JP2010157971A - Imaging module, method of manufacturing the same, and electronic information device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid foreign matters on the surface of an image sensor chip and to simplify the structure of an imaging module by reducing the number of constituent components, thereby reducing the number of assembling steps, increasing the accuracy of assembling, and eliminating the need of optical adjustment. <P>SOLUTION: An outer peripheral bottom surface 2d of a lens casing 2 at its back side is provided with a plurality of height-directional positioning parts 2b, which abut directly against the surface of an imaging chip. Since the lens casing 2 for housing condensing lenses 3a, 3b therein is fitted to an outer frame holder 1 to be freely rotatable therein, even if there is a foreign matter D on the surface of the sensor chip (imaging chip), it is possible to avoid the position of the foreign matter D, by making the height-directional positioning parts 2b of the lens casing 2 turn. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides an image pickup device in which an image pickup device having a plurality of light receiving units that photoelectrically convert image light from a subject to image and a lens for imaging incident light on the image pickup device are modularized (integrated). Module, method for manufacturing the same, and digital camera such as a digital video camera and digital still camera using the imaging module as an image input device such as a vehicle-mounted camera in an imaging unit, an image input camera such as a vehicle-mounted camera, and a scanner device Further, the present invention relates to electronic information equipment such as a facsimile apparatus, a television telephone apparatus, a camera-equipped mobile telephone apparatus, and a portable terminal apparatus (PDA).

  This type of conventional imaging module is mainly used in camera-equipped mobile phone devices, personal digital assistants (PDAs), card cameras, etc., and images from subjects on substrates such as ceramics or glass-filled epoxy resin. A solid-state imaging chip provided with an imaging device having a plurality of light receiving units that photoelectrically convert light to image a subject, and a holder member that fixes a lens for imaging incident light on the imaging device are provided. Yes. In this case, it is important to obtain a clear image by accurately fixing the distance between these lenses and the image sensor and forming the incident light on the image sensor with high accuracy.

  As described above, as a method for accurately defining the distance between the lens and the image pickup device, the bottom surface of the lens barrel to which the lens is fixed is directly applied to the periphery of the image pickup device on the solid-state image pickup chip and fixed. 1 is disclosed. First, the imaging module of Patent Document 1 will be described in detail with reference to FIG.

  FIG. 8 is a structural diagram schematically illustrating an exemplary configuration of a main part of a conventional imaging module described in Patent Document 1, wherein (a) is a longitudinal sectional view of the conventional imaging module, and (b) is a conventional one. It is a top view of the imaging module.

  8A and 8B, the conventional imaging module 100 includes a lens unit 101 and an image sensor chip 102. Here, the lens unit 101 includes a lens 101a and a lens barrel 101b that fixes the lens 101a. The image sensor chip 102 is a sensor unit 102a as an image sensor, a logic circuit unit 102b for processing a signal from the sensor unit 102a, and an input / output terminal for connecting the logic circuit unit 102b to the outside. Bonding pad 102c.

  Here, the lens 101 a is an aspherical convex lens and has a function of forming incident light on the surface of the image sensor chip 102.

  The lens barrel 101b has a shape such as a cylindrical shape or a square shape, and supports the lens 101a at a predetermined position on the inner periphery thereof. The lens barrel 101b functions as a lens support portion. The lens support portion does not need to be configured in a cylindrical shape. For example, the lens support section may support the lens 101a from below at a single point or a plurality of points. The bottom surface of the lens barrel 101b is fixed on the logic circuit portion 102b of the image sensor chip 102 in a gap d where the sensor cover 102d is not provided. In this case, since the sensor cover 102d includes the connection portions e extending in four directions, the four lower ends of the lens barrel 101b are mounted on the image sensor chip 102 in the four gaps d other than this portion. It is placed and fixed.

  The lens barrel 101b and the image sensor chip 102 are bonded with, for example, an ultraviolet curable resin. In this case, the bottom surface of the lower end portion of the lens barrel 101b is placed at a predetermined position with respect to the image sensor chip 102, and then an ultraviolet curable resin is used so that the image sensor chip 102 and the lens barrel 101b are bonded. Apply. Alternatively, after the ultraviolet curable resin is applied to one or both of the image sensor chip 102 and the lens barrel 101b, both may be positioned. By irradiating the ultraviolet curable resin with ultraviolet rays, the image sensor chip 102 and the lens barrel 101b are bonded and fixed. Thus, in the conventional camera module 100, since the lens support part (lens barrel 101b) that supports the lens 101a is placed on the image sensor chip 102 and directly fixed, the size can be reduced. Since the member between the lens 101a and the image sensor chip 102 is only the lens support portion (lens barrel 101b), there is little accumulation error in the distance between the lens 101a and the sensor portion 102a of the image sensor chip 102, and the relative relationship between the two is relatively small. The specific position can be set with high accuracy and more certainty.

  The sensor unit 102a of the image sensor chip 102 is an image sensor that is formed on the central surface of the image sensor chip 102, converts optical information into an electric signal, and outputs the signal as an image signal. This image sensor has a large number of read pixels. The sensor unit 102a is, for example, a CCD element or a CMOS element. The sensor unit 102a has a plurality of microchip lenses formed above each reading pixel, and can collect incident light on each reading pixel.

  The logic circuit unit 102b performs various signal processing such as amplification processing and noise removal processing on the imaging signal output from each sensor unit 102a.

  The bonding pad 102c is an input / output terminal that is electrically connected to the logic circuit portion 102b. The bonding pad 102c is electrically connected to an external electrode by wire bonding. For example, the image sensor chip 102 is placed on a wiring board constituting a circuit such as a mobile phone device, a portable terminal device (PDA), a card camera, etc., and these bonding pads 102c and this wiring board are connected by wire bonding. Connect electrically. Further, the image sensor chip 102 is installed on a sub-wiring board on which passive components such as resistors and capacitors, and active parts such as transistors and LSIs are mounted, and the bonding pad 102c and the sub-wiring board are electrically connected by wire bonding. The sub-wiring board can be electrically connected to a mobile phone device, a portable terminal device (PDA), a card camera, or the like.

  The sensor cover 102d is disposed to protect at least the sensor unit 102a, and prevents foreign matter from adhering to the sensor unit 102a. The sensor cover 102d has a contact portion that is fixed to the image sensor chip 102 outside the area of the sensor portion 102a. A gap is formed between the sensor cover 102d and the sensor unit 102a. The sensor cover 102d is formed of, for example, transparent synthetic resin or glass. The synthetic resin includes various resins such as silicon resin, polycarbonate resin, styrene resin, acrylic resin, and nylon resin. The sensor cover 102d is bonded or pressure-bonded on the image sensor chip 102. In the case of bonding, for example, an ultraviolet curable resin is used. The sensor cover 102d is formed at the manufacturing stage of the imaging module, and is continuously attached even at the usage stage of the imaging module. That is, the sensor cover 102d is not removed at the use stage. Accordingly, the upper part of the sensor portion 102a of the sensor cover 102d needs to have transparency in order to allow incident light to pass therethrough. However, the entire sensor cover 102d is not necessarily transparent.

  The distance between the incident surface of the sensor cover 102d, that is, the surface on the lens 101a side, and the surface of the sensor unit 102a needs to be a predetermined distance or more. The incident light that has passed through the lens 101a gradually converges and forms an image on the sensor unit 102a. Therefore, even if a foreign substance of the same size is attached directly to the sensor unit 102a, the incident light passes upward from the sensor unit 102a. The size on the image picked up by the sensor unit 102a differs from the case where the sensor portion 102a is attached on the sensor cover 102d separated by a predetermined distance. Specifically, when the lens 101a is a converging lens, the more the incident surface of the sensor cover 102d moves away from the sensor unit 102a, the smaller the foreign matter attached to the sensor cover 102d appears on the image of the sensor unit 102a. The influence of foreign matter adhesion can be reduced.

  As shown in FIG. 8B, the sensor cover 102d has a connecting portion that connects to the sensor cover 102d of the adjacent image sensor chip 102. This connecting portion is cut during dicing. In the sensor cover 102d, all the chips on the wafer are integrally formed by this connecting portion.

  In order to maintain optical accuracy, the sensor cover 102d is not provided at the contact portion between the lens barrel 101b and the image sensor chip 102 so that the lens barrel 101b and the image sensor chip 102 are in direct contact with each other. A gap (gap d) is provided in the sensor cover 102d. Similarly, in order to facilitate wiring, the sensor cover 102d is not provided on the bonding pad 102c, and a gap of the sensor cover 102d is provided.

  As described above, in Patent Document 1, the bottom surfaces of the four lower end portions of the lens barrel 101b to which the lens 101a is fixed are placed on the image sensor chip 102 and fixed, whereby the distance between the lens 101a and the sensor unit 102a. Is precisely defined. Further, in Patent Document 1, added value such as “IR cut filter”, “diaphragm” and “low pass filter” is added to the sensor cover 102d itself, and four through holes (legs extending from the bottom surface of the lens barrel 101b) are added thereto. The distance between the lens 101a and the sensor unit 102a is accurately defined by extending a leg from the bottom surface of the lens barrel 101b and bringing it into direct contact with the image sensor chip 102.

  Next, the imaging module of Patent Document 2 will be described in detail with reference to FIG. As a method for accurately fixing the distance between the lens and the image sensor, in Patent Document 1, the lens barrel 101b is interposed between the lens 101a and the sensor unit 102a. Patent Document 2 discloses that the distance between the lens and the image sensor is accurately defined by extending the distance to the sensor (distance to the sensor) and pressing the tip portion extended from the lens component onto the chip image sensor. .

  FIG. 9 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of a conventional imaging device disclosed in Patent Document 2.

  In FIG. 9, a conventional imaging apparatus 200 forms a subject image by focusing on a substrate 201, an imaging device 202 disposed on one surface of the substrate 201, and an imaging region of the imaging device 202. An optical member 203, a lens frame (holder member) 204 that covers the optical member 203 and the image sensor 202, a rotating member 205 that is provided on the upper surface (front part) of the lens frame 204 and includes a magnet, A light shielding plate 206 having a light shielding property provided below the rotating member 205, a diaphragm plate 207 provided below the light shielding plate 206 for adjusting the amount of light incident on the optical member 203, and a light shielding plate 206 A pressing member 2 that is provided between the IR cut filter 208 supported by the diaphragm plate 207, the diaphragm plate 207, and the optical member 203, and is a spring that presses the optical member 203 toward the substrate 201. 9, and a positioning electric parts 210 for positioning the lens frame 204. The rotating member 205, the light shielding plate 206, the diaphragm plate 207, and the IR cut filter 208 are defined as the upper end portion 211 (front portion of the holder member) of the lens frame 204.

  The optical member 203 is made of transparent glass or plastic material, and a first lens member 212 disposed on the substrate 201 side (rear side in the optical axis direction) and a first lens member 212 provided above the first lens member 212. The second lens member 213 is provided between the first lens member 212 and the second lens member 213, and a diaphragm 214 that adjusts the amount of light incident on the first lens member 212. The optical axes of the first lens member 212 and the second lens member 213 are the same.

  The first lens member 212 includes a convex lens-shaped first lens portion 212a and a tubular lower leg portion 212b around the first lens portion 212a, and a normal imaging mode is provided at the lower end portion of the lower leg portion 212b. , An abutting portion 212 c that abuts on the surface of the image sensor 202 is formed. Further, the pressing member 209 contacts the upper surface of the lower leg portion 212b. Due to the pressing force (biasing force) of the pressing member 209, the first lens member 212 is pressed toward the substrate 201 in the normal imaging mode. Further, around the first lens portion 212a, a collar portion 212d is formed in a circular shape in plan view outward from the tubular lower leg portion 212b. The focal length of the first lens member 212 is the distance from the lens principal point, but in terms of component dimensions, the distance dimension from the planar position of the collar portion 212d to the abutting portion 212c at the lower end of the lower leg portion 212b is manufactured. It is managed by.

  As a result, a part of the first lens member 212 is extended to the position of the focal length (distance to the sensor), and the distal end portion (lower end contact portion 212c) of the lower leg portion 212b extended from the lower surface of the first lens member 212. ) Can be pressed against the surface of the image sensor 202 so that the distance between the first lens member 212 and the surface of the image sensor 202 can be positioned with high accuracy.

JP 2004-260356 A JP 2004-266340 A

  However, in the conventional imaging module 100 described above, the sensor cover 102d on the sensor unit 102a is provided with added values such as “IR cut filter”, “aperture”, and “low-pass filter” as an integral part of the sensor cover 102d. 8 (a) and FIG. 8 (b), although it is necessary to make up an optical material equivalent to a lens through which light passes, and the sensor cover 102d other than on the sensor portion 102a needs to be shielded from light. In this way, when light is transmitted through the circle inside the gap d and light is shielded outside the circle, only the portion where the foot is projected downward is shielded so that light from the lateral direction does not enter the sensor unit 102a. It is difficult to manufacture. Further, the sensor cover 102d is provided with a through hole (gap d) for bringing the lower end portion of the lens barrel 101b into contact with the image sensor chip 102, and from the lateral direction through the gap d and the like. There is a high possibility that light leaks to the sensor unit 102a, and ghost / flare may occur. Furthermore, in order to position the lens barrel 101b on the image sensor chip 102 and the optical axis of the lens 101a at the center of the sensor unit 102a, dimensional accuracy in the XY directions is also required. Actually, the lower end portion divided into four parts of the lens barrel 101b is passed through the through hole (gap d) of the sensor cover 102d, but there is a dimension between the lower end portion and the through hole (gap d). If there is no allowance (clearance of a predetermined dimension or more), it will not enter smoothly, and if the allowance is large, the dimensional accuracy in the XY directions will be increased. When assembling these, since the number of parts is large and the structure is complicated, there are many management items, the number of assembling steps is required, and problems in assembly accuracy are likely to occur.

  Further, in the conventional imaging apparatus 200 described above, positioning in the Z direction is performed by directly contacting the lower leg portion 212 b extending from the lower surface of the first lens member 212 on the imaging element 202, and the surfaces of the first lens member 212 and the imaging element 202. However, in order to obtain a predetermined lens performance, the mold structure is complicated and accuracy is required. Further, since the pressing force (biasing force) to the sensor chip (imaging element 202) side by the pressing member 209 (spring) is constantly required, the pressing member 209 (spring) is disposed on the upper surface of the first lens member 212. In addition, a separate member that holds and holds the pressing member 209 (spring) is required, which increases the number of parts and the structure. Therefore, when assembling them, the number of parts is large and the structure is complicated, so there are many management items, the number of assembling steps, and problems in assembly accuracy are likely to occur. In addition, the conventional imaging apparatus 200 also requires focus adjustment of the lens position of the first lens member 212 in order to absorb the accuracy of each component, assembly accuracy, and the like when the imaging module is assembled.

  Moreover, as described above, in Patent Document 1, the bottom surfaces of the four lower ends of the lens barrel 101b to which the lens 101a is fixed are placed on and fixed to the image sensor chip 102, whereby the lens 101a and the sensor unit 102a are fixed. In addition, in Patent Document 2, a part of the lens component itself is extended to the focal length (distance to the sensor), and the tip portion extended from the lens component is placed on the image sensor chip. Although the distance between the lens and the image sensor is precisely defined by pressing against the surface of the image sensor chip, if there is a foreign object on the surface of the image sensor chip, the height of the lens and the surface of the image sensor chip will be shifted due to the foreign object. As a result, the optical axis is distorted and the distance accuracy between the lens and the image sensor cannot be guaranteed.

  The present invention solves the above-described conventional problems. Even if there is a foreign object on the surface of the image sensor chip, it can be avoided, and the number of components can be reduced to make the structure simpler. Provided is an imaging module capable of reducing man-hours, improving assembly accuracy, and eliminating the need for optical adjustment, and a manufacturing method thereof, and an electronic information device using the imaging module as an image input device such as a vehicle-mounted rear monitoring camera For the purpose.

  In the imaging module of the present invention, a lens housing that houses a condensing lens for imaging subject light on an imaging chip mounted on a substrate is rotatably fitted in an outer frame holder, The outer frame holder is an imaging module mounted on the substrate so as to cover the imaging chip, and a plurality of height direction positioning portions are arranged on the back side of the lens housing, and the plurality of height direction positionings The portion is directly supported by the surface of the imaging chip, and the distance between the condenser lens and the surface of the imaging chip is defined, whereby the above object is achieved.

  Further, including the pinhole (no lens) in this, the imaging module of the present invention is a condenser lens (one condenser lens or one condenser lens) for imaging subject light on the imaging chip mounted on the substrate. A lens housing having a pinhole (in a state where the condensing lens is not accommodated) is accommodated in the outer frame holder so as to be rotatable, The outer frame holder is an imaging module mounted on the substrate so as to cover the imaging chip, and a plurality of height direction positioning portions are arranged on the back side of the lens housing, and the plurality of height direction positioning portions Is directly supported by the surface of the imaging chip, and the distance between the condensing lens or the pinhole and the surface of the imaging chip is defined, whereby the above object is achieved.

  In the imaging module of the present invention, a lens housing in which an imaging chip is mounted on a substrate and a condensing lens for forming an image of subject light on the imaging chip is accommodated in a recess on the back side of the outer frame holder. The outer frame holder is mounted on the substrate so as to be pivotably fitted into the back side recess and to cover the imaging chip with the back side recess of the outer frame holder so that the back side recess is sealed or semi-sealed. In the imaging module, a plurality of height direction positioning portions that are in direct contact with the surface of the imaging chip are provided on the outer peripheral bottom surface of the back side of the lens housing. Achieved.

  Further, including the pinhole (no lens) in this, the imaging module of the present invention has an imaging chip mounted on a substrate, and a condenser lens (one piece of light) for imaging subject light on the imaging chip. The lens housing that houses the condensing lens or other group condensing lens) in the back side recess, or has a pinhole (a state in which the condensing lens is not accommodated) instead of the condensing lens is inside the back side recess of the outer frame holder. An imaging device in which the outer frame holder is mounted on the substrate so that the imaging chip is covered with a back side recess of the outer frame holder and the inside of the back side recess is sealed or semi-sealed. The module is provided with a plurality of height direction positioning portions that are in direct contact with the surface of the imaging chip on the outer peripheral bottom surface on the back side of the lens housing, thereby achieving the above object. .

  Furthermore, preferably, the plurality of height direction positioning portions in the imaging module of the present invention are two or more. Specifically, the plurality of height direction positioning portions are any one of 2 to 4 places. Further, the plurality of height direction positioning portions are any one of 2 to 6 locations. Further, the plurality of height direction positioning portions may be any one of 2 to 8 locations. Furthermore, there are two or more height direction positioning portions, and of the opposing surfaces of the plane on which the height direction positioning portion protrudes and the surface of the imaging chip, the height direction positioning portion has a protruding tip surface and the imaging chip. The opposing surface that does not contact the surface may be half or less in terms of area.

  Furthermore, preferably, the plurality of height direction positionings are performed so that the connecting side of the plurality of height direction positioning units in the imaging module of the present invention is parallel to at least one of the sides of the imaging chip. Are disposed.

  Further preferably, the height direction positioning portion in the imaging module of the present invention is constituted by a protruding portion protruding in a dotted, linear or planar shape from the outer peripheral bottom surface of the lens housing.

  Still preferably, in the imaging module of the present invention, the projecting portion has a circular tip end surface that contacts the surface of the imaging chip.

  Furthermore, preferably, the protruding portion of the imaging module of the present invention has a tip end surface that abuts on the surface of a positioning region other than the imaging region of the imaging chip.

  Further, preferably, the side wall of the protruding portion in the imaging module of the present invention is configured with a tapered surface.

  Further, preferably, the tapered surface of the protrusion in the imaging module of the present invention has an angle that can avoid the height of the foreign material and the inclined surface.

  Further preferably, the outer frame holder in the imaging module of the present invention has a through hole, and an adhesive is put through the through hole so that the positional relationship between the outer frame holder and the lens housing can be fixed. ing.

  Further preferably, in the imaging module of the present invention, the adhesive material has a light shielding property and / or the through hole is located at a position where the imaging element of the imaging chip does not sense the incoming light from the through hole. Is provided.

  Further preferably, in the imaging module of the present invention, the lens barrel member is constituted by the outer frame holder portion for positioning the optical axis and the lens housing for positioning the focal point.

  Further preferably, in the imaging module of the present invention, the bonding / fixing to the substrate is performed by using the outer frame holder independently of the plurality of height direction positioning portions being supported on the surface of the imaging chip. Done through.

  Still preferably, in the imaging module of the present invention, the installation surface or the installation line and the installation point by the height direction positioning part of the lens housing on the surface of the imaging chip can be selected independently of the adhesion position of the outer frame holder. .

  The image pickup module manufacturing method of the present invention includes a sensor unit forming step for mounting an image pickup chip on a substrate, and a condenser lens for forming an image of subject light on the image pickup chip inside the lens housing. A lens unit forming step of fitting a lens housing accommodating the condenser lens therein in a rotatable manner in an outer frame holder and accommodating the lens housing in this order or in the reverse order; A plurality of height direction positioning portions provided on the back side of the lens housing that accommodates the image pickup chip are brought into contact with the surface of the image pickup chip and the image pickup chip is covered with the outer frame holder. A sensor unit / lens unit combination step is performed in which the outer frame holder is bonded to the substrate with an adhesive so as to be hermetically or semi-hermetically sealed, thereby achieving the above object.

  Furthermore, including a pinhole (without a lens) in this, the method for manufacturing an imaging module according to the present invention includes a sensor unit forming step of mounting an imaging chip on a substrate, and imaging subject light on the imaging chip. The condensing lens is housed in a lens housing, and the condensing lens is housed in the inside or has a pinhole for imaging subject light on the imaging chip instead of the condensing lens. The lens unit forming step of fitting the lens housing in the outer frame holder so as to be rotatable and accommodating the lens housing in this order or in the reverse order is performed, and the lens housing in which the condenser lens is accommodated is performed. A plurality of height direction positioning portions provided on the back side are brought into contact with the surface of the imaging chip and covered on the imaging chip by the outer frame holder, and in this state, the interior is sealed or semi-sealed Outer frame hol - a and performs a sensor unit lens unit combining step of bonding by an adhesive on the substrate, the object can be achieved.

  Preferably, in the imaging module manufacturing method of the present invention, the sensor unit / lens unit combination step may be configured such that the outer frame holder together with the lens casing is attached to the substrate on which the imaging chip is mounted. It is placed after being aligned by an automatic assembly device that recognizes a planar image.

  Furthermore, preferably, in the case where a foreign object at the surface position of the imaging chip that is in contact with the height direction positioning portion in the manufacturing method of the imaging module of the present invention is optically detected beforehand by an optical microscope, the position of the foreign object is determined. The lens frame is mounted with the position of the positioning member in the height direction of the lens housing rotated by a predetermined amount with respect to the outer frame holder.

  The electronic information device of the present invention uses the above-described imaging module of the present invention as an image input device in an imaging unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, a lens housing that houses a condensing lens for forming an image of subject light on an imaging chip mounted on a substrate is fitted in the outer frame holder so as to be rotatable. The frame holder is an imaging module mounted on the substrate so as to cover the imaging chip, and a plurality of height direction positioning portions are arranged on the back side of the lens housing, and the plurality of height direction positioning portions are The distance between the condenser lens and the surface of the imaging chip is regulated by being directly supported by the surface of the imaging chip.

  As a result, the lens housing that houses the condensing lens is rotatably fitted in the outer frame holder, so that even if there is a foreign object on the surface of the imaging chip, the lens housing is positioned in the height direction. If the part is rotated, the position of the foreign object can be avoided, and the number of component parts can be reduced to make the structure simpler, thereby reducing the number of assembly steps and improving the assembly accuracy and eliminating the need for optical adjustment. Become.

  As described above, according to the present invention, since the lens case that houses the condenser lens is rotatably fitted in the outer frame holder, the lens case can be used even if there is a foreign object on the surface of the imaging chip. By rotating the body height direction positioning part, it is possible to avoid the position of foreign substances, and reduce the number of components to make it simpler, thereby reducing the assembly man-hours and improving the assembly accuracy, Optical adjustment is unnecessary.

It is a longitudinal cross-sectional view which shows typically the example of a principal part structure of the imaging module which concerns on Embodiment 1 of this invention. It is a longitudinal cross-sectional view which decomposes | disassembles and typically shows each member of the imaging module of FIG. (A)-(c) is a longitudinal cross-sectional view which shows typically the manufacturing method of the imaging module of FIG. 1 for every manufacturing process. It is principal part sectional drawing which shows typically the reset operation | movement when the height direction positioning part in the lens housing | casing of FIG. It is a top view for demonstrating that a height direction positioning part rotates with a lens case when the height direction positioning part in the lens case of FIG. 1 rides on a foreign material. (A)-(c) is an arrangement | positioning at the time of planarly viewing the arrangement | positioning state of the height direction positioning part in the lens housing | casing of FIG. As Embodiment 2 of this invention, it is a block diagram which shows the example of schematic structure of the electronic information apparatus which used the solid-state imaging device containing the imaging module 10 of Embodiment 1 of this invention for the imaging part. FIG. 2 is a structural diagram schematically illustrating a configuration example of a main part of a conventional imaging module described in Patent Document 1, wherein (a) is a longitudinal sectional view of the conventional imaging module, and (b) is a conventional imaging module. It is a top view. FIG. 10 is a vertical cross-sectional view schematically showing a configuration example of a main part of a conventional imaging device disclosed in Patent Document 2.

  Referring to the drawings, Embodiment 1 of an imaging module of the present invention and Embodiment 2 of an electronic information device such as a camera-equipped mobile phone apparatus using Embodiment 1 of the imaging module as an image input device in an imaging unit will be described below. The details will be described.

(Embodiment 1)
FIG. 1 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of an imaging module according to Embodiment 1 of the present invention.

  In FIG. 1, an imaging module 10 according to the first embodiment is fitted into an outer frame holder 1 as a dustproof and light shielding case, and the outer frame holder 1 so as to be rotatable about an optical axis C. The lens housing 2, the first condenser lens 3a and the second condenser lens 3b accommodated above and below the lens housing 2, and between the first condenser lens 3a and the second condenser lens 3b The light shielding film 4 provided, the substrate 5, the sensor chip 6 as a solid-state imaging chip provided on the substrate 5, and the first step portion 2 a in the lens housing 2 are fixed to the second light collection. The IR cut filter 7 disposed across the lens 3b and the sensor chip 6 and the height direction positioning portion 2b provided on the outer peripheral bottom surface 2d of the lens housing 2 are directly supported on the surface of the sensor chip 6. Outer frame holder in state It is possible to fix the positional relationship between the outer frame holder 1 and the lens housing 2 by being filled from the bonding portion 8 for bonding the outer peripheral bottom surface 1c and the surface of the substrate 5 and the fixing hole 9a of the outer frame holder 1. And a fixing member 9.

  The imaging module 10 includes a lens housing 2, a first condensing lens 3a, a light shielding film 4, a second condensing lens 3b, an IR cut filter 7, and a substrate disposed in this lens housing 2 in order from the top. The sensor chip 6 on 5 is covered with the outer frame holder 1 and the substrate 5 so that the inside is sealed or semi-sealed.

  The outer frame holder 1 is provided with a step 1a as an appearance, the upper part from the step 1a is cylindrical, the lower part from the step 1a is a quadrangular cylindrical shape, and the lower surface side is open. The outer frame holder 1 is formed of a resin casing that has a thin outer wall thickness and can shield and seal or semi-seal the inside. The outer frame holder 1 is arranged on the upper surface of the casing, that is, on the cylindrical upper surface of the step 1a. A circular hole 1b (or a circular transparent region) for passing incident light is formed as a first circular hole facing the optical lens 3a. The first condensing lens 3a and the light-shielding film from the back side of the open bottom of the outer frame holder 1 so that the optical axis C of the first condensing lens 3a and the second condensing lens 3b passes through the center of the circular hole 1b. 4 and the second condenser lens 3b can be positioned by sequentially inserting their circular outer shapes into the circular recesses of the outer frame holder 1 in this order. The outer convex portion of the lens housing 2 is fitted in the concave portion on the back surface of the outer frame holder 1. If the concave portion on the rear surface and the convex portion on the outer shape are circular shapes that are rotatable with respect to each other, the lower portion from the step 1 a is circular in plan view. Here, the outer shape of the outer frame holder 1 below the step 1a is rectangular or square (quadrangle cylinder shape) in plan view.

  The outer frame holder 1 focuses the incident light on the imaging area 6a of the sensor chip 6 by the first condenser lens 3a and the second condenser lens 3b so as to form an image. A height-direction positioning portion 2b placed on the outer frame holder 1 and the lens housing 2 itself with its own weight protrudes from the outer peripheral bottom surface 2d on the back side of the lens housing 2 in a tapered shape. The height-direction positioning portion 2b of the lens housing 2 rides on and comes into contact with the surface of the sensor chip 6, whereby the first condenser lens 3a and the second condenser lens 3b and the imaging area of the sensor chip 6 The distance in the height direction (Z direction) from 6a is accurately defined.

  That is, it protrudes from the outer peripheral bottom surface 2d of the lens housing 2 from the concave bottom surface (the top surface into which the lens enters) on the back side of the lens housing 2 where the first condensing lens 3a and the second condensing lens 3b are accommodated and positioned. The distance in the height direction to the end face (tip face) of the height direction positioning portion 2b can be accurately managed within the tolerance in manufacturing parts. Accordingly, the lens housing 2 is directly positioned on the upper surface of the sensor chip 6 by the height direction positioning portion 2b, whereby the first condensing lens 3a and the second condensing lens 3b fixed to the lens housing 2 and the sensor. The distance from the upper surface of the chip 6 can be accurately positioned in the vertical direction (Z direction), and the component accuracy, the assembly accuracy, and the mounting accuracy can be improved. The imaging module 10 with no focus adjustment can be realized simply by placing it on the upper surface of the lens.

  The first condensing lens 3a and the second condensing lens 3b are a combined lens for focusing the subject light on the imaging region 6a of the sensor chip 6 to form an image, and a transparent acrylic plastic material or glass material. Etc.

  The light shielding film 4 is black as an antireflection treatment and is positioned between the outer peripheral side lower surface (plane) of the first condenser lens 3a and the outer peripheral side upper surface (plane) of the second condenser lens 3b. A circular hole 4a (or a circular transparent region) as a second circular hole for passing incident light having a smaller diameter than the circular hole 2c at the center of the upper surface of the lens housing 2 is a circular hole of the outer frame holder 1. 1b and the circular hole 2c are provided concentrically (coincident with the optical axis C) at the center. The circular hole 4a (or circular transparent region) of the light shielding film 4 is a stop for preventing the occurrence of flare. That is, the circular hole 4a is set to have an opening diameter that does not cause flare in consideration of the lens characteristics of the first condenser lens 3a and the second condenser lens 3b. For example, oblique light having an inclination of 50 degrees to 60 degrees is applied to incident light from the vertical direction (height direction), and the level of an imaging signal (diffuse reflected noise level) by the oblique light is a predetermined reference value (display) Set the aperture diameter so that it is at a level that is smaller than the level of screen roughness.

  The sensor chip 6 includes a plurality of photoelectric conversion units (a plurality of photoelectric conversion units) configured to photoelectrically convert light in which incident light from a subject has transmitted through the first condenser lens 3a and the second condenser lens 3b in the central imaging region 6a. The solid-state imaging device is formed in a matrix. This solid-state imaging device can be applied to both a CMOS image sensor and a CCD image sensor. In the CMOS image sensor, a signal readout circuit that is connected to each other by a multilayer wiring layer and that selects a photoelectric conversion unit and outputs a signal from the photoelectric conversion unit is provided for each unit pixel unit. In a CCD image sensor, a plurality of photoelectric conversion units are two-dimensionally provided on a light receiving surface of an imaging region, and signal charges photoelectrically converted by the photoelectric conversion units are read to the charge transfer unit CCD and sequentially transferred in a predetermined direction. After that, the charge detection unit sequentially detects the charges in batch, not for each light receiving unit, and amplifies and outputs the signal as an imaging signal.

  The infrared (IR) cut filter 7 is spanned and fixed between the first step portions 2a of the lens housing 2 so as to cross over the sensor chip 6, and the first condensing lens 3a and the second condensing lens. Infrared light is cut from incident light that has passed through the lens 3b.

  A method for manufacturing the imaging module 10 having the above configuration will be described in detail.

  FIG. 2 is a longitudinal sectional view schematically showing each constituent member of the imaging module 10 of FIG. 1 in an exploded manner. FIGS. 3A to 3C show a method for manufacturing the imaging module of FIG. It is a longitudinal cross-sectional view typically shown for each manufacturing process.

  As shown in the lens unit manufacturing process in FIG. 2 and FIG. 3A, first, the outer frame holder 1 having a circular hole 1b (or a circular transparent region) in the middle is faced up, and the inside of the circular recess on the back side. Then, the lens housing 2 is inserted and fitted from the front side with the back side facing up. At this time, the lens housing 2 is rotatable within the circular recess of the outer frame holder 1.

  Furthermore, after the first condenser lens 3a is inserted and positioned to the end (bottom surface) in the circular recess on the back side of the lens housing 2, a light shielding film 4 having a circular hole 4a in the middle is further formed thereon. The first condenser lens 3a is inserted up to the outer peripheral plane part, and the second condenser lens 3b is inserted from above the light shielding film 4, and the inner circumference of the circular condenser between the second condenser lens 3b and the lens housing 2 is inserted. Put the adhesive between the faces and fix.

  Further, the infrared (IR) cut filter 7 is bonded and fixed over the first stepped portion 2 a of the circular recess on the back side of the lens housing 2. In this way, the lens housing 2 is accommodated at a predetermined position inside the outer frame holder 1, and further, in the lens housing 2, the first condenser lens 3 a, the light shielding film 4, and the second condenser lens 3 b. And the lens unit 11 in which the infrared (IR) cut filter 7 is accommodated in a predetermined position inside can be manufactured.

  On the other hand, as shown in the sensor unit manufacturing process of FIGS. 2 and 3A, the sensor chip 6 is mounted at a predetermined position on the substrate 5, and a plurality of sensor chips 6 are arranged along the opposite sides (two sides) of the sensor chip 6. The input / output pad (not shown) and a predetermined terminal (not shown) of the substrate 5 are wire-bonded by a wire or the like, or the through electrode of the sensor chip 6 is formed on the predetermined terminal (not shown) of the substrate 5. A plurality of terminals are connected by soldering. As a result, the sensor unit 12 having the sensor chip 6 mounted on the substrate 5 can be manufactured.

  Next, as shown in the optical axis adjustment and sensor unit / lens unit combination process of the sensor module 10 in FIG. 3B, the substrate 5 on which the sensor chip 6 is mounted is positioned with respect to an automatic assembly apparatus (not shown). The planar image of the sensor chip 6 is image-recognized by the image recognition function of the automatic assembly apparatus, and first, the adhesive 8 corresponds to the predetermined position on the substrate 5 (the lower end of the outer wall of the outer frame holder 1) by the automatic assembly apparatus. Further, the lens unit 11 is mounted on the sensor unit 12 with high accuracy and accuracy by the automatic assembly apparatus.

  In this case, the optical axis adjustment of the imaging module 10 is performed when the lens housing 2 is assembled into the outer frame holder 1. After the lens unit 11 is manufactured, when the sensor unit 11 and the lens unit 12 are combined, the hand means of the automatic assembly apparatus projects from the bottom surface 2d of the lens housing 2 for positioning in the height direction (Z direction). The first positioning lens 3a and the second condensing lens 3a held inside the lens housing 2 are placed directly on the surface of the sensor chip 6 by the weights of the outer frame holder 1 and the lens housing 2 due to their own weights. The distance between the condenser lens 3b and the imaging region at the center of the sensor chip 6 can be accurately positioned in the height direction.

  Since the sensor chip 6 is a silicon chip and it is difficult to make a dent on the surface, the positioning accuracy in the plane (XY) direction is high as the accuracy of mounting by the image recognition function of the automatic assembly apparatus. . In addition, as shown in FIG. 4, the side wall of the height direction positioning portion 2b of the lens housing 2 is configured with a tapered surface 2b1 (the tapered surface may be slightly swollen). When the positioning member 2b in the height direction rides on the foreign matter D on the surface of the sensor chip 6, the lens housing 2 is tilted together with the outer frame holder 1, but the tapered surface 2b1 (foreign matter is formed along the inclined surface of the foreign matter D. D is an adhesive particle, etc., and the tip surface of the foreign material D slips on the surface of the sensor chip 6 without the foreign material D automatically. Be guided to. At this time, as shown in FIG. 5, the lens housing 2 itself rotates in the circular recess of the outer frame holder 1, and the tip surface of the height direction positioning portion 2 b of the lens housing 2 is the surface of the sensor chip 6. Rotate and move directly on the surface without foreign material D.

  In addition, although the case where the height direction positioning part 2b of the lens housing | casing 2 automatically avoids the foreign material D was demonstrated like this Embodiment 1, not only this but the presence or absence of the foreign material D is optically observed with an optical microscope etc. When detecting in advance, the positional relationship between the outer frame holder 1 and the lens housing 2 (the circular lens housing 2 is marked with respect to the rectangle or square of the outer frame holder 1). The lens case 2 is inserted in a circular recess of the outer frame holder 1 so as to remove the foreign substance D at a predetermined position from the positional relationship (the outer frame holder 1 of the lens case 2). It may be turned on the surface of the sensor chip 6 so as to remove the foreign matter D when mounted on the sensor chip 6.

  Here, the front end surface of the height direction positioning portion 2b of the lens housing 2 is automatically slid down on the foreign matter D. Since the tapered surface is formed on the side wall of the height direction positioning portion 2b of the lens housing 2, the front end surface of the height direction positioning portion 2b is automatically slipped down on the foreign matter D.

  In short, in the first embodiment, the lens case 2 is centered on the optical axis C in the circular recess on the back surface of the outer frame holder 1 by dividing it into the outer frame holder 1 and the lens case 2 that is rotatable inside. Rotating and the height direction positioning portion 2b can automatically remove the foreign matter D. The surface of the sensor chip 6 on which the height direction positioning portion 2b of the lens housing 2 is placed may be a positionable region (peripheral circuit region or the like) other than the effective pixel region at the center of the chip. The surface height of the region and the like is preferably the same height region as the effective pixel region from the viewpoint of accuracy.

  As described above, the image of the chip shape of the sensor chip 6 on the substrate 5 is recognized by an automatic assembly device (not shown), and the lens housing 2 with a built-in lens is installed on the upper frame holder 1 from above. In this case, if the wires are wire-bonded to the two opposing sides, the height direction positioning portion 2b is placed on the chip end edges of the other two opposing sides. At this time, the lower end of the outer peripheral side wall of the outer frame holder 1 is set so as to float slightly from the surface of the substrate 5 (for example, about 0.2 μm). Thus, the inside of the outer frame holder 1 is brought into a sealed state or a semi-sealed state (including a case where the adhesive does not completely enter during the float). Thereby, the imaging module 10 assembled with high precision in the plane (XY) direction can be manufactured.

  Subsequently, as shown in the final position fixing step of the imaging module 10 in FIG. 3C, the fixing member 9 (adhesive) is inserted from the fixing hole 9 a of the outer frame holder 1, thereby the outer frame holder 1 and the lens. The positional relationship with the housing 2 can be fixed. At this time, since the light guide from the fixing hole 9a of the outer frame holder 1 is sealed and shielded by the fixing member 9, no light leaks to the inside.

  As described above, according to the first embodiment, the height direction positioning portion 2b of the lens housing 2 can automatically or in advance select the surface of the sensor chip 6 without the foreign matter D. Even if the foreign matter D is present at the positioning position, the height direction positioning portion 2b of the lens housing 2 can slide down the inclined surface of the foreign matter D and come into contact with another surface position. The initial distance accuracy with respect to the imaging surface can be ensured.

  Further, since the lens housing 2 is positioned with respect to the substrate 5 as in the prior art, a part of the lens housing 2 (height direction positioning portion 2b) is directly placed on the upper surface of the sensor chip 6. As a result, the number of parts of the imaging module 10 can be greatly reduced as compared with the prior art, and the configuration can be simplified. The condensing lenses 3a and 3b and the sensor chip 6 fixed in the circular recess of the lens housing 2 can be obtained. Can be accurately positioned in the vertical direction (Z direction), and component accuracy, assembly accuracy, and mounting accuracy can be improved, and a focus-adjustable camera module can be realized. .

  As described above, by directly positioning the sensor chip 6 using the height direction positioning portion 2b of the lens housing 2 that is rotatable inside at an arbitrary position on the upper surface of the sensor chip 6, the accuracy of the optical axis adjustment and the in-focus adjustment is improved. Each can be improved independently, and a camera module free of focus adjustment can be realized. Further, by assembling the lens case 2 with respect to the lens case 2 by directly contacting the reference surface (height direction positioning portion 2b) of the “lens case 2” with the upper surface of the sensor chip 6, Although there may be variations in accuracy and variations in the molding accuracy of the lens housing 2, it is much less than the conventional structure, and a focus adjustment-free structure can be realized.

  In addition, when assembling, the lens integrated structure of the outer frame holder 1 and the lens housing 2 is aligned and attached to the sensor chip 6 and the substrate 5 set with high precision by an automatic assembly device, so that the plane direction (XY Direction) can be minimized and the positioning can be performed with high accuracy.

  Furthermore, in the novel structure of the present invention, the outer frame holder 1 with an integrated lens structure seals the inside so as to cover the sensor chip 6 fixed on the substrate 5 from above, so that light leakage from the outside to the inside is prevented. Since it does not occur and has a hermetic or semi-hermetic structure, there is no intrusion of dust inside, and no dust adheres to the imaging area of the sensor chip 6 inside.

  In the first embodiment, the height direction positioning portion 2b of the cylindrical lens housing 2 protrudes from the outer peripheral bottom surface 2d of the lens housing 2 and faces 2 as shown in FIG. 6C. However, the present invention is not limited to this, and as shown in FIG. 6A, the height direction positioning portion is arranged so that the connecting shape of each height direction positioning portion 2b is parallel to each side of the sensor chip 6. 4b may be arranged at four places, and as shown in FIG. 6B, the height direction positioning is performed so that the connection shape of each height direction positioning portion 2b is parallel to at least one side of the sensor chip 6. Three portions 2b may be disposed, and two height direction positioning portions 2b are disposed so that the connecting shape of each height direction positioning portion 2b is parallel to one side of the sensor chip 6. May be.

(Embodiment 2)
FIG. 7 is a block diagram illustrating a schematic configuration example of an electronic information device using, as an imaging unit, a solid-state imaging device including the imaging module 10 according to the first embodiment of the present invention as the second embodiment of the present invention.

  In FIG. 7, the electronic information device 20 of the second embodiment obtains a color image signal by performing various signal processing on the image pickup signal from the image pickup module 10 of the first embodiment, and uses the color image signal as a predetermined signal for recording. A memory unit 21 such as a recording medium that can record data after processing, and a display such as a liquid crystal display device that can display the color image signal on a display screen such as a liquid crystal display screen after performing predetermined signal processing for display. Means 22, a communication means 23 such as a transmission / reception device that enables communication processing after the color image signal is subjected to predetermined signal processing for communication, and printing after the color image signal is subjected to predetermined print signal processing for printing And an image output means 24 such as a printer which can be processed. The electronic information device 20 is not limited to this, and may include at least one of a memory unit 21, a display unit 22, a communication unit 23, and an image output unit 24 such as a printer. .

  As described above, the electronic information device 20 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear monitoring camera, and a television phone camera. An electronic apparatus having an image input device such as an image input camera, a scanner device, a facsimile device, a television phone device, a camera-equipped mobile phone device, and a portable terminal device (PDA) can be considered.

  Therefore, according to the second embodiment, based on the color image signal, the image is displayed on the display screen, or the image output unit 24 prints it out on the paper. This can be satisfactorily communicated as communication data in a wired or wireless manner, can be stored in the memory unit 92 by performing a predetermined data compression process, and various data processes can be satisfactorily performed.

  Although not particularly described in the first embodiment, a lens housing 2 that accommodates condensing lenses 3a and 3b for forming an image of subject light on a sensor chip 6 mounted on the substrate 5. Is fitted in a rotatable manner within the outer frame holder 1, and the outer frame holder 1 is an imaging module mounted on the substrate 5 so as to cover the sensor chip 6. The vertical direction positioning portion 2b is disposed, and the plurality of height direction positioning portions 2b are directly supported by the surface of the sensor chip 6, and the distance between the condensing lenses 3a and 3b and the surface of the sensor chip 6 is defined. . A lens housing 2 having a sensor chip 6 mounted on the substrate 5 and accommodating condenser lenses 3 a and 3 b for forming an image of subject light on the sensor chip 6 inside the back side recess is provided on the outer frame holder 1. The outer frame holder-1 is mounted on the substrate 5 so as to be pivotably fitted in the backside recess and to cover the sensor chip 6 with the backside recess of the outer frame holder-1 so that the inside of the backside recess is sealed or semi-sealed. In the imaging module, a plurality of height direction positioning portions 2b that are in direct contact with the surface of the imaging chip are provided on the outer peripheral bottom surface 2d on the back side of the lens housing 2.

  As a result, the lens housing 2 containing the condensing lenses 3a and 3b is rotatably fitted in the outer frame holder 1, so that foreign matter D is present on the surface of the sensor chip 6 (imaging chip). However, the height direction positioning portion 2b of the lens housing 2 can be rotated to avoid the position of the foreign matter D, and the number of components can be reduced to make the configuration simpler, thereby reducing the number of assembly steps. And the assembly accuracy can be improved, and the object of the present invention can be achieved.

  Further, although not specifically described in the first embodiment, the imaging module of the present invention including a pinhole (without a lens) forms subject light on the sensor chip 6 mounted on the substrate 5. Condensing lenses 3a and 3b (including one condensing lens and other group condensing lenses) are accommodated inside, or pinholes (a state where no condensing lens is accommodated) are used instead of the condensing lenses A lens housing 2 is rotatably fitted in the outer frame holder 1, and the outer frame holder 1 is an imaging module mounted on the substrate 5 so as to cover the sensor chip 6. A plurality of height direction positioning portions 2b are arranged on the back side, and the plurality of height direction positioning portions 2b are directly supported by the surface of the sensor chip 6, and the condensing lenses 3a and 3b or the pinholes and the sensor chip 6 table The distance between the may be prescribed. Also, a sensor chip 6 is mounted on the substrate 5, and condenser lenses 3a and 3b (including one condenser lens and other group condenser lenses) for imaging subject light on the sensor chip 6 are provided on the back side. A lens housing 2 that is housed in the recess or has a pinhole (a state in which the condenser lens is not housed) instead of the condenser lens is rotatably fitted in the rear recess of the outer frame holder 1, An imaging module in which the outer frame holder-1 is mounted on the substrate 5 so that the sensor chip 6 is covered with a backside recess of the outer frame holder-1 and the inside of the backside recess is sealed or semi-sealed. A plurality of height direction positioning portions 2b that are in direct contact with the surface of the imaging chip may be provided on the outer peripheral bottom surface 2d on the back side.

  Furthermore, in the first embodiment, the plurality of height direction positioning portions 2b in the imaging module of the present invention are two or more, and the case of four or less is described. However, the present invention is not limited to this, and the plurality of heights. The direction positioning part 2b may be any of 2 to 6 locations, or may be any of 2 to 8 locations. Furthermore, there are two or more height direction positioning portions 2b, and the surface between the surface on which the height direction positioning portion 2b protrudes (the surface including the height direction positioning portion 2b and the outer peripheral bottom surface 2d) and the surface of the sensor chip 6 is opposed. Among them, the opposing surface (outer peripheral bottom surface 2d) where the height direction positioning portion 2b does not contact the protruding tip surface and the surface of the sensor chip 6 may be half or less in area.

  Although not particularly described in the first embodiment, the height direction positioning portion 2b is configured by a protruding portion that protrudes in a dotted, linear, or planar shape from the outer peripheral bottom surface 2d of the lens housing 2. .

  As mentioned above, although this invention was illustrated using preferable Embodiment 1, 2 of this invention, this invention should not be limited and limited to this Embodiment 1,2. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of the specific preferred embodiments 1 and 2 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention provides an image pickup device in which an image pickup device having a plurality of light receiving units that photoelectrically convert image light from a subject to image and a lens for imaging incident light on the image pickup device are modularized (integrated). Module, method for manufacturing the same, and digital camera such as a digital video camera and digital still camera using the imaging module as an image input device such as a vehicle-mounted camera in an imaging unit, an image input camera such as a vehicle-mounted camera, and a scanner device In the field of electronic information equipment such as facsimile devices, television telephone devices, mobile phone devices with cameras, and personal digital assistants (PDAs), even if there are foreign objects on the surface of the image sensor chip, it can be avoided, Reduce the number of components to make the structure simpler, thereby reducing the assembly man-hours and To improve the standing precision, can be dispensed with optical adjustment.

1 Outer frame holder 1a Step 1b, 2c, 4a Circular hole (transparent circular area)
1c, 2d Outer peripheral bottom surface 2 Lens housing 2a First step portion 2b Height direction positioning portion (protruding portion)
3a 1st condensing lens 3b 2nd condensing lens 4 light shielding film 5 board | substrate 6 sensor chip (imaging chip)
6a Imaging area 7 IR cut filter 8 Adhesion 9 Fixing member 9a Fixing hole (or fixing hole or through hole)
DESCRIPTION OF SYMBOLS 10 Imaging module C Optical axis 11 Lens unit 12 Sensor unit 20 Electronic information equipment 21 Memory part 22 Display means 23 Communication means 24 Image output means

Claims (18)

  A condensing lens for imaging the subject light on the imaging chip mounted on the substrate is housed inside, or a lens housing having a pinhole instead of the condensing lens rotates in the outer frame holder The outer frame holder is an imaging module mounted on the substrate so as to cover the imaging chip, and a plurality of height direction positioning portions are arranged on the back side of the lens housing, An imaging module in which a plurality of height direction positioning portions are directly supported by the surface of the imaging chip, and a distance between the condenser lens or the pinhole and the surface of the imaging chip is defined.   An imaging chip is mounted on the substrate, and a lens housing that houses a condensing lens for forming an image of subject light on the imaging chip inside the back side recess, or has a pinhole instead of the condensing lens, The outer frame is rotatably fitted into the back side recess of the outer frame holder, and the imaging chip is covered with the back side recess of the outer frame holder so that the inside of the back side recess is sealed or semi-sealed. An imaging module to which a holder is attached, wherein a plurality of height direction positioning portions that are in direct contact with the surface of the imaging chip are provided on the outer peripheral bottom surface on the back side of the lens housing.   The plurality of height direction positioning portions are two or more and six or less locations, or at two or more locations, of the opposing surfaces of the surface on which the height direction positioning portion protrudes and the surface of the imaging chip, 3. The imaging module according to claim 1, wherein an opposing surface where the height direction positioning portion does not contact the protruding tip surface and the surface of the imaging chip is less than half in area.   4. The plurality of height direction positioning portions are arranged so that the connection-shaped sides of the plurality of height direction positioning portions are parallel to at least one of the sides of the imaging chip. The imaging module described in 1.   The imaging module according to claim 1, wherein the height direction positioning portion is configured by a protruding portion that protrudes in a dot shape, a linear shape, or a planar shape from an outer peripheral bottom surface of the lens housing.   The imaging module according to claim 5, wherein the protruding portion has a circular end surface that contacts the surface of the imaging chip.   The imaging module according to claim 5, wherein a tip surface of the protruding portion is in contact with a surface of a positioning region other than the imaging region of the imaging chip.   The imaging module according to claim 5, wherein a side wall of the protruding portion is configured by a tapered surface.   The imaging module according to claim 8, wherein the tapered surface of the protruding portion has an angle that can avoid the height of the foreign matter and the inclined surface.   The through-hole is formed in the said outer frame holder, The adhesive material is put through this through-hole, and the positional relationship of this outer-frame holder and the said lens housing | casing is fixable. Imaging module.   The said adhesive material has light-shielding property, and / or the said through-hole is provided in the position where the image pick-up element of the said imaging chip does not sense the approach light from this through-hole. Imaging module.   The imaging module according to claim 1 or 2, wherein a lens barrel member is configured by the outer frame holder portion for positioning the optical axis and the lens housing for performing in-focus positioning.   The bonding / fixing to the substrate is performed via the outer frame holder independently of the plurality of height direction positioning portions being supported on the surface of the imaging chip. The imaging module described.   The imaging module according to claim 1 or 2, wherein an installation surface or an installation line and an installation point by a height direction positioning portion of the lens housing on the surface of the imaging chip can be selected independently of an adhesion position of the outer frame holder. . A sensor unit forming step of mounting an imaging chip on a substrate;
A condensing lens for forming an image of subject light on the imaging chip is accommodated inside the lens housing, and the condensing lens is accommodated inside or a lens housing having a pinhole instead of the condensing lens. The lens unit forming step of fitting the body in the outer frame holder so as to be freely rotatable and housed in the inside is performed in this order or in the reverse order.
A plurality of height direction positioning portions provided on the back side of the lens housing that houses the condenser lens are brought into contact with the surface of the imaging chip and the imaging chip is covered with the outer frame holder. A method for manufacturing an imaging module, wherein a sensor unit / lens unit combination step is performed in which the outer frame holder is adhered to the substrate with an adhesive so as to hermetically or semi-hermetically seal the interior.   In the sensor unit / lens unit combining step, the outer frame holder together with the lens housing is aligned with the substrate on which the imaging chip is mounted by an automatic assembly device that recognizes a planar image of the imaging chip. The manufacturing method of the imaging module of Claim 15 mounted.   When a foreign object at the surface position of the imaging chip that is in contact with the height direction positioning unit is optically detected in advance by an optical microscope, the lens is placed on the outer frame holder so as to remove the position of the foreign object. The method for manufacturing an imaging module according to claim 15 or 16, wherein the imaging module is mounted in a state where the position of the height direction positioning portion of the housing is rotated by a predetermined amount.   An electronic information device using the imaging module according to claim 1 as an image input device in an imaging unit.