circuit board 211'.
Referring to fig. 12, according to another aspect of the present invention, the present invention further provides an electronic device 600 ', wherein the electronic device 600' includes an electronic device body 610 'and at least one camera module 1', 1 'a, wherein each camera module 1', 1 'a is respectively disposed on the electronic device body 610' for obtaining images. It should be noted that the type of the electronic device body 610 'is not limited, for example, the electronic device body 610' may be any electronic device capable of being configured with the camera module, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and the like. It will be understood by those skilled in the art that although fig. 12 illustrates the electronic device body 610' as a smart phone, it does not limit the scope and content of the present invention.
The utility model provides a camera module, as shown in fig. 14 to 33C, it is small-size and is fit for being installed in an intelligent equipment for acquireing the image. The third embodiment of the present invention is shown in fig. 14 to 23, and the camera module includes an optical assembly 10, a filter 20 and a molded photosensitive assembly 30. The thickness of the camera module is dependent on the height of the optical assembly 10 and the thickness of the molded photosensitive assembly 30. The molded photosensitive member 30 is capable of receiving the image light transmitted from the optical member 10 through the optical filter 20. After the imaging light is shaped by the optical assembly 10 and filtered by the filter 20, a photosensitive sheet 33 molded in the molded photosensitive assembly 30 obtains a high quality resource for imaging. The optical assembly 10 includes a lens, a motor lens, and so on.
The position of the filter 20 mounted on the molding photosensitive member 30 is lower than the position of the molding photosensitive member 30 mounted on the optical member 10, as shown in fig. 14 to 16, so that the distance between the filter 20 and the molding photosensitive member 30 and the distance between the filter 20 and the optical member 10 are both maintained, while less stray light is conducted to the center of the molding photosensitive member 30. In the preferred embodiment, the filter 20 is fixed to the molded photosensitive assembly 30 by a filter glue 220. And the optical assembly 10 is fixed to the molded photosensitive assembly 30 by a lens paste 110. It is worth mentioning that the filter glue 220 and the lens glue 110 are on different stages of the molded photosensitive assembly 30, so that the lens glue 110 and the filter glue 220 keep a certain distance without an opportunity to cover the filter 20.
Further, in the preferred embodiment, the photosensitive sheet 33 is preferably fixed to the bottom of the molding photosensitive assembly 30, and the optical assembly 10 is attached to the top of the molding photosensitive assembly 30; and the optical filter 20 is attached between the optical assembly 10 and the photosensitive drum 33 to provide a stable supporting force to the optical assembly 10 and the optical filter 20 by the molded photosensitive assembly 30.
The optical assembly 10 includes a lens barrel 11 and a plurality of lenses 12 mounted in the lens barrel 11. And the lens barrel 11 includes a leg 111 supporting the lens 12 away from the filter 20. The legs 111 of the lens barrel 11 are fixed to the molding photosensitive assembly 30 to support the lens 12 at a distance from the filter 20 and the photosensitive sheet 33 to transmit the imaging light as required.
The optical filter 20 includes an optical filter portion 21 for filtering image forming light and an edge portion 22 extending outward from the optical filter portion 21, wherein the edge portion 22 is supported on the molded photosensitive member 30 such that the optical filter portion 21 corresponds to the photosensitive sheet 22, and it is noted that the optical filter 220 is between the edge portion 22 and the molded photosensitive member 30 without covering the optical filter portion 21 and the photosensitive sheet 33 of the molded photosensitive member 30. And the edge portion 22 of the filter 20 is directly supported to the molded photosensitive member 30 without an additional supporting member. In particular, in an example of the present invention, the edge portion 22 integrally extends outward from the optical filter portion 21, and the edge portion 22 is located around the optical filter portion 21, so that the optical filter 20 is implemented as an integral element so as to be fixed in the supporting cavity 300 of the molded photosensitive assembly 30.
Specifically, the molded photosensitive assembly 30 further includes a main body 31, some electronic devices 32, and a circuit board 35. The photosensitive sheet 33 is electrically connected to the electronic device 32 through the circuit board 35. The main body 31 covers the electronic device 32 on the circuit board 35 and forms the support chamber 300 to support the optical filter 20 and the optical module 10 at a distance. In other words, the main body 31 covers the electronic device 32 and a portion of the circuit board 35, wherein the photosensitive web 33 is surrounded by the bottom of the main body 31 and spaced apart from the optical filter 20.
In the preferred embodiment, the photosensitive web 33 is connected to the circuit board 35 by a set of wires 34. One end of the wiring 34 is fixed to the circuit board 35, and the other end is fixed to the photosensitive web 33. It will be understood by those skilled in the art that the photosensitive web 33 converts light into an image using the electronics 32 of the circuit board 35. The main body 31 partially covers the photosensitive web 35. In other words, the edges of the wiring 34 and the photosensitive web 33 are completely covered and protected inside the main body 31 of the molded photosensitive assembly 30. The photosensitive web 33 is surrounded by the electronic device 32 as shown in fig. 14 to 17, and the edge of the main body 31 covering the electronic device 32 is higher than the inside of the main body 31 covering the wiring 34.
More, the optical assembly 10 is supported on the top of the edge of the main body 31, and the optical assembly 10 is far away from the optical filter 20 and the photosensitive sheet 33, so that the optical filter 20 and the photosensitive sheet 33 are not pressed by the optical assembly 10. Preferably, not only the positions of the electronic device 32, the photosensitive sheet 33 and the optical filter 20 are stabilized by the main body 31, but also the size of the main body 10 and the distance between the main body 10 and the optical filter 20 are designed accordingly for enhancing the stability, reliability and compactness of the camera module, and specific design data of the main body 31 are disclosed in the following paragraphs. It is worth mentioning that the figures only illustrate the positional relationship among the optical assembly 10, the optical filter 20 and the molded photosensitive assembly 30, and are not illustrated strictly in numerical scale.
Further, as shown in fig. 16 and 17, the optical filter portion 21 has an incident surface 211 and an exit surface 212, wherein the incident surface 211 is disposed facing the lens 12 of the optical assembly 10, and the exit surface 212 is disposed facing the photosensitive sheet 33. After the imaging light is shaped by the lens 12 of the optical assembly 10, the imaging light passes through the incident surface 211 and then the exit surface 212 for filtering. Preferably, the optical filter portion 21 is made of an infrared light filtering material. The edge portion 22 has an edge top surface 221, an edge side surface 222, and an edge bottom surface 223. In the preferred embodiment, the edge top surface 221 is coplanar with the incident surface 211, and the edge bottom surface 223 is coplanar with the exit surface 212.
It should be noted that the edge bottom surface 223 of the edge portion 22 of the optical filter 20 is attached to the main body 31 of the molded photosensitive assembly 30 by the optical filter 220, so that the optical filter portion 21 transmits the imaging light in a clean state. And the filter portion 21 and the edge portion 22 do not need to support anything on the incident surface 211 and the edge top surface 221, providing higher reliability to the filter 20.
Specifically, the main body 31 of the molded photosensitive element 30 includes a housing 311 and a short body 312, and the short body 312 integrally extends from the inner side of the housing 311. The containing body 311 and the short body 312 are formed and molded on a connection face 350 of the circuit board 35 to cover the electronic device 32, the wiring 34, and the photosensitive web 33. In the third preferred embodiment, the electronic device 32 is mainly covered by the containing body 311, and the wiring 34 and the photosensitive web 33 are mainly covered by the short body 312. In other preferred embodiments, the electronic device 32 can also be covered by the dwarfing 312.
Specifically, the containing body 311 and the short body 312 have a certain height difference to form a slot inside the main body 31, so that the optical filter 20 is disposed in the slot of the main body 31. In other words, the containing body 311 has a high upper surface 3111 and a high inner side surface 3112, wherein the high upper surface 3111 of the containing body 311 is used for supporting the optical component 10. The short body 312 has a short upper surface 3121 and a short inner side surface 3122, wherein the short upper surface 3121 of the short body 312 is used for supporting the optical filter 30, and wherein the high inner side surface 3112 of the containing body 311 and the short inner side surface 3122 of the short body 312 inwardly form the supporting cavity 300 of the molded photosensitive assembly 30. The distance between the high upper surface 3111 of the containing body 311 and the connection surface 350 of the circuit board 35 is greater than the distance between the short upper surface 3121 of the short body 312 and the connection surface 350 of the circuit board 35, in other words, the high inner side surface 3112 and the short upper surface 3121 are trough-shaped to accommodate the optical filter 20 therein without protruding the optical filter 20 from the high upper surface 3111. It is understood that the containing body 311 further has a high outer surface 3113 to form an outer circumferential surface of the main body 31.
In the preferred embodiment, as shown in fig. 17, the height difference J between the containing body 311 and the short body 312 is greater than 0.1mm, that is, the distance between the high upper surface 3111 and the short upper surface 3121 is greater than 0.1mm to fit the thickness of the optical filter 20 and the optical filter 220. More preferably, the height difference J between the containing body 311 and the short body 312 is greater than or equal to the sum of the thickness of the optical filter 20, the thickness of the optical filter 220 and the margin of 0.04mm (e.g. 0.28mm), so that the thickness of the optical filter 20 is hidden in the main body 31 of the molded photosensitive assembly 30.
In addition, the thickness H of the filter 220 must be considered, which is generally less than 0.03mm, and the thickness of the filter 220 can be reduced appropriately under the condition of ensuring enough adhesive force, and a thermosetting glue is used in the preferred embodiment.
It should be noted that the width C of the short upper surface 3121 of the short body 312 (i.e. the distance from the high inner side surface 3112 to the short inner side surface 3122, or the thickness of the short body 312) is preferably greater than or equal to 0.4mm, so that on the basis of ensuring that the accommodating body 311 and the short body 312 can be shaped in a trough-shaped and L-shaped manner, the value of the width C also ensures that the filter 20 has a sufficient mounting area on the short upper surface 3121 of the short body 312, which allows a certain mounting deviation of the filter 20 without causing adverse effects, and the filter 220 also has a sufficient painting area on the short upper surface 3121, which increases the contact area between the filter 20 and the filter 220, thereby improving the adhesive bonding force.
The filter paste 220 is applied between the edge bottom 223 of the edge portion 22 of the optical filter 20 and the short upper surface 3121 of the short body 312 to connect the edge portion 22 of the optical filter 20 with the short body 312 through the filter paste 220. The filter glue 220 may be implemented as a glue body having a square-like shape, and the size of the filter glue 220 is smaller than that of the lens glue 110.
Preferably, the width of the filter paste 220 between the edge bottom surface 223 and the short upper surface 3121 of the short body 312 has a maximum value, and the width of the filter paste 220 is maximally equal to the width B of the edge portion 22, wherein the width B of the edge portion 22 of the filter 20 is preferably greater than or equal to 0.25mm, so that the filter 20 can be stably supported by the edge portion 22, ensuring a sufficient mounting area of the filter 20 on the short upper surface 3121 of the short body 312, allowing a certain mounting deviation of the filter 20 without adverse effects, and the filter portion 21 being aligned with the photosensitive sheet 33.
More, there is a gap between the side of the filter 20 and the inner side of the containing body 311 of the main body 31. In other words, the optical filter 20 does not contact the containing body 311 of the main body 31, so that the vibration of the optical assembly 10 transmitted through the main body 31 can be attenuated. In addition, since the gap between the side of the filter 20 and the inner side of the containing body 311 of the main body 31 can contain the excessive lens glue 110 and make the lens glue 110 away from the incident surface 211 of the filter 21, it can effectively prevent the lens glue 110 from flowing into the incident surface 211 of the filter part 21. Preferably, a distance a between the edge side surface 222 of the edge portion 22 of the optical filter 20 and the high inner side surface 3112 of the containing body 311 is greater than or equal to 0.15mm, which facilitates clearance (i.e., yielding) between the optical filter 20 and the containing body 311.
It should be noted that the lens glue 110 connects the legs 111 of the lens barrel 11 to the upper surface 3111 of the containing body 311 of the main body 31, so that the optical assembly 10 is mainly supported by the containing body 31 to reduce the stress of the photosensitive sheet 33. Preferably, the height K of the containing body 311 is greater than or equal to 0.5mm, so that the containing body 311 covering the electronic device 32 can be effectively molded, and the electronic device 32 can be prevented from being excessively pressed against the legs 111 of the optical assembly 10. Also, just as the filter 20 is supported at the short body 312, the filter 20 does not need to bear the weight and movement of the optical assembly 10 to improve reliability. In particular, the lens barrel 11 is directly on the main body 31, so that the thickness of the camera module is determined by the height of the optical assembly 10 and the thickness of the molded photosensitive assembly 30, which contributes to reducing the thickness of the camera module as a whole.
It should be noted that the size of the capacitor in the electronic device 32 is usually the largest, and therefore the distance D between the capacitor in the electronic device 32 and the edge side 222 of the edge portion 22 of the optical filter 20 is preferably greater than or equal to 0.2mm, so as to prevent interference between the electronic device 32 and a mold, and also to leave enough space between the electronic device 32 and the optical filter 20 for structural design optimization, which is beneficial to forming a complex molding structure between the two and increasing the functions of the molding structure. More preferably, a distance D between each of the electronic devices 32 and the edge side 222 of the edge portion 22 of the optical filter 20 is equal to or greater than 0.25 mm.
In the present preferred embodiment, the containing body 311 and the short body 312 of the main body 30 are each preferably shaped like a square with a chamfer, and the inscribed radius F of the chamfer is 0.3mm or more. It should be noted that the chamfer on the containing body 311 and the short body 312 needs to be kept away from the optical filter 20 (i.e. abducted) to reduce the chance of interference between the chamfer on the containing body 311 and the short body 312 and the optical filter 20. Of course, in other examples of the present invention, the chamfer on the containing body 311 and the short body 312 may be designed according to the chamfer mode of the optical filter 20.
With the photosensitive sheet 33 fixed to the bottom of the short body 312 of the main body 31, the filter 20 can achieve high-quality image formation by keeping a distance between the short body 312 and the photosensitive sheet 33. Preferably, the distance I between the short upper surface 3121 of the short body 312 and the photosensitive sheet 33 is preferably greater than or equal to 0.15mm, and mainly functions to ensure that the portion of the molding structure has a sufficient thickness to block stray light reflected by a lens, an optical filter or other structures, reduce incidence of useless light, improve imaging quality of the photosensitive sheet, and prevent the photosensitive sheet 33 from being damaged due to compression. Meanwhile, the distance I being greater than or equal to 0.15 can also avoid the mold interfering with the wiring 34, which helps to avoid the wiring 34 being exposed. It can be understood that if the back focus of the camera module meets the requirement, the distance I can be increased as much as possible to avoid the black spots caused by the contamination of the optical filter 20. In particular, if the distance I between the short upper surface 3121 of the short body 312 and the photosensitive web 33 is greater than 0.25 mm. A capacitor may be placed under the short body 312 to reduce the size of the camera module in the XY direction.
Therefore, in the preferred embodiment, the main body 31 not only covers the electronic device 32 and the wiring 34 to provide protection, but also provides the supporting cavity 300 to stably support the optical assembly 10 and the optical filter 20, respectively, without excessively pressing the electronic device 32 or the photosensitive sheet 33.
It is worth mentioning that, on one hand, in order to improve the mobile phone screen occupation ratio of smart devices (such as smart phones), people put forward higher and higher requirements on the fitting degree of the side surface of the camera module and the side surface of the smart phone, that is, people want the optical component 10 of the camera module to be closer to the installation shell of the smart phone; on the other hand, in order to provide the smart phone with a good holding touch feeling, the cross section of the mounting housing of the smart phone often has a certain radian (i.e. an arc-shaped outer frame). And the module lateral wall of the module of making a video recording is the parallel and level usually, this just leads to the parallel and level lateral wall of the module of making a video recording can not with smart mobile phone's arc frame agrees with well for have great clearance between the two, greatly limited the laminating degree of the module of making a video recording with smart mobile phone. It can be understood that, although the utility model discloses a module of making a video recording can be through reducing the height of the inclusion body 311 reduces the height of the module of making a video recording, nevertheless be limited to the height of electron device 32 self, the degree of reduction of the height of the inclusion body 311 is limited, consequently the utility model discloses an above-mentioned embodiment the laminating degree of module of making a video recording and smart mobile phone is still relatively poor.
In order to solve the above problem, as shown in fig. 18, the present invention further provides a modified embodiment of the camera module according to the third embodiment of the present invention, wherein the optical assembly 10 of the camera module is eccentrically disposed on the molded photosensitive assembly 30, so that the optical assembly 10 can be further adjacent to a mounting housing 51. That is, when the camera module is fixed to the mounting housing 51, the optical assembly 10 can be biased toward the mounting housing 51 due to the eccentric arrangement, so that the optical assembly 10 can be further close to the mounting housing 51, which helps to further improve the degree of fit between the camera module and the mounting housing 51.
In other words, the optical assembly 10 can be slightly offset from the molded photosensitive assembly 30 to accommodate the mounting housing 51 of the smart device. In other words, at least one side of the legs 111 of the lens 11 slightly protrudes from the high upper surface 3111 of the containing body 311, which not only helps to improve the fit of the camera module with the mounting housing of the smart device, but also has no influence on the stability of the filter 20.
It should be noted that when the camera module is mounted on the top side of the mounting housing 51 of the smart device, the legs 111 of the lens 11 only need to have one side slightly protruding from the upper surface 3111 of the containing body 311; when the camera module is mounted at a corner of the mounting housing 51 of the smart device, the legs 111 of the lens 11 need to have two adjacent sides and protrude outwards from the high upper surface 3111 of the housing 311 so that the camera module can be attached to the corner of the mounting housing 51 of the smart device.
According to another aspect of the present invention, a method of manufacturing the camera module of the present invention is shown in fig. 19A to 20. Specifically, as shown in fig. 19A, the method for manufacturing the camera module includes the steps of:
I. connecting the photosensitive web 33 with the wiring 34 and the electronic device 32 on the circuit board 35;
placing the connected circuit board 35 between an upper mold 41 and a lower mold 42; and
covering the electronic device 32 within the main body 31 and on the circuit board 35, wherein the main body 31 includes the containing body 311 and the short body 312 to form the molded photosensitive assembly 30.
Further, as shown in fig. 19B, the method for manufacturing the camera module further includes the steps of:
mounting the filter 20 on the short upper surface 3121 of the short body 312; and
v. mount the optical assembly 10 on the upper surface 3111 of the containing body 311.
More preferably, in the step III, a short upper surface of the dwarf is lower than a high upper surface of the containing body, and a relative height of the short upper surface of the dwarf is lower than a height of a tallest one of the electronic devices.
In an example of the present invention, the electronic device 32, the wiring 34, and the edge of the photosensitive web 33 are all covered by the main body 31.
Illustratively, as shown in fig. 19A, the step III further includes the steps of:
iii.1 injecting a molding material between the upper mold 41 and the lower mold 42;
iii.2 curing the molding material between the upper mold 41 and the lower mold 42 to form the body 31; and
iii.3 releasing the upper mold 41 and the lower mold 42 from the molded photosensitive member 30.
It is worth mentioning that, as shown in fig. 19A, the angle G between the high inner side face 3112 of the containing body 311 and the short upper surface 3121 of the short body 312 is preferably greater than or equal to 95 ° for the die-drawing operation. More preferably, the angle G between the high inner side surface 3112 and the low upper surface 3121 is also smaller than 100 ° so as to block some stray light while ensuring smooth molding of the molded structure. Furthermore, to ensure proper molding, the fillet radius between the tall medial side 3112 and the short upper surface 3121 is substantially equal to 0.1 mm. In other words, since the angle between the high medial side 3112 of the receptacle 311 and the normal to the low upper surface 3121 may be referred to as the draft angle of the high medial side 3112, the draft angle of the high medial side 3112 of the receptacle 311 is between 5 ° and 10 °.
It is noted that the draft angle of the short inside face 3112 of the short body 312 is preferably embodied between 5 ° and 10 °. In particular, the drawing angle of the outer side surface of the containing body 311 (i.e., the outer side surface of the main body 31) is also implemented between 5 ° and 10 °, which contributes to smooth completion of the drawing operation after molding.
As shown in fig. 20, the step IV further includes the steps of:
iv.1 applying the filter paste 220 to the short upper surface 3121 in a C-shape such that a gap is left between two ends of the filter paste 220;
IV.2, mounting the optical filter 20 on the optical filter glue 220;
IV.3, curing the light filtering glue 220; and
iv.4 filling the gap between the two ends of the filter glue 220 with the filter glue 220 to form the filter glue 220 with a square shape.
More specifically, as shown in fig. 20, in step iv.3, the excess air between the optical filter 20 and the photosensitive sheet 33 can escape from the gap to ensure that the air pressure in the space between the optical assembly 10 and the photosensitive sheet 33 is equal to the atmospheric pressure. Preferably, the length E of the gap is between 0.7 and 1.0mm (i.e. greater than or equal to 0.7mm and less than or equal to 1.0mm), so that a certain gap can be still reserved when the filter glue 220 is attached and pressed by the filter 20, so as to form an air escape hole, and air can be smoothly leaked out of the gap.
It is worth mentioning that the upper mold 41 is shaped like the support cavity 300 such that the support cavity 300 is formed between the main body 31 and the photosensitive web 33 after the upper mold 41 is released.
One possible mode of the preferred embodiment is shown in FIG. 21, in which the molded photosensitive member 30 further includes an upper cover 36. The upper cover 36 is mounted on the high upper surface 3111 of the containing body 311 and extends to cover the edge portion 22 of the optical filter 20, so that the optical filter 20 is held from bottom to top to enhance stability of the optical filter 20. It should be noted that the height of the upper cover 36 is smaller than the thickness of the filter 20, so as to reduce the thickness of the camera module.
Another possible mode of the preferred embodiment is shown in fig. 22, which is different from the above embodiment in that the short body 312 does not cover the wires 34 of the molded photosensitive member 30, so that the thickness of the camera module is lower than that of the above embodiment. This is because the short body 312 can be lower because it is only required to be higher than the wiring 34, rather than completely covering the wiring 34, so that the thickness of the filter 20 can be adapted with the short body 312 and the containing body 311 lower.
Another possible mode of the preferred embodiment is shown in fig. 23. Unlike the above-described embodiment, the photosensitive web 33 is mounted at a position lower than the position of the electronic device 32 mounted on the circuit board 35. For example, the connection face 350 of the circuit board 35 has a recess at the center thereof so that the photosensitive web 33 is mounted in the recess of the circuit board 35. Further, it is reasonable that the thickness of the camera module of this mode is lower than that of the above embodiment because the wiring 34 is lower due to the sunk photosensitive web 33.
It is worth mentioning that a fourth preferred embodiment of the present invention is shown in fig. 24 to 27, and is different from the third embodiment in that the electronic device 32A, the wiring 34A, and the photosensitive web 33A are all mainly covered on the short body 312A. In other words, the short body 312A is higher than at least a portion of the electronic device 32A to completely cover at least a portion of the electronic device 32A inside the main body 31A.
In the preferred embodiment, the filter 20A is mounted on the top of the short body 312A, and the optical assembly 10A is mounted on the top of the containing body 311A. With the electronic device 32A mainly covered on the short body 312A, the electronic device 32A is only stressed by the filter 20A, and does not bear the weight and movement of the optical assembly 10A, so that the electronic device 32A can have a longer life. It is understood that in this embodiment of the present invention, the optical filter 20A is firmly adhered to the short upper surface 3121A of the short body 312A by the optical filter glue 220A; the optical assembly 10A is firmly adhered to the high upper surface 3111A of the containing body 311A through a lens glue 110A to ensure that the relative positions of the optical filter 20A and the optical assembly 10A with respect to the photosensitive sheet 33A remain unchanged.
It should be noted that the heights of the electronic devices 32A of the camera module may be different, and in order to ensure that the height of the short body 312A is not too large, the height of the electronic devices 32A covered in the short body 312A is preferably less than 0.3 mm. In other words, in the present invention, an electronic device with a height smaller than 0.3mm is referred to as a short device 321A in the electronic device 32A, and an electronic device with a height greater than or equal to 0.3mm is referred to as a tall device 322A in the electronic device 32A, then the short device 321A in the electronic device 32A is covered by the short body 312A, and the tall device 322A in the electronic device 32A is covered by the containing body 311A. It is understood that short devices 321A in electronic device 32A of the present invention may all be covered by short body 312A (i.e., all of short devices 321A are disposed within short body 312A in a top-down orientation); alternatively, the short devices 321A in the electronic device 32A may be partially covered by the short body 312A (i.e., a portion of the short devices 321A is disposed within the short body 312A in a top view direction).
More preferably, the periphery of the photosensitive sheet 33A is provided with the wiring 34A or the electronic device 32A (i.e., the short device 321A) covered in the short body 312A, and the wiring 34A and the short device 321A are respectively located on different sides of the photosensitive sheet 33A; that is, the wiring 34A and the electronic device 32A covered in the short body 312A are not provided in this order from the inside to the outside around the photosensitive web 33A. In other words, the short devices 321A in the electronic device 32A may be distributed according to the positions of the wirings 34A, and the photosensitive sheet 33A does not have the wirings 34A on all sides, so the short devices 321A in the electronic device 32A may be preferably placed on one side or both sides of the photosensitive sheet 33A without the wirings 34A, which may reduce the area of the wiring board, the area of the molding in the XY direction, and the area of the camera module. It is to be understood that, since the width of the short device 321A in the electronic device 32A is generally about 0.25mm, which is similar to the thickness of the short body 312A, if it is desired that the short device 321A in the electronic device 32A is integrated into the short body 312A, the short device 321A in the electronic device 32A can be disposed only on the side of the photosensitive web 33A where no wiring is disposed, that is, the short device 321A in the electronic device 32A is not compatible with the position where the wiring 34A is disposed, so that a gold wire cannot be wired (i.e., the wiring 34A cannot be disposed) at the position where the short device 321A is disposed in the short body 312A.
It is to be noted that the high device 322A in the electronic device 32A is preferably disposed on the side of the photosensitive sheet 33A where the wiring 34A is present, so that the containing body 311A on the side of the photosensitive sheet 33A where the wiring 34A is absent does not need to cover the electronic device 32A. That is, the containing body 311A does not have to be kept away from the electronic device 32A, and therefore, the thickness of the containing body 311A is reduced, and the thickness of the short body 312A can be slightly increased. Preferably, the thickness of the containing body 311A is smaller than that of the short body 312A, so that the short body 312A can provide the short upper surface 3121A larger than that of the third preferred embodiment to support the rim portion 22A of the optical filter 20A, so that the optical filter 20A is stably mounted at the short body 312A.
The angle G between the tall medial surface 3112A and the short superior surface 3121A in the preferred embodiment may be greater than or equal to 100 °. In other words, the containing body 311A extends obliquely out of the top of the short body 312A, so that the containing body 311A is well supported and can support the optical assembly 10A without affecting the optical filter 20A. In other words, the angle G is formed in the demolding condition in the manufacturing method, and the short inner side surface 3122A and the photosensitive web 33A are also inclined, similarly to the angle G, so as to provide a stable supporting force.
In the preferred embodiment, the containing body 311A is designed to support the optical assembly 10A. Preferably, as shown in fig. 27, the high upper surface 3111A of the containing body 311A is asymmetric on four sides, that is, the thickness of the containing body 311A on four sides of the high upper surface 3111A is different, so that the optical assembly 10A protrudes from the containing body 311A from a portion with smaller thickness to the outside of the containing body 311A, which helps to improve the adhesion between the camera module and the mounting housing 51 of the smart device. In other words, in order to adapt to the mounting housing 51 of the smart device, the thickness of the portion of the containing body 311A adjacent to the mounting housing 51 is small, so that the optical assembly 10A is slightly misaligned with the molded photosensitive assembly 30A, i.e., the optical assembly 10A is biased toward the mounting housing 51, so as to improve the fit between the camera module and the mounting housing 51 of the smart device. Compared to the third embodiment in fig. 18, since the containing body 311A does not need to consider the electronic device 32A, the height of the containing body 311A can be reduced so that the leg 111A of the optical component 10A is supported on the high upper surface 3111A at a lower position; at the same time, the thickness of the containing body 311A can be further reduced so that the optical component 10A is further close to the mounting case 51 of the smart device.
According to another aspect of the present invention, the above fourth embodiment of the present invention further provides a method for manufacturing a camera module, including the steps of:
i connecting a photosensitive web 33A with some of the wirings 34A and some of the electronic devices 32A on a circuit board 35A;
II placing the connected circuit board 35A between an upper mold and a lower mold; and
III covering the electronic device 32A in a main body 31A and on the circuit board 35A to form a molded photosensitive assembly 30A, wherein the main body 31A includes a containing body 311A and a lower body 312A having a height lower than the containing body 311A, and at least a portion of the electronic device 32A is covered under the lower body 312A.
Further, the method for manufacturing the camera module further comprises the following steps:
IV installing a filter 20A on the short upper surface 3121A of the short body 312A; and
v mounts an optical element 10A in the containing body 311A.
In an example of the present invention, electronic device 32A includes at least one short device 321A, wherein at least a portion of short device 321 is covered under short upper surface 3121A of short body 312A, and the height of each short device 321 is less than 0.3 mm.
In an example of the present invention, the wiring 34A is covered with the short body 312A, wherein the wiring 34A and the short device 321A are both disposed around the photosensitive sheet 33A, and the wiring 34A and the short device 321A are respectively located on different sides of the photosensitive sheet 33A.
In an example of the present invention, the thickness of at least one side of the containing body 311A is smaller than the thickness of the short body 312A, so that the optical component 10A protrudes outward from the at least one side of the containing body 311A to the molded photosensitive component 30A.
In an example of the present invention, the electronic device 32A further includes at least one high device 322A, wherein the high device 322A is covered under the containing body 311A, and the height of each high device 322A is greater than or equal to 0.3 mm.
In an example of the present invention, the tall device 322A and the wiring 34A are located on the same side of the photosensitive web 33A.
In an example of the present invention, an angle between the high inner side surface 3112A of the containing body 311A and the short upper surface 3121A of the short body 312A is greater than or equal to 100 °.
It is worth mentioning that, for the product structure based on IOM, although in order to improve the fitting degree of the camera module and the mounting housing of the smart device, the present invention may be designed as shown in fig. 18 (or fig. 27), to eccentrically dispose the optical component 10 (or 10A) of the camera module on the molding photosensitive component 30 (or 30A), so that at least one side of the optical component 10 (or 10A) protrudes outward from the main body 31 (or 31A) of the molding photosensitive component 30 (or 30A); however, optical alignment needs to be maintained between the lens in the optical assembly 10 (or 10A) and the photosensitive drum 33 (or 33A) in the molded photosensitive assembly 30 (or 30A), and therefore, it is only considered to reduce the thickness of the containing body 311 (or 311A) of the main body 31 (or 31A) on the respective sides. However, the thickness reduction of the containing body 311 (or 311A) will cause the width of the lens glue 110 (or 110A) to be narrowed, and once the width of the lens glue 110 (or 110A) is too narrow, not only the adhesion strength between the optical assembly 10 (or 10A) and the molded photosensitive assembly 30 (or 30A) will be insufficient, but also the glue material of the lens glue 110 (or 110A) will be easily infiltrated to contaminate the optical filter 20 (or 20A).
In addition, since a certain assembly space needs to be reserved between the high inner side surface 3112 (or 3112A) of the containing body 311 (or 311A) and the optical filter 20 (or 20A), the adjustable range of the thickness of the containing body 311 (or 311A) becomes very small, so that the thickness of the containing body 311 (or 311A) is difficult to be reduced, which is not beneficial to improving the fitting degree between the camera module and the mounting shell of the smart device. Therefore, in order to solve the above problems, as shown in fig. 28 to 33C, a fifth preferred embodiment of the present invention further provides a camera module, unlike the third and fourth preferred embodiments, the containing body 311B of the main body 31B of the molded photosensitive member 30B has a high upper surface 3111B and a low upper surface 3110B, wherein the height of the containing body 311B at the high upper surface 3111B is greater than the height of the containing body 311B at the low upper surface 3110B, that is, the distance between the upper surface 3111B and the circuit board 35B is greater than the distance between the lower surface 3110B and the circuit board 35B, so that a portion of the optical assembly 10B is supported on the high upper surface 3111B of the containing body 311B, and another portion of the optical assembly 10B is supported on the lower upper surface 3110B of the containing body 311B.
In other words, the containing body 311B of the molded photosensitive element 30B is discontinuous, that is, the upper surface of the containing body 311B is discontinuous and includes the high upper surface 3111B and the low upper surface 3110B lower than the high upper surface 3111B, so that a part of the optical element 10B can be connected with the high upper surface 3111B of the containing body 311B through the lens glue 110B while another part of the optical element 10B can be connected with the low upper surface 3110B of the containing body 311B through the lens glue 110B.
Illustratively, the lens glue 110B of the camera module may include, but is not limited to, a fixing glue layer 1101B and a glue supplement layer 1102B. The fixing adhesive layer 1101B is disposed between the optical assembly 10B and the upper surface 3111B of the containing body 311B, so that the optical assembly 10B is fixedly connected and supported on the upper surface 3111B of the containing body 311B through the fixing adhesive layer 1101B. The adhesive layer 1102B is disposed between the optical element 10B and the lower upper surface 3112B of the containing body 311B, so that the optical element 10B is reinforced and supported by the containing body 311B through the adhesive layer 1102B.
Preferably, the lens paste 110B is applied according to the shape of the high upper surface 3111B of the housing 311B to form the fixing glue layer 1101B matching the shape of the high upper surface 3111B of the housing 311B, thereby maximizing the coupling strength between the optical assembly 10B and the molded photosensitive assembly 30B. Next, after the lens paste 110B is cured to form the fixing paste layer 1101B, a lens paste is applied between the optical component 10B and the lower upper surface 3112B of the containing body 311B to form the paste layer 1102B matching the shape of the lower upper surface 3112B of the containing body 311B, so that the paste layer 1102B not only can reinforce and support the optical component 10B on the containing body 311B, but also can seal the space between the optical component 10B and the molded photosensitive component 30B to prevent external dust from entering and contaminating the optical component 10B and/or the optical filter 20B.
It is noted that, since the low upper surface 3110B of the containing body 311B is lower than the high upper surface 3111B, the gap between the low upper surface 3110B of the containing body 311B and the leg 111B of the optical component 10B is larger than the gap between the high upper surface 3111B of the containing body 311B and the leg 111B, that is, the thickness of the glue compensating layer 1102B between the low upper surface 3110B of the containing body 311B and the optical component 10B is larger than the thickness of the fixing glue layer 1101B between the high upper surface 3111B of the containing body 311B and the optical component 10B, which helps to further reduce the thickness of the containing body 311B at the low upper surface 3110B while ensuring sufficient adhesive strength between the optical component 10B and the molded photosensitive component 30B, make the module of making a video recording with laminating degree between the installation shell of smart machine can improve.
More specifically, in the preferred embodiment, as shown in fig. 29, the upper surface 3111B of the containing body 311B is U-shaped, wherein the lower upper surface 3110B of the containing body 311B is linear, and the lower upper surface 3110B of the containing body 311B extends from a high outer side surface 3113B of the containing body 311B to another high outer side surface 3113B of the containing body 311B (i.e., the length of the lower upper surface 3110B of the containing body 311B is equal to the distance between the two high outer side surfaces 3113B of the containing body 311B, also called the outer dimension of the containing body 311B) to form a U-shaped groove in the main body 31B. In other words, the high upper surface 3111B of the containing body 311B corresponds to three sides of the optical component 10B, and the low upper surface 3110B of the containing body 311B corresponds to one side of the optical component 10B, so that the optical component 10B is supported on the high upper surface 3111B of the containing body 311B on three sides and is supported on the low upper surface 3110B of the containing body 311B on one side. It is understood that the glue layer 1102B on the short upper surface 3121B of the short body 312B is thicker than the fixing glue layer 1101B on the high upper surface 3111B of the containing body 311B to maintain the optical assembly 10B parallel to the optical filter 20B.
Preferably, the fixing glue layer 1101B of the lens glue 110B may be U-shaped to match the high upper surface 3111B of the containing body 311B. The adhesive layer 1102B of the lens adhesive 110B may be linear to match the lower upper surface 3112B of the containing body 312B. Thus, the fixing adhesive layer 1101B and the adhesive supplement layer 1102B are combined to form the lens adhesive 110B having a square structure so as to seal the space between the optical assembly 10B and the molded photosensitive assembly 30B, and prevent external dust from entering to contaminate the optical assembly 10B and/or the optical filter 20B.
It is noted that, in some embodiments of the present invention, the electronic device 321B is suitable to be covered by the containing body 311B of the main body 31B due to its large height, and is located below the high upper surface 3111B of the containing body 311B. In other words, the electronic devices 321B are adapted to be disposed on three sides of the photosensitive sheet 33B, and the electronic devices 321B correspond to the high upper surface 3111B of the accommodating body 311B.
Further, the low upper surface 3110B of the containing body 311B is flush with the low upper surface 3121B of the short body 312B, that is, the height of the containing body 311B at the low upper surface 3110B is equal to the height of the short body 312B. In this way, the containing body 311B does not need to reserve an avoiding space for the optical filter 20B at the lower upper surface 3110B, so as to further reduce the thickness of the containing body 311B at the side corresponding to the lower upper surface 3110B, so that the outward protruding degree of the optical component 10B at the lower upper surface 3110B of the containing body 311B is increased, and further the attaching degree between the camera module and the mounting housing of the smart device is further improved.
Illustratively, as shown in fig. 28, to accommodate the mounting housing 51 having rounded corners in the smart device, the optical component 10B protrudes outward from the lower upper surface 3110B of the containing body 311B (i.e., the side of the main body 31B corresponding to the lower upper surface 3110B), so that the optical component 10B of the camera module is closer to the mounting housing 51 of the smart device, so as to increase the screen occupation ratio of the smart device.
As shown in fig. 28 to 30, the housing 311B is shaped in a U-shape, and the short body 312B extends to the inside of the housing 311B and is shaped in a square shape so that a U-shaped groove is formed inside the main body 31B. In other words, the housing 311B of the main body 31B has a notch at the lower upper surface 3110B, so that when the optical element 10B is adhered to the first upper surface 3110B of the housing 311B by the lens glue 110B, an air escape channel is formed between the optical element 10B and the lower upper surface 3110B of the housing 311B, so that when the lens glue 110B is cured by heating, air between the optical element 10B and the optical filter 20B can escape through the air escape channel, and the optical filter 20B or the optical element 10B is prevented from being damaged due to expansion of air between the optical element 10B and the optical filter 20B caused by heating. It is to be understood that, similarly to the third and fourth embodiments, the optical filter 20B of this embodiment of the present invention is also supported on the short upper surface 3121B of the short body 312B.
As shown in fig. 31, the containing body 311B is shaped into another possible mode. The lower upper surface 3110B of the containing body 311B extends from one of the upper inner side surfaces 3112B of the containing body 311B to the other upper inner side surface 3112B of the containing body 311B (i.e., the length of the lower upper surface 3110B of the containing body 311B is equal to the distance between the two upper inner side surfaces 3112B of the containing body 311B, also referred to as the inner dimension of the containing body 311B), so that the containing body 311B has a larger upper surface 3111B for stably supporting the optical component 10B.
The method of manufacturing the camera module is shown in fig. 32 to 33C. The manufacturing method includes the steps of:
i connecting the photosensitive web 33B with the wiring 34B and the electronic device 32B to the circuit board 35B;
II placing the connected circuit board 35B between an upper mold 41B and a lower mold 42B;
III covering the electronic device 32B in a main body 31B and on the circuit board 35B to form a molded photosensitive assembly 30B, wherein the main body 31B includes a containing body 311B and a lower body 312B having a height lower than that of the containing body 311B;
IV mounting the filter 20B on the short upper surface 3121B of the short body 312B; and
v eccentrically disposing the optical component 10B to the containing body 311B so that the optical component 10B is close to at least one side of a mounting housing 51.
Further, the step V of the method for manufacturing the camera module may include the steps of:
v.1 fixing the optical element 10B on the upper surface 3111B of the containing body 311B; and
v.2 reinforce the optical element 10B on the lower top surface 3110B of the containing body 311B, wherein the lower top surface 3110B is lower than the upper top surface 3111B.
In an example of the present invention, the high upper surface 3111B of the containing body 311B in the step III is U-shaped, so that the optical component is supported on three sides on the high upper surface 3111B of the containing body 311B and on one side on the low upper surface 3110B of the containing body 311B.
In an example of the present invention, the low upper surface 3110B of the containing body 311B is flush with the low upper surface 3121B of the short body 312B.
In an example of the present invention, the low upper surface 3110B of the containing body 311B extends from one of the high outer side surfaces 3113B of the containing body 311B to the other of the high outer side surfaces 3113B of the containing body 311B.
In another example of the present invention, the low upper surface 3110B of the containing body 311B extends from one of the high inner side surface 3112B of the containing body 311B to the other of the high inner side surface 3112B of the containing body 311B.
It is worth mentioning that, in the step v.1 of the present invention, the lens glue 110B is applied to the high upper surface 3111B of the containing body 311B to form a fixing glue layer 1101B between the optical assembly 10B and the high upper surface 3111B of the containing body 311B.
Further, step v.2 of the present invention further comprises the steps of:
v.2.1 inverting the optical member 10B and the molding photosensitive member 30B so that the optical member 10B is located on the lower side of the molding photosensitive member 30B; and
v.2.2 the lens paste 110B is applied between the legs 111B of the optical assembly 10B and the lower upper surface 3110B of the containing body 311B to form a paste layer 1102B.
It is understood that, as the optical member 10B and the molded photosensitive member 30B are both laid upside down, the lens paste 110B has no chance to flow into the incident surface 211B of the optical filter portion 21B, so that the optical filter 20B is maintained clean and stably supported.
In an example of the present invention, the fixing adhesive layer 1101B is U-shaped, and the adhesive supplement layer 1102B is linear.
In an example of the present invention, the fixing adhesive layer 1101B is L-shaped, and the adhesive supplement layer 1102B is L-shaped.
In particular, in an example of the present invention, the angle between the high inner side face 3112B of the containing body 311B and the low upper surface 3121B of the low body 312B is between 95 ° and 100 °.
It is worth mentioning that when the upper surface 3111B of the housing 311B is U-shaped, the lower surface 3110B of the housing 311B will be linear and located on a separate side of the main body 31B, such that the optical component 10B of the camera module can protrude outward from the side where the lower surface 3110B is located to the molded photosensitive component 30B, which helps to limit the approach of the optical component 10B to the mounting housing of the smart device on the side where the lower surface 3110B is located, such that the camera module is suitable to be mounted to a non-corner region of the mounting housing to be unilaterally adjacent to the mounting housing. However, when the camera module is mounted in a corner region of the mounting housing of the smart device, the optical assembly 10B cannot approach the mounting housing at both sides because the low upper surface 3110B is only at one side of the main body 31B, resulting in insufficient fitting of the camera module to the mounting housing.
Therefore, in order to solve the above problem, the present invention further provides another modified embodiment of the camera module, as shown in fig. 34 and 35, wherein the high upper surface 3111B of the containing body 311B is L-shaped, and the low upper surface 3110B of the containing body 311B is also L-shaped, so that the low upper surfaces 3110B are located on both sides of the main body 31B adjacent to each other. In other words, in this modified embodiment of the present invention, the high upper surface 3111B of the containing body 311B of the molded photosensitive element 30B of the camera module is L-shaped, so that the optical element 10B is supported adjacent to both sides on the high upper surface 3111B of the containing body 311B and adjacent to both sides on the low upper surface 3110B of the containing body 311B. In this way, the optical component 10B of the camera module can protrude from the molded photosensitive component 30B from both sides where the lower upper surface 3110B is located, which facilitates to bring the optical component 10B to the limit close to the mounting housing of the smart device on both sides where the lower upper surface 3110B is located, so that the camera module is suitable to be mounted in the corner area of the mounting housing, so that the optical component 10B is bilaterally adjacent to the mounting housing, and the screen occupation ratio of the smart device is improved to the maximum extent.
Preferably, the fixing adhesive layer 1101B of the lens adhesive 110B may be L-shaped to match the high upper surface 3111B of the containing body 311B. The adhesive layer 1102B of the lens adhesive 110B may also be L-shaped to match the lower upper surface 3112B of the containing body 312B. Thus, the fixing adhesive layer 1101B and the adhesive supplement layer 1102B are combined to form the lens adhesive 110B having a square structure so as to seal the space between the optical assembly 10B and the molded photosensitive assembly 30B, and prevent external dust from entering to contaminate the optical assembly 10B and/or the optical filter 20B.
It is noted that, in some embodiments of the present invention, the electronic device 321B is suitable to be covered by the containing body 311B of the main body 31B due to its large height, and is located below the high upper surface 3111B of the containing body 311B. In other words, the electronic devices 321B are adapted to be disposed on both sides of the photosensitive web 33B, and the electronic devices 321B correspond to the high upper surface 3111B of the containing body 311B.
It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims (19)

1. A module of making a video recording is suitable for being fixed in an installation shell, its characterized in that includes:
an optical assembly;
a light filter; and
a molded photosensitive assembly is mounted under the optical assembly and the optical filter, wherein the molded photosensitive assembly includes a main body, some electronic devices, a photosensitive sheet and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive sheet, wherein the photosensitive sheet is fixed and surrounded by the bottom of the main body while keeping a distance from the optical filter, wherein the main body includes a housing body and a low body, wherein the optical assembly is eccentrically disposed in the housing body to be close to at least one side of the mounting case, wherein the optical filter is supported on the low upper surface of the low body.
2. The camera module of claim 1, wherein the enclosure has a high upper surface and a low upper surface, wherein the height of the enclosure at the high upper surface is greater than the height of the enclosure at the low upper surface, wherein a portion of the optical assembly is supported at the high upper surface of the enclosure and another portion of the optical assembly is supported at the low upper surface of the enclosure.
3. The camera module of claim 2, further comprising a lens glue, wherein the lens glue comprises a layer of securing glue, wherein the layer of securing glue is disposed between the optical assembly and the upper surface of the containment body.
4. The camera module of claim 3, wherein the lens glue further comprises a glue supplement layer, wherein the glue supplement layer is disposed between the optical assembly and the lower upper surface of the containing body, and wherein the thickness of the glue supplement layer is greater than the thickness of the fixing glue layer.
5. The camera module of claim 4, wherein the high upper surface of the containing body is U-shaped to support the optical assembly three-dimensionally; the low upper surface of the containing body is linear and extends from one high outer side surface of the containing body to the other high outer side surface of the containing body so as to support the optical component at one side.
6. The camera module of claim 4, wherein the high upper surface of the containing body is U-shaped to support the optical assembly three-dimensionally; the lower upper surface of the containing body is linear and extends from one high inner side surface of the containing body to the other high inner side surface of the containing body so as to support the optical component at one side.
7. The camera module of claim 4, wherein said high upper surface of said containing body is L-shaped to support said optical assembly adjacent two sides; wherein the lower upper surface of the containing body is also L-shaped to support the optical assembly adjacent two sides.
8. The camera module according to claim 5 or 6, wherein the fixing adhesive layer is U-shaped, and the adhesive supplement layer is linear, so that the lens adhesive having a square structure is formed by the fixing adhesive layer and the adhesive supplement layer.
9. The camera module of claim 7, wherein the fixing adhesive layer is L-shaped, and the adhesive supplement layer is L-shaped, so that the lens adhesive having a square structure is formed by the fixing adhesive layer and the adhesive supplement layer.
10. The camera module of any of claims 2-7, wherein the optical element protrudes outward from the molded photosensitive element at the lower upper surface of the receptacle.
11. The camera module of claim 10, wherein the electronics are encased by the containment body and are located below the upper high surface of the containment body.
12. The camera module of claim 11, wherein the electronic devices are disposed on two or three sides of the photosensitive sheet.
13. The camera module of claim 10, wherein said low upper surface of said containment body is flush with said low upper surface of said short body.
14. The camera module of claim 1, wherein the optical element protrudes outward from the molded photosensitive element from at least one side of the housing body such that the optical element is adjacent to at least one side of the mounting housing.
15. The camera module of any of claims 2-7, wherein the short upper surface of the dwarf is lower than a tall upper surface of the containment body, and the relative height of the short upper surface of the dwarf is lower than the height of the tallest of the electronic devices.
16. The camera module of claim 1, wherein the distance between the tall upper surface of the containment body and the short upper surface of the short body is greater than 0.1 mm.
17. The camera module of claim 1, wherein the draft angle of the high inner side of the containing body is between 5 ° and 10 °.
18. The camera module of claim 1, wherein a fillet radius between a tall inner side of the containment body and the short upper surface of the short body is substantially equal to 0.1 mm.
19. The camera module of claim 1, wherein the draft angle of the high outer side of the containing body is between 5 ° and 10 °.
CN201920764689.3U 2018-08-21 2019-05-24 Camera shooting module Active CN209982574U (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
CN201920764689.3U CN209982574U (en) 2019-05-24 2019-05-24 Camera shooting module
US17/266,776 US20210321025A1 (en) 2018-08-21 2019-07-10 Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device
EP19853014.9A EP3840353A4 (en) 2018-08-21 2019-07-10 Camera module, molding photosensitive assembly and manufacturing method therefor, and electronic device
PCT/CN2019/095337 WO2020038139A1 (en) 2018-08-21 2019-07-10 Camera module, molding photosensitive assembly and manufacturing method therefor, and electronic device
US16/547,537 US10986257B2 (en) 2018-08-21 2019-08-21 Camera module and manufacturing method thereof
US17/195,816 US11412117B2 (en) 2018-08-21 2021-03-09 Camera module and manufacturing method thereof
US17/195,785 US11412116B2 (en) 2018-08-21 2021-03-09 Camera module and manufacturing method thereof
US17/750,743 US11758255B2 (en) 2018-08-21 2022-05-23 Camera module and manufacturing method thereof
US17/983,592 US11706514B2 (en) 2018-08-21 2022-11-09 Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device
US18/203,731 US12003838B2 (en) 2018-08-21 2023-05-31 Camera module and molded photosensitive assembly and electronic device

Applications Claiming Priority (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111988498A (en) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111988498A (en) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

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