CN108469663B - Assembling process and alignment device for lens assembly and chip assembly - Google Patents
Assembling process and alignment device for lens assembly and chip assembly Download PDFInfo
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- CN108469663B CN108469663B CN201810471395.1A CN201810471395A CN108469663B CN 108469663 B CN108469663 B CN 108469663B CN 201810471395 A CN201810471395 A CN 201810471395A CN 108469663 B CN108469663 B CN 108469663B
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 210000004907 gland Anatomy 0.000 claims description 12
- 238000003384 imaging method Methods 0.000 claims description 7
- 238000007405 data analysis Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 230000007306 turnover Effects 0.000 claims description 3
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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Abstract
The invention discloses an assembly process of a lens component and a chip component, which is characterized by comprising the following steps of clamping the lens component by a six-axis platform and placing the lens component above a reference chip component, shooting a Chart Chart above the reference chip component, calculating and analyzing a shot photo to obtain the optical angle deviation of the lens component, and adjusting the optical angle of the lens component by the six-axis platform; spatial position difference compensation: and detecting the space position of the chip component to be assembled, comparing the space position with the space position of the reference chip component, and adjusting the position of the lens component through the six-axis platform to compensate after the space position difference value of the two is obtained. The invention saves the assembly time and improves the assembly efficiency and precision.
Description
Technical Field
The invention relates to the field of assembly of cameras, in particular to an assembly process of a lens assembly and a chip assembly of a mobile phone camera and an alignment device required in the assembly process.
Background
The assembly flow of the lens component and the chip component of the traditional camera is as follows:
the chip assembly is fed to an assembly station, and the lens assembly is fed to a six-axis platform above the chip assembly or clamped by a six-axis manipulator; dispensing the chip assembly; identifying X, Y, Z positions of the chip components at the assembly station by using CCD components and the like; then correspondingly adjusting the position of the lens component through the six-axis mechanical arm to enable the positions of the lens component and the chip component to be matched; electrifying the chip assembly, shooting a Chart image above the chip assembly through the lens assembly, and calculating and analyzing the shot image to obtain the spatial position deviation of the lens assembly, wherein the spatial position deviation particularly comprises the optical angle deviation, and adjusting the spatial position of the lens assembly through the six-axis platform; and attaching the lens assembly to the chip assembly, and blanking after the dispensing solidification is completed.
The traditional process has the following defects: the whole assembly consumes more time, and in the whole process, particularly, the space position deviation process from the time of electrifying and starting the chip assembly to the time of taking Chart images and finally obtaining the lens assembly through calculation and analysis is high in time consumption; while in this process no other operations can be performed: such as chip assembly feeding, chip assembly X, Y, Z position detection, dispensing, etc., seriously affects assembly efficiency. In addition, in the step of adjusting the space position of the lens component; the lack of a unified or fixed standard reference, the position recognition and position compensation of the chip assembly, and the accuracy and efficiency of the entire alignment of the lens assembly and the chip assembly need to be further improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an assembling process and an aligning device for a lens component and a chip component, which save assembling time and improve assembling efficiency and accuracy.
The aim of the invention is achieved by the following scheme:
a process for assembling a lens assembly and a chip assembly is characterized by comprising the following steps,
the optical angle of the lens component is adjusted by the six-axis platform after the lens component is clamped by the six-axis platform and is arranged above the reference chip component, a Chart image above the reference chip component is shot, and after the shot photo is calculated and analyzed to obtain the optical angle deviation of the lens component, the optical angle of the lens component is adjusted by the six-axis platform;
spatial position difference compensation: and detecting the space position of the chip component to be assembled, comparing the space position with the space position of the reference chip component, and adjusting the position of the lens component through the six-axis platform to compensate after the space position difference value of the two is obtained.
Preferably, the method further comprises:
after the optical angle adjustment and the spatial position difference compensation of the lens component are completed, the lens component is pressed down and attached to the chip component to be assembled through the six-axis platform, and dispensing and/or dispensing curing are performed.
Preferably, in the step of compensating for the spatial position difference, the spatial positions Xb, yb, zb, θxb, θyb of the chip component to be assembled are detected, compared with the spatial positions Xa, ya, za, θxa, θya of the reference chip component, and the spatial position differences Δx, Δy, Δz, Δθx, Δθy of the two are obtained, and then the positions of the lens component are adjusted by the six-axis platform to compensate for the spatial position differences Δx, Δy, Δz, Δθx, Δθy. The optical angle of the lens assembly comprises an optical axis angle theta x, thetay and/or an imaging included angle theta.
Further, in the space position difference compensation process, when the space position of the chip component to be assembled is detected, the position (Xb, yb) of the chip component to be assembled is identified through the CCD component; and measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled through the laser head. In the optical angle adjustment process of the lens assembly, feeding, dispensing or space position detection is synchronously performed on the chip assembly to be assembled.
In addition, in the process that the laser head measures the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled, the problem that the detection accuracy cannot be detected or influenced due to the influence of the bracket of the chip component to be assembled on the laser light is solved, and in the process, the bracket of the chip component to be assembled is preferably fixed at the bottom of the lens component to form the lens component with the chip bracket before the lens component and the chip component are assembled.
The invention also provides an alignment device for aligning the lens component and the chip component before the lens component and the chip component of the camera are assembled, which is characterized in that: the device comprises a six-axis platform, a station assembly, an upper CCD assembly, a laser head and a Chart diagram; the station assembly comprises a station bottom plate, a Y-axis sliding rail and a linear motor; the station bottom plate is provided with a reference station for placing a reference chip component, a station for placing a chip component to be assembled and a lens component clamping station for feeding the lens component; the linear motor can drive the station bottom plate to slide along the Y-axis sliding rail; the upper CCD component is used for detecting the positions Xb and Yb of the chip component to be assembled, and the laser head is used for measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled so as to obtain the space position of the chip component to be assembled; the six-axis platform can clamp the lens assembly and is arranged above the reference chip assembly, and after the optical angle deviation of the lens assembly is obtained by shooting a Chart image above the reference chip assembly, the six-axis platform adjusts the optical angle of the lens assembly; the lens assembly can also be adjusted according to the spatial position difference between the chip assembly to be assembled and the reference chip assembly to compensate for the spatial position difference.
Preferably, the reference station and the station to be assembled of the station bottom plate are respectively provided with a profiling part matched with the chip assembly in shape, and the profiling part is provided with a vacuum adsorption structure.
Preferably, the station assembly further comprises a pogpin assembly, the pogpin assembly comprises a gland, a pogpin connector arranged below the gland, and a mechanism for driving the gland to turn over or open and close, and the pogpin assembly is used for driving the gland pogpin connector to be inserted into the connector on the flat cable of the reference chip assembly after the reference chip assembly is correspondingly placed on the profiling part of the reference station and is adsorbed and fixed in vacuum, so that the reference chip assembly is electrified and started.
Preferably, a calibration block with a plurality of mark points is arranged beside the reference station and/or the station to be assembled of the station bottom plate.
Preferably, the device also comprises a lower CCD assembly, an X-axis gantry and a data analysis box, wherein the X-axis gantry is fixed on a support plate and transversely spans the station assembly along the X axis, and the upper CCD assembly and the laser head are arranged on the X-axis gantry and can slide along the X-axis gantry; the pogpin component is used for electrically connecting the reference chip component with the data analysis box; the lower CCD component is fixedly arranged at a position between the six-axis platform and the station component.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an alignment device according to a preferred embodiment;
FIG. 2 is a schematic view of the station assembly of FIG. 1;
FIG. 3 is a schematic view of the station floor configuration of FIG. 2;
fig. 4 is a schematic diagram of an assembly process in a preferred embodiment.
Detailed Description
A preferred embodiment of the present invention will be further described with reference to the drawings and the embodiments.
Embodiment one:
in a preferred embodiment, an alignment device is configured to align a lens assembly of a camera with a chip assembly before the lens assembly and the chip assembly are assembled.
As shown in fig. 1 to 3, the alignment device includes a six-axis platform 1, a station assembly 2, an upper CCD assembly 31, a lower CCD assembly 32, a laser head 33, an X-axis gantry 34, an electric cabinet 5, and the like. The six-axis platform 1, the station assembly 2 and the lower CCD assembly 32 are fixedly arranged on a support plate 4. The station assembly 2 further comprises a station bottom plate 21, a Y-axis sliding rail 22, a linear motor 23, a pogpin assembly 24, a data analysis box 25 and the like. The Y-axis slide rail 22 and the stator of the linear motor 23 extend along the Y axis, the station bottom plate 21 is fixedly arranged on the mover of the linear motor 23, and two sides of the bottom of the mover of the linear motor 23 are movably connected with the left and right Y-axis slide rails 22 through sliding blocks. The station base plate 21 is provided with a reference station 211 for placing a reference chip component, a station 212 for placing a chip component to be assembled and a lens component clamping station 213 for feeding the lens component. In the preferred process, the reference station 211 and the station to be assembled 212 are respectively provided with a profiling part matched with the shape of the chip assembly, and the profiling part is provided with a vacuum adsorption structure; the lens assembly clamping station 213 is also provided with a profiling part matched with the shape of the lens assembly, and a vacuum adsorption structure is also arranged corresponding to the profiling part. The pogpin assembly 24 comprises a gland, a pogpin connector arranged below the gland, and a mechanism for driving the gland to turn over or open and close. The pogpin assembly 24 is used for driving the gland pogpin connector to be inserted into the connector on the flat cable of the reference chip assembly after the reference chip assembly is correspondingly placed on the profiling part of the reference station 211 and is adsorbed and fixed by vacuum, so as to realize the electric connection between the reference chip assembly and the data analysis box 25. In the preferred process, the lens component clamping station 213 is located between the reference station 211 and the station to be assembled 212, and the lens component clamping station 213, the reference station 211 and the station to be assembled 212 are located at the right side of the station bottom plate 21; the X-axis coordinates of the center positions of the profiling parts of the lens assembly gripping station 213, the reference station 211 and the station to be assembled 212 are the same. In order to facilitate the position recognition of the reference station 211 and the station to be assembled 212, a check block 214 provided with a plurality of mark points is arranged beside the reference station 211 and the station to be assembled 212. As shown in fig. 1, the six-axis stage 1 is disposed on the right side of the station assembly 2, and the lower CCD assembly 32 is fixedly disposed at a position between the six-axis stage 1 and the station assembly 2. The X-axis gantry 34 holds the carriage plate 4 laterally across the station assembly 2 along the X-axis. The upper CCD assembly 31 and the laser head 33 are movably arranged on an X-axis sliding rail of the X-axis gantry 34 through a sliding plate, and can slide along the X-axis. The electric cabinet 5 is used for driving the six-axis platform 1, the station assembly 2, the upper CCD assembly 31, the motion control of the laser head 33, data interaction and the like.
When the alignment device specifically works, the alignment device comprises the following steps,
the upper CCD assembly 31 and the lower CCD assembly 32 establish a unified coordinate system, wherein the upper CCD assembly 31 moves along the X-axis gantry 34, the station bottom plate 21 moves along the Y-axis slide rail 22 under the drive of the linear motor 23, so that the upper CCD assembly 31 is aligned with the calibration block 214 beside the reference station 211 to take a photograph, calculate the coordinate system A of the calibration block 214; the station bottom plate 21 moves a fixed value (the Y-axis difference value between the upper CCD assembly 31 and the lower CCD assembly 32 is a fixed value) along the Y-axis sliding rail 22 under the drive of the linear motor 23 to move the check block 214 beside the reference station 211 to the position right above the lower CCD assembly 32, the lower CCD assembly 32 photographs, the coordinate system B of the check block 214 is calculated, and finally the coordinate systems of the upper CCD assembly 31 and the lower CCD assembly 32 are unified through the calibration of the coordinate system.
Placing a reference chip assembly onto the profiling part of the reference station 211 of the station base plate 21, inserting the pogpin connector of the pogpin assembly 24 into the connector on the flat cable of the reference chip assembly, and electrifying the reference chip assembly, wherein the reference chip assembly is preferably kept in an electrified state all the time so as to be ready for photographing; placing a chip component to be assembled on a profiling part of a station 212 to be assembled of the station bottom plate 21 and fixing the chip component by vacuum adsorption; the six-axis platform 1 clamps the lens assembly from the lens assembly clamping station 213 of the station base plate 21;
the station bottom plate 21 is driven by the linear motor 23 to move along the Y axis, so that a reference chip assembly on the reference station 211 is opposite to a lens assembly on the six-axis platform 1; the electrified reference chip assembly shoots a Chart Chart (not shown in the figure) above through the lens assembly, calculates and analyzes the shot Chart to obtain the spatial position and the spatial position deviation of the lens assembly, and adjusts the spatial position of the lens assembly through the six-axis platform 1 to enable the spatial position to be within assembly tolerance (or enable the spatial position to meet corresponding assembly index requirements such as definition, imaging angle, optical axis perpendicularity and the like). Preferably, the spatial position mainly includes optical angles θx, θy, θz of the lens assembly. Wherein θx, θy, and θz can be understood as the optical axis angles θx, θy, and the imaging angle θz, respectively, of the lens assembly.
Moving the station bottom plate 21 and the station to be assembled 212 to the lower part of the upper CCD assembly 31, photographing through the upper CCD assembly 31 on the X-axis gantry 34, and identifying the positions (Xb and Yb) of the chip assemblies to be assembled; measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled through the laser head 33; the spatial position of the chip component to be assembled is compared with the spatial position (i.e., xa, ya, za, θxa, θya) of the reference chip component to obtain a spatial position difference therebetween, wherein the spatial position (i.e., xa, ya, za, θxa, θya) of the reference chip component is measured only once, and then the spatial position (or placement state) of the reference chip component is kept constant since the reference chip component is always fixed on the reference station 211 of the station base plate 21.
The lens assembly is adjusted through the six-axis platform 1 so as to realize the compensation of the space position difference (delta X, delta Y, delta Z, delta theta X and delta theta Y) between the chip assembly to be assembled and the reference chip assembly. In the preferred process, the delta theta X and the delta theta Y are compensated, then the delta X, the delta Y and the delta Z are compensated, and finally the alignment of the lens component and the chip component to be assembled is completed.
After the alignment of the lens component and the chip component to be assembled is completed, the lens component is pressed down and attached to the chip component through the six-axis platform 1, and finally dispensing and solidification (or dispensing and dispensing solidification) are carried out, so that the assembly of the lens component and the chip component is completed; after the blanking, the next chip component to be assembled and the lens component can be placed in a continuous feeding mode, and the next lens component and the chip component to be assembled are aligned.
Therefore, the reference chip assembly is always electrified, the Chart image above the shot image can be shot through the lens assembly at any time, and the space position of the lens assembly can be analyzed, so that the time consumption of the processes of pogpin connection, electrifying start, shooting wait, shooting and the like on each chip assembly to be assembled is avoided, and the assembly time is greatly saved; in addition, in the optical angle adjustment process of the lens assembly, the steps of feeding, dispensing, even space position identification and the like can be simultaneously carried out on the chip assembly to be assembled, so that the assembly efficiency is further improved; finally, as the reference chip component is used as the reference, the space position of the reference chip component is fixed, the space position of the chip component to be assembled is compared with the reference chip component, the space position deviation of the chip component to be assembled can be rapidly determined, compensation is carried out by adjusting the lens component, rapid alignment is realized, and the efficiency and the precision of the whole alignment process are further improved.
Embodiment two:
the invention also provides a new process for assembling the lens component and the chip component by the aid of the alignment device, wherein the process comprises the steps of adjusting the optical angle of the lens component and compensating the space position difference between the chip component to be assembled and the reference chip component. Wherein,
an optical angle adjusting step of the lens assembly:
the reference chip assembly is electrified, a Chart image above the reference chip assembly is shot through the lens assembly, the shot image is calculated and analyzed, the spatial position of the lens assembly and the spatial position deviation are obtained, and the spatial position of the lens assembly is adjusted through the six-axis platform, so that the lens assembly is within an assembly tolerance (or meets the corresponding assembly index requirements such as definition, imaging angle, optical axis perpendicularity and the like). In particular, the spatial position preferably comprises the optical angles θx, θy, θz of the lens assembly. Wherein θx, θy, and θz can be understood as the optical axis angles θx, θy, and the imaging angle θz, respectively, of the lens assembly. During the step of adjusting the spatial position of the lens assembly, the steps may be performed synchronously: feeding the chip components to be assembled to corresponding assembling stations; dispensing the chip components to be assembled, and the like.
Compensating the space position difference between the chip component to be assembled and the reference chip component:
identifying the space position of the chip component to be assembled, specifically identifying the position (Xb, yb) of the chip component to be assembled through the CCD component; measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled through a laser head; and comparing the space position of the chip component to be assembled with the space position (namely Xa, ya, za, θXa and θya) of the reference chip component to obtain a space position difference value of the two. The lens component is adjusted through the six-axis platform so as to realize the compensation of the space position difference (delta X, delta Y, delta Z, delta theta X and delta theta Y) between the chip component to be assembled and the reference chip component. In the preferred embodiment, Δθx, Δθy are compensated, and then Δx, Δy, and Δz are compensated.
After the space position adjustment of the lens component and the space position difference compensation between the chip component to be assembled and the reference chip component are completed, the lens component is pressed down and attached to the chip component through the six-axis platform, and finally dispensing and solidification (or dispensing and dispensing solidification) are carried out, so that the assembly is completed.
In the process that the laser head measures the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled, the problem that the detection accuracy cannot be detected or influenced due to the influence of the bracket of the chip component to be assembled on laser light is solved, preferably, before the lens component and the chip component are assembled, the bracket of the chip component to be assembled is fixed at the bottom of the lens component to form the lens component with the chip bracket, and then the lens component and the chip component are assembled.
Therefore, compared with the prior art, the standard chip assembly can be always electrified, the Chart image above the shooting can be shot through the lens assembly at any time, and the space position of the lens assembly can be analyzed, so that the pogo pin connection, the electrifying start and the like of each chip assembly to be assembled are not needed, and the time from the pogo pin connection, electrifying start of the chip assembly to be assembled to the last shooting of the process is saved. In addition, in the optical angle adjustment process of the lens assembly, the steps of feeding, dispensing, even space position identification and the like can be simultaneously carried out on the chip assembly to be assembled, so that the time consumption of the optical angle adjustment step of the lens assembly is skillfully utilized, other operations can be synchronously carried out, and the whole assembly time is further saved. In addition, because the reference chip component is used as the reference, the space position of the reference chip component is fixed, the space position of the chip component to be assembled is compared with the reference chip component, the space position deviation of the chip component to be assembled can be rapidly determined, compensation is carried out by adjusting the lens component, rapid alignment is realized, and the efficiency and the precision of the whole alignment process are improved.
The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather should be construed to cover all equivalent structures or equivalent arrangements which are shown in the drawings or which are shown in the drawings, or which are incorporated herein by reference, either directly or indirectly, in other related arts. In addition, where the foregoing description has not been exhaustive, reference may be made to the direct representation of the drawings and the conventional understanding and prior art combinations.
Claims (10)
1. A process for assembling a lens assembly and a chip assembly is characterized by comprising the following steps,
optical angle adjustment of lens assembly: the upper CCD component and the lower CCD component are integrated through the calibration of a coordinate system, the lens component is clamped by the six-axis platform and is arranged above the reference chip component, a Chart image above the reference chip component is shot, and after the shot photo is calculated and analyzed to obtain the optical angle deviation of the lens component, the optical angle of the lens component is adjusted through the six-axis platform;
spatial position difference compensation: detecting the space position of a chip component to be assembled, comparing the space position with the space position of a reference chip component, and adjusting the position of a lens component through a six-axis platform to compensate after the space position difference value of the two is obtained;
in the step of compensating the space position difference, the space positions Xb, yb, zb, thetaXb and thetaYb of the chip component to be assembled are detected, compared with the space positions Xa, ya, za, thetaXa and thetaya of the reference chip component to obtain space position difference values delta X, delta Y, delta Z, delta thetaX and delta thetaY of the two, and then the position of the lens component is adjusted through a six-axis platform to compensate the space position difference values delta X, delta Y, delta Z, delta thetaX and delta thetaY; the optical angle of the lens component comprises an optical axis angle theta x, a theta y and/or an imaging included angle theta z; in the space position difference compensation process, when the space position of the chip component to be assembled is detected, the position (Xb, yb) of the chip component to be assembled is identified through the CCD component; and measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled through the laser head.
2. The process of assembling a lens assembly and a chip assembly of claim 1, further comprising:
after the optical angle adjustment and the spatial position difference compensation of the lens component are completed, the lens component is pressed down and attached to the chip component to be assembled through the six-axis platform, and dispensing and/or dispensing curing are performed.
3. The process of assembling a lens assembly and a chip assembly according to claim 1 or 2, wherein the optical angle of the lens assembly comprises an optical axis angle θx, θy and/or an imaging angle θz.
4. The process of assembling a lens assembly and a chip assembly according to claim 1, wherein a bracket of the chip assembly to be assembled is fixed to a bottom of the lens assembly to form the lens assembly with the chip bracket before assembling the lens assembly and the chip assembly.
5. The process for assembling a lens assembly and a chip assembly according to claim 1, wherein the chip assembly to be assembled is synchronously subjected to feeding, dispensing or spatial position detection during the optical angle adjustment of the lens assembly.
6. An alignment device for before the lens subassembly of camera and chip subassembly equipment, counterpoint lens subassembly and chip subassembly, its characterized in that: the laser device comprises a six-axis platform, a station assembly, an upper CCD assembly, a lower CCD assembly, a test block, a support plate, a laser head and a Chart Chart, wherein the six-axis platform, the station assembly and the lower CCD assembly are arranged on the support plate; the station assembly comprises a station bottom plate, a Y-axis sliding rail and a linear motor; the station bottom plate is provided with a reference station for placing a reference chip component, a station for placing a chip component to be assembled and a lens component clamping station for feeding the lens component; the linear motor can drive the station bottom plate to slide along the Y-axis sliding rail; the upper CCD component is used for detecting the positions Xb and Yb of the chip component to be assembled, and the laser head is used for measuring the height value Zb and the planeness theta Xb and theta Yb of the chip component to be assembled so as to obtain the space position of the chip component to be assembled; the six-axis platform can clamp the lens assembly and is arranged above the reference chip assembly, and after the optical angle deviation of the lens assembly is obtained by shooting a Chart image above the reference chip assembly, the six-axis platform adjusts the optical angle of the lens assembly; the lens assembly can also be adjusted according to the spatial position difference between the chip assembly to be assembled and the reference chip assembly to compensate for the spatial position difference.
7. The alignment device of claim 6, wherein the reference station and the station to be assembled of the station base plate are respectively provided with a profiling part matched with the shape of the chip assembly, and the profiling part is provided with a vacuum adsorption structure.
8. The alignment device of claim 7 wherein the station assembly further comprises a pogon pin assembly, the pogon pin assembly comprises a gland, a pogon pin connector arranged below the gland, and a mechanism for driving the gland to turn over or open and close, wherein the pogon pin assembly is used for driving the gland pin connector to be inserted into a connector on a flat cable of the reference chip assembly when the reference chip assembly is placed on a profiling part of the reference station and is vacuum-adsorbed and fixed, so that the reference chip assembly is powered on and started.
9. The alignment device of claim 8, wherein a calibration block having a plurality of mark points is provided beside the reference station and/or the station to be assembled of the station floor.
10. The alignment device according to any one of claims 6 to 9, further comprising an X-axis gantry and a data analysis box, wherein the X-axis gantry is fixed on a support plate and spans across the station assembly along the X-axis, and the upper CCD assembly and the laser head are mounted on the X-axis gantry and can slide along the X-axis gantry; the pogpin component is used for electrically connecting the reference chip component with the data analysis box; the lower CCD component is fixedly arranged at a position between the six-axis platform and the station component.
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