JP2009147898A - Image capturing module, method for manufacturing the image capturing module, and electronic information device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decrease man-hour for assembly, to improve assembly accuracy and to eliminate the need of optical adjustment by having simpler configuration by decreasing the number of components. <P>SOLUTION: A holder member (height direction positioning section 1b) is directly placed partially on an upper face of a sensor chip 5 from a structure where the holder member 1 is positioned onto a substrate 4. Thus, a simple configuration is provided by remarkably reducing the number of components of an image capturing module 10 in comparison with the prior arts, and positioning can be accurately performed, in a vertical direction (Z axial direction) for a distance between condenser lenses 2a, 2b fixed on the holder member 1 and the upper face of the sensor chip 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides an image pickup device in which an image pickup device having a plurality of light receiving units that photoelectrically convert image light from a subject to image and a lens for imaging incident light on the image pickup device are modularized (integrated). Module and manufacturing method thereof, and this imaging module is used in an imaging unit as an image input device such as an in-vehicle camera, for example, a digital camera such as a digital video camera and a digital still camera, an image input camera such as an in-vehicle camera, a scanner, The present invention relates to electronic information equipment such as a facsimile, a mobile phone with camera, and a portable terminal (PDA).

  This type of conventional imaging module is mainly used in camera-equipped mobile phone devices, personal digital assistants (PDAs), card cameras, etc., and images from subjects on substrates such as ceramics or glass-filled epoxy resin. A solid-state image pickup chip having an image pickup device having a plurality of light receiving units that photoelectrically convert light to pick up an object, and a holder member to which a lens for forming an image of incident light on the image pickup device is fixed. In this case, it is important to obtain a clear image by accurately fixing the distance between these lenses and the image sensor and forming the incident light on the image sensor with high accuracy.

  As described above, as a method for accurately defining the distance between the lens and the image pickup device, the bottom surface of the lens barrel to which the lens is fixed is directly applied to the periphery of the image pickup device on the solid-state image pickup chip and fixed. 1 is disclosed. First, the imaging module of Patent Document 1 will be described in detail with reference to FIG.

  FIG. 8 is a structural diagram schematically illustrating an exemplary configuration of a main part of a conventional imaging module described in Patent Document 1, wherein (a) is a longitudinal sectional view of the conventional imaging module, and (b) is a conventional one. It is a top view of the imaging module.

  In FIG. 8, a conventional imaging module 100 includes a lens unit 101 and an image sensor chip 102. Here, the lens unit 101 includes a lens 101a and a lens barrel 101b that fixes the lens 101a. The image sensor chip 102 is a sensor unit 102a as an image sensor, a logic circuit unit 102b for processing a signal from the sensor unit 102a, and an input / output terminal for connecting the logic circuit unit 102b to the outside. Bonding pad 102c.

  Here, the lens 101 a is an aspherical convex lens and has a function of forming incident light on the surface of the image sensor chip 102.

  The lens barrel 101b has a shape such as a cylindrical shape or a square shape, and supports the lens 101a at a predetermined position on the inner periphery thereof. The lens barrel 101b functions as a lens support portion. The lens support portion does not need to be configured in a cylindrical shape. For example, the lens support section may support the lens 101a from below at a single point or a plurality of points. The bottom surface of the lens barrel 101b is fixed on the logic circuit portion 102b of the image sensor chip 102 in a gap d where the sensor cover 102d is not provided. In this case, since the sensor cover 102d includes the connection portions e extending in four directions, the four lower ends of the lens barrel 101b are mounted on the image sensor chip 102 in the four gaps d other than this portion. It is placed and fixed.

  The lens barrel 101b and the image sensor chip 102 are bonded with, for example, an ultraviolet curable resin. In this case, the bottom surface of the lower end portion of the lens barrel 101b is placed at a predetermined position with respect to the image sensor chip 102, and then an ultraviolet curable resin is used so that the image sensor chip 102 and the lens barrel 101b are bonded. Apply. Alternatively, after the ultraviolet curable resin is applied to one or both of the image sensor chip 102 and the lens barrel 101b, both may be positioned. By irradiating the ultraviolet curable resin with ultraviolet rays, the image sensor chip 102 and the lens barrel 101b are bonded and fixed. Thus, in the conventional camera module 100, since the lens support part (lens barrel 101b) that supports the lens 101a is placed on the image sensor chip 102 and directly fixed, the size can be reduced. Since the member between the lens 101a and the image sensor chip 102 is only the lens support portion (lens barrel 101b), there is little accumulation error in the distance between the lens 101a and the sensor portion 102a of the image sensor chip 102, and the relative relationship between the two is relatively small. The specific position can be set with high accuracy and more certainty.

  The sensor unit 102a of the image sensor chip 102 is an image sensor that is formed on the central surface of the image sensor chip 102, converts optical information into an electric signal, and outputs the signal as an image signal. This image sensor has a large number of read pixels. The sensor unit 102a is, for example, a CCD element or a CMOS element. The sensor unit 102a has a plurality of microchip lenses formed above each reading pixel, and can collect incident light on each reading pixel.

  The logic circuit unit 102b performs various signal processing such as amplification processing and noise removal processing on the imaging signal output from each sensor unit 102a.

  The bonding pad 102c is an input / output terminal that is electrically connected to the logic circuit portion 102b. The bonding pad 102c is electrically connected to an external electrode by wire bonding. For example, the image sensor chip 102 is placed on a wiring board constituting a circuit such as a mobile phone device, a portable terminal device (PDA), a card camera, etc., and these bonding pads 102c and this wiring board are connected by wire bonding. Connect electrically. Further, the image sensor chip 102 is installed on a sub-wiring board on which passive components such as resistors and capacitors, and active parts such as transistors and LSIs are mounted, and the bonding pad 102c and the sub-wiring board are electrically connected by wire bonding. The sub-wiring board can be electrically connected to a mobile phone device, a portable terminal device (PDA), a card camera, or the like.

  The sensor cover 102d is disposed to protect at least the sensor unit 102a, and prevents foreign matter from adhering to the sensor unit 102a. The sensor cover 102d has a contact portion that is fixed to the image sensor chip 102 outside the area of the sensor portion 102a. A gap is formed between the sensor cover 102d and the sensor unit 102a. The sensor cover 102d is formed of, for example, transparent synthetic resin or glass. The synthetic resin includes various resins such as silicon resin, polycarbonate resin, styrene resin, acrylic resin, and nylon resin. The sensor cover 102d is bonded or pressure-bonded on the image sensor chip 102. In the case of bonding, for example, an ultraviolet curable resin is used. The sensor cover 102d is formed at the manufacturing stage of the imaging module, and is continuously attached even at the usage stage of the imaging module. That is, the sensor cover 102d is not removed at the use stage. Accordingly, the upper part of the sensor portion 102a of the sensor cover 102d needs to have transparency in order to allow incident light to pass therethrough. However, the entire sensor cover 102d is not necessarily transparent.

  The distance between the incident surface of the sensor cover 102d, that is, the surface on the lens 101a side, and the surface of the sensor unit 102a needs to be a predetermined distance or more. The incident light that has passed through the lens 101a gradually converges and forms an image on the sensor unit 102a. Therefore, even if a foreign substance of the same size is attached directly to the sensor unit 102a, the incident light passes upward from the sensor unit 102a. The size on the image picked up by the sensor unit 102a differs from the case where the sensor portion 102a is attached on the sensor cover 102d separated by a predetermined distance. Specifically, when the lens 101a is a converging lens, the more the incident surface of the sensor cover 102d moves away from the sensor unit 102a, the smaller the foreign matter attached to the sensor cover 102d appears on the image of the sensor unit 102a. The influence of foreign matter adhesion can be reduced.

  As shown in FIG. 8B, the sensor cover 102d has a connecting portion that connects to the sensor cover 102d of the adjacent image sensor chip 102. This connecting portion is cut during dicing. In the sensor cover 102d, all the chips on the wafer are integrally formed by this connecting portion.

  In order to maintain optical accuracy, the sensor cover 102d is not provided at the contact portion between the lens barrel 101b and the image sensor chip 102 so that the lens barrel 101b and the image sensor chip 102 are in direct contact with each other. A gap (gap d) is provided in the sensor cover 102d. Similarly, in order to facilitate wiring, the sensor cover 102d is not provided on the bonding pad 102c, and a gap of the sensor cover 102d is provided.

  As described above, in Patent Document 1, the bottom surfaces of the four lower end portions of the lens barrel 101b to which the lens 101a is fixed are placed on the image sensor chip 102 and fixed, whereby the distance between the lens 101a and the sensor unit 102a. Is precisely defined. Further, in Patent Document 1, added value such as “IR cut filter”, “diaphragm” and “low pass filter” is added to the sensor cover 102d itself, and four through holes (foot extending from the bottom surface of the lens barrel 101b) are added thereto. The distance between the lens 101a and the sensor unit 102a is accurately defined by extending a leg from the bottom surface of the lens barrel 101b and bringing it into direct contact with the image sensor chip 102.

  Next, the imaging module of Patent Document 2 will be described in detail with reference to FIG. As a method for accurately fixing the distance between the lens and the image sensor, in Patent Document 1, the lens barrel 101b is interposed between the lens 101a and the sensor unit 102a. Patent Document 2 discloses that the distance between the lens and the image sensor is accurately defined by extending the distance to the sensor (distance to the sensor) and pressing the tip portion extended from the lens component onto the chip image sensor. .

  FIG. 9 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of a conventional imaging device disclosed in Patent Document 2.

  In FIG. 9, a conventional imaging apparatus 200 forms a subject image by focusing on a substrate 201, an imaging device 202 disposed on one surface of the substrate 201, and an imaging region of the imaging device 202. An optical member 203, a lens frame (holder member) 204 that covers the optical member 203 and the image sensor 202, a rotating member 205 that is provided on the upper surface (front part) of the lens frame 204 and includes a magnet, A light shielding plate 206 having a light shielding property provided below the rotating member 205, a diaphragm plate 207 provided below the light shielding plate 206 for adjusting the amount of light incident on the optical member 203, and a light shielding plate 206 A pressing member 2 that is provided between the IR cut filter 208 supported by the diaphragm plate 207, the diaphragm plate 207, and the optical member 203, and is a spring that presses the optical member 203 toward the substrate 201. 9, and a positioning electric parts 210 for positioning the lens frame 204. The rotating member 205, the light shielding plate 206, the diaphragm plate 207, and the IR cut filter 208 are defined as the upper end portion 211 (front portion of the holder member) of the lens frame 204.

  The optical member 203 is made of transparent glass or plastic material, and a first lens member 212 disposed on the substrate 201 side (rear side in the optical axis direction) and a first lens member 212 provided above the first lens member 212. The second lens member 213 is provided between the first lens member 212 and the second lens member 213, and a diaphragm 214 that adjusts the amount of light incident on the first lens member 212. The optical axes of the first lens member 212 and the second lens member 213 are the same.

  The first lens member 212 includes a convex lens-shaped first lens portion 212a and a tubular lower leg portion 212b around the first lens portion 212a, and a normal imaging mode is provided at the lower end portion of the lower leg portion 212b. , An abutting portion 212 c that abuts on the surface of the image sensor 202 is formed. Further, the pressing member 209 contacts the upper surface of the lower leg portion 212b. Due to the pressing force (biasing force) of the pressing member 209, the first lens member 212 is pressed toward the substrate 201 in the normal imaging mode. Further, around the first lens portion 212a, a collar portion 212d is formed in a circular shape in plan view outward from the tubular lower leg portion 212b. The focal length of the first lens member 212 is the distance from the lens principal point, but in terms of component dimensions, the distance dimension from the planar position of the collar portion 212d to the abutting portion 212c at the lower end of the lower leg portion 212b is manufactured. It is managed by.

  As a result, a part of the first lens member 212 is extended to the position of the focal length (distance to the sensor), and the distal end portion (lower end contact portion 212c) of the lower leg portion 212b extended from the lower surface of the first lens member 212. ) Can be pressed against the surface of the image sensor 202 so that the distance between the first lens member 212 and the surface of the image sensor 202 can be positioned with high accuracy.

  Next, Patent Document 3 discloses a camera module provided with a cylindrical holder in which an imaging element chip is arranged on a substrate and a lens is controlled inside so as to cover the imaging element chip. . In order to align the distance between these lenses and the image pickup element chip, the lower surface of the protruding portion protruding from the holder is fixed to the surface of the image pickup element chip with an adhesive.

  Patent Document 4 discloses a method for manufacturing a camera module disclosed in Patent Document 3. In this case, the protrusion of the holder is brought close to the upper surface of the image sensor chip through an adhesive while checking the in-focus state of the lens, and the holder is positioned at the position where the lens is in focus with respect to the image sensor and bonded. Allow the agent to dry.

Further, Patent Document 5 has an image pickup device chip disposed on a substrate, and has a top surface portion located on the image pickup device chip and a protrusion protruding from the top surface portion toward the image pickup device chip. A camera module is disclosed in which the upper surface portion of the imaging element chip and the top surface portion are fixed to each other with an adhesive in a state where the portion is in contact with the upper surface of the imaging element chip.
JP 2004-260356 A JP 2004-266340 A JP 2007-184801 A JP 2007-150428 A JP 2007-259064 A

  However, in the conventional imaging module 100, since the sensor cover 102d is provided with added values such as “IR cut filter”, “diaphragm”, and “low-pass filter” as an integral part, the sensor cover 102d on the sensor unit 102a is optical. 8 (a) and FIG. 8 (b), although it is necessary to configure the optical material equivalent to the lens through which the light is transmitted and the sensor cover 102d other than on the sensor unit 102a needs to be shielded from light. In this way, when light is transmitted through the circle inside the gap d and light is shielded outside the circle, only the portion where the foot is projected downward is shielded so that light from the lateral direction does not enter the sensor unit 102a. It is difficult to manufacture. The sensor cover 102d is provided with a through hole (gap d) for bringing the lower end portion of the lens barrel 101b into contact with the image sensor chip 102. Through the gap d, the sensor cover 102d is viewed from the side. There is a high possibility that light leaks to the sensor unit 102a, and ghost / flare may occur. Furthermore, in order to position the lens barrel 101b on the image sensor chip 102 and the optical axis of the lens 101a at the center of the sensor unit 102a, dimensional accuracy in the XY directions is also required. Actually, the lower end portion of the lens barrel 101b divided into four parts is passed through the through hole (gap d) of the sensor cover 102d, but there is a dimension between the lower end part and the through hole (gap d). If there is no allowance (clearance of a predetermined dimension or more), it will not enter smoothly, and if the allowance is large, the dimensional accuracy in the XY directions will be increased. When assembling these, since the number of parts is large and the structure is complicated, there are many management items, the number of assembling steps is required, and problems in assembly accuracy are likely to occur.

  Further, in the conventional imaging apparatus 200 described above, positioning in the Z direction is performed by directly contacting the lower leg portion 212 b extending from the lower surface of the first lens member 212 on the imaging element 202, and the surfaces of the first lens member 212 and the imaging element 202. However, in order to obtain a predetermined lens performance, the mold structure is complicated and accuracy is required. Further, since the pressing force (biasing force) to the sensor chip (imaging element 202) side by the pressing member 209 (spring) is constantly required, the pressing member 209 (spring) is disposed on the upper surface of the first lens member 212. In addition, a separate member that holds and holds the pressing member 209 (spring) is required, which increases the number of parts and the structure. Therefore, when assembling them, the number of parts is large and the structure is complicated, so there are many management items, the number of assembling steps, and problems in assembly accuracy are likely to occur. In addition, the conventional imaging apparatus 200 also requires focus adjustment of the lens position of the first lens member 212 in order to absorb the accuracy of each component, assembly accuracy, and the like when the imaging module is assembled.

  Furthermore, in the camera modules of Patent Documents 3 to 5, an adhesive is interposed between the upper surface of the imaging element chip and the protruding portion or the top surface portion of the holder, but the adhesive layer varies greatly from 5 to 25 μm. The distance between the lens in the holder and the image sensor chip cannot be accurately aligned, and optical adjustment cannot be made unnecessary to improve yield and light collection efficiency.

  The present invention solves the above-described conventional problems, and reduces the number of component parts to make the configuration simpler, thereby reducing the number of assembly steps and improving the assembly accuracy, and eliminating the need for optical adjustment and It is an object of the present invention to provide an electronic information device using the manufacturing method and the imaging module as an image input device such as a vehicle-mounted rear monitoring camera.

  The imaging module of the present invention is mounted on the substrate so that a holder member that houses a condensing lens for imaging subject light on the imaging chip mounted on the substrate covers the imaging chip. In the imaging module, the holder member is directly supported on the surface of the imaging chip, thereby achieving the above object.

  More specifically, in the imaging module of the present invention, a holder member that houses a condensing lens for forming an image of subject light on an imaging chip mounted on a substrate covers the imaging chip. In the imaging module mounted on the substrate, the holder member is supported on the surface of the imaging chip, and a part of the holder member supported directly on the surface of the imaging chip is the condenser lens and the imaging It is a height direction positioning portion with respect to the surface of the chip, and the above object is achieved thereby.

  More specifically, the imaging module of the present invention includes a holder member in which an imaging chip is mounted on a substrate, and a condenser lens for forming an image of subject light on the imaging chip is accommodated in the back side recess. In the imaging module mounted on the substrate so as to cover or semi-seal the inside of the backside recess by covering the imaging chip with the backside recess, the surface of the imaging chip is provided on the stepped portion provided in the backside recess. A height direction positioning portion that directly contacts the surface is provided, whereby the above object is achieved.

  Preferably, the height direction positioning portion in the imaging module of the present invention is the entire surface of the stepped portion or a part thereof, or a protruding portion protruding from the stepped portion in a planar shape or a dot shape.

  Still preferably, in the imaging module of the present invention, the projecting portion has a circular or oval tip end surface that contacts the surface of the imaging chip.

  Further preferably, a plurality of protrusions are provided in the imaging module of the present invention, and abut on a surface other than the imaging region of the imaging chip at a plurality of locations.

  Further preferably, the step portion in the imaging module of the present invention is formed so as to escape a deformed portion due to a dicing end surface of the surface edge portion of the imaging chip.

  Further preferably, the projecting portion in the imaging module of the present invention is formed so as to project away from a deformed portion due to the dicing end surface of the surface edge of the imaging chip.

  Further preferably, the condensing lens in the imaging module of the present invention is positioned and accommodated on the bottom surface inside the back-side recess of the holder member, and the side wall inside the back-side recess and the outer peripheral end surface of the condensing lens are bonded and fixed. Has been.

  Further preferably, the condensing lens in the imaging module of the present invention is a set of two lenses, and a light-shielding film having a light passage hole in the center is sandwiched between the two lenses. .

  Further preferably, the infrared ray cut in the backside recess in the imaging module of the present invention is cut out from the incident light that has passed through the condenser lens and emitted to the imaging chip side so as to cross over the imaging chip. A filter is provided.

  Further preferably, in the imaging module of the present invention, the entire height of the stepped portion on the back surface of the holder member or a part of the stepped portion is directly positioned on the imaging chip without using an adhesive. As a part.

  Further preferably, the contact between the height direction positioning portion and the surface of the imaging chip in the imaging module of the present invention is a two-surface contact or a three-surface contact by the entire surface of the stepped portion or a partial surface thereof.

  Further preferably, in the imaging module of the present invention, a step is provided as the height direction positioning portion without passing through another step from the bottom surface of the concave portion which is the lens housing reference surface of the holder member.

  The image pickup module manufacturing method of the present invention includes a sensor unit forming step for mounting an image pickup chip on a substrate, and a condensing lens for forming an image of subject light on the image pickup chip in a recess on the back side of the holder member. The lens unit forming step to be fixed is performed in this order or in the reverse order, and the height direction positioning portion of the stepped portion provided in the back side recess is brought into direct contact with the surface of the imaging chip. The imaging chip is covered with the back side recess, and in this state, the sensor unit / lens unit combining step of bonding the holder member to the substrate with an adhesive so as to seal or semi-close the inside of the back side recess is performed. Yes, and the above objective is achieved.

  Preferably, the sensor unit forming step in the manufacturing method of the imaging module of the present invention includes mounting the imaging chip at a predetermined position on the substrate, a plurality of input / output pads of the imaging chip, and each predetermined of the substrate. The imaging chip is fixed on the substrate by wire bonding between the terminals.

  Further preferably, in the lens unit forming step in the method of manufacturing an imaging module according to the present invention, the condenser lens is inserted and positioned up to a bottom surface in the recess on the back side of the holder member, and in this state, the holder member The inner peripheral wall of the back-side concave portion and the outer peripheral end surface of the condenser lens are bonded and fixed with an adhesive.

  Further preferably, the sensor unit / lens unit combination step in the method of manufacturing an imaging module according to the present invention may be configured such that a holder member containing the condenser lens is attached to the substrate on which the imaging chip is mounted. The automatic assembling apparatus for recognizing a planar image is aligned with the imaging chip and placed directly on the imaging chip.

  The electronic information device of the present invention uses the above-described imaging module of the present invention as an image input device in an imaging unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  The structure in which the holder member is positioned with respect to the substrate is positioned by directly contacting the height direction positioning portion of the holder member on the surface of the sensor chip as the imaging chip, thereby reducing the number of parts of the imaging module to the conventional technology. Compared to this, it is possible to make a simple configuration with a significant reduction, and the distance between the lens fixed to the holder member and the upper surface of the sensor chip can be accurately positioned in the vertical direction (Z direction). As a result, it is possible to improve the component accuracy, the assembly accuracy, and the mounting accuracy, and it is possible to realize a focus adjustment-free imaging module. Here, since the surface of the sensor chip and the height direction positioning part are not bonded and no adhesive is interposed, the distance between the lens and the upper surface of the sensor chip varies greatly from 5 to 25 μm depending on the adhesive layer. As a result, more accurate assembly is possible.

  Since the holder member of the lens integrated structure is positioned and mounted on the substrate on which the sensor chip is mounted by an automatic assembly device that recognizes the planar image of the sensor chip, the plane direction (XY direction) is not displaced. It is possible to perform positioning with high accuracy while minimizing.

  Furthermore, in the novel structure of the present invention, the inside of the sensor chip fixed on the substrate is sealed so as to cover the sensor chip from above with a lens-integrated holder member, so light leakage from the outside to the inside does not occur. Since it has a sealed structure, there is no intrusion of dust inside, and there is no adhesion of dust onto the imaging area of the internal sensor chip. Therefore, the image quality of the image can be improved.

  As described above, according to the present invention, since the height direction positioning portion is directly applied to the upper surface of the imaging chip as the reference surface of the holder member for positioning in the height direction, variations in assembly accuracy of the condenser lens with respect to the holder member, the holder Factors such as molding accuracy of members may be considered, but the number of parts is simple compared to the conventional structure, so the assembly man-hour can be reduced and the assembly accuracy can be improved, making focus adjustment free. be able to. Also, since the surface of the sensor chip and the height direction positioning part are not bonded, and no adhesive is interposed therebetween, the lens and the upper surface of the sensor chip are compared with the case of bonding with an adhesive. As a result, it is possible to perform assembling with higher accuracy and to make focus adjustment free.

  Hereinafter, an electronic information device using any one of Embodiments 1 to 3 of the imaging module of the present invention and Embodiments 1 to 3 of the imaging module of the present invention as an image input device in an imaging unit will be described as a fourth embodiment. Details will be described with reference to FIG.

(Embodiment 1)
FIG. 1 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of an imaging module according to Embodiment 1 of the present invention.

  In FIG. 1, an imaging module 10 according to Embodiment 1 includes a holder member 1 for a dustproof case, a first condenser lens 2a and a second condenser lens 2b accommodated in the holder member 1 above and below, The light shielding film 3 provided between the first condenser lens 2a and the second condenser lens 2b, the substrate 4, the sensor chip 5 as a solid-state imaging chip provided on the substrate 4, and the holder member The IR cut filter 6 fixed to the first step portion 1d in 1 and disposed across the second condenser lens 2b and the sensor chip 5 is fixed between the outer wall bottom surface of the holder member 1 and the substrate 4. It has the adhesion part 7 to do.

  The dust-proof holder member 1 covers the first condensing lens 2 a, the light shielding film 3, the second condensing lens 2 b, the IR cut filter 6 and the sensor chip 5, which are arranged in order from the top, with the substrate 4. The structure is sealed or semi-sealed. The holder member 1 is provided with a step 11a as an appearance, the upper portion of the step 11a is cylindrical, the lower portion of the step 11a is a quadrangular cylinder, and the lower surface is open. The holder member 1 is formed of a resin casing having a thin outer wall thickness and capable of shielding and sealing or semi-sealing the inside. The first condensing lens 2a is formed on the upper surface of the casing, that is, on the cylindrical upper surface of the step. A circular hole 1a (or a circular transparent region) for passing incident light is formed as a first circular hole opposite to. The first condensing lens 2a, the light-shielding film 3 and the first condensing lens 2a from the back side of the open bottom surface of the holder member 1 so that the optical axes of the first condensing lens 2a and the second condensing lens 2b pass through the center of the circular hole 1a. The second condensing lens 2b can be positioned by sequentially inserting these circular outer shapes into the circular concave portion of the holder member 1 and fixing them.

  The dust-proof holder member 1 is placed on the sensor chip 5 so that the incident light is focused on the imaging region 5a of the sensor chip 5 by the first condenser lens 2a and the second condenser lens 2b. A height direction positioning portion 1b placed by its own weight projects from the second step portion 1f on the back surface of the holder member 1 in a planar shape. The height direction positioning portion 1b of the holder member 1 abuts on the sensor chip 5, whereby the height direction of the first condenser lens 2a and the second condenser lens 2b and the imaging region 5a of the sensor chip 5 ( The distance in the Z direction) is defined with high accuracy. That is, the height which protruded from the 2nd level | step difference part 1f of the back surface of the holder member 1 from the recessed part bottom surface of the back surface side of the holder member 1 in which the 1st condensing lens 2a and the 2nd condensing lens 2b can be accommodated and positioned. The distance in the height direction to the end face of the direction positioning portion 1b can be accurately managed within the intersection in manufacturing parts. Thereby, the holder member 1 is directly positioned on the upper surface of the sensor chip 5 by the planar height direction positioning portion 1b, whereby the first condenser lens 2a and the second condenser lens 2b fixed to the holder member 1 are obtained. The distance from the upper surface of the sensor chip 5 can be accurately positioned in the vertical direction (Z direction), the component accuracy, its assembly accuracy, and mounting accuracy can be improved, and the focus adjustment-free imaging module 10 is realized. can do.

  The first condensing lens 2a and the second condensing lens 2b are a combined lens for focusing the subject light on the imaging region 5a of the sensor chip 5 to form an image, and a transparent acrylic plastic material or glass material. Etc.

  The light shielding film 3 is black as an antireflection treatment, and is positioned between the outer peripheral side lower surface (plane) of the first condenser lens 2a and the outer peripheral side upper surface (plane) of the second condenser lens 2b. A circular hole 3a (or a circular transparent region) as a second circular hole for passing incident light having a diameter smaller than that of the circular hole 1a at the center of the upper surface of the holder member 1 is defined as the circular hole 1a of the holder member 1. It is concentrically provided at the center. The circular hole 3a (or circular transparent region) of the light shielding film 3 is a stop for preventing the occurrence of flare. That is, the circular hole 3a is set to have an opening diameter that does not cause flare in consideration of the lens characteristics of the first condenser lens 2a and the second condenser lens 2b. For example, oblique light having an inclination of 50 degrees to 60 degrees is applied to incident light from the vertical direction (height direction), and the level of an imaging signal (diffuse reflected noise level) by the oblique light is a predetermined reference value (display) Set the aperture diameter so that it is at a level that is smaller than the level of screen roughness.

  The sensor chip 5 includes a plurality of photoelectric conversion units (a plurality of photoelectric conversion units) configured to photoelectrically convert and image light in which incident light from a subject has transmitted through the first condenser lens 2a and the second condenser lens 2b in the central imaging region 5a. The solid-state imaging device is formed in a matrix. This solid-state imaging device can be applied to both a CMOS image sensor and a CCD image sensor. In the CMOS image sensor, a signal readout circuit that is connected to each other by a multilayer wiring layer and that selects a photoelectric conversion unit and outputs a signal from the photoelectric conversion unit is provided for each unit pixel unit. In a CCD image sensor, a plurality of photoelectric conversion units are two-dimensionally provided on a light receiving surface of an imaging region, and signal charges photoelectrically converted by the photoelectric conversion units are read to the charge transfer unit CCD and sequentially transferred in a predetermined direction. After that, the charge detection unit sequentially detects the charges in batch, not for each light receiving unit, and amplifies and outputs the signal as an imaging signal.

  The infrared (IR) cut filter 6 is spanned and fixed between the first step portions 1d of the holder member 1 so as to cross over the sensor chip 5, and the first condenser lens 2a and further the second condenser lens. Infrared light is cut from incident light that has passed through 2b.

  A method for manufacturing the sensor module 10 having the above configuration will be described.

  FIG. 2 is a longitudinal sectional view schematically showing the method for manufacturing the imaging module of FIG. 1 for each manufacturing process.

  As shown in the lens unit manufacturing process of FIG. 2A, first, the first condenser lens 2a is brought into contact with the bottom surface 1c of the concave portion on the back side of the holder member 1 having a circular hole 1a (or a circular transparent region) in the middle. After the insertion and positioning, a light shielding film 3 having a circular hole 3a in the middle is further inserted up to the outer peripheral plane portion of the first condenser lens 2a, and the second condenser lens 2b is further attached to the light shielding film 3. Inserted from above, an adhesive is inserted between the second condenser lens 2b and the inner peripheral surface of the concave portion of the holder member 1 and fixed. Further, the infrared (IR) cut filter 6 is bonded and fixed over the first step portion 1 d of the recess on the back side of the holder member 1. Thereby, the lens unit 11 in which the first condensing lens 2a, the light shielding film 3, the second condensing lens 2b, and the infrared (IR) cut filter are accommodated in a predetermined position inside can be manufactured.

  Next, as shown in the sensor unit manufacturing process of FIG. 2B, the sensor chip 5 is mounted at a predetermined position on the substrate 4, and a plurality of inputs are arranged along opposite sides (two sides) of the sensor chip 5. The sensor pad 5 is fixed on the substrate 4 by wire bonding between the output pad (not shown) and a predetermined terminal (not shown) of the substrate 4 by a wire 121. Thus, the sensor unit 12 having the sensor chip 5 mounted on the substrate 4 can be manufactured.

  Subsequently, as shown in the final sensor unit / lens unit combination step of the imaging module 10 in FIGS. 2C and 3, pins 13 stand at four corners of a frame member (not shown), and A square notch 4a is also formed on the receiving side, and a pin 13 is inserted into the notch 4a of the substrate 4 to prevent displacement in the plane (XY) direction. As a result, the substrate 4 on which the sensor chip 5 is mounted is positioned with respect to an automatic assembly device (not shown), and the planar image of the sensor chip 5 is recognized by the image recognition function of the automatic assembly device. The adhesive 7a is applied to a predetermined position on the substrate 4 (a position corresponding to the lower end 1e of the outer wall of the holder member 1) by the apparatus, and the lens unit 11 is accurately and accurately placed on the sensor unit 12 by the automatic assembly apparatus. To be installed. Thus, the frame member (not shown) and the pins 13 at the four corners thereof are used to fix the sensor unit 12 and the lens unit 11 without moving until the adhesive 7a is cured.

  In this case, for the positioning in the height direction (Z direction), the planar height direction positioning portion 1 b protruding from the second stepped portion 1 f on the back surface of the holder member 1 is used as the sensor chip 5 by the weight of the holder member 1. By positioning directly on the surface, the distance between the first condenser lens 2a and the second condenser lens 2b held by the holder member 1 and the imaging region 5a of the sensor chip 5 is accurately positioned in the height direction. Can do.

  Since the sensor chip 5 is a silicon chip and it is difficult to make a dent on the surface, the positioning accuracy in the plane (XY) direction is high as the accuracy of mounting by the image recognition function of the automatic assembly apparatus. . In addition to this, when a taper portion 1g for guiding the height direction positioning portion 1b on the surface of the sensor chip 5 is attached to the side wall reaching the second step portion 1f on the back surface of the holder member 1, the insertion is further facilitated. The thickness of the sensor chip 5 is as thin as about 0.2 mm. As described above, the chip shape on the substrate 4 is image-recognized by an automatic assembly apparatus (not shown) and the holder member 1 is installed from above. May or may not be. Since the wires 121 are wire-bonded to the two opposing sides, the height direction positioning portion 1b is placed on the chip edges of the two other opposing sides. At this time, the lower end 1e of the outer peripheral side wall of the holder member 1 is set so as to float slightly from the surface of the substrate 4 (for example, about 0.2 μm). Thus, the inside of the holder member 1 is sealed or semi-sealed (including the case where the adhesive 7a does not completely enter during the float, and the inside and outside of the holder member 1 communicate with each other through a part of the gap. The state). Thereby, the imaging module 10 assembled with high precision in the plane (XY) direction can be manufactured.

  As described above, according to the first embodiment, the holder member 1 is positioned on the upper surface of the sensor chip 5 directly from the structure in which the holder member 1 is positioned with respect to the substrate 4. By doing so, the number of parts of the imaging module 10 can be greatly reduced as compared with the prior art, and the configuration can be simplified, and the condensing lenses 2a and 2b fixed to the holder member 1 and the upper surface of the sensor chip 5 Can be accurately positioned in the vertical direction (Z direction), the component accuracy, the assembly accuracy, and the mounting accuracy can be improved, and a focus adjustment-free camera module can be realized. At the time of assembly, the substrate on which the sensor chip is mounted is fitted with a positioning pin and set with high accuracy, and the lens integrated structure holder member is positioned by the automatic assembly device with respect to the sensor chip and substrate set with high accuracy. Since they are mounted together, it is possible to perform positioning with high accuracy while minimizing the occurrence of deviation in the plane direction (XY direction). Furthermore, in the novel structure of the present invention, the inner part is sealed with a lens-integrated holder member so as to cover the sensor chip 5 fixed on the substrate from above, so that no light leaks from the outside to the inside. In addition, since it has a sealed or semi-sealed structure, there is no entry of dust into the interior, and there is no adhesion of dust onto the imaging area of the internal sensor chip.

(Embodiment 2)
In the first embodiment, in order to accurately position the distance between the lens fixed to the holder member 1 and the upper surface of the sensor chip 5, the planar height direction positioning portion 1b of the holder member 1 on the upper surface of the sensor chip 5 is used. In the second embodiment, the height direction positioning portion 1b of the first embodiment is not received as a surface shape on the upper surface of the sensor chip 5, but a point shape (circular or The case of receiving an oval shape will be described.

  FIG. 4 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of an imaging module according to Embodiment 2 of the present invention. In addition, the same code | symbol is attached | subjected and demonstrated to the structural member which show | plays the same effect as the structural member of FIG.

  In FIG. 4, the imaging module 10A according to the second embodiment includes a holder member 1A for a dustproof case, a first condenser lens 2a and a second condenser lens 2b mounted vertically in the holder member 1A, The light shielding film 3 provided between the first condenser lens 2 a and the second condenser lens 2 b, the substrate 4, the sensor chip 5 provided on the substrate 4, and the first in the holder member 1. And an IR cut filter 6 fixed across the second condenser lens 2 b and the sensor chip 5, and an adhesive portion 7 between the holder member 1 and the substrate 4.

  The dust-proof holder member 1 </ b> A covers the first condensing lens 2 a, the light shielding film 3, the second condensing lens 2 b, the IR cut filter 6 and the sensor chip 5, which are arranged in order from the top, with the substrate 4. The structure is sealed or semi-sealed. This holder member 1A is provided with a step 11a as an appearance, the upper portion of the step 11a is cylindrical, the lower portion of the step 11a is a quadrangular cylindrical shape, and the lower surface is opened in a concave shape. The holder member 1A is formed of a resin casing having a thin outer wall thickness and capable of shielding and sealing or semi-sealing the inside. The first condensing lens 2a is formed on the upper surface of the casing, that is, on the cylindrical upper surface of the step. A circular hole 1a (or a circular transparent region) for passing incident light is formed as a first circular hole opposite to. The first condensing lens 2a, the light-shielding film 3 and the like from the back side of the open bottom surface of the holder member 1A so that the optical axes of the first condensing lens 2a and the second condensing lens 2b pass through the center of the circular hole 1a. The second condensing lens 2b can be positioned in this order sequentially by inserting and fixing the circular outer shape thereof into the circular concave portion of the holder member 1A.

  The dust-proof holder member 1A has a holder on the sensor chip 5 so that incident light is focused on the imaging region 5a of the sensor chip 5 by the first condenser lens 2a and the second condenser lens 2b. A circular dot-shaped height direction positioning portion 1bA placed by the weight of the member itself protrudes from the second step portion 1f on the back surface of the holder member 1A in a circular dot shape. In this case, the height direction positioning portion 1bA is provided at a position corresponding to the vicinity of the four corners of the rectangular upper surface of the sensor chip 5. The height direction positioning portion 1bA of the holder member 1A abuts on the sensor chip 5 at the time of assembly, so that the heights of the first condenser lens 2a and the second condenser lens 2b and the imaging region 5a of the sensor chip 5 are increased. The distance is accurately defined in the direction (Z direction). That is, a height protruding from the concave bottom surface 1c on the back side of the holder member 1A where the first condenser lens 2a and the second condenser lens 2b are accommodated and positioned, and the second stepped portion 1f on the back surface of the holder member 1A. The distance in the height direction to the circular point of the vertical positioning portion 1bA can be accurately managed within the intersection in manufacturing the part. As a result, the holder member 1A is directly positioned on the upper surface of the sensor chip 5 by the circular dot-shaped height direction positioning portion 1bA, whereby the first condenser lens 2a and the second condenser lens 2b fixed to the holder member 1A. The distance between the sensor chip 5 and the upper surface of the sensor chip 5 can be accurately positioned in the vertical direction (Z direction), and component accuracy, assembly accuracy, and mounting accuracy can be improved. Can be realized.

  This is a case where the height direction positioning portion 1bA is positioned on the sensor chip 5 by contacting with a point (circular protruding portion) instead of a flat surface (stepped portion 1f) as in the first embodiment. When the height direction positioning portion 1b is applied to the upper surface of the sensor chip 5 as in the first embodiment, it is necessary to provide accuracy in a large area (or a long distance). The accuracy is likely to deteriorate, and the holder member can be managed by determining a circular point as in the height direction positioning portion 1bA and determining the intersection in manufacturing the part at the circular point. The distance between the lens fixed to 1A and the upper surface of the sensor chip 5 can be positioned with higher accuracy in manufacturing and assembling the parts. Or, it is necessary to note or deformed longer fit around the molding material.

(Embodiment 3)
In the second embodiment, the height direction positioning portion (projecting portion) having a point shape (circular shape or oval shape) has been described. However, in the third embodiment, the height of the point shape (circular shape or oval shape) is described. The number of direction positioning parts will be described.

  FIG. 5 is a plan view schematically showing the positional relationship between the upper surface of the sensor chip and the dot-shaped height direction positioning portion in the imaging module according to Embodiment 3 of the present invention. In addition, the same code | symbol is attached | subjected and demonstrated to the structural member which show | plays the same effect as the structural member of FIG. 1 and FIG.

  In FIG. 5, the positional relationship between the upper surface of the sensor chip 5 and the three height direction positioning portions 1bB in the imaging module 10B according to the third embodiment is arranged so as to avoid the imaging region 5a. Since the three points of the height direction positioning portion 1bB can form an area connecting the three points, all the three points hit each other without floating on the upper surface of the sensor chip 5. For this reason, the positioning accuracy in the height direction is improved. In the case of two points, there is a possibility that the holder member 1 rotates and tilts around a line connecting them, and the positioning accuracy in the height direction is not good, but at least one of the two points is in surface contact or If it is oval, it stabilizes without tilting like three points. Further, when the four point-like height direction positioning portions 1bA are in contact with the upper surface of the sensor chip 5 like the height direction positioning portion 1bA in the imaging module 10A according to the second embodiment, the height direction There is also a possibility that one of the four points of the positioning part 1bA will float. Therefore, when three points are arranged so as to contact the surface of the sensor chip 5 as in the height direction positioning portion 1bB, all the points abut against the surface of the sensor chip 5. An adhesive is set on the substrate 4 in advance, and when the dot-like height direction positioning portion 1bA or 1bB of the holder member 1 is set on the surface of the sensor chip 5 on the substrate 4, the image is accurately recognized. The positioning in the plane direction may be performed by an automatic positioning device, and it may be installed with a predetermined load. Thereafter, the adhesive 7a is cured. If the amount of the adhesive 7a is small around the entire circumference of the adhesive 7a, a hole is opened in the middle, and dust enters from there.

  The contact position of the three points on the height direction positioning portion 1bB is preferably the outer edge of the sensor chip 5 on the substrate 4 as much as possible so that the area consisting of the three points is large, but the edge of the sensor chip 5 is cut off. As a result, chipping is caused to cause swelling and the three protrusions of the height direction positioning portion 1bB protrude at positions avoiding deformation portions (bulging portions) due to the dicing side surface of the surface edge of the sensor chip 5. Is formed. In the case where the stepped portion 1f is brought into direct contact with the surface of the sensor chip 5 as in the height direction positioning portion .01b of the first embodiment, a deformed portion of the surface end portion of the sensor chip 5 due to the dicing side surface ( What is necessary is just to form a swelling part) so that the level | step-difference part 1f may be dented and to escape.

  Although not particularly described in the first to third embodiments, the infrared cut filter 6 and the sensor chip 5 that cut infrared rays from incident light that has passed through the condenser lenses 2a and 2b and emit the infrared rays to the sensor chip 5 side. It is conceivable that the gap is filled with a resin mold and positioned in the height direction (Z direction), but in this case, it is necessary to embed with a resin mold, which only increases the number of parts and the number of manufacturing steps. Instead, the positioning accuracy in the height direction (Z direction) is also reduced by the amount embedded in the resin mold.

  FIG. 6 is a view of the elliptical height direction positioning portion 1bB of the third embodiment as viewed from the back side, and shows a case where the substrate 4 is fixed by four pins 13.

  When the condenser lenses 2a and 2b for imaging the subject light on the sensor chip 5 are accommodated and fixed up to the bottom surface 1c in the back-side recess of the holder member 1, three points are provided on the bottom surface 1c of the back-side recess. If the imaging distance from the three protrusions to the three height direction positioning parts 1bB is managed by crossing the parts in manufacturing or assembling, the incident light is detected as a sensor chip. In order to form an image accurately on the top 5, positioning in the height direction (Z direction) can be performed with higher accuracy.

(Embodiment 4)
In the first embodiment, in order to accurately position the distance between the condenser lenses 2 a and 2 b fixed to the holder member 1 and the upper surface of the sensor chip 5, the planar height of the holder member 1 is set on the upper surface of the sensor chip 5. In the second embodiment, the height direction positioning portion 1b of the first embodiment is used as the height direction positioning portion 1bA in the shape of a surface on the upper surface of the sensor chip 5. The case of receiving in a point shape (circular shape or oval shape) instead of receiving will be described. In the third embodiment, the number of height direction positioning portions (here, the circular shape or oval shape) In the fourth embodiment, the entire stepped portion of the holder member 1 is directly mounted on the upper surface of the sensor chip 5 as the planar height direction positioning portion of the holder member 1 in the fourth embodiment. A case will be described in which.

  FIG. 10A is a top view schematically showing a configuration example of a main part of an imaging module according to Embodiment 4 of the present invention, and FIG. 10B is a longitudinal sectional view taken along line AA in FIG. FIG. 10C is a top view of the imaging module of FIG. 1 for comparison, and FIG. 10D is a longitudinal sectional view taken along line BB of FIG.

  10A and 10B, an imaging module 10C according to the fourth embodiment includes a holder member 1C for a dustproof case, and a first condenser lens 2a that is accommodated vertically in the holder member 1C. And a second light collecting lens 2b, a light shielding film 3 provided between the first light collecting lens 2a and the second light collecting lens 2b, and having a circular hole 3a (or a circular transparent region) formed in the center, The substrate 4, the sensor chip 5 as a solid-state imaging chip provided on the substrate 4, and the first step portion 1 d in the holder member 1 </ b> C are fixed, and the space between the second condenser lens 2 b and the sensor chip 5 is fixed. It has an infrared (IR) cut filter 6 disposed across, and an adhesive portion 7 fixed between the bottom surface of the outer wall of the holder member 1C and the substrate 4 with an adhesive.

  The dust-proof holder member 1 </ b> C covers the first condensing lens 2 a, the light shielding film 3, the second condensing lens 2 b, the IR cut filter 6, and the sensor chip 5, which are arranged in order from the top, with the substrate 4. The structure is sealed or semi-sealed. This holder member 1C is provided with a step 11a on the outside as an external appearance, the upper portion of the step 11a is cylindrical, the lower portion of the step 11a is a quadrangular cylinder, and the lower surface is opened with a plurality of steps. Yes. The holder member 1C is formed of a resin casing that has a thin outer wall thickness and is capable of shielding and sealing or semi-sealing the inside. The first condenser lens 2a is formed on the upper surface of the casing, that is, on the cylindrical upper surface of the step. A circular hole 1a (or a circular transparent region) for passing incident light is formed as a first circular hole opposite to. The first condenser lens 2a is shielded from the back side of the open bottom surface of the holder member 1C so that the optical axes of the first condenser lens 2a and the second condenser lens 2b pass through the center of the circular hole 1a. The film 3 and the second condenser lens 2b can be positioned in this order sequentially by inserting and fixing the circular outer shape to the full extent of the circular recess of the holder member 1C.

  The dust-proof holder member 1C is formed on the sensor chip 5 so that incident light is focused on the imaging region 5a of the sensor chip 5 with high precision by the first condenser lens 2a and the second condenser lens 2b. The height direction positioning portion 1bC placed directly on the holder member 1C itself without its own weight by the weight of the holder member 1C itself, as shown in FIG. 11A, the second step portion 1f on the back surface of the holder member 1C. The entire surface or a part of it. The first condensing lens 2a and the second condensing lens 2b are brought into contact with the entire surface or a part of the second stepped portion 1f on the sensor chip 5 as the height direction positioning portion 1bC of the holder member 1C. The distance in the height direction (Z direction) from the imaging region 5a of the sensor chip 5 is accurately defined. That is, the height from the bottom surface of the concave portion on the back surface side of the holder member 1C where the first and second light collecting lenses 2a and 2b can be accommodated and positioned to the entire surface of the second step portion 1f on the back surface of the holder member 1C. The distance in the vertical direction can be accurately managed within the intersection in manufacturing the part. As a result, the holder member 1C is fixed to the holder member 1C by directly positioning the holder member 1C on the upper surface of the sensor chip 5 on the upper surface of the sensor chip 5 without using an adhesive as a planar height direction positioning portion 1bC. The distance between the first condenser lens 2a and the second condenser lens 2b and the upper surface of the sensor chip 5 does not include variations in the thickness of the adhesive layer due to the adhesive (a large variation of about 5 to 25 μm). It is possible to position in the vertical direction (Z direction) with higher accuracy, and to improve the component accuracy, its assembly accuracy, and mounting accuracy with respect to the holder member 1C, and the focus adjustment-free imaging module of the fourth embodiment 10C can be realized.

  As described above, in the fourth embodiment, the step portion 1f of the holder member 1C that is directly supported on the surface of the sensor chip 5 as the imaging chip is formed by the first condenser lens 2a, the second condenser lens 2b, and the sensor. The height direction positioning portion 1bC with the surface of the chip 5 is used. However, when the placement area (bottom area) is small, such as when the height direction positioning portion 1bC is a point (protruding portion), the holder member 1C is automatically When placed, the height direction positioning portion 1bC is easily crushed or deformed due to a load, and an error occurs in the distance between the first condenser lens 2a and the second condenser lens 2b and the imaging region on the surface of the sensor chip 5. Therefore, two-surface contact is made by the entire surface of the stepped portion 1f between the height direction positioning portion 1bC of the holder member 1C and the surface of the sensor chip 5 or a partial surface thereof. In this way, if the contact is made in a wider area, it may be crushed or deformed, or an error of about 1 μm will occur to bring out the area on the mold, but 10 μm when an adhesive is interposed between them. The error is overwhelmingly smaller than the error of the degree (varies in the range of 5 to 25 μm).

  In addition to the case where the height direction positioning portion 1bC and the surface of the sensor chip 5 are brought into contact with each other by two surfaces by the entire surface or a partial surface of the step portion 1f as in the fourth embodiment, there are four or more surfaces. However, it is better that the contact is made on three surfaces as compared with this.

  In order to prevent the protruding portion from being crushed when the holder is placed, the material of the resin material and the mounting area of the holder member 1C (the bottom area of the protruding portion), and further the load when placing (the holder containing the lens) However, if the protruding part with a small placement area protrudes, it is better that the protruding amount is not so small.

  Furthermore, although not specifically described in the fourth embodiment, in order to accurately align the distances between the first condenser lens 2a and the second condenser lens 2b and the imaging region on the surface of the sensor chip 5, It is also possible to reduce the number of back surface steps of the holder member 1C and to form a reference surface with the surface of the sensor chip 5 closer to the housing position of the first condenser lens 2a and the second condenser lens 2b. It is possible to further reduce molding errors and improve molding accuracy. In this case, as shown in FIG. 12, as the imaging module 10D, another step (the IR cut filter 6 is a step between the back side and the front side) from the reference surface (back side concave bottom surface 1c) of the lens housing in the holder of the holder member 1D. The step 1g of the holder member 1D to be placed on the surface of the sensor chip 5 (contacting the surface of the sensor chip 5 wider than the step 1f in FIG. 10) is provided without any intervention. Also good.

  Furthermore, although it is structurally different from the case of the said Embodiments 1-4, the application example is demonstrated. A sensor chip 5 is mounted on a thin flexible substrate (flexible substrate) that is easy to shave, and a sensor cover (a lens is not housed and has a different configuration from the holder member) is placed on the surface of the sensor chip 5. Then, the vicinity of the sensor chip 5 on the substrate is fixed with an adhesive. The lens is provided on the sensor cover as an autofocus and motor-driven lens unit. The lens unit is configured to stop the motor drive at the lens position where the image pickup device is in focus electronically. Here, a predetermined location (height direction positioning portion) of the sensor cover is placed directly on the surface of the sensor chip 5 so that the sensor cover does not tilt relative to the surface of the sensor chip 5. As a result, the lens of the lens unit above it does not tilt.

  Further, as shown in FIG. 13, the height direction positioning portion 1 b of the holder 1 is placed on the surface of the sensor chip 5 even when the sensor chip 5 is mounted with an inclination with respect to the substrate 4. Since the holder 1 is mounted in a tilted state in the same manner as the surface of the sensor chip 5, even if the sensor chip 5 is mounted with an inclination with respect to the substrate 4, the camera performance is not affected.

(Embodiment 5)
FIG. 7 is a block diagram illustrating a schematic configuration example of an electronic information device using the imaging module according to any of Embodiments 1 to 4 of the present invention as an imaging unit as Embodiment 4 of the present invention.

  In FIG. 7, the electronic information device 20 according to the fifth embodiment includes the imaging module 10, 10A, 10B, 10C, or 10D according to any of the first to fourth embodiments and the imaging module 10, 10A, 10B, 10C, or 10D. A memory unit 21 such as a recording medium that can record data after predetermined signal processing is performed on the color image signal from the recording medium, and the color image signal from the imaging module 10, 10A, 10B, 10C, or 10D for display. Display means 22 such as a liquid crystal display device which can display on a display screen such as a liquid crystal display screen after predetermined signal processing, and the color image signal from the imaging module 10, 10A, 10B, 10C or 10D for communication. A communication means 23 such as a transmission / reception device capable of performing communication processing after predetermined signal processing, and the imaging module; 10, 10A, 10B, and an image output device 24 for printing out, etc. to the paper after predetermined signal processing for printing a color image signal from 10C or 10D.

  As this electronic information device 20, for example, a digital camera such as a digital video camera and a digital still camera, an image input camera such as a surveillance camera, a door phone camera, an in-vehicle camera, and a television phone camera, a scanner, a facsimile, and a camera-equipped mobile phone. An electronic device having an image input device such as a telephone device is conceivable.

  Therefore, according to the fifth embodiment, based on the color image signal from the imaging module 10, 10A, 10B, 10C, or 10D, this is displayed on the display screen, or this is output on the paper as an image output device. 24 is printed out well, it is communicated well as wired or wireless as communication data, it is stored in the memory unit 21 by performing predetermined data compression processing, and various data processing is good Can be done. The electronic information device 20 only needs to include at least one of the memory unit 21, the display unit 22, the communication unit 23, and the image output device 24.

  Although not particularly described in the first to fourth embodiments, the sensor chip 5 is mounted on the substrate 4, and the condenser lenses 2 a and 2 b for forming an image of the subject light on the sensor chip 5 are formed on the back side recesses. The holder member 1, 1A, 1C, or 1D accommodated in the inside covers the sensor chip 5 with the concave portion so that the inside of the concave portion is sealed or semi-sealed (including a case where it is communicated with the inside through a part of the gap). In the imaging module 10, 10 A, 10 B, 10 C, or 10 D mounted on the substrate 4, positioning in the height direction comes into direct contact with the surface of the sensor chip 5 at the stepped portion 1 f or 1 g provided in the back side recess. The part 1b, 1bA, 1bB or 1bC is provided. As a result, the number of component parts is reduced to provide a simpler structure, thereby reducing the number of assembling steps, improving the assembling accuracy, and eliminating the need for optical adjustment.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-5 of this invention, this invention should not be limited and limited to this Embodiment 1-5. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 5 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention provides an image pickup device in which an image pickup device having a plurality of light receiving units that photoelectrically convert image light from a subject to image and a lens for imaging incident light on the image pickup device are modularized (integrated). Module and manufacturing method thereof, and this imaging module is used in an imaging unit as an image input device such as an in-vehicle camera, for example, a digital camera such as a digital video camera and a digital still camera, an image input camera such as an in-vehicle camera, a scanner, In the field of electronic information equipment such as a facsimile, a camera-equipped mobile phone device and a portable terminal device (PDA), the height direction positioning portion is directly applied to the upper surface of the sensor chip as a reference surface of the holder member for positioning in the height direction. Therefore, the assembly accuracy variation of the condenser lens with respect to the holder member, the molding accuracy of the holder member Which variations cause is considered, but since the number of parts as compared with the conventional structure is also less simple structure, it is possible to improve the assembling accuracy while decreasing the number of assembling steps can be a focus adjustment free. Also, since the surface of the sensor chip and the height direction positioning part are not bonded, and no adhesive is interposed therebetween, the lens and the upper surface of the sensor chip are compared with the case of bonding with an adhesive. As a result, it is possible to perform assembling with higher accuracy and to make focus adjustment free.

It is a longitudinal cross-sectional view which shows typically the example of a principal part structure of the imaging module which concerns on Embodiment 1 of this invention. It is a longitudinal cross-sectional view which shows typically the manufacturing method of the imaging module of FIG. 1 for every manufacturing process. FIG. 5 is a schematic plan view for explaining a sensor unit / lens unit combination process of the imaging module corresponding to FIG. It is a longitudinal cross-sectional view which shows typically the example of a principal part structure of the imaging module which concerns on Embodiment 2 of this invention. It is a top view which shows typically the positional relationship of the upper surface of a sensor chip and the dotted | punctate height direction positioning part in the imaging module which concerns on Embodiment 3 of this invention. It is the figure which looked at the oval-shaped height direction positioning part in the imaging module of this Embodiment 3 from the back side, Comprising: It is a plane schematic diagram which shows the case where a board | substrate is fixed with four pins. It is a block diagram which shows schematic structural example of the electronic information device which used the imaging module in any one of Embodiment 1-3 of this invention for the imaging part as Embodiment 4 of this invention. FIG. 2 is a structural diagram schematically illustrating a configuration example of a main part of a conventional imaging module described in Patent Document 1, wherein (a) is a longitudinal sectional view of the conventional imaging module, and (b) is a conventional imaging module. It is a top view. FIG. 10 is a vertical cross-sectional view schematically showing a configuration example of a main part of a conventional imaging device disclosed in Patent Document 2. (A) is the top view which shows typically the principal part structural example of the imaging module which concerns on Embodiment 4 of this invention, (b) is the AA line longitudinal cross-sectional view of (a), (c), A top view of the imaging module in FIG. 1 for comparison with this, (d) is a longitudinal sectional view taken along line BB in (c). 10A is a rear view of the holder member in FIG. 10A, and FIG. 10B is a rear view of the holder member in the imaging module of FIG. 1 or FIG. 4 for comparison with the holder member. It is a longitudinal cross-sectional view which shows typically the modification of the imaging module which concerns on Embodiment 4 of this invention. It is a longitudinal cross-sectional view of the imaging module for demonstrating the other effect of the imaging module of this invention.

Explanation of symbols

1, 1A, 1C, 1D Holder member 1a Circular hole (transparent circular area)
1b, 1bA, 1bB, 1bB1, 1bB2, 1bC Height direction positioning part (protruding part or step part)
1c Bottom surface in back side recess 1d First step portion 1f Second step portion 2a First condenser lens 2b Second condenser lens 3 Light-shielding film 4 Substrate 5 Sensor chip (imaging chip)
5a Imaging area 6 IR cut filter 7 Adhesion 7a Adhesive (adhesive)
10, 10A, 10B, 10C, 10D Imaging module 11 Lens unit 11a External step 12 Sensor unit 20 Electronic information device 21 Memory unit 22 Display unit 23 Communication unit 24 Image output device

Claims (19)

  In the imaging module mounted on the substrate so that a holder member that accommodates a condensing lens for imaging subject light on the imaging chip mounted on the substrate covers the imaging chip, the holder An imaging module in which the member is supported directly on the surface of the imaging chip; An imaging chip is mounted on the substrate, and a holder member that houses a condensing lens for forming an image of subject light on the imaging chip inside the back-side recess covers the imaging chip with the back-side recess and the back-side recess In the imaging module mounted on the substrate so that the inside is sealed or semi-sealed,
An imaging module in which a height direction positioning part that directly contacts the surface of the imaging chip is provided in a stepped part provided in the back side recess.   The imaging according to claim 1 or 2, wherein a part of the holder member supported directly on the surface of the imaging chip is a height direction positioning portion between the condenser lens and the surface of the imaging chip. module.   4. The imaging module according to claim 2, wherein the height direction positioning portion is the entire surface of the stepped portion or a part thereof, or a protruding portion protruding from the stepped portion in a planar shape or a dot shape. 5.   The imaging module according to claim 4, wherein a tip end surface of the projecting portion that contacts the surface of the imaging chip is circular or oval.   The imaging module according to claim 4, wherein a plurality of the protruding portions are provided and abut on a surface other than the imaging region of the imaging chip at a plurality of locations.   5. The imaging module according to claim 2, wherein the stepped portion is formed so as to escape a deformed portion due to a dicing end surface of a surface edge portion of the imaging chip.   5. The imaging module according to claim 2, wherein the projecting portion is formed so as to project away from a deformed portion due to a dicing end surface of a surface edge portion of the imaging chip.   3. The imaging according to claim 2, wherein the condenser lens is positioned and accommodated on a bottom surface inside a back-side concave portion of the holder member, and a side wall inside the back-side concave portion and an outer peripheral end surface of the condenser lens are bonded and fixed. module.   The imaging module according to claim 1, wherein the condensing lens is a two-lens group lens, and a light-shielding film having a light passage hole provided in a central portion is sandwiched between the two lenses. .   The infrared cut filter which cuts infrared rays from the incident light which passed the said condensing lens and is radiate | emitted to the said imaging chip side is provided in the said holder member so that the upper direction of the said imaging chip may be crossed. Or the imaging module of 2.   3. The imaging according to claim 1, wherein the whole or a part of the stepped portion on the back surface of the holder member is a height direction positioning portion that is placed directly on the imaging chip without an adhesive. module.   The imaging module according to claim 12, wherein the contact between the height direction positioning portion and the surface of the imaging chip is a two-surface contact or a three-surface contact by the entire surface of the stepped portion or a partial surface thereof.   The imaging module according to claim 12, wherein a step is provided as the height direction positioning portion without passing through another step from the bottom surface of the recess that is a lens housing reference surface of the holder member. A sensor unit forming step of mounting an imaging chip on a substrate;
A lens unit forming step for accommodating and fixing a condensing lens for forming an image of subject light on the imaging chip in the concave portion on the back side of the holder-member in this order or in the reverse order.
The height direction positioning portion of the step portion provided in the back side recess is brought into direct contact with the surface of the imaging chip to cover the imaging chip with the back side recess, and in this state, the inside of the back side recess is sealed or An image pickup module manufacturing method for performing a sensor unit / lens unit combination step of bonding the holder member to the substrate with an adhesive so as to be semi-sealed.   In the sensor unit forming step, the imaging chip is mounted at a predetermined position on the substrate, and wire bonding is performed between the plurality of input / output pads of the imaging chip and predetermined terminals of the substrate. The method for manufacturing an imaging module according to claim 15, wherein the imaging chip is fixed to the imaging module.   In the lens unit forming step, the condenser lens is inserted and positioned up to the bottom surface in the concave part on the back side of the holder-member, and in this state, the inner peripheral wall of the concave part on the back side of the holder-member and the outer peripheral end surface of the condenser lens The method for manufacturing an imaging module according to claim 15, wherein the two are bonded and fixed with an adhesive.   In the sensor unit / lens unit combining step, a holder member containing the condenser lens is attached to the substrate on which the imaging chip is mounted, and the imaging chip is connected to the imaging chip by an automatic assembly device that recognizes a planar image of the imaging chip. The method of manufacturing an imaging module according to claim 15, wherein the positioning of the imaging module and the imaging chip are carried directly on the imaging chip.   An electronic information device using the imaging module according to claim 1 as an image input device in an imaging unit.