CN112770476A - Circuit board assembly, photosensitive assembly, camera module and circuit board assembly manufacturing method - Google Patents
Circuit board assembly, photosensitive assembly, camera module and circuit board assembly manufacturing method Download PDFInfo
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- CN112770476A CN112770476A CN201910999211.3A CN201910999211A CN112770476A CN 112770476 A CN112770476 A CN 112770476A CN 201910999211 A CN201910999211 A CN 201910999211A CN 112770476 A CN112770476 A CN 112770476A
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- electrical connection
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Abstract
The application relates to a circuit board assembly, a photosensitive assembly, a camera module and a preparation method of the circuit board assembly. The circuit board assembly includes a circuit board body, an electrical connection board and an electrical connector. The circuit board main body is provided with a circuit board electric connection end arranged on the surface of the circuit board main body. The electric connection board is provided with a connection board electric connection end which is arranged on the surface of the electric connection board and corresponds to the electric connection end of the circuit board. The circuit board assembly further comprises an integrated connecting structure arranged between the electric connecting end of the connecting plate and the electric connecting end of the circuit board. The integrated connecting structure comprises a conductive medium and a non-conductive adhesive which are adjacent to each other, wherein the electric connecting end of the connecting plate is electrically connected with the electric connecting end of the circuit board through the conductive medium, and the electric connecting plate is bonded to the circuit board through the non-conductive adhesive. Thus, the connection between the circuit board main body and the electric connecting plate is realized through the integrated connecting structure and the corresponding electric conduction process.
Description
Technical Field
The application relates to the field of camera modules, in particular to a circuit board assembly, a photosensitive assembly, a camera module and a circuit board assembly manufacturing method.
Background
With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like.
At present, most of circuit boards of camera modules are rigid-flex boards, which include a rigid board, a flexible board electrically connected to the rigid board, and an electrical connector electrically connected to the flexible board, so as to electrically connect the camera module to other electronic devices through the electrical connector. Among them, the electrical connection between the hard board and the soft board is generally achieved by acf (anisotropic Conductive film). However, due to the properties of the ACF and the conduction process, the electrical connection structure formed by the hard board and the soft board has certain defects, such as uncontrollable electrical conduction performance, high process temperature, excessive pressing force, etc.
Accordingly, there is a need for an improved circuit board assembly and manufacturing solution for a camera module.
Disclosure of Invention
The main object of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing the circuit board assembly, wherein the circuit board main board and the electrically connecting board are synchronously electrically connected to each other through an integral connecting structure composed of a conductive medium and a non-conductive adhesive, which is disposed between the circuit board main body and the electrically connecting board, and thus, the stability of the electrical connection between the circuit board main body and the electrically connecting board is improved.
Another object of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module and a circuit board assembly manufacturing method, wherein the conductive medium in the integral connection structure contacts with the circuit board main body and the electrical connection plate in the vertical direction and the horizontal direction, so as to improve the conductivity (especially, the conductivity in the vertical direction).
Another objective of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module and a circuit board assembly manufacturing method, wherein the integrated connection structure has a deformable feature, in a possible implementation manner of the present application, the electrical connection board is bonded to the circuit board main body through a non-conductive adhesive on the conductive medium while being electrically connected to the conductive medium disposed at the electrical connection end of the circuit board, and in such a manner, the circuit board main body and the conductive connection and the non-conductive connection between the electrical connection boards are synchronously implemented, thereby ensuring the stability of the electrical connection between the circuit board main body and the electrical connection boards.
Another objective of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing the circuit board assembly, wherein the integrated connection structure has a deformable feature, in a possible implementation manner of the present application, the circuit board main body is bonded to the electrical connection board through a non-conductive adhesive disposed on the conductive medium, and the circuit board main body is bonded to the electrical connection board through the non-conductive adhesive disposed on the conductive medium, so that the conductive connection and the non-conductive connection between the circuit board main body and the electrical connection board are synchronously achieved, and the stability of the electrical connection between the circuit board main body and the electrical connection board is ensured.
Another objective of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing the circuit board assembly, wherein a pressing force required for pressing the circuit board main body onto the electrical connection board or pressing the electrical connection board onto the circuit board main body is relatively small, and is approximately between 0.5N and 5N. That is to say, in the embodiment of the present application, the electrical connection and the non-electrical connection between the circuit board main body and the electrical connection board can be synchronously realized through a small pressing force, and the process difficulty is lower.
Another object of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing a circuit board assembly, in which the circuit board assembly is heated to a relatively low temperature (at 80 ° to 150 °) in the process of electrically connecting and bonding the circuit board main body to the electrical connection board through the integral connection structure. That is, in the embodiment of the present application, the process of electrically connecting the electrical connection board to the circuit board main body is performed at a relatively low temperature, so as to reduce the process difficulty on the one hand; on the other hand, the expansion and contraction amount of the non-conductive adhesive between the circuit board main body and the electric connection board is reduced, so that the deformation capacity of the non-conductive adhesive to the circuit board main body is reduced, and the flatness of the circuit board main body can be improved.
Another object of the present invention is to provide a circuit board assembly, a photosensitive assembly, a camera module and a method for manufacturing the circuit board assembly, wherein the process of electrically connecting the electrical connection board to the circuit board main body is performed at a relatively low temperature, so that the self-expansion amount of the circuit board main body is relatively reduced, and further, the bending amount of the circuit board main body is reduced.
Another objective of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing a circuit board assembly, wherein in a possible implementation manner of the present application, the non-conductive adhesive covers the electrical connection ends of the connection boards and the conductive medium in the integral connection structure, so that the electrical connection ends of two adjacent connection boards are blocked by the non-conductive adhesive, and a short circuit between the electrical connection ends of the two connection boards is prevented.
Another objective of the present application is to provide a circuit board assembly, a photosensitive assembly, a camera module, and a method for manufacturing the circuit board assembly, wherein in a possible implementation manner of the present application, the non-conductive adhesive covers the electrical connection terminals of the circuit board and the conductive medium in the integrated connection structure, so that the electrical connection terminals of the adjacent two circuit boards are separated by the non-conductive adhesive, and a short circuit between the electrical connection terminals of the two circuit boards is prevented.
Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.
To achieve at least one of the above objects or advantages, the present application provides a circuit board assembly including:
the circuit board comprises a circuit board main body and a circuit board connecting terminal, wherein the circuit board main body is provided with a circuit board electric connecting terminal arranged on the surface of the circuit board main body;
the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate, and the connecting plate electric connecting end corresponds to the circuit board electric connecting end;
the integrated connecting structure is arranged between the electric connecting end of the connecting plate and the electric connecting end of the circuit board and comprises a conductive medium and a non-conductive adhesive which are adjacent to each other, the electric connecting end of the connecting plate is electrically connected with the electric connecting end of the circuit board through the conductive medium, and meanwhile, the electric connecting plate is bonded to the circuit board main body through the non-conductive adhesive so as to realize the electric connection between the electric connecting plate and the circuit board main body; and
an electrical connector electrically connected to the electrical connection board.
In a wiring board assembly according to the present application, the conductive medium formed at the wiring board electrical connection terminals and the non-conductive adhesive applied to the conductive medium to form the integral connection structure have a layered structure.
In a wiring board assembly according to the present application, the conductive medium and the non-conductive adhesive have a layered structure, the conductive medium being formed at the connection plate electrical connection terminals, the non-conductive adhesive being applied to the conductive medium to form the integral connection structure.
In the circuit board assembly according to the present application, the integral connection structure has a deformable feature, and the electric connection plate is press-fitted to the integral connection structure so that the electric connection plate is bonded to the circuit board main body through the non-conductive adhesive while the electric connection end of the connection plate is electrically connected to the electric connection end of the circuit board through the conductive medium.
In the circuit board assembly according to the present application, the integral connection structure has a deformable characteristic, and the circuit board main body is press-fitted into the integral connection structure so that the circuit board main body is bonded to the electrical connection plate through the non-conductive adhesive while the electrical connection end of the circuit board is electrically connected to the electrical connection end of the connection plate through the conductive medium by the deformation of the integral connection structure.
In the circuit board assembly according to the present application, the force of the press fit is 0.5N-5N.
In the wiring board assembly according to the present application, the conductive medium is a mixture of metal particles and a binder.
In the wiring board assembly according to the present application, the adhesive is a thermosetting adhesive.
In a circuit board assembly according to the application, the non-conductive adhesive is embodied as a thermosetting glue.
In the wiring board assembly according to the present application, in electrically connecting the electrical connection board and the wiring board main body, the wiring board assembly is heated to a specific temperature range in which the conductive medium has deformable characteristics and in which the nonconductive adhesive is cured.
In the circuit board assembly according to the present application, the specific temperature range is 80 ° to 150 °.
In the circuit board assembly according to the present application, the size of the conductive medium is smaller than the size of the electrical connection terminal of the circuit board, and the conductive medium covers a part of the electrical connection terminal of the circuit board.
In the wiring board assembly according to the present application, the size of the conductive medium is equal to the size of the electric connection terminal of the wiring board, and the conductive medium completely covers the electric connection terminal of the wiring board.
In the circuit board assembly according to the present application, the size of the conductive medium is larger than the size of the electrical connection end of the circuit board, and the conductive medium covers the electrical connection end of the circuit board therein.
In the circuit board assembly according to the present application, the non-conductive adhesive covers the connection board electrical connection terminals and the conductive medium so that the adjacent connection board electrical connection terminals are blocked by the non-conductive adhesive.
In the wiring board assembly according to the present application, the conductive medium has a size smaller than that of the connection board electrical connection terminal, and the conductive medium covers a part of the connection board electrical connection terminal.
In the wiring board assembly according to the present application, the conductive medium has a size equal to that of the connection board electrical connection terminal, and the conductive medium completely covers the connection board electrical connection terminal.
In the wiring board assembly according to the present application, the size of the conductive medium is larger than the size of the electrical connection end of the connection board, and the conductive medium covers the electrical connection end of the connection board therein.
In the circuit board assembly according to the application, the non-conductive adhesive covers the circuit board electrical connection ends and the conductive medium, so that the adjacent two circuit board electrical connection ends are blocked by the non-conductive adhesive.
In the wiring board assembly according to the present application, the conductive medium has a round convex shape.
In the wiring board assembly according to the present application, the conductive medium further includes a conductive film formed on a surface thereof.
In the circuit board assembly according to the present application, the electrical connection board is mounted on and electrically connected to an upper surface of the circuit board main body.
In the circuit board assembly according to the present application, an edge region of an upper surface of the circuit board main body is recessed downward to form a recessed portion, and the electrical connection board is mounted on and electrically connected to the recessed portion of the circuit board main body.
In the wiring board assembly according to the present application, an upper surface of the electrical connection board is flush with an upper surface of the wiring board main body.
In the circuit board assembly according to the present application, the electrical connection board is attached and electrically connected to a lower surface of the circuit board main body.
In the circuit board assembly according to the present application, the lower surface edge region of the circuit board main body is recessed upward to form a recessed portion, and the electrical connection board is attached and electrically connected to the recessed portion of the circuit board main body.
In the wiring board assembly according to the present application, a lower surface of the electrical connection board is flush with a lower surface of the wiring board main body.
According to another aspect of the present application, there is also provided a photosensitive assembly, including:
a circuit board assembly as described above; and
and the photosensitive chip is electrically connected with the circuit board main body.
According to another aspect of the present application, there is also provided a camera module, which includes:
a photosensitive assembly, wherein the photosensitive assembly comprises:
the wiring board assembly as described above; and
the photosensitive chip is electrically connected to the circuit board main body; and
and the optical lens is kept in a photosensitive path of the photosensitive component.
According to another aspect of the present application, there is also provided a method of manufacturing a circuit board assembly, including:
providing a circuit board main body and an electric connecting plate, wherein the circuit board main body is provided with a circuit board electric connecting end arranged on the surface of the circuit board main body, and the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate;
forming conductive media on the electric connection ends of the circuit boards respectively;
applying a non-conductive adhesive on the conductive medium; and
pressing the electric connecting end of the connecting plate on the conductive medium to electrically connect the electric connecting end of the connecting plate and the electric connecting end of the circuit board, and simultaneously bonding the electric connecting plate on the circuit board main body through the non-conductive adhesive, so as to electrically connect the electric connecting plate to the circuit board main body; and
and electrically connecting the electric connector to the electric connection plate.
In the manufacturing method according to the present application, in the process of pressing the electric connection end of the connection board against the conductive medium to electrically connect the electric connection end of the connection board with the electric connection end of the circuit board and bonding the electric connection board to the circuit board main body by the non-conductive adhesive,
the electrical connection board and the wiring board main body are heated to 80 ° to 150 °, wherein in this temperature range the conductive medium has deformable properties and at the same time the non-conductive adhesive will cure.
In the preparation method according to the application, the force of the pressing is 0.5N-5N.
In the manufacturing method according to the present application, forming conductive media on the electric connection terminals of the wiring board, respectively, includes:
arranging a mask on the circuit board main body, wherein the mask is provided with a series of openings which penetrate through the mask and respectively correspond to the electric connection ends of the circuit board;
applying an excess of a conductive medium on the mask;
removing the redundant conductive medium on the surface of the mask; and
and removing the mask to form the conductive medium at the corresponding position of the opening.
In the manufacturing method according to the present application, after forming the conductive media on the electric connection terminals of the wiring board, respectively, and before applying the non-conductive adhesive on the conductive media, the method includes:
and forming a conductive film on the surface of the conductive medium.
According to another aspect of the present application, there is also provided a method of manufacturing a circuit board assembly, including:
providing a circuit board main body and an electric connecting plate, wherein the circuit board main body is provided with a circuit board electric connecting end arranged on the surface of the circuit board main body, and the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate;
forming conductive media on the connecting plate electric connection ends respectively;
applying a non-conductive adhesive on the conductive medium; and
pressing the electric connection end of the circuit board on the conductive medium to electrically connect the electric connection end of the connecting board and the electric connection end of the circuit board, and bonding the electric connection board to the circuit board main body through the non-conductive adhesive, so that the electric connection board is electrically connected to the circuit board main body; and
and electrically connecting the electric connector to the electric connection plate.
In the manufacturing method according to the present application, in the process of pressing the electric connection end of the circuit board against the conductive medium to electrically connect the electric connection end of the connection board and the electric connection end of the circuit board, and bonding the electric connection board to the circuit board main body by the non-conductive adhesive,
the electrical connection board and the wiring board main body are heated to 80 ° to 150 °, wherein in this temperature range the conductive medium has deformable properties and at the same time the non-conductive adhesive will cure.
In the preparation method according to the application, the force of the pressing is 0.5N-5N
In the manufacturing method according to the present application, forming conductive media on the connection plate electrical connection terminals, respectively, includes:
arranging a mask on the electric connection board, wherein the mask is provided with a series of openings which penetrate through the mask and respectively correspond to the electric connection ends of the circuit board;
applying an excess of a conductive medium on the mask;
removing the redundant conductive medium on the surface of the mask; and
and removing the mask to form the conductive medium at the corresponding position of the opening.
In the manufacturing method according to the present application, after forming the conductive media on the connection plate electrical connection ends, respectively, and before applying the non-conductive adhesive on the conductive media, it includes:
and forming a conductive film on the surface of the conductive medium.
Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.
These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
Drawings
The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.
Fig. 1 illustrates a structural schematic diagram of an existing ACF.
Fig. 2 illustrates a schematic diagram of conductive particles in a conventional ACF.
Fig. 3 illustrates a process diagram for realizing the electrical connection between the hard board and the soft board through the ACF.
Fig. 4 illustrates a schematic diagram of a circuit board assembly according to an embodiment of the present application.
Fig. 5A is a schematic diagram illustrating a modified implementation of the electrical connection end of the conductive medium to the circuit board according to an embodiment of the present application.
Fig. 5B is a schematic diagram illustrating another alternative implementation of the electrical connection terminal of the conductive medium to the circuit board according to the embodiment of the present application.
Fig. 6 illustrates a schematic diagram of a variant implementation of the wiring board assembly according to an embodiment of the present application.
Fig. 7 illustrates a schematic diagram of another variant implementation of the wiring board assembly according to an embodiment of the present application.
FIG. 8 illustrates a schematic diagram of yet another alternate implementation of the wiring board assembly according to an embodiment of the present application.
FIG. 9 illustrates a schematic diagram of yet another alternate implementation of the wiring board assembly according to an embodiment of the present application.
FIG. 10 illustrates a schematic diagram of yet another alternate implementation of the wiring board assembly according to an embodiment of the present application.
FIG. 11 illustrates a schematic diagram of yet another alternate implementation of the wiring board assembly according to an embodiment of the present application.
FIG. 12 illustrates a schematic view of a photosensitive assembly according to an embodiment of the present application.
Fig. 13 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
Fig. 14A and 14B illustrate a schematic diagram of a first manufacturing process of the wiring board assembly according to an embodiment of the present application.
Fig. 15A and 15B illustrate a schematic diagram of a second manufacturing process of the wiring board assembly according to an embodiment of the present application.
Detailed Description
Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.
Summary of the application
As described above, at present, the electrical connection between the hard board and the soft board in the circuit board of the camera module is realized by an ACF (Anisotropic Conductive Film). However, due to the properties of the ACF and the conduction process, the electrical connection structure formed by the hard board and the soft board has certain defects, such as uncontrollable electrical conduction performance, high process temperature, excessive pressing force, etc.
More specifically, fig. 1 illustrates a structural schematic diagram of an existing ACF. As shown in fig. 1, the ACF mainly includes a resin adhesive and conductive particles, and the conduction principle is as follows: the conductive particles are used to electrically connect the electrical connection terminals of the hard board and the soft board, and simultaneously, the short circuit of the adjacent electrical connection terminals can be avoided, so as to realize the purpose of conduction only in the Z-axis direction. That is to say, the ACF can realize that the resistance characteristics of the Z-axis electrical conduction direction and the XY insulation plane have a significant difference, and when the difference between the conduction resistance value in the Z-axis direction and the XY plane insulation resistance value exceeds a certain ratio, it is said that the conductive anisotropy is good. Those skilled in the art will appreciate that the anisotropic conductivity properties are primarily dependent on the fill rate of the conductive particles. Although the conductivity of the ACF increases with the increase of the filling rate of the conductive particles, the probability of short circuit caused by the contact of the conductive particles is also increased. In addition, the particle size distribution and distribution uniformity of the conductive particles also affect the anisotropic conductive properties. Generally, the conductive particles must have good particle size uniformity and roundness to ensure consistent contact area between the electrodes and the conductive particles, maintain the same on-resistance, and avoid open circuit caused by partial electrodes not contacting the conductive particles. The common particle size range is 3-5 μm, and too large conductive particles can reduce the number of particles contacted by each electrode, and can easily cause the situation of short circuit caused by the contact of the conductive particles of adjacent electrodes; too small conductive particles tend to cause the problem of particle aggregation, resulting in uneven particle distribution density. At present, the conductive particles mainly comprise metal powder and metal coated on the surface of a polymer plastic ball, and the commonly used metal powder comprises: nickel (Ni), gold (Au), gold-plated nickel, silver, tin alloy, and the like.
In the non-use state, the conductive particles in the ACF are uniformly distributed in the adhesive without contacting each other, that is, in the non-use state, the ACF film is not conductive. In electrically conducting the hard board and the soft board through the ACF, as shown in fig. 3, the ACF film is first pressed and heated. Generally, the pressurization and heating are performed twice, wherein the first time is for pre-positioning at a temperature of 60 to 100 ℃ and a pressure of (3 to 10). times.104 Pa, and the second time is for fixing at a temperature of about 150 to 200 ℃ and a pressure of (20 to 40). times.104 Pa, under such conditions, the insulating film of conductive particles is broken and pressed against each other at the portion where the wiring is present, thereby forming conduction.
However, in the heating and pressing process, it is inevitable that a part of the insulating film of the conductive particles in the vertical direction (i.e., Z-axis direction) is not crushed, and the conductivity in the vertical direction is affected. That is, the process of conducting the hard and soft boards through the ACF has randomness and uncontrollable characteristics.
Also, under the action of temperature and pressure, the ACF flows to fill the gaps between the upper and lower electrical connection terminals, and the conductive particles in the ACF also flow to fill the gaps between the upper and lower electrical connection terminals. On the one hand, however, the ability of the conductive particles to flow into the gap is probabilistic and less controllable in accuracy; on the other hand, there are conductive particles between the transverse electrical connection ends, and too many or too large conductive particles may contact and connect between the adjacent transverse electrical connection ends during the pressing process, thereby causing a short circuit of transverse conduction, and causing an abnormal electrical function.
In addition, the pressing force required in the process is large, and the process difficulty is high. In addition, the temperature required in the process is high (the temperature of the second heating is about 150 ℃ to 200 ℃), and the high temperature can cause a large amount of expansion and shrinkage of the hard plate, thereby causing the hard plate to bend.
In view of the above technical problems, a basic idea of the present application is to provide an integral connection structure including a conductive medium and a non-conductive adhesive adjacent to each other to achieve electrical connection between a wiring board main body and an electrical connection board through the integral connection structure.
Based on this, the present application provides a circuit board assembly, which includes a circuit board main body, an electrical connection board, and an electrical connector. The circuit board main body is provided with a circuit board electric connection end arranged on the surface of the circuit board main body. The electric connection board is provided with an electric connection end which is arranged on the surface of the electric connection board and corresponds to the electric connection end connection board of the circuit board. The circuit board assembly further comprises an integrated connecting structure arranged between the electric connecting end of the connecting plate and the electric connecting end of the circuit board. The integrated connecting structure comprises a conductive medium and a non-conductive adhesive which are adjacent to each other, wherein the electric connecting end of the connecting plate is electrically connected with the electric connecting end of the circuit board through the conductive medium, and the electric connecting plate is bonded to the circuit board through the non-conductive adhesive. Thus, the connection between the circuit board main body and the electric connecting plate is realized through the integrated connecting structure and the corresponding electric conduction process.
Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.
Exemplary Circuit Board Assembly
As shown in fig. 4, a circuit board assembly 10 according to an embodiment of the present application is illustrated, in which the circuit board assembly 10 is a circuit board assembly of a camera module, and includes a circuit board main body 11, an electrical connection board 12 electrically connected to the circuit board main body 11, and an electrical connector 13 electrically connected to the electrical connection board 12, where the electrical connector 13 is used for electrically connecting the camera module with other electrical components. In particular, compared to the conventional way of conducting the circuit board body and the electrical connection board through the ACF, in the embodiment of the present application, the electrical connection board 12 is electrically connected to the circuit board body 11 through the integral connection structure 110.
In the present embodiment, the circuit board main body 11 is typically implemented as a rigid board, which includes a set of circuit board electrical connection terminals 113 disposed on a surface thereof. The electrical connection board 12 is typically implemented as a flexible board, and includes a connection board electrical connection terminal 122 disposed on a surface thereof, wherein the connection board electrical connection terminal 122 corresponds to the circuit board electrical connection terminal 113. In particular, as shown in fig. 4, in the present embodiment, the integral connection structure 110 includes a conductive medium 114 and a non-conductive adhesive 115 which are disposed in a layered structure adjacent to each other, wherein the electrical connection board 12 is bonded to the wiring board main body by the non-conductive adhesive 115 while the connection board electrical connection terminal 122 is electrically connected to the wiring board electrical connection terminal 115 through the conductive medium 114, in such a manner that the electrical connection between the electrical connection board 12 and the wiring board main body 11 is achieved.
More specifically, as shown in fig. 4, in one possible implementation manner of the present application, the integral connection structure 110 is formed on the circuit board main body 11, wherein the conductive medium 114 is formed on the circuit board electrical connection terminal 113, and the non-conductive adhesive 115 is applied to the conductive medium 114 to form the integral connection structure 110. Accordingly, the electrical connection board 12 is pressed on the integrated connection structure 110 such that the electrical connection end 113 of the connection board is electrically connected to the circuit board main body 11 through the conductive medium 114, and the electrical connection board 12 is adhered to the circuit board main body 11 through the non-conductive adhesive 115. That is, in the present application, the physical bonding between the wiring board main body 11 and the electrical connection board 12, and the electrical connection between the wiring board main body 11 and the electrical connection board 12 are simultaneously achieved by the integral connection structure 110. That is, in the embodiment of the present application, the integral connection structure 100 serves as an integral medium, and simultaneously achieves the conductive connection and the non-conductive connection between the electrical connection board 12 and the wiring board 11. Such a process can simultaneously achieve both the bonding strength between the electrical connection plate 12 and the circuit board body 11 and the stability of the electrical connection between the electrical connection plate 12 and the circuit board body 11. It is worth mentioning that the process can also be carried out at relatively low temperatures and requires only relatively small pressing forces.
More specifically, the key to the process that can be carried out is: there is a particular correlation between the properties of the conductive medium 114 and the non-conductive adhesive 115 in the integral bonding structure 110. Specifically, the conductive medium 114 and the non-conductive adhesive 115 are configured to have the following properties: in electrically connecting the electrical connection board 12 to the wiring board main body 11, the wiring board assembly 10 is heated to a specific temperature range in which the conductive medium 114 has a deformable property and at the same time, the non-conductive adhesive 115 is cured. Due to the special property association between the conductive medium 114 and the non-conductive adhesive 115, during the process of electrically connecting the electrical connection board 12 to the circuit board main body 11, the connection board electrical connection end 122 of the electrical connection board 12 can pass through the non-conductive adhesive 115 which is not completely cured to be in contact with the conductive medium 114, and is electrically connected to the circuit board electrical connection end 113 of the circuit board main body 11 in this way, and at the same time, the non-conductive adhesive 115 is slowly cured, so that after the electrical connection board 12 is electrically connected to the lower surface of the circuit board main body 11, the electrical connection board 12 is also firmly attached to the lower surface of the circuit board main body 11 by the non-conductive adhesive 115.
More specifically, in the embodiment of the present application, the conductive medium 114 is implemented as a mixture of metal particles (when the diameter of the particles is smaller than a specific threshold value, the metal particles are implemented as metal powder) and adhesive, wherein the metal particles may be gold, silver, aluminum, copper, metal alloy, nonmetal and metal alloy, and the adhesive may be thermosetting adhesive, and the like. Particularly, the conductive medium 114 has good conductivity through special material selection and proportioning composition, and the property of the adhesive in the conductive medium 114 is adjusted to enable the conductive medium 114 to be cured within a temperature range of 80-200 ℃. Meanwhile, in the embodiment of the present application, the non-conductive adhesive 115 includes a resin material such as epoxy resin or polyimide resin, which is cured at a temperature ranging from 80 to 200 ℃. In particular, in the present embodiment, the circuit board assembly 10 is heated to a specific temperature range, preferably, 80 to 150 degrees celsius, in the process of electrically connecting the electrical connection board 12 to the circuit board main body 11.
It should be noted that in the embodiment of the present application, the conductive medium 114 includes an adhesive having a flexible characteristic, and the non-conductive adhesive 115 also has good flexibility. From the viewpoint of overall performance, the integral connection structure 110 has a deformable characteristic, which facilitates the electrical connection board 12 to synchronously realize the conductive connection and the non-conductive connection between the electrical connection board 12 and the circuit board 11 in a manner of being pressed on the integral connection structure 110. In particular, in the examples of the present application, the magnitude of the required pressing force is 0.5 to 5N. That is, in the present application, the electrical connection and the non-electrical connection between the electrical connection board 12 and the circuit board main body 11 can be achieved simultaneously by a small pressing force, the process difficulty is lower, and the electrical connection board 12 can be protected by the low pressing force so as not to generate adverse phenomena such as deformation and fracture, whereas in the existing FC process, the pressing force is usually more than 10N (usually set to 30N), the pressing force is large, and the photosensitive chip is at risk of deformation and even fracture.
It is worth mentioning that in the embodiment of the present application, the circuit board assembly 10 is heated to a relatively low temperature (at 80 ° to 150 °) during the process of electrically connecting and bonding the electrical connection board 12 to the circuit board main body 11 through the integral connection structure 110. That is, in the embodiment of the present application, the process of electrically connecting the electrical connection board 12 to the circuit board main body 11 is performed at a relatively low temperature, so as to reduce the process difficulty on one hand; on the other hand, by reducing the amount of expansion and contraction of the nonconductive adhesive 115 provided between the electrical connection board 12 and the circuit board body 11, the ability of the nonconductive adhesive 115 to deform the circuit board body 11 and the electrical connection board 12 is reduced, and the flatness of the circuit board body 11 and the electrical connection board 12 can be improved. Moreover, since the process of electrically connecting the electrical connection board 12 to the circuit board main body 11 is performed at a relatively low temperature, the self-expansion amount of the circuit board main body 11 is relatively reduced, which is beneficial to improving the surface flatness of the circuit board main body 11.
Further, in the present embodiment, in the process of forming the integral connection structure 110, first, the conductive medium 114 is provided to the board electrical connection terminal 113 of the board main body 11, wherein the conductive medium 114 has a round convex shape (the reason for having this shape is the surface tension of the conductive medium 114). In particular, in the embodiment of the present application, the size of the conductive medium 114 is smaller than the size of the circuit board electrical connection end 113, and the conductive medium 114 covers a portion of the circuit board electrical connection end 113, such a size relationship configuration can effectively control the conductive medium 114 within the range of the circuit board electrical connection end 113, and prevent the conductive medium 114 from overflowing to contaminate the structure of the circuit board main body 11 during the process of electrically connecting the electrical connection board 12 to the circuit board main body 11. Of course, in other examples of the present application, the size relationship between the conductive medium 114 and the circuit board electrical connection terminal 113 may also be configured in other types, for example, the size of the conductive medium 114 is equal to the size of the circuit board electrical connection terminal 113, and the conductive medium 114 completely covers the circuit board electrical connection terminal 113 (as shown in fig. 5A), or the size of the conductive medium 114 is larger than the size of the circuit board electrical connection terminal 113, and the conductive medium 114 covers the circuit board electrical connection terminal 113 therein (as shown in fig. 5B), which is not limited by the present application. It is worth mentioning that when the size of the conductive medium 114 is equal to the size of the circuit board electrical connection terminal 113 and the conductive medium 114 completely covers the circuit board electrical connection terminal 113, the contact area between the conductive medium 114 and the circuit board electrical connection terminal 113 can be increased, and the conductive capability can be enhanced. When the size of the conductive medium 114 is larger than the size of the circuit board electrical connection terminal 113 and the conductive medium 114 covers the circuit board electrical connection terminal 113 therein, the contact area between the conductive medium 114 and the circuit board electrical connection terminal 113 can be maximized, thereby further enhancing the conductive capability. However, it should be noted that when the size of the conductive medium 114 is larger than the size of the circuit board electrical connection terminal 113 and the conductive medium 114 covers the circuit board electrical connection terminal 113, the conductive media 114 disposed at different circuit board electrical connection terminals 113 need to be controlled to be isolated from each other to prevent the circuit from short circuit and failure.
To form the integral bonding structure 110, the non-conductive adhesive 115 is further applied to the conductive medium 114 and preferably completely encases the conductive medium 114 and the circuit board electrical connection terminals 113.
In particular, in the present embodiment, the conductive medium 114 and the non-conductive adhesive 115 have a layered structure, that is, the conductive medium 114 and the non-conductive adhesive 115 are not mixed with each other. As described above, in the conventional ACF glue, conductive particles are uniformly distributed in a binder (i.e., the conductive particles and the binder are mixed with each other), and, in a process of conducting a hard board and a soft board by the ACF glue, the ACF glue is heated and pressurized to break an insulating film of the conductive particles to form conduction. However, during the heating and pressing, it is inevitable that a part of the insulating film of the conductive particles in the vertical direction (i.e., Z-axis direction) is not crushed, which affects the conductivity in the vertical direction, that is, the process of conducting the hard board and the soft board through the ACF has randomness and uncontrollable characteristics. Accordingly, in the present embodiment, the metal particles in the conductive medium 114 are stacked, and the board electrical connection terminal 113 of the board main body 11 and the connection board electrical connection terminal 122 of the circuit board 12 are in contact with the metal particles in the conductive medium in both the vertical direction and the horizontal direction, so that the conductivity (particularly, the conductivity in the vertical direction) between the board main body 11 and the electrical connection board 12 is improved.
Also, under the action of temperature and pressure, in the prior art, the ACF flows to fill the voids of the upper and lower electrical connection terminals, and the conductive particles in the ACF also flow to fill the gaps of the upper and lower electrical connection terminals. On the one hand, however, the ability of the conductive particles to flow into the gap is probabilistic and less controllable in accuracy; on the other hand, there are conductive particles between the transverse electrical connection ends, and too many or too large conductive particles may contact and connect between the adjacent transverse electrical connection ends during the pressing process, thereby causing a short circuit of transverse conduction, and causing an abnormal electrical function. Accordingly, in the embodiment of the present application, the non-conductive adhesive 115 covers the circuit board electrical connection terminals 113 and the conductive medium 114 in the integral connection structure 110, so that the adjacent two circuit board electrical connection terminals 113 are blocked by the non-conductive adhesive 115, and a short circuit between the two circuit board electrical connection terminals 114 is prevented.
Fig. 6 is a schematic view illustrating a process of electrically connecting the electrical connection board 12 to the wiring board main body 11 according to the embodiment of the present application. As shown in fig. 6, in the process of electrically connecting the electrical connection board 12 to the wiring board main body 11 (the process ambient temperature is raised to between 80 and 150 degrees celsius), first, the electrical connection board 12 is brought close to the wiring board main body 11 so that the connection board electrical connection end 122 of the electrical connection board 12 corresponds to the wiring board electrical connection end 113 of the wiring board main body 11; further, the distance between the electrical connection board 12 and the wiring board main body 11 is gradually shortened (for example, the electrical connection board 12 is pressed down) so that the connection board electrical connection end 122 of the electrical connection board 12 passes through the non-conductive adhesive 115 which is not completely cured to come into contact with the conductive medium 114, thereby achieving electrical connection between the electrical connection board 12 and the wiring board main body 11, and the conductive medium 114 has a certain adhesiveness to which the electrical connection board 12 can be fixed; then, the distance between the electrical connection board 12 and the circuit board main body 11 is continuously shortened (for example, the electrical connection board 12 is continuously pressed), so that the connection board electrical connection end 122 of the electrical connection board 12 presses the conductive medium 114 to deform the conductive medium 114, thereby improving the stability of electrical connection between the two. At the same time, at the specific process environment temperature, the non-conductive adhesive 115 is gradually cured, so that the electrical connection board 12 is firmly attached to the lower surface of the circuit board main body 11 through the non-conductive adhesive 115 also in the process of electrically connecting the electrical connection board 12 to the lower surface of the circuit board main body 11, in such a way that, on the one hand, the electrical connection stability between the electrical connection board 12 and the circuit board main body 11 can be ensured, and, on the other hand, the bonding strength between the electrical connection board 12 and the circuit board main body 11 can also be effectively ensured. That is, in the embodiment of the present application, the electrical connection board 12 is electrically connected to the lower surface of the circuit board main body 11, and the electrical connection board 12 is bonded to the lower surface of the circuit board main body 11 almost simultaneously, so that the physical bonding between the electrical connection board 12 and the circuit board main body 11 by the non-conductive adhesive 115 can ensure the stability of the electrical connection between the electrical connection board 12 and the circuit board main body 11.
In order to enhance the electrical conductivity between the connection board electrical connection terminal 122 of the electrical connection board 12 and the circuit board electrical connection terminal 113 of the circuit board main body 11, in a further variant embodiment of the circuit board assembly 10 according to the embodiment of the present application as illustrated in fig. 7, the conductive medium 114 further includes a conductive film 116 formed on a surface thereof. Preferably, the conductive film 116 completely covers the outer surface of the conductive medium 114. In a specific implementation, the conductive film 116 may be formed on the surface of the conductive medium 114 by electroless plating or electroplating, wherein the plating material may be selected from gold, silver, aluminum, copper, and the like.
Further, as shown in fig. 4, in the present embodiment, the wiring board electrical connection terminal 113 is formed on the upper surface of the wiring board main body 11, more specifically, on the edge area of the upper surface thereof; the connection board electrical connection terminal 122 is formed on the lower surface of the circuit board 12, more specifically, in the edge area of the lower surface thereof. That is, in the embodiment of the present application, the circuit board 12 is mounted on and electrically connected to the upper surface of the board main body 11. Of course, it should be understood by those skilled in the art that the bonding position between the circuit board 12 and the circuit board main body 11 can be implemented in other types in the embodiments of the present application. For example, in a modified implementation of the circuit board assembly according to the embodiment of the present application as illustrated in fig. 8, the upper surface edge region of the circuit board main body 11 is recessed downward to form a recessed portion, and the electrical connection board 12 is mounted and electrically connected to the recessed portion of the circuit board main body 11. Preferably, an upper surface of the electrical connection board is flush with an upper surface of the wiring board main body. As another example, in the modified implementation of the circuit board assembly according to the embodiment of the present application as illustrated in fig. 9 to 11, the electrical connection board 12 is mounted and electrically connected to the lower surface of the circuit board main body 11. More specifically, in the modified implementation of the circuit board assembly as illustrated in fig. 9, the circuit board electrical connection terminals 113 are formed in the edge region of the lower surface of the circuit board main body 11, and the connection board electrical connection terminals 122 are formed in the edge region of the upper surface of the circuit board 12. In the modified implementation of the circuit board assembly as illustrated in fig. 10, the circuit board electrical connection terminals 113 are formed on the lower surface of the circuit board main body 11, and the connection board electrical connection terminals 122 are formed on the upper surface of the circuit board 12. In the modified embodiment of the circuit board assembly as illustrated in fig. 11, the edge area of the lower surface of the circuit board main body 11 is recessed upward to form a recessed portion, the electrical connection board 12 is attached and electrically connected to the recessed portion of the circuit board main body 11, and preferably, the lower surface of the electrical connection board 12 is flush with the lower surface of the circuit board main body 11.
In summary, the circuit board assembly 10 according to the embodiment of the present application is illustrated, which has at least the following advantages.
First, in the embodiment of the present application, the conductive connection and the non-conductive connection between the main board 11 of the circuit board and the electrical connection board 12 are simultaneously achieved by the integral connection structure 110 composed of the conductive medium 114 and the non-conductive adhesive 115, which is provided between the main board 11 of the circuit board and the electrical connection board 12, and in this way, the stability of the electrical connection between the main board 11 of the circuit board and the electrical connection board 12 is improved.
Next, in the present embodiment, the conductive medium 114 in the integral connection structure 110 is in contact with the wiring board main body 11 and the electrical connection plate 12 in both the vertical direction and the horizontal direction, so as to improve the electrical conductivity (particularly, the conductivity in the vertical direction).
Thirdly, the pressing force required for pressing the electrical connection board 12 on the circuit board main body 11 is small, and is about 0.5N to 5N. That is to say, in the embodiment of the present application, the electrical connection and the non-electrical connection between the circuit board main body 11 and the electrical connection board 12 can be synchronously achieved by a smaller pressing force, and the process difficulty is lower.
Also, in the present embodiment, the wiring board assembly 10 is heated to a relatively low temperature (at 80 ° to 150 °) in the process of electrically connecting and bonding the wiring board main body 11 to the electrical connection board 12 through the integral connection structure 110. That is, in the embodiment of the present application, the process of electrically connecting the electrical connection board 12 to the circuit board main body 11 is performed at a relatively low temperature, so as to reduce the process difficulty on one hand; on the other hand, the amount of expansion and contraction of the nonconductive adhesive 115 provided between the circuit board main body 11 and the electrical connection board 12 is reduced, so that the deformation capability of the nonconductive adhesive 115 to the circuit board main body 11 is reduced, and the flatness of the circuit board main body 11 can be improved.
In addition, in the embodiment of the present application, since the process of electrically connecting the electrical connection board 12 to the board main body 11 is performed at a relatively low temperature, the amount of self-expansion of the board main body 11 is relatively reduced, and thus, the amount of bending of the board main body 11 is reduced.
In addition, in the embodiment of the present application, the non-conductive adhesive 115 covers the circuit board electrical connection terminals 113 and the conductive medium 114 in the integral connection structure 110, so that the adjacent two circuit board electrical connection terminals 113 are blocked by the non-conductive adhesive 115, and a short circuit between the two circuit board electrical connection terminals 113 is prevented.
Although the integrated connection structure 110 is formed on the circuit board main body 11 as an example, those skilled in the art should understand that in other examples of the present application, the integrated connection structure 110 may be formed on the electrical connection board 12 first, that is, the conductive medium 114 is formed on the connection board electrical connection end 122, and the non-conductive adhesive 115 is applied to the conductive medium 114 to form the integrated connection structure 110. Accordingly, during the electrical connection process, the circuit board main body 11 is pressed on the integral connection structure 110 formed on the electrical connection board 12, so that the circuit board electrical connection end 113 is electrically connected to the connection board electrical connection end 122 through the conductive medium 114, and the circuit board main body 11 is adhered to the electrical connection board 12 through the non-conductive adhesive 115. And is not intended to limit the scope of the present application.
Furthermore, although the circuit board assembly 10 in fig. 4 to 11 is only illustrated as the circuit board assembly 10 including the circuit board main body 11, the electrical connection board 12 and the electrical connector 13, it should be understood by those skilled in the art that in an actual product, the circuit board assembly 10 further includes at least one electronic component (e.g., a capacitor, an inductor, a resistor, etc.) disposed on the circuit board main body 11, and thus, the disclosure is not limited thereto.
Further, as shown in fig. 12, the circuit board assembly 10 according to the embodiment of the present application can be matched with other components to form a photosensitive assembly 20, wherein the photosensitive assembly 20 includes the circuit board assembly 10 and the photosensitive chip 14 electrically connected to the circuit board main body 11, and other necessary components, for example, the package 15 formed on the circuit board main body 11, the filter element 16 held on the photosensitive chip 14, and so on, which are not important in the present application, and therefore will not be described again. Further, as shown in fig. 13, the photosensitive assembly 20 can cooperate with the optical lens 30 to form a camera module, wherein the optical lens 40 is retained in a photosensitive path of the photosensitive assembly 20.
Exemplary Circuit Board Assembly manufacturing Process
As shown in fig. 14A and 14B, a first manufacturing process of the wiring board assembly according to an embodiment of the present application is illustrated, in which the manufacturing process as illustrated in fig. 14A and 14B is exemplified by manufacturing the wiring board assembly 10 as illustrated in fig. 4.
Specifically, as shown in fig. 14A, in the manufacturing process, a circuit board main body 11 and an electrical connection board 12 are first provided, wherein the circuit board main body 11 has a circuit board electrical connection terminal 113 disposed on a surface thereof, and the electrical connection board 12 has a connection board electrical connection terminal 122 disposed on a surface thereof.
Further, as shown in fig. 14A, conductive media 114 are formed on the board electric connection terminals 113, respectively.
Specifically, in this exemplary manufacturing process, the conductive medium 114 is formed on the board electrical connection terminal 113, including:
first, a mask 30 or printing plate is provided on the upper surface of the wiring board body 11, wherein the mask 30 has a series of openings 300 penetrating therethrough and corresponding to the electrical connection terminals 113 of the wiring board, respectively. An excess of conductive medium 114 is then applied over the mask 30. Then, the excess conductive medium 114 on the surface of the mask 30 is removed. Then, the mask 30 is removed to form the conductive medium 114 at the corresponding position of the opening 300. In particular, in this exemplary manufacturing process, the size of the opening 300 is smaller than the electrical connection terminal 113 of the circuit board, so that the removal of the mask 30 to form the conductive medium 114 at the corresponding position of the opening 300 has the following properties: the size of the conductive medium 114 is smaller than that of the circuit board electrical connection terminal 113, and the conductive medium 114 covers a part of the circuit board electrical connection terminal 113. Of course, it should be understood by those skilled in the art that, in other manufacturing processes corresponding to other variant implementations of the circuit board assembly 10 of the embodiment of the present application, the size of the opening 300 of the mask 30 may correspond to the electrical connection terminal 113 of the circuit board, so that the removal of the mask 30 to form the conductive medium 114 at the corresponding position of the opening 300 has the following properties: the size of the conductive medium 114 is equal to the size of the circuit board electrical connection terminal 113, and the conductive medium 114 completely covers the circuit board electrical connection terminal 113. Alternatively, the size of the opening 300 of the mask 30 may be larger than the electrical connection terminal 113 of the circuit board, so that the following properties are obtained when the mask 30 is removed to form the conductive medium 114 at the corresponding position of the opening 300: the size of the conductive medium 114 is larger than that of the circuit board electrical connection terminal 113, and the conductive medium 114 covers the circuit board electrical connection terminal 113 therein.
It should be noted that after the mask 30 is removed to form the conductive medium 114 at the position corresponding to the opening 300, the conductive medium 114 may become a conductive dome with a structure having a smaller top and a larger bottom due to gravity, and the upper surface thereof is a cambered surface. Further, the conductive medium 114 may be pre-cured by heating to be fixed to the electrical connection terminal 113 of the circuit board.
Further, as shown in fig. 14B, a non-conductive adhesive 115 is applied on the conductive medium 114.
Further, as shown in fig. 14B, the electrical connection board 12 is electrically connected to the circuit board main body 11 by pressing the connection board electrical connection end 122 onto the conductive medium 114 to electrically connect the connection board electrical connection end 122 and the circuit board electrical connection end 113, and adhering the electrical connection board 12 to the lower surface of the circuit board main body 11 through the non-conductive adhesive 115. That is, in the embodiment of the present application, by the integral connection structure 110 of the conductive medium 14 and the non-conductive adhesive 15 provided between the wiring board main body 11 and the electrical connection board 12, the conductive connection and the non-conductive connection between the electrical connection board 12 and the wiring board main body 11 are realized, so that the stability of the electrical connection between the electrical connection board 12 and the wiring board main body 11 is ensured, and the difficulty of the process is reduced.
It is worth mentioning that in the present embodiment, there is a special correlation between the properties of the conductive medium 114 and the non-conductive adhesive 115. Specifically, the conductive medium 114 and the non-conductive adhesive 115 are configured to have the following properties: in electrically connecting the electrical connection board 12 to the wiring board main body 11, the wiring board assembly 10 is heated to a specific temperature range in which the conductive medium 114 has a deformable property and at the same time, the non-conductive adhesive 115 is cured. Accordingly, in the process of pressing the connection board electrical connection terminal 122 onto the conductive medium 114 to electrically connect the connection board electrical connection terminal 122 and the circuit board electrical connection terminal 113, and bonding the electrical connection board 12 to the lower surface of the circuit board main body 11 by the non-conductive adhesive 115, the electrical connection board 12 and the circuit board main body 11 are heated to 80 ℃ to 150 ℃, wherein, in this temperature range, the conductive medium 114 has deformable characteristics and at the same time the non-conductive adhesive 115 is cured.
It should be understood that, in the embodiment of the present application, the circuit board assembly 10 is heated to a relatively low temperature (at 80 ° to 150 °) during the process of electrically connecting and bonding the electrical connection board 12 to the circuit board main body 11 through the integral connection structure 110. That is, in the embodiment of the present application, the process of electrically connecting the electrical connection board 12 to the wiring board main body 11 is performed at a relatively low temperature.
Specifically, in the process of pressing the connection board electrical connection terminal 122 onto the conductive medium 114 to electrically connect the connection board electrical connection terminal 122 and the circuit board electrical connection terminal 113, and bonding the electrical connection board 12 to the lower surface of the circuit board main body 11 through the non-conductive adhesive 115, first, the electrical connection board 12 is close to the circuit board main body 11, so that the connection board electrical connection terminal 122 of the electrical connection board 12 corresponds to the circuit board electrical connection terminal 113 of the circuit board main body 11; further, the distance between the electrical connection board 12 and the wiring board main body 11 is gradually shortened (for example, the electrical connection board 12 is pressed down) so that the connection board electrical connection end 122 of the electrical connection board 12 passes through the non-conductive adhesive 115 that is not completely cured to come into contact with the conductive medium 114, thereby achieving electrical connection between the electrical connection board 12 and the wiring board main body 11; then, the distance between the electrical connection board 12 and the circuit board main body 11 is continuously shortened (for example, the electrical connection board 12 is continuously pressed), so that the connection board electrical connection end 122 of the electrical connection board 12 presses the conductive medium 114 to deform the conductive medium 114, thereby improving the stability of electrical connection between the two. At the same time, at the specific process environment temperature, the non-conductive adhesive 115 will be gradually cured, so that the electrical connection board 12 is firmly attached to the upper surface of the circuit board main body 11 by the non-conductive adhesive 115 also in the process of electrically connecting the electrical connection board 12 to the upper surface of the circuit board main body 11, in such a way that, on the one hand, the electrical connection stability between the electrical connection board 12 and the circuit board main body 11 can be ensured, and, on the other hand, the bonding strength between the electrical connection board 12 and the circuit board main body 11 can also be effectively ensured. That is, in the embodiment of the present application, the electrical connection board 12 is electrically connected to the lower surface of the circuit board main body 11, and the electrical connection board 12 is bonded to the lower surface of the circuit board main body 11 almost simultaneously, so that the physical bonding between the electrical connection board 12 and the circuit board main body 11 by the non-conductive adhesive 115 can ensure the stability of the electrical connection between the electrical connection board 12 and the circuit board main body 11.
In particular, in the examples of the present application, the magnitude of the required pressing force is 0.5 to 5N. That is, in the present application, the electrical connection and the non-electrical connection between the electrical connection board 12 and the circuit board main body 11 can be achieved simultaneously by a small pressing force, the process difficulty is lower, and the electrical connection board 12 can be protected by the low pressing force so as not to generate adverse phenomena such as deformation and fracture, whereas in the existing FC process, the pressing force is usually more than 10N (usually set to 30N), the pressing force is large, and the photosensitive chip is at risk of deformation and even fracture.
It should be noted that in order to enhance the electrical conductivity between the electrical connection board 12 and the circuit board main body 11, in other manufacturing processes of the present application, an electrically conductive film 116 may also be formed on the surface of the electrically conductive medium 114, for example, by chemical plating or electroplating.
In summary, a first manufacturing process of the circuit board assembly 10 based on the embodiments of the present application is illustrated, which is achieved by being able to manufacture the circuit board assembly 10 and the modified embodiments thereof as described above.
As shown in fig. 15A and 15B, a first manufacturing process of the wiring board assembly according to an embodiment of the present application is illustrated, in which the manufacturing process as illustrated in fig. 15A and 15B is exemplified by manufacturing the wiring board assembly 10 as illustrated in fig. 4.
Specifically, as shown in fig. 15A, in the manufacturing process, a circuit board main body 11 and an electrical connection board 12 are first provided, wherein the circuit board main body 11 has a circuit board electrical connection terminal 113 disposed on a surface thereof, and the electrical connection board 12 has a connection board electrical connection terminal 122 disposed on a surface thereof.
Further, as shown in fig. 15A, conductive media 114 are formed on the connection plate electrical connection terminals 122, respectively.
Specifically, in this exemplary manufacturing process, the conductive medium 114 is formed on the web electrical connection end 122, including:
first, a mask 30 or printing plate is placed on the lower surface of the electrical connection board 12, wherein the mask 30 has a series of openings 300 therethrough corresponding to the electrical connection terminals 122 of the connection board, respectively. An excess of conductive medium 114 is then applied over the mask 30. Then, the excess conductive medium 114 on the surface of the mask 30 is removed. Then, the mask 30 is removed to form the conductive medium 114 at the corresponding position of the opening 300. In particular, in this exemplary manufacturing process, the size of the opening 300 is smaller than the connection board electrical connection terminal 122, so that removing the mask 30 to form the conductive medium 114 at the corresponding position of the opening 300 has the following properties: the conductive medium 114 has a size smaller than the size of the connection board electrical connection end 122, and the conductive medium 114 covers a portion of the connection board electrical connection end 122. Of course, it should be understood by those skilled in the art that, in other manufacturing processes corresponding to other variant implementations of the circuit board assembly 10 of the embodiment of the present application, the size of the opening 300 of the mask 30 may correspond to the size of the connection board electrical connection terminal 122, so that the removal of the mask 30 to form the conductive medium 114 at the corresponding position of the opening 300 has the following properties: the conductive medium 114 has a size equal to the size of the connection board electrical connection end 122, and the conductive medium 114 completely covers the connection board electrical connection end 122. Alternatively, the size of the opening 300 of the mask 30 may be larger than the connection board electrical connection terminal 122, so that the removal of the mask 30 to form the conductive medium 114 at the corresponding position of the opening 300 has the following properties: the size of the conductive medium 114 is larger than the size of the connection board electrical connection end 122, and the conductive medium 114 covers the connection board electrical connection end 122 therein.
It should be noted that after the mask 30 is removed to form the conductive medium 114 at the position corresponding to the opening 300, the conductive medium 114 may become a conductive dome with a structure having a smaller top and a larger bottom due to gravity, and the upper surface thereof is a cambered surface. Further, the conductive medium 114 may be pre-cured by heating to secure it to the board electrical connection end 122.
Further, as shown in fig. 15B, a non-conductive adhesive 115 is applied on the conductive medium 114.
Further, as shown in fig. 15B, the electrical connection terminal 113 of the circuit board is pressed onto the conductive medium 114 to electrically connect the electrical connection terminal 113 of the circuit board to the electrical connection terminal 122 of the connection board, and the circuit board main body 11 is adhered to the lower surface of the circuit board 12 by the non-conductive adhesive 115, so as to electrically connect the electrical connection board 12 to the circuit board main body 11. That is, in the embodiment of the present application, by the integral connection structure 110 of the conductive medium 14 and the non-conductive adhesive 15 provided between the wiring board main body 11 and the electrical connection board 12, the conductive connection and the non-conductive connection between the electrical connection board 12 and the wiring board main body 11 are realized, so that the stability of the electrical connection between the electrical connection board 12 and the wiring board main body 11 is ensured, and the difficulty of the process is reduced.
It is worth mentioning that in the present embodiment, there is a special correlation between the properties of the conductive medium 114 and the non-conductive adhesive 115. Specifically, the conductive medium 114 and the non-conductive adhesive 115 are configured to have the following properties: in electrically connecting the electrical connection board 12 to the wiring board main body 11, the wiring board assembly 10 is heated to a specific temperature range in which the conductive medium 114 has a deformable property and at the same time, the non-conductive adhesive 115 is cured. Accordingly, in the process of pressing the connection board electrical connection terminal 122 onto the conductive medium 114 to electrically connect the connection board electrical connection terminal 122 and the circuit board electrical connection terminal 113, and bonding the electrical connection board 12 to the lower surface of the circuit board main body 11 by the non-conductive adhesive 115, the electrical connection board 12 and the circuit board main body 11 are heated to 80 ℃ to 150 ℃, wherein, in this temperature range, the conductive medium 114 has deformable characteristics and at the same time the non-conductive adhesive 115 is cured.
It should be understood that, in the embodiment of the present application, the circuit board assembly 10 is heated to a relatively low temperature (at 80 ° to 150 °) during the process of electrically connecting and bonding the circuit board main body 11 to the electrical connection board 12 through the integral connection structure 110. That is, in the embodiment of the present application, the process of electrically connecting the wiring board main body 11 to the electrical connection board 12 is performed at a relatively low temperature.
Specifically, in the process of pressing the circuit board electrical connection terminal 113 onto the conductive medium 114 to electrically connect the circuit board electrical connection terminal 113 to the connection board electrical connection terminal 122, and bonding the circuit board main body 11 to the lower surface of the electrical connection board 12 through the non-conductive adhesive 115, first, the circuit board main body 11 is close to the electrical connection board 12, so that the circuit board electrical connection terminal 113 of the circuit board main body corresponds to the connection board electrical connection terminal 122 of the electrical connection board 12; further, the distance between the electrical connection board 12 and the wiring board main body 11 is gradually shortened (for example, the electrical connection board 12 is pressed down) so that the wiring board electrical connection end 113 of the wiring board main body 11 passes through the non-conductive adhesive 115 that is not completely cured to come into contact with the conductive medium 114, thereby achieving electrical connection between the electrical connection board 12 and the wiring board main body 11; then, the distance between the electrical connection board 12 and the circuit board main body 11 is continuously shortened (for example, the electrical connection board 12 is continuously pressed), so that the circuit board electrical connection end 113 of the circuit board main body 11 is pressed against the conductive medium 114 to deform the conductive medium 114, thereby improving the stability of electrical connection between the two. At the same time, at the specific process environment temperature, the non-conductive adhesive 115 will be gradually cured, so that the circuit board main body 11 is firmly attached to the lower surface of the electrical connection board 12 by the non-conductive adhesive 115 also in the process of electrically connecting the circuit board main body 11 to the lower surface of the electrical connection board, in such a way that, on the one hand, the electrical connection stability between the electrical connection board 12 and the circuit board main body 11 can be ensured, and, on the other hand, the bonding strength between the electrical connection board 12 and the circuit board main body 11 can also be effectively ensured. That is, in the embodiment of the present application, the circuit board main body 11 is electrically connected to the lower surface of the electrical connection board 12, and the circuit board main body 11 is bonded to the lower surface of the electrical connection board 12 almost simultaneously, so that the physical bond between the electrical connection board 12 and the circuit board main body 11 by the non-conductive adhesive 115 can ensure the stability of the electrical connection between the electrical connection board 12 and the circuit board main body 11.
In particular, in the examples of the present application, the magnitude of the required pressing force is 0.5 to 5N. That is, in the present application, the electrical connection and the non-electrical connection between the electrical connection board 12 and the circuit board main body 11 can be achieved simultaneously by a small pressing force, the process difficulty is lower, and the electrical connection board 12 can be protected by the low pressing force so as not to generate adverse phenomena such as deformation and fracture, whereas in the existing FC process, the pressing force is usually more than 10N (usually set to 30N), the pressing force is large, and the photosensitive chip is at risk of deformation and even fracture.
It should be noted that in order to enhance the electrical conductivity between the electrical connection board 12 and the circuit board main body 11, in other manufacturing processes of the present application, an electrically conductive film 116 may also be formed on the surface of the electrically conductive medium 114, for example, by chemical plating or electroplating.
In summary, a second manufacturing process of the circuit board assembly 10 based on the embodiments of the present application is illustrated, which is achieved by being able to manufacture the circuit board assembly 10 and the modified embodiments thereof as described above.
It should be noted that, although the circuit board assembly 10 shown in fig. 4 is taken as an example in the present application, it should be understood by those skilled in the art that the processes for manufacturing other implementations of the circuit board assembly 10 according to the embodiments of the present application can be inferred from the accompanying description and the text description of the variant implementations of the circuit board assembly 10 of the present application, and thus, the descriptions thereof are omitted.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (39)
1. A circuit board assembly, comprising:
the circuit board comprises a circuit board main body and a circuit board connecting terminal, wherein the circuit board main body is provided with a circuit board electric connecting terminal arranged on the surface of the circuit board main body;
the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate, and the connecting plate electric connecting end corresponds to the circuit board electric connecting end;
the integrated connecting structure is arranged between the electric connecting end of the connecting plate and the electric connecting end of the circuit board and comprises a conductive medium and a non-conductive adhesive which are adjacent to each other, the electric connecting end of the connecting plate is electrically connected with the electric connecting end of the circuit board through the conductive medium, and meanwhile, the electric connecting plate is bonded to the circuit board main body through the non-conductive adhesive so as to realize the electric connection between the electric connecting plate and the circuit board main body; and
an electrical connector electrically connected to the electrical connection board.
2. The circuit board assembly of claim 1, wherein the conductive medium and the non-conductive adhesive have a layered structure, the conductive medium being formed at the circuit board electrical connection end, the non-conductive adhesive being applied to the conductive medium to form the integral connection structure.
3. The circuit board assembly of claim 1, wherein the conductive medium and the non-conductive adhesive have a layered structure, the conductive medium being formed at the connection board electrical connection end, the non-conductive adhesive being applied to the conductive medium to form the integral connection structure.
4. The wiring board assembly according to claim 2, wherein the integral connection structure has a deformable feature, the electrical connection plate is pressed to the integral connection structure so that the electrical connection end of the connection plate is electrically connected to the electrical connection end of the wiring board through the conductive medium by the deformation of the integral connection structure, and the electrical connection plate is adhered to the wiring board main body through the non-conductive adhesive.
5. The circuit board assembly of claim 3, wherein the integral connection structure has a deformable feature, and the circuit board main body is pressed onto the integral connection structure such that the circuit board electrical connection end is electrically connected to the connection board electrical connection end through the conductive medium by the deformation of the integral connection structure, and the circuit board main body is adhered to the electrical connection board by the non-conductive adhesive.
6. A wiring board assembly according to claim 4 or 5, wherein the force of the press fit is 0.5N-5N.
7. The circuit board assembly of claim 6, wherein the conductive medium is a mixture of metal particles and a binder.
8. The circuit board assembly of claim 7, wherein the adhesive is a heat curable glue.
9. The circuit board assembly according to claim 8, wherein the non-conductive adhesive is implemented as a heat curable glue.
10. The wiring board assembly according to claim 1 or 9, wherein the wiring board assembly is heated to a specific temperature range in which the conductive medium has a deformable property and in which the nonconductive adhesive is cured in electrically connecting the electrical connection board and the wiring board main body.
11. A cord plate assembly according to claim 10, wherein the specific temperature range is 80 ° to 150 °.
12. The wiring board assembly of claim 2, wherein the conductive medium has a size that is smaller than a size of the electrical connection end of the wiring board, and the conductive medium covers a portion of the electrical connection end of the wiring board.
13. The wiring board assembly of claim 2, wherein the conductive medium has dimensions equal to the dimensions of the wiring board electrical connection terminals and completely covers the wiring board electrical connection terminals.
14. The wiring board assembly according to claim 2, wherein the conductive medium has a size larger than the size of the electrical connection end of the wiring board and covers the electrical connection end of the wiring board therein.
15. The circuit board assembly of any of claims 12-14, wherein the non-conductive adhesive encapsulates the connection board electrical connection ends and the conductive medium such that the electrical connection ends of two adjacent connection boards are blocked from each other by the non-conductive adhesive.
16. The circuit board assembly of claim 3, wherein the conductive medium has a size smaller than a size of the connection board electrical connection end, and the conductive medium covers a portion of the connection board electrical connection end.
17. The circuit board assembly of claim 3, wherein the conductive medium has a size equal to the size of the connection board electrical connection end and the conductive medium completely covers the connection board electrical connection end.
18. The circuit board assembly of claim 3, wherein the conductive medium has a size greater than a size of the connection board electrical connection end and the conductive medium covers the connection board electrical connection end therein.
19. The circuit board assembly according to any one of claims 16-18, wherein said non-conductive adhesive encapsulates said circuit board electrical connection terminals and said conductive medium such that adjacent ones of said circuit board electrical connection terminals are blocked by said non-conductive adhesive.
20. A wiring board assembly according to claim 2 or 3, wherein the conductive medium has a rounded convex shape.
21. The circuit board assembly of claim 2 or 3, wherein the conductive medium further comprises a conductive film formed on a surface thereof.
22. The circuit board assembly according to claim 1, wherein the electrical connector board is attached and electrically connected to the upper surface of the circuit board main body.
23. The circuit board assembly according to claim 22, wherein an upper surface edge region of the circuit board main body is recessed downward to form a recessed portion, and the electrical connector board is attached and electrically connected to the recessed portion of the circuit board main body.
24. The circuit board assembly of claim 23, wherein an upper surface of the electrical connection board is flush with an upper surface of the circuit board body.
25. The circuit board assembly according to claim 1, wherein the electrical connector board is attached and electrically connected to a lower surface of the circuit board main body.
26. The circuit board assembly according to claim 25, wherein the lower surface edge region of the circuit board main body is recessed upward to form a recessed portion, and the electrical connector board is attached and electrically connected to the recessed portion of the circuit board main body.
27. The circuit board assembly of claim 26, wherein a lower surface of the electrical connection board is flush with a lower surface of the circuit board body.
28. A photosensitive assembly, comprising:
a wiring board assembly according to any one of claims 1-27; and
and the photosensitive chip is electrically connected with the circuit board main body.
29. The utility model provides a module of making a video recording which characterized in that includes:
a photosensitive assembly, wherein the photosensitive assembly comprises:
a wiring board assembly according to any one of claims 1-27; and
the photosensitive chip is electrically connected to the circuit board main body; and
and the optical lens is kept in a photosensitive path of the photosensitive component.
30. A method of making a circuit board assembly, comprising:
providing a circuit board main body and an electric connecting plate, wherein the circuit board main body is provided with a circuit board electric connecting end arranged on the surface of the circuit board main body, and the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate;
forming conductive media on the electric connection ends of the circuit boards respectively;
applying a non-conductive adhesive on the conductive medium;
pressing the electric connecting end of the connecting plate on the conductive medium to electrically connect the electric connecting end of the connecting plate and the electric connecting end of the circuit board, and simultaneously bonding the electric connecting plate on the circuit board main body through the non-conductive adhesive, so as to electrically connect the electric connecting plate to the circuit board main body; and
and electrically connecting the electric connector to the electric connection plate.
31. The manufacturing method according to claim 30, wherein in the process of press-fitting the connecting plate electrical connection terminal to the conductive medium to electrically connect the connecting plate electrical connection terminal to the wiring board electrical connection terminal and bonding the electrical connection plate to the wiring board main body by the non-conductive adhesive,
the electrical connection board and the wiring board main body are heated to 80 ° to 150 °, wherein in this temperature range the conductive medium has deformable properties and at the same time the non-conductive adhesive will cure.
32. The method of claim 31, wherein the force of the pressing is 0.5N-5N.
33. The manufacturing method according to claim 30, wherein forming conductive media on the wiring board electrical connection terminals, respectively, comprises:
arranging a mask on the circuit board main body, wherein the mask is provided with a series of openings which penetrate through the mask and respectively correspond to the electric connection ends of the circuit board;
applying an excess of a conductive medium on the mask;
removing the redundant conductive medium on the surface of the mask; and
and removing the mask to form the conductive medium at the corresponding position of the opening.
34. A producing method according to claim 33, wherein after forming conductive media on said wiring board electrical connection terminals, respectively, and before applying a non-conductive adhesive on said conductive media, comprising:
and forming a conductive film on the surface of the conductive medium.
35. A method of making a circuit board assembly, comprising:
providing a circuit board main body and an electric connecting plate, wherein the circuit board main body is provided with a circuit board electric connecting end arranged on the surface of the circuit board main body, and the electric connecting plate is provided with a connecting plate electric connecting end arranged on the surface of the electric connecting plate;
forming conductive media on the connecting plate electric connection ends respectively;
applying a non-conductive adhesive on the conductive medium;
pressing the electric connection end of the circuit board on the conductive medium to electrically connect the electric connection end of the connecting board and the electric connection end of the circuit board, and bonding the electric connection board to the circuit board main body through the non-conductive adhesive, so that the electric connection board is electrically connected to the circuit board main body; and
and electrically connecting the electric connector to the electric connection plate.
36. The manufacturing method according to claim 35, wherein in the process of press-fitting the electric connection terminal of the wiring board to the conductive medium to electrically connect the electric connection terminal of the connection board and the electric connection terminal of the wiring board and bonding the electric connection board to the wiring board main body by the non-conductive adhesive,
the electrical connection board and the wiring board main body are heated to 80 ° to 150 °, wherein in this temperature range the conductive medium has deformable properties and at the same time the non-conductive adhesive will cure.
37. The method of claim 36, wherein the force of the pressing is 0.5N-5N.
38. The manufacturing method as set forth in claim 35, wherein forming conductive media on the connection plate electrical connection terminals, respectively, comprises:
arranging a mask on the electric connection board, wherein the mask is provided with a series of openings which penetrate through the mask and respectively correspond to the electric connection ends of the circuit board;
applying an excess of a conductive medium on the mask;
removing the redundant conductive medium on the surface of the mask; and
and removing the mask to form the conductive medium at the corresponding position of the opening.
39. A producing method according to claim 38, wherein after forming conductive media on said connection plate electrical connection terminals, respectively, and before applying a non-conductive adhesive on said conductive media, comprising:
and forming a conductive film on the surface of the conductive medium.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999211.3A CN112770476A (en) | 2019-10-21 | 2019-10-21 | Circuit board assembly, photosensitive assembly, camera module and circuit board assembly manufacturing method |
| US17/770,744 US20220367556A1 (en) | 2019-10-21 | 2020-10-21 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
| CN202080073806.7A CN114731358B (en) | 2019-10-21 | 2020-10-21 | Circuit board assembly, photosensitive assembly, camera module and preparation method of circuit board assembly and photosensitive assembly |
| EP20879658.1A EP4044575A4 (en) | 2019-10-21 | 2020-10-21 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
| PCT/CN2020/122405 WO2021078138A1 (en) | 2019-10-21 | 2020-10-21 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999211.3A CN112770476A (en) | 2019-10-21 | 2019-10-21 | Circuit board assembly, photosensitive assembly, camera module and circuit board assembly manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112770476A true CN112770476A (en) | 2021-05-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910999211.3A Pending CN112770476A (en) | 2019-10-21 | 2019-10-21 | Circuit board assembly, photosensitive assembly, camera module and circuit board assembly manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN112770476A (en) |
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