JP2004194223A - Imaging apparatus and portable terminal - Google Patents

Imaging apparatus and portable terminal Download PDF

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Publication number
JP2004194223A
JP2004194223A JP2002362708A JP2002362708A JP2004194223A JP 2004194223 A JP2004194223 A JP 2004194223A JP 2002362708 A JP2002362708 A JP 2002362708A JP 2002362708 A JP2002362708 A JP 2002362708A JP 2004194223 A JP2004194223 A JP 2004194223A
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Prior art keywords
lens
imaging device
imaging
substrate
optical
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Japanese (ja)
Inventor
Tadashi Saito
正 斎藤
Yuichi Shin
勇一 新
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Konica Minolta Inc
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Konica Minolta Inc
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Priority to JP2002362708A priority Critical patent/JP2004194223A/en
Priority to EP03257695A priority patent/EP1429168A3/en
Priority to KR1020030090452A priority patent/KR20040053804A/en
Priority to TW092135246A priority patent/TW200425493A/en
Priority to CNA2003101205250A priority patent/CN1507067A/en
Publication of JP2004194223A publication Critical patent/JP2004194223A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus that can be manufactured satisfactorily without being subjected to constraints by the size and shape of an optical member, an image pickup element and a substrate and to provide a portable terminal with the built-in imaging apparatus. <P>SOLUTION: In this imaging apparatus 100 provided with a substrate (PC) provided with the image pickup element (2) and the optical member (1) for forming a subject image in an imaging area (2a) of the image pickup element (2), the optical member (1) has a lens member (9) and a supporting part (10a) for supporting the lens member and is provided with a lens support member (10) that is arranged while allowed to abut on a non-imaging area of the image pickup element (2). <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、携帯電話やパーソナルコンピュータなどに搭載可能な撮像装置、及び携帯端末に関する。
【０００２】
【従来の技術】
近年、携帯電話機やパーソナルコンピュータ等に搭載可能な、小型で高性能の撮像装置が開発されている。
このような従来の撮像装置は、例えば、基板の上に、Ａ／Ｄ変換器やドライバ等の電気部品、画像処理ＩＣ回路に接続されるＣＣＤベアチップ（撮像素子）などが取り付けられる他、結像レンズと、前記基板上に配置するための脚部を備えたレンズ部（光学部材）等が配設されている（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開平９−２８４６１７号公報
【０００４】
【発明が解決しようとする課題】
ところで、上記特許文献１の撮像装置において、例えば、レンズ部の結像レンズの大きさは変わらないが、ＣＣＤベアチップや基板がより小型化することにより、レンズの有効径よりも内側でＣＣＤベアチップの撮像エリアの外側に、脚部を当接するように配置できるようにしなければならない場合、レンズ部の脚部の基板と当接する部分のみを小さく形成すると、例えば、図１３に示すようなレンズ部１２０を製造することが考えられる。しかし、この場合、脚部１２０ｂが、結像レンズ１２０ａの有効径１２０ａａの内側まで入り組んだ形状となり、アンダーカット部１２１，１２１が形成されることとなるが、金型によりこのような形状のレンズ部１２０を成形することは不可能である。従って、ＣＣＤベアチップや基板の大きさや形状にフレキシブルに対応したレンズ部（光学部材）を形成することは困難であった。
【０００５】
本発明の課題は、光学部材、撮像素子、基板の大きさや形状による制約を受けることなく、好適に製造可能な撮像装置およびそれを内蔵した携帯端末を提供することである。
【０００６】
【課題を解決するための手段】
以上の課題を解決するため、請求項１に記載の発明は、
撮像素子が設けられた基板と、
前記撮像素子の撮像領域に被写像を結像させる光学部材と、を備える撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持する支持部を備えるとともに、前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
からなることを特徴とする。
【０００７】
この請求項１に記載の発明によれば、光学部材は、レンズ部材と、該レンズ部材を支持する支持部を備えるとともに、撮像素子の非撮像領域に当接して配置されるレンズ支持部材とからなるので、レンズ部材と、撮像素子・基板との間に配置されるレンズ支持部材を適宜変更することにより、レンズ部材と、撮像素子、基板の大きさや形状等の関係性に制約を受けることがなくなることとなって、撮像装置の製造における自由度が増す。
【０００８】
請求項２に記載の発明は、開口部が形成された基板と、
前記基板の裏面側に、前記開口部の少なくとも一部を塞ぐように取り付けられた撮像素子と、
前記撮像素子の撮像領域に被写像を結像させる光学部材と、を備える撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持する支持部を備えるとともに、前記基板の表面側から前記開口部を通じて前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
からなることを特徴とする。
【０００９】
請求項２に記載の発明によれば、基板の表面側から開口部を通じて当該撮像素子の表面に当接するように、撮像素子に入射光を集光する光学部材のレンズ支持部材が取り付けられているので、撮像装置は、基板の厚み分、薄型化が実現する。また、光学部材は、レンズ部材とレンズ部材を支持する支持部を備えるレンズ支持部材とからなるので、レンズ部材と撮像素子との間に介すレンズ支持部材を適宜変更することにより、撮像装置は、レンズ部材、撮像素子、基板等のサイズや形状等の関係性に制約をうけることなく製造することが実現することとなって、製造における自由度が増す。
【００１０】
請求項３に記載の発明は、請求項１又は２に記載の撮像装置において、
前記支持部の該側端部の位置が前記撮像素子よりも外側にあることを特徴とする。
【００１１】
請求項３に記載の発明によれば、請求項１又は２に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部の大きさが撮像素子よりも大きい等、支持部の該側端部の位置が撮像素子よりも外側にある場合においても、支障なく撮像装置を製造することができる。それにより、レンズ部材の大きさに関係なく撮像素子を小さく成形できることとなって、撮像装置の小型化が実現する。
【００１２】
請求項４に記載の発明は、請求項１〜３の何れか一項に記載の撮像装置において、
前記支持部において、前記レンズ部材は前記レンズ支持部材に嵌合されていることを特徴とする。
【００１３】
この請求項４に記載の発明によれば、請求項１〜３の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、支持部において、レンズ部材はレンズ支持部材に嵌合されているので、レンズ部材とレンズ支持部材とが所定の位置に固定されることとなって、光学部材の寸法精度を安定させ、所定の光学的機能を達成することができる。
【００１４】
請求項５に記載の発明は、請求項４に記載の撮像装置において、
前記レンズ部材は、光軸方向に垂直な方向に突出する突部を備え、
前記支持部は、前記突部を嵌合する上部が開口した凹部を備えることを特徴とする。
【００１５】
請求項５に記載の発明によれば、請求項４に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部材は、光軸方向に垂直な方向に突出する突部を備え、支持部は、この突部を嵌合する上部が開口した凹部を備えているので、レンズ部材を上方から嵌め込めることとなって、製造の容易化が実現する。
【００１６】
請求項６に記載の発明は、請求項１〜５の何れか一項に記載の撮像装置において、
前記レンズ支持部材は、遮光性を有することを特徴とする。
【００１７】
請求項６に記載の発明によれば、請求項１〜５の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ支持部材は、遮光性を有するので、レンズ部材に対する内面反射を防止することができる。
【００１８】
請求項７に記載の発明は、請求項１〜６の何れか一項に記載の撮像装置において、
前記レンズ部材と前記レンズ支持部材との間に、絞り板とＩＲカットフィルタのうち少なくとも何れか一方が挿入されていることを特徴とする。
【００１９】
請求項７に記載の発明によれば、請求項１〜６の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部材と前記レンズ支持部材との間に、絞り板とＩＲカットフィルタのうち少なくとも何れか一方を挿入した構造の撮像装置を製造することができる。
【００２０】
請求項８に記載の発明は、請求項１〜７の何れか一項に記載の撮像装置において、
前記レンズ支持部材において、前記撮像素子の非撮像領域上に当接する当接面は、均一な凸凹面に形成されていることを特徴とする。
【００２１】
請求項８に記載の発明によれば、請求項１〜７の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ支持部材において、撮像素子の非撮像領域上に当接する当接面は、均一な凸凹面に形成されているので、レンズ支持部材と撮像素子とは、多点接地となることにより、レンズ支持部材の荷重を分散させることができることとなって、好適である。
【００２２】
請求項９に記載の発明は、光電変換部を備えた撮像素子と、
前記撮像素子を保持し、且つ電気信号の外部接続用端子を有する基板と、前記光電変換部に被写体画像を結像させる光学部材と、開口部を有し、前記光学部材を覆う遮光性部材からなる筐体とを有する撮像部を備え、前記光学部材の光軸方向の高さが１０ｍｍ以下である撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持するとともに、前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
を備えることを特徴とする。
【００２３】
請求項９に記載の発明によれば、光学部材の光軸方向の高さが１０ｍｍ以下という比較的小型の撮像装置において、光学部材が、レンズ部材とレンズ支持部材とを備えていることにより、レンズ部材と撮像素子との間に介すレンズ支持部材を適宜変更することで、撮像装置は、レンズ部材、撮像素子、基板等のサイズや形状等の関係性に制約をうけることなく製造することが実現することとなって、製造における自由度が増す。
【００２４】
請求項１０に記載の発明は、請求項１〜９の何れか一項に記載の撮像装置がケース内に搭載されていることを特徴とする携帯端末である。
【００２５】
請求項１０に記載の発明によれば、請求項１〜９の何れか一項に記載の撮像装置がケース内に搭載されている携帯端末は、その撮像装置に基づき、製造上の自由度が増す。
【００２６】
【発明の実施の形態】
以下、図を参照して本発明の実施の形態を詳細に説明する。
【００２７】
[第１の実施の形態]
図１は、本第１の実施の形態における撮像装置１００の斜視図であり、図２は、図１のII−II線における同撮像装置１００の一部省略断面図である。図３は、光学部材１の斜視図、図４は、撮像装置１００に備えられる光学部材１と撮像素子２との組み付けを示す分解斜視図である。
【００２８】
図１、図２に示されるように、撮像装置１００は、基板ＰＣと、その基板ＰＣの一方の面上に配設された撮像素子２と、この撮像素子２の撮像領域（後述の光電変換部２ａ）に集光させ被写体像を結像させるための光学部材１と、この光学部材１に入射する光の量を調節する絞り板３と、撮像素子２を覆い隠す鏡枠４と、遮光性を有する遮光板５と、遮光板に支持されるＩＲカットフィルタ６と、光学部材１を押圧する押圧部材７と、鏡枠４の位置決めを行うための位置決め電気部品８ａと、その他基板ＰＣ上に配置された電気部品８…と、基板ＰＣから延出されるフレキシブル基板ＦＰＣ等を備えている。
【００２９】
光学部材１は、図２〜図４に示すように、透明なプラスチック材料を素材とするレンズ部材９と、このレンズ部材９を支持するとともに、前記撮像素子２上に当接して配置されるレンズ支持部材１０とから構成される。
レンズ部材９は、凸レンズ形状のレンズ部９ａと、レンズ部９ａの側下方に形成され、レンズ支持部材１０に嵌合する嵌合部９ｃとが一体的に形成されている。また、レンズ部材９の上端には上面部９ｂが形成され、この上面部９ｂの中央にレンズ部９ａが形成されている。また、嵌合部９ｃには、下方に突出した突部９ｄ…が設けられている。
また、レンズ部材９は、レンズ部９ａの光軸方向の長さが１０ｍｍ以下で、且つ重量が１５グラム以下のものであり、比較的小型な撮像装置に用いられる。
【００３０】
レンズ支持部材１０は、レンズ部材９の内面反射を防止するための遮光性を備えたプラスチック材料により形成される。このレンズ支持部材１０の上端には、レンズ部材９の嵌合部９ｃと嵌合してレンズ部材９を支持する受け皿状の支持部１０ａが形成され、この支持部１０ａの下方に管状の脚部１０ｂが形成されている。また、該脚部１０ｂの下方に、撮像素子２に当接する４つの当接部１０ｃ…が形成されている。
支持部１０ａは、図２に示すように、レンズ部材９の突部９ｄ…と嵌合する凹部１０ｄ…を有している。これにより、レンズ部材９は、レンズ支持部材１０に固定され所定の位置からずれない構造となっている。
【００３１】
また、当接部１０ｃ…の撮像素子２との当接面は、均一な凸凹面の粗し面に形成されているので、撮像素子２上において多点接地となり、荷重を分散させることができる。
【００３２】
ここで、図４に示すように、レンズ部材９の外径が、撮像素子２の長辺よりも長い。また、支持部１０ａの外側端部の位置が撮像素子２の長辺側の端部よりも外側に位置しているが、レンズ支持部材１０の脚部１０ｂ及び当接部１０ｃ…は、レンズ部９の有効径９ａａよりも内側に位置するように形成されている。そして、当接部１０c…は、撮像素子２の非撮像領域２ｂ上で、且つ点線で示したレンズ部９の有効径９ａａに相当する円ｃの内側の位置に配設される。
即ち、レンズ部材９をそのままの大きさでは、撮像素子２上に配設することができないが、レンズ支持部材１０を介すことにより、撮像素子２上に配設可能となっている。
【００３３】
撮像素子２は、イメージセンサであり、例えば、ＣＭＯＳ型イメージセンサ、ＣＣＤ型イメージセンサ等からなる。矩形薄板状の撮像素子２の下面は、基板ＰＣの上面に取り付けられている。撮像素子２の上面中央には、図４に示すように、画素が２次元的に配列された、撮像領域としての光電変換部２ａが形成されている。その外側の非撮像領域２ｂに、レンズ支持部材１０の当接部１０ｃ…が当接する被当接部２ｃ…が設けられるとともに、処理部（図示省略）が形成されている。ここで、被当接部２ｃ…は、レンズ部９ａの有効径９ａａに相当する円ｃの内側に位置している。そして、処理部の外縁近傍には、複数のパッド（図示省略）が配置されている。結線用端子であるパッドは、図２に示すように、ワイヤＷを介して基板ＰＣに接続されている。ワイヤＷは、基板ＰＣ上の所定の回路に接続されている。
【００３４】
絞り板３は、レンズ部９ａの周囲の上面部９ｂに固定されている。この絞り板３は、遮光性のある素材からなり、レンズ部９ａの絞り値（Ｆ値）を規定する第１の絞りとしての開口３ａを有する。
【００３５】
鏡枠４は、遮光性のある素材からなる筐体であり、光学部材１の外側に配置されている。
鏡枠４には、図１、図２に示すように、角柱状の下部４ａと、円筒状の上部４ｂとが設けられている。下部４ａの下端部は、基板ＰＣ上に接着剤Ｂにより固着される。また、また、鏡枠４の下部４ａと上部４ｂとの間の隔壁４ｃの内周面と、光学部材１のレンズ支持部材１０の脚部１０ｃとは密着的に嵌合するように構成されている。そして、この嵌合により、光学部材１は、例えば、光学部材１のレンズ部９ａの光軸を中心とした回転が防止されるように、鏡枠４に位置規制されている。
【００３６】
また、光学部材１は鏡枠４に位置規制されているので、基板ＰＣの所定位置に、例えば、後述する位置決め電気部品８ａ…に基づき、鏡枠４を位置決めして配置することにより、基板ＰＣの所定位置に光学部材１を配置することができ、例えば、基板ＰＣに備えられた撮像素子２の光電変換部２ａの中心と、鏡枠４に嵌合された光学部材１のレンズ部９ａの光軸中心とを一致させるように備えることができる。
また、光学部材１は鏡枠４に位置規制されているため、基板ＰＣの所定位置に鏡枠４が配置され、固定された状態においては、光学部材１は所定の位置からずれにくく、例えば、光学部材１のレンズ部９ａの光軸中心と、撮像素子２の光電変換部２ａの中心とが一致した状態を維持しやすい。
【００３７】
遮光板５は、鏡枠４の上部４ｂの上端に接着剤Ｂにより取り付けられている。遮光板５は、その中央に第２の絞りとしての開口５ａを有している。
ＩＲカットフィルタ６は、赤外線吸収特性を有する素材からなり、遮光板５の中央の開口５ａの下方に接着剤Ｂにより接合されている。
そして、この遮光板５とＩＲカットフィルタ６とでカバー部材１１を構成する。このように、基板ＰＣと鏡枠４とカバー部材とが密着し接合しているので、撮像部１０は、防塵、防湿の構造を有する。
【００３８】
押圧部材７は、例えば、コイルばねなどの弾性部材により構成され、光学部材１と、遮光板５との間に配置されている。そして、遮光板５が鏡枠４に取り付けられることで、遮光板５が押圧部材７を押圧して、押圧部材７が弾性変形する。この押圧部材７は、光学部材１を図２中、下方に向かって所定の押圧力により押圧して、光学部材１を撮像素子２に付勢する。ここで、遮光板５から下方の撮像素子２に向かう力が加わった際、押圧部材７が弾性変形することにより、その力を吸収する緩衝作用が働くので、その力は直接撮像素子２には伝達されず、撮像素子２が破損することを防ぐ効果がある。
【００３９】
電気部品９…は、撮像装置１００を動作させ、画像処理を行うために必要な電気部品である。このように電気部品８…が基板ＰＣ上に設けられているので、撮像装置１００を一つのユニットとして、様々な電子機器に搭載し易くなる。
位置決め電気部品８ａは、例えば、コンデンサ、抵抗、ダイオード等であり、図２において、基板ＰＣ上の撮像素子２と鏡枠４との間であって、鏡枠４に近接して配置されている。また、基板ＰＣから位置決め電気部品８ａの上端部までの高さは、基板ＰＣから撮像素子２の上端部までの高さよりも高くなっている。また、位置決め電気部品８ａは、鏡枠４の下部４ａにおける固着部位の内側の４角を囲むようにして４つ設けられている。従って、この位置決め電気部品８は、鏡枠４を基板ＰＣ上に固着する際の、鏡枠４の位置決め指標となる。また、位置決め電気部品８ａの上端が撮像素子２の上端よりも高くなっているので、鏡枠４が、撮像素子２に接触して撮像素子２のワイヤＷ等を傷つけるのを防ぐ。
尚、位置決め電気部品８ａは、例えば、コンデンサ、抵抗、ダイオード等に限らず、撮像装置１００に必要な電気部品であればよい。
【００４０】
フレキシブル基板ＦＰＣは外部接続用端子として、撮像装置１００を電子機器に搭載する際に、電子機器の基板等に接続される。
【００４１】
このように、本第１の実施の形態における撮像装置１００において、光学部材１は、レンズ部材９とレンズ支持部材１０とから構成されているので、撮像素子２、或いは光電変換部２ａのサイズ等の構造上、撮像素子２の光学部材１の脚部２ｂ及び当接部２ｃ…が、レンズ部９ａの有効径９ａａの内側に位置していても、レンズ部材９をそのままの形状で、撮像素子２上に配置することができる。従って、撮像素子２のサイズや形状が様々ある場合、レンズ部材９をそれに合わせて形成しなくとも、レンズ支持部材１０の脚部１０ｃを撮像素子２のサイズや形状に合わせて変更したものを形成することでフレキシブルに対応することができる。
即ち、レンズ部材９の大きさに左右されることなく、撮像素子２を製造することができるので、撮像素子２をレンズ部材９よりも小さくする等、撮像素子２、それに伴う撮像装置１００の製造における自由度が増す。また、撮像素子２をレンズ部材９の大きさに左右されることなく小さく形成できることにより、撮像装置１００の小型化に貢献することとなる。
【００４２】
また、レンズ部材９とレンズ支持部材１０とは、レンズ部材９の突部９ｄ…とレンズ支持部材１０の凹部１０ｄ…とが嵌合するように構成されているので、レンズ部９ａの光軸の中心と撮像素子２の光電変換部２ａの中心とが一致した状態を維持することができる。
【００４３】
尚、本発明の第１の実施の形態の撮像装置１００の光学部材１の形状、構成等は上記に限定されるものではない。
以下、図５〜図８を用いて光学部材１の変形例１２、１５、１８、２１について説明する。
【００４４】
（変形例１）
図５に示す変形例１の光学部材１２は、レンズ部材９と、レンズ支持部材１０との間に、絞り板１３と、ＩＲカットフィルタ１４とを配設可能に構成されている。この光学部材１２に示すように、レンズ部材９とレンズ支持部材１０との間に、絞り板、ＩＲカットフィルタ等の部品を組み込む構成であってもよい。
【００４５】
（変形例２）
また、図６に示す変形例２の光学部材１５は、円形状のレンズ部１６ａを備えたレンズ部材１６と、このレンズ部材１６を支持する支持部材１７とから構成されている。
レンズ部材１６において、レンズ支持部材１７と嵌合するための突部１６ｂ…がレンズ部１６ａの光軸方向と垂直な方向に突出するように設けられており、レンズ支持部材１７において、上端に形成された支持部１７ａに、該突部１６ｂと嵌合可能な被嵌合部としての凹部１７ｂ…が形成されている。従って、レンズ部材１６の突部１６ｂを、レンズ支持部材１７の凹部１７ｂに嵌合させることにより、レンズ部材１６がレンズ支持部材１７に支持されるとともに、レンズ部材１６の光軸方向に垂直な方向の位置決めがなされる。また、この凹部１７ｂ…は、上部が開口した形状になっているので、レンズ部材１６を上方からレンズ支持部材１７に嵌め込めることとなって、製造が容易である。
尚、上記突部１６ｂ…は、レンズ部材１６を金型成型する際のゲートを用いてもよく、この場合、突部１６ｂをわざわざ成型するコストが省ける。
【００４６】
（変形例３）
また、図７に示す変形例３の光学部材１８は、ファインダレンズ状のレンズ部１９ａを備えたレンズ部材１９と、該レンズ部材を支持するレンズ支持部材２０とから構成されている。
レンズ部材１９において、レンズ支持部材２０と嵌合するための突部１９ｂ…が、レンズ部１９ａの光軸方向と垂直な方向に突出するように設けられており、レンズ支持部材２０において、この突部１９ｂ…と嵌合可能な被嵌合部としての凹部２０ｂ…が支持部２０ａに形成されている。これによって、ファインダレンズ状のレンズ部１９ａを撮像装置に組み込むことができる。
【００４７】
（変形例４）
また、図８に示す変形例４の光学部材２１は、図７のレンズ部材１９と、該レンズ部材を支持するレンズ支持部材２２とから構成されている。そして、レンズ支持部材２２において、レンズ部材１９の突部１９ｂ…と嵌合可能な被嵌合部としての凹部２２ｂ…が支持部２２ａに形成されている。この支持部２２ａ及び凹部２２ｂの下方に、２対の立方体形状の脚部２３、２３が形成され、撮像素子２の被当接部２ｄ…に当接する、下駄状の脚部２３，２３としてもよい。
【００４８】
[第２の実施の形態]
次に、図９、図１０を用いて、本発明の第２の実施の形態について説明する。尚、第１の実施の形態と同一部分には同一符号を付し、異なる部分についてのみ説明する。
【００４９】
図９、図１０に示すように、撮像装置２００は、開口部２０１が形成された基板ＰＣと、その基板ＰＣの裏面側から開口部２０１を塞ぐように備えられた撮像素子２０２と、基板ＰＣの表面側から開口部２０１を通じて、その撮像素子２０２の表面である受光面に当接し、撮像素子２０２に集光させるための光学部材１と、この光学部材１に入射する光量を調節する絞り板３と、撮像素子２０２と開口部２０１とを覆い隠す外枠部材としての鏡枠４と、鏡枠４に備えられた遮光性を有する遮光板５と、遮光板５に支持されるフィルタ６と、遮光板５と光学部材１の間に備えられ、光学部材１を基板ＰＣ側へ押圧する押圧部材７と、光学部材１の位置決めを行うために基板ＰＣ上の所定位置に配置された位置決め電気部品８ａ…、及びその他基板ＰＣに配置された電気部品８…と、基板ＰＣより延出した外部接続用端子としてのフレキシブル基板ＦＰＣ等により構成されている。
【００５０】
撮像素子２０２は、例えば、ＣＭＯＳ型イメージセンサ、ＣＣＤ型イメージセンサ等からなり、矩形薄板状の撮像素子２０２の端部における上面が、基板ＰＣの裏面側に取り付けられている。撮像素子２０２の上面中央には、画素が２次元的に配列され、撮像領域としての矩形状の光電変換部２０２ａが形成されており、撮像素子２０２が基板ＰＣの裏面に取り付けられた際、基板ＰＣに形成された開口部２０１を通して、基板ＰＣの表面側から光電変換部２０２ａが露出するようになっている。
【００５１】
また、撮像素子２０２の端部における上面と、基板ＰＣの裏面側とは、電極としてのバンプ２０３を介して取り付けられており、撮像素子２０２と基板ＰＣとはバンプ２０３により電気的に接続されている。
【００５２】
より詳細には、基板ＰＣの裏面には、撮像素子２０２との接続部材としてのボンディングパッド（図示なし）が配置されている。また、撮像素子２０２において、光電変換部２０２ａの外周の上記ボンディングパッドと対応した位置に設けられた入出力端子（図示省略）上にバンプ２０３が設けられており、このバンプ２０３を介して、撮像素子２０２の入出力端子と、基板ＰＣのボンディングパッドとが接合されることにより、撮像素子２０２と基板ＰＣとが電気的に接続されている。その接合方法として、例えば、超音波溶着の他、ＡＣＦ（異方性導電性フィルム）、ＡＣＰ（異方性導電性ペースト）等がある。
【００５３】
このように、第２の実施の形態における撮像装置２００において、撮像素子２０２が基板ＰＣの裏面側から基板ＰＣの開口部２０１を塞ぐように備えられるとともに、基板ＰＣの表面側から開口部２０１を通じて、その撮像素子２０２の光電変換部２０２ａに当接するように光学部材１が備えられているので、基板ＰＣとの厚さの分、基板ＰＣ表面から垂直方向への光学部材１の突出を抑えることができる。よって、その光学部材１の突出を抑えた分、撮像装置２００の厚みを薄くすることができる。
【００５４】
〔第３の実施の形態〕
次に、本発明の第３の実施の形態について説明する。なお、第１、第２の実施の形態と同様の箇所は同一符号を用いるとともに、詳細な説明は省略し、異なる部分についてのみ説明する。
図１１は、本発明の第３の実施の形態における撮像装置３００の一部省略断面図である。
【００５５】
図１１に示されるように、撮像装置３００における光学部材３０１は、第１のレンズ部材３１０と、この第１のレンズ部材３１０に入射する光量を調節する絞り板３０３を介し、第１のレンズ部材３１０の上方に備えられた補助光学部材としての第２のレンズ部材３２０と、第１のレンズ部材３１０を支持するとともに、基板ＰＣの表面側から開口部２０１を通じて、撮像素子２０２の表面に当接するレンズ支持部材３３０により構成されている。なお、第１のレンズ部材３１０と第２のレンズ部材３２０との光軸は同一となっている。
【００５６】
第１のレンズ部材３１０は、レンズ部３１０ａの周囲に管状の下脚部３１０ｂを備えたものであり、下脚部３１０ｂの下端部にはレンズ支持部材３３０に当接する当接部３１０ｃが設けられている。また、第１のレンズ部材３１０の外周部は、鏡枠４の隔壁４ｃに当接し嵌合されており、第１のレンズ部材３１０の位置決めを確実なものとしている。
【００５７】
第１のレンズ部材３１０の管状の下脚部３１０ｂの上面であって、レンズ部３１０ａの周囲には、遮光性のある素材からなり、レンズ部３１０ａのＦナンバーを規定する絞りとしての開口３０３ａを有する絞り板３０３が接着剤により、固定されている。
【００５８】
第２のレンズ部材３２０は、レンズ部３２０ａの周囲に管状の上脚部３２０ｂを備えたものであり、上脚部３２０ｂの下面側には、絞り板３０３が接着剤により、固定されている。また、第２のレンズ部材３２０は、第２のレンズ部材３２０と、遮光板５との間に配置された押圧部材７により、第２のレンズ部材３２０を図１１中、下方に向かって所定の押圧力により押圧して、絞り板３０３を介し第１のレンズ部材３１０を撮像素子２０２に付勢する。
【００５９】
レンズ支持部材３３０は、第１のレンズ部材３１０の内面反射を防止するための遮光性を備えたプラスチック材料を素材とし、その上端に形成され、第１のレンズ部材９の当接部３１０ｃと当接して第１のレンズ部材３１０を支持する受け皿状の支持部３３０ａと、支持部３３０ａの下方に形成された管状の脚部３３０ｂと、該脚部３３０ｂの下方に形成され、撮像素子２０２に当接する４つの当接部３３０ｃ…とを備えている。
【００６０】
このように、撮像装置３００において、光学部材３０１として、第１のレンズ部材３１０と第２の光学部材レンズ部材３２０とを複合して用いることにより、第１のレンズ部材３１０と第２のレンズ部材３２０のそれぞれの光学機能等を複合することにより、光学部材としての機能の幅を広げることができる。よって、小型化した撮像装置であっても、より高機能な撮像装置とすることができる。
尚、第１のレンズ部材３１０の当接部３１０ｃの下方に突部を備え、レンズ支持部材３３０の支持部３３０ａに、該突部と嵌合可能な凹部を有している構成であってもよい。この場合、第１のレンズ部材３１０と、レンズ支持部材３３０とがより固定され所定の位置からずれを防止できる。
【００６１】
次に、撮像装置１００を一例として、上記撮像装置を搭載した携帯端末について説明する。
図１１に示すように、携帯端末は、例えば、折り畳み式携帯電話機Ｔ（以下、携帯電話機Ｔという）であり、表示画面Ｄを備えたケースとしての上筐体７１と、操作ボタンＰを備えた下筐体７２とがヒンジ７３を介して連結されている。撮像装置１００は、上筐体７１の内表面側（表示画面Ｄを有する側）の表示画面Ｄの下方に内蔵されており、撮像装置１００（光学部材１）が上筐体７１の外表面から光を取り込めるものとされている。
【００６２】
このように、携帯電話機Ｔに薄型化された撮像装置１００を内蔵することにより、携帯電話機Ｔをより薄型化することができ、撮像対象との距離や、撮像環境に合わせて撮像装置１００の機能を使い分けることにより、付加価値の高い携帯電話機Ｔとすることができる。なお、携帯電話機Ｔのその他の構成要素は、公知のものであるため、説明を省略する。尚、上述の携帯電話機Ｔにおいて、第１の実施の形態で説明を行った撮像装置１００を搭載した構成で説明を行ったが、第２，第３の実施の形態で説明を行った撮像装置２００、３００を用いてもよい。この場合、基板ＰＣの厚さ分、光学部材１の光軸方向の突出分が少なくなるので、携帯電話機Ｔの薄型化が実現する。
【００６３】
以上、本発明を実施の形態を参照して説明してきたが、本発明は上記実施の形態に限定して解釈されるべきでなく、適宜変更・改良が可能であることは勿論である。例えば、第２、第３の実施の形態において、第１の実施の形態で説明した光学部材１を用いる構成で説明を行ったが、光学部材１の変形例である、光学部材１２、１５、１８、２１を搭載してもよい。
【００６４】
また、各種説明を行った光学部材において、光学部材を構成するレンズ部材及びレンズ支持部材の形状等は上述のものに限定されるものではなく、例えば、レンズ部材とレンズ支持部材との嵌合部分の形状、数等は限定されない。また、レンズ支持部材において、撮像素子との当接する脚の形状、数等も同様に限定されない。例えば、レンズ支持部材と撮像素子とは、粗し面で当接してもよいし、密着面で当接してもよい。
【００６５】
また、基板ＰＣは、ハードなものに限らず、フレキシブルなものであってもよい。
また、本実施の形態では、撮像素子２、２０２として、ＣＭＯＳ型イメージセンサを用いる構成で説明したが、ＣＣＤ（Charged Coupled Device）型イメージセンサであっても良い。
本発明の撮像装置は、携帯電話、パーソナルコンピュータ、ＰＤＡ、ＡＶ装置、テレビ、家庭電化製品など、種々のものに組み込むことが可能と考えられる。
【００６６】
【発明の効果】
請求項１に記載の発明によれば、光学部材は、レンズ部材と、該レンズ部材を支持する支持部を備えるとともに、撮像素子の非撮像領域に当接して配置されるレンズ支持部材とからなるので、レンズ部材と、撮像素子・基板との間に配置されるレンズ支持部材を適宜変更することにより、レンズ部材と、撮像素子、基板の大きさや形状等の関係性に制約を受けることがなくなることとなって、撮像装置の製造における自由度が増す。
【００６７】
請求項２に記載の発明によれば、基板の表面側から開口部を通じて当該撮像素子の表面に当接するように、撮像素子に入射光を集光する光学部材のレンズ支持部材が取り付けられているので、撮像装置は、基板の厚み分、薄型化が実現する。また、光学部材は、レンズ部材とレンズ部材を支持する支持部を備えるレンズ支持部材とからなるので、レンズ部材と撮像素子との間に介すレンズ支持部材を適宜変更することにより、撮像装置は、レンズ部材、撮像素子、基板等のサイズや形状等の関係性に制約をうけることなく製造することが実現することとなって、製造における自由度が増す。
【００６８】
請求項３に記載の発明によれば、請求項１又は２に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部の大きさが撮像素子よりも大きい等、支持部の該側端部の位置が撮像素子よりも外側にある場合においても、支障なく撮像装置を製造することができる。それにより、レンズ部材の大きさに関係なく撮像素子を小さく成形できることとなって、撮像装置の小型化が実現する。
【００６９】
請求項４に記載の発明によれば、請求項１〜３の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、支持部において、レンズ部材はレンズ支持部材に嵌合されているので、レンズ部材とレンズ支持部材とが所定の位置に固定されることとなって、光学部材の寸法精度を安定させ、所定の光学的機能を達成することができる。
【００７０】
請求項５に記載の発明によれば、請求項４に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部材は、光軸方向に垂直な方向に突出する突部を備え、支持部は、この突部を嵌合する上部が開口した凹部を備えているので、レンズ部材を上方から嵌め込めることとなって、製造の容易化が実現する。
【００７１】
請求項６に記載の発明によれば、請求項１〜５の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ支持部材は、遮光性を有するので、レンズ部材に対する内面反射を防止することができる。
【００７２】
請求項７に記載の発明によれば、請求項１〜６の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ部材と前記レンズ支持部材との間に、絞り板とＩＲカットフィルタのうち少なくとも何れか一方を挿入した構造の撮像装置を製造することができる。
【００７３】
請求項８に記載の発明によれば、請求項１〜７の何れか一項に記載の発明と同様の効果が得られるのは勿論のこと、特に、レンズ支持部材において、撮像素子の非撮像領域上に当接する当接面は、均一な凸凹面に形成されているので、レンズ支持部材と撮像素子とは、多点接地となることにより、レンズ支持部材の荷重を分散させることができることとなって、好適である。
【００７４】
請求項９に記載の発明によれば、光学部材の光軸方向の高さが１０ｍｍ以下という比較的小型の撮像装置において、光学部材が、レンズ部材とレンズ支持部材とを備えていることにより、レンズ部材と撮像素子との間に介すレンズ支持部材を適宜変更することで、撮像装置は、レンズ部材、撮像素子、基板等のサイズや形状等の関係性に制約をうけることなく製造することが実現することとなって、製造における自由度が増す。
【００７５】
請求項１０に記載の発明によれば、請求項１〜９の何れか一項に記載の撮像装置がケース内に搭載されている携帯端末は、その撮像装置に基づき、製造上の自由度が増す。
【図面の簡単な説明】
【図１】本発明の第１の実施の形態における撮像装置の斜視図である。
【図２】図１の撮像装置のII−II線における一部省略断面図である。
【図３】光学部材の斜視図である。
【図４】撮像装置に備えられる光学部材と撮像素子とを示す分解斜視図である。
【図５】光学部材の変形例１と撮像素子とを示す分解斜視図である。
【図６】光学部材の変形例２を示す分解斜視図である。
【図７】光学部材の変形例３を示す分解斜視図である。
【図８】光学部材の変形例４と撮像素子とを示す分解斜視図である。
【図９】第２の実施の形態における撮像装置を説明するための一部省略断面図である。
【図１０】図９の撮像装置の基板及び撮像素子の平面図である。
【図１１】第３の実施の形態における撮像装置を説明するための一部省略断面図である。
【図１２】本発明にかかる撮像装置を内蔵した携帯電話機の一例を示す正面図及び背面図である。
【図１３】従来の光学部材及びその変形例を説明するための説明図である。
【符号の説明】
１、１２、１５、１８、２１ 光学部材
２、２０２ 撮像素子
２ａ、２０２ａ 光電変換部（撮像領域）
２ｂ 非撮像領域
３、１３ 絞り板
４ 鏡枠（筐体）
６、１４ ＩＲカットフィルタ
９、３１０、３２０ レンズ部材
９ａ、３１０ａ、３２０ａ レンズ部
９ｄ 突部
１０、３３０ レンズ支持部材
１０ａ、３３０ａ 支持部
１０ｄ 凹部
１００、２００、３００ 撮像装置
２０１ 開口部
ＰＣ 基板
ＦＰＣ フレキシブル基板（外部接続用端子）
Ｂ 接着剤
Ｔ 折り畳み式携帯電話機（携帯端末）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an imaging device that can be mounted on a mobile phone, a personal computer, and the like, and a mobile terminal.
[0002]
[Prior art]
2. Description of the Related Art In recent years, small, high-performance imaging devices that can be mounted on mobile phones, personal computers, and the like have been developed.
Such a conventional image pickup apparatus includes, for example, an electronic component such as an A / D converter and a driver, a CCD bare chip (image pickup device) connected to an image processing IC circuit, and the like on a substrate, and also forms an image. A lens, a lens unit (optical member) having legs for disposing on the substrate, and the like are provided (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-9-284617
[0004]
[Problems to be solved by the invention]
By the way, in the imaging device of Patent Document 1, for example, the size of the imaging lens of the lens unit does not change, but the CCD bare chip and the substrate are made smaller, so that the CCD bare chip is located inside the effective diameter of the lens. When it is necessary to be able to arrange the legs so as to abut on the outside of the imaging area, if only the portions of the legs of the lens which are in contact with the substrate are formed small, for example, the lens unit 120 as shown in FIG. It is conceivable to manufacture However, in this case, the leg portion 120b has a complicated shape inside the effective diameter 120aa of the imaging lens 120a, and the undercut portions 121 and 121 are formed. It is not possible to mold the part 120. Therefore, it has been difficult to form a lens portion (optical member) flexibly corresponding to the size and shape of the CCD bare chip and the substrate.
[0005]
An object of the present invention is to provide an imaging device that can be suitably manufactured without being restricted by the size and shape of an optical member, an imaging element, and a substrate, and a portable terminal that incorporates the imaging device.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the invention described in claim 1 is
A substrate provided with an imaging element;
An optical member that forms an image on an imaging region of the imaging element,
The optical member,
A lens member,
A lens support member that includes a support portion that supports the lens member, and is disposed in contact with a non-imaging area of the image sensor.
It is characterized by comprising.
[0007]
According to the first aspect of the present invention, the optical member includes a lens member and a support portion that supports the lens member, and includes a lens support member that is disposed in contact with a non-imaging area of the image sensor. Therefore, by appropriately changing the lens support member disposed between the lens member and the image pickup device / substrate, the relationship between the lens member, the image pickup device, and the size and shape of the substrate may be restricted. As a result, the degree of freedom in manufacturing the imaging device is increased.
[0008]
The invention according to claim 2 includes a substrate having an opening,
On the back side of the substrate, an image sensor attached to close at least a part of the opening,
An optical member that forms an image on an imaging region of the imaging element,
The optical member,
A lens member,
A lens support member that includes a support portion that supports the lens member, and is disposed in contact with a non-imaging area of the imaging element through the opening from a surface side of the substrate,
It is characterized by comprising.
[0009]
According to the second aspect of the present invention, the lens support member of the optical member that condenses incident light is attached to the image sensor so that the surface of the substrate comes into contact with the surface of the image sensor through the opening. Therefore, the imaging device is reduced in thickness by the thickness of the substrate. Further, since the optical member includes a lens member and a lens support member having a support portion that supports the lens member, by appropriately changing the lens support member interposed between the lens member and the image sensor, the imaging device can be used. Therefore, it is possible to realize the manufacture without being restricted by the relationship between the size and the shape of the lens member, the imaging element, the substrate, and the like, and the degree of freedom in the manufacture is increased.
[0010]
The invention according to claim 3 is the imaging device according to claim 1 or 2,
The position of the side end of the support portion is located outside the image pickup device.
[0011]
According to the third aspect of the present invention, the same effects as those of the first or second aspect can be obtained, and in particular, the supporting portion such as a lens portion having a size larger than that of the imaging device. Even if the position of the side end portion is outside the image sensor, the image pickup apparatus can be manufactured without any trouble. Thereby, the image pickup device can be formed small regardless of the size of the lens member, and the size of the image pickup device can be reduced.
[0012]
The invention according to claim 4 is the imaging device according to any one of claims 1 to 3,
In the supporting portion, the lens member is fitted to the lens supporting member.
[0013]
According to the fourth aspect of the present invention, the same effects as those of the first to third aspects of the invention can be obtained. Since it is fitted to the member, the lens member and the lens support member are fixed at a predetermined position, so that the dimensional accuracy of the optical member can be stabilized and a predetermined optical function can be achieved.
[0014]
According to a fifth aspect of the present invention, in the imaging device according to the fourth aspect,
The lens member includes a protrusion protruding in a direction perpendicular to the optical axis direction,
The support portion includes a concave portion having an open upper portion for fitting the protrusion.
[0015]
According to the fifth aspect of the invention, the same effect as that of the fourth aspect of the invention can be obtained, and in particular, the lens member has a projection projecting in a direction perpendicular to the optical axis direction. Since the support portion has a concave portion with an open top for fitting the projection, the lens member can be fitted from above, thereby facilitating manufacture.
[0016]
The invention according to claim 6 is the imaging device according to any one of claims 1 to 5,
The lens support member has a light shielding property.
[0017]
According to the sixth aspect of the present invention, it is needless to say that the same effects as those of the first to fifth aspects of the present invention can be obtained. In particular, since the lens supporting member has a light shielding property. In addition, internal reflection on the lens member can be prevented.
[0018]
The invention according to claim 7 is the imaging device according to any one of claims 1 to 6,
At least one of an aperture plate and an IR cut filter is inserted between the lens member and the lens support member.
[0019]
According to the invention as set forth in claim 7, it is needless to say that the same effects as those of the invention as set forth in any one of claims 1 to 6 can be obtained, in particular, between the lens member and the lens support member. Further, it is possible to manufacture an imaging device having a structure in which at least one of the aperture plate and the IR cut filter is inserted.
[0020]
According to an eighth aspect of the present invention, in the imaging apparatus according to any one of the first to seventh aspects,
In the lens support member, a contact surface that comes into contact with a non-imaging area of the imaging element is formed with a uniform uneven surface.
[0021]
According to the eighth aspect of the invention, it is needless to say that the same effects as those of the first aspect of the invention can be obtained. Since the contact surface that comes into contact with the region is formed with a uniform uneven surface, the lens support member and the imaging element can be dispersed at a multi-point ground, thereby distributing the load of the lens support member. It is suitable.
[0022]
According to a ninth aspect of the present invention, there is provided an imaging device including a photoelectric conversion unit,
A substrate that holds the imaging element and has an external connection terminal for an electric signal, an optical member that forms an image of a subject on the photoelectric conversion unit, and an opening that includes a light-shielding member that covers the optical member. An imaging device comprising: an imaging unit having a housing, wherein a height of the optical member in an optical axis direction is 10 mm or less.
The optical member,
A lens member,
A lens support member that supports the lens member and is disposed in contact with a non-imaging region of the image sensor,
It is characterized by having.
[0023]
According to the ninth aspect of the present invention, in a relatively small imaging device in which the height of the optical member in the optical axis direction is 10 mm or less, the optical member includes a lens member and a lens support member. By appropriately changing the lens support member interposed between the lens member and the imaging device, the imaging device can be manufactured without any restrictions on the relationship between the size and shape of the lens member, the imaging device, the substrate, and the like. Is realized, and the degree of freedom in manufacturing is increased.
[0024]
According to a tenth aspect of the present invention, there is provided a portable terminal characterized in that the imaging device according to any one of the first to ninth aspects is mounted in a case.
[0025]
According to the tenth aspect of the present invention, the portable terminal in which the imaging device according to any one of the first to ninth aspects is mounted in a case has a degree of freedom in manufacturing based on the imaging device. Increase.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0027]
[First Embodiment]
FIG. 1 is a perspective view of the imaging device 100 according to the first embodiment, and FIG. 2 is a partially omitted cross-sectional view of the imaging device 100 taken along line II-II of FIG. FIG. 3 is a perspective view of the optical member 1, and FIG. 4 is an exploded perspective view showing the assembling of the optical member 1 and the image sensor 2 provided in the imaging device 100.
[0028]
As shown in FIGS. 1 and 2, the imaging apparatus 100 includes a substrate PC, an imaging device 2 provided on one surface of the substrate PC, and an imaging region of the imaging device 2 (photoelectric conversion described later). An optical member 1 for converging an image of a subject by condensing the light on a unit 2a), an aperture plate 3 for adjusting an amount of light incident on the optical member 1, a mirror frame 4 for covering and hiding the image sensor 2, Light-shielding plate 5, an IR cut filter 6 supported by the light-shielding plate, a pressing member 7 for pressing the optical member 1, a positioning electric component 8a for positioning the lens frame 4, and other components on the substrate PC , And a flexible board FPC extending from the board PC.
[0029]
As shown in FIGS. 2 to 4, the optical member 1 includes a lens member 9 made of a transparent plastic material, and a lens that supports the lens member 9 and is disposed in contact with the imaging element 2. And a support member 10.
The lens member 9 is formed integrally with a convex lens-shaped lens portion 9a and a fitting portion 9c formed below the lens portion 9a and fitted to the lens support member 10. An upper surface portion 9b is formed at the upper end of the lens member 9, and a lens portion 9a is formed at the center of the upper surface portion 9b. The fitting portion 9c is provided with protrusions 9d projecting downward.
The lens member 9 has a length of the lens portion 9a in the optical axis direction of 10 mm or less and a weight of 15 g or less, and is used for a relatively small imaging device.
[0030]
The lens support member 10 is formed of a plastic material having a light blocking property for preventing internal reflection of the lens member 9. At the upper end of the lens support member 10, a saucer-like support portion 10a that fits with the fitting portion 9c of the lens member 9 to support the lens member 9 is formed, and a tubular leg portion is provided below the support portion 10a. 10b are formed. Below the leg 10b, four contact portions 10c which contact the image sensor 2 are formed.
As shown in FIG. 2, the support portion 10a has concave portions 10d to fit with the protrusions 9d of the lens member 9. Thus, the lens member 9 is fixed to the lens support member 10 and has a structure that does not shift from a predetermined position.
[0031]
Further, since the contact surfaces of the contact portions 10c with the image pickup device 2 are formed on the roughened surface of the uniform uneven surface, the contact points 10c are multipoint grounded on the image pickup device 2, and the load can be dispersed. .
[0032]
Here, as shown in FIG. 4, the outer diameter of the lens member 9 is longer than the long side of the image sensor 2. Also, the position of the outer end of the support portion 10a is located outside the longer side end of the image sensor 2, but the leg portion 10b and the contact portion 10c of the lens support member 10 are It is formed so as to be located inside the effective diameter 9aa of the 9. Are arranged on the non-imaging area 2b of the imaging element 2 and inside the circle c corresponding to the effective diameter 9aa of the lens section 9 indicated by the dotted line.
That is, the lens member 9 cannot be arranged on the image sensor 2 with the same size, but can be arranged on the image sensor 2 via the lens support member 10.
[0033]
The image sensor 2 is an image sensor, and is, for example, a CMOS image sensor, a CCD image sensor, or the like. The lower surface of the rectangular thin plate-shaped imaging element 2 is attached to the upper surface of the substrate PC. At the center of the upper surface of the imaging element 2, as shown in FIG. 4, a photoelectric conversion unit 2a as an imaging area in which pixels are two-dimensionally arranged is formed. In the outer non-imaging area 2b, abutted portions 2c to which the abutting portions 10c of the lens support member 10 abut are provided, and a processing unit (not shown) is formed. Here, the abutted portions 2c are located inside a circle c corresponding to the effective diameter 9aa of the lens portion 9a. A plurality of pads (not shown) are arranged near the outer edge of the processing unit. The pads serving as connection terminals are connected to the substrate PC via wires W as shown in FIG. The wire W is connected to a predetermined circuit on the board PC.
[0034]
The aperture plate 3 is fixed to an upper surface 9b around the lens 9a. The diaphragm plate 3 is made of a material having a light-shielding property, and has an opening 3a as a first diaphragm that defines a diaphragm value (F value) of the lens portion 9a.
[0035]
The mirror frame 4 is a housing made of a material having a light-shielding property, and is arranged outside the optical member 1.
As shown in FIGS. 1 and 2, the lens frame 4 is provided with a prismatic lower part 4a and a cylindrical upper part 4b. The lower end of the lower portion 4a is fixed on the substrate PC with an adhesive B. Further, the inner peripheral surface of the partition wall 4c between the lower part 4a and the upper part 4b of the lens frame 4 and the leg part 10c of the lens supporting member 10 of the optical member 1 are configured to fit tightly. I have. By this fitting, the position of the optical member 1 is regulated by the lens frame 4 so that, for example, rotation of the lens portion 9a of the optical member 1 around the optical axis is prevented.
[0036]
Further, since the position of the optical member 1 is regulated by the lens frame 4, the lens frame 4 is positioned and arranged at a predetermined position of the substrate PC based on, for example, positioning electric components 8a to be described later. The optical member 1 can be arranged at a predetermined position. For example, the center of the photoelectric conversion portion 2a of the imaging element 2 provided on the substrate PC and the lens portion 9a of the optical member 1 fitted to the lens frame 4 can be arranged. It can be provided so as to coincide with the optical axis center.
Further, since the position of the optical member 1 is regulated by the lens frame 4, the lens frame 4 is arranged at a predetermined position of the substrate PC, and in a fixed state, the optical member 1 is hard to be shifted from the predetermined position. It is easy to maintain a state where the center of the optical axis of the lens unit 9a of the optical member 1 and the center of the photoelectric conversion unit 2a of the image sensor 2 match.
[0037]
The light shielding plate 5 is attached to the upper end of the upper part 4b of the lens frame 4 with an adhesive B. The light shielding plate 5 has an opening 5a as a second stop at the center thereof.
The IR cut filter 6 is made of a material having an infrared absorption characteristic, and is joined by an adhesive B below the central opening 5 a of the light shielding plate 5.
The light shielding plate 5 and the IR cut filter 6 constitute a cover member 11. As described above, since the substrate PC, the lens frame 4 and the cover member are in close contact with and joined to each other, the imaging unit 10 has a dustproof and moistureproof structure.
[0038]
The pressing member 7 is formed of, for example, an elastic member such as a coil spring, and is disposed between the optical member 1 and the light shielding plate 5. When the light shielding plate 5 is attached to the lens frame 4, the light shielding plate 5 presses the pressing member 7, and the pressing member 7 is elastically deformed. The pressing member 7 presses the optical member 1 downward with a predetermined pressing force in FIG. 2 to urge the optical member 1 toward the image sensor 2. Here, when a force is applied from the light-shielding plate 5 to the lower image sensor 2, the pressing member 7 is elastically deformed, so that a buffering action is performed to absorb the force. There is an effect of preventing the image pickup device 2 from being damaged without being transmitted.
[0039]
The electric components 9 are electric components necessary for operating the imaging device 100 and performing image processing. Since the electric components 8 are provided on the substrate PC in this manner, it becomes easy to mount the imaging device 100 as one unit on various electronic devices.
The positioning electric component 8a is, for example, a capacitor, a resistor, a diode, or the like. In FIG. 2, the positioning electric component 8a is arranged between the imaging device 2 on the substrate PC and the lens frame 4 and close to the lens frame 4. . The height from the substrate PC to the upper end of the positioning electric component 8a is higher than the height from the substrate PC to the upper end of the image sensor 2. Also, four positioning electric components 8a are provided so as to surround the four corners inside the fixed portion in the lower part 4a of the lens frame 4. Therefore, the positioning electric component 8 serves as a positioning index of the lens frame 4 when the lens frame 4 is fixed on the substrate PC. Further, since the upper end of the positioning electric component 8a is higher than the upper end of the image sensor 2, the lens frame 4 is prevented from being in contact with the image sensor 2 and damaging the wires W of the image sensor 2.
The positioning electric component 8a is not limited to, for example, a capacitor, a resistor, and a diode, and may be any electric component necessary for the imaging device 100.
[0040]
The flexible substrate FPC is connected as an external connection terminal to a substrate or the like of the electronic device when the imaging device 100 is mounted on the electronic device.
[0041]
As described above, in the imaging device 100 according to the first embodiment, since the optical member 1 is constituted by the lens member 9 and the lens supporting member 10, the size of the imaging element 2 or the photoelectric conversion unit 2a is determined. ..., even if the leg 2b and the contact portion 2c of the optical member 1 of the image sensor 2 are located inside the effective diameter 9aa of the lens portion 9a, the lens member 9 is kept in the same shape and the image sensor 2 can be arranged. Therefore, when the size and shape of the image pickup device 2 are various, the leg portion 10c of the lens support member 10 is formed in accordance with the size and shape of the image pickup device 2 without forming the lens member 9 correspondingly. By doing so, it is possible to respond flexibly.
That is, since the imaging element 2 can be manufactured without being affected by the size of the lens member 9, the imaging element 2 and the manufacturing of the imaging device 100 associated therewith can be manufactured by making the imaging element 2 smaller than the lens member 9. The degree of freedom in is increased. In addition, since the imaging device 2 can be formed small without being affected by the size of the lens member 9, it contributes to downsizing of the imaging device 100.
[0042]
Since the lens member 9 and the lens support member 10 are configured such that the protrusions 9d of the lens member 9 and the concave portions 10d of the lens support member 10 fit, the optical axis of the lens portion 9a is A state in which the center and the center of the photoelectric conversion unit 2a of the image sensor 2 match can be maintained.
[0043]
The shape, configuration, and the like of the optical member 1 of the imaging device 100 according to the first embodiment of the present invention are not limited to the above.
Hereinafter, modified examples 12, 15, 18, and 21 of the optical member 1 will be described with reference to FIGS.
[0044]
(Modification 1)
The optical member 12 of the first modification shown in FIG. 5 is configured such that an aperture plate 13 and an IR cut filter 14 can be disposed between the lens member 9 and the lens support member 10. As shown in the optical member 12, a configuration may be adopted in which components such as an aperture plate and an IR cut filter are incorporated between the lens member 9 and the lens support member 10.
[0045]
(Modification 2)
The optical member 15 of Modification 2 shown in FIG. 6 includes a lens member 16 having a circular lens portion 16a and a support member 17 for supporting the lens member 16.
In the lens member 16, projections 16b for fitting with the lens support member 17 are provided so as to protrude in a direction perpendicular to the optical axis direction of the lens portion 16a. A concave portion 17b as a fitted portion that can be fitted to the protrusion 16b is formed in the support portion 17a. Accordingly, by fitting the projection 16b of the lens member 16 into the concave portion 17b of the lens support member 17, the lens member 16 is supported by the lens support member 17 and the direction perpendicular to the optical axis direction of the lens member 16 Is determined. Since the recesses 17b have an open top, the lens member 16 can be fitted into the lens support member 17 from above, which facilitates manufacture.
The protrusions 16b may use a gate when the lens member 16 is molded, and in this case, the cost of molding the protrusion 16b can be omitted.
[0046]
(Modification 3)
The optical member 18 of the third modification shown in FIG. 7 includes a lens member 19 having a finder lens-shaped lens portion 19a, and a lens support member 20 for supporting the lens member.
In the lens member 19, protrusions 19b for fitting with the lens support member 20 are provided so as to protrude in a direction perpendicular to the optical axis direction of the lens portion 19a. A concave portion 20b as a fitted portion that can be fitted to the portion 19b is formed in the support portion 20a. As a result, the finder lens-shaped lens portion 19a can be incorporated in the imaging device.
[0047]
(Modification 4)
The optical member 21 of Modification 4 shown in FIG. 8 includes the lens member 19 of FIG. 7 and a lens support member 22 that supports the lens member. In the lens support member 22, a concave portion 22b as a fitted portion that can be fitted to the protrusion 19b of the lens member 19 is formed in the support portion 22a. Below the support portion 22a and the concave portion 22b, two pairs of cubic legs 23, 23 are formed, which may be clog-shaped legs 23, 23 that come into contact with the abutted portions 2d of the imaging device 2. Good.
[0048]
[Second embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. The same parts as those in the first embodiment are denoted by the same reference numerals, and only different parts will be described.
[0049]
As shown in FIGS. 9 and 10, the imaging device 200 includes a substrate PC having an opening 201 formed thereon, an imaging element 202 provided to cover the opening 201 from the back side of the substrate PC, and a substrate PC. An optical member 1 for contacting the light receiving surface, which is the surface of the image sensor 202, through the opening 201 from the surface side of the optical member 1 and condensing the light on the image sensor 202, and a diaphragm plate for adjusting the amount of light incident on the optical member 1 3, a lens frame 4 as an outer frame member that covers the imaging element 202 and the opening 201, a light shielding plate 5 provided on the lens frame 4 having a light shielding property, and a filter 6 supported by the light shielding plate 5. A pressing member 7 provided between the light shielding plate 5 and the optical member 1 for pressing the optical member 1 toward the substrate PC; and a positioning electric member disposed at a predetermined position on the substrate PC for positioning the optical member 1. Parts 8a ... and other bases The electrical components 8 ... arranged on your PC, and is configured by a flexible substrate FPC and the like as an external connection terminal extending from the substrate PC.
[0050]
The imaging element 202 is composed of, for example, a CMOS image sensor, a CCD image sensor, or the like. At the center of the upper surface of the imaging element 202, pixels are two-dimensionally arranged, and a rectangular photoelectric conversion unit 202a as an imaging area is formed. When the imaging element 202 is mounted on the back surface of the substrate PC, Through the opening 201 formed in the PC, the photoelectric conversion unit 202a is exposed from the front surface side of the substrate PC.
[0051]
The upper surface at the end of the image sensor 202 and the back surface of the substrate PC are attached via bumps 203 as electrodes, and the image sensor 202 and the substrate PC are electrically connected by the bumps 203. I have.
[0052]
More specifically, a bonding pad (not shown) as a connection member with the image sensor 202 is arranged on the back surface of the substrate PC. In the image sensor 202, a bump 203 is provided on an input / output terminal (not shown) provided at a position corresponding to the bonding pad on the outer periphery of the photoelectric conversion unit 202a. The image sensor 202 and the substrate PC are electrically connected by joining the input / output terminals of the element 202 and the bonding pads of the substrate PC. Examples of the joining method include, besides ultrasonic welding, ACF (anisotropic conductive film) and ACP (anisotropic conductive paste).
[0053]
As described above, in the imaging device 200 according to the second embodiment, the imaging element 202 is provided so as to cover the opening 201 of the substrate PC from the back side of the substrate PC, and is also provided through the opening 201 from the front side of the substrate PC. Since the optical member 1 is provided so as to be in contact with the photoelectric conversion portion 202a of the imaging element 202, the projection of the optical member 1 in the vertical direction from the surface of the substrate PC can be suppressed by the thickness of the substrate PC. Can be. Therefore, the thickness of the imaging device 200 can be reduced by the amount by which the protrusion of the optical member 1 is suppressed.
[0054]
[Third Embodiment]
Next, a third embodiment of the present invention will be described. The same parts as those in the first and second embodiments are denoted by the same reference numerals, detailed description is omitted, and only different parts will be described.
FIG. 11 is a partially omitted cross-sectional view of an imaging device 300 according to the third embodiment of the present invention.
[0055]
As shown in FIG. 11, an optical member 301 in the imaging apparatus 300 is provided with a first lens member 310 and a first lens member 310 via a diaphragm plate 303 for adjusting the amount of light incident on the first lens member 310. A second lens member 320 as an auxiliary optical member provided above 310 and the first lens member 310 are supported, and come into contact with the surface of the imaging element 202 through the opening 201 from the front side of the substrate PC. It is composed of a lens support member 330. The optical axes of the first lens member 310 and the second lens member 320 are the same.
[0056]
The first lens member 310 includes a tubular lower leg portion 310b around the lens portion 310a, and a lower end portion of the lower leg portion 310b is provided with a contact portion 310c that contacts the lens support member 330. . Further, the outer peripheral portion of the first lens member 310 abuts and is fitted to the partition wall 4c of the lens frame 4 to ensure the positioning of the first lens member 310.
[0057]
An upper surface of the tubular lower leg portion 310b of the first lens member 310, around the lens portion 310a, is made of a light-shielding material, and has an opening 303a as an aperture for defining the F number of the lens portion 310a. The aperture plate 303 is fixed with an adhesive.
[0058]
The second lens member 320 has a tubular upper leg 320b around the lens portion 320a, and a diaphragm plate 303 is fixed to the lower surface of the upper leg 320b by an adhesive. Further, the second lens member 320 is moved downward by a predetermined amount in FIG. 11 by the pressing member 7 disposed between the second lens member 320 and the light shielding plate 5. When pressed by a pressing force, the first lens member 310 is urged to the image sensor 202 via the diaphragm plate 303.
[0059]
The lens support member 330 is made of a plastic material having a light-shielding property for preventing internal reflection of the first lens member 310, and is formed at an upper end thereof and abuts on the contact portion 310 c of the first lens member 9. A saucer-shaped support portion 330a that contacts and supports the first lens member 310, a tubular leg 330b formed below the support portion 330a, and a lower leg portion 330b formed below the leg portion 330b. And four contact portions 330c.
[0060]
As described above, in the imaging device 300, by using the first lens member 310 and the second optical member lens member 320 in combination as the optical member 301, the first lens member 310 and the second lens member are used. By combining each of the optical functions 320, etc., the range of functions as an optical member can be expanded. Therefore, even if the imaging device is downsized, a more sophisticated imaging device can be provided.
Note that a configuration is also possible in which a projection is provided below the contact portion 310c of the first lens member 310, and the support portion 330a of the lens support member 330 has a concave portion that can be fitted with the projection. Good. In this case, the first lens member 310 and the lens support member 330 are further fixed, and can be prevented from shifting from a predetermined position.
[0061]
Next, a mobile terminal equipped with the above-described imaging device will be described using the imaging device 100 as an example.
As shown in FIG. 11, the mobile terminal is, for example, a foldable mobile phone T (hereinafter, referred to as a mobile phone T) and includes an upper housing 71 as a case having a display screen D and an operation button P. The lower housing 72 is connected via a hinge 73. The imaging device 100 is incorporated below the display screen D on the inner surface side (the side having the display screen D) of the upper housing 71, and the imaging device 100 (optical member 1) is mounted on the outer surface of the upper housing 71 from the outer surface. It is said to be able to capture light.
[0062]
As described above, by incorporating the thinned imaging device 100 into the mobile phone T, the mobile phone T can be made thinner, and the function of the imaging device 100 can be adjusted according to the distance to the imaging target and the imaging environment. By properly using the mobile phone, it is possible to provide a mobile phone T with high added value. Note that the other components of the mobile phone T are known, and thus description thereof is omitted. In the above-described mobile phone T, the description has been given of the configuration in which the imaging device 100 described in the first embodiment is mounted. However, the imaging device described in the second and third embodiments is used. 200 and 300 may be used. In this case, since the protrusion of the optical member 1 in the optical axis direction is reduced by the thickness of the substrate PC, the thickness of the mobile phone T is reduced.
[0063]
As described above, the present invention has been described with reference to the embodiments. However, the present invention should not be construed as being limited to the above embodiments, and it is needless to say that modifications and improvements can be made as appropriate. For example, in the second and third embodiments, the configuration using the optical member 1 described in the first embodiment has been described, but the optical members 12, 15, and 18, 21 may be mounted.
[0064]
Further, in the optical members described variously, the shapes and the like of the lens members and the lens supporting members constituting the optical members are not limited to those described above. The shape, number, and the like of are not limited. In the lens support member, the shape, the number, and the like of the legs that come into contact with the image sensor are not limited. For example, the lens support member and the image sensor may abut on a rough surface or may abut on a close contact surface.
[0065]
The board PC is not limited to a hard board, but may be a flexible board.
Further, in the present embodiment, a configuration in which a CMOS image sensor is used as the imaging elements 2 and 202 has been described, but a CCD (Charged Coupled Device) image sensor may be used.
It is considered that the imaging device of the present invention can be incorporated in various devices such as a mobile phone, a personal computer, a PDA, an AV device, a television, and home appliances.
[0066]
【The invention's effect】
According to the first aspect of the present invention, the optical member includes the lens member, the supporting portion that supports the lens member, and the lens supporting member that is disposed in contact with the non-imaging region of the image sensor. Therefore, by appropriately changing the lens support member disposed between the lens member and the imaging device / substrate, the relationship between the lens member, the size and the shape of the imaging device and the substrate is not restricted. As a result, the degree of freedom in manufacturing the imaging device is increased.
[0067]
According to the second aspect of the present invention, the lens support member of the optical member that condenses incident light is attached to the image sensor so that the surface of the substrate comes into contact with the surface of the image sensor through the opening. Therefore, the imaging device is reduced in thickness by the thickness of the substrate. Further, since the optical member includes a lens member and a lens support member having a support portion that supports the lens member, by appropriately changing the lens support member interposed between the lens member and the image sensor, the imaging device can be used. Therefore, it is possible to realize the manufacture without being restricted by the relationship between the size and the shape of the lens member, the imaging element, the substrate, and the like, and the degree of freedom in the manufacture is increased.
[0068]
According to the third aspect of the present invention, the same effects as those of the first or second aspect can be obtained, and in particular, the supporting portion such as a lens portion having a size larger than that of the imaging device. Even if the position of the side end portion is outside the image sensor, the image pickup apparatus can be manufactured without any trouble. Thereby, the image pickup device can be formed small regardless of the size of the lens member, and the size of the image pickup device can be reduced.
[0069]
According to the fourth aspect of the present invention, the same effects as those of the first to third aspects of the present invention can be obtained. Therefore, the lens member and the lens supporting member are fixed at a predetermined position, so that the dimensional accuracy of the optical member can be stabilized and a predetermined optical function can be achieved.
[0070]
According to the fifth aspect of the invention, the same effect as that of the fourth aspect of the invention can be obtained, and in particular, the lens member has a projection projecting in a direction perpendicular to the optical axis direction. Since the support portion has a concave portion with an open top for fitting the projection, the lens member can be fitted from above, thereby facilitating manufacture.
[0071]
According to the sixth aspect of the present invention, it is needless to say that the same effects as those of the first to fifth aspects of the present invention can be obtained. In particular, since the lens supporting member has a light shielding property. In addition, internal reflection on the lens member can be prevented.
[0072]
According to the invention as set forth in claim 7, it is needless to say that the same effects as those of the invention as set forth in any one of claims 1 to 6 can be obtained, in particular, between the lens member and the lens support member. Further, it is possible to manufacture an imaging device having a structure in which at least one of the aperture plate and the IR cut filter is inserted.
[0073]
According to the eighth aspect of the invention, it is needless to say that the same effects as those of the first aspect of the invention can be obtained. Since the contact surface that comes into contact with the region is formed with a uniform uneven surface, the lens support member and the imaging element can be dispersed at a multi-point ground, thereby distributing the load of the lens support member. It is suitable.
[0074]
According to the ninth aspect of the present invention, in a relatively small imaging device in which the height of the optical member in the optical axis direction is 10 mm or less, the optical member includes a lens member and a lens support member. By appropriately changing the lens support member interposed between the lens member and the imaging device, the imaging device can be manufactured without any restrictions on the relationship between the size and shape of the lens member, the imaging device, the substrate, and the like. Is realized, and the degree of freedom in manufacturing is increased.
[0075]
According to the tenth aspect of the present invention, the portable terminal in which the imaging device according to any one of the first to ninth aspects is mounted in a case has a degree of freedom in manufacturing based on the imaging device. Increase.
[Brief description of the drawings]
FIG. 1 is a perspective view of an imaging device according to a first embodiment of the present invention.
FIG. 2 is a partially omitted cross-sectional view taken along line II-II of the imaging apparatus of FIG.
FIG. 3 is a perspective view of an optical member.
FIG. 4 is an exploded perspective view showing an optical member and an image pickup device provided in the image pickup apparatus.
FIG. 5 is an exploded perspective view showing Modification Example 1 of an optical member and an image sensor.
FIG. 6 is an exploded perspective view showing a second modification of the optical member.
FIG. 7 is an exploded perspective view showing a third modification of the optical member.
FIG. 8 is an exploded perspective view showing a fourth modification of the optical member and an image sensor.
FIG. 9 is a partially omitted cross-sectional view illustrating an imaging device according to a second embodiment.
FIG. 10 is a plan view of a substrate and an image sensor of the image pickup device of FIG. 9;
FIG. 11 is a partially omitted cross-sectional view illustrating an imaging device according to a third embodiment.
FIGS. 12A and 12B are a front view and a rear view showing an example of a mobile phone incorporating an imaging device according to the present invention.
FIG. 13 is an explanatory diagram for explaining a conventional optical member and its modification.
[Explanation of symbols]
1, 12, 15, 18, 21 optical member
2,202 Image sensor
2a, 202a Photoelectric conversion unit (imaging area)
2b Non-imaging area
3, 13 Aperture plate
4 Mirror frame (housing)
6,14 IR cut filter
9, 310, 320 Lens member
9a, 310a, 320a Lens unit
9d protrusion
10, 330 Lens support member
10a, 330a support
10d recess
100, 200, 300 imaging device
201 Opening
PC board
FPC flexible board (terminal for external connection)
B adhesive
T Foldable mobile phone (mobile terminal)

Claims (10)

撮像素子が設けられた基板と、
前記撮像素子の撮像領域に被写像を結像させる光学部材と、を備える撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持する支持部を備えるとともに、前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
からなることを特徴とする撮像装置。A substrate provided with an imaging element;
An optical member that forms an image on an imaging region of the imaging element,
The optical member,
A lens member,
A lens support member that includes a support portion that supports the lens member, and is disposed in contact with a non-imaging area of the image sensor.
An imaging device comprising: 開口部が形成された基板と、
前記基板の裏面側に、前記開口部の少なくとも一部を塞ぐように取り付けられた撮像素子と、
前記撮像素子の撮像領域に被写像を結像させる光学部材と、を備える撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持する支持部を備えるとともに、前記基板の表面側から前記開口部を通じて前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
からなることを特徴とする撮像装置。A substrate having an opening formed therein,
On the back side of the substrate, an image sensor attached to close at least a part of the opening,
An optical member that forms an image on an imaging region of the imaging element,
The optical member,
A lens member,
A lens support member that includes a support portion that supports the lens member, and is disposed in contact with a non-imaging area of the imaging element through the opening from a surface side of the substrate,
An imaging device comprising: 請求項１又は２に記載の撮像装置において、
前記支持部の外側端部の位置が前記撮像素子よりも外側にあることを特徴とする撮像装置。The imaging device according to claim 1, wherein
An image pickup apparatus, wherein a position of an outer end of the support portion is outside the image pickup device. 請求項１〜３の何れか一項に記載の撮像装置において、
前記支持部において、前記レンズ部材は前記レンズ支持部材に嵌合されていることを特徴とする撮像装置。The imaging device according to any one of claims 1 to 3,
The imaging device according to claim 1, wherein the lens member is fitted to the lens support member in the support portion. 請求項４に記載の撮像装置において、
前記レンズ部材は、光軸方向に垂直な方向に突出する突部を備え、
前記支持部は、前記突部を嵌合する上部が開口した凹部を備えることを特徴とする撮像装置。The imaging device according to claim 4,
The lens member includes a protrusion protruding in a direction perpendicular to the optical axis direction,
The imaging device according to claim 1, wherein the support portion includes a concave portion having an open upper portion for fitting the protrusion. 請求項１〜５の何れか一項に記載の撮像装置において、
前記レンズ支持部材は、遮光性を有することを特徴とする撮像装置。The imaging device according to any one of claims 1 to 5,
The image pickup device, wherein the lens support member has a light shielding property. 請求項１〜６の何れか一項に記載の撮像装置において、
前記レンズ部材と前記レンズ支持部材との間に、絞り板とＩＲカットフィルタのうち少なくとも何れか一方が挿入されていることを特徴とする撮像装置。The imaging device according to any one of claims 1 to 6,
An imaging device, wherein at least one of an aperture plate and an IR cut filter is inserted between the lens member and the lens support member. 請求項１〜７の何れか一項に記載の撮像装置において、
前記レンズ支持部材において、前記撮像素子の非撮像領域上に当接する当接面は、均一な凸凹面に形成されていることを特徴とする撮像装置。The imaging device according to any one of claims 1 to 7,
The imaging device according to claim 1, wherein the contact surface of the lens support member, which is in contact with the non-imaging region of the imaging element, is formed with a uniform uneven surface. 光電変換部を備えた撮像素子と、
前記撮像素子を保持し、且つ電気信号の外部接続用端子を有する基板と、前記光電変換部に被写体画像を結像させる光学部材と、開口部を有し、前記光学部材を覆う遮光性部材からなる筐体とを有する撮像部を備え、前記光学部材の光軸方向の高さが１０ｍｍ以下である撮像装置であって、
前記光学部材は、
レンズ部材と、
前記レンズ部材を支持するとともに、前記撮像素子の非撮像領域に当接して配置されるレンズ支持部材と、
を備えることを特徴とする撮像装置。An image sensor having a photoelectric conversion unit;
A substrate that holds the imaging element and has an external connection terminal for an electric signal, an optical member that forms an image of a subject on the photoelectric conversion unit, and an opening that includes a light-shielding member that covers the optical member. An imaging device comprising: an imaging unit having a housing, wherein a height of the optical member in an optical axis direction is 10 mm or less.
The optical member,
A lens member,
A lens support member that supports the lens member and is disposed in contact with a non-imaging region of the image sensor,
An imaging device comprising: 請求項１〜９の何れか一項に記載の撮像装置がケース内に搭載されていることを特徴とする携帯端末。A mobile terminal, wherein the imaging device according to claim 1 is mounted in a case.
JP2002362708A 2002-12-13 2002-12-13 Imaging apparatus and portable terminal Pending JP2004194223A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002362708A JP2004194223A (en) 2002-12-13 2002-12-13 Imaging apparatus and portable terminal
EP03257695A EP1429168A3 (en) 2002-12-13 2003-12-08 Image sensing device and portable terminal
KR1020030090452A KR20040053804A (en) 2002-12-13 2003-12-12 Image sensing device and portable terminal
TW092135246A TW200425493A (en) 2002-12-13 2003-12-12 Image pickup device and portable terminal
CNA2003101205250A CN1507067A (en) 2002-12-13 2003-12-12 Image sensing equipment and portable terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002362708A JP2004194223A (en) 2002-12-13 2002-12-13 Imaging apparatus and portable terminal

Publications (1)

Publication Number Publication Date
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JP2006227615A (en) * 2005-02-17 2006-08-31 Inventio Ag Lens arrangement for integration into wall, wall-integrated device with connection housing and the lens arrangement, method of installing the device, and transportation installation with the device
US7570880B2 (en) 2005-05-13 2009-08-04 Samsung Electronics Co., Ltd. Auto focus control apparatus for camera module
KR101844475B1 (en) 2010-12-24 2018-04-02 엘지이노텍 주식회사 Camera module and its mamufacturing method
CN105163015A (en) * 2015-09-29 2015-12-16 北京伊神华虹系统工程技术有限公司 Reflection type panoramic camera

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KR20040053804A (en) 2004-06-24
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EP1429168A3 (en) 2004-07-28
TW200425493A (en) 2004-11-16

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