CN112543270B - Method and device for quickly assembling camera with AA - Google Patents
Method and device for quickly assembling camera with AA Download PDFInfo
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- CN112543270B CN112543270B CN202011398128.XA CN202011398128A CN112543270B CN 112543270 B CN112543270 B CN 112543270B CN 202011398128 A CN202011398128 A CN 202011398128A CN 112543270 B CN112543270 B CN 112543270B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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Abstract
The invention provides a quick AA assembling method of a camera, which is characterized in that a reference chip is fixedly arranged at an AA station, so that a lens is actively aligned with the reference chip at the AA station to obtain position posture data of the lens, namely first data; the method comprises the steps of obtaining position posture data, namely second data, of a chip to be mounted on an assembly station and a reference chip on an AA station respectively, and calculating the first data and the second data to obtain a target position of a lens on the assembly station, so that the chip to be mounted with glue dispensed is solidified with the lens on the assembly station to obtain a finished product material, and the chip to be mounted on the assembly station does not need to be electrified or actively aligned; the assembly station does not need to be electrified, and the lens and the chip are not shielded in the curing process, so that the curing effect is improved; the dispensing station and the AA process are executed in parallel, so that the assembly efficiency is improved; in addition, the reference chip is always fixed on the AA station, so that the jig mechanism and the circuit design are simplified, and the assembly cost is reduced.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a method and a device for quickly assembling an AA (advanced micro-electro mechanical system) of a camera.
Background
The semiconductor is widely applied to the fields of mobile phones, automobiles, sensors and the like, the technology of the semiconductor serving as a core component of the mobile phones and computers is increasingly enhanced, the social demand is gradually increased, the semiconductor tends to be miniaturized, and the manufacturing quantity is huge.
With the gradual increase of the requirements of the camera, the requirements on the manufacturing precision of the semiconductor are also increased. In the semiconductor manufacturing process, an optical Active Alignment apparatus, i.e., an Active Alignment (AA) process, is usually required. The AA process can adjust all six degrees of freedom of the camera to realize the alignment function, and is a commonly used adjustment process in the prior art.
At present, the existing AA technology is that an AA lens and a chip are firstly used, then the chip exits from an AA area, glue drawing is started, after glue drawing is finished, the AA area returns for UV curing, and finally a finished module is obtained and exits from the AA area. The whole process is serial, and the dispensing and the AA share a chip transmission module. When the AA operates, the dispensing module is idle; when the dispensing module operates, AA is idle; the efficiency of the equipment is limited and difficult to promote.
In addition, each chip needs to be electrified and imaged in the AA technological process, the chip transmission module needs to be provided with a movable electrified jig, the jig is high in stability requirement and high in cost, and the jig can influence the solidification precision of the AA and the dispensing module due to the fact that the space is idle.
Disclosure of Invention
In view of this, the present invention provides a method and an apparatus for fast AA assembling a camera, in which a reference chip is fixedly disposed at an AA station to improve assembling efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme:
the camera rapid AA assembling method provided by the embodiment of the invention comprises the following steps:
conveying the chip to be mounted to a dispensing station under the action of the transmission module and dispensing to obtain a first chip to be mounted;
the first chip to be mounted is conveyed to an assembly station under the action of the transmission module;
the camera lens is conveyed to an AA station under the action of the transmission module, a reference chip is arranged at the AA station, and the reference chip is fixedly arranged at the AA station; the lens and the reference chip are actively aligned to obtain position and posture data of the lens after active alignment action, and the position and posture data is recorded as first data;
the data measuring instrument acquires attitude data of the first chip to be mounted and the reference chip at the assembly station and records the attitude data as second data; the second data comprises plane coordinates, relative heights and plane angles of the surfaces of the first chip to be mounted and the reference chip;
the lens is conveyed to the assembling station under the action of the transmission module; and calculating a target position of the lens according to the first data and the second data, and curing the lens and the first chip to be mounted to obtain a finished product material.
Preferably, after the step of conveying the chip to be packaged to the dispensing station under the action of the transmission module, the method further comprises the following steps:
positioning the chip to be mounted by using the image positioning module;
and the dispensing module is used for dispensing the positioned chip to be mounted to obtain the first chip to be mounted.
Preferably, a reference chip is arranged at the AA station, and the lens and the reference chip perform active alignment action; further comprising:
the reference chip is fixedly arranged in the lighting jig at the AA station;
the transmission assembly moves the lens to a position right above the lighting fixture;
and performing active alignment action of the lens and a reference chip under the action of the image acquisition mechanism and the adjusting mechanism at the AA station to obtain the first data.
Preferably, in the step of acquiring the posture data of the first chip to be mounted and the reference chip at the assembly station by the data measuring instrument, the method further includes:
and the image measuring instrument of the data measuring instrument measures the plane position data of the first chip to be mounted and the reference chip.
Preferably, in the step of acquiring the posture data of the first chip to be mounted and the reference chip at the assembly station by the data measuring instrument, the method further includes:
and the 3D contourgraph of the data measuring instrument measures the relative height and the plane angle of the first chip to be mounted and the reference chip.
Preferably, before the step of conveying the chip to be packaged to the dispensing station, the method further comprises:
and taking the chip to be loaded out of the chip tray mechanism of the chip loading station and conveying the chip to the dispensing station by using the conveying module.
Preferably, before the step lens is transmitted to the AA station, the method further comprises:
taking the lens out of a lens tray mechanism of the lens feeding station and conveying the lens to the AA station by using a transmission module.
Preferably, the lens or the chip is clamped by clamping jaws on a six-axis module of the transmission module so as to be conveyed.
The invention also provides a camera rapid AA device, which comprises:
the dispensing station comprises an image positioning module and a dispensing module; the image positioning module is used for positioning the chip, and the dispensing module is used for dispensing the positioned chip to obtain a first chip to be mounted;
the device comprises an AA station, a power supply station and a power supply station, wherein the AA station comprises an image acquisition mechanism, an adjusting mechanism and a lighting fixture, and a reference chip is fixedly mounted on the lighting fixture; under the action of the image acquisition mechanism and the adjusting mechanism, the lens and the reference chip perform active alignment action;
the assembling station is arranged between the dispensing station and the AA station; the assembling station comprises a data measuring instrument and a curing lamp, and the data measuring instrument is used for measuring the attitude data of the first chip to be assembled and the lens; the curing lamp is used for curing glue between the lens and the first chip to be mounted;
and the transmission module is used for transmitting the chip to be packaged and the lens among the dispensing station, the AA station and the assembling station.
Preferably, the method further comprises the following steps:
the chip feeding station is arranged adjacent to the dispensing station; the chip feeding station comprises a chip tray mechanism for storing chips;
a lens loading station, wherein the lens loading station is arranged adjacent to the AA station; the lens feeding station comprises a lens tray mechanism for storing lenses;
a finished product material blanking station, wherein the finished product material blanking station is arranged adjacent to the assembly station; and the finished product material blanking station is used for blanking the finished product material on the assembling station.
The technical scheme of the invention at least has one of the following beneficial effects:
the invention discloses a quick AA assembly method and a quick AA assembly device of a camera.A reference chip is fixedly arranged at an AA station, so that a lens is actively aligned with the reference chip at the AA station to obtain position and posture data of the lens, namely first data; the method comprises the steps of obtaining position posture data, namely second data, of a chip to be mounted on an assembly station and a reference chip on an AA station respectively, and calculating the first data and the second data to obtain a target position of a lens on the assembly station, so that the chip to be mounted with glue dispensed is solidified with the lens on the assembly station to obtain a finished product material, and the chip to be mounted on the assembly station does not need to be electrified or actively aligned; the assembly station does not need to be electrified, and the lens and the chip are not shielded in the curing process, so that the curing effect is improved;
the dispensing station and the AA process are executed in parallel, so that the assembly efficiency is improved; in addition, the reference chip is always fixed on the AA station, so that the jig mechanism and the circuit design are simplified, and the assembly cost is reduced.
Drawings
Fig. 1 is an overall flowchart of a method for quickly assembling an AA camera according to an embodiment of the present invention;
FIG. 2 is a logic diagram of a method for assembling a camera with a quick AA according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a camera quick AA device according to an embodiment of the present invention;
FIG. 4a is a schematic diagram illustrating a position state of a reference chip and a lens in an AA station before an active alignment operation according to an embodiment of the present invention;
FIG. 4b is a schematic diagram illustrating a position state of a reference chip and a lens after an active alignment operation in the AA station according to the embodiment of the present invention;
fig. 4c is a schematic diagram illustrating a position state of a chip to be mounted and a lens in an assembly station according to an embodiment of the present invention.
Reference numerals:
1. the method comprises the following steps of chip loading, 2, a first chip to be loaded, 3, a reference chip, 4, a lens, 10, a chip loading station, 20, a dispensing station, 210, a dispensing module, 220, an image positioning module, 30, an assembling station, 310, a curing lamp, 320, a 3D (three-dimensional) contourgraph, 330, an image measuring instrument, 40, an AA (advanced) station, 410, an image acquisition mechanism, 50, a six-axis module, 60, a lens loading station, 70 and a finished product material unloading station.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
First, a camera quick AA assembling method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the method for assembling a camera quickly AA according to the embodiment of the present invention includes the following steps:
s1, the chip 1 to be packaged is conveyed to the glue dispensing station 20 under the action of the transmission module and is subjected to glue dispensing to obtain a first chip 2 to be packaged.
S2, the first chip 2 to be mounted is transported to the assembling station 30 by the transporting module.
S3, the lens 4 is conveyed to an AA station 40 under the action of the transmission module, a reference chip 3 is arranged at the AA station 40, and the reference chip 3 is fixedly arranged at the AA station 40; the lens 4 and the reference chip 3 perform active alignment action to obtain position and posture data of the lens after the active alignment action, and the position and posture data is recorded as first data.
S4, acquiring attitude data of the first chip to be mounted 2 and the reference chip 3 at the assembly station 30 by the data measuring instrument, and recording the attitude data as second data; the second data includes the plane coordinates, the relative height and the plane angle of the surfaces of the first chip to be mounted 2 and the reference chip 3.
S5, the lens 4 is conveyed to the assembly station 30 under the action of the transmission module; and calculating the target position of the lens according to the first data and the second data, and curing the lens 4 and the first chip to be mounted 2 to obtain a finished product material. According to the assembling method, the reference chip 3 is fixedly arranged on the AA station 40, so that the lens is actively aligned with the reference chip 3 on the AA station 40, and position posture data, namely first data, of the lens 4 is obtained; obtaining a target position of the lens 4 on the assembly station 30 by obtaining position posture data, namely second data, of the first chip to be assembled on the assembly station 30 and the reference chip 3 on the AA station 40 respectively and calculating the first data and the second data, so that the chip to be assembled 1 with glue dispensed is cured on the assembly station 30 and the lens 4 to obtain a finished product material, and the first chip to be assembled 2 on the assembly station 30 does not need to be electrified and actively aligned; the assembly station 30 does not need to be electrified, and the lens 4 and the chip are not shielded in the curing process, so that the curing effect is improved;
the dispensing station 20 and the AA process are executed in parallel, so that the assembly efficiency is improved; in addition, the reference chip 3 is always fixed on the AA station 40, so that the jig mechanism and the circuit design are simplified, and the assembly cost is reduced.
In an embodiment of the present invention, step S1 further includes:
positioning the chip 1 to be mounted by using the image positioning module 220; the dispensing module 210 dispenses the positioned chip 1 to be mounted to obtain a first chip 2 to be mounted. The transmission module conveys the chip 1 to be packaged to the dispensing station 20, the dispensing station 20 dispenses the chip 1 to be packaged to obtain a first chip 2 to be packaged, and the first chip 2 to be packaged is the glued chip 1 to be packaged.
It should be noted that: the glue dispensed on the first chip 2 is a curing glue, i.e. a fluid state before curing by the curing lamp 310.
In an embodiment of the present invention, in step S3, the method further includes:
the reference chip 3 is fixedly arranged in the lighting jig at the AA station 40;
the transmission assembly moves the lens 4 to be right above the lighting fixture;
and performing active alignment action of the lens 4 and the reference chip 3 under the action of the image acquisition mechanism 410 and the adjusting mechanism at the AA station 40 to obtain first data. The reference chip 3 is fixedly installed in the lighting fixture of the AA station 40, and the transmission assembly transfers the lens to a position right above the reference chip 3 to perform active alignment. When the active alignment action is completed, current attitude data, i.e., first data, of the current lens 4 is acquired.
In step S4, the method further includes:
the image measuring instrument 330 of the data measuring instrument measures the plane position data of the first chip 2 to be mounted and the reference chip 3.
The 3D profile 320 of the data measuring instrument measures the relative height and plane angle of the first to-be-mounted chip 2 and the reference chip 3.
Specifically, as shown in fig. 4a, 4b, and 4c, the method comprises the following steps:
firstly, measuring a reference chip 3 by an image measuring instrument 330 to obtain a plane coordinate (X1, Y1); measuring a first chip 2 to be mounted to obtain a plane coordinate (X2, Y2);
secondly, measuring the reference chip 3 by the 3D profiler 320 to obtain a plane height Z1 angle (Tx1, Ty 1); measuring the first chip to be mounted 2 to obtain the plane height Z2 angle (Tx2, Ty 2);
step three, the transmission module picks up the lens 4 and actively aligns the lens 4 with the reference chip 3 to obtain the optimal position and angle of the lens 4: (X3, Y3, Z3, Tx3, Ty 3);
in the fourth step, the target position of the lens 4 on the first chip to be mounted is: (X4, Y4, Z4, Tx4, Ty 4); wherein, X4 is X3-X1+ X2, Y4 is Y3-Y1+ Y2, Z4 is Z3-Z1+ Z2, Tx4 is Tx3-Tx1+ Tx2, Ty4 is Ty3-Ty1+ Ty 2.
It should be noted that: only six-dimensional attitude data of the reference chip 3 need to be acquired during the first measurement to obtain target attitude data of the lens; in the following measurement process, only the six-dimensional attitude data of the first chip to be mounted needs to be acquired, because the six-dimensional attitude data of the reference chip 3 is invariant.
In an embodiment of the present invention, before step S1, the method further includes:
the chip 1 to be loaded is taken out from a chip tray mechanism of the chip loading station 10 and is conveyed to the dispensing station 20 by utilizing a conveying module, and the chip tray mechanism is used for storing a plurality of chips 1 to be loaded.
In step S3, the method further includes picking up the lens 4 from the lens tray mechanism of the lens loading station 60 and transferring the lens to the AA station 40 by using the transfer module, so that the lens 4 and the reference chip 3 perform an active alignment action.
The transmission module is preferably a six-axis module 50, and the six-axis module 50 includes a clamping jaw for clamping the lens 4 or the chip to clamp and convey the lens 4 or the chip. The six-axis module 50 includes three translation axes of XYZ, and a holding jaw at a shaft end for picking up and fixing the lens 4 around the three rotation axes of XYZ.
The present invention also provides a camera rapid AA device, as shown in fig. 3, including: the device comprises a dispensing station 20, an AA station 40, an assembling station 30 and a transmission module;
the dispensing station 20 includes an image positioning module 220 and a dispensing module 210; the image positioning module 220 is used for positioning the chip, and the dispensing module 210 is used for dispensing the positioned chip to obtain the first chip 2 to be mounted.
The AA station 40 comprises an image acquisition mechanism 410, an adjusting mechanism and a lighting fixture, and a reference chip 3 is fixedly arranged on the lighting fixture; under the action of the image acquisition mechanism 410 and the adjustment mechanism, the lens 4 and the reference chip 3 perform active alignment action. The AA station 40 can be matched with a relay lens and a chart for imaging; and can also be matched with a collimator for imaging.
The assembling station 30 is arranged between the dispensing station 20 and the AA station 40; the assembly station 30 includes a data measuring instrument and a curing lamp 310, the data measuring instrument is used for measuring the attitude data of the first chip 2 to be mounted and the lens 4; the curing lamp 310 is used for curing the glue between the lens 4 and the first chip 2 to be mounted. The data measuring instrument comprises an image measuring instrument 330 for measuring 2D data and a 3D contourgraph 320 for measuring 3D data, wherein the 3D contourgraph 320 can select a laser 3D sensor and is matched with a single-axis linear module to realize surface type measurement; a linear three-dimensional mechanism optical sensor can be selected to directly measure the surface type of the whole chip; and a point laser or point spectrum displacement sensor can be selected and matched with an XY double-axis linear module to measure a plurality of points on the plane of the chip and calculate the surface type.
The transmission module is used for transmitting the chip to be mounted and the lens 4 among the dispensing station 20, the AA station 40 and the assembling station 30. The transmission module is constructed by a multi-axis linear motion platform; or a multi-axis manipulator is selected.
Further, the apparatus further comprises: a chip feeding station 10, a lens feeding station 60 and a finished product material discharging station 70;
wherein, the chip feeding station 10 and the dispensing station 20 are arranged adjacently; the chip loading station 10 includes a chip tray mechanism for storing chips. The lens feeding station 60 is arranged adjacent to the AA station 40; the lens loading station 60 includes a lens tray mechanism for storing the lenses 4. The finished product material blanking station 70 is arranged adjacent to the assembly station 30; the finished product material blanking station 70 is used for blanking the finished product material on the assembly station 30.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A quick AA assembling method for a camera is characterized by comprising the following steps:
the chip (1) to be mounted is conveyed to a glue dispensing station (20) under the action of the transmission module and is subjected to glue dispensing to obtain a first chip (2) to be mounted;
the first chip (2) to be mounted is conveyed to an assembly station (30) under the action of the transmission module;
the lens (4) is conveyed to an AA station (40) under the action of the transmission module, a reference chip (3) is arranged at the AA station (40), and the reference chip (3) is fixedly arranged at the AA station (40); the lens (4) and the reference chip (3) perform active alignment action to obtain position and posture data of the lens (4) after the active alignment action, and the position and posture data is recorded as first data;
the data measuring instrument acquires attitude data of the first chip to be mounted (2) and the reference chip (3) at the assembly station (30) and records the attitude data as second data; the second data comprise plane coordinates, relative heights and plane angles of the surfaces of the first chip to be mounted (2) and the reference chip (3);
the lens (4) is conveyed to the assembly station (30) under the action of the transmission module; and calculating a target position of the lens (4) according to the first data and the second data, and curing the lens (4) and the first chip (2) to be mounted to obtain a finished product material.
2. The method for rapidly assembling the AA in the camera according to claim 1, wherein after the step of conveying the chip (1) to be assembled to the dispensing station (20) under the action of the transmission module, the method further comprises the following steps:
positioning the chip (1) to be mounted by using an image positioning module (220);
and the dispensing module (210) is used for dispensing the positioned chip (1) to be mounted to obtain the first chip (2) to be mounted.
3. The camera rapid AA assembly method according to claim 1, characterized in that a reference chip (3) is arranged at the AA station (40), and the lens (4) and the reference chip (3) perform active alignment action; further comprising:
the reference chip (3) is fixedly arranged in the lighting jig at the AA station (40);
the transmission assembly moves the lens (4) to a position right above the lighting fixture;
and performing active alignment action of the lens (4) and the reference chip (3) under the action of the image acquisition mechanism and the adjusting mechanism at the AA station (40) to obtain the first data.
4. The camera rapid AA assembling method according to claim 1, further comprising, in the step of acquiring the attitude data of the first chip to be mounted (2) and the reference chip (3) at the assembling station (30) by a data measuring instrument:
an image measuring instrument (330) of the data measuring instrument measures plane position data of the first chip to be mounted (2) and the reference chip (3).
5. The camera rapid AA assembling method according to claim 4, further comprising, in the step of acquiring the attitude data of the first chip to be mounted (2) and the reference chip (3) at the assembling station (30) by a data measuring instrument:
and the 3D profile meter of the data measuring instrument measures (320) the relative height and plane angle of the first chip to be mounted (2) and the reference chip (3).
6. The camera rapid AA assembly method according to claim 1, further comprising, before the step of transferring the chip (1) to be mounted to the dispensing station (20):
and taking the chip (1) to be loaded out of the chip tray mechanism of the chip loading station (10) and conveying the chip tray mechanism to the dispensing station (20) by using a conveying module.
7. The camera quick AA assembly method according to claim 1, further comprising, before the step of transferring the lens (4) to the AA station (40):
taking the lens (4) out of a lens tray mechanism of the lens feeding station (60) and conveying the lens to the AA station (40) by using a transmission module.
8. The method for rapid AA assembly of cameras according to any one of claims 1 to 7, wherein the lens or the chip is gripped by a gripper on a six-axis module of the transfer module for transferring the two.
9. A camera rapid AA device, comprising:
a dispensing station (20), wherein the dispensing station (20) comprises an image positioning module (220) and a dispensing module (210); the image positioning module (220) is used for positioning the chip, and the dispensing module (210) is used for dispensing the positioned chip to obtain a first chip to be mounted;
the device comprises an AA station (40), wherein the AA station (40) comprises an image acquisition mechanism (410), an adjusting mechanism and a lighting fixture, and a reference chip (3) is fixedly mounted on the lighting fixture; under the action of the image acquisition mechanism (410) and the adjusting mechanism, the lens (4) and the reference chip (3) perform active alignment action;
an assembly station (30), the assembly station (30) being disposed between the dispensing station (20) and the AA station (40); the assembling station (30) comprises a data measuring instrument and a curing lamp (310), wherein the data measuring instrument is used for measuring attitude data of the first chip to be assembled (2) and the lens (4); the curing lamp (310) is used for curing glue between the lens (4) and the first chip (1) to be mounted;
and the transmission module is used for transmitting the chip (1) to be packaged and the lens (4) among the dispensing station (20), the AA station (40) and the assembling station (30).
10. The camera quick AA apparatus of claim 9, further comprising:
the chip feeding station (10), wherein the chip feeding station (10) and the dispensing station (20) are arranged adjacently; the chip feeding station (10) comprises a chip tray mechanism for storing chips;
the lens feeding station (60) is arranged adjacent to the AA station (40); the lens feeding station (60) comprises a lens tray mechanism for storing lenses;
a finished product material blanking station (70), wherein the finished product material blanking station (70) is arranged adjacent to the assembly station (30); the finished product material blanking station (70) is used for blanking the finished product material on the assembling station (30).
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CN202011398128.XA CN112543270B (en) | 2020-12-03 | 2020-12-03 | Method and device for quickly assembling camera with AA |
PCT/CN2020/136050 WO2022116259A1 (en) | 2020-12-03 | 2020-12-14 | Fast aa assembly method and device for camera |
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CN202011398128.XA CN112543270B (en) | 2020-12-03 | 2020-12-03 | Method and device for quickly assembling camera with AA |
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CN113245825B (en) * | 2021-06-16 | 2022-03-11 | 苏州天准科技股份有限公司 | Assembling method and equipment for double-camera AA of camera |
CN113245823B (en) * | 2021-06-16 | 2021-11-19 | 苏州天准科技股份有限公司 | Rotating disc device with plugging function and camera assembling equipment |
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CN107838672A (en) * | 2017-10-17 | 2018-03-27 | 歌尔股份有限公司 | Optics module assembles device and method |
CN108745779A (en) * | 2018-05-24 | 2018-11-06 | 深圳中科精工科技有限公司 | A kind of high-precision double-station AA devices |
CN209735946U (en) * | 2019-01-31 | 2019-12-06 | 浙江图元智能装备科技有限公司 | Self-lubricating bearing graphite particle automatic assembling machine for spatial installation of camera |
CN209390218U (en) * | 2019-03-25 | 2019-09-13 | 宁波舜宇仪器有限公司 | A kind of camera module AA equipment |
CN209982634U (en) * | 2019-03-28 | 2020-01-21 | 宁波舜宇光电信息有限公司 | Camera module focusing assembly system, lens assembly and photosensitive assembly parameter acquisition device |
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CN112543270A (en) | 2021-03-23 |
WO2022116259A1 (en) | 2022-06-09 |
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