CN220626749U - Lens carrier, optical filter assembly, camera module, electronic equipment and carrier prefabricated part - Google Patents

Abstract

The application relates to a lens bearing piece, an optical filter assembly, a camera module and electronic equipment. The lens carrier includes: the bearing part body is flat; the light transmission hole is arranged on the bearing piece body. The lens carrier of this application need not to set up the support lateral wall, and first glue film both is used for bonding circuit board and lens carrier, is used for supporting the lens carrier again, is favorable to realizing the miniaturization of camera module.

Description

Lens carrier, optical filter assembly, camera module, electronic equipment and carrier prefabricated part

Technical Field

The application relates to the field of electronic equipment, in particular to a lens carrier, an optical filter assembly, a camera module, electronic equipment and a carrier prefabricated member.

Background

Camera modules are increasingly used in electronic devices. For example, both virtual reality devices and augmented reality devices need to acquire real world information through a camera module. In order to facilitate the wearing of the electronic device by the user, a miniaturization requirement is provided.

The camera module generally comprises a lens, a lens base, a circuit board, a photosensitive chip and the like. The lens base comprises a bearing part and a supporting side wall, wherein the bearing part is used for bearing the lens, the supporting side wall is jointed with the circuit board, and the bearing part is kept above the photosensitive chip through the support of the supporting side wall. In order to ensure the structural strength of the lens base and meet the requirements of the molding process, the lens base needs to have a certain wall thickness, and the miniaturization of the camera module is affected.

Disclosure of Invention

In order to at least partially solve the above-mentioned problem, the present application provides a lens carrier, an optical filter assembly, a camera module and an electronic device, so as to facilitate miniaturization of the camera module.

One embodiment of the present application provides a lens carrier comprising: the bearing part body is flat; the light transmission hole is arranged on the bearing piece body.

According to some embodiments of the present application, the surface of the carrier body is provided with relief holes and/or relief grooves.

According to some embodiments of the present application, the lens carrier further comprises: the first baffle, the first baffle set up in the carrier body, first baffle is located the light passing hole outside, first baffle is kept away from the surface of light passing hole is the inclined plane.

According to some embodiments of the present application, the lens carrier further includes a second baffle, the second baffle is disposed on the carrier body, the second baffle is located on an outer periphery of the carrier body, and a surface of the second baffle, which is close to the light-passing hole, is an inclined plane.

According to some embodiments of the application, the lens carrier further includes an extension portion, the extension portion is disposed on the carrier body, and the extension portion is located outside the light-passing hole.

According to some embodiments of the application, the thickness of the carrier body is 0.08-0.2 mm.

According to some embodiments of the present application, the lens carrier further includes a first air outlet, and the first air outlet is disposed on the carrier body.

One embodiment of the present application provides a filter assembly comprising: a lens carrier as described above; the optical filter is arranged in the light-passing hole.

An embodiment of the present application provides a camera module, including: a circuit board; a photosensitive element connected with the circuit board; the first adhesive layer is arranged on the circuit board; the lens carrier is arranged on the first adhesive layer; or the optical filter component is arranged on the first adhesive layer; the lens is arranged on the lens bearing piece.

An embodiment of the present application provides an electronic device including the camera module described above.

One embodiment of the present application provides a carrier preform comprising: the lens carrier as described above; and the supporting part is connected with the lens bearing piece.

According to some embodiments of the application, the support is provided with a third air outlet.

The lens carrier of this application need not to set up the support lateral wall, and first glue film both is used for bonding circuit board and lens carrier, is used for supporting the lens carrier again, is favorable to realizing the miniaturization of camera module.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings by a person skilled in the art without departing from the scope of protection of the present application.

FIG. 1 is a schematic diagram of a conventional camera module;

FIG. 2 is a schematic diagram of a camera module according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a lens carrier according to an embodiment of the present application;

FIG. 4 is a schematic view of a lens carrier according to an embodiment of the present application;

FIG. 5 is a schematic diagram showing the connection of the lens carrier and the circuit board shown in FIG. 4;

FIG. 6 is a schematic view of a lens carrier according to an embodiment of the present application;

FIG. 7 is a schematic diagram showing the connection of the lens carrier of FIG. 6 to a circuit board;

FIG. 8 is a schematic view of a lens carrier according to an embodiment of the present application;

FIG. 9 is a schematic diagram illustrating the connection of the lens carrier of FIG. 8 to a circuit board;

FIG. 10 is a schematic view of a cut second baffle according to an embodiment of the present application;

FIG. 11 is a schematic view of a lens carrier according to an embodiment of the present application;

FIG. 12 is a schematic view of a process flow for manufacturing a photosensitive assembly according to an embodiment of the present application;

FIG. 13 is a schematic diagram of bubble generation in an embodiment of the present application;

FIG. 14 is a schematic view of an air outlet in an embodiment of the present application;

FIG. 15 is an exploded view of a photosensitive assembly preform according to an embodiment of the present application;

FIG. 16 is a schematic view of a carrier preform according to an embodiment of the present application;

FIG. 17 is an exploded view of a photosensitive assembly preform according to an embodiment of the present application;

FIG. 18 is a schematic view of a carrier preform according to an embodiment of the present application;

FIG. 19 is a schematic diagram of an electronic device according to an embodiment of the present application;

fig. 20 is a schematic diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application, taken in conjunction with the accompanying drawings, will clearly and fully describe the technical aspects of the present application, and it will be apparent that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

As shown in fig. 1, the conventional camera module 100 'includes a circuit board 1', a photosensitive chip 2', an electronic component 3', a lens holder 4', an optical filter 5' and a lens 6', wherein the photosensitive chip 2' and the electronic component 3 'are disposed on the circuit board 1', a supporting sidewall 41 'of the lens holder 4' is adhered to the circuit board 1', and the optical filter 5' and the lens 6 'are disposed on the lens holder 4'. Due to the structural strength requirement and the molding process requirement of the lens base 4', the wall thickness of the lens base 4' is difficult to further reduce, and the miniaturization of the camera module is affected.

As shown in fig. 2, an embodiment of the present application provides a camera module 100, where the camera module 100 includes: the optical filter comprises a circuit board 1, a photosensitive element 2, a first adhesive layer 4, an optical filter assembly 10 and a lens 7. The lens 7 includes at least one lens, and the lens 7 is disposed on the filter assembly 10.

The photosensitive element 2 is electrically connected with the circuit board 1, and optionally, the photosensitive element 2 is a photosensitive chip. The photosensitive element 2 is disposed on the front surface of the circuit board 1, and the front surface of the circuit board 1 is the top surface of the circuit board 1 in fig. 2. At least one electronic component 3 is provided on the wiring board 1.

The first adhesive layer 4 is disposed on the circuit board 1, and the first adhesive layer 4 is formed by curing glue. The filter assembly 10 includes a lens carrier 5 and a filter 6. The lens carrier 5 is disposed on the first adhesive layer 4, and the first adhesive layer 4 plays a supporting role on the lens carrier 5. The optical filter 6 is disposed on the lens carrier 5, and the optical filter 6 is disposed on the optical path of the photosensitive element 2. The filter 6 may be used to filter out interfering light.

As shown in fig. 3, the lens carrier 5 includes a carrier body 51 and a light passing hole 52. The carrier body 51 is flat. The carrier body 51 is located above the first adhesive layer 4, and the first adhesive layer 4 supports the carrier body 51. The lens 7 is disposed on the carrier body 51, for example, the lens 7 and the carrier body 51 are bonded by glue. The light-passing hole 52 is disposed in the carrier body 51, and the light-passing hole 52 is located on the light path of the photosensitive element 2.

Optionally, the optical filter 6 is disposed in the light-passing hole 52. External light is incident on the light-sensitive element 2 through the lens 7 and the filter 6.

In another embodiment, the optical filter 6 is integrated with the lens 7, and the image capturing module 100 includes: the circuit board 1, the photosensitive element 2, the first adhesive layer 4, the lens carrier 5 and the lens 7, wherein the lens 7 is arranged on the carrier body 51. The external light passes through the lens 7, passes through the light-passing hole 52, and is incident on the photosensitive element 2.

In the embodiment of the application, the first adhesive layer 4 is arranged between the circuit board 1 and the lens bearing piece 5, and the first adhesive layer 4 plays a role in bonding the circuit board 1 and the lens bearing piece 5. The lens carrier 5 does not need to be provided with a supporting side wall 41' of a traditional lens seat, the first adhesive layer 4 supports the lens carrier 5, and the circuit board 1, the first adhesive layer 4 and the lens carrier 5 form a space for accommodating the photosensitive element 2. The thickness of the first adhesive layer 4 is set according to the requirement, so as to reduce the height of the camera module 100 and realize miniaturization of the camera module 100. The thickness in this embodiment means the dimension in the vertical direction in the drawing.

In some embodiments, the thickness of the first glue layer 4 is 0.1-0.8 mm. For example, the thickness of the first glue layer 4 is 0.1mm, 0.15mm, 0.5mm or 0.8mm. In the camera module with the same function, the first adhesive layer 4 of the present embodiment is not limited by the molding process, and the thickness of the first adhesive layer 4 may be set smaller than the thickness of the supporting sidewall 41' of the conventional lens base.

As shown in fig. 4 and fig. 5, the lens is omitted in fig. 5, in some embodiments, the surface of the carrier body 51 has an avoidance structure 53, at least part of the electronic components 3 on the circuit board 1 enter the avoidance structure 53, and the avoidance structure 53 is used for avoiding the electronic components 3 on the circuit board 1, so as to further reduce the height of the image capturing module 100. For example, the relief structure 53 is a relief groove provided on the bottom surface of the carrier body 51, or the relief structure 53 is a relief hole penetrating through the carrier body 51.

As shown in fig. 6 and 7, the lens is omitted from fig. 7, and in some embodiments, the lens carrier 5 further includes: a first baffle 54. The first baffle 54 is disposed on the bottom surface of the carrier body 51, and the first baffle 54 is located outside the light-passing hole 52. The first baffle 54 is integrally formed with the carrier body 51. Alternatively, the first baffle 54 is substantially in a closed loop structure, and the first baffle 54 is disposed coaxially with the light-passing hole 52. When the lens carrier 5 is adhered to the circuit board 1, the first baffle 54 presses the glue between the lens carrier 5 and the circuit board 1 from the inner side, and the first baffle 54 plays a role in blocking the glue, so that the glue is prevented from polluting the photosensitive element 2. The glue between the lens carrier 5 and the circuit board 1 is cured to form a first glue layer 4, and the first baffle 54 is in contact with the first glue layer 4.

Optionally, the surface of the first baffle 54 contacting the first glue layer 4 is beveled, so that the first baffle 54 presses the glue.

As shown in fig. 8 and 9, the lens is omitted from fig. 9, and in some embodiments, the lens carrier 5 further includes: and a second baffle 55. The second baffle 55 is disposed on the bottom surface of the carrier body 51, the second baffle 55 is located at the outer periphery of the carrier body 51, and the second baffle 55 and the carrier body 51 are integrally formed. When the lens carrier 5 is adhered to the circuit board 1, the second baffle 55 presses the glue between the lens carrier 5 and the circuit board 1 from the outside, so that the glue better fills the gap between the lens carrier 5 and the circuit board 1. The glue between the lens carrier 5 and the circuit board 1 is cured to form a first glue layer 4, and the second baffle 55 is in contact with the first glue layer 4. The second baffle 55 can also increase the contact area between the lens carrier 5 and the first adhesive layer 4, so that the lens carrier 5 and the first adhesive layer 4 are more firmly adhered.

Optionally, the surface of the second baffle 55 contacting the first adhesive layer 4 is inclined, so that the second baffle 55 can squeeze the glue.

As shown in fig. 10, after the glue between the lens carrier 5 and the circuit board 1 is cured, the second baffle 55 is cut along the dotted line in fig. 10 to further reduce the size of the camera module 100. Alternatively, the second baffle 55 may be optionally partially cut away, as desired.

As shown in fig. 11, in some embodiments, the lens carrier 5 further includes an extension portion 56, the extension portion 56 is disposed at the bottom of the carrier body 51, and the extension portion 56 is located outside the light-passing hole 52. Optionally, the extension 56 is integrally formed with the carrier body 51. The extension part 56 is arranged on the carrier body 51, so that the glue amount filled between the lens carrier 5 and the circuit board 1 can be reduced, and the structural strength of the lens carrier 5 can be improved. The extension 56 can also reduce the cavity space between the lens carrier 5, the first adhesive layer 4 and the circuit board 1, and the smaller the cavity space is, the less dust in the cavity is, so that the possibility of black spots of the camera module 100 is reduced.

In some embodiments, the optical filter 6 is integrated with the lens 7, and the thickness of the carrier body 51 can be further reduced because the optical filter 6 does not need to be disposed in the light-transmitting hole 52 of the lens carrier 5. Alternatively, the thickness of the carrier body 51 is 0.08-0.2 mm. For example, the thickness of the carrier body is 0.08mm, 0.1mm, 0.15mm, 0.2mm.

As shown in fig. 12, when preparing the image capturing module 100, the photosensitive assembly 20 is prepared, and then the lens 7 is disposed on the photosensitive assembly 20, and the preparation method of the photosensitive assembly 20 includes:

s1, preparing a photosensitive assembly prefabricated member, which comprises the following steps:

s11, attaching the electronic element 3 on the circuit board 1, wherein the position of the electronic element 3 is set according to the requirement, the electronic element 3 can be arranged on the front surface of the circuit board 1, and the electronic element 3 can also be arranged on the back surface of the circuit board 1;

s12, electrically connecting the photosensitive element 2 with the circuit board 1, for example, disposing the photosensitive element 2 on the front surface of the circuit board 1, and connecting the photosensitive element 2 with the circuit board 1 through gold wires;

s13, dispensing on the circuit board 1 or dispensing on the carrier prefabricated member 50, for example, coating the glue 40 on the circuit board 1 by a dispenser;

bonding the bearing piece prefabricated part 50 with the circuit board 1, cutting the bearing piece prefabricated part 50 to obtain a lens bearing piece 5, and ensuring that the lens bearing piece 5 is positioned on a light path of the photosensitive element 2 when the bearing piece prefabricated part 50 is bonded with the circuit board 1;

s14, curing the glue 40 between the carrier prefabricated member 50 and the circuit board 1 into a first glue layer 4, for example, heating the glue 40 to cure the glue 40;

the support member pre-fabricated part 50 is provided with a supporting part 501, and in the preparation process of the photosensitive assembly 20, for example, dispensing is performed on the circuit board 1, the support member pre-fabricated part 50 is adhered to the circuit board 1, the support member pre-fabricated part 50 is extruded with the glue 40 from the upper side, the supporting part 501 is abutted to the circuit board 1, and the supporting part 501 plays a supporting role on the supporting member 5 because the glue 40 is not solidified yet. The carrier preform 50 is cut into the support 501 to obtain the support 5. For example, the support preform 50 may cut out a plurality of supports 5 to improve the production efficiency of the photosensitive assembly 20.

S2, cutting the photosensitive assembly prefabricated member according to the set size to obtain the photosensitive assembly 20.

As shown in fig. 13, bubbles 200 may be generated at corners of the carrier preform 50 where it contacts the glue 40, the bubbles 200 affecting bonding reliability and resulting in poor appearance after cutting. During curing of the glue 40 into the first glue layer 4, the air bubbles 200 may expand, affecting the performance of the first glue layer 4, and the air bubbles 200 may also cause a glue explosion, which contaminates the photosensitive element 2 with glue.

As shown in fig. 14 and 15, in some embodiments, a first air outlet hole 502 is provided in the carrier preform 50, and the first air outlet hole 502 penetrates through the upper and lower surfaces of the carrier preform 50 so that the cavity between the carrier preform 50 and the circuit board 1 communicates with the outside.

Optionally, the number of the first air outlet holes 502 is multiple, and the positions of the first air outlet holes 502 are set according to requirements. For example, dispensing the circuit board 1, the pattern of glue 40 on the circuit board 1 is substantially "mouth" shaped, placing the carrier pre-form 50 on the glue 40, and the first air outlet 502 is located between the glue 40 and the support 501.

Optionally, after the support portion 501 is cut away, the first air outlet hole 502 remains on the lens carrier 5, for example, the first air outlet hole 502 remains on the carrier body 51. In another alternative embodiment, the first air outlet 502 is not reserved on the lens carrier 5. The dashed lines in fig. 15 are cut lines of the carrier preform 50.

In some embodiments, the carrier pre-form 50 is substantially rectangular, and a flexible board 13 (FPC) is connected to one side of the circuit board 1, so that the carrier pre-form 50 and the circuit board 1 are not easily cut on the side of the flexible board 13 and the side close to the flexible board 13. The support part 501 is not arranged on the edge of the carrier prefabricated member 50 close to the flexible board 13, the support parts 501 are arranged on the other three edges of the carrier prefabricated member 50, and the support parts 501 can be arranged between the adjacent lens carriers 5.

In step S13, dispensing on the circuit board 1 or dispensing on the carrier preform 50 includes: the glue 40 for dispensing is formed with a second air outlet hole 41. Optionally, a second air outlet 41 is provided in a portion of the glue 40 close to the flexible sheet 13. A second air outlet hole 41 is provided to communicate the cavity between the carrier preform 50, the circuit board 1 and the glue 40 to the outside.

The glue 40 is cured into a first glue layer 4, and the second air outlet holes 41 are reserved in the first glue layer 4.

As shown in fig. 16, in some embodiments, a hollowed-out structure is disposed on the supporting portion 501 of the carrier prefabricated member 50, and the hollowed-out structure is used as the third air outlet 503. Optionally, the supporting portion 501 includes legs 5011, for example, four legs 5011 are respectively located at four corners of the carrier prefabricated member 50, and the hollow structure between adjacent legs 5011 is a third air outlet hole 503. The third air outlet hole 503 and the second air outlet hole 41 are matched when the carrier prefabricated member 50 is adhered to the circuit board 1, so that air bubbles 200 are avoided at the edge of the glue 40. In step S2, cutting the photosensitive assembly preform includes cutting away the support portion 501 to obtain the lens carrier 5.

Alternatively, the support 501 may also include at least three legs 5011, and the positions of the legs 5011 may be set as desired.

As shown in fig. 17 and 18, in some embodiments, the leg 5011 of the support 501 includes a first support leg 5012 and at least two second support legs 5013. For example, the first support leg 5012 is located on the side of the carrier preform 50 near the flexible board 13, and the second support leg 5013 is located on the side of the carrier preform 50 away from the flexible board 13. The hollow structure between the first support leg 5012 and the second support leg 5013 and the hollow structure between the adjacent second support legs 5013 can be used for air outlet. Optionally, the positions of the first support leg 5012 and the at least two second support legs 5013 are set according to the requirements.

Alternatively, the first support leg 5012 corresponds to the second air outlet hole 41. When the carrier preform 50 is bonded to the circuit board 1, the first support leg 5012 is positioned in the second air outlet hole 41 to reduce the size of the carrier preform 50. The first supporting leg 5012 may be a trapezoid block, and the cross-sectional area is gradually reduced from top to bottom, so as to ensure that a gap is left between the first supporting leg 5012 and the hole wall of the second air outlet hole 41, so that the cavity between the carrier prefabricated member 50 and the circuit board 1 and the glue 40 is communicated with the outside.

As shown in fig. 19 and 20, one embodiment of the present application provides an electronic device 300, where the electronic device 300 includes the camera module 100 as described above. Optionally, the electronic device of the embodiment may be a mobile phone, a tablet computer, a wearable device, a television, a vehicle, a monitoring device, or the like, which is not limited in this application. The camera module 100 cooperates with an electronic device to realize image capturing and reproducing functions for a target object. The number and positions of the camera modules 100 are set according to the requirements.

The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and embodiments of the present application, and the description of the above examples is only used to help understand the technical solution and core ideas of the present application. Therefore, those skilled in the art will recognize that many modifications and adaptations of the present application are possible and can be accomplished with the aid of the teaching herein within the scope of the present application. In view of the foregoing, this description should not be construed as limiting the application.

Claims (12)

1. A lens carrier, comprising:

the bearing piece body is flat and is used for supporting the lens;

the light transmission hole is arranged on the bearing piece body.

2. The lens carrier of claim 1, wherein the surface of the carrier body is provided with relief holes and/or relief grooves.

3. The lens carrier of claim 1, further comprising: the first baffle, the first baffle set up in the carrier body, first baffle is located the light passing hole outside, first baffle is kept away from the surface of light passing hole is the inclined plane.

4. The lens carrier of claim 1, further comprising a second baffle disposed on the carrier body, the second baffle being located at an outer periphery of the carrier body, a surface of the second baffle adjacent to the light-passing hole being a slope.

5. The lens carrier of claim 4, further comprising an extension disposed on the carrier body, the extension being outside the light-passing hole.

6. The lens carrier of claim 1, wherein the carrier body has a thickness of 0.08-0.2 mm.

7. The lens carrier of any of claims 1-6, further comprising a first air outlet disposed in the carrier body.

8. A filter assembly, comprising:

the lens carrier of any one of claims 1 to 6;

the optical filter is arranged in the light-passing hole.

9. A camera module, comprising:

a circuit board;

a photosensitive element connected with the circuit board;

the first adhesive layer is arranged on the circuit board;

the lens carrier of any one of claims 1-7, the carrier being disposed on the first adhesive layer; or the optical filter assembly of claim 8, the optical filter assembly being disposed on the first adhesive layer;

the lens is arranged on the lens bearing piece.

10. An electronic device comprising the camera module of claim 9.

11. A carrier preform, comprising:

the lens carrier of any one of claims 1 to 7;

and the supporting part is connected with the lens bearing piece.

12. The carrier preform of claim 11, wherein the support portion is provided with a third air outlet aperture.