CN111988507B - Assembling method and assembling apparatus of image capturing device - Google Patents
Assembling method and assembling apparatus of image capturing device Download PDFInfo
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- CN111988507B CN111988507B CN202010821392.3A CN202010821392A CN111988507B CN 111988507 B CN111988507 B CN 111988507B CN 202010821392 A CN202010821392 A CN 202010821392A CN 111988507 B CN111988507 B CN 111988507B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims abstract description 134
- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 238000012360 testing method Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 9
- 238000000926 separation method Methods 0.000 description 6
- 239000005304 optical glass Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The invention discloses an assembling method and assembling equipment of an image capturing device, wherein the assembling method comprises the steps of providing an image sensing assembly, at least comprising an image sensing chip facing to the height direction; temporarily fixing a lens assembly above the image sensing assembly in the height direction and keeping a spacing distance, wherein an optical lens group of the lens assembly is provided with a rear optical surface facing the image sensing chip and an optical axis passing through the image sensing chip; starting an image sensing chip; controlling a focusing mechanism of the lens assembly to move the optical lens group in the optical axis direction; performing image capture by the image sensing chip to continuously generate a plurality of test images, thereby calculating an optimal in-focus position to obtain a compensation reserve; obtaining a back focal length compensation preset value by means of relative movement adjustment between the lens assembly and the image sensing assembly; adjusting the spacing distance according to the value obtained by subtracting the compensation reservation value from the back focal length compensation preset value; and fixing the lens assembly and the image sensing assembly to each other.
Description
Technical Field
The present invention relates to an image capturing device, and more particularly, to an assembling method and an assembling apparatus with an image capturing device.
Background
In an image capturing apparatus, in order to ensure the imaging quality of an optical lens assembly on an image sensing assembly, Active Alignment correction (Active Alignment) needs to be performed on an optical axis of the lens assembly during an assembly process, so as to adjust a relative position relationship between the optical axis and an image sensing chip. The active alignment correction is used to make the optical axis vertically pass through the center of the image sensor chip, so that the image generated by the image sensor chip will not be distorted or shifted, and then the focusing mechanism and the image sensor assembly of the optical lens set are fixed with each other by the adhesive.
The focusing mechanism of the optical lens group and the image sensing assembly are required to be kept at a sufficient distance for subsequent focal length compensation. For lens assemblies with larger back focus tolerances, the aforementioned separation distance is also larger. Therefore, a larger amount of adhesive is also required to fill the gap distance when fixing the focusing mechanism and the image sensing element to each other.
However, when the separation distance is large, the adhesive with too large thickness is liable to overflow toward the side direction and stick to other parts. Meanwhile, the larger the thickness of the adhesive, the lower the structural strength at the adhesive, forming a weak point of low-strength structural strength in the entire image capturing apparatus.
Disclosure of Invention
In view of the above problems, the present invention provides an assembling method and an assembling apparatus with an image capturing device, which are used to reduce the distance between the focusing mechanism and the image sensing assembly and improve the overall structural strength.
At least one embodiment of the present invention provides an assembling method of an image capturing apparatus, including:
providing an image sensing assembly; the image sensing assembly at least comprises an image sensing chip, and the image sensing chip faces to the height direction;
providing a lens assembly, temporarily fixing the lens assembly above the image sensing assembly in the height direction, and keeping a spacing distance between the lens assembly and the image sensing assembly; the lens assembly at least comprises an optical lens group and a focusing mechanism for moving the optical lens group, wherein the optical lens group is provided with a rear optical surface and an optical axis, the rear optical surface faces the image sensing chip, and the optical axis passes through the image sensing chip;
starting an image sensing chip;
controlling the focusing mechanism to move the optical lens group in the direction of the optical axis;
the image sensing chip captures images to continuously generate a plurality of test images;
obtaining a compensation reserved value according to the movement stroke required by the optical lens group and the maximum stroke provided by the focusing mechanism;
obtaining a back focal length compensation preset value by means of relative movement adjustment between the lens assembly and the image sensing assembly;
adjusting the spacing distance according to the value obtained by subtracting the compensation reservation value from the back focal length compensation preset value; and
providing adhesive between the lens assembly and the image sensing assembly to adhere the lens assembly to the image sensing assembly and fix the lens assembly and the image sensing assembly to each other.
In at least one embodiment of the present invention, before the step of fixing the lens assembly and the image sensing assembly to each other, the method further includes: and the verticality of the optical axis relative to the image sensing chip is changed, and the angle compensation of the optical axis is completed.
In at least one embodiment of the present invention, before the step of fixing the lens assembly and the image sensing assembly to each other, the method further includes: the image sensing package or lens package is moved in a direction perpendicular to the optical axis such that the optical axis is aligned with the center of the image sensing chip.
In at least one embodiment of the present invention, a mobile platform is further provided for carrying the image sensor assembly and moving the image sensor assembly in a height direction and a plane perpendicular to the height direction.
In at least one embodiment of the present invention, the apparatus further comprises a clamping device for clamping and temporarily fixing the lens assembly above the image sensor assembly, and the clamping device is further used for tilting the lens assembly to change the angle of the optical axis and transmitting the focus control signal to the focusing mechanism.
At least one embodiment of the present invention further provides an assembling apparatus for an image capturing device, which is used to assemble the image capturing device, the image capturing device includes an image sensing component and a lens component, the image sensing component at least includes an image sensing chip, the lens component at least includes an optical lens set and a focusing mechanism for moving the optical lens set, and the optical lens set has a rear optical surface and an optical axis.
The assembling equipment comprises a moving platform, a clamping device and a control module.
The mobile platform is used for bearing the image sensing assembly and enabling the image sensing chip to face to the height direction.
The clamp device is used for clamping the lens assembly, temporarily fixing the lens assembly above the image sensing assembly in the height direction, keeping a spacing distance between the lens assembly and the image sensing assembly, enabling the rear optical surface to face the image sensing chip and enabling the optical axis to pass through the image sensing chip; the clamp device is further provided with a contact pin for transmitting a focusing control signal to the focusing mechanism.
The control module is electrically connected to the mobile platform and the contact pins.
The glue dispensing device is used for providing glue to adhere the lens assembly to the image sensing assembly so as to mutually fix the lens assembly and the image sensing assembly.
The control module starts the image sensing chip, the focusing control signal controls the focusing mechanism to move the optical lens group, so that the optical lens group moves in the direction of the optical axis, the image sensing chip captures images to continuously generate a plurality of test images, and the compensation reserved value is obtained according to the movement stroke required by the optical lens group and the maximum stroke which can be provided by the focusing mechanism.
The control module controls the relative movement adjustment between the lens assembly and the image sensing assembly to obtain a back focal length compensation preset value.
The control module further adjusts the spacing distance according to a value obtained by subtracting the compensation reservation value from the back focal length compensation preset value.
In at least one embodiment of the present invention, the control module changes the perpendicularity of the optical axis relative to the image sensing chip to complete the angle compensation of the optical axis.
In at least one embodiment of the present invention, the control module moves the image sensor assembly or the lens assembly in a direction perpendicular to the optical axis, such that the optical axis is aligned with the center of the image sensor chip.
In the invention, the optical lens group is moved in the optical axis direction by the focusing mechanism, so that the compensation reserve value can be calculated in advance, and the reserved spacing distance between the lens component and the image sensing component can be reduced when back focus compensation is carried out. The reduced spacing distance reduces the filling amount and thickness of the adhesive, thereby improving the overall structural strength of the image capturing device. Meanwhile, the reserved spacing distance is reduced, so that the size of the image sensing assembly can be further reduced, and the assembly accuracy is improved.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a schematic diagram of an assembling apparatus of an image capturing device in an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of an image capture device according to an embodiment of the invention.
FIG. 3 is a flow chart of an assembly apparatus in an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of a mobile platform carrying an image sensor assembly according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view of a temporarily mounted lens assembly in accordance with an embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view illustrating an optical axis compensation angle performed according to an embodiment of the present invention.
Fig. 7 is a cross-sectional view of an embodiment of the present invention, illustrating movement of the image sensing assembly to achieve back focus compensation and correction of the optical axis.
FIG. 8 is a cross-sectional view of an embodiment of the invention, wherein an adhesive is provided between the lens assembly and the image sensor assembly to adhere the lens assembly to the image sensor assembly.
Wherein, the reference numbers:
100 image capturing apparatus
110 image sensing assembly
111 base plate
112 image sensing chip
113 frame
114 optical glass plate
115 signal joint
120 lens assembly
122 optical lens group
122a rear optical surface
124 focusing mechanism
124a actuating component
124b outer casing
124c Signal Access Point
126 optical image stabilization actuator
200 assembling equipment
210 moving platform
220 clamping device
222 contact pin
230 control module
240 adhesive dispensing device
Optical axis compensation angle
L is the optical axis
X, Y in the horizontal direction
Z is the height direction
G is the separation distance
Step 110-170, Step
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
the following description uses the term module to refer to an Application Specific Integrated Circuit (ASIC), an electronic circuit, a microprocessor, a chip that executes one or more software or firmware programs, a circuit design. The modules are configured to perform various algorithms, transformations, and/or logic processing to generate one or more signals. When the module is implemented in software, the module may be implemented in the memory as a program readable by a chip or a circuit design through program execution.
Referring to fig. 1 and fig. 2, an assembling apparatus 200 of an image capturing device 100 according to an embodiment of the present invention is shown for assembling the image capturing device 100. The image capture device 100 includes an image sensing assembly 110 and a lens assembly 120. The image capturing apparatus 100 is configured to be disposed in an electronic device such as a smart phone, a tablet computer, a notebook computer, a display, a stand-alone camera, or a blank camera.
As shown in fig. 1 and 2, the image sensor assembly 110 includes at least a substrate 111, an image sensor chip 112, a frame 113, and an optical glass plate 114. The image sensor chip 112 and the frame 113 are disposed on the upper surface of the substrate 111, and the frame 113 surrounds the image sensor chip 112. The optical glass plate 114 is disposed on the frame 113 and is disposed corresponding to the image sensing chip 112. The substrate 111, the frame 113 and the optical glass plate 114 together form a closed space to cover and protect the image sensing chip 112. The image sensor chip 112 is electrically connected to the signal connector 115, so that the image sensor chip 112 is in signal connection with an external device (e.g., a circuit of an electronic apparatus). In some embodiments, the image sensing chip 112 is directly or indirectly connected to the signal connector 115; the signal connector 115 may be an FPC connector (FPC connector) for electrically connecting to a circuit of an electronic device such as a smart phone.
As shown in fig. 1 and fig. 2, the lens assembly 120 at least includes an optical lens group 122 and a focusing mechanism 124. The optical lens group 122 has at least one optical lens, and the optical lens group 122 has a rear optical surface 122a and an optical axis L. The rear optical surface 122a faces the image sensing chip 112, and the optical axis L passes through the image sensing chip 112. Focusing mechanism 124 is connected to optical lens group 122, and focusing mechanism 124 is generally disposed around optical lens group 122. The focusing mechanism 124 is used for moving the optical lens assembly 122 along the optical axis L to change the distance between the optical lens assembly 122 and the image sensor chip 112 for focusing.
As shown in fig. 2, the focusing mechanism 124 includes an actuator 124a, a housing 124b, and a signal access point 124 c. The actuating element 124a is connected to the optical lens assembly 122. The actuator 124a may be, but not limited to, a voice coil motor, a piezoelectric element, or a Shape Memory Alloy (SMA) for driving the optical lens assembly 122 to move along the optical axis L for focusing. The housing 124b covers the actuator 124a, and the top and bottom surfaces of the housing 124b are open, the optical axis L of the optical lens assembly 122 passes through the top and bottom surfaces, and the rear optical surface 122a is exposed at the bottom surface. The signal access point 124c is electrically connected to the actuator 124a for receiving a focus control signal to control the actuator 124a of the focus mechanism 124 to move the optical lens assembly 122. In the present embodiment, the focus control signal controls the actuator 124a of the focus mechanism 124 to move the optical lens assembly 122, so that the optical lens assembly 122 can move in the direction of the optical axis L. The signal access point 124c may be located on the surface of the housing 124b or on a flexible flat cable extending from the actuator 124 a.
In various embodiments, the lens assembly 120 further includes an optical image stabilization actuator 126(OIS actuator 126). The OIS actuator 126 is disposed on the bottom surface of the focusing mechanism 124, and the OIS actuator 126 has a hollow area, and the optical lens set 122 is disposed corresponding to the hollow area.
As shown in fig. 1, the assembling apparatus 200 includes a moving platform 210, a clamping device 220, a control module 230, and a dispensing device 240. The control module 230 is electrically connected to the moving platform 210, the clamping device 220 and the dispensing device 240. The movable platform 210 is used for carrying the image sensor assembly 110, and the control module 230 is used for controlling the movable platform 210 to make the movable platform 210 horizontally and vertically move the image sensor assembly 110 to perform three-axis linear displacement. The control module 230 is electrically connected to the image sensor chip 112 through the signal connector 115 or other conductive contacts to activate the image sensor chip 112.
As shown in fig. 1, the clamping device 220 is used for clamping the lens assembly 120 to temporarily fix the lens assembly 120 above the image sensor assembly 110, and make the rear optical surface 122a face the image sensor chip 112, and the optical axis L passes through the image sensor chip 112. The control module 230 is used to control the clamping device 220, so that the clamping device 220 clamps or releases the lens assembly 120. The control module 230 is also used to control the clamping device 220 to tilt the lens assembly 120 so as to change the angle (tilt angle) of the optical axis L. In addition, the fixture apparatus 220 is provided with contact pins 222 for contacting the signal access points 124 c; the contact pin 222 is electrically connected to the control module 230, so that the focusing control signal generated by the control module 230 can be transmitted to the focusing mechanism 124 through the contact pin 222 and the signal access point 124 c.
In the embodiment, although the movable platform 210 functions to move the image sensor assembly 110 horizontally and vertically for three-axis linear displacement, and the fixture device 220 functions to tilt the lens assembly 120 and change the angle of the optical axis L, the invention is not limited thereto, and in other embodiments, the movable platform 210 may be used to tilt the image sensor assembly 110 and change the angle of the optical axis L of the lens assembly 120 relative to the image sensor assembly 110, and the fixture device 220 may be used to move the lens assembly 120 horizontally and vertically for three-axis linear displacement. That is, it is sufficient that the moving platform 210 and the chucking device 220 can move or change the relative positions of both the image sensing assembly 110 and the lens assembly 120.
The assembly method of the image capturing apparatus 100 is specifically as follows.
Referring to fig. 3 and 4, first, the image sensor device 110 is provided, and the movable platform 210 carries the image sensor device 110, as shown in Step 110. The substrate 111 is placed on the moving platform 210 such that the image sensor chip 112 faces upward of the moving platform 210, i.e. in the height direction Z.
Referring to fig. 3 and 5, the clamping device 220 is located above the loading area of the movable platform 210. The lens assembly 120 is provided, the lens assembly 120 is held by the holding device 220, and the lens assembly 120 is temporarily fixed above the image sensing assembly 110 in the height direction Z, so that the lens assembly 120 and the image sensing assembly 110 maintain a spacing distance G, as shown in Step 120. At this time, the rear optical surface 122a faces the image sensing chip 112, and the optical axis L passes through the image sensing chip 112; the image obtained by the optical lens assembly 122 can be imaged on the image sensor chip 112.
In the present embodiment, the control module 230 provides a start signal to the image sensing chip 112 of the image sensing device 110 through the signal connector 115 to start the image sensing chip 112. In addition, the clamping device 220 is clamped to the housing 124b of the focusing mechanism 124 and is connected to the signal access point 124c of the focusing mechanism 124 by the contact pin 222, so that the control module 230 can transmit the focusing control signal to the focusing mechanism 124 through the clamping device 220. The focus control signal controls the actuator 124a of the focus mechanism 124 to move the optical lens assembly 122, so that the optical lens assembly 122 can move in the direction of the optical axis L. Meanwhile, since the control module 230 starts the image sensing chip 112, the image sensing chip 112 can perform image capturing to continuously generate a plurality of test images; the control module 230 receives a plurality of test images generated by the image sensing assembly 110 for subsequent analysis, as shown in Step 130.
After analyzing and calculating the best focus position from the plurality of test images, a compensation reserve V1 may be derived to reduce the compensation distance required for subsequent Active Alignment (Active Alignment). For example, when the required moving stroke of the optical lens assembly 122 is 0.2mm (millimeter), and the maximum stroke provided by the focusing mechanism 124 is 0.3mm, the focusing mechanism 124 can also provide the compensation margin V1 of 0.3 mm-0.2 mm-0.1 mm, so that the focusing mechanism 124 can additionally provide 0.1mm space for the subsequent active alignment compensation.
As shown in fig. 5, in some embodiments, the optical axis L is not perpendicular to the image sensor chip 112 at this stage, but has a tilt angle compensation value (optical axis compensation angle a) with the normal of the image sensor chip 112 to be compensated.
As shown in fig. 2, 3 and 6, in some embodiments, the received test image generally includes a sample pattern, and the control module 230 can analyze the sharpness and distortion of the sample pattern in the test image to calculate the optical axis compensation angle a and the clearest focus position required by the optical lens assembly 122. In terms of the optical axis compensation angle, the control module 230 changes the verticality of the optical axis L relative to the image sensor chip 112 according to the distortion degree change of the plurality of test images, thereby completing the angle compensation of the optical axis L. In the present embodiment, the clamping device 220 is controlled to tilt the lens assembly 120 to change the perpendicularity of the optical axis L with respect to the image sensor chip 112, so as to complete the angle compensation of the optical axis L, as shown in Step 140. In some embodiments, the control module 230 sends different control signals to control the focusing mechanism 124 and the clamping device 220 simultaneously when receiving and analyzing a plurality of test images, in other words, Step 130 and Step 140 may be performed simultaneously or not.
As shown in fig. 2, 3 and 7, the control module 230 controls the moving platform 210 to move the image sensing assembly 110 in the height direction Z and the horizontal directions X and Y, and performs back focus compensation (as shown in Step 150) and alignment compensation of the optical axis L (as shown in Step 160). In terms of back focus compensation, the back focus compensation predetermined value V2 is obtained by adjusting the relative movement between the lens assembly 120 and the image sensing assembly 110. In the present embodiment, the control module 230 controls the moving platform 210 to move the image sensing element 110 in the height direction Z for performing the focus adjustment, so as to obtain the back focus compensation predetermined value V2. In the step of back focus compensation, the separation distance G between the lens assembly 120 and the image sensing assembly 110 is obtained by subtracting the compensation allowance V1 from the back focus compensation predetermined value V2, that is, in the height direction Z, the control module 230 adjusts the separation distance G between the lens assembly 120 and the image sensing assembly 110 according to the back focus compensation predetermined value V2 and the compensation allowance V1, so as to perform back focus compensation. The control module 230 controls the movable stage 210 to move the image sensor assembly 110 in the height direction Z according to the value obtained by subtracting the compensation reserved value V1 from the back focus compensation preset value V2, so as to adjust the separation distance G.
In terms of the Alignment compensation of the optical axis L, in the present embodiment, the control module 230 controls the moving platform 210 to move the image sensor assembly 110 in the horizontal direction X, Y, i.e. in the direction perpendicular to the optical axis L, so as to align the optical axis L with the center of the image sensor chip 112, thereby completing the Active Alignment correction (Active Alignment) of the optical axis L.
As shown in fig. 2, 3 and 8, finally, the lens assembly 120 and the image sensing assembly 110 are fixed to each other by maintaining the relative position between the lens assembly 120 and the image sensing assembly 110, as shown in Step 170. In one or more embodiments, the control module 230 controls the dispensing device 240 to move to the side of the lens assembly 120 and the image sensing assembly 110, and provides adhesive between the lens assembly 120 and the image sensing assembly 110 to adhere the lens assembly 120 to the image sensing assembly 110. In the present embodiment, the adhesive is injected between the frame 113 and the OIS actuator 126, and the adhesive does not extend between the rear optical surface 122a and the optical glass plate 114. In various embodiments, image capture device 100 does not have OIS actuator 126, and adhesive is injected between frame 113 and housing 124b of focusing mechanism 124. In some embodiments, the control module 230 drives the fixture device 220 to move away the lens assembly 120 to leave the dispensing space, controls the dispensing device 240 to move to the upper edge of the image sensor assembly 110 for dispensing, and drives the fixture device 220 to move back the lens assembly 120 to the adjusted position, thereby providing adhesive between the lens assembly 120 and the image sensor assembly 110 to bond the lens assembly 120 to the image sensor assembly 110.
In the present invention, since the optical lens assembly 122 is moved in the direction of the optical axis L by the focusing mechanism 124, the compensation allowance V1 can be calculated in advance, so that the distance G between the lens assembly 120 and the image sensor assembly 110 can be reduced during the back focus compensation. The reduced gap distance G reduces the amount and thickness of the adhesive, thereby improving the overall structural strength of the image capturing apparatus 100. Meanwhile, the reserved spacing distance G is reduced, so that the size of the image sensing assembly 110 can be further reduced, and the assembly accuracy is improved.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A method of assembling an image capture device, comprising:
providing an image sensing assembly; the image sensing assembly at least comprises an image sensing chip, and the image sensing chip faces to the height direction;
providing a lens assembly, temporarily fixing the lens assembly above the image sensing assembly in the height direction, and keeping a spacing distance between the lens assembly and the image sensing assembly; the lens assembly at least comprises an optical lens group and a focusing mechanism for moving the optical lens group, wherein the optical lens group is provided with a rear optical surface and an optical axis, the rear optical surface faces the image sensing chip, and the optical axis passes through the image sensing chip;
starting the image sensing chip;
controlling the focusing mechanism to move the optical lens group in the optical axis direction;
the image sensing chip carries out image capture to continuously generate a plurality of test images;
obtaining a compensation reserved value according to the movement stroke required by the optical lens group and the maximum stroke provided by the focusing mechanism;
obtaining a back focal length compensation preset value by means of relative movement adjustment between the lens assembly and the image sensing assembly;
adjusting the spacing distance according to the value obtained by subtracting the compensation reservation value from the back focal length compensation preset value; and
providing adhesive between the lens assembly and the image sensing assembly to adhere the lens assembly to the image sensing assembly and fix the lens assembly and the image sensing assembly to each other.
2. The method of claim 1, further comprising, before the step of fixing the lens assembly and the image sensor assembly to each other:
and the verticality of the optical axis relative to the image sensing chip is changed, and the angle compensation of the optical axis is completed.
3. The method of claim 1, further comprising, before the step of fixing the lens assembly and the image sensor assembly to each other:
and moving the image sensing assembly or the lens assembly in a direction perpendicular to the optical axis to align the optical axis with the center of the image sensing chip.
4. The method of claim 3, further comprising:
a moving platform is provided for carrying the image sensing assembly and moving the image sensing assembly in the height direction and a plane perpendicular to the height direction.
5. The method of assembling an image capturing device as claimed in claim 2, further comprising:
providing a clamp device for clamping and temporarily fixing the lens assembly above the image sensing assembly, and the clamp device is further used for inclining the lens assembly to change the angle of the optical axis and transmitting a focusing control signal to the focusing mechanism.
6. An assembling device of an image capturing device is used for assembling the image capturing device, the image capturing device comprises an image sensing assembly and a lens assembly, the image sensing assembly at least comprises an image sensing chip, the lens assembly at least comprises an optical lens group and a focusing mechanism used for moving the optical lens group, and the optical lens group is provided with a back optical surface and an optical axis; characterized in that the assembly device comprises:
the mobile platform is used for bearing the image sensing assembly and enabling the image sensing chip to face to the height direction;
a clamp device for clamping the lens assembly, temporarily fixing the lens assembly above the image sensing assembly in the height direction, keeping a spacing distance between the lens assembly and the image sensing assembly, and making the rear optical surface face the image sensing chip, and the optical axis passes through the image sensing chip; the clamp device is further provided with a contact pin for transmitting a focusing control signal to the focusing mechanism;
the control module is electrically connected to the mobile platform and the contact pins; and
a dispensing device for providing adhesive to adhere the lens assembly to the image sensing assembly so that the lens assembly and the image sensing assembly are fixed to each other;
the control module starts the image sensing chip, the focusing control signal controls the focusing mechanism to move the optical lens group, so that the optical lens group moves in the optical axis direction, the image sensing chip captures images to continuously generate a plurality of test images, and a compensation reserved value is obtained according to the movement stroke required by the optical lens group and the maximum stroke provided by the focusing mechanism;
the control module controls the relative movement adjustment between the lens assembly and the image sensing assembly to obtain a back focal length compensation preset value;
the control module further adjusts the spacing distance according to a value obtained by subtracting the compensation reservation value from the back focus compensation preset value.
7. The apparatus of claim 6, wherein the control module changes the perpendicularity of the optical axis with respect to the image sensor chip to perform the angle compensation of the optical axis.
8. The apparatus of claim 6, wherein the control module moves the image sensor assembly or the lens assembly in a direction perpendicular to the optical axis to align the optical axis with the center of the image sensor chip.
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Also Published As
| Publication number | Publication date |
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| CN111796386A (en) | 2020-10-20 |
| TW202045976A (en) | 2020-12-16 |
| CN111988507A (en) | 2020-11-24 |
| TWI769465B (en) | 2022-07-01 |
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