JP2011066716A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem wherein an image pickup device unit in an imaging apparatus is thinned, and hence dropping impact, or the like causes deviation in parallelism and position coordinates on a light reception surface of an image pickup device and causes defocusing at the time of photographing. <P>SOLUTION: The imaging apparatus includes: a lens unit; the image pickup device 43 coinciding with the optical axis of the lens unit; and a fixing frame plate 21, namely a support for fixing the image pickup device 43 for connecting to the lens unit. The fixing frame plate 21 includes an opening, the image pickup device 43 is incorporated into the opening, and an adhesive bonds and fixes the periphery of the image pickup device 43 onto an inner wall of the opening of the fixing frame plate 21. In this case, the side of the opening is formed in an undulated shape 54. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an imaging device including an imaging element.

  Today, there is a strong demand for miniaturization and thinning in portable imaging devices such as digital cameras and camera-equipped mobile phones, and highly integrated and high-density parts are incorporated inside. In addition, with an increase in the number of pixels of an image pickup device, the image pickup apparatus is required to have high accuracy for fixing the image pickup device to a lens barrel or the like. Therefore, in a configuration in which the image pickup device is fixed to the lens barrel, etc., and the plate (support) to which the image pickup device is bonded and fixed is screwed to the lens barrel etc., the plate is attached to the lens barrel etc. Adjust the orientation of the image sensor with respect to the plate so that the optical axis of the lens barrel and the center normal of the light receiving surface of the image sensor fixed to the plate are correctly aligned when attached. It was adhered and fixed to the plate.

  In order to prevent foreign matter from adhering to the light receiving surface of the image sensor, a sealed space is formed in front of the image sensor by interposing a frame-like elastic body between the optical low-pass filter and the light receiving surface. In order to prevent foreign matter from adhering to the light receiving surface.

  Further, regarding the downsizing and thinning of the imaging device, Japanese Patent Application Laid-Open Publication No. 2004-228561 discloses an imaging device unit that can realize downsizing and thinning of the imaging device on a plate to which the imaging device is bonded and fixed. A rectangular through hole corresponding to the external shape (rectangular) of the element is provided, the image sensor is fitted into this through hole, and an adhesive is injected into the gap formed between the inner wall of the through hole and the side surface of the image sensor An image sensor unit having a configuration in which the image sensor is bonded and fixed to a plate by being cured is disclosed.

JP 2006-173890 A

  However, in the imaging device shown in Patent Document 1, the imaging element is configured to be fixed only by an adhesive injected into a gap formed between the inner wall of the through hole and the side surface of the imaging element. It is difficult to secure the strength around the element, and there is a concern that the position of the light receiving surface may change due to drop impact, aging, and environmental changes.

  The present invention has been made in view of the problems of the prior art as described above, and by increasing the adhesive strength between the support and the imaging device, the reliability is improved and the quality can be improved. An object of the present invention is to provide an imaging device that can increase the degree of freedom of the image and contribute to downsizing.

  An imaging apparatus of the present invention includes a lens unit, an imaging element that matches the optical axis of the lens unit and the center normal of the light receiving surface, and a support that fixes the imaging element and couples the lens unit. The support has an opening, the image pickup device is incorporated in the opening, and the periphery of the image pickup device is bonded and fixed to the inner wall of the opening of the support by an adhesive. The side surface in the part is formed in a corrugated shape.

  In some imaging apparatuses of the present invention, a V-shaped recess is formed on a side surface of the opening.

  In some imaging apparatuses of the present invention, a semicircular recess is formed on a side surface of the opening.

  Further, in the imaging apparatus of the present invention, there is a case where a rectangular recess is formed on a side surface of the opening.

  The adhesive may be an ultraviolet curable adhesive.

  In the imaging apparatus of the present invention, the adhesive may be applied on both side surfaces of the side surface of the imaging element and the short side of the opening.

  Further, the support is coupled to the lens unit.

  The image sensor is a CCD or a CMOS.

  According to the present invention, by increasing the adhesive strength between the support and the image sensor, it is possible to prevent the positional deviation of the light receiving surface of the image sensor due to a drop impact, a change with time, and an environment change, and the reliability and quality are improved. In addition, it is possible to provide an imaging device that can improve the degree of freedom of the product shape and contribute to downsizing.

1 is an external perspective view of an image pickup apparatus (digital camera) according to an embodiment of the present invention. 1 is a perspective view showing an internal structure of an imaging apparatus (digital camera) according to an embodiment of the present invention. It is a perspective sectional view showing the composition of a lens unit and an image sensor unit according to an embodiment of the present invention. It is sectional drawing of the image pick-up element unit which concerns on the Example of this invention. It is a perspective view of an image sensor unit according to an embodiment of the present invention. It is explanatory drawing of the fixed frame board opening part of the image pick-up element unit which concerns on the Example of this invention. It is a figure which shows an example of the side surface shape of the fixed frame board opening part which concerns on the Example of this invention. It is a figure which shows the other example of the side shape of the fixed frame board opening part which concerns on the Example of this invention. It is a figure which shows the other example of the side surface shape of the fixed frame board opening part which concerns on the Example of this invention.

  An imaging apparatus 10 according to an embodiment for carrying out the present invention includes a lens unit 41, an imaging element 43 that matches the optical axis of the lens unit 41 and the center normal of the light receiving surface, and the lens unit 41 by fixing the imaging element 43. And a fixed frame plate 21 that is a support to be coupled to the rim. The fixed frame plate 21 has an opening, the image pickup device 43 is incorporated in the opening, and the image pickup device 10 is configured to bond and fix the periphery of the image pickup device 43 to the inner wall of the opening of the fixed frame plate 21 with an adhesive. Thus, the side surface of the opening is formed in the corrugated shape 54.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a digital camera 10 as an embodiment of an imaging apparatus according to the present invention, and FIG. 2 is a perspective view showing the internal structure of the digital camera 10.

  The digital camera 10 shown in FIG. 1 incorporates a lens unit including an inner zoom lens and an inner focus lens, and the first lens of the photographing lens is positioned near the upper corner of the front of the digital camera 10. A lens window 12 is provided as described above. A flash emission window 24 is provided so as to place a flash in the vicinity of the lens window 12, a release button 19 is provided on the upper surface of the digital camera 10, and a monitor screen or A zoom button is provided.

  As shown in FIG. 2, the digital camera 10 has a lens unit 41 that has a first lens 45 that is positioned above the side of the digital camera 10 and has a lens surface facing forward, and an image sensor 43 attached to the lower end. In addition, a circuit board 15 and a battery 31 are built in the side of the lens unit 41.

  The lens unit 41 has an optical axis conversion element that changes the optical axis direction such as a prism by 90 degrees behind the first lens 45, and the center normal line of the light receiving surface of the image sensor 43 in the immediate vicinity of the image sensor 43. And a fixed lens or a fixed lens group, and an inner zoom lens and an inner focus lens, which are a plurality of movable lens groups, are provided between the fixed lens or the fixed lens group and the optical axis conversion element. That is, when the optical axis of the first lens 45 is the first optical axis, the inner zoom lens, the inner focus lens, and the image sensor 43 are located on the second optical axis that is orthogonal to the first optical axis.

  The lens unit 41 moves the zoom drive motor for driving the inner zoom lens, the zoom lead screw for moving the zoom lens in the second optical axis direction by the rotation of the motor, and the zoom lens only in parallel. And a focus drive motor and a focus lens drive mechanism for moving the focus lens.

  The circuit board 15 has a memory card connector, a CPU for controlling the drive of the digital camera 10, and other electronic components such as a plurality of LSIs, ICs, and memories. The display unit is a liquid crystal display element. The backlight panel is integrated with the backlight panel, and an IC and a driver for driving the display element are incorporated.

  In this way, various parts are unitized, and the battery 31 and the flash light emission window 24 are arranged beside the lens unit 41 and the lens unit 41 is arranged vertically, so that assembly is easy and the optical path length in the lens unit 41 is Thus, the digital camera 10 having an optical zoom function in which the zoom magnification and the zoom ratio can be easily increased, the optical path length is long, and the change range of the zoom magnification and the zoom rate is increased.

  Here, the lens unit 41 and the imaging element unit 50 below the lens unit 41 will be described. FIG. 3 is a perspective sectional view of the lens unit 41 and the image sensor unit 50 coupled to the lens unit 41. As shown in FIG. 3, the image sensor unit 50 below the lens unit 41 includes a fixed frame plate 21 that is a support that supports the image sensor 43, and a light receiving surface that extends upward from the central opening of the fixed frame plate 21. The image sensor 43 is arranged so as to face and a printed circuit board 51 on which the image sensor 43 is mounted. Between the lens unit 41 and the image sensor unit 50, a low-pass filter 23 that reduces false colors that are not in the captured image and fine patterns that cause moire, and light reception by the low-pass filter 23 and the image sensor 43. An elastic body 30 is provided for preventing foreign matter from entering between the surfaces. In FIG. 3, the lens built in the lens unit 41 is not shown.

  FIG. 4 is a cross-sectional view in a state where the image sensor unit 50 according to the embodiment of the present invention is attached to the lens unit 41. A low-pass filter 23 is disposed below the lens unit 41. The lower part of the low-pass filter 23 covers the periphery of the low-pass filter 23 in order to prevent foreign matter from entering the light receiving surface of the image sensor 43 and the lower surface of the low-pass filter 23. Thus, the center is opened, and the elastic body 30 in the shape of a frame is arranged.

  Under the elastic body 30, an image pickup device 43 is mounted which is positioned with respect to the fixed frame plate 21 and coupled to the left and right side surfaces on the short side of the opening of the fixed frame plate 21 by an ultraviolet curing adhesive 52. A substrate 51 is disposed.

  Here, the positioning of the fixed frame plate 21 and the printed circuit board 51 on which the image sensor 43 is mounted will be described. Since the degree of perpendicularity of the light receiving surface of the image sensor 43 with respect to the optical axis of the lens unit 41 greatly affects the imaging performance, the image sensor 43 needs to be mounted in a range of an inclination error of about several tens of μm. The lens barrel 41 and the fixed frame plate 21 of the lens unit 41 can be made of metal or hard resin. As a result, the fixed frame plate 21 can be coupled to the lens unit 41 with high accuracy. The fixed frame plate 21 and the image sensor 43 need to be coupled with high accuracy. Therefore, when the image sensor 43 mounted on the printed circuit board 51 is bonded to the fixed frame plate 21, the light receiving surface of the image sensor 43 is placed on the optical axis adjuster using an optical axis adjuster including a bonding jig (not shown). Adjust the pitch angle, roll angle, and yaw angle so that they are perpendicular to the optical axis, and then adjust the center of the light receiving surface of the image sensor 43 so that the optical axis on the optical axis adjuster matches. The side surface of the element 43 and the side surface (inner wall surface) of the opening of the fixed frame plate 21 are bonded by an ultraviolet curable adhesive 52.

  The image sensor unit 50 in which the side surface of the image sensor 43 and the side surface of the opening of the fixed frame plate 21 are fixed by the ultraviolet curable adhesive 52 is set at a predetermined position of the lens unit 41 and is in a direction perpendicular to the optical axis. The lens unit 41 is coupled by fastening screws 57 to the screw holes 53 on the left and right sides of the fixed frame plate 21 while finely adjusting the position of. Thus, in the digital camera 10, the perpendicularity between the optical axis of the lens unit 41 and the light receiving surface of the image sensor 43 is ensured, and the center of the light receiving surface of the image sensor 43 and the optical axis of the lens unit 41 are aligned.

  Next, each part of the image sensor unit 50 will be described in detail. FIG. 5 is a perspective view of the image sensor unit 50 according to the present invention. The image sensor unit 50 includes an image sensor 43, a printed circuit board 51, and a fixed frame plate 21.

  The image sensor 43 is a CCD (Charge Coupled Device) that can capture a high-speed subject image with high pixels without distortion, and is small in size and low in manufacturing cost, or can perform parallel processing when outputting a video signal. In addition, it is a complementary metal oxide semiconductor (CMOS) that can read signals at high speed and consumes little power.

  The fixed frame plate 21 is a metal plate having an opening at the center. The fixed frame plate 21 is fitted in the central portion below the lens unit 41 described above, and also fulfills the function of ensuring the rigidity of the lens unit 41.

  The fixed frame plate 21 is provided with a rectangular opening for fitting the image sensor 43. The opening is opened slightly larger than the image sensor 43, and when the image sensor 43 is fitted into the opening of the fixed frame plate 21, the inner wall of the opening and the side surface of the image sensor 43 are arranged on the short side. A gap is formed between them. The imaging element 43 can be bonded and fixed to the fixed frame plate 21 by injecting the ultraviolet curing adhesive 52 into the gap and curing it.

  In adhering the image sensor 43 to the fixed frame plate 21, first, the printed circuit board 51 on which the image sensor 43 is mounted and the fixed frame plate 21 are set in an optical axis adjusting machine including an unillustrated bonding jig. The pitch angle, roll angle, and yaw angle are adjusted by the optical axis adjuster so that the light receiving surface of the image sensor 43 is perpendicular to the optical axis of the optical axis adjuster, and the center of the light receiving surface of the image sensor 43 is further adjusted. And the optical axis of the optical axis adjuster are adjusted so that the optical axis is aligned, and then the image sensor 43 is bonded and fixed to the fixed frame plate 21.

  Further, the fixed frame plate 21 is provided with screw holes 53 for coupling with the lens unit 41 described above at three locations, two on the right side and one on the left side, and the screws 57 described above are provided in the three screw holes 53. By attaching, the fixed frame plate 21 can be coupled to the lens unit 41 without rotating.

  And as shown in FIG. 6, the opening part in the fixed frame board 21 makes the shape of the side surface of the both right-and-left both ends the corrugated shape 54. As shown in FIG. Thus, by making the shape of both side surfaces into the corrugated shape 54, the adhesion area between the opening side surface of the fixed frame plate 21 and the ultraviolet curable adhesive 52 is increased, and the adhesive strength can be increased. For example, when the side surface shape of the opening is a straight line and when the side surface shape of the opening in the fixed frame plate 21 is a corrugated shape 54 with an opening angle of 90 degrees as shown in FIG. And the case where the concave portion is formed on one surface), the adhesion area can be increased by about 1.3 times.

  As described above, by increasing the bonding area, the bonding strength can be increased, and it is possible to prevent the image sensor 43 from being displaced due to a drop impact, the repulsive force of the elastic body 30, a change with time, and an environmental change. In addition, increasing the adhesive strength can increase the degree of freedom of the product shape and contribute to downsizing.

  Further, the shape of the side surfaces on both the left and right sides of the opening in the fixed frame plate 21 is not limited to the corrugated shape 54 shown in FIG. 7, but, for example, a semicircular 55 recess is formed on one side as shown in FIG. 9 or a shape in which a concave portion of a rectangular shape 56 is formed on one surface as shown in FIG. In short, any shape that can increase the bonding area is acceptable.

  And the application | coating location of the adhesive agent in the fixed frame board 21 is not restricted to the right and left both ends of an opening part, The three-sided or four-way side surface of an opening part is made into a corrugated shape, respectively, and the image pick-up element 43 and a fixed frame are in each part. The opening in the plate 21 can be bonded.

  As described above, according to the present embodiment, V-shaped concave portions are formed on the side surfaces at both ends of the opening portion of the fixed frame plate 21 so that the shape of the side surface of the opening portion is the corrugated shape 54. By increasing the adhesive strength with the image sensor 43, it is possible to prevent the displacement of the light receiving surface of the image sensor 43 due to a drop impact or the repulsive force of the elastic body 30, and the reliability is improved and the quality is improved. It is possible to provide a digital camera 10 (imaging device) that can increase the degree of freedom of product shape and contribute to downsizing.

  In addition, even if the concave portions of the semicircular shape 55 are formed on both side surfaces of the opening of the fixed frame plate 21, the adhesive strength between the fixed frame plate 21 and the image sensor 43 can be increased. The digital camera 10 (imaging device) that can prevent the displacement of the light-receiving surface of the element 43, increases reliability, improves quality, increases the degree of freedom of product shape, and contributes to miniaturization. Can be provided.

  Furthermore, even if the rectangular 56 concave portions are formed on both side surfaces of the opening of the fixed frame plate 21, the adhesive strength between the fixed frame plate 21 and the image pickup device 43 can be increased. Providing digital camera 10 (imaging device) that can prevent displacement of the light receiving surface of 43, improve reliability and improve quality, increase the degree of freedom of product shape, and contribute to downsizing can do.

  Then, by bonding the fixed frame plate 21 and the image sensor 43 with the ultraviolet curable adhesive 52, it is possible to shorten the adhesion time and to prevent the adhesive from contracting during curing.

  In addition, since the image sensor 43 can be firmly adhered to only the two sides of the side surfaces of the fixed frame plate 21 and the short side of the opening of the fixed frame plate 21, the size of the digital camera 10 (imaging device) can be reduced and the degree of freedom in design can be increased. Can also contribute.

  Further, by adjusting the position of the image pickup device 43 and the fixed frame plate 21 and bonding and fixing to form a unit, and then coupling the lens unit 41 with the lens unit 41, it is possible to contribute to shortening the manufacturing time and improving the yield.

  The image pickup element 43 is not limited to the CCD, and the same effect can be obtained with a CMOS.

  In addition, this invention is not limited to the above Example, A change and improvement are freely possible in the range which does not deviate from the summary of invention.

10 Digital camera (imaging device) 12 Lens window
15 Circuit board 19 Release button
21 Fixed frame plate
23 Low-pass filter 24 Flash emission window
30 Elastic body 31 Battery
41 Lens unit 43 Image sensor
45 1st lens 50 Image sensor unit
51 Printed circuit board 52 UV curable adhesive
53 Screw hole 54 Corrugated shape
55 Semicircular shape 56 Rectangular shape
57 screw

Claims (8)

A lens unit;
An image sensor that matches the optical axis of the lens unit and the center normal of the light receiving surface;
A support that fixes the imaging device and is coupled to the lens unit;
An imaging device in which the support has an opening, the imaging element is incorporated in the opening, and the periphery of the imaging element is bonded and fixed to the inner wall of the opening of the support by an adhesive. ,
An image pickup apparatus, wherein a side surface of the opening is formed in a corrugated shape.   The imaging apparatus according to claim 1, wherein a V-shaped recess is formed on a side surface of the opening.   The imaging apparatus according to claim 1, wherein a semicircular recess is formed on a side surface of the opening.   The imaging apparatus according to claim 1, wherein a rectangular recess is formed on a side surface of the opening.   The imaging apparatus according to claim 1, wherein the adhesive is an ultraviolet curable adhesive.   The imaging apparatus according to claim 1, wherein the adhesive is applied on both side surfaces of a side surface of the imaging element and a short side of the opening.   The imaging apparatus according to claim 1, wherein the support is coupled to the lens unit. The imaging apparatus according to claim 1, wherein the imaging element is a CCD or a CMOS.

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