CN112740647B - Photosensitive assembly, camera module and manufacturing method thereof - Google Patents
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application provides a photosensitive assembly, includes: the chip comprises a photosensitive chip and a plurality of chip electrodes, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area surrounding the photosensitive area; the extension layer is positioned on the side surface of the photosensitive chip, is in contact with the photosensitive chip and has a surface flush with the front surface of the photosensitive chip; the rewiring layer is formed on the front surfaces of the expansion layer and the photosensitive chip; the rewiring layer is provided with a plurality of rewiring layer electrodes, and the rewiring layer electrodes are communicated with the chip electrodes in a one-to-one correspondence mode through rewiring layer routing. The application also provides a corresponding manufacturing method and a camera module. The high-density packaging of the photosensitive chip of the camera module can be realized; the camera module can realize the reverse chip pasting process by adopting a conventional printed circuit board so as to realize the packaging of high I/O number.
Description
Cross Reference to Related Applications
The present application claims priority and benefit of the chinese patent application, filed in 2018, 8, 29 on the chinese intellectual property office (CNIPA), having application number 201810997067.5 and entitled "photosensitive assembly, camera module and method of making the same," which is incorporated herein by reference in its entirety.
Technical Field
The application relates to the technical field of optics, in particular to a photosensitive assembly, a camera module and a manufacturing method of the camera module.
Background
With the rapid development of smart phones and other electronic devices, the mobile phone screen tends to be fully screen-thinned and light-thinned, so that the demand for miniaturization of the camera module is more and more strong.
The camera module generally includes an optical lens assembly and a photosensitive assembly. Wherein the photosensitive assembly generally comprises a circuit board and a photosensitive chip 103 mounted on the circuit board. In the conventional camera module, the photo sensor chip 103 is usually connected to the circuit layer by a "wire bonding" process or a flip chip process.
The conventional printed circuit board is limited by factors such as current requirements, circuit heating caused by circuit board materials, and printed circuit board processing capability, so that the line width and line distance of the common printed circuit board are about 70 μm, and 30 μm can be achieved under the limit processing capability, but the cost is very high. Correspondingly, the wire width and the wire distance of the traditional circuit board are limited, the factors of the circuit board can be considered when the chip is conducted, the pad distance cannot be further reduced, and the development trend of continuous miniaturization of the chip is deviated. In addition, as the bonding pads of the chip are more and more dense, the pitch is approaching the limit, and in the wire bond process, under the condition that the gold wires are very dense, the interference between the gold wires is easy to occur, thereby causing circuit failure. On the other hand, the wire bond process is followed by a series of steps such as molding, lens holder, etc. in the whole manufacturing process, which will affect the reliability of gold wire connection. Furthermore, the gold wire has a certain arc height, so an extra height is usually added to the module for avoiding the gold wire, and the existence of the gold wire may hinder the miniaturization development of the module.
Nowadays, some manufacturers adopt flip chip technology to solve a series of problems caused by gold wires. For example, in the flip chip process, because the chip is directly attached to the bottom side of the circuit board, and then the chip is conducted with the circuit board through the gold ball, the conducting length of the circuit board and the photosensitive chip is greatly shortened, the delay is reduced, and the electrical property is effectively improved. On the other hand, the Flip Chip process has high requirements for conduction accuracy and flatness, and a ceramic substrate with high structural strength and insusceptibility to bending needs to be used as a circuit board (i.e., a circuit board), and the Flip Chip process is very expensive. In addition, the process scheme requires that the size and the density of the bonding pads of the circuit board are consistent or basically consistent with those of the photosensitive chip. Generally, due to process limitations, the minimum size of the pads of the circuit board is limited, and the line width of the gold ball bumps is large, such as about 100 um. In order to adapt to the flip chip process, the size of the photosensitive chip bonding pad is difficult to further reduce so as to adapt to the bonding pad size of the circuit board. Therefore, the number of the bonding pads which can be arranged on the photosensitive chip is reduced, or the size of the photosensitive chip is increased due to the increase of the number of the bonding pads, so that the size reduction of the camera module is not facilitated. This is because the higher the pixels of the photosensitive chip, the larger the amount of image data that needs to be output, and more I/O ports are needed to output the data. While a smaller number of pads results in a reduction of I/O ports outputting data. Therefore, the conventional flip chip process is not favorable for increasing the number of pixels of the photosensitive chip.
Disclosure of Invention
The present application provides a solution that overcomes at least one of the deficiencies of the prior art.
According to an aspect of the present application, there is provided a photosensitive assembly including: the chip comprises a photosensitive chip and a plurality of chip electrodes, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area surrounding the photosensitive area; the extension layer is positioned on the side surface of the photosensitive chip, is in contact with the photosensitive chip and has a surface flush with the front surface of the photosensitive chip; the rewiring layer is formed on the front surfaces of the expansion layer and the photosensitive chip; the rewiring layer is provided with a plurality of rewiring layer electrodes, and the rewiring layer electrodes are correspondingly connected and conducted with the chip electrodes one by one through rewiring layer routing.
The printed circuit board further comprises a circuit board, wherein the circuit board is provided with a plurality of circuit board electrodes, and the plurality of rewiring layer electrodes are attached to and conducted with the plurality of circuit board electrodes in a one-to-one correspondence mode.
The circuit board is a rigid-flex board.
The central area of the circuit board and the central area of the rewiring layer are both provided with through holes, and the chip electrode is closer to the through holes than the rewiring layer electrode.
Wherein a periphery of an attachment position of the wiring board and the rewiring layer has a filling material.
And the area of the chip electrode is smaller than that of the rewiring layer electrode.
Wherein the density of the plurality of chip electrodes is higher than the density of the plurality of rewiring layer electrodes; the width of the routing of the rewiring layer is smaller than that of the routing of the circuit board.
Wherein, the extension layer surrounds the photosensitive chip, or is positioned on one side, two sides or three sides of the photosensitive chip.
The back of the circuit board is provided with a groove, and the photosensitive chip is located in the groove.
Wherein the photosensitive assembly further comprises a metal sheet attached to the circuit board and covering the groove.
The photosensitive assembly further comprises a metal sheet, the metal sheet is attached to the circuit board and covers the back surface of the photosensitive chip, a groove is formed in the metal sheet, and the photosensitive chip is located in the groove.
And a gap is reserved between the metal sheet and the photosensitive chip.
The photosensitive assembly further comprises a molding layer, and the molding layer covers the circuit board and the back face of the photosensitive chip.
In a top view, the photosensitive chip is provided with a row of chip electrodes positioned on the top side or the bottom side, and the chip electrodes are connected to rewiring layer electrodes positioned on the left side or the right side of the photosensitive chip through rewiring layer wires.
The surface of a photosensitive area of the photosensitive chip is provided with a protective layer; the protective layer is a color filter or a transparent cover plate.
According to another aspect of the application, still provide a module of making a video recording, include: any one of the above photosensitive elements; and an optical lens assembly mounted to the photosensitive assembly.
According to another aspect of the present application, there is also provided a method for manufacturing a photosensitive assembly, including: placing a photosensitive chip on the surface of a substrate; manufacturing an extension layer extending out of the side face of the photosensitive chip on the surface of a substrate, and enabling the surface of the extension layer to be flush with the surface of the photosensitive chip; and manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip, connecting the multiple photosensitive electrodes of the photosensitive chip to the multiple rewiring layer electrodes positioned on the rewiring layer through rewiring layer wiring, wherein the multiple rewiring layer electrodes are suitable for being attached with multiple circuit board electrodes in a one-to-one correspondence mode in size and layout.
In the step of placing the photosensitive chip on the surface of the substrate, the photosensitive surface of the photosensitive chip faces the substrate; and in the step of manufacturing an extension layer extending from the side surface of the photosensitive chip on the surface of the substrate, the contact surface of the extension layer and the substrate and the surface of the photosensitive chip on one side of the photosensitive surface form the flush surface for manufacturing the rewiring layer.
In the step of manufacturing the extension layer extending from the side surface of the photosensitive chip on the surface of the substrate, a molding part surrounding the photosensitive chip is formed by molding from the back surface of the photosensitive chip, and the molding part is used as the extension layer.
Wherein, the step of manufacturing the extension layer extending from the side surface of the photosensitive chip on the surface of the substrate further comprises: and grinding the extension layer to thin the photosensitive assembly.
Wherein, the step of manufacturing the extension layer extending from the side surface of the photosensitive chip on the surface of the substrate further comprises: and grinding the back surfaces of the extension layer and the photosensitive chip to thin the photosensitive assembly.
Wherein, the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip further comprises: and removing the rewiring layer covering the photosensitive surface of the photosensitive chip to expose the photosensitive surface.
The manufacturing method of the photosensitive assembly further comprises the following steps: and forming a protective layer on the photosensitive surface of the photosensitive chip before the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip is executed.
In the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a sacrificial layer; the manufacturing method of the photosensitive assembly further comprises the following steps: and removing the sacrificial layer after the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip is completed.
Wherein, in the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a color filter.
The manufacturing method of the photosensitive assembly further comprises the following steps: and after the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip is completed, attaching a circuit board to the rewiring layer, wherein the rewiring layer electrodes are in one-to-one correspondence with the circuit board electrodes of the circuit board and are conducted.
The manufacturing method of the photosensitive assembly further comprises the following steps: and attaching a metal sheet to the back surface of the circuit board after attaching the circuit board to the rewiring layer, so that the metal sheet covers the back of the photosensitive chip.
The manufacturing method of the photosensitive assembly further comprises the following steps: after attaching a wiring board to the rewiring layer, disposing a filling material around an attachment position of the wiring board and the rewiring layer; and covering a molding layer on the back surfaces of the circuit board and the photosensitive chip through a molding process.
Wherein, in the step of arranging the photosensitive chips on the surface of the substrate, a plurality of photosensitive chips are arranged on the surface of the same substrate at intervals to form a photosensitive chip array; in the step of manufacturing an extension layer surrounding the photosensitive chips on the surface of the substrate, manufacturing an integrally formed extension layer on the substrate, wherein the extension layer surrounds each photosensitive chip to form a photosensitive chip assembly array; in the step of manufacturing a rewiring layer on the flush surface of the extension layer and the photosensitive chip, manufacturing the rewiring layer on the surface of the photosensitive chip assembly array; and cutting the photosensitive chip component array after the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip so as to obtain a single photosensitive component.
Wherein, in the step of dicing the array of photosensitive chip assemblies, the array of photosensitive chip assemblies is diced from the back.
Compared with the prior art, the application has at least one of the following technical effects:
1. this application can realize switching on the great circuit board pad of line width/circuit to the sensitization chip of less contact, realizes making a video recording module sensitization chip's high density encapsulation.
2. This application can realize being close to the circuit board pad in the optical window outside relatively and switch on to the chip pad that is closer to the optical window.
The application can realize that the camera module adopts the conventional printed circuit board to realize the reverse chip technology so as to realize the packaging of high I/O number.
Drawings
Exemplary embodiments are illustrated in referenced figures of the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.
FIG. 1 illustrates a schematic cross-sectional view of a photosensitive assembly according to one embodiment of the present application;
FIG. 2 illustrates a schematic top view of the photosensitive assembly shown in FIG. 1;
FIG. 3 illustrates a schematic top view of a photosensitive assembly according to another embodiment of the present application;
FIG. 4 shows a schematic view of the placement of the photo-sensing chip 103 on the substrate 105 a;
FIG. 5 illustrates the placement of an array of photo-sensing chips in a wafer level process;
FIG. 6 shows the arrangement of the photo-sensor chip array adapted to the panel (panel level) process;
FIG. 7 shows a schematic view of molding on the substrate surface and the backside of the photo-sensing chip;
FIG. 8 shows the assembly of the ground mold 109 and the photosensitive chip 103;
FIG. 9 is a schematic view showing the formation of a re-wiring layer on the front surface of the photosensitive chip 103 and the surface of the mold 109 around the same;
FIG. 10 shows a schematic view of forming the optical window 106;
FIG. 11 is a schematic diagram showing dicing of an array of photosensitive chip assemblies;
FIG. 12 shows a schematic view of the attachment of the photosensitive chip assembly to the wiring board 101;
fig. 13 shows a schematic diagram of attaching a metal sheet 104 on the surface (typically the back surface) of the wiring board 101 to cover the back of the photosensitive chip 103;
FIG. 14 shows a schematic view of molding on the backside of the wiring board 101 and the photosensitive chip assembly;
FIG. 15 shows a schematic view of a photosensitive assembly of another embodiment of the present application;
FIG. 16 shows a molded array of photosensitive chips with a protective layer 110 in one embodiment of the present application;
fig. 17 shows a schematic view of the re-wiring layer 102 formed on the front surface of the photosensitive chip 103 and the surface of the mold 109 around it in step S400';
FIG. 18 shows the array of photosensitive chip assemblies after the protective layer 110 has been removed;
FIG. 19 is a schematic diagram showing dicing of an array of photosensitive chip assemblies with protective layer remaining;
FIG. 20 shows a schematic view of a photosensitive chip assembly with a protective layer remaining attached to a wiring board 101;
fig. 21 shows a schematic view of a photosensitive assembly with a remaining protective layer to which the metal sheet 104 is attached;
FIG. 22 shows a schematic view of molding on the backside of the wiring board 101 and the photosensitive chip assembly with the photosensitive resist remaining;
FIG. 23 shows a schematic view of a photosensitive assembly retaining a photosensitive protective layer according to another embodiment of the present application;
fig. 24 is a perspective exploded view of a camera module according to an embodiment of the present application;
fig. 25 shows a perspective exploded view of the photosensitive chip assembly 113.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including" and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, the use of "may" mean "one or more embodiments of the application" when describing embodiments of the application. Also, the term "exemplary" refers to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
FIG. 1 shows a schematic cross-sectional view of a photosensitive assembly according to one embodiment of the present application. Referring to fig. 1, in the present embodiment, the photosensitive assembly includes a photosensitive chip 103, a molding portion 109, a rewiring layer 102, and a wiring board 101. Wherein the lower surface of the wiring board 101 has a plurality of wiring board electrodes 1014 (i.e., first electrodes). The photosensitive chip 103 has a photosensitive region 1031 and a non-photosensitive region 1032 surrounding the photosensitive region 1031. The chip electrodes 1033 are disposed in the non-photosensitive region 1032. The molding portion 109 is formed around the photosensitive chip 103, and an upper surface of the molding portion 109 is flush with an upper surface of the photosensitive chip 103, constituting an integral flat surface. The redistribution layer 102 is formed on the planarized surface. The upper surface of the redistribution layer 102 has a plurality of redistribution layer electrodes 1022 (i.e., second electrodes) in one-to-one correspondence with the plurality of wiring board electrodes 1014, and each redistribution layer electrode 1022 through the redistribution layer 102 is in communication with a corresponding chip electrode 1033, respectively. The wiring board has a through hole 1013 as a light passing hole in the center. In this embodiment, the circuit board 101 may be a rigid-flex board. The rigid-flex board comprises a hard board area 1011 and a soft board area 1012, and the center of the hard board area 1011 is provided with a through hole 1013. Herein, the hard board region may be understood as a region in the rigid-flexible board which is rigid (not bendable at normal temperature) as a whole, and the soft board region may be understood as a region in the rigid-flexible board which is flexible (i.e., bendable) as a whole. Note that the hard sheet region may be a region that is rigid as a whole formed by laminating a plurality of hard sheets and soft sheets, and is not necessarily constituted by only a hard sheet.
Further, fig. 2 shows a schematic top view of the photosensitive assembly shown in fig. 1. This figure is a perspective view with the wiring board omitted and shows redistribution layer electrodes 1022, chip electrodes 1033, and redistribution layer traces 1023. As shown in fig. 2, the rewiring layer wiring 1023 connects and conducts the rewiring layer electrode 1022 and the chip electrode 1033. The area of the re-wiring layer electrode 1022 may be larger than that of the chip electrode 1033. The area of the redistribution layer electrodes 1022 is adapted (e.g., equal or substantially equal) to the area of the wiring board electrodes 1014. In this embodiment, the redistribution layer electrode 1022 is located outside the chip electrode 1033 (i.e., the chip electrode 1033 is closer to the physical center of the through hole 1013 than the redistribution layer electrode 1022). In this embodiment, the electrodes may be all metal electrodes.
In the prior art, the size of the bonding pad of the rigid-flex board ranges from 60 to 80 μm, and the size of the bonding pad of the chip can be 10 to 20 μm. Therefore, in the above embodiment, the fan-out package is implemented by forming the extension layer (e.g., the molding portion 109) around the photosensitive chip 103 and then forming the redistribution layer 102 on the flat surface of the photosensitive chip 103 formed by the extension layer, so that the photosensitive chip assembly formed by the photosensitive chip 103, the extension layer and the redistribution layer 102 may have a pad suitable for reverse mounting with a circuit board. The size and layout of these pads may be adapted in a one-to-one correspondence with the board electrodes (i.e., board pads). Meanwhile, in the photosensitive chip assembly, the chip electrodes of the photosensitive chip still have the characteristics of small area and dense arrangement, so that the pixel number of the photosensitive assembly of the film chip process scheme is increased, and various defects caused by the conventional wire bond process are avoided. On the other hand, the rigid-flex board is a flexible circuit board (flexible board) and a rigid circuit board (rigid board), which are combined together according to relevant process requirements through processes such as pressing and the like to form a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics. At present, the manufacturing process of the rigid-flex printed circuit board is mature, and the rigid-flex printed circuit board has a great cost advantage compared with circuit boards of other processes such as a ceramic substrate and the like. Furthermore, the connecting band of the photosensitive assembly in the above embodiment is manufactured by using the manufacturing process of the rigid-flex board, so that the connecting band can be prevented from being attached by processes such as an ACF (anisotropic conductive film) which require high-temperature hot pressing after the photosensitive chip is attached. The connection strap may electrically connect the hard board area to a connector for electrical connection with a motherboard of a terminal device (e.g., a cell phone). The soft board of the soft and hard combination board can be directly used as a connecting belt of the photosensitive assembly, and in the soft and hard combination board, the soft board area extends to the hard board area through the side surface of the hard board area. Whereas, based on the ACF process, the connection tape connects the hard sheets through the hard sheet surface (usually the edge area of the hard sheet surface).
On the other hand, in the conventional design, the photosensitive assembly includes a photosensitive chip and a circuit board, and the circuit board has a through hole corresponding to the photosensitive area of the photosensitive chip. The optical axis of the light sensing chip overlaps with the physical center line of the through hole or has only a small deviation. Generally, the first pad on the lower surface of the wiring board is located a relatively large distance from the physical center of the via due to process limitations. When the chip is mounted upside down, the chip pad has to be disposed at a position far from the through hole in order to attach the chip pad and the first pad of the wiring board in one-to-one correspondence. This results in an increase in the area of the photosensitive chip. In the above embodiments of the present application, the attachment and conduction between the photosensitive chip 103 and the circuit board 101 are achieved by other processes without increasing the distance from the chip electrode 1033 (which may be a chip pad) to the physical center of the through hole 1013.
In another embodiment of the present application, the photosensitive device includes a photosensitive chip assembly, a circuit board 101 and a redistribution layer 102, the photosensitive chip assembly includes a photosensitive chip 103 and an extended layer extending on two sides of the photosensitive chip 103, wherein the photosensitive chip 103 has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the non-photosensitive area is provided with a plurality of chip electrodes 1033. The extension layer extends from the non-photosensitive area to the peripheral side, so that the length and width of the photosensitive chip assembly are extended relative to the size of the photosensitive chip 103. The extension layer is formed by, for example, but not limited to, a photolithography process, a molding process, and the like. When the circuit board electrode 1014 is projected (orthographically) onto the upper surface of the photosensitive chip assembly along the optical axis direction of the photosensitive chip 103 (or the direction perpendicular to the photosensitive surface of the photosensitive chip 103), the circuit board electrode 1014 is projected outside the chip electrode 1033, or the orthographically projected circuit board electrode 1014 along the optical axis direction of the photosensitive chip 103 is located in the extension layer. It should be noted that in the present application, the extension layer is not limited to extend from the non-photosensitive region to the peripheral side, and may extend from the non-photosensitive region to three sides, two sides, or even one side, for example, in other embodiments.
Further, fig. 3 shows a schematic top view of a photosensitive assembly according to another embodiment of the present application. This figure is a perspective view, omitting the wiring board, showing the rewiring layer electrodes 1022 and the chip electrodes 1033. For clarity of the drawing, the redistribution layer traces 1023 are not shown in fig. 3. It is easily understood that, in the present embodiment, the redistribution layer trace 1023 connects the redistribution layer electrode 1022 and the chip electrode 1033. Referring to fig. 3, in the present embodiment, the area of the redistribution layer electrode 1022 may be larger than the area of the chip electrode 1033. The area of the redistribution layer electrodes 1022 is adapted (e.g., equal or substantially equal) to the area of the wiring board electrodes 1014. In this embodiment, the redistribution layer electrode 1022 is located outside the chip electrode 1033 (i.e., the chip electrode 1033 is closer to the physical center of the via 1013 than the redistribution layer electrode 1022). In this embodiment, the electrodes may be all metal electrodes. In particular, in the present embodiment, the chip electrodes 1033 provided on the top side of the photosensitive chip 103 can be led to the left and right sides so as not to excessively increase the size in the Y direction. In fig. 3, the direction from bottom to top is the Y direction, and the direction from right to left is the X direction. The size in the Y direction is not excessively increased, and the screen occupation ratio of the mobile phone is favorably improved (for example, the photosensitive assembly or the camera module is favorably arranged at the position close to the top frame of the mobile phone shell, so that the top edge of the mobile phone screen is allowed to be close to the top frame of the mobile phone shell). In addition, in a modified embodiment, the chip pad and the re-wiring layer pad may have a partial overlap. For clarity of illustration, no overlap is shown in fig. 3.
Further, still referring to FIG. 3, in one embodiment, the re-wiring layer electrodes 1022 on each side may have multiple rows so that more electrodes are disposed on the same side (e.g., left or right) of the photo-sensing chip. The electrodes of the chip 1033 on the top side of the photosensitive chip are routed to the left and right sides by the rewiring layer to connect the rewiring layer electrodes 1022 on the left and right sides, which allows the top side of the photosensitive chip to be free from the rewiring layer electrodes, thereby enabling the size of the rewiring layer in the Y direction (i.e., the direction from bottom to top in fig. 3) to be reduced. Note that the redistribution layer traces are not shown in fig. 3 for clarity of illustration.
Further, still referring to fig. 1, in an embodiment, the photosensitive assembly may further include a metal plate 104. The metal plate 104 has a recess 104a, and the photosensitive chip is accommodated in the recess 104a. And after the metal sheet is attached, a complete photosensitive assembly can be obtained. The metal sheet 104 is attached to the back surface of the rewiring layer 102, so that the photosensitive chip 103 can be isolated from the external environment, and the photosensitive chip 103 is prevented from being damaged due to external force impact. A reserved gap can be kept between the metal sheet 104 and the photosensitive chip 103, so that the photosensitive chip 103 is prevented from being damaged or the electrical connection is prevented from being failed due to collision between the metal sheet 104 and the photosensitive chip 103. The gap may be filled with air, glue, molding, an insulating layer, etc. to better protect the chip.
FIGS. 4-13 illustrate a photosensitive assembly manufacturing process according to an embodiment of the present application. In this embodiment, the method for manufacturing the photosensitive assembly includes the following steps.
S100, the photo sensor chip 103 is placed on the substrate 105a (or called carrier), wherein the photo sensor surface of the photo sensor chip 103 faces downward, i.e. the photo sensor chip 103 is flipped over the substrate 105 a. FIG. 4 shows a schematic view of the placement of the photo-sensing chip 103 on the substrate 105 a. In this embodiment, a plurality of photosensitive chips 103 may be arranged on the substrate 105a at a certain pitch. The layout may be as shown in fig. 5. FIG. 5 shows the layout of an array of photo-sensors that is compatible with wafer level (wafer level) processing. In another embodiment, the placement mode of the photo sensor chip array may also be a placement mode adapted to a panel level (panel) process. FIG. 6 shows the arrangement of the photo sensor chip array adapted to the panel level (panel level) process.
S200, a molding portion 109 is formed on the substrate surface and the backside of the photosensitive chip to cover the photosensitive chip, thereby bonding the photosensitive chip 103, the molding portion 109, and the substrate 105a together. FIG. 7 shows a schematic view of molding on the substrate surface and the backside of the photo-sensing chip.
And S300, grinding the molding part 109 and the photosensitive chip 103 to reduce the thickness of the molding part 109 and the photosensitive chip 103. Fig. 8 shows an assembly of the mold 109 and the photosensitive chip 103 after grinding. In the prior art, in order to reduce the size of the imaging module, the photosensitive chip 103 is usually ground (0.3 mm or more before grinding and 0.15mm after grinding). In this embodiment, when a chip with a thickness of 0.15mm is directly used for wafer/panel level molding (molding), warpage may occur. When the number of photosensitive chips 103 molded at one time is large, the warpage becomes very large, and therefore it is preferable to perform molding using the photosensitive chip 103 which has not been thinned, and then to make the thickness of the combined body of the molding portion 109 and the photosensitive chip 103 thinner as a whole by grinding. The grinding process of this step may be performed directly after the molding (i.e., step S200) is completed, or may be performed after the redistribution layer is prepared. It is noted that step S300 is an optional step, and in some embodiments of the present application, step S300 may be omitted.
S400, a rewiring layer is formed on the front surface of the photosensitive chip and the surface of the molding part 109 around the front surface. Fig. 9 shows a schematic view of forming a rewiring layer on the front surface of the photosensitive chip 103 and the surface of the mold 109 around the same. In this step, the substrate 105a of the molded photo sensor chip array (i.e., the substrate in step S100) may be peeled off, and then the molded photo sensor chip array may be placed on another substrate 105b with the front surface facing upward, and then a rewiring layer may be formed on the front surface of the photo sensor chip 103 and the surface of the molding portion 109 around the front surface.
In this step, the surface of the formed redistribution layer 102 has redistribution layer electrodes 1022, and the redistribution layer electrodes 1022 are connected to the chip electrodes 1033 through redistribution layer traces 1023. The size of the rewiring layer electrode 1022 may be larger than that of the chip electrode 1033, and the position of the rewiring layer electrode 1022 may be located outside the chip electrode 1033 (i.e., a position farther from the photosensitive center). In this embodiment, the redistribution layer electrode 1022 is entirely located above the molding portion 109. In a modified embodiment, the redistribution layer electrode may be partially located above the molding portion 109 and partially located above the photosensitive chip 103, and even the redistribution layer electrode 1022 may have a partial overlap with the chip electrode 1033 (i.e., a part of the redistribution layer electrode 1022 may be located above the chip electrode 1033).
The redistribution layer 102 may be formed on the front surface of the molding portion 109 and the front surface of the assembly of the photo chip 103 by spin-on resist, exposure, development and electroplating processes. The rewiring layer may include a dielectric layer. The redistribution layer trace 1023 is embedded in the dielectric layer.
S500, the rewiring layer 102 above the photosensitive area of the photosensitive chip 103 is removed, and an optical window is formed. Fig. 10 shows a schematic view of forming the light window 106. In step S400, no redistribution layer trace 1023 is disposed above the photosensitive region 1031 of the photosensitive chip 103, and thus the redistribution layer 102 above the photosensitive region 1031 is a dielectric layer. And removing the dielectric layer above the photosensitive region 1031 to obtain a photosensitive chip assembly with an optical window. The photosensitive chip assembly is composed of a photosensitive chip 103, a molding portion 109, and a rewiring layer 102. It is noted that when a plurality of photosensitive chips 103 are molded at the same time, the result of this step is an array of photosensitive chip assemblies.
And S600, cutting the photosensitive chip assembly array obtained in the step S500 to obtain a single photosensitive chip assembly. FIG. 11 shows a schematic diagram of dicing an array of photosensitive chip assemblies. Referring to fig. 11, the cutting is preferably made from the back side 111. This prevents contamination of the chip on the one hand and facilitates subsequent picking up and attaching of the chip assembly to the wiring board on the other hand. In this step, the substrate on the back of the array of the photosensitive chip module may be peeled off first, and then the array of the photosensitive chip module is placed on another substrate with its front surface facing downward, and then cut from the back of the array of the photosensitive chip module.
And S700, attaching the photosensitive chip assembly to the circuit board. In this embodiment, the circuit board 101 is a rigid-flex board. Fig. 12 shows a schematic view of attaching the photosensitive chip assembly to the wiring board 101. The attachment is based on a flip-chip (flip-chip) process. As shown in fig. 12, the redistribution layer electrodes 1022 of the photo-sensitive chip assembly and the circuit board electrodes 1014 are in one-to-one contact and conductive.
And S800, attaching a metal sheet 104 on the back surface of the circuit board 101 to cover the back of the photosensitive chip assembly. Fig. 13 shows a schematic diagram of attaching a metal sheet 104 on the surface (typically the back surface) of the wiring board 101 to cover the back of the photosensitive chip 103. Referring to fig. 13, the metal plate 104 has a recess 104a, and the photosensitive chip 103 is accommodated in the recess 104a. After the metal sheet 104 is attached, a complete photosensitive assembly can be obtained. The metal sheet 104 is attached to the back surface of the rewiring layer 102, so that the photosensitive chip 103 can be isolated from the external environment, and the photosensitive chip 103 is prevented from being damaged due to external force impact. A reserved gap can be kept between the metal sheet 104 and the photosensitive chip 103, so that the photosensitive chip 103 is prevented from being damaged or the electrical connection is prevented from being failed due to collision between the metal sheet 104 and the photosensitive chip 103. The gap may be filled with air, glue, molding, an insulating layer, etc. to better protect the chip.
Fig. 14 shows a schematic view of molding on the back surface of the wiring board 101 and the photosensitive chip assembly. In another embodiment, as shown in fig. 14, the metal sheet 104 may be replaced with a molding layer 107 in step S800. The molding layer 107 may be formed on the back surface of the re-wiring layer 102 and the back surface of the photosensitive chip 103 by, for example, a molding process. Preferably, to prevent the molding material from penetrating into the photosensitive region, the gap between the rewiring layer 102 and the wiring board 103 (mainly the area around the connection point of the rewiring layer electrode 1022 and the wiring board electrode 1014) may be filled based on the underfil process to form the filling layer 108, and then the molding layer 107 may be formed based on the molding process.
FIG. 15 shows a schematic view of a photosensitive assembly according to another embodiment of the present application. In this embodiment, the wiring board 101 has a recess 101b around the through-hole 1013. The photosensitive chip assembly is accommodated in this recess 101b. In other words, the back surface of the wiring board 101 forms a step around the through-hole 1013, thereby forming the recess 101b, and the photosensitive chip 103 is placed on the step and brought into contact with the wiring board 101 at the step (e.g., the bottom surface 101c of the step) and conducted. In this embodiment, the metal sheet 104 may be a flat plate, which is attached to the back surface of the circuit board 101 and covers the back of the photosensitive chip assembly. The metal sheet 104 has a gap with the back surface of the photo chip assembly (i.e., they are not in direct contact). The metal sheet 104 isolates the photosensitive chip 103 from the external environment, thereby preventing the photosensitive chip 103 from being damaged due to external impact. A reserved gap can be kept between the metal sheet 104 and the photosensitive chip 103, so that the photosensitive chip 103 is prevented from being damaged or the electrical connection is prevented from being failed due to collision between the metal sheet 104 and the photosensitive chip 103. The gap may be filled with air, glue, molding, an insulating layer, etc. to better protect the chip. In this embodiment, the metal sheet 104 may be a steel sheet. It is noted that the metal sheet 104 in this application may be replaced by a metal sheet other than a steel sheet.
Further, according to another embodiment of the present application, there is provided another method for manufacturing a photosensitive assembly, which is different from the embodiment shown in fig. 4 to 13 in that a molding from the front surface is used to form an array of photosensitive chip assemblies. Specifically, the present embodiment includes the following steps.
S100', the photosensitive chip is placed on a substrate (or called a carrier), wherein the photosensitive surface of the photosensitive chip faces downward. S200', a molding part 109 is formed on the substrate surface and the backside of the photosensitive chip to cover the photosensitive chip, thereby bonding the photosensitive chip 103, the molding part 109, and the substrate 105a together. When a plurality of photosensitive chips 103 are molded at a time, a molded photosensitive chip array can be obtained.
S300', the back of the mold 109 and the photosensitive chip 103 are ground to reduce the thickness of the mold 109 and the photosensitive chip 103. Note that in another embodiment, only the molding portion 109 may be ground to reduce the thickness, and the backside of the photosensitive chip 103 may or may not be exposed. In another variant embodiment, this step may be omitted.
S400', a protection layer is formed on the photosensitive surface (i.e., the surface of the photosensitive region), and a rewiring layer 102 is formed on the front surface of the photosensitive chip and the surface of the molding portion 109 around the front surface. FIG. 16 shows a molded array of photosensitive chips with a protective layer 110 in one embodiment of the present application. The protection layer may be a sacrificial layer (the sacrificial layer is mainly made of silicon oxide, polysilicon, photoresist, or the like). Fig. 17 shows a schematic view of the re-wiring layer 102 formed on the front surface of the photosensitive chip 103 and the surface of the mold 109 around the same in step S400'. Due to the protection layer 110, the redistribution layer 102 in this embodiment does not cover the photosensitive region 1031, and besides, the position and structure of the redistribution layer in this embodiment may be the same as those in the foregoing step S400, which is not described herein again. After this step is completed, an array of the photo sensitive chip 1031 components having the protective layer 104 can be obtained.
S500', the passivation layer 110 is removed. FIG. 18 shows the array of photosensitive chip assemblies after the protective layer 110 is removed.
S600'-S800', the photosensitive chip 1031 assembly array is diced, and the wiring board 101 and the metal sheet 104 are attached. The steps S600'-S800' may be identical to the steps S600-S800 described above, and are not described herein again.
Further, in another embodiment of the present application, another method for manufacturing a photosensitive assembly is provided, in which a protective layer covering the surface of the photosensitive region is remained. The protective layer may be a filter (e.g., infrared or visible) or a glass cover plate (purely protective). In contrast to the previous embodiment, the present embodiment omits the step S500', and the steps S100' -S400' and S600' -S800' are identical to the previous embodiment. FIG. 19 shows a schematic diagram of dicing an array of photosensitive chip assemblies with protective layer remaining. Fig. 20 shows a schematic view of the photosensitive chip assembly with the protective layer left attached to the wiring board 101. Fig. 21 shows a schematic view of the photosensitive assembly with the remaining protective layer to which the metal sheet 104 is attached.
Further, fig. 22 shows a schematic view of molding on the back surface of the wiring board 101 and the photosensitive chip assembly with the photosensitive protective layer remaining. Referring to fig. 22, in another embodiment of the present application, the metal sheet 104 in step S800' may be replaced by a molding layer 107. The molding layer 107 may be formed on the rewiring layer 102 and the back surface of the photosensitive chip 103 by, for example, a molding process. Preferably, to prevent the molding material from penetrating into the photosensitive region, the gap between the rewiring layer 102 and the wiring board 103 (mainly the area around the connection point of the rewiring layer electrode 1022 and the wiring board electrode 1014) may be filled based on the underfil process to form the filling layer 108, and then the molding layer 107 may be formed based on the molding process.
Further, fig. 23 shows a schematic view of a photosensitive assembly retaining a photosensitive protective layer according to another embodiment of the present application. In this embodiment, the wiring board 101 has a recess 101a around the through-hole 1013. The photosensitive chip assembly with the photosensitive protective layer remaining is accommodated in this recess 101b. In other words, the back surface of the wiring board 101 forms a step around the through-hole 1013, thereby forming the recess 101b, and the photosensitive chip 103 is placed on the step and brought into contact with and conducted to the wiring board 101 at the step (e.g., the bottom surface 101c of the step). In this embodiment, the metal sheet may be a flat plate, which is attached to the back surface of the circuit board and covers the back of the photosensitive chip assembly. The metal sheet has a gap with the back surface of the photosensitive chip assembly (i.e., the two are not in direct contact). The metal plate 104 isolates the photosensitive chip 103 from the external environment, thereby preventing the photosensitive chip 103 from being damaged due to external impact. A reserved gap can be kept between the metal sheet 104 and the photosensitive chip 103, so that the photosensitive chip 103 is prevented from being damaged or the electrical connection is prevented from being failed due to collision between the metal sheet 104 and the photosensitive chip 103. The gap may be filled with air, glue, molding, an insulating layer, etc. to better protect the chip. In this embodiment, the metal sheet may be a steel sheet. It is noted that the metal sheet in this application may be replaced by another metal sheet than the steel sheet.
Further, in one embodiment of the present application, the circuit board may be implemented as a molded circuit board with embedded circuits, the molded circuit board is manufactured by copper-implanting, molding, grinding, etc., the molded circuit board has higher structural strength and flatness, and smaller line width, such as 30 μm, and the higher flatness is suitable for the subsequent re-wiring process and copper-implanting process. In addition, a series of electronic components of the camera module, such as a resistor and a capacitor, can be embedded in the molded circuit board, so that the functions of electromagnetic shielding and electronic component protection are achieved, and the length and width of the camera module can be smaller to a certain extent.
Further, according to an embodiment of the present application, there is also provided a camera module, which includes a lens assembly 112 and a photosensitive assembly. Wherein the photosensitive component can be the photosensitive component of any of the foregoing embodiments. Fig. 24 is a perspective exploded view of a camera module according to an embodiment of the present application. As shown in fig. 24, the lens module is mounted on the front surface of the circuit board 101, and the photosensitive chip module is mounted on the back surface of the circuit board 101. The light window of the photosensitive chip assembly 113 corresponds to the light through hole of the circuit board 101. Further, fig. 25 shows a perspective exploded view of the photosensitive chip assembly 113. Referring to fig. 24 and 25, the photosensitive chip assembly 113 includes a photosensitive chip 103, a molding portion 109 formed around the photosensitive chip 103 (the molding portion 109 may be replaced with another type of expansion layer), and a rewiring layer 102 formed on the surface (front surface) of the photosensitive chip 103 and the molding portion 109. The redistribution layer 102 has a redistribution layer electrode 1022 and a redistribution layer routing 1023, and the redistribution layer routing 1023 conducts the redistribution layer electrode 1022 and the chip electrodes 1033 in a one-to-one correspondence manner. The size and layout of the rewiring layer electrodes are adapted to the wiring board electrodes so that the rewiring layer electrodes 1022 and the wiring board electrodes are in one-to-one correspondence and are electrically connected. The contacting can be effected here, for example, by soldering.
Herein, the photosensitive chip assembly may be regarded as a photosensitive assembly.
The above description is meant as an illustration of preferred embodiments of the application and of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (28)
1. A photosensitive assembly, comprising:
the chip comprises a photosensitive chip, a first electrode and a second electrode, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the non-photosensitive area is provided with a plurality of chip electrodes;
the extension layer is positioned on the side surface of the photosensitive chip, is in contact with the photosensitive chip and has a surface flush with the front surface of the photosensitive chip; and
the rewiring layer is formed on the front surfaces of the expansion layer and the photosensitive chip; the rewiring layer is provided with a plurality of rewiring layer electrodes, and the rewiring layer electrodes are correspondingly connected and conducted with the chip electrodes one by one through rewiring layer wiring;
the circuit board is provided with a plurality of circuit board electrodes, the rewiring layer electrodes are attached to and conducted with the circuit board electrodes in a one-to-one correspondence mode through the reverse pasting technology, and the area of the rewiring layer electrodes is matched with the area of the circuit board electrodes.
2. The photosensitive assembly of claim 1, wherein the circuit board is a rigid-flex board.
3. A photosensitive assembly according to claim 1, wherein the central region of the wiring board and the central region of the rewiring layer each have a through hole, and the chip electrode is closer to the through hole than the rewiring layer electrode.
4. A photosensitive assembly according to claim 1, wherein a filler material is provided around the attachment position of the wiring board and the rewiring layer.
5. The photosensitive assembly of claim 1, wherein an area of the chip electrode is smaller than an area of the rewiring layer electrode.
6. The photosensitive assembly of claim 1 wherein the concentration of the plurality of chip electrodes is higher than the concentration of the plurality of re-wiring layer electrodes; the width of the routing of the rewiring layer is smaller than that of the routing of the circuit board.
7. A photosensitive assembly according to claim 1, wherein the extension layer surrounds the photosensitive chip or is located on one, two or three sides of the photosensitive chip.
8. A photosensitive assembly according to claim 4, wherein the back of the circuit board has a recess, and the photosensitive chip is located in the recess.
9. A photosensitive assembly according to claim 8, further comprising a metal sheet attached to the circuit board and covering the recess.
10. A photosensitive assembly according to claim 4, further comprising a metal sheet attached to the circuit board and covering the back surface of the photosensitive chip, and having a groove and the photosensitive chip is located in the groove.
11. A photosensitive assembly according to claim 9 or 10, wherein a gap is left between the metal sheet and the photosensitive chip.
12. The photosensitive assembly of claim 4 further comprising a molding layer covering the backside of the circuit board and the photosensitive chip.
13. The photosensitive assembly of claim 1, wherein the photosensitive chip has an array of chip electrodes on a top side or a bottom side in a top view, and the chip electrodes are connected to the rewiring layer electrodes on a left side or a right side of the photosensitive chip by the rewiring layer traces.
14. The photosensitive assembly according to any one of claims 1 to 10, wherein the surface of the photosensitive region of the photosensitive chip has a protective layer; the protective layer is a color filter or a transparent cover plate.
15. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of any one of claims 1 to 14; and
and the optical lens assembly is arranged on the photosensitive assembly.
16. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps:
placing a photosensitive chip on the surface of a substrate;
manufacturing an extension layer extending out of the side face of the photosensitive chip on the surface of a substrate, and enabling the surface of the extension layer to be flush with the surface of the photosensitive chip; and
manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip, connecting a plurality of photosensitive electrodes of the photosensitive chip to a plurality of rewiring layer electrodes positioned on the rewiring layer through rewiring layer routing, wherein the sizes and the layouts of the rewiring layer electrodes are suitable for attaching a plurality of circuit board electrodes in a one-to-one correspondence manner;
and attaching the circuit board to the rewiring layer by adopting a reverse pasting process, wherein the rewiring layer electrodes are in one-to-one correspondence to be in contact with and conducted with the circuit board electrodes of the circuit board, and the area of the rewiring layer electrodes is matched with the area of the circuit board electrodes.
17. The method of claim 16, wherein in the step of placing the photo chip on the surface of the substrate, the photo surface of the photo chip faces the substrate; and
in the step of manufacturing an extension layer extending from the side surface of the photosensitive chip on the surface of the substrate, the contact surface of the extension layer and the substrate and the surface of the photosensitive chip on the side of the photosensitive surface form the flush surface for manufacturing the rewiring layer.
18. The method of manufacturing a photosensitive assembly according to claim 17, wherein in the step of manufacturing an extension layer extending from a side surface of the photosensitive chip on the surface of the substrate, a molding portion surrounding the photosensitive chip is formed by molding from a back surface of the photosensitive chip, and the molding portion is used as the extension layer.
19. The method of claim 17, wherein the step of forming an extension layer on the substrate surface extending from the side of the photo-sensor chip further comprises:
and grinding the extension layer to thin the photosensitive assembly.
20. The method of claim 19, wherein the step of forming an extension layer on the substrate surface extending from the side of the photo-sensor chip further comprises:
and grinding the back surfaces of the extension layer and the photosensitive chip to thin the photosensitive assembly.
21. The method of claim 16, wherein the step of forming a redistribution layer on the flush surfaces of the expansion layer and the photosensitive chip further comprises:
and removing the rewiring layer covering the photosensitive surface of the photosensitive chip to expose the photosensitive surface.
22. The method of claim 16, further comprising: and forming a protective layer on the photosensitive surface of the photosensitive chip before the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip is executed.
23. The method of claim 22, wherein in the step of placing the photo-sensing chip on the surface of the substrate, the protective layer is a sacrificial layer;
the manufacturing method of the photosensitive assembly further comprises the following steps: and removing the sacrificial layer after the step of manufacturing a rewiring layer on the flush surfaces of the extension layer and the photosensitive chip is completed.
24. The method of claim 22 wherein the step of placing the photosensitive chip on the surface of the substrate and the protective layer is a color filter.
25. The method of manufacturing a photosensitive assembly according to claim 16, further comprising:
and after the circuit board is attached to the rewiring layer, attaching a metal sheet to the back surface of the circuit board, so that the metal sheet covers the back of the photosensitive chip.
26. The method of manufacturing a photosensitive assembly according to claim 16, further comprising:
after attaching a wiring board to the rewiring layer, disposing a filling material around an attachment position of the wiring board and the rewiring layer; and
and covering a molding layer on the back surfaces of the circuit board and the photosensitive chip by a molding process.
27. A method for fabricating a photosensitive assembly according to any one of claims 16 to 24, wherein in the step of disposing a photosensitive chip on the surface of the substrate, a plurality of said photosensitive chips are disposed at intervals on the surface of the same substrate to form an array of photosensitive chips;
in the step of manufacturing an extension layer surrounding the photosensitive chips on the surface of a substrate, manufacturing an integrally formed extension layer on the substrate, wherein the extension layer surrounds each photosensitive chip to form a photosensitive chip assembly array;
in the step of manufacturing a rewiring layer on the flush surface of the extension layer and the photosensitive chip, manufacturing the rewiring layer on the surface of the photosensitive chip assembly array; and
and cutting the photosensitive chip assembly array after the step of manufacturing a rewiring layer on the flush surface of the extension layer and the photosensitive chip so as to obtain a single photosensitive assembly.
28. The method of claim 27, wherein the step of dicing the array of photosensitive die assemblies includes dicing the array of photosensitive die assemblies from a backside.
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| CN201810997067.5A CN110661938A (en) | 2018-06-29 | 2018-08-29 | Photosensitive assembly, camera module and manufacturing method thereof |
| PCT/CN2019/097078 WO2020042829A1 (en) | 2018-06-29 | 2019-07-22 | Photosensitive assembly, and camera module and manufacturing method therefor |
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| CN112740647A CN112740647A (en) | 2021-04-30 |
| CN112740647B true CN112740647B (en) | 2022-11-04 |
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| CN201821230522.0U Active CN208768159U (en) | 2018-06-29 | 2018-08-01 | Circuit board module, photosensory assembly and camera module |
| CN201821231045.XU Active CN208638447U (en) | 2018-06-29 | 2018-08-01 | Circuit board module, photosensory assembly and camera module |
| CN201810865550.8A Pending CN110661937A (en) | 2018-06-29 | 2018-08-01 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| CN201821404180.XU Active CN208956151U (en) | 2018-06-29 | 2018-08-29 | Circuit board module, photosensory assembly and camera module |
| CN201821404179.7U Active CN209170489U (en) | 2018-06-29 | 2018-08-29 | Photosensory assembly and camera module |
| CN201810997067.5A Pending CN110661938A (en) | 2018-06-29 | 2018-08-29 | Photosensitive assembly, camera module and manufacturing method thereof |
| CN201810998040.8A Pending CN110661939A (en) | 2018-06-29 | 2018-08-29 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| CN201980040666.0A Active CN112840632B (en) | 2018-06-29 | 2019-07-22 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| CN201980040667.5A Active CN112740647B (en) | 2018-06-29 | 2019-07-22 | Photosensitive assembly, camera module and manufacturing method thereof |
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| CN201821231045.XU Active CN208638447U (en) | 2018-06-29 | 2018-08-01 | Circuit board module, photosensory assembly and camera module |
| CN201810865550.8A Pending CN110661937A (en) | 2018-06-29 | 2018-08-01 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| CN201821404180.XU Active CN208956151U (en) | 2018-06-29 | 2018-08-29 | Circuit board module, photosensory assembly and camera module |
| CN201821404179.7U Active CN209170489U (en) | 2018-06-29 | 2018-08-29 | Photosensory assembly and camera module |
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| CN201980040666.0A Active CN112840632B (en) | 2018-06-29 | 2019-07-22 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
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| WO2020001583A1 (en) * | 2018-06-29 | 2020-01-02 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module, and manufacturing method therefor |
| CN111866324B (en) * | 2019-04-30 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and preparation method |
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Also Published As
| Publication number | Publication date |
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| CN110661936B (en) | 2024-04-16 |
| WO2020024830A1 (en) | 2020-02-06 |
| CN110661938A (en) | 2020-01-07 |
| CN110661937A (en) | 2020-01-07 |
| CN208768159U (en) | 2019-04-19 |
| CN208638447U (en) | 2019-03-22 |
| CN110661936A (en) | 2020-01-07 |
| CN112740647A (en) | 2021-04-30 |
| CN112840632B (en) | 2022-09-09 |
| WO2020024829A1 (en) | 2020-02-06 |
| CN110661939A (en) | 2020-01-07 |
| CN208956151U (en) | 2019-06-07 |
| WO2020042829A1 (en) | 2020-03-05 |
| CN112840632A (en) | 2021-05-25 |
| CN209170489U (en) | 2019-07-26 |
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