JP2005333170A - Solid-state imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus capable of attaining cost-reduction by facilitating focus adjustment. <P>SOLUTION: The solid-state imaging apparatus 1 is configured by combining a holder 3 shaped nearly a cube with an IC 5 fixed thereto, with a lens barrel 2 shaped nearly a cylinder to which an optical component such as a lens is fixed. A projected bearing surface 2h in an axial direction is formed to four positions of a step part 2g of the lens barrel 2 with the same height at an equal interval in a circumferential direction. Supporting surfaces a, b, c, d, e, f formed stepwise having a very small difference (e.g., 10 μm) are consecutively arranged at four positions along a cylindrical wall face 3a of the holder 3. The height size of the lens and a solid-state imaging element can be adjusted by selecting one of the supporting surfaces and pressing the selected supporting surface into contact with the bearing surface 2h to combine an assembly of lens barrel 2 and an assembly of the holder 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solid-state imaging device.

  An imaging device incorporated in a digital camera, a notebook computer with a camera, a mobile phone, or the like includes a solid-state imaging device and components such as a circuit board, a lens, a lens holder, and a filter. In the process of assembling the imaging device, the positional relationship between optical components such as lenses and filters and the solid-state imaging device must be finished with high accuracy. In particular, a compact imaging module is used for a camera-equipped mobile phone or the like. For example, when the solid-state imaging device has a level of 100,000 pixels, the focus appears to be in focus even if the focal position is shifted by about 50 μm, but 300,000 pixels. If it is above, the image appears blurred when it is shifted by about 20 μm. In view of this, as a device for ensuring the positional relationship with high accuracy, a device in which the deposition position of an integrated circuit (IC), which is a solid-state imaging device, is variable has been devised (for example, see Patent Document 1).

An example of such a conventional solid-state imaging device will be described with reference to the drawings. FIG. 5 is a schematic diagram of a central longitudinal section showing the positional relationship between an optical component of a conventional solid-state image pickup device and an IC, and the case of the solid-state image pickup device is omitted. In FIG. 5, 51 is a first lens, 52 is a second lens, and 53 is an IC which is a solid-state imaging device element. A spacer 54 is disposed between the first lens 51 and the second lens 52. These parts are fixed to the housing of the solid-state imaging device. By selectively using the spacers 54 having different thicknesses, the position adjustment in the height direction between the IC 53 surface and the second lens 52 surface has been performed.
JP 2001-333332 (page 2-3, FIG. 1)

  However, as described above, position adjustment in the height direction between the lens surface and the IC surface is performed by selecting and using spacers having different thicknesses. The typical spacer thickness used there is 25, 38, 50 μm, etc., and fine height adjustment up to 10 μm was not possible. Further, in order to replace the spacer 54 incorporated between the first lens 51 and the second lens 52, the second lens 52 must be disassembled from the lens barrel each time, and man-hours for replacement are required. Was bringing up the cost of the product.

  The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a solid-state imaging device capable of improving productivity and reducing cost by facilitating highly accurate focus adjustment. That is.

  In order to achieve the above-described object, the present invention provides an optical component including a lens and a filter, and a solid-state imaging device in which an IC, which is a solid-state imaging device, is fixed to a casing. A plurality of seats having the same axial height on either one of the lens barrel and the holder. The surface is formed at equal intervals in the circumferential direction, and a plurality of receiving surfaces with which each of the seating surfaces abuts on the other of the lens barrel and the holder has a stepped shape along the cylindrical wall surface. The position of the lens barrel and the holder in the height direction is adjusted by selecting and combining any one of the plurality of receiving surfaces with the receiving surface with which the seat surface abuts. It is possible to make it possible.

  Further, the plurality of seating surfaces are at the same height, and the receiving surfaces corresponding to each of the plurality of seating surfaces have the same height.

  Further, at least one of the lens barrel and the holder is provided with an alignment mark for aligning the circumferential position of the seating surface and the receiving surface.

  According to the present invention, in an optical component including a lens and a filter, and a solid-state imaging device in which an IC that is a solid-state imaging element is fixed to a casing, the casing has a substantially cylindrical barrel that fixes the optical component; A combination of a holder that fixes the IC and fits into the lens barrel, and a plurality of seating surfaces having the same axial height are formed in the lens barrel at equal intervals in the circumferential direction, In the holder, a plurality of receiving surfaces with which each of the seating surfaces abuts are formed in a stepped shape having a minute step along a cylindrical wall surface, and the receiving surfaces with which the seating surface abuts are defined as the plurality of receiving surfaces. Since the position of the lens barrel and the holder in the height direction can be adjusted by selecting and combining any one of the above, the focus adjustment process is simplified and the cost of the solid-state imaging device is reduced. I was able to.

  Hereinafter, a solid-state imaging device which is the best embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a central longitudinal sectional view showing a solid-state imaging device according to an embodiment of the present invention. FIG. 2 is a bottom view of the lens barrel shown in FIG. FIG. 3 is a plan view of the holder shown in FIG. FIG. 4 is a partial perspective view showing details of the receiving surface of the holder.

  First, the configuration of the solid-state imaging device according to the embodiment of the present invention will be described. In FIG. 1, reference numeral 1 denotes a solid-state imaging device. Reference numeral 2 denotes a substantially cylindrical lens barrel to which an optical component such as a lens, which will be described later, is fixed. Reference numeral 3 denotes a substantially cubic holder that is combined with the lens barrel 2 and constitutes the housing of the solid-state imaging device 1. Reference numeral 4 denotes an FPC (flexible wiring board), which is bonded to the lower end surface of the holder 3. A connecting portion 4 a for connecting to the outside from the FPC 4 protrudes from the side surface of the holder 3. Reference numeral 5 denotes an IC which is a solid-state imaging device, and is mounted face-down on the FPC 4. 6 is a sealing resin covering the periphery of the IC 5 except for the light receiving surface.

  Counterbore portions 2a and 2b are formed at the upper center of the lens barrel 2, and a light receiving opening 2c is formed at the center thereof. A step 2d is formed below the opening 2c, and a groove 2f and a step 2g are formed on the outer periphery of the lower cylindrical portion 2e. As shown in FIG. 2, the step 2g has a height in the axial direction. The protruding seating surfaces 2h having the same length are formed at four locations at equal intervals in the circumferential direction.

  7 is a first lens stored in contact with the step 2d, 8 is a second lens superimposed on the first lens 7, and 9 is a light shielding spacer sandwiched between the first lens 7 and the second lens 8. Reference numeral 10 denotes a ring-shaped lens pressing member, which is fixed to the lens barrel 2 by pressing the lower surface of the second lens 8. Reference numeral 11 is an infrared cut filter fixed to the counterbore 2b, and 12 is a transparent decorative seal fixed to the counterbore 2a. Reference numeral 13 denotes a light-shielding O-ring disposed between the cylindrical wall surface 3a of the holder 3 and the groove 2f. Reference numeral 14 denotes an FPC which is an interface for connecting the solid-state imaging device 1 to an external device, and is connected to the connection portion 4a of the FPC 4 by a connector such as an ACF.

  As shown also in FIGS. 3 and 4, a plurality of receiving surfaces formed in a step shape having minute steps (for example, 10 μm) along the cylindrical wall surface 3 a of the holder 3, here a, b, c, d , E, and f are continuously arranged at four locations. The heights of the four receiving surfaces with the same reference numerals, which are the receiving surfaces with which the four seating surfaces 2h are in contact, are equal. The outer periphery of the cylindrical portion 2e of the lens barrel 2 is fitted to the inner wall 3b inside the receiving surface. A light receiving opening 3 c is formed at the center of the holder 3.

  Here, focusing of the solid-state imaging device 1 will be described. First, an optical component is assembled and fixed to the lens barrel 2, and an IC 5 is mounted on the holder 3 to form respective assemblies. Next, the lens barrel 2 assembly and the holder 3 assembly are combined. At this time, the seating surface 2h of the lens barrel 2 is any one of the receiving surfaces a, b, c, d, e, and f of the holder 3. The rotation position is adjusted and held so as to contact (for example, c or d). In order to match the positions of the seating surface 2h and the receiving surface in the circumferential direction, the concave portion 3e as an alignment mark provided on the upper end surface 3d outside the receiving surface is used as a guide. In this state, the light emitted from the chart surface of the test chart previously disposed in front of the lens barrel 2 assembly forms an image on the light receiving surface of the IC 5 through the filter 11, the first lens 7, and the second lens 8. The sharpness of the image is confirmed on the monitor screen connected by the FPC 14 of the interface drawn out from the FPC 4.

  Of the stepped receiving surfaces, the receiving surface near the center (for example, c or d) is formed so that the position in the height direction becomes a design target value. When the receiving surface is not focused, it is possible to select another adjacent receiving surface and recombine the lens barrel 2 to adjust the focal position. When the focal position is determined, an adhesive is applied to the gap between the lens barrel 2 and the assembly of the holder 3 in that state, and both are fixed.

  Next, effects of the embodiment of the present invention will be described. As described above, since the holder 3 is provided with a plurality of receiving surfaces having different heights for receiving the seating surface 2h of the lens barrel 2, the lens barrel 2 assembly in which the optical components are assembled, the holder 3 assembly in which the IC 5 is fixed, In the focus adjustment before assembling, any one of the receiving surfaces can be easily selected and combined, and the cost of the solid-state imaging device can be reduced.

  In the above description, two lenses have been described. However, the number of lenses is not necessarily limited to two. Further, although the number of seating surfaces 2h of the lens barrel 2 is four, any number of three or more may be used. The present invention is not limited to this embodiment, and the seat surface 2h is arranged not on the lens barrel 2 but on the holder side, and the receiving surfaces a to f are arranged not on the holder 3 but on the lens barrel 2. Also good. In this case, the rotational position alignment mark may be provided on either or both of the seat surface side and the receiving surface side.

  The solid-state imaging device of the present invention is not limited to the one in this embodiment, and can be widely applied to other various imaging devices.

It is a center longitudinal cross-sectional view which shows the solid-state imaging device which is embodiment of this invention. It is a bottom view of the lens barrel of FIG. It is a top view of the holder of FIG. It is a fragmentary perspective view which shows the receiving surface of the holder of FIG. It is a schematic cross section of the conventional solid-state imaging device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solid-state imaging device 2 Lens barrel 2h Seat surface 3 Holder 3a Cylindrical wall surface 5 IC
7 First lens 8 Second lens 11 Filter a, b, c, d, e, f Receiving surface

Claims (3)

  An optical component including a lens and a filter, and a solid-state imaging device in which an IC, which is a solid-state imaging device, is fixed to a casing. The casing fixes a substantially cylindrical lens barrel to which the optical component is fixed, and the IC. A combination of a holder that fits into the lens barrel, and a plurality of seating surfaces having the same axial height are formed at equal intervals in the circumferential direction on either the lens barrel or the holder. A plurality of receiving surfaces with which each of the seating surfaces abuts are formed on the other of the lens barrel and the holder in a stepped shape having a minute step along the cylindrical wall surface, and the seating surface abuts. A solid-state imaging device characterized in that the position of the lens barrel and the holder in the height direction can be adjusted by selecting and combining any one of the receiving surfaces from the plurality of receiving surfaces.   The solid-state imaging device according to claim 1, wherein the plurality of seating surfaces are at the same height, and the receiving surfaces corresponding to each of the plurality of seating surfaces have the same height. The alignment mark for aligning the circumferential position of the seat surface and the receiving surface is disposed on at least one of the lens barrel and the holder. Item 3. The solid-state imaging device according to Item 2.

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