CN113784017A - Camera module and assembling method for camera module - Google Patents
Camera module and assembling method for camera module Download PDFInfo
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- CN113784017A CN113784017A CN202010517990.1A CN202010517990A CN113784017A CN 113784017 A CN113784017 A CN 113784017A CN 202010517990 A CN202010517990 A CN 202010517990A CN 113784017 A CN113784017 A CN 113784017A
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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Abstract
The application relates to a camera module and an assembling method thereof. The camera module comprises a photosensitive assembly with a photosensitive chip and a lens assembly, and the method comprises the following steps: arranging a first adhesive glue material on one surface of the photosensitive assembly; irradiating the first adhesive glue material by using ultraviolet light with a first wavelength to enable the first adhesive glue material to start first curing; adjusting the relative position of the lens assembly and the photosensitive assembly during the first curing of the first adhesive glue material, contacting the lens assembly with the first adhesive glue material, and irradiating the first adhesive glue material with ultraviolet light with a second wavelength to complete the second curing of the first adhesive glue material, wherein the first adhesive glue material is partially cured in the second curing step, and the second wavelength is different from the first wavelength; and waiting for the first curing of the first adhesive glue material to be finished.
Description
Technical Field
The present application relates to the field of optical imaging technology. More particularly, the present application relates to a camera module and an assembling method for assembling the camera module using an exposure technique.
Background
With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for assisting users in acquiring images (e.g., videos or images) have been rapidly developed and advanced. In addition, in recent years, camera modules have been widely used in various fields such as medical treatment, security, and industrial production.
In order to meet the increasingly wide market demands, a high-pixel, small-size and large-aperture diaphragm is an irreversible development trend of the existing camera module. Currently, the market has put forward higher and higher demands on the imaging quality of the camera module. Factors that affect the resolution of a camera module of a given optical design include the quality of the optical imaging lens and manufacturing errors during the assembly of the camera module.
At present, in the assembly process of the camera module, an adhesive material such as thermosetting adhesive, Ultraviolet (UV) thermosetting adhesive, etc. is generally used to adhere the lens component and the photosensitive component together. Such thermosetting adhesives need to be cured by heating. However, the temperature rise may affect various components in the lens assembly, thereby degrading the overall performance of the camera module and reducing the imaging quality. Meanwhile, because the thermal expansion coefficients of the circuit board, the photosensitive chip, the packaging body and other components in the photosensitive assembly are different, the expansion speed and the expansion amount of each component are unbalanced due to the temperature rise, the photosensitive chip is bent, and the imaging quality is also reduced. Meanwhile, the color filter disposed on top of the photosensitive member may have its filtering performance lowered due to an excessive temperature.
Disclosure of Invention
According to an exemplary embodiment, the present application provides an assembly method for a camera module. The camera module comprises a photosensitive assembly with a photosensitive chip and a lens assembly with a plurality of lenses capable of being matched with the photosensitive chip for imaging. The assembling method for the camera module comprises the following steps: arranging a first adhesive glue material on one surface of the photosensitive assembly; irradiating the first adhesive glue material by ultraviolet light with a first wavelength to enable the first adhesive glue material to start first curing; during the first curing of the first adhesive glue material: adjusting the relative position of the lens assembly and the photosensitive assembly, contacting the lens assembly with the first adhesive glue material, and irradiating the first adhesive glue material with ultraviolet light with a second wavelength to complete second curing of the first adhesive glue material, wherein the first adhesive glue material is partially cured in the second curing step, and the second wavelength is different from the first wavelength; and waiting for the first curing of the first adhesive glue material to be finished.
In an embodiment, the second wavelength may be less than the first wavelength
In an embodiment, the first wavelength may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength may have a wavelength range of 300nm to 400 nm.
In an embodiment, the first adhesive glue may include: a first photoinitiator that catalyzes the first adhesive glue to initiate the first curing in response to irradiation with ultraviolet light having the first wavelength; and a second photoinitiator that catalyzes the first adhesive glue to initiate the second curing in response to irradiation with ultraviolet light having the second wavelength.
In embodiments, the first photoinitiator may be a cationic system photoinitiator; and the second photoinitiator may be a photoinitiator of a cationic system or a radical system.
In an embodiment, the method for assembling a camera module may further include: controlling a curing time of the first curing by controlling an irradiation time and an irradiation energy of the ultraviolet light having the first wavelength; the curing time of the second curing is controlled by controlling the irradiation time and irradiation energy of the ultraviolet light of the second wavelength. Wherein a curing time of the first curing may be longer than a curing time of the second curing.
In an embodiment, the irradiation energy in the first curing step may be lower than the irradiation energy in the second curing step.
In an embodiment, the partially curing the first adhesive glue in the second curing step may include: the first adhesive glue material is irradiated along the peripheral edge of the camera module, and the part, close to the outer side, of the first adhesive glue material is solidified.
In an embodiment, the photosensitive assembly may further include: and the first surface of the packaging body faces the photosensitive chip above the photosensitive chip. Wherein, can also include in the step of arranging the first bonding glue material: and arranging the first adhesive glue material on a second surface of the packaging body opposite to the first surface.
In an embodiment, the photosensitive assembly may further include: and the circuit board is positioned below the photosensitive chip. The assembling method for the camera module further comprises the following steps: arranging the second adhesive glue material between the packaging body and the circuit board; irradiating the second adhesive glue material by using ultraviolet light with the first wavelength to enable the second adhesive glue material to start first curing; during the first curing, irradiating the second adhesive glue material by using ultraviolet light with a second wavelength to enable the second adhesive glue material to complete second curing; and waiting for the first curing of the second adhesive glue material to be finished.
In an embodiment, the photosensitive assembly may further include: and the circuit board is positioned below the photosensitive chip. Wherein, can also include in the step of arranging the first bonding glue material: and arranging the first adhesive glue material on the surface of the circuit board on which the photosensitive chip is arranged.
In an embodiment, the step of disposing the first adhesive glue may further include: the first adhesive material is arranged in a ring shape extending around an outer edge of one surface of the photosensitive member.
According to an exemplary embodiment, the application also provides a camera module. This module of making a video recording can include: the photosensitive assembly comprises a photosensitive chip; the lens assembly comprises a plurality of lenses which can be matched with the photosensitive chip for imaging; and the first adhesive rubber material is arranged between the photosensitive assembly and the lens assembly. Wherein, first bonding glue material can include: a first photoinitiator configured to catalyze the first adhesive glue to start a first curing in response to irradiation by ultraviolet light having a first wavelength; and a second photoinitiator configured to catalyze the first adhesive glue to complete a second cure in response to irradiation by ultraviolet light having a second wavelength during the first cure, wherein the second wavelength is different from the first wavelength.
In an embodiment, the second wavelength may be less than the first wavelength.
In an embodiment, the first wavelength may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength may have a wavelength range of 300nm to 400 nm.
In embodiments, the first photoinitiator may be a cationic system photoinitiator and the second photoinitiator may be a cationic system or a radical system photoinitiator.
In an embodiment, the photosensitive assembly may further include: and the first surface of the packaging body faces the photosensitive chip above the photosensitive chip. The first adhesive glue may be located between a second surface of the package body and the lens assembly, wherein the second surface may be opposite to the first surface.
In an embodiment, the photosensitive assembly may further include: and the circuit board is positioned below the photosensitive chip. A second adhesive material may be disposed between the circuit board and the package body, and the second adhesive material and the first adhesive material have the same material and property.
In an embodiment, the photosensitive assembly may further include: and the circuit board is positioned below the photosensitive chip. The first adhesive material may be located between the surface of the circuit board on which the photosensitive chip is disposed and the lens assembly.
In an embodiment, the first adhesive material may be arranged in a ring shape extending around an edge of one surface of the photosensitive member.
Compared with the prior art, but glue the material through the bonding that uses ultraviolet curing and assemble the module of making a video recording, this application has following at least one technological effect:
1) the method can prevent or reduce the phenomenon that the photosensitive chip of the camera module is heated and bent in the assembly process due to the temperature rise during heating and curing, the color filtering performance of the color filter is reduced, and/or the overall imaging quality of the camera module is deteriorated;
2) can accomplish the whole solidification process of bonding material under the unchangeable condition of station to reduce the transfer number of times of making a video recording module in the equipment process, reduced the risk that produces the defect.
Drawings
Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments when taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a flowchart illustrating steps of an assembly method for a camera module according to an exemplary embodiment of the present application;
fig. 2A to 2D are sectional views showing steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application;
FIG. 3 is a top view corresponding to FIG. 2A, illustrating an exemplary embodiment according to the present application;
FIG. 4 is a cross-sectional view illustrating another exemplary embodiment according to the present application;
FIG. 5 is a cross-sectional view illustrating yet another exemplary embodiment according to the present application; and
fig. 6 is a cross-sectional view illustrating still another exemplary embodiment according to the present application.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in this specification, the expressions first, second, third, etc. are used only to distinguish one feature from another, and do not represent any limitation on the features.
It will be further understood that the terms "comprises," "comprising," "has," "having," "includes" and/or "including," when used in this specification, specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
The features, principles and other aspects of the present application are described in detail below.
Fig. 1 is a flowchart illustrating steps of an assembly method for a camera module according to an exemplary embodiment of the present application. Fig. 2A to 2D are sectional views showing steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application. Fig. 3 is a top view corresponding to fig. 2A, illustrating an exemplary embodiment according to the present application.
Fig. 2D can be regarded as a sectional view of the camera module after the assembly is completed according to the present application, and the basic structure of the camera module according to the present application will be described first with reference to fig. 2D. As shown in fig. 2D, the camera module 10 includes a photosensitive component 100 and a lens component 200 located above the photosensitive component 100, wherein the photosensitive component 100 can be configured to be located at the rear end of the optical path of the lens component 200 to receive the image data from the lens component 200 and cooperate therewith to implement the imaging function of the camera module 10.
Specifically, in the present application, the photosensitive assembly 100 may include a photosensitive chip 100-1, a package 100-2, a circuit board 100-3, a color filter 100-4, and an electronic component 100-5, wherein the photosensitive chip 100-1 may be mounted on the circuit board 100-3 by a second adhesive material AP2 or by soldering, and may be electrically connected to the circuit board 100-3 by a metal lead or an electrical contact; the package 100-2 may be configured to package elements such as the photosensitive chip 100-1, the color filter 100-4, and the electronic component 100-5 on the circuit board 100-3, and may be configured in a ring shape having an opening; the color filter 100-4 may be installed to cover the opening of the package body 100-2 and configured to filter unnecessary light such as infrared rays; the electronic component 100-5 may be electrically connected (e.g., soldered) to the circuit board 100-3.
The lens assembly 200 according to the present application may include a lens portion 200-1 and a lens receiving portion 200-2 receiving the lens portion 200-1, wherein the lens portion 200-1 includes at least one lens. Although the lens portion 200-1 is shown in the drawings of the present application as including 4 lenses, this is merely exemplary, and the number of lenses may be adjusted to any suitable number according to actual needs. The lens accommodating portion 200-2 may be, for example, a lens carrier or a motor depending on the type of the camera module. Specifically, when the camera module is a fixed focus module, the lens accommodating portion 200-2 may be a lens carrier to accommodate and support the lens portion 200-1; in another case, when the camera module is assembled by the lens portion 200-1 and the motor, the lens portion 200-1 can be driven by the motor to perform moving, rotating and tilting operations, so that the camera module can achieve auto-focusing or optical anti-shake functions.
Next, the steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application will be described in detail with reference to fig. 1 and fig. 2A to 2D.
According to an exemplary embodiment of the present application, there is provided an assembling method for a camera module, the method including steps S10 to S50.
In step S10, a first adhesive glue material AP1 is disposed on one surface of the photosensitive assembly 100. Specifically, as shown in fig. 2A, in this step, the first adhesive glue material AP1 may be disposed on an upper surface of the package body 100-2 of the photosensitive assembly 100, which is a surface opposite to a surface facing the photosensitive chip 100-1 above the photosensitive chip 100-1.
Fig. 3 shows a top view of a specific arrangement of the first adhesive glue material AP1 in the case shown in fig. 2A. As shown in fig. 3, the first adhesive glue material AP1 may be arranged in a ring shape continuously extending along the outer edge of the upper surface of the package body 100-2. However, the exemplary embodiment of the present application is not limited thereto, and the first adhesive glue material AP1 may also be in the form of dots or stripes arranged discontinuously, may also be in other suitable shapes such as "C" shape, and may also have any other suitable arrangement capable of firmly bonding the light sensing assembly 100 and the lens assembly 200 together.
In step S20, the first adhesive material AP1 is irradiated with ultraviolet light having a first wavelength, so that the first adhesive material AP1 starts the first curing. Specifically, as shown in fig. 2A, the first ultraviolet light irradiator 300-1 (also referred to as an exposure device) may emit ultraviolet light having a first wavelength λ 1. In this step, the first ultraviolet light irradiator 300-1 may be configured to irradiate ultraviolet light having the first wavelength λ 1 to the first adhesive glue material AP1 from above the photosensitive assembly 100, thereby initiating the first curing process.
In an exemplary embodiment, the first adhesive glue AP1 may include a first photoinitiator therein. The first photoinitiator may catalyze the first adhesive glue AP1 to start the first curing process in response to ultraviolet light having the first wavelength λ 1 directly irradiating on the first adhesive glue AP 1. Further, the first curing process may be a time-lapse curing, i.e. the first curing process has a longer curing time, e.g. the first curing time may be more than 1min, even more than 1 hour. In the present application, the term "curing time" refers to the time required for the adhesive cement to cure from the beginning until the end of curing (i.e., to reach a fully cured state), and may also be understood as the reaction time of the photoinitiator included in the adhesive cement to the irradiation of ultraviolet rays.
In an exemplary embodiment, the first wavelength λ 1 may have a wavelength range of 380nm to 460 nm. Ultraviolet light in the wavelength range of 380nm to 460nm can have strong penetrating power, and the first adhesive glue material AP1 can be fully irradiated. Meanwhile, ultraviolet light in a wavelength range of 380nm to 460nm may have a lower irradiation energy, so that the first curing process may be easily controlled to have a longer curing time.
In an exemplary embodiment, the curing time of the first curing process may be controlled by an irradiation time (also referred to as an exposure time) and an irradiation energy (also referred to as an exposure energy) of ultraviolet light having the first wavelength λ 1. Alternatively, the first irradiation time in the first curing process may be selected to be 0.1 seconds to 1 minute, and further, may also be selected to be 0.1 seconds to 5 seconds. Alternatively, the first irradiation energy in the first curing process may be selected to be 100mJ/m2To 1000mJ/m2. It is to be understood that the first irradiation time and the first irradiation energy range of the exemplary embodiment of the present application are not limited thereto, and may be adjusted as needed.
In an exemplary embodiment, the first photoinitiator may be a cationic photoinitiator, which catalyzes the first adhesive glue AP1 under the irradiation of ultraviolet light with the first wavelength λ 1 to slowly crosslink the small resin molecules in the first adhesive glue AP1 to form polymer chains. Thereby, the first adhesive glue material AP1 can be controlled to have a slow first curing process (i.e., to have a longer curing time).
Referring back to fig. 1, during the first curing of the first adhesive glue material AP1, steps S30 and S40 are sequentially performed.
Specifically, during the first curing of the first adhesive glue AP1, the relative positions of the lens assembly 200 and the photosensitive assembly 100 are adjusted, and the lens assembly 200 is brought into contact with the first adhesive glue AP1 (step S30). Next, ultraviolet light having the second wavelength λ 2 is irradiated to the first adhesive material AP1, so that the first adhesive material AP1 completes the second curing (step S40).
In an exemplary embodiment, referring to fig. 2B, in step S30, the step of adjusting the relative position of the lens assembly 200 and the photosensitive assembly 100 may include: the lens assembly 200 is captured by the lens capturing mechanism 400, and the lens assembly 200 is moved, rotated and/or tilted with reference to the position of the photosensitive assembly 100 such that the central axes thereof are substantially aligned, thereby ensuring good imaging quality of the assembled camera module. Subsequently, the lens assembly 200 is controlled to move downward by the lens taking mechanism 400 so as to be in contact with the first adhesive glue AP 1. Alternatively, after the lens assembly 200 is contacted with the first adhesive glue AP1, a downward force may be continuously applied to the lens assembly 200 to form a slight pressing force therebetween, so that better adhesion can be performed at a later stage. It should be understood that the pressing force should be controlled within a reasonable range, and should not be too large, so as to prevent the first adhesive glue AP1 from overflowing.
In an exemplary embodiment, referring to fig. 2C, in step S40, the first adhesive glue AP1 may be irradiated again with the second ultraviolet light irradiator 300-2 after the lens assembly 200 is brought into contact with the first adhesive glue AP 1. The second ultraviolet light irradiator 300-2 may emit ultraviolet light having a second wavelength λ 2. In this step, by irradiating the first adhesive paste AP1 with ultraviolet light having the second wavelength λ 2, the first adhesive paste AP1 starts to perform the second curing process, which may partially cure the first adhesive paste AP1, and may be relatively fast with respect to the first curing process, so that the second curing may be completed before the first curing process is finished.
Alternatively, in step S40, the second ultraviolet light irradiator 300-2 may irradiate the first adhesive glue AP1 along the peripheral edge of the camera module 10, thereby curing the portion of the first adhesive glue AP1 near the outer side. Specifically, by irradiating ultraviolet light from the outer peripheral edge, the first portion AP1-1 of the first adhesive glue material AP1 is cured, and the second portion AP1-2 thereof is not cured, wherein the first portion AP1-1 is closer to the outer edge of the camera module 10, that is, closer to the second ultraviolet light irradiator 300-2 than the second portion AP 1-2. Alternatively, the first portion AP1-1 may account for 50% or more of the entire first adhesive glue AP 1. The partial curing achieved at this time may provide sufficient adhesive force and adhesive strength to fix and support the lens assembly 200 on the photosensitive assembly 100.
In an exemplary embodiment, the second wavelength λ 2 may be different from the first wavelength λ 1, for example, the second wavelength λ 2 may be smaller than the first wavelength λ 1. Alternatively, the second wavelength λ 2 may have a wavelength range of, for example, 300nm to 400 nm.
In an exemplary embodiment, the first adhesive glue material AP1 may further include a second photoinitiator different from the first photoinitiator. The second photoinitiator may catalyze the first adhesive glue AP1 to start the second curing process in response to ultraviolet light having the second wavelength λ 2 directly irradiating on the first adhesive glue AP 1. In particular, the second photoinitiator is different from the first photoinitiator and is more sensitive to uv light of shorter wavelength. Therefore, the second photoinitiator can catalyze the first adhesive glue AP1 under irradiation with the shorter second wavelength λ 2.
Alternatively, the second photoinitiator may be, for example, a photoinitiator of a cationic system or a photoinitiator of a radical system. In the case that the second photoinitiator is a cationic photoinitiator, the second photoinitiator generates a catalytic action on the first adhesive glue material AP1 under the irradiation of ultraviolet light with a second wavelength λ 2, so that small resin molecules in the first adhesive glue material AP1 are rapidly crosslinked to form a polymer chain. In addition, in the case that the second photoinitiator is a photoinitiator of a radical system, it can be combined with the resin small molecules in the first adhesive glue material AP1 under the irradiation of the ultraviolet light with the second wavelength λ 2 to undergo rapid crosslinking to form a polymer chain. Thereby, the first adhesive glue material AP1 can be controlled to have a fast curing process (i.e., to have a shorter curing time) during the second curing process.
In an exemplary embodiment, as described above, the second curing process is a relatively fast curing process compared to the first curing process, in other words, the curing time of the second curing may be shorter than the curing time of the first curing. Alternatively, the second curing time may be, for example, less than 2min, or even less than 1 min.
In an exemplary embodiment, the curing time of the second curing process may be controlled by the irradiation time and irradiation energy of the ultraviolet light having the second wavelength λ 2. Alternatively, the second irradiation time in the second curing process may be selected to be 0.1 seconds to 1 minute, and further, may also be selected to be 0.1 seconds to 5 seconds. Alternatively, the second irradiation energy in the second curing process may be selected to be 1200mJ/m2To 5000mJ/m2. It is to be understood that the second irradiation time and the second irradiation energy range of the exemplary embodiment of the present application are not limited thereto, and may be adjusted as needed.
Referring back to fig. 1, after the second curing is completed during the first curing of the first adhesive glue AP1, the first curing may be waited for to be finished (step S50), i.e., the first adhesive glue AP1 is waited for to be completely cured. The fully cured first adhesive glue material AP1 is shown in fig. 2D.
According to another embodiment of the present application, the method for assembling the camera module by using the uv-curable adhesive material described above may be applied to the assembly of the photosensitive assembly, for example, the assembly of the package 100-2 and the circuit board 100-3. A sectional view of the assembled camera module according to this embodiment is shown in fig. 4. This exemplary embodiment will be briefly described below with reference to fig. 4, and the same description as that described with reference to fig. 1 to 3 will be omitted.
Specifically, the third adhesive glue material AP3 may be first arranged at the upper surface of the circuit board 100-3 on which the photosensitive chip 100-1 is arranged. Among them, the third adhesive glue material AP3 may have the same material and properties as the first adhesive glue material AP1, for example, may have a first photoinitiator and a second photoinitiator responding to different wavelengths of ultraviolet light irradiation. In addition, the third adhesive glue AP3 may be arranged in a ring shape along the outer edge of the circuit board 100-3, similarly to the arrangement of the first adhesive glue AP 1.
Next, the first ultraviolet light having the first wavelength λ 1 may be irradiated to the third adhesive material AP3 by the first ultraviolet light irradiator 300-1, so that the third adhesive material AP3 starts the first curing.
Next, during the first curing of the third adhesive glue AP3, the package body 100-2 may be moved downward from above the circuit board 100-3 to contact with the third adhesive glue AP3 disposed on the upper surface of the circuit board 100-3 and/or to further slightly press the two. Subsequently, the third adhesive paste material AP3 may be irradiated with ultraviolet light having the second wavelength λ 2 using the second ultraviolet light irradiator 300-2 to partially cure the third adhesive paste material AP3 during the first curing of the third adhesive paste material AP3 to complete the second curing of the third adhesive paste material AP 3.
Then, the first curing of the third adhesive glue material AP3 may be waited for to end.
Further, a sectional view of an assembled camera module according to a further exemplary embodiment of the present application is shown in fig. 5 and 6.
According to still another embodiment of the present application, as shown in fig. 5, the photosensitive assembly 100 'may not include a package body, and alternatively, the lens receiving portion 200-2' of the lens assembly 200 'may be in direct contact with the color filter 100-4 in the photosensitive assembly 100' and may have a greater thickness in a vertical direction so as to be able to contact the circuit board 100-3 at the time of assembly.
In the case of the exemplary embodiment as shown in fig. 5, the assembly process of the lens assembly 200 ' and the photosensitive assembly 100 ' is different from the method described above with reference to fig. 1 to 3 in that, in step S10, the first adhesive glue AP1 ' is disposed on the upper surface of the circuit board 100-3 on which the photosensitive chip 100-1 is disposed. For the sake of brevity, a description of the remaining steps that are similar or identical to the methods described previously will be omitted herein.
According to still another embodiment of the present application as shown in fig. 6, it is different from the method described above with reference to fig. 4 in that the above-described method of assembling the camera module may be applied only to the assembly between the internal components of the photosensitive assembly 100 (i.e., the package body 100-2 and the circuit board 100-3), and the assembly between the photosensitive assembly 100 and the lens assembly 200 may be accomplished using other coupling means. The specific photosensitive assembly 100 internal component assembly process may be implemented as described with reference to fig. 4, which is not described in detail herein to avoid redundancy.
According to an embodiment of the application, a camera module is also provided. This module of making a video recording can include: the photosensitive assembly 100 comprises a photosensitive chip 100-1; the lens assembly 200 comprises a plurality of lenses which can cooperate with the photosensitive chip 100-1 to form images; and a first adhesive glue AP1 disposed between the photosensitive assembly 100 and the lens assembly 200. Wherein, the first adhesive glue material AP1 may include: a first photoinitiator configured to catalyze the first adhesive glue material to start a first curing in response to irradiation of ultraviolet light having a first wavelength λ 1; and a second photoinitiator configured to catalyze the first adhesive glue material to complete a second curing in response to irradiation of ultraviolet light having a second wavelength λ 2 during the first curing, wherein the second wavelength λ 2 is smaller than the first wavelength λ 1.
In an embodiment, the first wavelength λ 1 may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength λ 2 may have a wavelength range of 300nm to 400 nm.
In embodiments, the first photoinitiator may be a cationic system photoinitiator and the second photoinitiator may be a cationic system or a radical system photoinitiator.
In an embodiment, the photosensitive assembly 100 may further include: the package 100-2, the first surface of the package 100-2 faces the photo sensor chip 100-1 above the photo sensor chip 100-1. The first adhesive glue may be located between a second surface of the package body 100-2 and the lens assembly 200, wherein the second surface may be opposite to the first surface.
In an embodiment, the photosensitive assembly 100 may further include: the circuit board 100-3, the circuit board 100-3 is located under the photosensitive chip 100-1. A third adhesive material may be disposed between the circuit board 100-3 and the package body 100-2, and the third adhesive material and the first adhesive material have the same material and property.
In an embodiment, the photosensitive assembly 100 may further include: the circuit board 100-3, the circuit board 100-3 is located under the photosensitive chip 100-1. Wherein, the first adhesive glue may be located between the surface of the circuit board 100-3 on which the photosensitive chip 100-1 is disposed and the lens assembly 200.
In an embodiment, the first adhesive glue AP1 may be arranged in a ring shape extending around the edge of one surface of the photosensitive assembly 100.
The above description is only a preferred embodiment of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (22)
1. An assembly method for a camera module, the camera module including a photosensitive assembly having a photosensitive chip and a lens assembly having a plurality of lenses capable of cooperating with the photosensitive chip to form an image, the method comprising:
arranging a first adhesive glue material on one surface of the photosensitive assembly;
irradiating the first adhesive glue material by ultraviolet light with a first wavelength to enable the first adhesive glue material to start first curing;
during the first curing of the first adhesive glue material:
adjusting the relative position of the lens assembly and the photosensitive assembly, and contacting the lens assembly with the first adhesive rubber material; and
irradiating the first adhesive glue material by ultraviolet light with a second wavelength to complete second curing of the first adhesive glue material, wherein the first adhesive glue material is partially cured in the second curing step, and the second wavelength is different from the first wavelength; and
and waiting for the first curing of the first adhesive glue material to be finished.
2. The assembly method for a camera module of claim 1, wherein the second wavelength is less than the first wavelength.
3. The assembly method for a camera module of claim 2, wherein the first wavelength has a wavelength range of 380nm to 460 nm.
4. The assembling method for an image pickup module according to claim 2 or 3, wherein the second wavelength has a wavelength range of 300nm to 400 nm.
5. The assembling method for a camera module according to claim 1, wherein the first adhesive material comprises: a first photoinitiator that catalyzes the first adhesive glue to initiate the first curing in response to irradiation with ultraviolet light having the first wavelength; and
a second photoinitiator that catalyzes the first adhesive glue to initiate the second cure in response to irradiation with ultraviolet light having the second wavelength.
6. The assembling method for an image pickup module according to claim 5, wherein the first photoinitiator is a cationic photoinitiator; and
the second photoinitiator is a photoinitiator of a cationic system or a radical system.
7. The assembly method for a camera module of claim 1, further comprising: controlling a curing time of the first curing by controlling an irradiation time and an irradiation energy of the ultraviolet light having the first wavelength;
controlling a curing time of the second curing by controlling an irradiation time and an irradiation energy of the ultraviolet light of the second wavelength; and
the curing time of the first curing is longer than the curing time of the second curing.
8. The assembling method for a camera module according to claim 7, wherein the irradiation energy in the first curing step may be lower than the irradiation energy in the second curing step.
9. The assembling method for a camera module according to claim 1, wherein in the second curing step, partially curing the first adhesive glue comprises:
the first adhesive glue material is irradiated along the peripheral edge of the camera module, and the part, close to the outer side, of the first adhesive glue material is solidified.
10. The assembly method for a camera module of claim 1, wherein the photosensitive assembly further comprises: a package body, a first surface of the package body facing the photosensitive chip above the photosensitive chip; and
the step of arranging the first adhesive material further comprises: and arranging the first adhesive glue material on a second surface of the packaging body opposite to the first surface.
11. The assembly method for a camera module of claim 10, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the method further comprises the following steps:
arranging the second adhesive glue material between the packaging body and the circuit board;
irradiating the second adhesive glue material by using ultraviolet light with the first wavelength to enable the second adhesive glue material to start first curing;
during the first curing, irradiating the second adhesive glue material with ultraviolet light with a second wavelength to complete second curing of the second adhesive glue material; and
and waiting for the first curing of the second adhesive glue material to be finished.
12. The assembly method for a camera module of claim 1, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the step of arranging the first adhesive material further comprises: and arranging the first adhesive glue material on the surface of the circuit board on which the photosensitive chip is arranged.
13. The assembling method for a camera module according to claim 1, wherein the step of arranging the first adhesive material further comprises: the first adhesive material is arranged in a ring shape extending around an outer edge of one surface of the photosensitive member.
14. A camera module, comprising:
the photosensitive assembly comprises a photosensitive chip;
the lens assembly comprises a plurality of lenses which can be matched with the photosensitive chip for imaging; and
a first adhesive glue disposed between the photosensitive assembly and the lens assembly, and the first adhesive glue comprising:
a first photoinitiator configured to catalyze the first adhesive glue to start a first curing in response to irradiation by ultraviolet light having a first wavelength; and
a second photoinitiator configured to catalyze the first adhesive glue to complete a second cure in response to irradiation by ultraviolet light having a second wavelength during the first cure, wherein the second wavelength is different from the first wavelength.
15. The camera module of claim 14, wherein the second wavelength is less than the first wavelength.
16. The camera module of claim 15, wherein the first wavelength has a wavelength range of 380nm to 460 nm.
17. The camera module of claim 15 or 16, wherein the second wavelength has a wavelength range of 300nm to 400 nm.
18. The camera module according to claim 14, wherein the first photoinitiator is a cationic photoinitiator and the second photoinitiator is a cationic or radical photoinitiator.
19. The camera module of claim 14, wherein the photosensitive assembly further comprises: a package body, a first surface of the package body facing the photosensitive chip above the photosensitive chip; and
the first adhesive glue material is positioned between a second surface of the packaging body and the lens assembly, wherein the second surface is opposite to the first surface.
20. The camera module of claim 19, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
and a second adhesive material is arranged between the circuit board and the packaging body, and the second adhesive material and the first adhesive material have the same material and property.
21. The camera module of claim 14, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the first adhesive rubber material is positioned between the surface of the circuit board, on which the photosensitive chip is arranged, and the lens assembly.
22. The camera module of claim 14, wherein the first adhesive glue is arranged in an annular shape extending around an edge of one surface of the photosensitive assembly.
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| CN202010517990.1A CN113784017B (en) | 2020-06-09 | 2020-06-09 | Camera module and assembling method for camera module |
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| CN202010517990.1A CN113784017B (en) | 2020-06-09 | 2020-06-09 | Camera module and assembling method for camera module |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937028A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Camera module assemble method and camera module |
| CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
| CN110794619A (en) * | 2019-10-16 | 2020-02-14 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937028A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Camera module assemble method and camera module |
| CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
| CN110794619A (en) * | 2019-10-16 | 2020-02-14 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
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