CN208638447U

CN208638447U - Circuit board module, photosensory assembly and camera module

Info

Publication number: CN208638447U
Application number: CN201821231045.XU
Authority: CN
Inventors: 王明珠; 黄桢; 田中武彦; 陈振宇; 郭楠; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-06-29
Filing date: 2018-08-01
Publication date: 2019-03-22
Anticipated expiration: 2028-08-01
Also published as: WO2020024829A1; CN110661939B; CN112740647B; CN209170489U; WO2020024830A1; CN112840632B; CN110661938A; CN112740647A; CN208768159U; WO2020042829A1; CN110661939A; CN112840632A; CN110661936B; CN208956151U; CN110661937A; CN110661936A

Abstract

The utility model provides a kind of photosensory assembly, comprising: sensitive chip, with photosensitive region and the non-photo-sensing region being centered around around photosensitive region, wherein the non-photo-sensing region is provided with multiple chip electrodes；Wiring board has through-hole corresponding with the photosensitive region, and the lower surface of the wiring board has multiple first electrodes, and the wiring board is hardboard or Rigid Flex；And wiring layer again, it is formed in the lower surface of the wiring board, the lower surface of the wiring layer again has multiple second electrodes, and each of the multiple first electrode passes through routing traces again and the corresponding second electrode electrical connection respectively；Sensitive chip attaches to the lower surface of the wiring layer again, and second electrode is contacted and is connected correspondingly with chip electrode respectively.The utility model additionally provides corresponding circuit board module and camera module.The high-density packages of camera module sensitive chip may be implemented in the utility model；The encapsulation of high I/O number may be implemented.

Description

Circuit board module, photosensory assembly and camera module

Technical field

The utility model relates to optical technical fields, specifically, the utility model relates to circuit board modules, photosensory assembly And camera module.

Background technique

With the rapid development of smart phone and other electronic equipments, since mobile phone screen is increasingly intended to shield comprehensively Change, is lightening therefore more more and more intense to the miniature requirement of camera module.

Camera module generally includes optical lens assembly and photosensory assembly.Wherein photosensory assembly generally includes wiring board and peace Sensitive chip loaded on wiring board.In existing camera module, sensitive chip is usually to pass through " beating gold thread " (i.e. wire Bond or wire bonding) it technique or loses money instead of making money chip (i.e. flipchip) technique and realizes and the conducting of circuit layer.

Conventional print-circuit board is limited to the fever of route caused by current requirements, wiring board material and printed circuit board The factors such as process capability cause common printed circuit board the wide line away from 70 μm or so.Correspondingly, it is limited to traditional wire The line width line-spacing of road plate, chip can also take the factor of wiring board into account when being connected, pad spacing can not further reduce, this and core The development trend that piece is increasingly miniaturized is away from each other.In addition, the pad due to chip is more and more intensive, spacing is also gradually approaching pole Limit, in the case where this gold thread is very intensive, is easy to happen between gold thread and interferes, so as to cause electricity under wire bond technique Road failure.On the other hand, in entire manufacturing process, a series of such as molding, mirror will be also carried out after wire bond technique Seat and etc., the reliability that gold thread connects will all be impacted.Furthermore gold thread has certain camber, therefore in mould group To increase by one section of additional height to avoid gold thread usually, therefore, the presence of gold thread may hinder the miniaturization of mould group.

Nowadays, part manufacturer solves gold thread bring a series of problems using flip chip technique.Such as flip In chip technique, since it is that chip is attached directly to circuit board bottom side, then pass through gold goal reality between chip and circuit board It is now connected, the length that wiring board is connected with sensitive chip under this technique greatly shortens, and reduces delay, effectively improves electricity Performance.On the other hand, Flip Chip technique is high for conducting precision and flatness requirement, needs using with high structural strength Inflexible ceramic substrate is done wiring board (i.e. circuit board), and its price is very expensive.In addition, this process program requirement The pad size and pad closeness and the pad size of sensitive chip and pad closeness of wiring board are consistent or almost the same.It is logical For often, since technique limits, the minimum dimension of the pad of wiring board is limited, while gold stud bump line width is larger, such as 100 μm or so.In order to adapt to flip chip technique, the size of sensitive chip pad is difficult to further reduce, so that itself and route The pad size of plate is adapted to.The number of pads that can be arranged on sensitive chip so just reduces, or increases number of pads meeting Sensitive chip size is caused to increase, the size for being unfavorable for camera module reduces.This is because the pixel of sensitive chip is higher, it is required The image data amount to be exported is bigger, and more ports I/O is also just needed to carry out output data.And less bonding pad number causes It reduces the port I/O of output data.Therefore, existing flip chip technique is unfavorable for the raising of sensitive chip number of pixels.

Utility model content

The utility model is intended to provide a kind of solution of at least one defect that can overcome the prior art.

One aspect according to the present utility model provides a kind of photosensory assembly, comprising: sensitive chip, with photosensitive Region and the non-photo-sensing region being centered around around photosensitive region, wherein the non-photo-sensing region is provided with multiple chip electrodes；Line Road plate, has through-hole corresponding with the photosensitive region, and the lower surface of the wiring board has multiple first electrodes, and institute Stating wiring board is hardboard or Rigid Flex；And wiring layer again, it is formed in the lower surface of the wiring board, the wiring layer again Lower surface there are multiple second electrodes, each of the multiple first electrode passes through routing traces again and corresponding institute respectively State second electrode electrical connection；Also, the sensitive chip attaches to the lower surface of the wiring layer again, and the multiple second Electrode is contacted and is connected correspondingly with the multiple chip electrode respectively.

Wherein, the second electrode is than the first electrode close to the through-hole.

Wherein, the area of the second electrode is less than the area of the first electrode.

Wherein, the closeness of the multiple second electrode is higher than the multiple first electrode.

Wherein, the wiring board is Rigid Flex, and the Rigid Flex includes hardboard area and flexible board area, the through-hole Positioned at the hardboard area, the multiple first electrode is located at the lower surface in the hardboard area.

Wherein, the width of the cabling of the wiring layer again is less than the width of the cabling of the wiring board.

Wherein, the second electrode is metal column.

Wherein, insulation protection glue is filled around the metal column.

Wherein, the second electrode and the chip electrode are attached together by planting ball technique.

Wherein, the position filling insulation protection glue of ball is planted.

Wherein, the photosensory assembly further includes sheet metal, which has a groove, the sheet metal attach to it is described again The lower surface of wiring layer, and the sensitive chip is made to be contained in the groove.

Wherein, the sheet metal is not contacted with the sensitive chip.

Wherein, the photosensory assembly further includes molding layer, and the molding layer is formed in the surface of wiring layer and the institute again State the back side of sensitive chip, and the molding layer contact the sensitive chip side and the insulation protection glue.

Wherein, the lower surface of the wiring board has groove, and the sensitive chip is located in the groove, and described photosensitive group Part further includes sheet metal, and the sheet metal attaches to the wiring board and covers the groove, the sheet metal with it is described photosensitive There are gaps between chip.

Wherein, the lower surface of the wiring board is the surface after planarization process.

Another aspect according to the present utility model additionally provides a kind of circuit board module, comprising: wiring board, have with The lower surface of the corresponding through-hole of the photosensitive region, the wiring board has multiple first electrodes, and the wiring board is hard Plate or Rigid Flex；And wiring layer again, it is formed in the lower surface of the wiring board, the lower surface of the wiring layer again has Multiple second electrodes, each of the multiple first electrode are electrically connected by being routed again with the corresponding second electrode respectively It connects；And the sensitive chip attaches to the lower surface of the wiring layer again, and the size and cloth of the multiple second electrode Office be suitable for based on lose money instead of making money technique attachment sensitive chip so that the multiple second electrode respectively with multiple cores of the sensitive chip Plate electrode is contacted and is connected correspondingly.

Wherein, the second electrode is than the first electrode close to the through-hole；The closeness of the multiple second electrode Higher than the multiple first electrode.

Another aspect according to the present utility model additionally provides a kind of camera module, comprising: aforementioned any photosensitive group Part；And it is installed on the optical lens of the photosensory assembly.

Another aspect according to the present utility model, additionally provides a kind of photosensory assembly, and production method includes: assist side Lower surface formed again wiring layer constitute circuit board module, wherein the lower surface of the wiring board have multiple first electrodes, institute State again wiring layer lower surface have multiple second electrodes, each of the multiple first electrode respectively by be routed again with it is right The second electrode electrical connection answered；And sensitive chip is attached into the circuit board module, wherein the multiple second electricity Pole contacts and is connected correspondingly with the multiple chip electrode respectively.

Wherein, assist side lower surface formed again wiring layer the step of include: to be planarized to wiring board lower surface Processing；And the wiring layer again is formed on the wiring board lower surface after planarization process.

Wherein, the lower surface that the lower surface of assist side forms that the step of wiring layer again includes: assist side directly makes The first electrode is connected to by routing traces again, the routing traces again from the first end of the light hole far from the wiring board Close to the second end of the light hole；And the second electrode is made on the position of the second end of routing traces again.

Wherein, the lower surface of assist side forms the step of wiring layer again further include: described attaching to sensitive chip After circuit board module, the first electrode and the routing traces again are covered by underfill process.

Wherein, the lower surface of assist side forms the step of wiring layer again further include: leads to after making the second electrode It crosses underfill process and fills insulation protection glue in the junction of the second electrode and the chip electrode.

Wherein, the lower surface of assist side directly makes the lower surface rotation that the step of routing traces again includes: assist side Resist coating；Photoresist is exposed；Develop to the photoresist of exposure；Conduction material is plated in the formed cabling channel that develops Material；And removal photoresist, it leaves conductive material and is formed by cabling.

Wherein, assist side lower surface formed again wiring layer the step of include: to draw the first electrode；In route The lower surface fill insulant of plate forms first medium layer, wherein the first medium layer and the first electrode of extraction Surface flushes；Wiring layer cabling again is made on the surface of the first medium layer and the first electrode of extraction；Described The surface fill insulant of one dielectric layer forms second dielectric layer, wherein the second dielectric layer and the wiring layer cabling again Surface flush；Second electrode is drawn on the surface of the cabling of wiring layer again；And the second dielectric layer surface and The surface fill insulant of the cabling of wiring layer again forms third dielectric layer.

Wherein, the lower surface of assist side was formed in the step of wiring layer again, and the cabling of wiring layer again passes through spin coating light Photoresist, exposure, development, plating or plant conductive material and the process flow for removing photoresist are made.

Wherein, by the first electrode draw the step of by spin coating photoresist, exposure, development, plating or plant conductive material, And the process flow of removal photoresist is made.

Wherein, pass through spin coating photoresist the step of second electrode is drawn on the surface of the cabling of wiring layer again, exposure, show Shadow, plating or plant conductive material and the process flow for removing photoresist are made.

Wherein, the wiring board has through-hole corresponding with photosensitive region；The lower surface for executing the assist side is formed Again before the step of wiring layer, the through-hole is filled so that the lower surface of the wiring board and the lower surface formation one of filler are complete Whole plane；And before executing the step of sensitive chip is attached to the circuit board module, the filler is removed to expose The through-hole.

Wherein, in the step of through-hole being filled, the filler is photoresist.

Compared with prior art, the utility model has at least one following technical effect:

1, the utility model may be implemented the photosensitive core of the biggish circuit pads/line conduction of line width to smaller contact Piece realizes the high-density packages of camera module sensitive chip.

2, the circuit pads that the utility model may be implemented on the outside of relatively close optical window are conducted to the core closer to optical window Piece pad.

3, the utility model may be implemented camera module and lose money instead of making money chip technology using conventional printed wiring board realization, to realize The encapsulation of high I/O number.

4, the utility model can need the technique of high temperature hot pressing to attach the connecting band of camera module to avoid ACF etc., have Help the miniaturization of camera module, and improves yield.

Detailed description of the invention

Exemplary embodiment is shown in reference attached drawing.Embodiment and attached drawing disclosed herein should be considered illustrative , and not restrictive.

Fig. 1 shows the diagrammatic cross-section of the photosensory assembly of the utility model one embodiment；

The electrode that Fig. 2 shows the photosensory assemblies of Fig. 1 under depression angle and again wiring layer cabling；

Fig. 3 shows the Rigid Flex with through-hole；

Fig. 4 shows the schematic diagram of the wiring board after spin coating photoresist；

Fig. 5 shows the schematic diagram being exposed to the first photoresist layer；

Fig. 6 shows the schematic diagram to develop to the first photoresist layer after exposure；

Fig. 7 is shown in the groove plant copper of the first photoresist layer or copper-plated schematic diagram；

Fig. 8 shows the schematic diagram of the first photoresist layer of removal；

Fig. 9 shows assist side surface filling insulation/protection medium schematic diagram；

Figure 10 shows in insulating medium layer and plants the schematic diagram of copper or copper-plated top surface spin coating photoresist；

Figure 11 shows the schematic diagram being exposed to the second photoresist layer；

Figure 12 shows the schematic diagram to develop to the second photoresist layer after exposure；

Figure 13 shows the schematic diagram that wiring layer cabling again is formed in the groove of the second photoresist layer；

Figure 14 shows the schematic diagram of the second photoresist layer of removal；

Figure 15 shows filling insulation/protection medium on first medium layer, forms the schematic diagram of second dielectric layer；

Figure 16 is shown in second dielectric layer and the schematic diagram of wiring layer cabling surface spin coating photoresist again；

Figure 17 shows the schematic diagrames being exposed to third photoresist layer；

Figure 18 shows the schematic diagram to develop to the third photoresist layer after exposure；

Figure 19 is shown in the groove plant copper of third photoresist layer or copper-plated schematic diagram；

Figure 20 shows the schematic diagram of removal third photoresist layer；

Figure 21 shows filling insulation/protection medium schematic diagram in second dielectric layer and again wiring layer cabling；

Figure 22, which is shown, plants the schematic diagram of copper post at the top of second electrode；

Figure 23 shows the schematic diagram that sensitive chip is attached to planted copper post；

Figure 24 shows the schematic diagram for applying insulation protection glue at copper post；

Figure 25, which is shown, plants the schematic diagram of ball at the top of second electrode；

Figure 26 shows the schematic diagram that sensitive chip is attached to second electrode by plant ball；

Figure 27, which is shown, is planting the schematic diagram for applying insulation protection glue at ball；

Figure 28 shows the photosensory assembly with steel disc in the utility model one embodiment；

Figure 29 shows the photosensory assembly with molding layer in the utility model one embodiment；

Figure 30 shows the schematic diagram of PCB surface out-of-flatness；

Figure 31 shows the schematic diagram ground to wiring board；

Figure 32 shows the schematic diagram of the wiring board after the completion of grinding；

Figure 33 shows the schematic diagram that hot pressing or weight are carried out to wiring board；

Figure 34 shows the schematic diagram that Self-leveling is carried out to wiring board；

Figure 35 shows photoresist layer and forms the schematic diagram on slope in the edge close to through-hole；

Figure 36 shows the schematic diagram of the wiring board material layer of the utility model one embodiment；

Figure 37 shows the circuit board module for making on complete surface and obtaining after wiring layer again；

Figure 38 shows the production process of the circuit board module in another embodiment of the utility model；

Figure 39 shows a kind of cross-sectional view of wiring layer again in the prior art；

Figure 40, which is shown, directly to be made wiring layer cabling again on the wiring board Jing Guo planarization process and forms wiring board The schematic diagram of component；

Figure 41 shows the schematic diagram that sensitive chip is attached on the circuit board module of Figure 40；

Figure 42 shows the schematic diagram for applying insulation protection glue at attachment location；

Figure 43 shows the schematic diagram of the covering insulating material on wiring layer cabling again；

Figure 44 shows the schematic diagram of wired circuit again and wiring board circuit in the utility model one embodiment；

Figure 45 shows the diagrammatic cross-section of the photosensory assembly in another embodiment of the utility model.

Specific embodiment

Various aspects of the reference attached drawing to the application are made more detailed description by the application in order to better understand.It answers Understand, the only description to the illustrative embodiments of the application is described in detail in these, rather than limits the application in any way Range.In the specification, the identical element of identical reference numbers.Stating "and/or" includes associated institute Any and all combinations of one or more of list of items.

It should be noted that in the present specification, the first, second equal statement is only used for a feature and another feature differentiation It comes, without indicating any restrictions to feature.Therefore, discussed below without departing substantially from teachings of the present application First main body is also known as the second main body.

In the accompanying drawings, for ease of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative And it is and non-critical drawn to scale.

It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or their combination.In addition, ought be such as When the statement of at least one of " ... " appears in after the list of listed feature, entire listed feature is modified, rather than is modified Individual component in list.In addition, when describing presently filed embodiment, use " can with " indicate " one of the application or Multiple embodiments ".Also, term " illustrative " is intended to refer to example or illustration.

As it is used in the present context, term " substantially ", " about " and similar term are used as the approximate term of table, and Be not used as the term of table degree, and be intended to illustrate by by those skilled in the art will appreciate that, measured value or calculated value In inherent variability.

Unless otherwise defined, otherwise all terms (including technical terms and scientific words) used herein all have with The application one skilled in the art's is generally understood identical meaning.It will also be appreciated that term (such as in everyday words Term defined in allusion quotation) it should be interpreted as having and their consistent meanings of meaning in the context of the relevant technologies, and It will not be explained with idealization or excessively formal sense, unless clear herein so limit.

It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

Fig. 1 shows the diagrammatic cross-section of the photosensory assembly of the utility model one embodiment.With reference to Fig. 1, this photosensitive group Part includes: sensitive chip 103, wiring board 101 and wiring layer 102 again.Wherein sensitive chip 103 has photosensitive region 1031 and encloses It is wound on the non-photo-sensing region 1032 around photosensitive region 1031, the non-photo-sensing region 1032 is provided with multiple chip electrodes 1033.This multiple chip electrode 1033 (or being properly termed as chip bonding pad) can be centered around around photosensitive region 1031.This reality The wiring board 101 applied in example can be Rigid Flex.Rigid Flex includes hardboard area 1011 and flexible board area 1012, described hard 1011 center of plate area has through-hole 1013.Herein, the hardboard area 1011 can be understood as in Rigid Flex on the whole It is rendered as the region of rigidity (inflexibility at normal temperature), the flexible board area 1012 can be understood as the entirety in Rigid Flex On be rendered as the region of flexible (i.e. flexible).It may be noted that hardboard area 1011 can be by multiple hardboard 1011a and soft board 1012a lamination and formed rigid region is presented on the whole, might not be only made of hardboard 1011a.Further, hardboard The lower surface in area 1011 has multiple first electrodes 1014 (or being properly termed as the first pad).Wiring layer 102 is formed in firmly again There is multiple second electrodes 1022 (or to be properly termed as the second weldering for the lower surface plate 1011a, the lower surface of the wiring layer again 102 Disk), each of the multiple first electrode 1014 respectively by wired circuit 1021 (i.e. wiring layer cabling again) again with it is corresponding The second electrode 1022 be electrically connected；Also, the sensitive chip 103 attaches to the lower surface of the wiring layer 102 again, and And the multiple second electrode 1022 is contacted and is connected correspondingly with the multiple chip electrode 1033 respectively.The through-hole 1013 can be light hole, and the positions and dimensions of the light hole are adapted to the photosensitive region 1031 of the sensitive chip 103.First The area of electrode 1014 can be greater than the area of second electrode 1022.The area of second electrode 1022 and the face of chip electrode 1033 Product adaptation (such as equal or of substantially equal).Also there is wiring board cabling 1015 in wiring board 101, photosensory assembly can be formed Functional circuit.Further, the electrode that Fig. 2 shows the photosensory assemblies of Fig. 1 under depression angle and again wiring layer cabling 1021.As can be seen that first electrode 1014 is located at outside (the i.e. ratio of second electrode 1022 of second electrode 1022 in the present embodiment First electrode 1014 is close to the light hole 1013).In the present embodiment, electrode can be metal electrode.

In the prior art, the pad size range of Rigid Flex is 60~80 μm, and the pad ruler of wiring layer can again To accomplish 20~50 μm.Therefore, in above-described embodiment, by forming again wiring layer 102 on Rigid Flex 101 and realizing fan Enter formula encapsulation, so that the Rigid Flex component that Rigid Flex 101 and again wiring layer 102 collectively form can have small area And densely arranged metal electrode (i.e. pad), so that the electrode (i.e. pad) of Rigid Flex component can be with intensive row The chip electrode 1033 of cloth is contacted and is connected correspondingly, to help to improve the photosensory assembly of filpchip process program Number of pixels, while avoiding various defects brought by existing wire bond technique.On the other hand, Rigid Flex 101 Be a kind of flexible circuit board (alternatively referred to as soft board 1012a, i.e. FPC plate) and rigid wiring board (alternatively referred to as hardboard 1011a, i.e., Pcb board), by processes such as pressings, combined by related process requirement, the line with FPC characteristic and PCB characteristic of formation Road plate.Currently, the manufacture craft of Rigid Flex 101 comparative maturity, the route relative to other techniques such as ceramic substrate Plate has biggish cost advantage.Furthermore the connecting band of the photosensory assembly of above-described embodiment utilizes the production of Rigid Flex 101 Technique is made, can to avoid attachment sensitive chip 103 after need the technique of high temperature hot pressing to attach connecting band by ACF etc. again. Wherein hardboard area can be electrically connected to connector by connecting band, to be electrically connected with the mainboard of terminal device (such as mobile phone).It is soft The soft board 1012a of scleroma plywood 101 can be directly as the connecting band of photosensory assembly, in Rigid Flex 101, flexible board area 1012 It is that the hardboard area is extended to by the side in hardboard area 1011.And being based on ACF technique, then connecting band is by hardboard surface (the usually fringe region on hardboard surface) connects the hardboard 1011a.

It is noted that the Rigid Flex 101 of embodiment shown in FIG. 1 can be replaced with hardboard (such as pcb board).Pass through Wiring layer 102 is formed again on pcb board and realizes fan-in encapsulation, so that the route board group that pcb board and again wiring layer 102 collectively form Part can have small area and densely arranged metal electrode, so that the electrode of Rigid Flex component can be with intensive row The chip electrode 1033 of cloth is contacted and is connected correspondingly, and then is avoided various brought by existing wire bond technique Defect.Meanwhile also contributing to the number of pixels of the photosensory assembly of filpchip process program.Further, due to route Second pad 1022 of board group part than first pad 1014 close to light hole 1013 so that in losing money instead of making money technique, sense The attachment point (can be pad, pressing point or other types of attachment point) of optical chip 103 and circuit board module closer to Photosensitive region 1031.The chip bonding pad 1033 of sensitive chip 103 in this way can be set in the position closer to photosensitive region 1031 Set, facilitate reduce sensitive chip 103 the gross area (gross area here refers to comprising photosensitive region 1031 and non-photo-sensing region 1032 gross area).Therefore the circuit board module of the present embodiment helps to reduce the gross area of sensitive chip 103, and then helps In the miniaturization of camera module.

Further, referring still to Fig. 1, in one embodiment, the second electrode 1022 can be implemented as metal column, Such as copper post 1022a, by the one layer photoresist layer of spin coating on pcb board, then by exposure, development, plant copper, formed it is multiple with The corresponding copper post 1022a of chip electrode 1033.After being spun on Rigid Flex upper surface due to photoresist, by controlling spin coating Revolving speed, time etc., it is ensured that photoresist layer upper surface flatness with higher, and then ensure that each copper post 1022a's Upper surface flushes, that is to say, that the upper surface of each copper post is located at same surface, therefore the chip electrode 1033 of sensitive chip 103 obtains To contact the upper surface of each copper post simultaneously, to solve since segment chip electrode 1033 caused by warpage easily occurs for pcb board The problem of cannot achieve electrical connection.Further, using ultrasonic bond etc. between the copper post 1022a and the chip electrode 1033 Suitable technique realizes electrical connection, and conduction mode the utility model is with no restrictions.

Further, in one embodiment, the upper surface of the copper post 1022a can further adhere to nickel, palladium, gold, The conductive attachments material such as tin cream or conductive silver glue passes through the conductive attachment of the attachment between the chip electrode 1033 and the copper post Material realizes conducting, while being also convenient for the attachment between electrode (such as welding or pressing).

Further, one embodiment according to the present utility model additionally provides a kind of photosensory assembly production method, including The following steps.

Step S100: prepare the wiring board 101 with through-hole.Fig. 3 shows the Rigid Flex with through-hole 101.It is noted that the wiring board 101 in this step is also possible to the line of not through-hole in another embodiment of the utility model Road plate, through-hole can make after wiring layer again completes.Wiring board 101 in this step can be with self manufacture, can also be with It buys on the market.

Step S200: assist side surface spin coating photoresist.PCB surface in this step refers to setting first electrode The surface of 1014 (i.e. route plate electrodes), i.e. lower surface in Fig. 1.Fig. 4 shows the wiring board 101 after spin coating photoresist.It can To find out, the first photoresist layer 104 is formd on the surface of wiring board 101.In Fig. 4, wiring board 101 is squeezed, therefore is set The surface for setting first electrode 1014 is located above.

Step S300: the first photoresist layer 104 is exposed.Fig. 5, which is shown, is exposed the first photoresist layer 104 Schematic diagram.As can be seen that the position 104a being exposed corresponds to the position where first electrode 1014 (i.e. route plate electrode).

Step S400: developing to the first photoresist layer 104 after exposure, i.e., with photoetching (lithography) technique Specific pattern is transferred on the first photoresist layer 104, so that groove 104b is formed at first electrode, so that the wiring board 101 first electrode 1014 is photo-etched glue-line exposure.Fig. 6, which is shown, develops to the first photoresist layer 104 after exposure Schematic diagram.

Step S500: being that mask carries out plating technic (in the first photoetching with the first photoresist layer 1014 after patterned The groove of glue-line 1014 plants copper or copper facing) so that conductive material can be plated be overlying on and be photo-etched glue-line to expose first electric On pole 1014, formation is multiple to be electrically connected in the copper post of first electrode 1014, to first electrode 1014 be drawn, so as to again Wiring layer and circuit board electrical connection.Fig. 7 is shown in the groove plant copper of the first photoresist layer 104 or copper-plated schematic diagram.Institute Stating conductive material can be copper or other suitable metals.

Step S600: the first photoresist layer 104 of removal.Fig. 8 shows the schematic diagram of the first photoresist layer of removal.

Step S700: assist side surface (surface for referring to setting first electrode) filling dielectric forms first medium Layer.It may be noted that the top surface of copper post is exposed to outside first medium layer.Fig. 9 shows showing for assist side surface filling dielectric It is intended to.

Step S800: in first medium layer 106 and the top surface spin coating photoresist of copper post, the second photoresist layer 105 is formed.Figure 10 show the schematic diagram of the top surface spin coating photoresist in first medium layer 106 and copper post.

Step S900: the second photoresist layer 105 is exposed.Figure 11, which is shown, exposes the second photoresist layer 105 The schematic diagram of light.As can be seen that exposure area 105a corresponds to again the cabling of wiring layer.

Step S1000: developing to the second photoresist layer 105 after exposure, i.e., is turned specific pattern with photoetching process It moves on the second photoresist layer 105, shows the pattern for corresponding to again the cabling of wiring layer.The pattern is in the second photoresist layer 105 form groove 105b.Figure 12 shows the schematic diagram to develop to the second photoresist layer 105 after exposure.

Step S1100: with after patterned the second photoresist layer 105 be that mask carries out plating technic (in the second light The groove of photoresist layer 105 plants copper or copper facing (or the conductive materials such as NiPdAu)), form wiring layer cabling 1021 again.Figure 13 shows The schematic diagram of wiring layer cabling 1021 again is gone out to be formed in the groove of the second photoresist layer 105.

Step S1200: the second photoresist layer of removal.Figure 14 shows the schematic diagram of the second photoresist layer of removal.

Step S1300: filling insulation/protection medium on first medium layer 106, forms second dielectric layer 107.Figure 15 shows Go out filling insulation/protection medium on first medium layer 106, forms the schematic diagram of second dielectric layer 107.Second dielectric layer 107 can use material identical with first medium layer 106, and the first, second dielectric layer can combine together at this time.

Step S1400: in second dielectric layer 107 and wiring layer cabling surface spin coating photoresist again, third photoresist is formed Layer 108.Figure 16 is shown in second dielectric layer 107 and the schematic diagram of wiring layer cabling surface spin coating photoresist again.

Step S1500: being exposed third photoresist layer 108, and the region 108a exposed corresponds to second electrode (i.e. Wiring layer electrode again) position.Figure 17 shows the schematic diagrames being exposed to third photoresist layer 108.

Step S1600: developing to the third photoresist layer 108 after exposure, thus in the quilt of third photoresist layer 108 Groove 108b is formed at exposure position.Figure 18 shows the schematic diagram to develop to the third photoresist layer 108 after exposure.

Step S1700: planting copper or copper facing in the groove of third photoresist layer 108, forms second electrode (i.e. wiring layer again Electrode).Figure 19 is shown plants copper or copper-plated schematic diagram at the groove 108b of third photoresist layer.

Step S1800: removal third photoresist layer 108.Second electrode is exposed on outer at this time.Figure 20 shows removal The schematic diagram of three photoresist layers 108.

Step S1900: filling insulation/protection medium in second dielectric layer and again wiring layer cabling, forms third medium Layer.The top of second electrode 1022 is exposed to outside third dielectric layer 109.Figure 21 is shown in second dielectric layer and wiring layer is walked again Insulation/protection medium schematic diagram is filled on line.Third dielectric layer can use material identical with the first, second dielectric layer, The first, second, third dielectric layer can combine together at this time.

Step S2000: copper post is planted at the top of second electrode.Figure 22, which is shown, plants copper post at the top of second electrode 1022 The schematic diagram of 1022a.

Step S2100: sensitive chip is attached into planted copper post.Wherein sensitive chip is inverted, the chip electricity of sensitive chip Pole and second electrode (wiring layer electrode again) correspond.Attachment technique, which can be, to be attached and is connected by anisotropic conductive adhesive, is led to It crosses ultrasonic welding process to be attached and be connected, be attached by welding procedure of hot pressing and be connected, or is attached by reflow soldering process And be connected etc..Figure 23 shows the schematic diagram that sensitive chip 103 is attached to planted copper post 1022a.

After completing step S2100, photosensory assembly shown in FIG. 1 can be obtained.

It further, can also further include step S2200 in one embodiment of the utility model.

Step S2200: apply insulation protection glue at copper post.In one embodiment, Underfill technique can be passed through Apply insulation protection glue around copper post.Figure 24 shows the schematic diagram for applying insulation protection glue 110 at copper post 1022a.

Further, in one embodiment of the utility model, step S2000-S2200 can be by following step S2000 '-S2200 ' is replaced.

Step S2000 ': ball is planted at the top of second electrode.Figure 25, which is shown, plants ball at the top of second electrode 1022 The schematic diagram of 1022b.The plant ball can be gold goal.

Step S2100 ': sensitive chip is attached into second electrode by planting ball (such as gold goal).Wherein sensitive chip falls It sets, the chip electrode and second electrode (wiring layer electrode again) of sensitive chip correspond.Attachment technique can be by incorgruous Conducting resinl is attached and is connected, is attached by ultrasonic welding process and is connected, be attached by welding procedure of hot pressing and be connected, or It is attached and is connected by reflow soldering process.Figure 26, which is shown, attaches to second electrode for sensitive chip 103 by planting ball 1022b 1022 schematic diagram.

Step S2200 ': apply insulation protection glue at ball planting.In one embodiment, Underfill work can be passed through Skill is planting application insulation protection glue around ball.Figure 27, which is shown, is planting the schematic diagram for applying insulation protection glue 110 at ball 1022b.

Further, in one embodiment of the utility model, the photosensory assembly can also include steel disc 111.Figure 28 show the photosensory assembly with steel disc 111 in the utility model one embodiment.Photosensory assembly in Figure 28 is to be inverted 's.With reference to Figure 28, which attaches to the surface (referring to close to the surface of sensitive chip side) of circuit board module.And the steel disc 111 have groove 111a, and sensitive chip is contained in the groove (i.e. steel disc covers the sensitive chip).Steel disc 111 with it is photosensitive There is gap between chip (i.e. the two is not directly contacted with).The step of being attached steel disc 111 can be in step S2200 or step (should be noted that the utility model is not limited to this) is executed after the completion of S2200 '.Steel disc can make sensitive chip be isolated from extraneous ring Border prevents sensitive chip from being caused to damage by external impacts.Gap is kept between steel disc 111 and sensitive chip, steel can be prevented It collides between piece 111 and sensitive chip.Further, in some embodiments, gap can by air, glue, molding, absolutely The materials such as edge layer filling, preferably to protect chip.In the embodiment of deformation, steel disc 111 can be replaced by other sheet metals.

Further, in one embodiment of the utility model, the photosensory assembly can also include molding layer.The mould Modeling layer is covered on the circuit board module back side (referring to close to the surface of sensitive chip side) and the sensitive chip back side (is located at photosensitive area The surface of domain opposite side).Figure 29 shows the photosensory assembly with molding layer 112 in the utility model one embodiment. The molding layer 112 can make after the completion of step S2200 or step S2200 '.Molding layer 112 can be with direct-on-line road board group The part back side and the sensitive chip back side are formed, and the molding layer 112 contacts the side of sensitive chip and wraps up copper post or plant ball Insulation protection glue.It, can be by mold and the circuit board module back side, the sensitive chip back side, sensitive chip when making the molding layer Side and package copper post or plant ball insulation protection glue forming cavity is collectively formed, the moulding material of liquid fills the molding Chamber obtains the molding layer 112 after die sinking.The molding layer 112 can make sensitive chip be isolated from external environment, prevent photosensitive core Piece is caused to damage by external impacts.

Further, utility model people leads to its surface irregularity the study found that wiring board is easy to happen warpage, unfavorable In the progress of subsequent wiring technique again.For example, (Figure 30 shows PCB surface 1019 not when PCB surface out-of-flatness Smooth schematic diagram), coated on the photoresist layer in PCB surface also by out-of-flatness, to be formed in each copper in photoresist The upper surface of column will not also flush, when this will lead to chip and attaches in copper post, it is difficult to guarantee that each pad is effectively connected. Therefore, in one embodiment of the utility model, in the step s 100, planarization process can be carried out to wiring board.

Further, described that wiring board progress planarization process can be in one embodiment of the utility model Wiring board is ground, wiring board is made to correspond to again the surface flatness with higher of wiring layer.Figure 31 is shown to line The schematic diagram that road plate is ground, Figure 32 show the schematic diagram of the wiring board after the completion of grinding.Grinding work in the present embodiment Skill can be completed in the step s 100.

In another embodiment of the utility model, it is described to wiring board carry out planarization process can be to wiring board into Row hot pressing, weight or baking, make wiring board correspond to again the surface flatness with higher of wiring layer.Figure 33 is shown pair Wiring board carries out the schematic diagram of hot pressing or weight.Hot pressing or weight technique in the present embodiment are completed in the step s 100.

It is described that Self-leveling work can be passed through to wiring board progress planarization process in another embodiment of the utility model Skill is realized.Figure 34 shows the schematic diagram that Self-leveling is carried out to wiring board.Phase is stood after the coating of photoresist 119 with reference to Figure 34 To the long period, its Self-leveling can be made.Self-leveling technique in the present embodiment can be completed in step s 200.

Further, since the wiring board in the utility model has through-hole (light hole), after spin coating photoresist, Photoresist layer may will form slope as shown in the figure in through hole, and since the chip bonding pad of sensitive chip is generally arranged at sense Light region side, and very close to photosensitive region, to reduce chip size, accordingly, the copper post for being formed in again wiring layer also will Positioned at the position close to through hole, with corresponding with chip electrode.Therefore, copper post will be formed in the slope position of photoresist layer. Due to copper post be by into photoresist layer copper facing formed, copper product may be overflowed along inclined-plane, lead to copper post upper surface Out-of-flatness.If each copper post upper surface do not flush may cause be electrically connected between poor contact or copper post and short circuit the problems such as.For into One step solves the above problems, and in one embodiment of the utility model, improves to the wiring board with through-hole, assist side The through hole of each layer applies filler, such as photoresist.

Further, Figure 35 shows photoresist layer and forms the schematic diagram on slope in the edge close to through-hole.Due to this Wiring board 101 in utility model has through-hole 1013, therefore after spin coating photoresist, photoresist layer 1021a is in through-hole 1013 Place may will form slope 1021b as shown in Figure 11, and since the chip electrode of sensitive chip 103 1033 is generally arranged at 1031 side of photosensitive region, and very close to photosensitive region 1031, to reduce chip size, accordingly, it is formed in wiring layer again 102 copper post 1022a will also be located at the position at through-hole 1013, with corresponding with chip electrode 1033.Therefore, copper post 1022a will likely be formed in the slope position 1021b of photoresist layer 1021a.As shown in figure 35, since copper post 1022a is to pass through Into the through-hole 1013 of photoresist layer 1021a, copper facing is formed, therefore copper product will likely be overflowed from inclined-plane, lead to copper post The out-of-flatness of the upper surface 1022a, or the problems such as be electrically connected with other copper posts 1022a.

In order to solve this problem, one embodiment of the utility model proposes a kind of photosensory assembly production process, the stream Journey can be to avoid problem caused by aforementioned photoresist layer 1021a unevenness.In the present embodiment, it is practical new to show this by Figure 36 The schematic diagram of the wiring board material layer of type one embodiment.As shown in figure 36, in the manufacturing process of the wiring board, exist in advance In its every layer of material 101a, apply packing material 101b, such as photoresist all at 1013 position of through-hole, then will respectively press layer by layer The wiring board 101 (wiring board 101 in the present embodiment is Rigid Flex), the route formed at this time are formed together The through-hole 1013 of plate 101 is filled by multilevel resist 101b, so that the surface of wiring board 101 is a complete surface.Figure 37 shows The circuit board module for making on complete surface and obtaining after wiring layer again is gone out.Spin coating photoresist is on the complete surface Will not occur the slope 1021b in Figure 35 again, to ensure that table on the smooth and each copper post 1022a of the upper surface copper post 1022a Face is flush.It may be noted that, when manufacturing Rigid Flex, soft board 1012a and hardboard 1011a can be passed through in the present embodiment Laminating technology is combined together, and constitutes hardboard by the rigid region that presents on the whole that multiple hardboards and soft board are laminated and are formed Area, the region being only made of soft board form flexible board area.Further, the copper post on wiring layer 102 again and again wiring layer 102 After 1022a is formed, the whole photoresist at through-hole 1013 is removed (including the photoresist in light hole and again in wiring layer 102 The photoresist layer corresponding with light hole), through-hole corresponding with sensitive chip is formed, required circuit board module can be obtained, The circuit board module can be attached sensitive chip based on technique is lost money instead of making money.For example, sensitive chip 103 can be attached to reference to Fig. 1 The lower surface of the wiring board 101, that is, there is again the surface of wiring layer 102, lead sensitive chip 103 with copper post 1022a It is logical, to form photosensory assembly.

Further, Figure 38 shows the production process of the circuit board module in another embodiment of the utility model.Such as figure It, can also be after 101 laminating molding of wiring board, then to through-hole in another embodiment of the utility model shown in 38 1013 wiring board 101 is filled, such as Other substrate materials 101c is filled into through-hole 1013, makes the wiring board 101 have an even curface, and wiring technique is then carried out again on the wiring board with flat surface, plants process for copper, together Sample, which also can achieve, prevents photoresist layer from the case where slope 1021b occur.Again after wiring layer 102, copper post 1022a forming, removal Other substrate materials 101c at through-hole 1013 manifests the through-hole 1013 again, provides clear aperature for sensitive chip 103, Further, sensitive chip 103 is connected with copper post 1022a, forms the photosensory assembly.

Further, Figure 39 shows a kind of cross-sectional view of wiring layer 102 again in the prior art.Wiring layer 102 includes again Circuit layer and the insulating layer 1023 for coating circuit layer.In the prior art, polymide is generallyd use as insulating layer material, is somebody's turn to do Insulating layer 1023 solidifies after high-temperature baking.However, in the application, then wiring layer 102 forms the following table of assist side 101 Face, wiring board 101 are normally based on laminating technology production, and easily deform (such as warpage) under high-temperature baking.In this way may be used The wiring layer again 102 being attached on wiring board 101 can be will lead to and the problem of warpage also occur.Cloth is carried out on the face with warpage Wiring technology will lead to again the reliability decrease of wiring layer 102, be unfavorable for promoting yield.

Based on Such analysis, one embodiment according to the present utility model has been further related to a kind of with omission The circuit board module of polymide layers (dielectric layer) of wiring layer again 102.Figure 40-43, which is shown, a kind of omits polymide layers The production process of photosensory assembly, the process include the following steps.

Step S10: wiring layer cabling again is directly made on the wiring board Jing Guo planarization process and forms route board group Part.Wiring layer cabling (or can be filled out based on spin coating photoresist, exposure, development, copper facing in the obtained photoresist groove of development again Fill other conductive materials) and removal photoresist process flow obtain.

Figure 40, which is shown, directly to be made wiring layer cabling again on the wiring board Jing Guo planarization process and forms wiring board The schematic diagram of component.As shown in figure 40, after the circuit layer of the wiring layer again 102 is formed in the hardboard area 1011, by institute The first end for stating again wired circuit (i.e. routing traces again) is connected to the first electrode 1014 (i.e. the first pad) in hardboard area 1011, So that the circuit 1016 in hardboard area 1011 and the circuit of wiring layer again conducting.

It is worth noting that, 1022 width of cabling of the wired circuit again of the wiring layer again 102 is significantly less than institute State the trace width of wiring board 101.Under the process conditions of the prior art, the circuit precision on wiring board 101 makes the line The minimum value of the trace width of road plate 101 is 60~80 μm (i.e. the trace width of full accuracy is 60~80 μm).Such as pcb board The trace width of full accuracy can achieve 60 μm, and Rigid Flex alignment accuracy is likely lower than pcb board, full accuracy Trace width is about 75 μm.And the trace width for taking again wiring technique to be formed controllably is formed within 20 μm, such as 10 to 20 μ m。

Figure 44 shows showing for wired circuit again 1021 in the utility model one embodiment and wiring board circuit 1016 It is intended to.With reference to Figure 40 and Figure 44, the wired circuit again 1021 is also formed with multiple second pads 1022, each second pad 1022 correspond to the corresponding distribution of chip bonding pad 1033 in the non-photo-sensing area 1032 of sensitive chip 103, so that between the two may be used By fixing and being connected in a manner of losing money instead of making money.It is noted that 1014 size of the first pad in hardboard area 101 is greater than wiring layer again 1022 size of the second pad of the formation of 102 wired circuit again 1021, and the second pad 1022 is exposed to wiring layer again 102 outside, so as to and chip bonding pad be attached (such as welding or pressing).Second pad can pass through copper facing, plant copper or plant ball Etc. techniques obtain.It should be noted in the present invention, the second pad includes but is not limited to copper post, gold goal etc..In the present embodiment, When the planarization process to wiring board is milled processed, the wiring board top layer route after grinding may be exposed to wiring board Surface.Therefore, in this case, the cabling of wiring board top layer need to avoid again the cabling of wiring layer, to prevent the two route Between be surprisingly connected to.In addition, in the present embodiment, since the cabling of wiring board is exposed, wiring board can cancel pad, The cabling of wiring layer is set again to be directly connected in the cabling of wiring board, without being connected again by circuit pads.Wiring board at this time The contact portion of the cabling of wiring layer again of cabling can be considered as route plate electrode (i.e. first electrode).

Step S20: sensitive chip is attached on the circuit board module of step S10.Figure 41 shows the wiring board in Figure 40 The schematic diagram of sensitive chip 103 is attached on component.

Step S30: apply insulation protection glue at the attachment location of sensitive chip and circuit board module.In one embodiment In, insulation protection glue can be applied around attachment location (such as copper post or the position for planting ball) by Underfill technique.Figure 42 show the schematic diagram for applying insulation protection glue 1028 at attachment location.

Step S40: the covering insulating material on wiring layer cabling again.This step can also be real by Underfill technique It is existing.Figure 43 shows the schematic diagram of the covering insulating material on wiring layer cabling again.Step S30 and S40 can be merged into a step, To copper post or plant the position of ball and the trace portions of wiring layer are uniformly filled (such as by Underfill technique again It is filled).Insulation protection glue can form a protective layer 1029, and the protective layer 1029 can protect the wired circuit again 1021, and the protective layer 1029 can prevent each circuit in the wired circuit 1021 again and will not interfere with each other and occur short Road；It is worth noting that, the protective layer 1029 takes the techniques such as low temperature or ultraviolet light irradiation can cured material in the present embodiment Material support, prevents hot setting bring warpage issues.

Figure 45 shows the diagrammatic cross-section of the photosensory assembly in another embodiment of the utility model.The hardboard area tool There is a groove 1015 for being suitable for accommodating again wiring layer 102 and sensitive chip 103, to be conducive to reduce the height gauge of photosensory assembly It is very little, and play a protective role to sensitive chip 103.The size of the groove 1015 can be slightly larger than the size of sensitive chip 103, On the one hand, space on the other hand is provided for 102 cabling of wiring layer again convenient for the installation of sensitive chip 103.In the present embodiment, Since the hardboard area forms groove 1015, accordingly, the cabling space in the hardboard area will be contracted by, therefore, part original shape Route in hardboard area described in Cheng Yu, which can be gone to, to be formed in again in wiring layer 102, so that alleviating hardboard area forms groove The problem of cabling anxiety after 1015.

In one variant embodiment of the utility model, the size of the pad of wiring board can narrow down to the circuit with wiring board The consistent size of cabling, i.e., the first end of the described wired circuit again is directly bonded conducting (also with the circuit of the wiring board It is to say, the pad of hardboard can degenerate into a part of hardboard circuit trace).It is understood that in the prior art, hardboard Pad size is bigger than normal, can not be reduced so as to cause hardboard size.And the present embodiment cancels pad, the wired circuit again First end directly may connect to the circuit of hardboard, in the case where ensuring that the circuit of wired circuit and hardboard again is connected, also Wiring board size can be made to reduce.

It is noted that can take in another embodiment of the utility model and further increase hardboard or hardboard area Performance, make it that can bear the baking of higher temperature without there is warpage, so that wiring layer again attached to it be avoided not go out Existing warpage.In another embodiment of the utility model, insulating layer baking temperature can also be reduced, such as insulating layer material can be with Using compared with low temperature can cured material replace traditional polymide.So in the curing process, warpage will not occur for hardboard.

Further, one embodiment according to the present utility model additionally provides a kind of camera module, the camera module Including photosensory assembly and the optical lens being installed on the photosensory assembly.Wherein photosensory assembly can be any one aforementioned reality Apply photosensory assembly provided by example.The optical lens light collected can be supported along the light hole to described photosensitive group Part, and imaging reaction is carried out in the photosensory assembly.The type of the optical lens can be made according to the demand of the camera module Corresponding adjustment, such as the optical lens can be implemented as integral type optical lens, split type optical lens, naked camera lens or packet Include the optical frames head etc. of a lens barrel.

It may be noted that herein, photoresist refers to not needing the material of high temperature process, photoresist curing process includes but not It is limited to the lower technique of the fuel factors such as illumination, moisture, pressure, radiation, crystallization.

Above description is only the better embodiment of the application and the explanation to institute's application technology principle.Art technology Personnel should be appreciated that utility model range involved in the application, however it is not limited to which the specific combination of above-mentioned technical characteristic forms Technical solution, while should also cover do not depart from the utility model design in the case where, by above-mentioned technical characteristic or its etc. The other technical solutions for carrying out any combination with feature and being formed.Such as features described above and (but being not limited to) disclosed herein Technical characteristic with similar functions is replaced mutually and the technical solution that is formed.

Claims

1. a kind of photosensory assembly characterized by comprising

Sensitive chip, with photosensitive region and the non-photo-sensing region being centered around around photosensitive region, wherein the non-photo-sensing area Domain is provided with multiple chip electrodes；

Wiring board has through-hole corresponding with the photosensitive region, and the lower surface of the wiring board has multiple first electrodes, And the wiring board is hardboard or Rigid Flex；And

Wiring layer again, is formed in the lower surface of the wiring board, and the lower surface of the wiring layer again has multiple second electrodes, institute Each of multiple first electrodes are stated to be electrically connected by routing traces again with the corresponding second electrode respectively；Also, it is described Sensitive chip attaches to the lower surface of the wiring layer again, and the multiple second electrode respectively with the multiple chip electrode It contacts and is connected correspondingly.

2. photosensory assembly according to claim 1, which is characterized in that the second electrode is than the first electrode close to institute State through-hole.

3. photosensory assembly according to claim 1, which is characterized in that the area of the second electrode is less than first electricity The area of pole.

4. photosensory assembly according to claim 1, which is characterized in that the closeness of the multiple second electrode is higher than described Multiple first electrodes.

5. photosensory assembly according to claim 1, which is characterized in that the wiring board is Rigid Flex, described soft or hard Board includes hardboard area and flexible board area, and the through-hole is located at the hardboard area, and the multiple first electrode is located at the hardboard The lower surface in area.

6. photosensory assembly according to claim 1, which is characterized in that the width of the cabling of the wiring layer again is less than described The width of the cabling of wiring board.

7. photosensory assembly according to claim 1, which is characterized in that the second electrode is metal column.

8. photosensory assembly according to claim 7, which is characterized in that fill insulation protection glue around the metal column.

9. photosensory assembly according to claim 1, which is characterized in that the second electrode and the chip electrode pass through plant Ball technique is attached together.

10. according to photosensory assembly as claimed in claim 9, which is characterized in that plant the position filling insulation protection glue of ball.

11. according to photosensory assembly described in claim 1, which is characterized in that further include sheet metal, which has groove, institute It states sheet metal and attaches to the lower surface of the wiring layer again, and the sensitive chip is made to be contained in the groove.

12. according to the photosensory assembly described in claim 11, which is characterized in that the sheet metal is not contacted with the sensitive chip.

13. according to photosensory assembly described in claim 8 or 10, which is characterized in that further include molding layer, the molding layer is formed in The surface of the wiring layer again and the back side of the sensitive chip, and the molding layer contact the sensitive chip side and The insulation protection glue.

14. according to photosensory assembly described in claim 1, which is characterized in that the lower surface of the wiring board has groove, the sense Optical chip is located in the groove, and the photosensory assembly further includes sheet metal, and the sheet metal attaches to the wiring board and covers Groove is stated in residence, and there are gaps between the sheet metal and the sensitive chip.

15. photosensory assembly according to claim 1, which is characterized in that the lower surface of the wiring board is planarization process Surface afterwards.

16. a kind of circuit board module characterized by comprising

Wiring layer again, is formed in the lower surface of the wiring board, and the lower surface of the wiring layer again has multiple second electrodes, institute Each of multiple first electrodes are stated to be electrically connected by being routed again with the corresponding second electrode respectively；And it is described photosensitive Chip attaches to the lower surface of the wiring layer again, and the size of the multiple second electrode and layout are suitable for being based on losing money instead of making money work Skill be attached sensitive chip so that the multiple second electrode respectively with multiple chip electrodes of the sensitive chip correspondingly It contacts and is connected.

17. circuit board module according to claim 16, which is characterized in that the second electrode is leaned on than the first electrode The nearly through-hole；The closeness of the multiple second electrode is higher than the multiple first electrode.

18. circuit board module according to claim 16, which is characterized in that the area of the second electrode is less than described the The area of one electrode.

19. a kind of camera module characterized by comprising

Photosensory assembly described in any one of claim 1~15；And

It is installed on the optical lens of the photosensory assembly.