CN109491181A - Camera mould group and its manufacturing method - Google Patents
Camera mould group and its manufacturing method Download PDFInfo
- Publication number
- CN109491181A CN109491181A CN201910002613.1A CN201910002613A CN109491181A CN 109491181 A CN109491181 A CN 109491181A CN 201910002613 A CN201910002613 A CN 201910002613A CN 109491181 A CN109491181 A CN 109491181A
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- CN
- China
- Prior art keywords
- wiring board
- imager chip
- holding tank
- fixed
- mould group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 50
- 230000003287 optical effect Effects 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 25
- 238000003384 imaging method Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 241000218202 Coptis Species 0.000 description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention discloses a kind of camera mould group and its manufacturing method, the camera mould group includes wiring board, support base, lens assembly and imager chip, holding tank is offered on the top surface of the wiring board, the support base is fixed on the top of the wiring board, the top surface of the wiring board is towards the support base, the lens assembly is set to the support base backwards to the side of the wiring board, the imager chip is at least partly accommodated and is fixed in the holding tank of the wiring board, and the imager chip is fixed in the holding tank by fixed glue, the imager chip is located on the optical axis of the lens assembly, the imager chip and the wiring board are electrically connected.Imager chip is embedded in wiring board under the premise of guaranteeing camera mould group optics overall length, can reduce the height of camera mould group, keep the size of camera mould group smaller by camera mould group and its manufacturing method provided by the invention.
Description
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of camera mould group and its manufacturing method.
Background technique
Currently, the portable electronic products such as each electronic product, such as mobile phone, camera, tablet computer, thickness is increasingly
Thin, screen accounting is also higher and higher, and pixel is higher and higher, therefore also proposes smaller, thinner requirement to its camera mould group.Mesh
Preceding camera mould group, due to its optics, the limitation of architectural characteristic, thickness is larger, and the thickness of electronic product is increasingly
It is thin, therefore cause camera mould group protrusion on the surface of electronic product, seriously affect the appearance of electronic product.
The narration of front is to provide general background information, might not constitute the prior art.
Summary of the invention
The purpose of the present invention is to provide a kind of lesser camera mould group of size and its manufacturing methods.
The present invention provides a kind of camera mould group, including wiring board, support base, lens assembly and imager chip, the route
Holding tank is offered on the top surface of plate, the support base is fixed on the top of the wiring board, the top surface direction of the wiring board
The support base, the lens assembly are set to the support base backwards to the side of the wiring board, the imager chip at least portion
Partial volume is received and is fixed in the holding tank of the wiring board, and the imager chip is fixed on the receiving by fixed glue
In slot, the imager chip is located on the optical axis of the lens assembly, and the imager chip and the wiring board are electrically connected.
Further, the holding tank runs through the top and bottom of the wiring board, forms through-hole.
Further, the fixed glue is filled in the surrounding of the imager chip.
Further, the fixed glue is also filled up in the bottom of the imager chip.
Further, the camera mould group further includes optical filter, and the bottom of the support base towards the wiring board opens up
Have the first fluting, the support base is also provided with the second fluting at the top of the wiring board, the imager chip with it is described
Wiring board is electrically connected by conducting wire, and the conducting wire is located in first fluting, and the optical filter is set to the support base
In second fluting, and the optical filter is located on the optical axis of the lens assembly.
Invention additionally discloses a kind of camera module making methods, comprising:
Wiring board is provided, and setting auxiliary support plate on the bottom surface of assist side, offers appearance on the top surface of the wiring board
Receive slot；
Imager chip is set in the holding tank, and the imager chip is fixed on by the receiving by fixed glue
Slot；
Removal auxiliary support plate, the imager chip and the wiring board are electrically connected.
Further, the holding tank is the through-hole for penetrating through the wiring board, described that imager chip is set in holding tank,
And imager chip is fixed on by holding tank by fixed glue and is specifically included:
Fixed glue is set in the holding tank, and the fixed glue is set on the auxiliary support plate；
By the imager chip be set in the holding tank and with it is described it is fixed be glued touch, by the fixed adhesive curing, with
The imager chip is fixed in the holding tank.
Further, the fixed glue is filled in surrounding and the bottom of the imager chip.
Further, the holding tank is the through-hole for penetrating through the wiring board, described that imager chip is set in holding tank,
And imager chip is fixed on by holding tank by fixed glue and is specifically included:
The imager chip is set in the holding tank, the imager chip is set on the auxiliary support plate；
Fixed glue is set in the holding tank, and the fixed glue is filled in the surrounding of the imager chip.
Further, the camera module making method further includes the steps that being electrically connected by imager chip and wiring board
Later:
Support base is set in the top surface side of the wiring board, and optical filter and lens group are set on the support base
Part, the optical filter is between the lens assembly and the imager chip, and the imager chip and the optical filter position
In on the optical axis of the lens assembly.
Camera mould group and its manufacturing method provided by the invention will be under the premise of guaranteeing camera mould group optics overall length
As the height of camera mould group can be reduced in chip buried wiring board, keep the size of camera mould group smaller.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the camera mould group of first embodiment of the invention.
Fig. 2 is the flow chart of the camera module making method of second embodiment of the invention.
Fig. 3 a is the diagrammatic cross-section of the camera mould group in Fig. 2 in the step S11 of camera module making method.
Fig. 3 b is the schematic top plan view of Fig. 3 a.
Fig. 3 c is the diagrammatic cross-section of camera mould group in the step S13 of camera module making method in Fig. 2.
Fig. 3 d is the schematic top plan view of Fig. 3 c.
Fig. 3 e is the diagrammatic cross-section of camera mould group in the step S15 of camera module making method in Fig. 2.
Fig. 3 f is the schematic top plan view of Fig. 3 e.
Fig. 3 g is the diagrammatic cross-section of camera mould group in the step S17 of camera module making method in Fig. 2.
Fig. 3 h is the schematic top plan view of Fig. 3 g.
Fig. 4 is the structural schematic diagram of the camera mould group of third embodiment of the invention.
Fig. 5 is the flow chart of the camera module making method of fourth embodiment of the invention.
Fig. 6 a is the diagrammatic cross-section of the camera mould group in Fig. 5 in the step S31 of camera module making method.
Fig. 6 b is the schematic top plan view of Fig. 6 a.
Fig. 6 c is the diagrammatic cross-section of camera mould group in the step S33 of camera module making method in Fig. 5.
Fig. 6 d is the schematic top plan view of Fig. 6 c.
Fig. 6 e is the diagrammatic cross-section of camera mould group in the step S35 of camera module making method in Fig. 5.
Fig. 6 f is the schematic top plan view of Fig. 6 e.
Fig. 6 g is the diagrammatic cross-section of camera mould group in the step S37 of camera module making method in Fig. 5.
Fig. 6 h is the schematic top plan view of Fig. 6 g.
Fig. 7 is the structural schematic diagram of the camera mould group of fifth embodiment of the invention.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
First embodiment
It please join Fig. 1, the camera mould group provided in first embodiment of the invention, including wiring board 11, support base 13, lens group
Part 15, imager chip 17 and optical filter 19.
Holding tank 112 is offered on the top surface of wiring board 11.Specifically in the present embodiment, holding tank 112 runs through wiring board
11 top and bottom form through-hole.It is appreciated that holding tank 112 can not also penetrate through wiring board 11, it is opened in be formed
The blind hole of 11 top surface of wiring board.Also settable connector on wiring board 11, to realize the biography of external circuit Yu 11 signal of wiring board
It is defeated.
Support base 13 is fixed on the top of wiring board 11, and the top surface of wiring board 11 is towards support base 13.13 direction of support base
The bottom of wiring board 11 offers the first fluting 132, and support base 13 is also provided with the second fluting backwards to the top of wiring board 11
134。
Lens assembly 15 is set to support base 13 backwards to the side of wiring board 11.Lens assembly 15 includes lens barrel and eyeglass, mirror
Piece is set in lens barrel.
Imager chip 17 is at least partly accommodated and is fixed in the holding tank 112 of wiring board 11, and imager chip 17 is located at
On the optical axis of eyeglass, imager chip 17 is electrically connected by conducting wire 21 and wiring board 11, and conducting wire 21 is located in the first fluting 132.
In the present embodiment, imager chip 17 is all contained in holding tank 112, makes the upper of the upper surface of imager chip 17 and wiring board 11
The upper surface of flush or imager chip 17 is lower than the upper surface of wiring board 11.Specifically, conducting wire 21 can be gold thread.It can
To understand, conducting wire 21 can be bonded with the upper surface of wiring board 11 and imager chip 17, and at this moment the first fluting 132 can not need pre-
It stays to accommodate conducting wire 21.
In the present embodiment, imager chip 17 passes through fixed glue 22 and is fixed in holding tank 112.Specifically, fixed glue 22 is filled out
Fill the bottom in imager chip 17 and surrounding.Fixed glue 22 is resin glue, can provide carrying to imager chip 17 after solidification and make
With, and can fixed imaging chip 17.
Optical filter 19 is set in the second fluting 134 of support base 13, and optical filter 19 is located on the optical axis of eyeglass.It can manage
Solution, optical filter 19 can also be set in the first fluting 132 of support base 13, and at this moment the second fluting 134 can omit.Specifically, it filters
Mating plate 19 is fixed in the second fluting 134 by glue.
In this camera mould group, under the premise of guaranteeing camera mould group optics overall length, imager chip 17 is embedded to wiring board 11
It is interior, the height of camera mould group can be reduced, keeps the size of camera mould group smaller.
Second embodiment
The present invention also provides a kind of camera module making methods, as shown in Fig. 2, the camera mould group manufacturer of second embodiment
Method the following steps are included:
S11 provides wiring board 11, setting auxiliary support plate 23 on the bottom surface of assist side 11.
Specifically, as shown in Figure 3a and Figure 3b shows, holding tank 112 is offered on the top surface of wiring board 11.Assist support plate 23 can
On the bottom surface for attaching assist side 11 by glue, and support plate 23 is assisted at least to cover holding tank 112.In the present embodiment, hold
Slot 112 of receiving runs through the top and bottom of wiring board 11, forms through-hole.It is appreciated that holding tank 112 can not also penetrate through wiring board
11, to form the blind hole for being opened in 11 top surface of wiring board, accordingly, when holding tank 112 is blind hole, auxiliary can be not provided with and carried
Plate 23.Also settable connector on wiring board 11, to realize the transmission of external circuit Yu 11 signal of wiring board.
Fixed glue 22 is arranged in S13 in holding tank 112.
Specifically, as shown in Fig. 3 c and Fig. 3 d, glue is injected in holding tank 112, to form fixed glue 22 after hardening.
Specifically, glue can be resin glue.In the present embodiment, fixed glue 22 is set on auxiliary support plate 23.
Imager chip 17 is set in holding tank 112 and contacts with fixed glue 22, fixed glue 22 is solidified by S15, will be at
As chip 17 is fixed in holding tank 112.
As shown in Fig. 3 e and Fig. 3 f, imager chip 17 can be slightly less than holding tank 112, in imager chip 17 and wiring board 11
Holding tank 112 side wall between there are the gaps for accommodating fixed glue 22.Fixed glue 22 is such as by cured heating, illumination
Mode is solidified, and the fixation glue 22 after solidification is filled in bottom and the surrounding of imager chip 17, can be to imaging core after solidification
Piece 17 provides carrying effect, and can fixed imaging chip 17.It is appreciated that imager chip 17 at least partly accommodates and is fixed on line
In the holding tank 112 of road plate 11, specifically in the present embodiment, imager chip 17 is all contained in holding tank 112, makes that core is imaged
The upper surface of piece 17 is concordant with the upper surface of wiring board 11 or the upper surface of imager chip 17 is lower than the upper table of wiring board 11
Face.
S17, removal auxiliary support plate 23, and imager chip 17 is electrically connected with wiring board 11 by conducting wire 21.
In the present embodiment, first removal auxiliary support plate 23, then electrical by conducting wire 21 by imager chip 17 and wiring board 11
Connection.It is appreciated that can also first be electrically connected imager chip 17 by conducting wire 21 with wiring board 11, then remove auxiliary support plate
23.Specifically, as shown in Fig. 3 g and Fig. 3 h, wiring board 11 is equipped with circuit 114, and imager chip 17 is equipped with pad 172, passes through
Pad 172 and circuit 114 are electrically connected by conducting wire 21.More specifically, conducting wire 21 can be gold thread, what gold thread can be bonded by gold thread
Mode is formed.
Support base 13 is arranged in the top surface side of S19, assist side 11, and optical filter 19 and camera lens are arranged on support base 13
Component 15, optical filter 19 is between lens assembly 15 and imager chip 17.
Specifically, referring once again to Fig. 1, the bottom of support base 13 towards wiring board 11 offers the first fluting 132, support
Seat 13 is also provided with the second fluting 134 backwards to the top of wiring board 11.Lens assembly 15 includes lens barrel and eyeglass, and eyeglass is set to mirror
In cylinder.Conducting wire 21 is located in the first fluting 132.Imager chip 17 and optical filter 19 are located on the optical axis of eyeglass, and optical filter 19
In the second fluting 134 of support base 13.
In this camera module making method, under the premise of guaranteeing camera mould group optics overall length, imager chip 17 is embedded to
In wiring board 11, the height of camera mould group can be reduced, keeps the size of camera mould group smaller.
3rd embodiment
As shown in figure 4, being the camera mould group of third embodiment of the invention, including wiring board 31, support base 33, lens assembly
35, imager chip 37 and optical filter 39.
The structure of the camera mould group of the camera mould group and first embodiment of the present embodiment is essentially identical, and difference is, this reality
It applies in example, fixed glue 42 is only filled in the surrounding of imager chip 37, the bottom without being filled in imager chip 37.
In this camera mould group, under the premise of guaranteeing camera mould group optics overall length, imager chip 37 is embedded to wiring board 31
It is interior, the height of camera mould group can be reduced, keeps the size of camera mould group smaller.Also, in the present embodiment, due to imager chip 37
Fixed glue 42 is not filled in bottom, therefore, can further decrease the height of camera mould group.
Fourth embodiment
The present invention also provides a kind of camera module making methods, as shown in figure 5, the camera mould group manufacturer of fourth embodiment
Method the following steps are included:
S31 provides wiring board 31, setting auxiliary support plate 43 on the bottom surface of assist side 31.
Specifically, as shown in figures 6 a and 6b, holding tank 312 is offered on the top surface of wiring board 31.Assist support plate 43 can
On the bottom surface for attaching assist side 31 by glue, and support plate 43 is assisted at least to cover holding tank 312.In the present embodiment, hold
Slot 312 of receiving runs through the top and bottom of wiring board 31, forms through-hole.It is appreciated that holding tank 312 can not also penetrate through wiring board
31, to form the blind hole for being opened in 31 top surface of wiring board, accordingly, when holding tank 312 is blind hole, auxiliary can be not provided with and carried
Plate 43.Also settable connector on wiring board 31, to realize the transmission of external circuit Yu 31 signal of wiring board.
Imager chip 37 is set in holding tank 312 by S33.
Specifically, as described relative to figs. 6c and 6d, imager chip 37 is set on auxiliary support plate 43, imager chip 37 and is slightly less than appearance
Slot 312 is received, with there are gaps between imager chip 37 and the side wall of the holding tank 312 of wiring board 31.
Fixed glue 42 is arranged in S35 in holding tank 312.
Specifically, as shown in Fig. 6 e and Fig. 6 f, glue is injected in holding tank 312, to form fixed glue 42 after hardening,
Fixed glue 42 is filled in the surrounding of imager chip 37, and between imager chip 37 and wiring board 31.Specifically, glue can be
Resin glue.
S37, removal auxiliary support plate 23, and imager chip 37 is electrically connected with wiring board 31 by conducting wire 41.
In the present embodiment, first imager chip 37 is electrically connected with wiring board 31 by conducting wire 41, then remove auxiliary support plate
43.It is appreciated that auxiliary support plate 43 can also be removed first, then imager chip 37 is electrically connected with wiring board 31 by conducting wire 41
It connects.Specifically, as shown in Fig. 6 g and Fig. 6 h, wiring board 31 is equipped with circuit 314, and imager chip 37 is equipped with pad 372, passes through
Pad 372 and circuit 314 are electrically connected by conducting wire 41.More specifically, conducting wire 41 can be gold thread, what gold thread can be bonded by gold thread
Mode is formed.
Support base 33 is arranged in the top surface side of S39, assist side 31, and optical filter 39 and camera lens are arranged on support base 33
Component 35, optical filter 39 is between lens assembly 35 and imager chip 37.
Specifically, referring once again to Fig. 4, the bottom of support base 33 towards wiring board 31 offers the first fluting 332, support
Seat 33 is also provided with the second fluting 334 backwards to the top of wiring board 31.Lens assembly 35 includes lens barrel and eyeglass, and eyeglass is set to mirror
In cylinder.Conducting wire 41 is located in the first fluting 332.Imager chip 37 and optical filter 39 are located on the optical axis of eyeglass, and optical filter 39
In the second fluting 334 of support base 33.
In this camera module making method, under the premise of guaranteeing camera mould group optics overall length, imager chip 37 is embedded to
In wiring board 31, the height of camera mould group can be reduced, keeps the size of camera mould group smaller.Also, in the present embodiment, due to imaging
Fixed glue 42 is not filled in the bottom of chip 37, therefore, can further decrease the height of camera mould group.
5th embodiment
As shown in fig. 7, being the camera mould group of fifth embodiment of the invention, including wiring board 51, support base 53, lens assembly
55, imager chip 57 and optical filter 59.
The structure of the camera mould group of the camera mould group and first embodiment of the present embodiment is essentially identical, and difference is, this reality
It applies in example, the quantity of imager chip 57 is two, and two imager chips 57 are stacked in the holding tank 512 of wiring board 51.Wherein,
It include light-sensitive element with photosensitive positioned at the imager chip 57 close to 55 side of lens assembly, the imaging far from 55 side of lens assembly
Chip 57 includes processing circuit.
It is appreciated that the camera mould group of the 5th embodiment can also be essentially identical with the camera modular structure of 3rd embodiment,
Difference is equally that two imager chips 57 are arranged.
In this camera mould group, under the premise of guaranteeing camera mould group optics overall length, imager chip 57 is embedded to wiring board 51
It is interior, the height of camera mould group can be reduced, keeps the size of camera mould group smaller.
Above-mentioned first to the 5th embodiment camera mould group and camera module making method manufacture camera mould group be
Fixed-focus camera mould group, it will be understood that camera mould group of the invention equally can be zoom camera mould group, corresponding to increase driving camera lens
Component mobile voice coil motor or other drivers.
Herein unless specifically defined or limited otherwise, term " installation ", " connected ", " connection " should do broad sense reason
Solution, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection, it can also be with
It is electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.
For the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood with concrete condition.
Herein, term " on ", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outside", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal" is to be based on the orientation or positional relationship shown in the drawings, merely to expression skill
The clear and description of art scheme is convenient, therefore is not considered as limiting the invention.
Herein, sequence adjective " first ", " second " for describing element etc. is used for the purpose of discriminative attributes class
As element, be not meant to that the element described in this way must be according to given sequence or time, space, grade or other
Limitation.
Herein, unless otherwise indicated, " multiple ", " several " are meant that two or more.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Herein, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, are removed
It comprising those of listed element, but also may include other elements that are not explicitly listed.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of camera mould group, including wiring board, support base, lens assembly and imager chip, which is characterized in that the wiring board
Top surface on offer holding tank, the support base is fixed on the top of the wiring board, and the top surface of the wiring board is towards institute
Support base is stated, the lens assembly is set to the support base backwards to the side of the wiring board, and the imager chip is at least partly
It accommodates and is fixed in the holding tank of the wiring board, and the imager chip is fixed on the holding tank by fixed glue
Interior, the imager chip is located on the optical axis of the lens assembly, and the imager chip and the wiring board are electrically connected.
2. camera mould group as described in claim 1, which is characterized in that the holding tank runs through the top surface and bottom of the wiring board
Face forms through-hole.
3. camera mould group as claimed in claim 1 or 2, which is characterized in that the fixed glue is filled in the imager chip
Surrounding.
4. camera mould group as claimed in claim 3, which is characterized in that the fixed glue is also filled up in the bottom of the imager chip
Portion.
5. camera mould group as described in claim 1, which is characterized in that the camera mould group further includes optical filter, the support
Seat offers the first fluting towards the bottom of the wiring board, and the support base is also provided with the at the top of the wiring board
Two flutings, the imager chip and the wiring board are electrically connected by conducting wire, and the conducting wire is located in first fluting, institute
Optical filter is stated in second fluting of the support base, and the optical filter is located on the optical axis of the lens assembly.
6. a kind of camera module making method characterized by comprising
Wiring board is provided, and setting auxiliary support plate on the bottom surface of assist side, offers holding tank on the top surface of the wiring board；
Imager chip is set in the holding tank, and the imager chip is fixed on by the holding tank by fixed glue；
Removal auxiliary support plate, the imager chip and the wiring board are electrically connected.
7. camera module making method as claimed in claim 6, which is characterized in that the holding tank is to penetrate through the wiring board
Through-hole, it is described that imager chip is set in holding tank, and imager chip is fixed on holding tank specifically includes by fixation glue:
Fixed glue is set in the holding tank, and the fixed glue is set on the auxiliary support plate；
The imager chip is set in the holding tank and is touched with the fixed splicing, by the fixed adhesive curing, by institute
Imager chip is stated to be fixed in the holding tank.
8. camera module making method as claimed in claim 7, which is characterized in that the fixed glue is filled in the imaging core
The surrounding of piece and bottom.
9. camera module making method as claimed in claim 6, which is characterized in that the holding tank is to penetrate through the wiring board
Through-hole, it is described that imager chip is set in holding tank, and imager chip is fixed on holding tank specifically includes by fixation glue:
The imager chip is set in the holding tank, the imager chip is set on the auxiliary support plate；
Fixed glue is set in the holding tank, and the fixed glue is filled in the surrounding of the imager chip.
10. camera module making method as claimed in claim 6, which is characterized in that it further include assisting support plate in removal, it will be at
After the step of being electrically connected as chip and wiring board:
Support base is set in the top surface side of the wiring board, and optical filter and lens assembly, institute are set on the support base
Optical filter is stated between the lens assembly and the imager chip, and the imager chip and the optical filter are positioned at described
On the optical axis of lens assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002613.1A CN109491181B (en) | 2019-01-02 | 2019-01-02 | Camera module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002613.1A CN109491181B (en) | 2019-01-02 | 2019-01-02 | Camera module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109491181A true CN109491181A (en) | 2019-03-19 |
| CN109491181B CN109491181B (en) | 2024-03-19 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910002613.1A Active CN109491181B (en) | 2019-01-02 | 2019-01-02 | Camera module and manufacturing method thereof |
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| CN (1) | CN109491181B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098213A (en) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | A kind of chip module method for packing and positioning |
| CN110198402A (en) * | 2019-06-17 | 2019-09-03 | 湖北三赢兴电子科技有限公司 | A kind of chip sides dispensing consolidated structures and camera module and method |
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| US20040085654A1 (en) * | 2002-10-31 | 2004-05-06 | Dainippon Screen Mfg. Co., Ltd. | Optical element module, and apparatus and method for fixing optical element |
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