CN106937028A - Camera module assemble method and camera module - Google Patents
Camera module assemble method and camera module Download PDFInfo
- Publication number
- CN106937028A CN106937028A CN201511025050.6A CN201511025050A CN106937028A CN 106937028 A CN106937028 A CN 106937028A CN 201511025050 A CN201511025050 A CN 201511025050A CN 106937028 A CN106937028 A CN 106937028A
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- China
- Prior art keywords
- camera lens
- module
- lens module
- camera
- sensitive chip
- Prior art date
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Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 50
- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 238000000605 extraction Methods 0.000 claims description 18
- 238000012360 testing method Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000284 extract Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
A kind of camera module assemble method, including：One circuit board and a camera lens module are provided, one end of the circuit board is provided with a connector, and the other end is wiring board, and the wiring board is provided with a sensitive chip and and covers the support of the sensitive chip, the support contains an optical filter, and the camera lens module is the voice coil motor that a combination has camera lens；The camera lens module is adjusted so that the lens focusing is aligned in the optical axis of the sensitive chip and the camera lens with the centre normal of the sensitive chip；One curable glue is provided, and the curable glue is coated with the upper surface of the support；The precompressed knot camera lens module and the curable glue；The camera lens module is adjusted again, the optical axis of the camera lens is aligned with the centre normal of the sensitive chip；Fit the camera lens module and the support, and solidify the curable glue.The present invention also provides a kind of camera module.Packaging efficiency, the image quality of guarantee camera module can be improved using the camera module assemble method and increase the camera lens module and the bonding force of the support.
Description
Technical field
The present invention relates to camera technology field, more particularly to a kind of camera module assemble method and camera module.
Background technology
At present, the camera module with focus function, consists predominantly of camera lens, voice coil motor (VCM), filter
Light plate rack, circuit board and CIS (Sensor) etc..Camera lens contains eyeglass, camera lens and VCM
Screw thread coordinates, and VCM is used to drive camera motion to realize focus function.During assembling, first Sensor is passed through
Chip directly placed technology (Chip On Board, COB) is arranged on board top surface, then, in circuit
Dispensing around the Sensor of plate, the filter supporter that will contain optical filter is pasted on circuit boards by glue,
Then, in the upper surface dispensing of filter supporter, the VCM for having camera lens by extraction element crawl combination extremely filters
, then be bonded on the glue in filter supporter for VCM bottom surfaces by correspondence position for dispensing glue on plate rack, from
And complete the assembling of camera module.
In the assembling process of above-mentioned camera module, when VCM is captured, often there are the inclined situations of VCM,
Cause the center of lens of camera lens in VCM and Sensor center deviations on circuit board, so as to influence camera module
Image quality, or cause the defective products to increase.
The content of the invention
Based on this, the present invention provides one kind and can improve packaging efficiency, ensure image quality and increase shooting mould
The camera module assemble method of group thrust, and the camera module obtained using the assemble method.
In order to solve the above technical problems, a kind of camera module assemble method that the present invention is provided, including：
A. a circuit board and a camera lens module are provided, one end of the circuit board is provided with a connector, and the other end is
Wiring board, the wiring board is provided with a sensitive chip and one covers the support of the sensitive chip, and the support is housed
There is an optical filter, the camera lens module is the voice coil motor that a combination has camera lens；
B. the camera lens module is adjusted so that the lens focusing is photosensitive with this in the optical axis of the sensitive chip and the camera lens
The centre normal alignment of chip；
C., one curable glue is provided, and the curable glue is coated with the upper surface of the support；
D. the precompressed knot camera lens module and the curable glue；
E. the camera lens module is adjusted again, the optical axis of the camera lens is aligned with the center of the sensitive chip；
F. fit the camera lens module and the support, and solidify the curable glue.
The present invention also provides a kind of camera module using the assembling of above-mentioned camera module assemble method.One kind shooting
Module, including a circuit board, a camera lens module and a curable glue,
One end of the circuit board is provided with a connector, and the other end is wiring board, and it is photosensitive that the wiring board is provided with one
Chip, one cover the sensitive chip support and some mount components, the sensitive chip by some gold threads with
The wiring board is electrically connected with, and the support contains an optical filter；
The camera lens module is the voice coil motor that a combination has camera lens, and the camera lens includes a lens barrel and is contained in the mirror
Some eyeglasses in cylinder；
The curable glue coats the upper surface of the support, in the lens focusing in the sensitive chip and the camera lens
Optical axis solidify when being aligned with the centre normal of the sensitive chip, make the camera lens module can by this with the support
Solidification glue is fitted.
Above-mentioned camera module assemble method, adjust the camera lens module focus in the sensitive chip when, due to this
Camera lens module can quickly be located at the location of captured image highest definition values, shorten focusing time,
Improve the packaging efficiency of the camera module；Meanwhile, can adjust the camera lens module makes the optical axis of the camera lens and the sense
The centre normal alignment of optical chip, it is ensured that the image quality of the camera module；Finally, due to the pre-pressing mirror
Head mould group and the curable glue, increased the adhesive force of the curable glue, so increased the camera lens module with
The bonding force of the support.
Brief description of the drawings
Fig. 1 is the flow chart of the camera module assemble method of one embodiment of the invention；
Fig. 2 is the generalized section of an assembled state of the camera module of one embodiment of the invention；
Fig. 3 is the generalized section of another assembled state of the camera module of Fig. 2；
Fig. 4 is the generalized section of another assembled state of the camera module of Fig. 2；
Fig. 5 is the generalized section of the coating curable glue of the camera module of Fig. 2；
The generalized section that Fig. 6 is completed for the camera module of Fig. 2.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.
First-selected embodiment of the invention is given in accompanying drawing.But, the present invention can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to this
Disclosure of the invention content is more thorough comprehensive.
It should be noted that when element is referred to as " being fixedly arranged on " another element, it can be directly in another yuan
On part or can also there is element placed in the middle.When an element is considered as " connection " another element, it can
To be directly to another element or may be simultaneously present centering elements.Term as used herein " is hung down
It is straight ", " level ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article with belong to technology of the invention
The implication that the technical staff in field is generally understood that is identical.The art for being used in the description of the invention herein
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.It is used herein
Term " and/or " include the arbitrary and all of combination of one or more related Listed Items.
To realize the present invention, the assembling device (referring to Fig. 2) that the embodiment of the present invention is provided includes a mirror
Head mould group extraction element 110, a controller 120, a plummer 130 and are arranged on the plummer 130
Testing cassete 140, the controller 120 electrically connected with the testing cassete 140 and control the testing cassete 140 and should
Camera lens module extraction element 110.
Fig. 1 and Fig. 2 is referred to, the camera module assemble method of one embodiment of the invention includes：
Step a：A circuit board 102 and a camera lens module 101 are provided, one end of the circuit board 102 is provided with one
Connector 1021, the other end is wiring board 1022, and the wiring board 1022 is provided with the He of a sensitive chip 103
One support 104 for covering the sensitive chip 103, the support 104 contains an optical filter 105, the camera lens mould
Group 101 is the voice coil motor 1012 that a combination has camera lens 1011.
Step b：The camera lens module 101 is adjusted so that the camera lens 1011 is focused in the sensitive chip 103 and is somebody's turn to do
The optical axis optical axis L L' of camera lens 1011 is aligned with the centre normal SS' of the sensitive chip 103.
In the present embodiment, step b specifically includes following steps：
Step b1：The circuit board 102 is positioned on the plummer 130, the connection of the circuit board 102
Device 1021 is electrically connected with the testing cassete 140 on the plummer 130, the testing cassete 140 and the controller
120 electrical connections；The camera lens module 101 is extracted with the camera lens module extraction element 110, and adjusts the camera lens mould
Group 101 causes that the optical axis L L' of the camera lens 1011 is aligned with the centre normal SS' of the sensitive chip 103.
The controller 120 extracts the camera lens module 101 by controlling the camera lens module extraction element 110, and it is right to come
The camera lens module 101 is adjusted.In Fig. 2, the camera lens module extraction element 110 is extracting the camera lens mould
During group 101, the camera lens module 101 there occurs the light of the camera lens 1011 in inclination, i.e. the camera lens module 101
Axle LL' is not parallel with the centre normal SS' of the sensitive chip 103, forms a larger angle.
In camera module assembling process of the present invention, the controller 120 controls the camera lens module extraction element 110
The camera lens module 101 is extracted, along the six-freedom degree direction of the camera lens module 101, with the first motion amplitude pair
The camera lens module 101 is adjusted, and specifically, the camera lens module 101 is entered along X, Y and Z-direction
Adjustment and the adjustment around X, Y and the inclination angle of Z-direction gone by a relatively large margin.Refering to Fig. 3, this is illustrate only
The section of an assembled state in step b1 assembling process, in figure 3, by the adjustment of step b1 so that
The centre normal SS' angles of the optical axis L L' of the camera lens 1011 and the sensitive chip 103 in the camera lens module 101
Diminish, and by follow-up adjustment until optical axis L L' and the center of the sensitive chip 103 of the camera lens 1011
Normal SS' is aligned, meanwhile, the controller 120 records the optical axis L L' and the sensitive chip 103 of the camera lens 1011
Centre normal SS' when being aligned, the location of camera lens module 101.
Step b2：The camera lens module extraction element 110 extracts the camera lens module 101 and is located at the sensitive chip 103
Top, meanwhile, the controller 120 control the sensitive chip 103 through the camera lens 1011 shoot test chart
The image of piece, and analyze the current definition values of the image, further predict the image highest definition values and
The location of camera lens module 101 under the image highest definition values.
Specifically, the camera lens module extraction element 110 extracts the camera lens module 101 and is located at this in step b2
Behind the top of sensitive chip 103, the position of the camera lens module 101 keeps constant, and the position is above-mentioned steps
The center method of the optical axis L L' of the camera lens 1011 that the controller 120 is recorded and the sensitive chip 103 in b1
When line SS' is aligned, the location of the camera lens module 101.
Step b3：The controller 120 controls the camera lens mould according to the current definition values of step b2 gained images
Organize extraction element 100 to adjust the camera lens module 101, the camera lens module 101 is quickly located at step b2 institutes
The location of camera lens module 101 under the image highest definition values of precognition, meanwhile, the controller 120
Control the sensitive chip 103 that the image of test pictures is shot through the camera lens 1011, and analyze the image clearly
Angle value, finely tuning the camera lens module 101 makes the camera lens 1011 focus in the sensitive chip 103, while the control
Device 120 records the camera lens 1011 and focuses when the sensitive chip 103 the location of the camera lens module 101.
Fig. 4 is referred to, camera module is through the assembling after above-mentioned steps b3 in showing one embodiment of the invention
State, above-mentioned steps b3 can quickly be located at the image that step b2 is predicted by the camera lens module 101
The location of camera lens module 101 under highest definition, such that it is able to reduce built-up time, lifting assembling
Efficiency.But because there is required precision and alignment error in assembling device, need to be in being somebody's turn to do for being predicted positioned at step b2
The location of image highest definition values are accurately adjusted with the second motion amplitude to the camera lens module 101,
I.e. the controller 120 controls the camera lens module extraction element 110 to extract the camera lens module 101 with less than above-mentioned
The second motion amplitude of the first motion amplitude is around the center of camera lens 1011 of the camera lens module 101 in step b1
Motion, to adjust the gradient of the camera lens module 101, makes the camera lens 1011 focus in the sensitive chip 103.
Step c：One curable glue 106 is provided, and the curable glue 106 is coated with the upper surface of the support 104.
Specifically, referring to Fig. 5, the controller 120 controls the camera lens module extraction element 110 to extract the mirror
Head mould group 101 is removed from the top of support 104, and the curable glue 106 is applied on the support 104 four
At circumferential edges, and ensure that the curable glue 106 does not outwards overflow the edge of support 104, inwardly do not spill over this
On optical filter 105, and a closed figure is constituted, the curable glue 106 is ultraviolet cured adhesive (UV glue).
Step d：The precompressed knot camera lens module 101 and the curable glue 106.
In step d, the camera lens module extraction element 110 is by the dislocation of camera lens module 101 in step b3
In the camera lens 1011 that is recorded of the controller 120 focus the camera lens module 110 when the sensitive chip 103
The location of, then control the camera lens module extraction element 110 extract the camera lens module 101 first move downward,
Motion upwards, and up and down motion amplitude again is 30um.In the present embodiment, to lift the curable glue 106
Adhesive force, while lifted packaging efficiency, this step d is only the camera lens module 101 is moved downward once,
Motion once returns to the original position of step d upwards again.
Certainly, in other embodiments, it is the adhesive force that preferably lifts the curable glue 106, can also makes
The camera lens module 101 and the multiple-prepressing knot of curable glue 106, that is, cause the camera lens module 101 downwards to
Upper motion is multiple.
Step e：The camera lens module 101 is adjusted again, makes the optical axis L L' of the camera lens 1011 and the sensitive chip
103 centre normal SS' alignments.
In step e, the position starting point of adjustment in above-mentioned steps b3 the camera lens 1011 focus in the sense
The location of camera lens module 101 during optical chip 103, namely above-mentioned steps d original position.
Step f：Fit the camera lens module 101 and the support 104, and solidify the curable glue 106, assemble
Into a camera module 100 (referring to Fig. 6).
In step f, by the curable glue 106, the camera lens module 101 is fitted with the support 104
Together, and by ultraviolet light solidify the curable glue 106, influenceed with preventing exposure assembling take the photograph
As the image quality of module 100.
The invention described above camera module assemble method, during the involved adjustment camera lens module 101,
The controller 120 controls the real time imagery of sensitive chip 103, and analysis institute is into image clarity values and records every
The definition values of one image and the location of camera lens module 101 under each image clarity values.When
The central sharp angle value highest of the image and four corners (upper left, lower-left, upper right, bottom right) of the image
Fractional value (such as 35, by be 100 point based on) of the definition values higher than the controller 120 setting, you can recognize
The fixed camera lens 1011 is focused in the optical axis L L' and the sensitive chip 103 of the sensitive chip 103 and the camera lens 1011
Centre normal SS' alignment.
It should be understood that Fig. 2 to Fig. 6 illustrate only a section of the camera lens 1011, the actual camera lens
1011 is rotationally symmetrical on optical axis L L', and the camera lens module 101 is on the symmetrical rectangle of the section or just
Square camera lens module.
Fig. 6 is referred to, is the shooting mould being assembled into using embodiments of the present invention camera module assemble method
Group 100, the camera module 100 includes a circuit board 102, a camera lens module 101 and a curable glue 106.
One end of the circuit board 102 is provided with a connector 1021, other end for wiring board 1022, the wiring board
1022 are provided with a sensitive chip 103, covers the support 104 of the sensitive chip 103 and some attachment units
Part 107, the sensitive chip 103 is electrically connected with the wiring board 1022 by wire 1031, carries out signal transmission,
The support 104 contains an optical filter 105.
Specifically, in the present embodiment, the part of some mount components 107 is distributed in outside the support 104
The wiring board 1022 on, and near the support 104, remainder is distributed in the line in the support 104
On road plate 1022, and arranged along the surrounding of sensitive chip 103, some mount components 107 can be resistance
Device, electrical equipment, inductor etc., to strengthen the function of the wiring board 1022.The optical filter 105 is located at the branch
On frame 104, and it is immobilizated in the middle through-hole 1041 of the support 104, the middle through-hole 1041 is right against
The sensitive chip 103, so that the optical filter 105 covers the sensitive chip 103, the sensitive chip 103 is used
In filter from the camera lens 1011 enter the sensitive chip 103 infrared light, it is to avoid infrared light influences the shooting mould
The image quality of group 100.
The camera lens module 100 is the voice coil motor 1012 that a combination has the camera lens 1011, and the camera lens 1011 is wrapped
Three eyeglasses 10112 for including a lens barrel 10111 and being contained in the lens barrel 10111.Lens barrel outer wall 1011a
External screw thread is provided with, in voice coil motor inwall 1012a is provided with and match with the external screw thread of the lens barrel 10111
Screw thread, in embodiments of the present invention, the external screw thread of lens barrel 10111 passes through with the internal thread of voice coil motor 1012
Thread fiting mode, the camera lens 1011 is installed in the voice coil motor 1012.
It should be understood that in other embodiments, when on lens barrel outer wall 1011a without external screw thread, the voice coil loudspeaker voice coil horse
When on up to inwall 1012a without internal thread, the camera lens 1011 can be by the lens barrel with the voice coil motor 1012
Gap location between outer wall 1011a and voice coil motor inwall 1012a carries out dispensing and combines.In other embodiments,
According to the requirement of designer, the camera lens 1011 can also contain a piece of eyeglass, two panels eyeglass, or more than three
Eyeglass.
The curable glue 106 coats the upper surface of the support 104, focuses photosensitive in this in the camera lens 1011
Solidify when the optical axis L L' of chip 103 and the camera lens 1011 is aligned with the centre normal SS' of the sensitive chip 103,
The camera lens module 101 is set to be fitted by the curable glue 106 with the support 104.
Specifically, the curable glue 106 coats the edge on the support 104, and ensures that this can
Solidification glue 106 does not outwards overflow the edge of support 104, does not inwardly spill on the optical filter 105, and at this
The upper surface of support 104 forms a closed figure, and the curable glue 106 is ultraviolet cured adhesive (UV glue),
And can be with rapid curing under ultraviolet light.
The invention described above camera module assemble method, focuses in the sensitive chip the camera lens module 101 is adjusted
When 103, because the controller 120 can control the camera lens module extraction element 110, make the camera lens module 101
It is quick to be located at the location of camera lens module 101 under captured image highest definition values, so as to shorten right
The burnt time, improve the packaging efficiency of the camera module 101；Meanwhile, can adjust the camera lens module 101 makes this
The optical axis L L' of camera lens 1011 is aligned with the centre normal SS' of the sensitive chip 103, it is ensured that the camera module 100
Image quality；Through the precompressed knot camera lens module 101 and the curable glue 106, the curable glue is increased
106 adhesive force, and then increased the bonding force of the camera lens module 101 and the support 104.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, can also make it is some deformation and
Improve, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is defined.
Claims (10)
1. a kind of camera module assemble method, comprises the following steps：
A. a circuit board and a camera lens module are provided, one end of the circuit board is provided with a connector, and the other end is
Wiring board, the wiring board is provided with a sensitive chip and one covers the support of the sensitive chip, and the support is housed
There is an optical filter, the camera lens module is the voice coil motor that a combination has camera lens；
B. the camera lens module is adjusted so that the lens focusing is photosensitive with this in the optical axis of the sensitive chip and the camera lens
The centre normal alignment of chip；
C., one curable glue is provided, and the curable glue is coated with the upper surface of the support；
D. the precompressed knot camera lens module and the curable glue；
E. the camera lens module is adjusted again, the optical axis of the camera lens is aligned with the centre normal of the sensitive chip；
F. fit the camera lens module and the support, and solidify the curable glue.
2. camera module assemble method according to claim 1, it is characterised in that b is specific for the step
It is further comprising the steps of：
B1. the circuit board is positioned on a plummer, the survey on the connector and the plummer of the circuit board
Examination box is electrically connected with, and the testing cassete is electrically connected with a controller；The camera lens is extracted with camera lens module extraction element
Module, and the camera lens module is adjusted so that the optical axis of the camera lens is aligned with the centre normal of the sensitive chip；
B2. the camera lens module extraction element extracts the camera lens module positioned at the top of the sensitive chip, meanwhile, should
Controller controls the sensitive chip through the image of the lens shooting test pictures, and it is currently clear to analyze the image
Clear angle value, further predicts the highest definition values and the camera lens under the image highest definition values of the image
The location of module；
B3. the controller controls the camera lens module to extract dress according to the current definition values of step b2 gained images
Put to adjust the camera lens module, the image highest for making the camera lens module quickly be predicted positioned at step b2 is clear
The location of camera lens module under angle value, meanwhile, the controller controls the sensitive chip to be clapped through the camera lens
Take the photograph the image of test pictures, and analyze the image clarity values, finely tune the camera lens module make the lens focusing in
The sensitive chip, while the controller records the lens focusing when sensitive chip residing for the camera lens module
Position.
3. camera module assemble method according to claim 2, it is characterised in that to the camera lens module
Adjustment be adjustment on the six-freedom degree to the camera lens module：That is the adjustment of X, Y and Z-direction
With the adjustment around X, Y and the inclination angle of Z-direction.
4. camera module assemble method according to claim 2, it is characterised in that step b1 with
First motion amplitude is adjusted to the camera lens module, and step b3 is should what is predicted positioned at step b2
The location of image highest definition values are accurately adjusted with the second motion amplitude to the camera lens module.
5. camera module assemble method according to claim 4, it is characterised in that the second motion amplitude
Less than the first motion amplitude.
6. camera module assemble method as claimed in any of claims 1 to 5, it is characterised in that
Adjust the camera lens module during, the sensitive chip real time imagery, analysis institute into image clarity values simultaneously
Record the definition values and the location of camera lens module under each image clarity values of each image.
7. camera module assemble method according to claim 2, it is characterised in that in step e again
Secondary adjustment camera lens module, the position starting point of adjustment in the step b3 lens focusing when sensitive chip
The location of the camera lens module.
8. camera module assemble method according to claim 2, it is characterised in that step d was for should
Camera lens module extraction element extracts the camera lens module and first moves downward, then motion upwards, and up and down motion amplitude
It is 30um, makes the camera lens module and the curable glue multiple-prepressing knot, to lift the adhesive force of the curable glue.
9. a kind of camera module, an including circuit board, a camera lens module and a curable glue,
One end of the circuit board is provided with a connector, and the other end is wiring board, and it is photosensitive that the wiring board is provided with one
Support and some mount components that chip, one cover the sensitive chip, the sensitive chip passes through with the wiring board
Wire is electrically connected, and the support contains an optical filter；
The camera lens module is the voice coil motor that a combination has camera lens, and the camera lens includes a lens barrel and is contained in the mirror
Some eyeglasses in cylinder；
The curable glue coats the upper surface of the support, in the lens focusing in the sensitive chip and the camera lens
Optical axis solidify when being aligned with the centre normal of the sensitive chip, make the camera lens module can by this with the support
Solidification glue is fitted.
10. camera module according to claim 9, it is characterised in that the curable glue is ultraviolet light
Solidification glue, and solidified by ultraviolet light.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025050.6A CN106937028B (en) | 2015-12-30 | 2015-12-30 | Camera module assembly method and camera module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025050.6A CN106937028B (en) | 2015-12-30 | 2015-12-30 | Camera module assembly method and camera module |
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| CN106937028A true CN106937028A (en) | 2017-07-07 |
| CN106937028B CN106937028B (en) | 2020-09-18 |
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| CN107688222A (en) * | 2017-09-18 | 2018-02-13 | 济南中维世纪科技有限公司 | It is a kind of based on empty burnt alarm algorithm be used for focus the Atomatic focusing method on IPC |
| CN107948638A (en) * | 2017-12-14 | 2018-04-20 | 信利光电股份有限公司 | A kind of camera module active calibration equipment and its calibration method |
| CN108540694A (en) * | 2018-03-21 | 2018-09-14 | 昆山丘钛微电子科技有限公司 | Camera module and its assemble method |
| CN109491181A (en) * | 2019-01-02 | 2019-03-19 | 昆山丘钛微电子科技有限公司 | Camera mould group and its manufacturing method |
| CN109819152A (en) * | 2019-02-27 | 2019-05-28 | 维沃移动通信有限公司 | Focusing camera mould group and terminal device |
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| CN111757092A (en) * | 2019-03-28 | 2020-10-09 | 宁波舜宇光电信息有限公司 | Camera module focusing assembly system and method, lens component parameter acquisition device and photosensitive component parameter acquisition device |
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