JP4277665B2 - Imaging device and portable terminal equipped with the imaging device - Google Patents

Description

  The present invention relates to an imaging device, and more particularly to a small and thin imaging device built in a portable terminal.

  Conventionally, a small and thin imaging device is mounted on a small and thin electronic device such as a mobile phone or a PDA (Personal Digital Assistant), so that not only audio information but also image information can be transmitted to a remote place. It is possible to transmit to each other.

  These imaging devices built in these portable terminals have a very short focal length of the imaging optical system and an aperture F value of about 2 to 4, so that the focal depth on the image side becomes very shallow, and imaging is performed. Strict accuracy is required for positioning the imaging optical system with respect to the surface in the optical axis direction. In addition, each of the light receiving units that perform photoelectric conversion is arranged at a pitch of several μm. Therefore, if there is dust that blocks the subject luminous flux on the microlens arranged on the light receiving element, the subject image data is hindered. Will come.

On the other hand, proposals have been made regarding a position setting method and a dustproof method for an imaging optical system of an imaging apparatus. For example, in order to eliminate the need for focus adjustment at the time of manufacturing the imaging device, the leg formed integrally with the optical member is brought into contact with the imaging element, and the optical member is biased toward the imaging element by an elastic member. A device having a dustproof and moistureproof structure while positioning the image pickup element and the optical member in the optical axis direction is disclosed (for example, see Patent Document 1).
JP 2003-37758 A

  An image pickup apparatus mounted on the above-described mobile terminal is also required to have a high image quality as the penetration rate increases, and an image pickup apparatus including an image pickup element having a high number of pixels is required.

  However, the increase in the number of pixels of the image sensor aiming at high image quality reduces the pixel pitch, and the allowable size of the dust adhering to the photoelectric conversion surface of the image sensor is further reduced, which is no longer visible with the naked eye. Even if the dust adheres, the subject luminous flux is blocked, and image data cannot be obtained, causing a problem.

  On the other hand, the image pickup apparatus described in Patent Document 1 is an effective method that does not require an adjustment process for positioning the image pickup element and the optical member in the optical axis direction and can prevent dust from entering from the outside. However, if micro-vibration or the like takes a long time inside, dust due to contact between the leg part of the optical member and the partition wall of the lens frame or wear from the contact part between the leg part and the image sensor occurs. If it adheres to the upper surface, the subject luminous flux may be blocked, which may cause a defect that impedes the subject image data.

  In addition, when zooming or close-up shooting is performed to move the imaging optical system, it is necessary to mechanically connect with an operation member or a driving member for moving the imaging optical system, and external dust enters from this coupling portion, There is a problem that causes similar drawbacks.

  In view of the above-described problems, the present invention provides an imaging device in which dust that has entered from the outside and dust generated by an internal operation do not adhere to the imaging device and interfere with image data, and a portable terminal equipped with the imaging device The purpose is to obtain.

  The above problem can be solved by the following.

  1) An imaging device, a pedestal formed with legs that contact the imaging device, an imaging optical system that guides subject light to the imaging region of the imaging device, the imaging device, the pedestal, and the imaging optical system are included. And an outer frame member that seals a space on the photoelectric conversion surface side of the imaging element with the pedestal or a part of the pedestal and the outer frame member.

  2) In a state where the leg portion is in contact with the image sensor, an adhesive portion at a position different from the leg portion of the pedestal is bonded to a substrate on which the image sensor is mounted or the outer frame member, and the image sensor 1) The imaging device in which the space on the photoelectric conversion surface side is sealed.

  3) The imaging apparatus according to 1) or 2), wherein the imaging optical system includes a contact portion that contacts the pedestal, and the imaging optical system is biased toward the pedestal by an elastic member.

  4) The imaging device according to any one of 1) to 3), wherein the pedestal has a cam surface, and the imaging optical system is moved along the optical axis by rotating the imaging optical system on the cam surface.

  5) The pedestal has contact horizontal planes formed at different heights, and the imaging optical system is incorporated by selecting any one of the horizontal planes. .

  6) The imaging apparatus according to any one of 1) to 5), wherein a part of an optical member constituting a photographing optical system is formed in a photographing light beam transmitting portion of the pedestal.

  7) The imaging device according to any one of 1) to 6), wherein an infrared light cut filter is formed on the pedestal.

  8) The imaging apparatus according to any one of 1) to 7), wherein the imaging optical system includes a plurality of optical members, and the optical members are in contact with each other.

  9) A portable terminal including the imaging device according to any one of 1) to 8).

  The imaging device of the present invention, a pedestal on which a leg portion that contacts the imaging device is formed, an imaging optical system that guides subject light to the imaging region of the imaging device, and an outer frame that includes the imaging device, the pedestal, and the imaging optical system And an image pickup device in which the space on the photoelectric conversion surface side of the image pickup device is sealed by a pedestal or a part of the pedestal and the outer frame member, by dust entering from the outside and internal operation It is possible to prevent the generated dust from adhering to the image pickup device and to obtain an image pickup device that does not interfere with image data.

  In addition, with the legs in contact with the image sensor, the bonding portion at a position different from the legs of the pedestal is bonded to the substrate or outer frame member on which the image sensor is mounted, and the space on the photoelectric conversion surface side of the image sensor By sealing the adhesive, the adhesive does not enter under the leg portion, and there is no deviation in the optical axis direction of the imaging optical system.

  Further, the imaging optical system is formed with a contact portion that contacts the pedestal, and the imaging optical system is biased to the pedestal by the elastic member, so that the imaging optical system is held via the elastic member, so that the outside is removed. Even if an external force is applied to the frame member, it can be configured such that no external force is directly applied to the imaging optical system, and the frame member can be made highly durable.

  Further, the pedestal has a cam surface, and the imaging optical system rotates on the cam surface so that the imaging optical system is moved along the optical axis, thereby intervening components involved in the position in the optical axis direction. Therefore, it is possible to obtain an image pickup apparatus that can accurately position the image pickup element and the image pickup optical system in the optical axis direction and can perform close-up shooting at low cost.

  Alternatively, the pedestal has horizontal surfaces for contact formed at different heights, and the imaging optical system has a fixed focus in this case by selecting and incorporating any of the horizontal surfaces. Therefore, it is possible to obtain an imaging apparatus that absorbs manufacturing variations of the back focus of the imaging optical system and is always focused on a predetermined subject distance.

  Further, by forming a part of the optical member constituting the photographing optical system in the photographing light beam transmitting portion of the pedestal, the number of parts can be reduced and the cost can be reduced.

  Furthermore, by forming an infrared light cut filter on the pedestal, the number of parts can be reduced and the cost can be reduced, and the thickness of the image pickup apparatus can be reduced compared to a method in which an infrared light cut filter is arranged in front of the image pickup optical system. Can be made thinner.

  In addition, the imaging optical system is composed of a plurality of optical members, and the optical members are brought into contact with each other so that they are configured without any other member, so that the distance between the lenses can be assembled without error, and the adjustment process can be performed. It can be unnecessary.

  In addition, by using a portable terminal equipped with any of the imaging devices described above, a portable terminal equipped with an imaging device having the above-described effects can be obtained.

  Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.

  FIG. 1 is a diagram showing an external appearance of a mobile phone T that is an example of a mobile terminal in which an imaging device of the present invention is built.

  In the mobile phone T shown in FIG. 1, an upper casing 71 as a case having a display screen D and a lower casing 72 having an operation button P are connected via a hinge 73. The imaging device S is built below the display screen D in the upper casing 71, and is arranged so that the imaging device S can capture light from the outer surface side of the upper casing 71.

  Below the display screen D of the upper casing 71, an arcuate opening 74 and the operation member 15 are disposed so as to be exposed from the opening 74. By moving the operation member 15 upward in the drawing within the opening 74, the focus position at the time of macro photography is set.

  Note that the position of the imaging device may be arranged above or on the side of the display screen D in the upper casing 71, and the same applies to the position of the operation member 15. Of course, the mobile phone is not limited to a folding type.

(First embodiment)
FIG. 2 is a perspective view of the imaging apparatus 100 according to the first embodiment of this invention. The imaging apparatus 100 in the figure corresponds to the imaging apparatus S in FIG.

  As shown in FIG. 2, the outer surface of the image pickup apparatus 100 includes a printed circuit board 11 on which an image sensor is mounted, a connect board 17 for connection to another control board of the mobile terminal, and the printed board 11 and the connect board 17. A flexible printed circuit board FPC to be connected, an outer frame member 12, a lid member 13 incorporated on the upper surface of the outer frame member 12, and an operation member 15 rotatably attached to a boss 12b formed integrally with the outer frame member 12. The operation member 15 is composed of a stepped screw 16 that rotatably fixes the operation member 15.

  FIG. 3 is a cross-sectional view of the imaging device 100 taken along line FF shown in FIG. Hereinafter, in order to avoid duplication of explanation, the same reference numerals are given to the same members.

  In the figure, the outer frame member 12 includes a first lens 1, an aperture stop 4 that determines the aperture F value of the imaging optical system, a second lens 2, fixed apertures 5a and 5b for blocking unnecessary light, and a third lens. 3, an imaging optical system 50 configured by 3, a pedestal 6, an imaging element 8 mounted on a printed circuit board 11, a compression coil spring 9 that is an elastic member, and a lid member 13.

  The pedestal 6 according to the present invention has at least three leg portions 6d that abut against the image pickup device 8 on the image plane side.

  FIG. 4 is a perspective view of the pedestal 6 used in the imaging apparatus 100. This figure is a view seen from the imaging optical system 50 side.

  As shown in FIG. 4, the pedestal 6 is made of a light-transmitting material, and has a low horizontal surface D, a high horizontal surface E on the imaging optical system 50 side, and an inclined surface that continuously connects the horizontal surfaces. F are formed at intervals of approximately 120 ° (hereinafter referred to as cam surfaces). Further, the imaging light beam transmitting portion 6t formed with a plane parallel plate and a frame portion 6h formed in a square box shape are formed.

  Returning to FIG. 3, the pedestal 6 is incorporated so as to surround the periphery of the image pickup device 8 with the frame portion 6 h, and as shown in the drawing, the leg portion 6 d is in contact with the image pickup device 8. The frame portion 6h, which is an adhesive portion at a different position, and the printed board 11 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). That is, the pedestal 6 seals the space C on the photoelectric conversion surface side of the image sensor 8 to be an isolated space, and can prevent dust from entering the space C from the outside.

  In addition, since the adhesive portion between the leg portion 6d and the frame portion 6h is a different surface, the adhesive A does not enter under the leg portion 6d, and the optical axis direction shift of the imaging optical system does not occur. .

  Furthermore, the outer frame member 12 is bonded and fixed to the printed circuit board 11 and an adhesive B (for example, a rubber-based adhesive) on the outer periphery thereof.

  As shown in the figure, the imaging optical system 50 is a unit in which the first lens 1, the second lens 2, and the third lens 3 are brought into contact with each other at a flange portion other than the optically effective surface and are fixed to each other with an adhesive or the like. By constructing without using other members, the distance between the lenses can be assembled without error.

  On the imaging surface side of the third lens 3 constituting the imaging optical system 50, protrusions 3a are formed at intervals of approximately 120 °, and are arranged corresponding to the cam surfaces formed on the pedestal 6, and this protrusion 3a. This makes contact with the cam surface of the base 6. Further, a compression coil spring 9 is incorporated between the lid member 13 and the flange portion of the third lens 3 on the subject side of the flange portion of the third lens 3. The imaging optical system 50 and the pedestal 6 are urged toward the imaging element 8 by the compression coil spring 9.

  On the other hand, the boss 15b formed on the operation member 15 that can be rotated by the stepped screw 16 is engaged with the bifurcated portion 3f of the third lens 3 and assembled (see FIG. 2). This operation member 15 exposed from the opening 74 of the portable terminal T shown in FIG. 1 is a part operated by the user.

  In the imaging apparatus 100 configured as described above, the bifurcated portion 3 f of the third lens 3 that engages with the boss 15 b is also rotated by the rotation operation of the operation member 15, and the protrusion formed on the third lens 3. 3a moves from the low horizontal surface D of the cam surface to the high horizontal surface E via the inclined surface F, whereby the imaging optical system 50 moves to the subject side along the optical axis. This makes it possible to switch between long-distance shooting and short-distance shooting.

  In other words, the space 6 on the photoelectric conversion side of the image sensor 8 is sealed by the pedestal 6, so that dust that has entered from the outside and dust generated by the internal operation wrap around and adhere to the image sensor, and become image data. Can solve problems that cause problems. Further, the cam surface is formed on the base 6 having the leg 6d that is in contact with the image pickup device 8, and the image pickup optical system biased by the elastic member is brought into contact with the cam surface, thereby being involved in the position in the optical axis direction. The intervening part can be the pedestal 6 only, and the image pickup device and the image pickup optical system can be accurately positioned in the optical axis direction. In addition, an image pickup apparatus capable of close-up shooting can be obtained.

(Second Embodiment)
The second embodiment of the present invention will be described below. 2nd Embodiment shows the example which sealed the space by the side of the photoelectric conversion surface of an image pick-up element by the base and a part of outer frame member.

  The appearance of the mobile phone T provided with the image pickup apparatus of the second embodiment and the perspective view of the image pickup apparatus 150 are the same as those in FIGS. Further, the following imaging device 150 corresponds to the imaging device S in FIG.

  FIG. 5 is a cross-sectional view of the imaging device 150 according to the second embodiment of the present invention cut along the line FF shown in FIG. Hereinafter, in order to avoid duplication of explanation, the same reference numerals are given to the same members, and different parts from the first embodiment will be described.

  3, the inside of the outer frame member 12 includes an imaging optical system 50 similar to that in FIG. 3, a pedestal 6, an imaging element 8 mounted on the printed circuit board 11, a compression coil spring 9 that is an elastic member, and a lid member 13. It is configured.

  As shown in the figure, the pedestal 6 has leg portions 6d that are in contact with the image sensor 8 at least at three locations on the image plane side.

  FIG. 6 is a perspective view of the pedestal 6 used for the imaging device 150. This figure is a view seen from the imaging optical system 50 side.

  As shown in FIG. 6, the pedestal 6 is formed of a light-transmitting material, and the horizontal surface D having a low height and the horizontal surface E having a high height are continuously formed on the imaging optical system 50 side as in FIG. Inclined surfaces F that are connected to each other are formed at intervals of approximately 120 ° (hereinafter referred to as cam surfaces). Further, the imaging light beam transmitting portion 6t on which a plane-parallel plate is formed, a flange portion 6j, and a positioning projection 6k.

  Returning to FIG. 5, the pedestal 6 is assembled by aligning a notch portion (not shown) formed on the outer frame member 12 and a positioning projection 6 k, and as shown in the drawing, a flange portion 6 j that is an adhesive portion and The inscribed surfaces of the positioning projection 6k and the outer frame member 12 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). Further, the outer frame member 12 is first bonded and sealed to the printed circuit board 11 with an adhesive A on the outer periphery thereof, and then bonded and fixed with an adhesive B (for example, a rubber-based adhesive). In this case, the adhesive B is for reinforcement and may be omitted.

  That is, the space on the photoelectric conversion surface side of the image pickup device 8 is sealed and separated by the pedestal 6 and the outer periphery of the outer frame member 12 so that dust can be prevented from entering the space from the outside. Become.

  The imaging apparatus 150 configured as described above can operate in the same manner as described with reference to FIG. 3, and the imaging optical system 50 can move to the subject side along the optical axis. Can be switched.

  That is, the space on the photoelectric conversion side of the image sensor 8 is sealed by the pedestal 6 and a part of the outer frame member, so that dust that has entered from the outside and dust generated by internal operation wrap around the image sensor. The problem of adhering to the image data can be solved. Further, similarly, a cam surface is formed on the base 6 having the leg portion 6d in contact with the image pickup element 8, and the image pickup optical system biased by the elastic member 9 is brought into contact therewith, whereby the position in the optical axis direction is determined. Therefore, it is possible to provide only the pedestal 6 as the intervening part involved in the image pickup device, and it is possible to accurately position the image pickup element and the image pickup optical system in the optical axis direction.

(Third embodiment)
The third embodiment of the present invention will be described below. The third embodiment is an example in which the pedestal has horizontal contact surfaces formed at different heights, and the imaging optical system is incorporated by selecting any one of the contact surfaces.

  The appearance of the mobile phone T provided with the imaging device of the third embodiment is the same as that shown in FIG. 1 except that the opening 74 and the operation member 15 are omitted. The following imaging device 200 corresponds to the imaging device S in FIG.

  FIG. 7 is a perspective view of an imaging apparatus 200 according to the third embodiment of the present invention. Hereinafter, in order to avoid duplication of description, the same reference numerals are given to the same functional members, and different parts from the first and second embodiments will be described.

  As shown in the figure, the outer surface of the image pickup apparatus 200 includes a printed circuit board 11 on which an image sensor is mounted, a connect board 17 for connection to another control board of the mobile terminal, and the printed circuit board 11 and the connect board 17. A flexible printed circuit board FPC to be connected, an outer frame member 12, and a lid member 13 incorporated on the upper surface of the outer frame member 12.

  FIG. 8 is a cross-sectional view of the imaging apparatus 200 according to the third embodiment of the present invention cut along the line GG shown in FIG.

  3, the inside of the outer frame member 12 includes an imaging optical system 50 similar to that in FIG. 3, a pedestal 6, an imaging element 8 mounted on the printed circuit board 11, a compression coil spring 9 that is an elastic member, and a lid member 13. It is configured. As shown in the figure, the pedestal 6 has leg portions 6d that are in contact with the image sensor 8 at least at three locations on the image plane side.

  A compression coil spring 9 is incorporated between the lid member 13 and the flange portion of the third lens on the subject side of the flange portion of the third lens constituting the imaging optical system 50. The imaging optical system 50 and the pedestal 6 are urged toward the imaging element 8 by the compression coil spring 9.

  FIG. 9 is a plan view of the pedestal 6 used in the imaging device 200. This figure is a view seen from the imaging optical system 50 side.

  In the same figure, the pedestal 6 is formed of a translucent material, and horizontal surfaces K, L, M, and N having different heights are formed on the imaging optical system 50 side at intervals of approximately 120 °, respectively, on the circumference. It has three horizontal planes at the same height. That is, the positions of the same reference numerals in the figure have the same height from the contact surface of the leg 6d (see FIG. 8), and are formed by four types of horizontal planes having different heights. Further, an imaging light beam transmitting portion 6t, a flange portion 6j, and a positioning projection 6k formed on a parallel flat plate are formed.

  The positioning projection 6k is fitted into a positioning portion formed on the outer frame member 12 so as to be positioned in the circumferential direction. As shown in the drawing, the boundary lines of the respective horizontal planes described above are in steps of 30 degrees with respect to the bisector P of the positioning projection 6k.

  Returning to FIG. 8, this pedestal 6 is assembled by aligning a notch portion (not shown) formed in the outer frame member 12 and a positioning projection 6k, and as shown in FIG. The inscribed surfaces of the positioning projection 6k and the outer frame member 12 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). Further, the outer frame member 12 is first bonded and sealed to the printed circuit board 11 with an adhesive A on the outer periphery thereof, and then bonded and fixed with an adhesive B (for example, a rubber-based adhesive). In this case, the adhesive B is for reinforcement and may be omitted.

  That is, the space on the photoelectric conversion surface side of the image pickup device 8 is sealed and separated by the pedestal 6 and the outer periphery of the outer frame member 12 so that dust can be prevented from entering the space from the outside. Become.

  FIG. 10 is a schematic plan view showing the positional relationship between the contact protrusion 3 a and the positioning protrusion 3 k formed in the imaging optical system 50. This figure is a view of the imaging optical system 50 as seen from the subject side, and the abutment protrusion 3a is indicated by a broken line.

  A projection 3a for contact with the pedestal 6 is formed on the imaging surface side of the third lens constituting the imaging optical system 50, and this projection 3a is in contact with any one of the horizontal surfaces of the pedestal. Further, as shown in the figure, the protrusions 3a are formed at three positions at intervals of 120 degrees with reference to positions shifted by 15 degrees with respect to the bisector P of the positioning protrusion 3k.

  The base 6 shown in FIG. 9 and the imaging optical system 50 shown in FIG. 10 configured as described above are incorporated in the outer frame member 12, and any one of the four different horizontal planes K, L, M, and N described above is selectively used. A method of making contact will be described.

  FIG. 11 is a schematic diagram showing a positional relationship among the outer frame member 12, the positioning projection 6k of the base 6, and the positioning projection 3k of the third lens.

  As shown in the figure, the outer frame member 12 has four concave portions W, X, Y, and Z that are engaged with the positioning projections 6k of the base 6 and the positioning projections 3k of the imaging optical system at intervals of 90 degrees. Is formed.

  FIG. 11A shows a case where both the positioning projection 6k of the pedestal 6 and the positioning projection 3k of the imaging optical system are engaged with the recess W. FIG. In this case, the three protrusions 3 a for contacting the third lens are positioned on the horizontal plane K formed on the base 6.

  FIG. 11B shows a case where the positioning projection 6k of the base 6 is engaged with the recess W and the positioning projection 3k of the imaging optical system is engaged with the recess X. In this case, the three protrusions 3 a for contacting the third lens are positioned on the horizontal plane N formed on the base 6.

  FIG. 11C shows a case where the positioning projection 6k of the base 6 is engaged with the recess W, and the positioning projection 3k of the imaging optical system is engaged with the recess Z. In this case, the three protrusions 3 a for contacting the third lens are positioned on the horizontal plane L formed on the pedestal 6.

  FIG. 11D shows a case where the positioning projection 6k of the base 6 is engaged with the recess W, and the positioning projection 3k of the imaging optical system is engaged with the recess Y. In this case, the three protrusions 3 a for contacting the third lens are positioned on the horizontal plane M formed on the pedestal 6.

  That is, the imaging element and the third lens are selected by incorporating any one of the four concave portions formed in the outer frame member 12 with respect to the position of the projection 6 k of the base 6. That is, four types of positions on the optical axis of the imaging optical system can be selected.

  As a result, manufacturing variations in the back focus of the imaging optical system can be absorbed by selecting and incorporating any of the four recesses formed on the outer frame member 12, and imaging always focused on a predetermined subject distance. A device can be obtained. The selection of the concave portion may be determined by individually measuring the imaging optical system or may be determined on a production lot basis.

  In the first to third embodiments described above, the pedestal 6 is formed using a material having a function of not transmitting infrared light (infrared light cutting function), and is manufactured by, for example, integral molding. be able to. By doing in this way, the thickness of the whole imaging device can be made thinner than arrange | positioning an infrared-light cut filter ahead of an optical system. Needless to say, an infrared light cut coating may be applied to the imaging light beam transmitting portion 6t of the pedestal 6 or a glass infrared light cut filter may be sealed and bonded.

  In addition, the configuration using a pedestal having a cam surface or a horizontal plane having a different height has been described, but even if the imaging optical system contact surface of the pedestal is formed at the same height, it does not depart from the present invention. Of course not.

  Further, although the compression coil spring has been described as the elastic member, it goes without saying that a leaf spring, a sponge-like elastic member, or the like may be used.

(Fourth embodiment)
The fourth embodiment of the present invention will be described below. In the first to third embodiments described above, the configuration using the pedestal has been described. However, in the fourth embodiment, a part of the optical member that constitutes the imaging optical system in the imaging light flux transmitting portion of the pedestal. An example in which is formed will be described.

  The appearance of the mobile phone T provided with the imaging device of the fourth embodiment is the same as that shown in FIG. 1 except that the opening 74 and the operation member 15 are omitted. The following imaging device 300 corresponds to the imaging device S in FIG. Since the imaging apparatus 300 of the fourth embodiment has the same shape as that of FIG.

  FIG. 12 is a cross-sectional view of the imaging device 300 according to the fourth embodiment of the present invention cut along the line GG shown in FIG.

  In the figure, the inside of the outer frame member 12 includes an image pickup optical system 50, an image pickup element 8 mounted on the printed circuit board 11, and a lid member 13. As shown in the figure, the third lens 3 constituting the imaging optical system 50 is formed with a rectangular or circular box-shaped frame portion 6 h that includes the leg portion 6 d and the imaging element 8. That is, the third lens is formed on the photographing light beam transmitting portion of the pedestal described above.

  The imaging optical system 50 is assembled using the third lens 3 formed in this manner, and as shown, the leg 6d is in contact with the imaging element 8 and is at a position different from the leg 6d. The frame portion 6h, which is an adhesive portion, and the printed board 11 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). That is, the third lens 3 seals the space on the photoelectric conversion surface side of the image sensor 8 to be an isolated space, and can prevent dust from entering the space from the outside.

  Similarly, the adhesive portion between the leg portion 6d and the frame portion 6h is a different surface, so that the adhesive A does not enter under the leg portion 6d, and a deviation in the optical axis direction of the imaging optical system occurs. There is no.

  Furthermore, the outer frame member 12 is bonded and fixed to the printed circuit board 11 and an adhesive B (for example, a rubber-based adhesive) on the outer periphery thereof.

  As shown in the figure, the imaging optical system 50 is a unit in which the first lens 1, the second lens 2, and the third lens 3 are brought into contact with each other at a flange portion other than the optically effective surface and are fixed to each other with an adhesive or the like. By constructing without using other members, the distance between the lenses can be assembled without error. In this case, the compression coil spring, which is an elastic member, can be eliminated.

  In this case, infrared light is cut by preventing infrared light from being transmitted by applying an infrared light cut coating to any one of the optically effective surfaces constituting the imaging optical system 50.

  By doing so, the number of parts can be reduced and the cost can be reduced.

  In the first to fourth embodiments described above, the description has been made using the single-focus imaging device. However, the present invention is not limited to this and can be applied to a variable-focus optical system such as a zoom lens. Yes.

It is a figure which shows the external appearance of the mobile telephone T which is an example of the portable terminal which incorporated the imaging device of this invention. It is a perspective view of imaging device 100 of a 1st embodiment of the present invention. FIG. 3 is a cross-sectional view of the imaging apparatus 100 taken along line FF shown in FIG. 2. 2 is a perspective view of a pedestal used for the imaging apparatus 100. FIG. It is sectional drawing which cut | disconnected the imaging device 150 which concerns on the 2nd Embodiment of this invention by the FF line | wire shown in FIG. 3 is a perspective view of a pedestal used for the imaging device 150. FIG. It is a perspective view of the imaging device 200 of the 3rd Embodiment of this invention. It is sectional drawing which cut | disconnected the imaging device 200 which concerns on the 3rd Embodiment of this invention by the GG line | wire shown in FIG. 3 is a plan view of a pedestal used for the imaging apparatus 200. FIG. It is a schematic plan view which shows the positional relationship of the protrusion for contact formed in the imaging optical system, and the protrusion for positioning. It is the schematic which shows the positional relationship of the outer frame member, the positioning projection of the base, and the positioning projection of the third lens. It is sectional drawing which cut | disconnected the imaging device 300 which concerns on the 4th Embodiment of this invention by the GG line | wire shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st lens 2 2nd lens 3 3rd lens 4 Aperture stop 6 Base 8 Image pick-up element 9 Elastic member 11 Printed circuit board 12 Outer frame member 13 Lid member 15 Operation member 16 Stepped screw 50 Imaging optical system

Claims (9)

An imaging device, a pedestal formed with legs that contact the imaging device, an imaging optical system that guides subject light to an imaging region of the imaging device, and an exterior that includes the imaging device, the pedestal, and the imaging optical system A frame member,
An image pickup apparatus, wherein a space on the photoelectric conversion surface side of the image pickup element is sealed by the pedestal or the pedestal and a part of the outer frame member. In a state where the leg portion is in contact with the image sensor, an adhesive portion at a position different from the leg portion of the pedestal is bonded to a substrate on which the image sensor is mounted or the outer frame member, and the photoelectric sensor of the image sensor is bonded. The imaging apparatus according to claim 1, wherein the space on the conversion surface side is sealed. The imaging apparatus according to claim 1, wherein the imaging optical system includes a contact portion that contacts the pedestal, and the imaging optical system is biased toward the pedestal by an elastic member. The pedestal has a cam surface, and the imaging optical system is moved along the optical axis by rotating the imaging optical system on the cam surface. The imaging device according to item. The said pedestal has horizontal surfaces for contact formed at different heights, and the imaging optical system is incorporated by selecting any one of the horizontal surfaces. The imaging apparatus according to item 1. The imaging apparatus according to any one of claims 1 to 5, wherein a part of an optical member constituting a photographing optical system is formed in a photographing light beam transmitting portion of the pedestal. The imaging apparatus according to claim 1, wherein an infrared light cut filter is formed on the pedestal. The imaging apparatus according to claim 1, wherein the imaging optical system includes a plurality of optical members, and the optical members are in contact with each other. A portable terminal comprising the imaging device according to claim 1.

Images