CN101326811A - Wafer based camera module and method of manufacture - Google Patents
Wafer based camera module and method of manufacture Download PDFInfo
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- CN101326811A CN101326811A CNA2006800465252A CN200680046525A CN101326811A CN 101326811 A CN101326811 A CN 101326811A CN A2006800465252 A CNA2006800465252 A CN A2006800465252A CN 200680046525 A CN200680046525 A CN 200680046525A CN 101326811 A CN101326811 A CN 101326811A
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- lens
- picture pick
- keeper
- photographing module
- chip
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Abstract
An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.
Description
Technical field
The present invention is broadly directed to field of digital camera devices, particularly, relates to a kind of combination array chip and lens devices of novelty.It is to produce low-cost shooting that the current main-stream of integral lens of the present invention and chip assembly is used, and the ability that wherein generates high quality graphic under the situation of camera assembly that need not be expensive or complicated is an important factor.
The application is the continuity of same inventor at the Application No. No.10/784102 of application on February 20th, 2004, and its content is all quoted as a reference at this.
Background technology
The very little digital camera module that is applicable to shooting, cell phone and the handheld device etc. of small inexpensive has demand widely.In the prior art, this module generally includes integrated chip and/or the chip on board assembly that is encapsulated in the routine in the mechanical cover.Lens module or assembly be connected to chip carrier and with its mechanical registeration.The part that this arrangement requirement is used for connection procedure has very high quality.Keep the jockey of workpiece alignment or the type of anchor clamps that requirement is arranged during usually also to connection.This also makes the amount of labour also very big.In addition, bindiny mechanism is quite accurate usually, if obtained device falls and so on, this bindiny mechanism can be easy to vibration and unsceptered.
Need a kind of method of making photographing module, this photographing module compact size is made cheapness, and moves durable reliable.But just known to the inventor, before the present invention who is describing, what make that this device adopts is that said elements is arranged.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of manufacturing simple and inexpensive photographing module.
Another object of the present invention provides the photographing module that a kind of size can be very little.
Another object of the present invention provides a kind of reinforcement and operates reliable photographing module.
Another object of the present invention provides a kind of photographing module, and lens position is accurate in the described photographing module, thereby does not need initiatively to adjust and provide best picture quality.
Briefly, an example of the present invention has a kind of lens subassembly, and described lens subassembly is fixing rigidly with respect to camera chip by the moulding part as the lens keeper.Described molded element is formed thereon have been installed on the printed circuit board (PCB) of camera chip.Described then lens subassembly is inserted in the described moulding part and keeps the location by adhesive therein.The method according to this invention and device, lens by minimum parts with minimum operating procedure and the sensor surface of relative described camera chip is accurately fixing.The gained size of component can be very little, and operation is gone up durable reliable.
In another embodiment of the present invention, described lens keeper whole erection is at (around described camera chip in the border) on the described camera chip, rather than on printed circuit board (PCB) and camera chip.In the present embodiment, the combination of described camera chip and lens keeper can be used as an element and is installed on the printed circuit board (PCB) together.In addition, can be before or after being fixed on camera chip on the printed circuit board (PCB), even when camera chip remains the integral part of the silicon wafer that is used to make it, lens subassembly is positioned in the described lens keeper.
Another kind of photographing module comprises: shooting integrated circuit (IC) chip (camera chip); Lens unit; And being installed in lens keeper on the described shooting integrated circuit (IC) chip, described lens are by the described relatively shooting integrated circuit (IC) chip of described lens keeper location.Described lens keeper can be installed to described shooting integrated circuit (IC) chip by any way, include but not limited to directly molded described lens keeper on described camera chip, perhaps be pre-formed described lens keeper and preformed lens keeper is bonded on the described camera chip.
By with lens position in the receiving unit of described lens keeper, with the described relatively shooting integrated circuit (IC) chip of lens location.Lens and the distance of shooting between the integrated circuit (IC) chip by with the datum level setting of lens (or part of the assembly under the lens) adjacency.Alternatively, if in concrete the application, need focusing power, can between lens keeper and lens unit, provide focusing (complementary inclined-plane).As another option, can lens be attached to the lens keeper between the integrated circuit (IC) chip the lens keeper being installed in shooting.
Another photographing module also comprises a plurality of electric contacts that are used for photographing module is connected to host electronic appliance (for example circuit board of mobile phone).According to the relative size of shooting integrated circuit (IC) chip and lens keeper, electric contact can be positioned on the end face of integrated circuit (IC) chip, on the bottom surface of integrated circuit (IC) chip, or its part combination.For example, if the Breadth Maximum of lens keeper is substantially equal to the width of shooting integrated circuit (IC) chip, then may on chip, be not used in enough areas of electric contact.In this case, at least a portion electric contact can be formed on the bottom surface of integrated circuit (IC) chip, and is connected to the circuit that is formed on the integrated circuit (IC) chip end face by the through hole that forms through integrated circuit (IC) chip.But,, then on the expose portion of the end face of integrated circuit (IC) chip, form electric contact if enough areas are arranged.
The method of the novelty that is used to make photographing module is also disclosed.A concrete grammar comprises: the substrate (silicon wafer) that is formed with a plurality of discrete picture pick-up devices on it is provided; Then a plurality of lens keepers are fixed on the described substrate, each in the described lens keeper is fixed on one corresponding in described a plurality of picture pick-up device.In a particularly efficient method, before picture pick-up device is separated from one another or simultaneously, described lens keeper is fixed (for example molded, bonding etc.) to picture pick-up device.Similarly, lens unit (pure lens, lens drum etc.) can be fixed in the lens keeper before the singualtion of wafer.In addition, focusing can be focused before singualtion if desired.So, adopt disclosed method, the photographing module assembly is attached to the processing of wafers stage, can once make the photographing module of a plurality of wafer scales thus.
As described here and as shown in the figure, according to the explanation of implementing mode of the present invention, these and other objects of the present invention and advantage and industrial applicability thereof will be obvious for those skilled in the art.Here listed purpose and/or advantage be not the present invention might purpose and advantage exhaustive.In addition, though lack or use in do not need one or several expectation purpose and/or advantage, also can implement the present invention.
In addition, one skilled in the art will realize that various embodiment of the present invention can realize the one or more of above-mentioned purpose and/or advantage, but need not to be whole.Therefore, listed purpose and advantage are not basic elements of the present invention, should be as restriction.
Description of drawings
Fig. 1 is the cross sectional side view according to the example of integrated shooting of the present invention and lens subassembly;
Fig. 2 is according to the integrated shooting of part assembling of the present invention and the top plan view of lens subassembly;
Fig. 3 is the top plan view according to another example of PCB assembly of the present invention;
Fig. 4 is the plane view of bottom according to flexible connecting member of the present invention;
Fig. 5 is the top plan view of the flexible PCB device of assembling;
Fig. 6 is the top plan view that for example can be used for implementing substrate band of the present invention;
Fig. 7 is the top plan view that for example can be used for implementing die sleeve of the present invention (molding chase);
Fig. 8 is the cross sectional side view of one of mold inserts (mold insert) of Fig. 7;
Fig. 9 is the top plan view that is illustrated in the substrate band of the Fig. 6 that has boundary belt on its position;
Figure 10 is the cross sectional side view of another example of integrated shooting of the present invention and lens subassembly;
Figure 11 is the flow chart that the inventive method that is used to produce integrated shooting and lens subassembly is shown;
Figure 12 is the flow chart of summing up a concrete grammar of the camera chip installation steps of carrying out Figure 11;
Figure 13 is the flow chart of summing up a concrete grammar of superpose-forming (overmolding) the lens installation steps of carrying out Figure 11;
Figure 14 is the flow chart of summing up a concrete grammar of the device isolation step of carrying out Figure 11;
Figure 15 is the flow chart of summing up a concrete grammar of the lens installation steps of carrying out Figure 11;
Figure 16 is the cross sectional side view of photographing module and lens subassembly according to another embodiment of the present invention;
Figure 17 is the top plan view of the photographing module of Figure 16;
Figure 18 A is the perspective view that comprises a part of substrate of a plurality of picture pick-up devices, forms moulded parts on each picture pick-up device;
Figure 18 B is that the substrate of Figure 18 A is at singualtion (singulation) perspective view afterwards;
Figure 19 be according to still another embodiment of the invention photographing module and the cross sectional side view of lens subassembly;
Figure 20 is the top plan view of the photographing module of Figure 19;
Figure 21 A is a flow chart of making the method for photographing module according to summary of the present invention;
Figure 21 B is a flow chart of making the other method of photographing module according to summary of the present invention;
Figure 22 is the flow chart that summary according to the present invention is installed to photographing module the method for telecommunications main frame.
Embodiment
Describe the present invention in the following description with reference to the accompanying drawings, wherein similar Reference numeral refers to same or analogous parts.Although the present invention illustrates according to the pattern that realizes purpose of the present invention, it will be understood by those skilled in the art that and under this demonstration, can carry out various distortion and can not deviate from the spirit or scope of the present invention.Here and/or embodiments of the invention described in the accompanying drawing and distortion just illustrate as an example, and do not limit the scope of the invention.Unless otherwise indicated, otherwise indivedual aspect of the present invention and parts can omit or revise, or are substituted by known equivalents, or by for example following can develop or substitute at the substitute that be found to be acceptable present the unknown future.Because potential range of application is very extensive, and because the present invention is easy to be applicable to many distortion, the present invention also can be various application and revises, and keeps the spirit and scope of the present invention simultaneously.
In following specification, for fear of making the unnecessary loaded down with trivial details of flesh and blood obfuscation of the present invention, known and/or common component no longer at length specifies.Should notice that the diagram in this specification institute accompanying drawing not necessarily draws in proportion, being directly proportional in not necessarily using with the present invention is actual.Accompanying drawing only is a positioned opposite of explaining particular aspects of the present invention, and helps to understand important inventive point.
Realize that known mode of the present invention is integrated photographing module.Integrated photographing module of the present invention is shown in the end view of Fig. 1, and represents with Reference numeral 10 therein.Integrated photographing module 10 has camera chip 12, and camera chip 12 itself does not have different with other camera chip that has for example now adopted or may develop future.One skilled in the art will recognize that and to have sensor array area 14 on the camera chip 12 and also can comprise many other attachment components (timer etc.) that make sensor array area 14 pickup images institute necessity or needs.In the example of Fig. 1, camera chip 12 is attached to (will describe in detail below) printed circuit board (PCB) (" PCB ") 16.Camera chip 12 engages (wire bond) connecting line 17 (only illustrating two among Fig. 1) by a plurality of leads and is electrically connected to PCB 16.
PCB 16 has a plurality of passive components 18 thereon, and the element of described passive component 18 on camera chip 12 formed the internal circuit of photographing module 10.Alternatively, contact pad 20 bottom PCB 16 can have in some applications a plurality of (only illustrating several for simplicity's sake in the view of Fig. 1), be used for integrated photographing module 10 is electrically connected to the outer member (not shown), for example operation keys, optional flasher circuit, external digital memory or external control circuit etc.Above-mentioned parts form PCB assembly 22 together, and described PCB assembly 22 is significantly not different with the PCB assembly that adopts in similar photographing module at present in many aspects.
According to the present invention, lens subassembly 24 remains on this position by moulded parts 26 relative PCB assembly 22 location and by adhesive 28.Moulded parts 26 is formed by the moulding material on PCB assembly 22, will describe in detail below.Moulded parts 26 has enough accurate dimensions tolerances, if make lens subassembly 24 be positioned in the recess 29 (Fig. 2) in the moulded parts 26, shown in the example of Fig. 1, then gap 30 is suitable for the focusing of lens subassembly 24 relative PCB assemblies 22.The optimum distance of lens subassembly 24 and sensor array area 14 is by the shape and the material decision of used concrete lens.The height in gap 30 is functions of the layout of lens subassembly 24 on Z dimension 32, as finding out in the view by Fig. 1 that described layout will describe in detail below.
Notice that lens subassembly 24 does not mean that any concrete lens design of qualification, and just schematically represent for illustration purpose.According to concrete design, lens subassembly 24 can be formed by a material, can comprise the one or more lens that are installed in the carrier (for example Figure 10), maybe can comprise extra optical element.
Over cap 33 is installed in sensor array area 14 tops, and protection sensor array area 14 can be not impaired in manufacturing and assembling process.Preferably, over cap 33 is formed by material firm, optically inactive (opticallyinactive).In a specific embodiment, over cap is a cover glass, can be before forming moulded parts 26 or during be installed in above the sensor array area 14.
Fig. 2 is before lens subassembly 24 is positioned on the integrated photographing module 10 of Fig. 1, the diagrammatic top plan view of the integrated photographing module 10 of Fig. 1.Shown in the view of Fig. 2, the layout of lens subassembly 24 (Fig. 1) on X dimension 34 and Y dimension 36 obtains by the position and the tolerance of moulded parts 26 center dants 29.Hole 38 is set in the moulded parts 26, makes and to see sensor array area 14 by the hole.
Fig. 3 is the top plan view of another example of PCB assembly 22a.In the example of Fig. 3, can find out that camera chip 12 is attached to (passing through adhesive in this example) another PCB 16a.A plurality of connecting lines 17 are connected to a plurality of connection pads 42 on another PCB 16a, to be electrically connected setting up between another PCB 16a and the camera chip 12.Also have a plurality of connections on another PCB assembly 22a and refer to 40 so that PCB assembly 22a is electrically connected to external circuit.The example that is different from Fig. 1, in the example of Fig. 3, all passive components 18 are positioned on the side of camera chip 12.
Fig. 4 is the plane view of bottom of flexible circuit 44.Flexible circuit 44 have thereon a plurality of connections refer to 40 with another PCB assembly on similar a plurality of be connected refer to 40 the coupling.Further, flexible circuit 44 has a plurality of edges connection pads 46, is used to be connected to external circuit.
Fig. 5 is the top plan view of the flexible circuit assembly that has assembled 48 of another PCB assembly 22a with Fig. 3 of the flexible circuit 44 that is attached to Fig. 4.It is first-class to notice that another PCB assembly 22a can be directly connected to rigid circuit board, rather than flexible circuit 44.But in some applications, flexible circuit 44 can allow PCB assembly 22a more freedom degree on arranging.Further, if necessary or need, on flexible circuit 44, can comprise extra circuit.Flexible circuit 44 will be included in to connect and refer to that 40 provide the trace that is electrically connected (not shown) with edge connection pads 46 and when needing as mentioned above between optional other circuit.Can find out that in the view of Fig. 5 in flexible circuit assembly 48, another PCB assembly 22a connects (hot bar attachment) point 50 at hot pin and is connected to flexible circuit 44, make to connect to refer to that 40 (can't see) mate as requested in the view of Fig. 5.Those skilled in the art are very familiar in the hot pin connection method that hot pin tie point 50 engages to element.
Fig. 6 is the top floor map of substrate band 52.Include a plurality of (shown in this example 100) independent PCB 16a in the substrate band 52.Substrate band 52 also has a plurality of mating holes 54 (in this example 18), is used for substrate band 52 is alignd at one or more layout anchor clamps (not shown).
Fig. 7 is the top floor map that for example can be used for implementing die sleeve 56 of the present invention.Die sleeve 56 is made of the such metal of for example stainless steel.Die sleeve is used for a plurality of (this example is 100) mold inserts 58 is remained on the fixed position.Mold inserts 58 is arranged to: when die sleeve 56 aligns above substrate band 52, and mold inserts 58 accurately align up (Fig. 6) among a plurality of PCB 16a on the substrate band 52.
Fig. 8 is the diagrammatic side view of one of locational mold inserts 58 above one of another PCB assembly 22a.As under in detail as described in, before substrate band 52 was separated into independent another PCB assembly 22a, another PCB assembly 22a was configured on the substrate band 52, unless stated otherwise.Shown in the view of Fig. 8,59 coating of the flexible non-cohesive material layer of mold inserts 58 usefulness, impaired or prevent that moulded parts 26 material adhesives are in mold inserts 58 with the transducer 12 that prevents the below.As is known to the person skilled in the art, the concrete material that is used for coating 59 will depend on the concrete composition of moulded parts 26, and coating material 59 can omit in some applications.Like this, coating material 59 is not considered to important composition of the present invention.Notice that molding process itself is not special in the present invention.Molding technique is known in the art, and those skilled in the art will know the necessary details of suitable formation moulded parts 26 and equivalent described here.
Fig. 9 is the top plan view of the example of substrate band 52, has boundary belt 60 thereon with protection PCB assembly 16a (can't see in the view at Fig. 9) in some assembling process of the present invention.The use of boundary belt 60 will be described in detail in following relating in the inventive method of producing photographing module 10.
Figure 10 is another example according to integrated photographing module 10a of the present invention.In the view of Figure 10, can see that another lens subassembly 24a has plastic lens housing 62, first lens 64 and second lens 66.Those skilled in the art should understand that integrated photographing module 10a needs two lens usually.Therefore, for example the layout shown in Figure 10 is thought optimum by the inventor.But the present invention also can implement when only adopting lens.Distance between first lens 64 and second lens 66 is fixed by the structure of lens housing 62.Distance between first lens 64 and the camera chip 12 is with setting as described below.In the example of Figure 10, adhesive cast gate 70 is arranged on moulded parts 26 peripheries, to receive lens subassembly 24a is remained positioned in adhesive 28 in the moulded parts 26.
Figure 11 is the flow chart that the example of photographing module building method 100 of the present invention is shown.In this embodiment, construct a plurality of photographing modules simultaneously.At first, in " camera chip installation " operation 102, one or more camera chips 12 are respectively installed to one or more PCB 16a.Next, in " lens are installed superpose-forming (overmolding) " operation 103, moulded lens is installed moulded parts 26 above each camera chip 12.Then, in " device isolation " operation 104, PCB 16a is by (for example, cutting) separated from one another.Next, in " lens installation " operation 105, lens housing 62 is installed in each moulded parts 26 (Figure 10).At last, in " encapsulation " operation 106, the integrated photographing module 10a that finishes is packed being shipped to manufacturing place of miniature video camera, phone shooting etc., or is connected to flexible circuit 44 alternatively as mentioned above.
Figure 12 is the flow chart of summing up a concrete grammar 107 of the camera chip fitting operation 102 that carries out method 100.At first, in " over cap location " operation 108, over cap 33 is positioned at camera chip 12 tops (Figure 10).Alternatively, over cap 33 can be during lens be installed superpose-forming 103, locate in the time of another of camera chip fitting operation 102, maybe can omit.Next, in " printing with paste " operation 110, solder paste traces is printed on each PCB 16a of substrate band 52.In " passive connection " operation 112, passive component 18 is placed on the PCB 16a.In " backflow " operation 114, substrate band 52 is carried out solder reflow operation, in " cleaning " operation 116, the substrate band 52 after the solder reflow operation 114 is carried out conventional clean operation.
In " tube core engages (die bonding) " operation 118, camera chip 12 is engaged to PCB16a (passing through adhesive in this example).In " solidifying in the stove " operation 120, the adhesive that last operation applied is solidified in stove.In " plasma cleans " operation 122, surface (in subsequent operation) the inert gas etching of closing line.In " wire-bonded (wire bonding) " operation 124, connecting line 17 is engaged with heat sound juncture.In second " plasma cleans " operation 126, PCB 16a is cleaned once more.
Figure 13 sums up the flow chart that the lens that carry out method 100 are installed a concrete grammar 127 of superpose-forming operation 103.In over cap positioning action 128, over cap 33 is located above camera chip 12.Install as the part in the last process if note over cap 33, this step that perhaps do not need protection when covering is dispensable.In " superpose-forming " operation 129, die sleeve 56 is placed on substrate band 52 tops, forms moulded parts 26 as described above then.Except the function of having stated here, moulded parts 26 also can play the effect that over cap 33 is kept the location, is essentially sealing in the sensor array area 14 of camera chip 12.Moulded parts 26 adopts common routine well known by persons skilled in the art " superpose-forming " technology is formed.After molded operation, model can be used for the exposure (exposure) of the sensor array area 14 of camera chip 12.At last, in " O/M curing " operation 130, moulded parts 26 is by hot curing simply.
Figure 14 is the flow chart of summing up a concrete grammar 131 of the device isolation operation 104 of carrying out Figure 11.At first, boundary belt 60 is placed on all PCB 16a tops (as shown in Figure 9) in " connection cover tape " operation 132.Then, in " being sawn into monolithic " operation 134, each PCB 16a is cut.Make that by boundary belt 60 this cutting correctly carried out, make that products obtained therefrom is a plurality of independent PCB assembly 22a, each still has the boundary belt 60 of each several part thereon.Boundary belt 60 is the common commodity that are used at brazing process protection components and parts etc.At last, in " removing cover tape " operation 138, these boundary belts 60 are removed from each PCB assembly 22a.
Sum up the flow chart of a concrete grammar 139 of the lens fitting operation 105 that carries out method 100 among Figure 15.In " lens installation " operation 140, among of being inserted in the moulded parts 26 (Figure 10) among the lens subassembly 24a.In " focusing on and test " operation 142, lens subassembly 24a moves up and down (along the Z axle 32 of Fig. 1) so that sensor array area 14 vernier focusings of the relative camera chip 12 of lens subassembly 24a.Correct focusing is determined by the automatic focus test equipment of routine usually.Should note the inventor believe by during " superpose-forming " operation 128 with reference to the position of die sleeve 56 relative camera chips 12, this operates in and can be cancelled future.At last, in " glue distribute and solidify " operation 144, as described in before here, ultraviolet curing adhesive 28 is applied, and is used ultraviolet light polymerization subsequently.
Figure 16 is the sectional side view of the photographing module 300 of another alternate embodiment according to the present invention.Photographing module 300 comprises the picture pick-up device 302 (for example integrated circuit camera chip) with sensor array area 304, whole be formed on the picture pick-up device 302 lens keeper 306 (for example, and be placed in lens subassembly 308 in the lens keeper 306 molded housing).In the present embodiment, lens keeper 306 is formed on the end face 310 of picture pick-up device 302 and in border around the end face 310, and lens keeper 306 also limits the receiver lens assembly 308 and the recess 312 of sensor array area 304 positioning lens assemblies 308 relatively.Sensor array area 304 can convert the optical imagery that is focused on thereon by lens subassembly 308 to the signal of telecommunication, make picture pick-up device 302 optical imagery can be converted to DID and also this DID is provided to the host electronic appliance (not shown), for example, cell phone, the circuit of PDA etc.
Photographing module 300 also can comprise the optional guard block of sensor array area 304 tops.For example, before or after lens keeper 306 is installed on the picture pick-up device 302, can above sensor array area 304, use the over cap 318 as sheet glass.Used under the situation of over cap 318 before lens keeper 306 is installed, in case lens keeper 306 is formed on the picture pick-up device 302, lens keeper 306 is applicable to over cap 318 is kept the location.
(for example, cell phone, PDA etc.) electrical connection, picture pick-up device 302 comprise a plurality of electric contacts 320, make picture pick-up device 302 can be conductively coupled to the printed circuit board (PCB) (PCB) 322 of main process equipment with host electronic appliance for ease of forming.In the present embodiment, electric contact 320 is formed in the conductive welding disk on the bottom surface of picture pick-up device 302.Electric contact 320 is electrically connected to a plurality of complementary electrical contacts 324 that form by solder ball (solder ball) 326 on PCB 322, described solder ball 326 also is mechanically fixed to PCB 322 with photographing module 300.In addition, electric contact 320 couples by a plurality of (only the illustrating two) through hole 328 of perforation picture pick-up device 302 formation and the electronic circuit (not shown) of picture pick-up device 302.Should also be noted that through hole 328 can be with include but not limited to that the several different methods of holing with chemical erosion forms in the various stages of making picture pick-up device 302.At last, PCB 322 can be attached to main process equipment with any one of the whole bag of tricks known in the art.
A significant advantage of photographing module 300 is that photographing module 300 sizes significantly reduce compared to existing technology.Particularly, lens keeper 306 be formed on picture pick-up device 302 end face 310 around in the border.Therefore, the shared bulk of photographing module 300 is not more than the lateral dimension of picture pick-up device 302.Further, the size that reduces lens keeper 306 also reduces and lens keeper 306 is made relevant material cost.
Figure 17 is the diagrammatic top plan view that removes the photographing module 300 of lens subassembly 308.As shown in figure 17, lens keeper 306 be formed in picture pick-up device 302 end face 310 around cylindrical shell in the border.Therefore, lens keeper 306 can not extend beyond the shared bulk of picture pick-up device 302 on directions X 330 and Y direction 332.Although in the present embodiment, the width/diameter of lens keeper 306 is substantially equal to the width of picture pick-up device 302, should understand the edge that lens keeper 306 does not need to extend to picture pick-up device 302.It is circular that lens keeper 306 also needs not be.Although the concrete structure shown in believing is favourable, may need as various concrete application, lens keeper 306 can have any suitable shape.
Figure 18 A is that (perspective view of) a part for example, silicon wafer, each picture pick-up device 302 all has sensor array area 304 for substrate 400 with a plurality of (being 9) discrete picture pick-up device 302 in this object lesson.In addition, on one of whole picture pick-up device 302 that is formed on correspondence of each of a plurality of lens keepers 306 and in border around it.After picture pick-up device 302 was formed on the substrate 400, lens keeper 306 once had been formed on the corresponding picture pick-up device 302 in the molded operation simultaneously.Picture pick-up device 302 can (singualtion process) separated from one another then, to generate a plurality of independent photographing modules 300.
In the photographing module 300 shown in Figure 18 A, lens subassembly 308 is not installed in the lens keeper 306.But it should be noted that lens subassembly 308 can be installed in the lens keeper 306 before or after photographing module 300 is separated from one another.For example, can be after lens keeper 306 be formed on the wafer 400, and wafer 400 is inserted into lens subassembly 308 in the lens keeper 306 before being cut apart.In fact, if before wafer 400 is cut apart lens subassembly 308 is positioned in the lens keeper 306, then lens subassembly 308 can protect sensor array area 304 not contaminated in singualtion process.
On substrate 400, form lens keeper 306 simultaneously and have important advantage.Particularly, manufacturing times are saved in a plurality of lens keepers 306 meetings of formation in a step during wafer is made, and eliminate intrinsic foozle the process of camera chip 302 formation lens keeper 306 after substrate 400 separates.Therefore, the output of available photographing module 300 significantly increases.
Figure 18 B is the perspective view after being divided into a plurality of independent photographing modules 300 of substrate 400.Because lens keeper 306 forms and directly is fixed to picture pick-up device 302 during making substrate 400, photographing module 300 can the parts by routine be installed equipment and technology is directly installed on the PCB (for example PCB 322) as independent parts, and does not worry aiming between lens keeper 306 and the picture pick-up device 302.But it should be noted that can be after substrate 400 be cut apart and/or after picture pick-up device 302 has been installed on PCB or other substrate, and lens keeper 306 is formed on the picture pick-up device 302, and this also within the scope of the invention.
Figure 19 is the cross sectional side view of another photographing module 500 according to a further aspect of the invention.Photographing module 500 comprises the picture pick-up device 502 (integrated circuit (IC) chip of for example making a video recording) with sensor array area 504, be formed entirely on the picture pick-up device 502 lens keeper 506 (for example, and be positioned at lens subassembly 508 in the lens keeper 506 molding outer casing).Similar with lens keeper 306, lens keeper 506 is formed on the end face 510 of picture pick-up device 502 (Figure 20) and in border around the end face 5 10.In addition, similar with sensor array area 304, sensor array area 504 will be in order to will convert the electronic image data through the optical imagery of lens subassembly 508 to.
In the present embodiment, lens keeper 506 and lens subassembly 508 comprise that another focuses on the feature portion that adjusts.Particularly, lens keeper 506 has recess 512 and projection 513.Recess 512 receiver lens assemblies 508 and with lens subassembly 508 relative sensor array area 504 located lateral.Projection 513 support of lens assemblies 508, and play the effect that lens subassembly 508 is positioned at the datum level of sensor array area 504 top predetermined altitudes, thereby image adequate focusing on sensor array area 504 that lens subassembly 508 is generated.In addition, projection 513 prevents to touch unintentionally between lens subassembly 508 and the picture pick-up device 502, thereby protection gap 514 is provided between lens subassembly 508 and sensor array area 504.In case suitably being located, lens subassembly 508, then provide adhesive 516 to prevent relatively moving between lens subassembly 508 and the picture pick-up device 502 with projection 513 adjacency.
Similar with photographing module 300, photographing module 500 also is included in the optional guard block of sensor array area 504 tops.For example, can be before lens keeper 506 be attached to picture pick-up device 502, during or afterwards, the over cap 518 that sheet glass is such is applied to sensor array area 504.Before lens keeper 506 attached or during use under the situation of over cap 518, lens keeper 506 can be used for over cap 518 is kept the location.
Another difference between photographing module 300 and the photographing module 500 is the position that electrically contacts dish.Photographing module 500 comprises that a plurality of electric contacts 520 (for example, the line pad) are formed on the peripheral of picture pick-up device 502 and on its end face 510, but not is formed on the bottom surface of picture pick-up device 502.As long as on the end face 510 enough spaces are arranged, on end face 510, form the through hole that electric contact 520 does not just need to generate the rear surface of leading to picture pick-up device 502.
Figure 20 is the diagrammatic top plan view behind the photographing module 500 of removing of lens subassembly 508.As shown in figure 20, lens keeper 506 be formed in picture pick-up device 502 end face 510 around cylindrical outer cover in the border.Because more or less less than the width of picture pick-up device 502, lens keeper 506 can not stop any electric contact 520 that forms on the end face 510 of picture pick-up device 502 to the width/diameter of lens keeper 506.
Figure 20 also illustrates the top view of projection 513.Projection 513 is normally circular, makes lens subassembly 508 be supported at its whole girth thus.But it should be noted that the datum level of projection 513 can be revised as and comprise " step " or chamfered portion for a kind of adjustable focus mechanism is provided.
Now method of the present invention is described with reference to Figure 21 A-22.In order clearly to explain, these methods describe with reference to the concrete parts of the previous embodiment of carrying out concrete function.Though however, it should be understood that be shown in here or consider the disclosure and element that other element of inventing can replace herein being quoted from, and do not deviate from scope of the present invention.Therefore, should understand the present invention and be not limited to any concrete element of carrying out any concrete function.Further, some step of the present invention needn't be carried out in the following sequence.For example, in some cases, two or more method steps can different order or are carried out simultaneously.In addition, some step of described method can be optionally (optional even without being denoted as), thereby can be omitted.Particularly consider aforementioned explanation of the present invention, method disclosed herein and distortion thereof will be obvious, and are considered to be in the four corner of the present invention.
Figure 21 A makes the flow chart of the method 600A of photographing module (for example photographing module 300) according to an embodiment of the invention.In the first step 602, provide the substrate that is formed with a plurality of discrete image capture devices 302 thereon (for example substrate 400).Then, in second step 604, a plurality of lens keepers 306 (for example molding outer casing) are fixed in the substrate 400, make each lens keeper 306 be fixed on the corresponding discrete picture pick-up device 302.Next, in optional the 3rd step 606, lens subassembly 308 is attached to each lens keeper 306.In the 4th step 608, discrete picture pick-up device 302 is by separated from one another, thereby generates a plurality of independent photographing modules 300 then.At last, in optional the 5th step 610,, then lens subassembly 308 is positioned in the lens keeper 306 if lens subassembly 308 is not positioned in the lens keeper 306 during the 3rd step 606.
Figure 21 B is another flow chart of making the method 600B of photographing module 300.In the first step 602, provide the substrate that is formed with a plurality of discrete image capture devices 302 thereon (for example substrate 400).Then, in second step 612, discrete picture pick-up device 302 is separated from one another into a plurality of independent picture pick-up devices 302.Next, in the 3rd step 614, lens keeper 306 whole being formed on the single picture pick-up device 302 are to form photographing module 300.At last, in optional the 4th step 61 6, lens subassembly 308 is attached to lens keeper 306.
Figure 22 is the method that photographing module of the present invention is installed to the circuit substrate (for example, PCB, flexible circuit board etc.) of telecommunications main frame.In the first step 702, a kind of photographing module (for example, photographing module 300) is provided, described photographing module comprises having lens keeper 306 whole formation picture pick-up device 302 thereon.Then, in second step 704, provide the circuit substrate (for example, PCB 322) of main process equipment.At last, in the 3rd step 706, photographing module 300 for example is welded to the complementary electrical contacts 324 of PCB 322 and directly is installed to PCB 322 by the electric contact 320 with picture pick-up device 302.
It should be noted that although these methods also can be applicable to the photographing module 500 shown in Figure 19 and 20 with reference to the 300 describing method 600A of the photographing module shown in Figure 16-18B, 600B and 700, and other photographing module that does not specify here.
The present invention can make various distortion and not change its value or scope.For example, according to the needs of concrete application or convenient, relevant with example described here shown in and size, shape and the quantity of described parts can be individually or all changes.
Similarly other baseplate material is for example ceramic, can be used for replacing PCB 16 described here.
Another distortion is to replace space described here to fill gap 30 with the optical clear distance piece that acceptable material on for example transparent plastic, glass or other optics is made.Provide with camera chip 12 and lens subassembly 24 all the distance piece of adjacency can eliminate the needs of condenser lens during the lens fitting operation.In addition, for example the second such set of lenses such as variable focus lens package can be coupled in the lens subassembly 24 or 24a in fixed of machinery.Distance piece also can play the effect of over cap, thereby does not need the over cap that provides independent.
Although the inventor believes that at present by adhesive lens subassembly 24,24a being installed to moulded parts 26 etc. is the most feasible method, but by other mechanical means, mechanical clamp etc. for example, relative camera chip 12 is fixed to PCB 16 also within the scope of the invention with lens subassembly 24,24a.
Conspicuous distortion of the present invention can be included between " cutting singualtion " operation 134 lens subassembly 24a is installed to moulded parts 26.Certainly, this need do some other to this method and revises to guarantee that sensor array area 14 is protected during " cutting singualtion " operation 134 grades.
Extra parts and/or part can easily be added to the present invention.A possible example is to provide glass cover on moulded parts 26.This lid can play several effects.It can be in storage, transportation and operating period protection sensor array area 14, and it optionally provides a kind of function that can be lifted by " pick up and put (pick-and-place) " machinery, and it also can be in reflow soldering operating period protection sensor array area 14.
Those skilled in the art should understand and can make an amendment (comprising above-described) and do not deviate from scope of the present invention photographing module 300 and 500.For example, wafer 400 might comprise the picture pick-up device 302 of more or less quantity.As another example, single over cap can be placed on wafer 400 tops, makes that each photographing module 300 can comprise a part of over cap when wafer 400 is cut apart.As another example, second over cap can be placed on lens keeper 306 tops when substrate 400 is cut apart, and makes chip can not enter lens keeper 306.As another example, can be after forming lens keeper 306 whenever, for example before the singualtion, after the singualtion but before photographing module 300 is installed on the PCB 322, or after photographing module 300 is installed on the PCB 322, lens subassembly 308 is positioned in the lens keeper 306.
More than all are that the present invention can be with the part example of embodiment.Those skilled in the art are easy to notice and can make numerous modifications and replacement and do not deviate from spiritual scope of the present invention.
Therefore, the disclosure herein content does not mean that restriction, and claims are interpreted as comprising full content of the present invention.
Industrial applicability
Integrated photographing module 10 of the present invention, 10a can be widely used at very little equipment, catch visual image in for example small-sized digital camera and the cell phone etc.This equipment and method are suitable for the application of wide spectrum, comprise that employing is from the VGA resolution to the 1.3M pixel or higher sensor assembly.With attached the comparing of housing of adopting conventional method, the moulding material cheapness of method and apparatus described here, the technology cost is lower.This mainly is because compare with attached lens once, once the whole front panel that has a large amount of photographing modules 10 on it is carried out mold treatment easily.In addition, the cost of mold compound can be lower than the aforesaid separate housing part cost that is used for attached lens.
In addition, under the situation of photographing module 300 and 500, can on the wafer 400 of picture pick-up device 302 and 502, form a plurality of lens keepers 306 and 506 respectively simultaneously.Do size, photographing module 300 and the 500 required manufacturing times and the overall cost that significantly reduce lens keeper 306 and 506 like this.
According to the present invention, photographing module 10,300 and 500 final assembly can be firmer, and X and Y position are more accurate relatively.This is to realize by guaranteeing that the sensor die position is controlled by position reference identical on the substrate with superpose-forming inserts position.Current approach comprises other means that adopt directing pin and be used for the shell installation.Compare with the mould of stable dimensions more with having more high dimensional accuracy, these means are introduced the bigger tolerance of organizing inherently.
As previously mentioned, the Z dimension accuracy will can realize that this surface is the key reference that shooting focuses on reference to camera chip 12,302,502 surfaces own.Can expect.This will have been avoided the needs of active alignment in most cases.In addition, do not finish aligning owing in fact will lens subassembly not rotating to the screw thread shell, this will inevitably make that lens position is more stable.
Can expect that further the minimizing itself according to number of components required for the present invention can cause further cost savings.
Because photographing module 10 of the present invention, 10a, 300,500 are easy to produce and the existing project organization of imagination is not integrated as yet with being used for camera system and other, and because have advantage described here, can expect that this is easy to be accepted in industrial meeting.Because these and other reason, can expect that effectiveness of the present invention and industrial applicability are in scope and all can be considerable on the duration.
Claims (51)
1. photographing module comprises:
The shooting integrated circuit (IC) chip;
Lens; And
Be installed in the lens keeper on the described shooting integrated circuit (IC) chip, described lens are by the described relatively shooting integrated circuit (IC) chip of described lens keeper location.
2. photographing module according to claim 1 wherein further comprises the over cap of the sensor array top that is positioned at described shooting integrated circuit (IC) chip.
3. photographing module according to claim 1, wherein said lens keeper is molded on the end face of described shooting integrated circuit (IC) chip.
4. photographing module according to claim 1, wherein said lens keeper is pre-formed and bonds on the end face of described shooting integrated circuit (IC) chip.
5. photographing module according to claim 1, wherein said lens keeper limits the recess that is used to receive described lens.
6. photographing module according to claim 5, wherein when described lens were positioned at described recess, described recess was with the described relatively shooting integrated circuit (IC) chip of described lens location.
7. photographing module according to claim 6, wherein said lens keeper comprise the datum level that is used for fixing the distance between described lens and the described shooting integrated circuit (IC) chip.
8. photographing module according to claim 1, wherein said lens are fixed to shell, make to have the gap between described lens of at least a portion and described shooting integrated circuit (IC) chip.
9. photographing module according to claim 1, wherein said lens are couple to described lens keeper by adjustable focus mechanism.
10. photographing module according to claim 1, wherein said lens are building blocks of set of lenses.
11. photographing module according to claim 1, wherein
Described shooting integrated circuit (IC) chip comprises photosensitive region and non-photosensitive region; And
Described lens keeper is installed on the described non-photosensitive region, thereby does not cover described photosensitive region.
12. photographing module according to claim 1 wherein further comprises at least one electric contact, in order to described shooting integrated circuit (IC) chip is conductively coupled to electronic equipment.
13. photographing module according to claim 12, wherein said at least one electric contact are positioned on the expose portion on surface of the described shooting integrated circuit (IC) chip that described lens keeper is installed.
14. photographing module according to claim 12, wherein
Described lens keeper is formed on the end face of described shooting integrated circuit (IC) chip; And
Described at least one electric contact is formed on the bottom surface of described shooting integrated circuit (IC) chip.
15. photographing module according to claim 1, wherein said lens keeper are installed on the end face of described shooting integrated circuit (IC) chip and in border around the described end face.
16. a method that is used to make photographing module, described method comprises:
The substrate that is formed with a plurality of discrete picture pick-up devices on it is provided; And
A plurality of lens keepers are fixed on the described substrate, and each in the described lens keeper is fixed on one corresponding in described a plurality of picture pick-up device.
17. method according to claim 16 wherein is included in molded described a plurality of lens keepers on the described substrate in the step of fixing described lens keeper on the described substrate.
18. method according to claim 17, wherein the step at molded described a plurality of lens keepers on the described substrate is included in molded described a plurality of lens keepers of while on the described substrate.
19. method according to claim 16 wherein is included in the step of fixing described lens keeper on the described substrate and fixes described a plurality of lens keeper on the described substrate simultaneously.
20. method according to claim 16 wherein further comprises when after fixing the step of described lens keeper on the described substrate, separates described a plurality of discrete picture pick-up device.
21. method according to claim 16 wherein further comprises over cap is placed on each top in described a plurality of discrete picture pick-up device.
22. method according to claim 21, each the step of top that wherein over cap is placed in described a plurality of picture pick-up device is carried out during the step that described a plurality of lens keepers is fixed on the described substrate.
23. method according to claim 21, wherein said over cap are molded distance pieces.
24. method according to claim 21, wherein said over cap is a glass.
25. method according to claim 16, the step of wherein fixing described a plurality of lens keepers are included in and form lens in described a plurality of lens keeper each and receive recess.
26. method according to claim 25 comprises further that wherein each the described lens that lens unit with correspondence navigates in described a plurality of lens keeper receive in the recess.
27. photographing module according to claim 26, the step of wherein locating described lens unit comprise with in the described lens unit each with described lens keeper in one corresponding datum level adjacency, with the distance between fixing described lens unit and the described picture pick-up device.
28. method according to claim 26, wherein the step that described lens unit is positioned in the described lens keeper is carried out when described discrete picture pick-up device remains the integral part of described substrate.
29. method according to claim 16 comprises further that wherein lens with correspondence are attached to each in described a plurality of lens keeper.
30. method according to claim 29, the step that wherein described lens is attached to described lens keeper is carried out when described discrete picture pick-up device remains the integral part of described substrate.
31. method according to claim 29 wherein further is included in described discrete picture pick-up device when remaining the integral part of described substrate, focuses on described lens.
32. method according to claim 16, each in wherein said a plurality of picture pick-up devices comprises:
Be positioned at the imaging circuit on the end face of described picture pick-up device; And
Be formed on the electric contact on the bottom surface of described picture pick-up device.
33. method according to claim 32, each in the wherein said picture pick-up device comprises the through hole by described substrate, in order to described imaging circuit is connected with described electric contact.
34. one width corresponding in the method according to claim 32, the width of wherein said lens keeper and described picture pick-up device is roughly the same.
35. method according to claim 16, the step of wherein on described substrate, fixing described a plurality of lens keepers comprise with in described a plurality of lens keepers each be positioned at corresponding in the described picture pick-up device one around in the border.
36. method according to claim 16 wherein further comprises:
Described discrete picture pick-up device is separated from one another; And wherein
Described a plurality of lens keepers are fixed on step on the described substrate are included in after the step of separating described discrete picture pick-up device, on whole at least one that is formed in a plurality of independent picture pick-up devices of lens keeper.
37. a silicon wafer comprises:
A plurality of discrete picture pick-up devices; And
A plurality of lens keepers, each lens keeper are installed on one corresponding in the described picture pick-up device.
38. according to the described silicon wafer of claim 37, wherein further comprise a plurality of over caps, each over cap is arranged in one corresponding top of described a plurality of picture pick-up device.
39. according to the described silicon wafer of claim 38, wherein said over cap is molded distance piece.
40. according to the described silicon wafer of claim 38, wherein said over cap is a glass.
41. according to the described silicon wafer of claim 37, each in wherein said a plurality of lens keepers comprises that lens receive recess.
42., wherein further comprise being positioned at the lens unit that each described lens receives the correspondence of recess according to the described silicon wafer of claim 41.
43. according to the described silicon wafer of claim 42, each comprises the datum level that is used for the described relatively picture pick-up device of described lens unit location wherein said lens keeper.
44. according to the described silicon wafer of claim 37, wherein further comprise a plurality of lens units, each lens unit is installed on one corresponding in described a plurality of lens keeper.
45. according to the described silicon wafer of claim 44, wherein said lens unit is installed on the described lens keeper, makes to have the gap between described lens unit and described picture pick-up device.
46. according to the described silicon wafer of claim 37, each in the wherein said discrete picture pick-up device comprises:
Be positioned at the imaging circuit on the end face of described picture pick-up device; And
The electric contact that on the bottom surface of described shooting integrated circuit (IC) chip, forms.
47. according to the described silicon wafer of claim 46, in the wherein said lens keeper in the Breadth Maximum of each and the described picture pick-up device corresponding one Breadth Maximum roughly the same.
48. according to the described silicon wafer of claim 46, each in the wherein said picture pick-up device comprises the through hole by described silicon wafer, in order to described imaging circuit is connected with described electric contact.
49. according to the described silicon wafer of claim 37, each in the wherein said lens keeper is formed on the end face of corresponding described picture pick-up device and in border around the described end face.
50. an electronics comprises:
Be used for carrying out the communicating circuit of communication with another electronics; And
Photographing module comprises: the shooting integrated circuit (IC) chip with photosensitive region; And the shell of whole erection on described shooting integrated circuit (IC) chip.
51., wherein further comprise according to the described electronics of claim 62
The circuit substrate that comprises at least a portion of described communicating circuit; And wherein
Described photographing module is installed on the described circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210238583.2A CN102761697B (en) | 2005-10-11 | 2006-10-10 | Based on camera module and the manufacture method thereof of wafer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/247,993 US7796187B2 (en) | 2004-02-20 | 2005-10-11 | Wafer based camera module and method of manufacture |
| US11/247,993 | 2005-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210238583.2A Division CN102761697B (en) | 2005-10-11 | 2006-10-10 | Based on camera module and the manufacture method thereof of wafer |
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| Publication Number | Publication Date |
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| CN101326811A true CN101326811A (en) | 2008-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800465252A Pending CN101326811A (en) | 2005-10-11 | 2006-10-10 | Wafer based camera module and method of manufacture |
| CN201210238583.2A Active CN102761697B (en) | 2005-10-11 | 2006-10-10 | Based on camera module and the manufacture method thereof of wafer |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210238583.2A Active CN102761697B (en) | 2005-10-11 | 2006-10-10 | Based on camera module and the manufacture method thereof of wafer |
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| Country | Link |
|---|---|
| US (1) | US7796187B2 (en) |
| EP (1) | EP1943833B1 (en) |
| JP (2) | JP2009512346A (en) |
| CN (2) | CN101326811A (en) |
| CA (1) | CA2625587A1 (en) |
| TW (1) | TWI392337B (en) |
| WO (1) | WO2007047254A2 (en) |
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- 2006-10-10 JP JP2008535619A patent/JP2009512346A/en active Pending
- 2006-10-10 WO PCT/US2006/039521 patent/WO2007047254A2/en active Application Filing
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| CN110140074A (en) * | 2016-11-30 | 2019-08-16 | 株式会社大赛璐 | Imaging device lens for camera's component and its manufacturing method |
| CN110140074B (en) * | 2016-11-30 | 2021-11-16 | 株式会社大赛璐 | Lens unit for imaging device and method for manufacturing the same |
| CN111316626A (en) * | 2017-11-03 | 2020-06-19 | Zf主动安全和电子美国有限公司 | Driver assistance system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102761697B (en) | 2015-10-28 |
| EP1943833B1 (en) | 2012-05-16 |
| CA2625587A1 (en) | 2007-04-26 |
| US7796187B2 (en) | 2010-09-14 |
| JP2009512346A (en) | 2009-03-19 |
| WO2007047254A3 (en) | 2007-10-11 |
| EP1943833A2 (en) | 2008-07-16 |
| EP1943833A4 (en) | 2010-04-07 |
| TWI392337B (en) | 2013-04-01 |
| CN102761697A (en) | 2012-10-31 |
| JP2013214964A (en) | 2013-10-17 |
| TW200718185A (en) | 2007-05-01 |
| WO2007047254A2 (en) | 2007-04-26 |
| US20060132644A1 (en) | 2006-06-22 |
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