CN113241352B - Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof - Google Patents
Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof Download PDFInfo
- Publication number
- CN113241352B CN113241352B CN202110545320.5A CN202110545320A CN113241352B CN 113241352 B CN113241352 B CN 113241352B CN 202110545320 A CN202110545320 A CN 202110545320A CN 113241352 B CN113241352 B CN 113241352B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- image sensor
- board substrate
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 239000012188 paraffin wax Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a flexible circuit board capable of being wire-bonded for packaging an image sensor and a preparation process thereof, relates to the field of packaging of image sensors, and solves the problem that the top end of the flexible circuit board in the prior art cannot be wire-bonded. The technical characteristics include that the image sensor comprises an image sensor and an image sensor photosurface, wherein the image sensor photosurface is positioned on the image sensor, and the image sensor photosurface also comprises a flexible circuit board which is arranged on the side surface of the image sensor and is electrically connected with the image sensor photosurface through wire bonding; the flexible circuit board comprises a flexible circuit board substrate and a wire bonding carrier arranged on the flexible circuit board substrate, wherein the wire bonding carrier is electrically connected with the flexible circuit board substrate, and the flexible circuit board substrate is electrically connected with the photosensitive surface of the image sensor through the wire bonding carrier. The outgoing line requirement of the flexible circuit board on the side face of the image sensor is met, meanwhile, the space for leading out signals in the focal plane is reduced, and the effective utilization of the focal plane space is realized.
Description
Technical Field
The invention relates to the technical field of image sensor packaging, in particular to a flexible circuit board capable of being wired for image sensor packaging and a preparation process thereof.
Background
The flexible circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the advantages of high reliability, light weight, thin thickness, good bending performance and the like.
Along with the development of deep space exploration technology in recent years, focal plane pixel requirements of a telescope are higher and higher, a single image sensor cannot meet the use requirements of oversized pixels, a plurality of image sensors are usually required to be spliced at a focal plane position, and the traditional mode of designing an image sensor chip and a processing circuit on the same plane cannot meet the space requirements. Therefore, signals on the image sensor are led out, so that the photosurface and the processing circuit are positioned on different planes, and the use space of the photosurface of the image sensor is saved. The flexible circuit board has the advantages of high wiring density, good bending performance and the like, and is the optimal choice for connecting the image sensor and the processing circuit board. However, the flexible circuit board is limited by the processing technology of the flexible circuit board, the flexible circuit board is limited in size in the thickness direction, and the thickness of the top end of the flexible circuit board cannot be increased in a local coating manner, so that great difficulty is brought to wire bonding between the image sensor and the flexible circuit board.
Disclosure of Invention
The invention provides a flexible circuit board capable of being wired for packaging an image sensor and a preparation process thereof, which aim to solve the technical problem that the top end of the flexible circuit board in the prior art cannot be wired.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the flexible circuit board capable of being wire-bonded for packaging the image sensor comprises an image sensor and an image sensor photosurface, wherein the image sensor photosurface is positioned on the image sensor, and the flexible circuit board is arranged on the side surface of the image sensor and is electrically connected with the image sensor photosurface through wire bonding;
the flexible circuit board comprises a flexible circuit board substrate and a wire bonding carrier arranged on the flexible circuit board substrate, wherein the wire bonding carrier is electrically connected with the flexible circuit board substrate, and the flexible circuit board substrate is electrically connected with the photosensitive surface of the image sensor through the wire bonding carrier.
Preferably, the wire bonding carrier comprises a bonding pad and a metal block;
the bonding pad is arranged on the flexible circuit board substrate and is electrically connected with the flexible circuit board substrate;
the metal block is fixed on the bonding pad, and the metal block is electrically connected with the bonding pad.
Preferably, the bonding pad and the metal block are electrically connected through conductive adhesive or soldering tin.
Preferably, the metal block corresponds to the shape and size between the pads.
Preferably, the number of the bonding pads is at least one, and the number of the metal blocks is at least one and is in one-to-one correspondence with the bonding pads.
The preparation process of the flexible circuit board capable of being wire-bonded for packaging the image sensor is characterized by comprising the following process steps:
step one, preparing paraffin strips, and processing grooves on the paraffin strips in square shapes, wherein the grooves correspond to the arrangement of the bonding pads, and the width of the grooves is 0.05-0.1 mm narrower than that of the metal blocks;
step two, sequentially placing the metal blocks into grooves on the processed paraffin strips;
step three, preparing a fixed block, placing the paraffin bar block on the fixed block, and heating the paraffin bar at 30-35 ℃ to adhere the metal block and the fixed block;
cleaning the flexible circuit board substrate, firstly dipping 100% pure alcohol into clean cloth to wipe the flexible circuit board substrate and the side surface of the bonding pad, then flushing with deionized water, and finally drying the flexible circuit board substrate and the side surface of the bonding pad at a speed of 0.5-1.5 m/s by clean gas;
fifthly, coating conductive silver adhesive on the bonding pad;
aligning the metal blocks on the paraffin strips with the bonding pads on the flexible circuit board substrate, and compacting;
heating the bonding pad area at the other side of the flexible circuit board substrate at the temperature of 60-70 ℃ until the paraffin strips are completely melted, directly pressing the fixed block on the metal block at the moment, and keeping a pressing state until the conductive silver adhesive is completely solidified;
and step eight, cleaning the rest paraffin strips.
Preferably, the clean gas required in step four is dry nitrogen, argon or other inert gas.
The invention has the following beneficial effects:
according to the flexible circuit board capable of being wire-bonded for packaging the image sensor and the preparation process thereof, the thickness of the end face of the flexible circuit board is increased by bonding the metal block on the end face of the flexible circuit board, so that the wire-bonding requirement on the end face of the flexible circuit board is met. Meanwhile, the preparation process of the flexible circuit board capable of being wired for packaging the image sensor is simple to operate, the metal blocks are firmly bonded, the conductivity is good, the signal transmission requirement of the chip is completely met, the flexible circuit board can be used as a side outgoing line of a large focal plane image sensor, the occupied surface area of the chip is greatly reduced, and the focal plane utilization efficiency of an optical system is improved. In summary, the flexible circuit board capable of being wired for packaging the image sensor manufactured by the manufacturing process can reduce the space for leading out signals in a focal plane while meeting the outgoing line requirement of the flexible circuit board on the side surface of the image sensor, and realize the effective utilization of the focal plane space.
Drawings
The invention is described in further detail below with reference to the drawings and the detailed description.
FIG. 1 is a schematic diagram of a flexible printed circuit board capable of being wired for packaging an image sensor according to the present invention;
FIG. 2 is a schematic diagram of a flexible circuit board of a wire-bondable flexible circuit board for packaging an image sensor according to the present invention;
FIG. 3 is a flow chart of the process for manufacturing a flexible printed circuit board capable of being wire-bonded for packaging an image sensor according to the present invention;
FIG. 4 is a schematic diagram of an adhesive fixture block of the process of manufacturing a flexible circuit board capable of being wired for packaging an image sensor according to the present invention;
fig. 5 is a schematic diagram of an adhesive metal block and a fixing block of the process for manufacturing a flexible circuit board capable of being wired for packaging an image sensor according to the present invention.
Reference numerals in the drawings denote:
1. an image sensor; 2. an image sensor photosurface; 3. a flexible circuit board; 4. wire bonding; 5. paraffin strips; 6. a fixed block; 301. a flexible circuit board substrate; 302. a bonding pad; 303. a metal block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, a flexible circuit board capable of being wire-bonded for packaging an image sensor comprises an image sensor 1, an image sensor photosurface 2, and a flexible circuit board 3, wherein the image sensor photosurface 2 is positioned on the image sensor 1, and the flexible circuit board 3 is arranged on the side surface of the image sensor 1 and is electrically connected with the image sensor photosurface 2 through a wire bond 4;
the flexible circuit board 3 comprises a flexible circuit board substrate 301 and a wire bonding carrier arranged on the flexible circuit board substrate 301, wherein the wire bonding carrier is electrically connected with the flexible circuit board substrate 301, and the flexible circuit board substrate 301 is electrically connected with the photosensitive surface 2 of the image sensor through the wire bonding carrier by the wire bonding 4.
Specifically, the flexible circuit board substrate 301 is manufactured by a conventional process, and the circuit is integrated inside the flexible circuit board substrate 301. By arranging the wire bonding carrier on the end face of the flexible circuit board substrate 301, the thickness of the end face of the flexible circuit board substrate 301 is increased, and the wire bonding requirement on the end face of the flexible circuit board substrate 301 is met.
Further, the wire bonding carrier includes a bonding pad 302 and a metal block 303;
the bonding pad 302 is arranged on the flexible circuit board substrate 301, and the bonding pad 302 is electrically connected with the flexible circuit board substrate 301;
the metal block 303 is fixed on the bonding pad 302, and the metal block 303 is electrically connected with the bonding pad 302.
Specifically, the metal block 303 is electrically connected with the bonding pad 302 through conductive adhesive or soldering tin, so as to increase the thickness of the wire-bonding area on the end face of the flexible circuit board substrate 301.
Further, the bonding pad 302 and the metal block 303 are electrically connected through conductive adhesive or solder. Wherein the bonding pad 302 is electrically connected with the metal block 303, and the connection mode can be welding, bonding or other modes capable of realizing conductive connection.
Further, the shape and size between the metal block 303 and the pad 302 correspond.
Further, the number of the bonding pads 302 is at least one, and the number of the metal blocks 303 is at least one and is arranged in one-to-one correspondence with the bonding pads 302.
The preparation process of the flexible circuit board capable of being wire-bonded for packaging the image sensor comprises the following process steps:
step one, preparing paraffin strips 5, and processing grooves on the square paraffin strips 5, wherein the grooves correspond to the arrangement of the bonding pads 302, and the width of the grooves is 0.05 mm-0.1 mm narrower than that of the metal blocks 303;
step two, sequentially placing the metal blocks 303 into grooves on the processed paraffin strips 5;
step three, preparing a fixed block 6, placing the paraffin strip 5 on the fixed block 6, and heating the paraffin strip 5 at 30-35 ℃ to adhere the metal block 303 and the fixed block 6 in which the paraffin strip 5 is placed;
step four, cleaning the flexible circuit board substrate 301, firstly dipping 100% pure alcohol into clean cloth to wipe the side surfaces of the flexible circuit board substrate 301 and the bonding pad 302, then flushing with deionized water, and finally drying the surfaces of the flexible circuit board substrate 301 and the bonding pad 302 at a speed of 0.5-1.5 m/s by clean gas;
step five, coating conductive silver paste on the bonding pad 302;
step six, aligning the metal block 303 on the paraffin strip 5 with the bonding pad 302 on the flexible circuit board substrate 301, and compacting;
step seven, heating the area of the bonding pad 302 on the other side of the flexible circuit board substrate 301 at the temperature of 60-70 ℃ until the paraffin 5 is completely melted, directly pressing the fixed block 6 on the metal block 303 at the moment, and keeping the pressing state until the conductive silver adhesive is completely solidified;
and step eight, cleaning the residual paraffin strips 5.
Further, the clean gas required in the fourth step is dry nitrogen, argon or other inert gases.
In another embodiment of the process for manufacturing the flexible circuit board capable of being wired for packaging the image sensor, the second step is to sequentially put the metal blocks 303 into the grooves on the processed paraffin strips 5, and the second step can be realized by heating the paraffin strips 5 and pressing the metal blocks 303 into the paraffin strips 5 after the paraffin strips 5 are softened.
In still another embodiment of the present process for manufacturing a flexible circuit board capable of being wired for packaging an image sensor, if a solder is used to connect the bonding pad 302 and the metal block 303, the fifth step is to apply solder paste on the bonding pad 302, and the heating temperature in the seventh step is to be adjusted to 270-300 ℃.
The preparation process of the flexible circuit board capable of being wired for packaging the image sensor is simple to operate, the metal blocks are firmly bonded, the conductivity is good, the signal transmission requirement of the chip is completely met, the flexible circuit board can be used as a side outgoing line of a large focal plane image sensor, the occupied surface area of the chip is greatly reduced, and the focal plane utilization efficiency of an optical system is improved.
In summary, the flexible circuit board capable of being wired for packaging the image sensor manufactured by the manufacturing process can reduce the space for leading out signals in a focal plane while meeting the outgoing line requirement of the flexible circuit board on the side surface of the image sensor, and realize the effective utilization of the focal plane space.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (5)
1. The preparation process of the flexible circuit board capable of being wire-bonded for the image sensor package, which is produced by the preparation process, comprises an image sensor (1) and an image sensor photosurface (2), wherein the image sensor photosurface (2) is positioned on the image sensor (1), and the preparation process is characterized by further comprising a flexible circuit board (3) which is arranged on the side surface of the image sensor (1) and is electrically connected with the image sensor photosurface (2) through a wire bonding (4);
the flexible circuit board (3) comprises a flexible circuit board substrate (301) and a wire bonding carrier arranged on the flexible circuit board substrate (301), wherein the wire bonding carrier is electrically connected with the flexible circuit board substrate (301), and the flexible circuit board substrate (301) is electrically connected with the photosensitive surface (2) of the image sensor through a wire bonding (4);
the wire bonding carrier comprises a bonding pad (302) and a metal block (303);
the bonding pad (302) is arranged on the flexible circuit board substrate (301), and the bonding pad (302) is electrically connected with the flexible circuit board substrate (301);
the metal block (303) is fixed on the bonding pad (302), and the metal block (303) is electrically connected with the bonding pad (302);
the preparation process of the flexible circuit board capable of being wired for packaging the image sensor comprises the following steps:
step one, preparing paraffin strips (5), and processing grooves on the paraffin strips (5) in square strips, wherein the grooves correspond to the arrangement of the bonding pads (302) and the width of the grooves is 0.05-0.1 mm narrower than the width of the metal blocks (303);
step two, sequentially placing the metal blocks (303) into grooves on the processed paraffin strips (5);
step three, preparing a fixed block (6), placing the paraffin strip (5) block on the fixed block (6), and heating the paraffin strip (5) at 30-35 ℃ to adhere the metal block (303) and the fixed block (6) in which the paraffin strip (5) is placed;
cleaning the flexible circuit board substrate (301), firstly wiping the side surfaces of the flexible circuit board substrate (301) and the bonding pads (302) by using clean cloth dipped with 100% pure alcohol, then flushing by using deionized water, and finally drying the surfaces of the flexible circuit board substrate (301) and the bonding pads (302) at a speed of 0.5-1.5 m/s by using clean gas;
fifthly, coating conductive silver paste on the bonding pad (302);
step six, aligning the metal block (303) on the paraffin strip (5) with the bonding pad (302) on the flexible circuit board substrate (301) and compressing;
heating the area of the bonding pad (302) at the other side of the flexible circuit board substrate (301) at the temperature of 60-70 ℃ until the paraffin strips (5) are completely melted, directly pressing the fixed block (6) on the metal block (303), and keeping a pressing state until the conductive silver adhesive is completely solidified;
and step eight, cleaning the rest paraffin strips (5).
2. The process for manufacturing a flexible printed circuit board capable of being wired for packaging an image sensor according to claim 1, wherein the bonding pad (302) and the metal block (303) are electrically connected by conductive paste or solder.
3. The process for manufacturing a wire-bondable flexible circuit board for image sensor packaging according to claim 1, wherein the metal block (303) corresponds to the shape and size between the pads (302).
4. The process for manufacturing a flexible printed circuit board capable of being wired for packaging an image sensor according to claim 1, wherein the number of the bonding pads (302) is at least one, and the number of the metal blocks (303) is at least one and is arranged in a one-to-one correspondence with the bonding pads (302).
5. The process for manufacturing a flexible printed circuit board capable of being wire-bonded for packaging an image sensor according to claim 1, wherein the clean gas required in the fourth step is dry nitrogen, argon or other inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110545320.5A CN113241352B (en) | 2021-05-19 | 2021-05-19 | Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110545320.5A CN113241352B (en) | 2021-05-19 | 2021-05-19 | Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113241352A CN113241352A (en) | 2021-08-10 |
| CN113241352B true CN113241352B (en) | 2024-03-15 |
Family
ID=77137649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110545320.5A Active CN113241352B (en) | 2021-05-19 | 2021-05-19 | Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113241352B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06113214A (en) * | 1992-09-28 | 1994-04-22 | Olympus Optical Co Ltd | Solid-state image pickup device |
| JP2002305361A (en) * | 2001-04-05 | 2002-10-18 | Casio Micronics Co Ltd | Flexible wiring board, manufacturing method therefor, joining structure of flexible wiring board and joining method therefor |
| JP2003133654A (en) * | 2001-06-13 | 2003-05-09 | Canon Inc | Flexible board, semiconductor device, imaging device, radiation imaging device and system thereof |
| JP2006114664A (en) * | 2004-10-14 | 2006-04-27 | Denso Corp | Electronic part and method of manufacturing the same |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| CN110661939A (en) * | 2018-06-29 | 2020-01-07 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| KR20200084559A (en) * | 2019-01-03 | 2020-07-13 | 주식회사 엠씨넥스 | Image sensor package of camera |
| CN111739863A (en) * | 2020-08-25 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Fingerprint identification chip packaging structure and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7139060B2 (en) * | 2004-01-27 | 2006-11-21 | Au Optronics Corporation | Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
| JP4855168B2 (en) * | 2006-07-27 | 2012-01-18 | オリンパス株式会社 | Solid-state imaging device |
| US20130241057A1 (en) * | 2012-03-14 | 2013-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and Apparatus for Direct Connections to Through Vias |
| US20160148965A1 (en) * | 2014-09-30 | 2016-05-26 | James E. Clayton | Detector assembly using vertical wire bonds and compression decals |
-
2021
- 2021-05-19 CN CN202110545320.5A patent/CN113241352B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06113214A (en) * | 1992-09-28 | 1994-04-22 | Olympus Optical Co Ltd | Solid-state image pickup device |
| JP2002305361A (en) * | 2001-04-05 | 2002-10-18 | Casio Micronics Co Ltd | Flexible wiring board, manufacturing method therefor, joining structure of flexible wiring board and joining method therefor |
| JP2003133654A (en) * | 2001-06-13 | 2003-05-09 | Canon Inc | Flexible board, semiconductor device, imaging device, radiation imaging device and system thereof |
| JP2006114664A (en) * | 2004-10-14 | 2006-04-27 | Denso Corp | Electronic part and method of manufacturing the same |
| CN110661939A (en) * | 2018-06-29 | 2020-01-07 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module and photosensitive assembly manufacturing method |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| KR20200084559A (en) * | 2019-01-03 | 2020-07-13 | 주식회사 엠씨넥스 | Image sensor package of camera |
| CN111739863A (en) * | 2020-08-25 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Fingerprint identification chip packaging structure and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113241352A (en) | 2021-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102646606B (en) | Packaging method of integrated circuit (IC) card module | |
| US20020053727A1 (en) | Semiconductor device | |
| JPH09260538A (en) | Resin sealed semiconductor device manufacturing method and its mounting structure | |
| US6696310B2 (en) | Manufacturing method of lighting device | |
| CN104094426A (en) | Semiconductor light emitting device and fabrication method for same | |
| CN103325803B (en) | Image sensor package method and structure, imageing sensor module and formation method | |
| JPH081936B2 (en) | Chip carrier and method of manufacturing the same | |
| CN101292576B (en) | A component adapted for being mounted on a substrate and a method of mounting a surface mounted device | |
| CN113241352B (en) | Wire-bonding flexible circuit board for packaging image sensor and preparation process thereof | |
| JP2006080477A (en) | Flip chip packaging/manufacturing method, and device thereof | |
| CN100468728C (en) | Multiple chip semi-conductor packaging structure and encapsulation method | |
| KR20010028845A (en) | Stacked micro ball grid array package and manufacturing method thereof | |
| TWI660571B (en) | Solar cell string and method for manufacturing the same | |
| CN106571377A (en) | Image sensor module and manufacturing method thereof | |
| US8084847B2 (en) | Prefabricated lead frame and bonding method using the same | |
| US20050009242A1 (en) | Packaging method for thin integrated circuits | |
| CN112530929A (en) | Electronic assembly, manufacturing method thereof, camera and electronic device | |
| CN1465122A (en) | Optical semiconductor module and method of producing the same | |
| JP2002289741A (en) | Semiconductor device | |
| CN203312298U (en) | Image sensor packaging structure and image sensor module | |
| CN213877424U (en) | Flexible transparent display screen without connector | |
| CN215299240U (en) | Packaging structure of driving chip and packaging support thereof | |
| CN218547066U (en) | Photoelectric packaging structure | |
| CN214542238U (en) | CMOS image sensor packaging structure | |
| CN210805768U (en) | Chip support and light emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |