JP5158895B2 - Imaging device - Google Patents

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JP5158895B2
JP5158895B2 JP2010109236A JP2010109236A JP5158895B2 JP 5158895 B2 JP5158895 B2 JP 5158895B2 JP 2010109236 A JP2010109236 A JP 2010109236A JP 2010109236 A JP2010109236 A JP 2010109236A JP 5158895 B2 JP5158895 B2 JP 5158895B2
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holding plate
image sensor
substrate
fixing
control board
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JP2011237623A (en
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真 北川
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Sharp Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B37/00—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe
    • G03B37/04—Panoramic or wide-screen photography; Photographing extended surfaces, e.g. for surveying; Photographing internal surfaces, e.g. of pipe with cameras or projectors providing touching or overlapping fields of view
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Cameras In General (AREA)
  • Stereoscopic And Panoramic Photography (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Description

所定距離をおいて配設された複数のレンズユニットと、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備えた撮像装置に関する。   The present invention relates to an imaging apparatus including a plurality of lens units disposed at a predetermined distance and a plurality of imaging elements that capture images formed by the plurality of lens units.

従来から、パノラマ画像など複数の画像を撮像する撮像装置、例えば、水平方向に所定距離ずつずらして配設された複数のデジタルカメラにより撮像された複数枚の画像データを合成して１枚の画像を生成する装置が提案されている。   Conventionally, an image pickup apparatus that picks up a plurality of images such as a panoramic image, for example, a plurality of pieces of image data picked up by a plurality of digital cameras arranged by shifting a predetermined distance in the horizontal direction, combines one piece of image data. Has been proposed.

特許文献１には、このようなパノラマ画像を生成する撮像装置が開示されている。この撮像装置は、装置内に、所定距離をおいて配設された複数のレンズユニットと、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備える。なお、前記レンズユニットは、少なくとも、レンズと鏡筒から構成され、前記所定距離は、いわゆる基線長と呼ばれるものである。
パノラマ画像は、前記複数の撮像素子によって撮像された複数の画像の重複する領域（オーバーラップ領域とも言う）を相互に重ね合わせることによって生成される。 Patent Document 1 discloses an imaging apparatus that generates such a panoramic image. The imaging apparatus includes a plurality of lens units arranged at a predetermined distance in the apparatus and a plurality of imaging elements that capture images formed by the plurality of lens units. The lens unit includes at least a lens and a lens barrel, and the predetermined distance is a so-called baseline length.
A panoramic image is generated by superimposing overlapping regions (also referred to as overlap regions) of a plurality of images captured by the plurality of image sensors.

特開２００７−１６６３１７号公報JP 2007-166317 A

このような撮像装置の製造工程において、最適なパノラマ画像を得るために、例えば、所定間隔をおいて複数の撮像素子を平面状の板（保持板とも言う）に接着固定し、また、前記複数の撮像素子に対応する複数のレンズユニットを前記保持板に接着固定する作業を行う。   In the manufacturing process of such an imaging device, in order to obtain an optimal panoramic image, for example, a plurality of imaging elements are bonded and fixed to a flat plate (also referred to as a holding plate) at a predetermined interval. An operation of adhering and fixing a plurality of lens units corresponding to the imaging element to the holding plate is performed.

このとき、複数の撮像素子（レンズユニット）間の距離（基線長）が必要以上に大きくなると、撮像画像間の視差が大きくなるので、オーバーラップ領域が小さくなる。その結果、水平方向におけるパノラマ画像の幅が狭くなる。そこで、基線長を適切な長さに設定する必要がある。   At this time, if the distance (baseline length) between the plurality of image pickup elements (lens units) becomes larger than necessary, the parallax between the picked-up images becomes larger, so the overlap region becomes smaller. As a result, the width of the panoramic image in the horizontal direction is reduced. Therefore, it is necessary to set the baseline length to an appropriate length.

しかし、複数の撮像素子を保持板に固定する固定部材が場所を取り合う、即ち、固定部材が干渉し合うので、基線長を適切な長さに設定することは困難である。
このように、基線長を適切な長さに設定しなければならない状況下で、複数の撮像素子の位置合わせ調整作業、及び、固定作業を容易に実行することは更に困難である。 However, it is difficult to set the base line length to an appropriate length because the fixing members that fix the plurality of image sensors to the holding plate take place, that is, the fixing members interfere with each other.
As described above, it is more difficult to easily perform the alignment adjustment work and the fixing work of the plurality of image pickup devices in a situation where the base line length must be set to an appropriate length.

本発明は、かかる実情に鑑みてなされたものであり、所定距離をおいて配設された複数のレンズユニットと、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備えた撮像装置において、基線長を適切な長さに設定し、複数の撮像素子の位置合わせ調整作業、固定作業を容易かつ確実にする撮像装置を提供することを目的とする。   The present invention has been made in view of such a situation, and includes a plurality of lens units disposed at a predetermined distance and a plurality of imaging elements that capture images formed by the plurality of lens units. An object of the present invention is to provide an imaging apparatus that sets a base line length to an appropriate length and facilitates and reliably performs alignment adjustment work and fixing work of a plurality of imaging elements.

第１の技術手段は、所定距離をおいて配設された複数のレンズユニットに対応し、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備えた撮像装置において、前記複数の撮像素子はそれぞれの基板に搭載され、前記それぞれの基板に搭載された前記撮像素子は、該撮像素子の画素配列方向が所定の方向と略一致するように配設され、前記それぞれの基板が紫外線透過性部材からなる１つの平板状の保持板に固着されており、前記保持板は、前記それぞれの基板の外形形状に略一致する複数の矩形開口部を備え、前記保持板の矩形開口部内に、前記それぞれの基板が配設され、前記保持板の矩形開口部の内側面部と前記それぞれの基板の外側面部とが紫外線硬化樹脂により接着固定されており、紫外線透過性部材からなる前記１つの平板状の保持板の矩形開口部の内側面部は、テーパ部を備え、前記保持板の前記テーパ部と前記それぞれの基板の外側面部との隙間に、前記テーパ部に対応する、紫外線透過性部材からなるクサビ形状の固定部材が、前記それぞれの基板の調整された配設位置を変えることなく差し込まれ、前記くさび形状の固定部材と前記保持板のテーパ部、及び、前記固定部材と前記それぞれの基板の外側面部とが紫外線硬化樹脂により接着固定されていることを特徴とするものである。 A first technical means corresponds to a plurality of lens units disposed at a predetermined distance, and includes a plurality of imaging elements that capture images formed by the plurality of lens units. The image pickup devices are mounted on respective substrates, and the image pickup devices mounted on the respective substrates are arranged so that a pixel arrangement direction of the image pickup devices substantially coincides with a predetermined direction, The holding plate is fixed to one flat holding plate made of an ultraviolet light transmissive member, and the holding plate includes a plurality of rectangular openings that substantially match the outer shape of each of the substrates, and the inside of the rectangular opening of the holding plate. in the the respective substrates are arranged, and an outer surface portion of the inner surface and the respective substrate of the rectangular opening of the holding plate are bonded by an ultraviolet curing resin, or an ultraviolet transmissive member The inner side surface portion of the rectangular opening of the one flat holding plate is provided with a taper portion, and corresponds to the taper portion in the gap between the taper portion of the holding plate and the outer surface portion of each of the substrates, A wedge-shaped fixing member made of an ultraviolet light transmissive member is inserted without changing the adjusted arrangement position of each of the substrates, and the wedge-shaped fixing member, the tapered portion of the holding plate, and the fixing member And an outer surface portion of each of the substrates are bonded and fixed by an ultraviolet curable resin.

第２の技術手段は、第１の技術手段の撮像装置において、前記それぞれの基板を紫外線硬化樹脂により前記１つの平板上の保持板に接着固定した後、前記レンズユニットを前記１つの平板上の保持板に接着固定することを特徴とするものである。
According to a second technical means, in the imaging device of the first technical means, the respective substrates are bonded and fixed to the holding plate on the one flat plate with an ultraviolet curable resin, and then the lens unit is mounted on the one flat plate. It is characterized by being bonded and fixed to the holding plate.

本発明によれば、所定距離をおいて配設された複数のレンズユニットと、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備えた撮像装置において、複数の撮像素子の固定に紫外線を透過する固定部材を用いることで、基線長を適切な長さに設定し、複数の撮像素子の位置合わせ調整作業、固定作業を容易かつ確実にすることができる。   According to the present invention, in an imaging apparatus including a plurality of lens units arranged at a predetermined distance and a plurality of imaging elements that capture images formed by the plurality of lens units, By using a fixing member that transmits ultraviolet light for fixing, the base line length can be set to an appropriate length, and the alignment adjustment operation and the fixing operation of the plurality of image sensors can be easily and reliably performed.

本発明に係る撮像装置の主要構成部品の調整工程、固定工程を説明する図である。It is a figure explaining the adjustment process and fixing process of the main components of the imaging device concerning the present invention. 撮像素子の制御基板等を保持板に取り付ける工程を説明する図である。It is a figure explaining the process of attaching the control board etc. of an image pick-up element to a holding plate. 固定部材の外観図である。It is an external view of a fixing member. 紫外線硬化樹脂が塗布された状態を示す図である。It is a figure which shows the state by which the ultraviolet curable resin was apply | coated. レンズユニットの位置調整、固定工程を説明する図である。It is a figure explaining the position adjustment and fixing process of a lens unit. 撮像素子を保持板に直接固定する工程を説明する図である。It is a figure explaining the process of fixing an image sensor directly to a holding plate. 撮像素子等を保持板に直接取り付ける工程を説明する図である。It is a figure explaining the process of attaching an image pick-up element etc. directly to a holding plate. レンズユニットの位置調整、固定工程を説明する図である。It is a figure explaining the position adjustment and fixing process of a lens unit. 撮像素子を保持板に直接固定する工程を説明する図である。It is a figure explaining the process of fixing an image sensor directly to a holding plate. 図９の断面詳細図である。FIG. 10 is a detailed cross-sectional view of FIG. 9.

（実施例１）
本発明に係る撮像装置の組み立て工程を、図面を参照しながら説明する。
図１は、本発明に係る撮像装置１００の主要構成部品の調整工程、固定工程を説明する図である。
図２（Ａ）は、第１撮像素子１１０が搭載されている第１制御基板１２０等を保持板１３０に取り付ける工程を説明する正面図、図２（Ｂ）は、前記工程を説明する側面図である。 Example 1
An assembly process of the imaging device according to the present invention will be described with reference to the drawings.
FIG. 1 is a diagram illustrating an adjustment process and a fixing process of main components of the imaging apparatus 100 according to the present invention.
2A is a front view illustrating a process of attaching the first control board 120 and the like on which the first image sensor 110 is mounted to the holding plate 130, and FIG. 2B is a side view illustrating the process. It is.

図１の顕微鏡２００は、ステージ２０１上に置かれた第１撮像素子１１０の画素等を拡大して観察するものである。このステージ２０１は、顕微鏡２００の光軸Ａ（Ｚ軸）に対して垂直である（ＸＹ平面）。
マニピュレータ３００は、撮像装置１００の主要構成部品の位置調整を行うものである。 The microscope 200 in FIG. 1 is for magnifying and observing the pixels of the first image sensor 110 placed on the stage 201. The stage 201 is perpendicular to the optical axis A (Z axis) of the microscope 200 (XY plane).
The manipulator 300 adjusts the position of the main components of the imaging device 100.

図２の第１撮像素子１１０は、第１撮像素子１１０の外装用基板（パッケージ基板）である第１撮像素子基板１１０ａに搭載されている。更に、第１撮像素子基板１１０ａは、第１制御基板１２０に搭載されている。
第１制御基板１２０は、第１撮像素子基板１１０ａの他にも、第１撮像素子１１０の動作制御や第１撮像素子１１０が出力した画像データを受信する各種電子部品を搭載する基板である。 The first image sensor 110 of FIG. 2 is mounted on a first image sensor substrate 110a that is an exterior substrate (package substrate) of the first image sensor 110. Further, the first imaging element substrate 110 a is mounted on the first control board 120.
The first control board 120 is a board on which various electronic components that receive operation control of the first image sensor 110 and image data output from the first image sensor 110 are mounted in addition to the first image sensor board 110a.

第１撮像素子１１０と同機能を有する第２撮像素子１４０も、第２撮像素子１４０の外装用基板（パッケージ基板）である第２撮像素子基板１４０ａに搭載され、第２撮像素子基板１４０ａも、第１制御基板１２０と同機能を有する第２制御基板１５０に搭載されている。   The second image sensor 140 having the same function as the first image sensor 110 is also mounted on the second image sensor substrate 140a, which is an exterior substrate (package substrate) of the second image sensor 140, and the second image sensor substrate 140a is also It is mounted on a second control board 150 having the same function as the first control board 120.

保持板１３０は、第１制御基板１２０、第２制御基板１５０が取り付け固定される平面状の板（平板）である。
符号Ｆは、撮像素子（１１０、１４０）を搭載する基板（１２０、１５０）が保持板１３０に固着されている固着部分を示す。 The holding plate 130 is a flat plate (flat plate) to which the first control board 120 and the second control board 150 are attached and fixed.
Reference numeral F denotes a fixed portion where the substrate (120, 150) on which the image sensor (110, 140) is mounted is fixed to the holding plate 130.

以下、第１撮像素子１１０、第２撮像素子１４０を同一平面の保持板１３０上に配設、固定する工程を、図１、図２等を参照しながら詳細に説明する。
まず、技術者が、ステージ２０１に保持板１３０を置く。保持板１３０には第１制御基板１２０、第２制御基板１５０の概略位置決めを行うための第１位置決めピン１３０ａ、第２位置決めピン１３０ｂが予め取り付けられている。このとき、マニピュレータ３００のアーム３０１を第１制御基板１２０に取り外し自在に取り付ける。マニピュレータ３００は、アーム３０１を６軸（Ｘ、Ｙ、Ｚ、θＸ、θＹ、θＺ）方向に動作させることが可能であり、マニピュレータ３００により、第１制御基板１２０の位置を６軸方向に調整する。ここでθＸはＸ軸周りの回転、θＹはＹ軸方向の回転、θＺはＺ軸方向の回転を示す。 Hereinafter, the process of disposing and fixing the first image sensor 110 and the second image sensor 140 on the same plane holding plate 130 will be described in detail with reference to FIGS.
First, an engineer places the holding plate 130 on the stage 201. A first positioning pin 130 a and a second positioning pin 130 b for roughly positioning the first control board 120 and the second control board 150 are attached to the holding plate 130 in advance. At this time, the arm 301 of the manipulator 300 is detachably attached to the first control board 120. The manipulator 300 can move the arm 301 in six axis directions (X, Y, Z, θ X , θ Y , θ Z ), and the manipulator 300 moves the position of the first control board 120 in the six axis directions. Adjust to. Here, θ X represents rotation around the X axis, θ Y represents rotation in the Y axis direction, and θ Z represents rotation in the Z axis direction.

次に、第１位置決めピン１３０ａに沿って第１制御基板１２０を保持板１３０に配置することで、第１制御基板１２０の概略位置決めを行う。
次に、技術者は、顕微鏡２００を覗きながらマニピュレータ３００を操作して、第１撮像素子１１０におけるθＸ、θＹ方向のあおりが顕微鏡の焦点深度内に入るように第１制御基板１２０の位置調整を行う。そして、顕微鏡２００のＸＹ方向（符号Ｃに示すクロスライン参照）と第１撮像素子１１０の画素配列（ＸＹ軸参照）が一致するようにθＺ方向に対して第１制御基板１２０の位置調整を行う。 Next, the first control board 120 is roughly positioned by placing the first control board 120 on the holding plate 130 along the first positioning pins 130a.
Next, the engineer operates the manipulator 300 while looking into the microscope 200 to position the first control board 120 so that the tilts in the θ X and θ Y directions in the first image sensor 110 are within the depth of focus of the microscope. Make adjustments. Then, the position of the first control board 120 is adjusted with respect to the θZ direction so that the XY direction of the microscope 200 (refer to the cross line indicated by reference symbol C) and the pixel arrangement (refer to the XY axis) of the first image sensor 110 coincide. Do.

そして、これらの位置調整が終了すると、第１撮像素子１１０の上辺の中央部、左辺の中央部、右辺の中央部に対応する第１制御基板１２０の外側面部１２０ａに紫外線硬化樹脂が塗布された固定部材１６０を配設する。
図３は、固定部材１６０の外観図である。固定部材１６０は、紫外線を透過する部材から構成された例えば立方体状の部品である。固定部材１６０の側面部１６０ａ、底面部１６０ｂに予め紫外線硬化樹脂を塗布する。そして、図４に示すように、紫外線硬化樹脂（符号Ｂ参照）が塗布された固定部材１６０の側面部１６０ａを、位置調整が終了している第１制御基板１２０の外側面部１２０ａに接するように配設する。このとき、底面部１６０ｂが保持板１３０に接している。なお、図４では、第１撮像素子１１０の上辺の中央部にある固定部材１６０に塗布された紫外線硬化樹脂のみを図示しているが、第１撮像素子１１０の左辺の中央部、右辺の中央部に配設された固定部材にも同様に紫外線硬化樹脂が塗布されている。 When these position adjustments are completed, the ultraviolet curable resin is applied to the outer side surface portion 120a of the first control board 120 corresponding to the central portion of the upper side of the first imaging element 110, the central portion of the left side, and the central portion of the right side. A fixing member 160 is disposed.
FIG. 3 is an external view of the fixing member 160. The fixing member 160 is, for example, a cubic part composed of a member that transmits ultraviolet rays. An ultraviolet curable resin is applied in advance to the side surface portion 160 a and the bottom surface portion 160 b of the fixing member 160. Then, as shown in FIG. 4, the side surface portion 160 a of the fixing member 160 to which the ultraviolet curable resin (see reference symbol B) is applied is in contact with the outer side surface portion 120 a of the first control board 120 whose position adjustment has been completed. Arrange. At this time, the bottom surface portion 160 b is in contact with the holding plate 130. In FIG. 4, only the ultraviolet curable resin applied to the fixing member 160 at the center of the upper side of the first image sensor 110 is illustrated, but the center of the left side of the first image sensor 110 and the center of the right side are illustrated. Similarly, an ultraviolet curable resin is applied to the fixing member disposed in the portion.

前記紫外線硬化樹脂が塗布された固定部材１６０を前記位置に配設した後、図示しない紫外線照射装置から紫外線を固定部材１６０に照射して、塗布された紫外線硬化樹脂を硬化する。
固定部材１６０は、紫外線透過性部材から構成されているので、紫外線照射装置からの紫外線が固定部材１６０を透過して、前記紫外線硬化樹脂に照射され、前記紫外線硬化樹脂が確実に硬化する。
紫外線硬化樹脂の硬化後、マニピュレータ３００を取り外し、第２制御基板１５０の位置調整、固定作業を行う。この作業は、前述した第１制御基板１２０の位置調整、固定作業と同様である。前記位置調整、固定作業により、第１撮像素子１１０と同一の焦点深度内に第２撮像素子１４０の位置が調整され、更に、第１撮像素子１１０、第２撮像素子１４０の画素配列がＸＹ方向に一致する。 After the fixing member 160 to which the ultraviolet curable resin is applied is disposed at the position, the fixing member 160 is irradiated with ultraviolet rays from an ultraviolet irradiation device (not shown) to cure the applied ultraviolet curable resin.
Since the fixing member 160 is composed of an ultraviolet transmissive member, ultraviolet rays from the ultraviolet irradiation device pass through the fixing member 160 and are irradiated onto the ultraviolet curable resin, so that the ultraviolet curable resin is reliably cured.
After the ultraviolet curable resin is cured, the manipulator 300 is removed, and the position adjustment and fixing work of the second control board 150 is performed. This operation is the same as the position adjustment and fixing operation of the first control board 120 described above. By the position adjustment and fixing operation, the position of the second image sensor 140 is adjusted within the same depth of focus as the first image sensor 110, and the pixel arrangement of the first image sensor 110 and the second image sensor 140 is in the XY direction. Matches.

このように、固着部Ｆは、紫外線透過性部材からなる固定部材１６０を備え、固定部材１６０を介して第１制御基板１２０、第２制御基板１５０が保持板１３０に固着されている。   As described above, the fixing portion F includes the fixing member 160 made of an ultraviolet light transmissive member, and the first control board 120 and the second control board 150 are fixed to the holding plate 130 via the fixing member 160.

図２に示した保持板１３０の中央部に固定された固定部材１６０Ｍは、第１制御基板１２０、第２制御基板１５０を固定している。このように１つの固定部材を介して２つの基板を固定することができるので、固定部材が干渉し合うことにより、基線長が必要以上に長くなることがない。それ故、基線長を適切な長さに設定することができる。 Fixing members 160 M which is fixed to the central portion of the holding plate 130 shown in FIG. 2, a first control board 120, the second control board 150 is fixed. Since two substrates can be fixed via one fixing member in this way, the base line length does not become longer than necessary due to interference between the fixing members. Therefore, the base line length can be set to an appropriate length.

次に、レンズユニットの位置調整、固定工程について、図５を用いて説明する。
図５（Ａ）は、レンズユニット１７０等の位置調整、固定工程を説明する正面図、図５（Ｂ）は、同断面図である。 Next, the position adjustment and fixing process of the lens unit will be described with reference to FIG.
FIG. 5A is a front view for explaining the position adjustment and fixing process of the lens unit 170 and the like, and FIG. 5B is a sectional view thereof.

まず、第１撮像素子１１０の中心にレンズユニット１７０のレンズの中心が略一致するように、即ち、両中心が同一光軸上に位置するように、レンズユニット１７０の位置を概略調整する。なお、レンズユニット１７０には、マニピュレータ３００のアーム３０１が取り付けられているとする。同時に、第１制御基板１２０と表示装置とを接続して、レンズユニット１７０のレンズを介して第１撮像素子１１０により撮像されたチャート画像が前記表示装置に表示されるようにする。このチャート画像は、バックフォーカス調整、あおり調整を行う際に必要なものである。   First, the position of the lens unit 170 is roughly adjusted so that the center of the lens of the lens unit 170 substantially coincides with the center of the first image sensor 110, that is, both centers are located on the same optical axis. It is assumed that the arm 301 of the manipulator 300 is attached to the lens unit 170. At the same time, the first control board 120 and the display device are connected so that the chart image captured by the first image sensor 110 via the lens of the lens unit 170 is displayed on the display device. This chart image is necessary for back focus adjustment and tilt adjustment.

このようにチャート画像が前記表示装置に表示されている状態において、チャート画像が前記表示装置に最適表示されるように、Ｚ方向にレンズユニット１７０の位置調整、即ち、バックフォーカス調整を行う。引き続き、表示装置の画面内で均一に焦点を結ぶように、レンズユニット１７０におけるθＸ、θＹ方向のあおり調整を行う。前記調整を繰り返し、レンズユニット１７０の最適配置を調整する。この調整が終了すると、例えば、紫外線硬化樹脂等を用いてレンズユニット１７０を保持板１３０に固定する。 Thus, in a state where the chart image is displayed on the display device, the position adjustment of the lens unit 170 in the Z direction, that is, the back focus adjustment is performed so that the chart image is optimally displayed on the display device. Subsequently, tilt adjustment in the θ X and θ Y directions in the lens unit 170 is performed so as to focus uniformly on the screen of the display device. The above adjustment is repeated to adjust the optimal arrangement of the lens unit 170. When this adjustment is completed, the lens unit 170 is fixed to the holding plate 130 using, for example, an ultraviolet curable resin.

次に、第１撮像素子１１０に対応するレンズユニット１７０の配設、固定と同様にして、第２撮像素子１４０に対応するレンズユニット１７１の配設、固定作業を行い、撮像装置１００の主要組み立て作業が完了する。   Next, the lens unit 171 corresponding to the second image sensor 140 is disposed and fixed in the same manner as the lens unit 170 corresponding to the first image sensor 110, and the main assembly of the image pickup apparatus 100 is performed. The work is complete.

（実施例１の変形例）
上記実施例では、第１撮像素子１１０（第１撮像素子基板１１１ａ）は、第１制御基板１２０に搭載されていたが、第１制御基板１２０から第１撮像素子１１０を物理的に分離し、第１撮像素子１１０と第１制御基板１２０をフレキシブルプリント基板（ＦＰＣ：Flexible printed circuits）を介して接続することもある。
このような場合、図６に示すように、第１撮像素子１１１の第１撮像素子基板１１１ａを保持板１３０に固定部材１６０を用いて直接固定するようにしてもよい。 (Modification of Example 1)
In the above embodiment, the first image sensor 110 (first image sensor substrate 111a) is mounted on the first control board 120, but physically separates the first image sensor 110 from the first control board 120, The first image sensor 110 and the first control board 120 may be connected via a flexible printed circuit (FPC).
In such a case, as shown in FIG. 6, the first imaging element substrate 111 a of the first imaging element 111 may be directly fixed to the holding plate 130 using the fixing member 160.

図６（Ａ）は、第１撮像素子基板１１１ａを保持板１３０に固定部材１６０を用いて直接固定している状態を示す正面図、図６（Ｂ）は同側面図である。
第１撮像素子１１１（第１撮像素子基板１１１ａ）は、ＦＰＣ１８０を介して図示しない制御基板に接続している。第２撮像素子１４１の第２撮像素子基板１４１ａも、第１撮像素子基板１１１ａと同様に保持板１３０に固定部材１６０を用いて直接固定する。なお、第２撮像素子１４１（第２撮像素子基板１４１ａ）も、ＦＰＣ１８１を介して図示しない制御基板に接続している。 6A is a front view showing a state in which the first imaging element substrate 111a is directly fixed to the holding plate 130 using the fixing member 160, and FIG. 6B is a side view thereof.
The first image sensor 111 (first image sensor substrate 111a) is connected to a control board (not shown) via the FPC 180. Similarly to the first image sensor substrate 111a, the second image sensor substrate 141a of the second image sensor 141 is also directly fixed to the holding plate 130 using the fixing member 160. The second image sensor 141 (second image sensor substrate 141a) is also connected to a control board (not shown) via the FPC 181.

（実施例２）
他にも様々な手法により、紫外線硬化樹脂を使用して平板の保持板に撮像素子等を取り付け固定することができる。
図７（Ａ）は、上記取り付け固定を説明する正面図、図７（Ｂ）は、同断面図である。
保持板１３１は、紫外線透過性部材から構成される平面状の板であり、矩形開口部１３１ａ、１３１ｂを備える。 (Example 2)
In addition, an image pickup device or the like can be attached and fixed to a flat holding plate using an ultraviolet curable resin by various methods.
FIG. 7A is a front view for explaining the mounting and fixing, and FIG. 7B is a sectional view thereof.
The holding plate 131 is a planar plate made of an ultraviolet transmissive member and includes rectangular openings 131a and 131b.

矩形開口部１３１ａの形状は、第１撮像素子１１２が搭載される第１撮像素子基板１１２ａの外形形状に略一致する。矩形開口部１３１ｂの形状は、第２撮像素子１４２が搭載される第２撮像素子基板１４２ａの外形形状に略一致する。
また、実施例１のように、第１撮像素子基板１１２ａは第１制御基板１２１に搭載され、第２撮像素子基板１４２ａは第２制御基板１５１に搭載されているものとする。 The shape of the rectangular opening 131a substantially matches the outer shape of the first image sensor substrate 112a on which the first image sensor 112 is mounted. The shape of the rectangular opening 131b substantially matches the outer shape of the second image sensor substrate 142a on which the second image sensor 142 is mounted.
Further, as in the first embodiment, it is assumed that the first imaging element substrate 112a is mounted on the first control board 121 and the second imaging element substrate 142a is mounted on the second control board 151.

以下、第１撮像素子１１２、第２撮像素子１４２を保持板１３１に配設、固定する工程を、図７を参照しながら詳細に説明する。
まず、保持板１３１に形成された矩形開口部１３１ａの内側面部１３１ｃに紫外線硬化樹脂を塗布する。そして、保持板１３１の裏側（図７（Ｂ）では左側）から第１撮像素子基板１１２ａ（第１撮像素子１１２）を矩形開口部１３１ａに配設（挿入）する。なお、矩形開口部１３１ａの内側面部１３１ｃと第１撮像素子基板１１２ａの外側面部１１２ｂには符号Ｓ（図７（Ｂ））で示す隙間（クリアランス）が形成され、その間に紫外線硬化樹脂がある。 Hereinafter, the process of disposing and fixing the first image sensor 112 and the second image sensor 142 to the holding plate 131 will be described in detail with reference to FIG.
First, an ultraviolet curable resin is applied to the inner side surface 131c of the rectangular opening 131a formed in the holding plate 131. Then, the first imaging element substrate 112a (first imaging element 112) is disposed (inserted) into the rectangular opening 131a from the back side (left side in FIG. 7B) of the holding plate 131. A gap (clearance) indicated by a symbol S (FIG. 7B) is formed between the inner side surface portion 131c of the rectangular opening 131a and the outer side surface portion 112b of the first image pickup device substrate 112a, and there is an ultraviolet curable resin therebetween.

次に、第１撮像素子基板１１２ａを保持板１３１の矩形開口部１３１ａに配設した状態のまま、図１に示した顕微鏡２００のステージ２０１に平面状の保持板１３１を置く。なお、このとき、保持板１３１とステージ２０１との間に一定の空間が生じるように、保持板１３１とステージ２０１の間に、例えば４つの円柱状部材を置く。この４つの円柱状部材は、保持板１３１の角部にそれぞれ置かれる。この円柱状部材により、第１制御基板１２１等の位置調整を行う際に必要となる空間が形成される。このとき、ステージ２０１と保持板１３１とが平行になっている。   Next, the planar holding plate 131 is placed on the stage 201 of the microscope 200 shown in FIG. 1 while the first imaging element substrate 112a is disposed in the rectangular opening 131a of the holding plate 131. At this time, for example, four columnar members are placed between the holding plate 131 and the stage 201 so that a certain space is generated between the holding plate 131 and the stage 201. These four columnar members are respectively placed at the corners of the holding plate 131. The columnar member forms a space required when adjusting the position of the first control board 121 and the like. At this time, the stage 201 and the holding plate 131 are parallel to each other.

次に、マニピュレータ３００のアーム３０１を第１制御基板１２１に取り外し自在に取り付ける。そして、実施例１で説明したように、第１撮像素子１１２におけるθＸ、θＹ方向のあおりが顕微鏡の焦点深度内に入るように第１制御基板１２１の位置調整を行う。そして、顕微鏡２００のＸＹ方向と第１撮像素子１１２の画素配列が一致するようにθＺ方向に対して第１制御基板１２１の位置調整を行う。 Next, the arm 301 of the manipulator 300 is detachably attached to the first control board 121. As described in the first embodiment, the position of the first control board 121 is adjusted so that the tilts in the θ X and θ Y directions of the first image sensor 112 are within the depth of focus of the microscope. Then, the position adjustment of the first control board 121 with respect to theta Z direction as XY direction and pixel arrangement of the first image sensor 112 of the microscope 200 are matched.

前記位置調整後、図示しない紫外線照射装置から紫外線を矩形開口部１３１ａの内側面部１３１ｃに照射して、塗布された紫外線硬化樹脂を硬化して、第１撮像素子基板１１２ａを保持板１３１に固定する。このように、保持板１３１は、紫外線透過性部材から構成されているので、紫外線照射装置からの紫外線が前記紫外線硬化樹脂に照射され、紫外線硬化樹脂が確実に硬化する。
なお、保持板１３１と第１制御基板１２１との接触面にも紫外線硬化樹脂を塗布し、前記紫外線硬化樹脂により、保持板１３１と第１制御基板１２１を接着固定してもよい。 After the position adjustment, ultraviolet rays are irradiated to the inner side surface 131c of the rectangular opening 131a from an ultraviolet irradiation device (not shown), the applied ultraviolet curable resin is cured, and the first imaging element substrate 112a is fixed to the holding plate 131. . Thus, since the holding plate 131 is composed of an ultraviolet light transmissive member, the ultraviolet curable resin is irradiated with ultraviolet rays from the ultraviolet irradiation device, and the ultraviolet curable resin is reliably cured.
Alternatively, an ultraviolet curable resin may be applied to the contact surface between the holding plate 131 and the first control board 121, and the holding plate 131 and the first control board 121 may be bonded and fixed by the ultraviolet curable resin.

引き続き、第２制御基板１５１の位置調整、固定作業を行う。この作業の前に、マニピュレータ３００のアーム３０１を第１制御基板１２１から取り外し、第２制御基板１５１に取り付ける。そして、前述のように、保持板１３１の矩形開口部１３１ｂの内側面部１３１ｄに紫外線硬化樹脂を塗布し、保持板１３１の裏側から第２撮像素子基板１４２ａ（第２撮像素子１４２）を矩形開口部１３１ｂに配設する。   Subsequently, the position adjustment and fixing work of the second control board 151 is performed. Prior to this operation, the arm 301 of the manipulator 300 is removed from the first control board 121 and attached to the second control board 151. Then, as described above, an ultraviolet curable resin is applied to the inner side surface 131d of the rectangular opening 131b of the holding plate 131, and the second imaging element substrate 142a (second imaging element 142) is connected to the rectangular opening from the back side of the holding plate 131. 131b.

以後の作業は、第１制御基板１２１の位置調整、固定作業と同様である。前記位置調整、固定作業により、第１撮像素子１１２と同一の焦点深度内に第２撮像素子１４２の位置が調整され、更に、第１撮像素子１１２、第２撮像素子１４２の画素配列がＸＹ方向に一致する。   The subsequent work is the same as the position adjustment and fixing work of the first control board 121. By the position adjustment and fixing operation, the position of the second image sensor 142 is adjusted within the same depth of focus as the first image sensor 112, and the pixel arrangement of the first image sensor 112 and the second image sensor 142 is in the XY direction. Matches.

このように複数の開口部を保持板に形成し、前記複数の開口部内にそれぞれ撮像素子を接着固定することで、基線長が必要以上に長くなることがなくなり、基線長を適切な長さに設定することができる。また、保持板が、実施例１で説明した固定部材の固定機能を具備するので、部品点数が減り、製造コスト、製造工程を削減できる。   In this way, by forming a plurality of openings in the holding plate and bonding and fixing the imaging elements in the plurality of openings, the base line length does not become longer than necessary, and the base line length is set to an appropriate length. Can be set. Further, since the holding plate has the fixing member fixing function described in the first embodiment, the number of parts can be reduced, and the manufacturing cost and the manufacturing process can be reduced.

次に、レンズユニットの位置調整、固定工程について、図８を用いて説明する。
図８（Ａ）は、レンズユニット１７３等の位置調整、固定工程を説明する正面図、図８（Ｂ）は、同断面図である。
まず、第１撮像素子１１２の中心にレンズユニット１７３のレンズの中心が略一致するように、即ち、両中心が同一光軸上に位置するように、レンズユニット１７３の位置を概略調整する。なお、レンズユニット１７３には、マニピュレータ３００のアーム３０１が取り付けられているとする。その後、実施例１で説明したように、バックフォーカス調整、あおり調整を行い、レンズユニット１７３の配置位置を調整する。この調整が終了すると、レンズユニット１７３を保持板１３１に接着固定する。 Next, the position adjustment and fixing process of the lens unit will be described with reference to FIG.
FIG. 8A is a front view for explaining the position adjustment and fixing process of the lens unit 173 and the like, and FIG. 8B is a cross-sectional view thereof.
First, the position of the lens unit 173 is roughly adjusted so that the center of the lens of the lens unit 173 substantially coincides with the center of the first image sensor 112, that is, both centers are located on the same optical axis. It is assumed that the arm 301 of the manipulator 300 is attached to the lens unit 173. Thereafter, as described in the first embodiment, back focus adjustment and tilt adjustment are performed, and the arrangement position of the lens unit 173 is adjusted. When this adjustment is completed, the lens unit 173 is bonded and fixed to the holding plate 131.

なお、レンズユニット１７３位置決め用の突起部１３１ｅを保持板１３１に予め設け、突起部１３１ｅに沿うように、レンズユニット１７３を配設すれば、レンズユニット１７３の位置決め作業を簡略化し、かつ、前記位置決めを高精度に行うことができる。   If a projection 131e for positioning the lens unit 173 is provided in advance on the holding plate 131 and the lens unit 173 is arranged along the projection 131e, the positioning operation of the lens unit 173 is simplified and the positioning is performed. Can be performed with high accuracy.

第２撮像素子１４２のレンズユニット１７４についても、第１撮像素子１１２のレンズユニット１７３と同様にして、保持板１３１に取り付ける。   The lens unit 174 of the second image sensor 142 is also attached to the holding plate 131 in the same manner as the lens unit 173 of the first image sensor 112.

なお、保持板１３１の矩形開口部１３１ａ内に、第１制御基板１２１を配設できる場合には、第１制御基板１２１そのものを保持板１３１の矩形開口部１３１ａ内に配設して、固定してもよい。   When the first control board 121 can be disposed in the rectangular opening 131a of the holding plate 131, the first control board 121 itself is disposed in the rectangular opening 131a of the holding plate 131 and fixed. May be.

（実施例２の変形例）
撮像素子をより高精度かつ確実に取り付け固定する実施例を図９、図１０を用いて説明する。
図９（Ａ）は、上記取り付け固定を説明する正面図、図９（Ｂ）は、同断面図である。図１０は、図９（Ｂ）の詳細断面図である。 (Modification of Example 2)
An embodiment in which the image sensor is attached and fixed with higher accuracy and reliability will be described with reference to FIGS.
FIG. 9A is a front view for explaining the mounting and fixing, and FIG. 9B is a sectional view thereof. FIG. 10 is a detailed cross-sectional view of FIG.

保持板１３２は、実施例２で説明した保持板１３１と同様に紫外線透過性部材から構成される平面状の板であり、矩形開口部１３２ａ、１３２ｂを備える。   The holding plate 132 is a flat plate made of an ultraviolet transmissive member, like the holding plate 131 described in the second embodiment, and includes rectangular openings 132a and 132b.

矩形開口部１３２ａの内側面部１３２ｃは、テーパ状に形成されている。
固定部材１６１は、クサビ形状の紫外線透過性部材から構成され、第１撮像素子基板１１２ａ（第１撮像素子１１２）を保持板１３２の矩形開口部１３２ａに固定する。固定部材１６１のくさび部分の角度は、図示のように、矩形開口部１３２ａのテーパ部のテーパ角度と同一である。 The inner side surface part 132c of the rectangular opening part 132a is formed in a taper shape.
The fixing member 161 is composed of a wedge-shaped ultraviolet transmissive member, and fixes the first image sensor substrate 112 a (first image sensor 112) to the rectangular opening 132 a of the holding plate 132. As shown in the figure, the angle of the wedge portion of the fixing member 161 is the same as the taper angle of the taper portion of the rectangular opening 132a.

実施例２で説明したように、矩形開口部１３２ａの内側面部１３２ｃに紫外線硬化樹脂Ｂ（図１０参照）を塗布し、更に、第１撮像素子基板１１２ａの外側面部１１２ｂに紫外線硬化樹脂Ｂを塗布した状態で、第１撮像素子基板１１２ａを矩形開口部１３２ａに配設して位置調整を行う。
そして、矩形開口部１３２ａの内側面部１３２ｃと第１撮像素子基板１１２ａの外側面部１１２ｂの隙間に、固定部材１６１を差し込む。なお、固定部材１６１に紫外線硬化樹脂Ｂを塗布してもよい。 As described in the second embodiment, the ultraviolet curable resin B (see FIG. 10) is applied to the inner side surface 132c of the rectangular opening 132a, and the ultraviolet curable resin B is further applied to the outer side surface 112b of the first imaging element substrate 112a. In this state, the first image sensor substrate 112a is disposed in the rectangular opening 132a to adjust the position.
Then, the fixing member 161 is inserted into the gap between the inner side surface portion 132c of the rectangular opening portion 132a and the outer side surface portion 112b of the first imaging element substrate 112a. Note that the ultraviolet curable resin B may be applied to the fixing member 161.

その後、図示しない紫外線照射装置から紫外線を固定部材１６１に照射して、塗布された紫外線硬化樹脂を硬化する。   Thereafter, the fixing member 161 is irradiated with ultraviolet rays from an ultraviolet irradiation device (not shown) to cure the applied ultraviolet curable resin.

保持板１３２、固定部材１６１は、紫外線透過性部材から構成されているので、紫外線照射装置からの紫外線が前記紫外線硬化樹脂に照射され、紫外線硬化樹脂が確実に硬化する。   Since the holding plate 132 and the fixing member 161 are composed of an ultraviolet transmissive member, the ultraviolet curable resin is irradiated with ultraviolet rays from the ultraviolet irradiation device, and the ultraviolet curable resin is reliably cured.

このようにして固定部材を用いることで、紫外線硬化樹脂の接着層の厚さを薄くすることができるので、撮像素子をより高精度かつ確実に保持板に取り付けることができる。   Since the thickness of the adhesive layer of the ultraviolet curable resin can be reduced by using the fixing member in this manner, the imaging element can be attached to the holding plate with higher accuracy and reliability.

以上の実施例では、２つの撮像素子を備えた撮像装置を例示して説明したが、３つ以上の撮像素子を備えた撮像装置に対しても本発明を同様に適用できる。   In the above embodiment, the image pickup apparatus including two image pickup elements has been described as an example. However, the present invention can be similarly applied to an image pickup apparatus including three or more image pickup elements.

固定部材１６０、１６１、保持板１３１、１３２は、温度上昇による撮像素子の位置ずれを防ぐため、なるべく熱膨張係数が小さい素材を用いることが好ましい。例えば、白板ガラス、石英ガラスのようなガラスや、プラスチックであればポリエーテルスルホンなどを用いて作製することが可能である。また、撮像素子の画素サイズや必要精度に応じて、材料を選定することが可能である。   For the fixing members 160 and 161 and the holding plates 131 and 132, it is preferable to use a material having a thermal expansion coefficient as small as possible in order to prevent the image sensor from being displaced due to a temperature rise. For example, it can be produced using glass such as white plate glass or quartz glass, or polyethersulfone if plastic is used. Further, the material can be selected according to the pixel size of the image sensor and the required accuracy.

１００…撮像装置、１１０，１１１，１１２…第１撮像素子、１１０ａ，１１１ａ，１１２ａ…第１撮像素子基板、１１２ｂ…外側面部、１２０，１２１…第１制御基板、１２０ａ…外側面部、１３０〜１３２…保持板、１３０ａ…第１位置決めピン、１３０ｂ…第２位置決めピン、１３１ａ，１３１ｂ，１３２ａ，１３２ｂ…矩形開口部、１３１ｃ，１３１ｄ，１３２ｃ…内側面部、１３１ｅ…突起部、１４０，１４１，１４２…第２撮像素子、１４０ａ，１４１ａ，１４２ａ…第２撮像素子基板、１５０，１５１…第２制御基板、１６０，１６１…固定部材、１６０ａ…側面部、１６０ｂ…底面部、１７０〜１７４…レンズユニット、１８０，１８１…ＦＰＣ、２００…顕微鏡、２０１…ステージ、３００…マニピュレータ、３０１…アーム、Ａ…光軸、Ｂ…紫外線硬化樹脂、Ｃ…クロスライン、Ｆ…固着部、Ｓ…隙間。 DESCRIPTION OF SYMBOLS 100 ... Imaging device, 110, 111, 112 ... 1st imaging device, 110a, 111a, 112a ... 1st imaging device board | substrate, 112b ... Outer surface part, 120, 121 ... 1st control board, 120a ... Outer surface part, 130-132 ... holding plate, 130a ... first positioning pin, 130b ... second positioning pin, 131a, 131b, 132a, 132b ... rectangular opening, 131c, 131d, 132c ... inner side surface, 131e ... projection, 140, 141, 142 ... Second image pickup device, 140a, 141a, 142a ... second image pickup device substrate, 150, 151 ... second control substrate, 160, 161 ... fixing member, 160a ... side surface portion, 160b ... bottom surface portion, 170-174 ... lens unit, 180,181 ... FPC, 200 ... microscope, 201 ... stage, 300 ... manipulator, 301 ... a Arm, A ... optical axis, B ... UV curable resin, C ... cross line, F ... fixed portion, S ... gap.

Claims (2)

所定距離をおいて配設された複数のレンズユニットに対応し、前記複数のレンズユニットによって形成される像を撮像する複数の撮像素子を備えた撮像装置において、
前記複数の撮像素子はそれぞれの基板に搭載され、前記それぞれの基板に搭載された前記撮像素子は、該撮像素子の画素配列方向が所定の方向と略一致するように配設され、前記それぞれの基板が紫外線透過性部材からなる１つの平板状の保持板に固着されており、
前記保持板は、前記それぞれの基板の外形形状に略一致する複数の矩形開口部を備え、
前記保持板の矩形開口部内に、前記それぞれの基板が配設され、前記保持板の矩形開口部の内側面部と前記それぞれの基板の外側面部とが紫外線硬化樹脂により接着固定されており、
紫外線透過性部材からなる前記１つの平板状の保持板の矩形開口部の内側面部は、テーパ部を備え、
前記保持板の前記テーパ部と前記それぞれの基板の外側面部との隙間に、前記テーパ部に対応する、紫外線透過性部材からなるクサビ形状の固定部材が、前記それぞれの基板の調整された配設位置を変えることなく差し込まれ、
前記くさび形状の固定部材と前記保持板のテーパ部、及び、前記固定部材と前記それぞれの基板の外側面部とが紫外線硬化樹脂により接着固定されていることを特徴とする撮像装置。 In an imaging apparatus that includes a plurality of imaging elements that correspond to a plurality of lens units disposed at a predetermined distance and that capture images formed by the plurality of lens units.
The plurality of image pickup devices are mounted on respective substrates, and the image pickup devices mounted on the respective substrates are arranged so that a pixel arrangement direction of the image pickup devices substantially coincides with a predetermined direction, The substrate is fixed to one flat holding plate made of an ultraviolet light transmissive member,
The holding plate includes a plurality of rectangular openings that substantially match the outer shape of each of the substrates,
Each of the substrates is disposed in the rectangular opening of the holding plate, and the inner side surface of the rectangular opening of the holding plate and the outer surface of the respective substrate are bonded and fixed by an ultraviolet curable resin ,
The inner side surface portion of the rectangular opening portion of the one flat holding plate made of an ultraviolet light transmissive member includes a tapered portion,
In the gap between the tapered portion of the holding plate and the outer surface portion of each substrate, a wedge-shaped fixing member made of an ultraviolet light transmissive member corresponding to the tapered portion is arranged in an adjusted manner on each substrate. Plugged in without changing position,
An imaging apparatus, wherein the wedge-shaped fixing member and the taper portion of the holding plate, and the fixing member and the outer surface portion of each substrate are bonded and fixed with an ultraviolet curable resin . 請求項１に記載の撮像装置において、
前記それぞれの基板を前記１つの平板上の保持板に接着固定した後、前記レンズユニットを前記１つの平板上の保持板に接着固定することを特徴とする撮像装置。 The imaging device according to claim 1 ,
An imaging apparatus comprising: fixing each of the substrates to the holding plate on the one flat plate, and then fixing the lens unit to the holding plate on the one flat plate.
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